FI852577L - Foerfarande foer framstaellning av skyddande kuvert. - Google Patents

Foerfarande foer framstaellning av skyddande kuvert.

Info

Publication number
FI852577L
FI852577L FI852577A FI852577A FI852577L FI 852577 L FI852577 L FI 852577L FI 852577 A FI852577 A FI 852577A FI 852577 A FI852577 A FI 852577A FI 852577 L FI852577 L FI 852577L
Authority
FI
Finland
Prior art keywords
kuvert
skyddande
foerfarande foer
foer framstaellning
framstaellning
Prior art date
Application number
FI852577A
Other languages
English (en)
Finnish (fi)
Other versions
FI852577A7 (fi
FI852577A0 (fi
Inventor
Giorgio Ventura
Original Assignee
Arcotronics Italia Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arcotronics Italia Spa filed Critical Arcotronics Italia Spa
Publication of FI852577A0 publication Critical patent/FI852577A0/fi
Publication of FI852577L publication Critical patent/FI852577L/fi
Publication of FI852577A7 publication Critical patent/FI852577A7/fi

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/048—Welding with other step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Insulating Of Coils (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FI852577A 1984-07-27 1985-06-28 Menetelmä suojaavien kuorien valmistamiseksi. FI852577A7 (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT03538/84A IT1180514B (it) 1984-07-27 1984-07-27 Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici

Publications (3)

Publication Number Publication Date
FI852577A0 FI852577A0 (fi) 1985-06-28
FI852577L true FI852577L (fi) 1986-01-28
FI852577A7 FI852577A7 (fi) 1986-01-28

Family

ID=11109286

Family Applications (1)

Application Number Title Priority Date Filing Date
FI852577A FI852577A7 (fi) 1984-07-27 1985-06-28 Menetelmä suojaavien kuorien valmistamiseksi.

Country Status (9)

Country Link
US (1) US4720916A (enExample)
EP (1) EP0169820A3 (enExample)
JP (1) JPS6147602A (enExample)
KR (1) KR900001116B1 (enExample)
ES (1) ES8609872A1 (enExample)
FI (1) FI852577A7 (enExample)
GR (1) GR851658B (enExample)
IT (1) IT1180514B (enExample)
PT (1) PT80874B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631109A (ja) * 1986-06-19 1988-01-06 Murata Mfg Co Ltd 電子部品およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3076051A (en) * 1959-03-05 1963-01-29 Rca Corp Thermoelectric devices and methods of making same
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3364567A (en) * 1965-09-14 1968-01-23 Bell Telephone Labor Inc Encapsulated electrical device and method of fabricating same
US3530541A (en) * 1968-06-13 1970-09-29 Trw Inc Mold for encapsulating electrical components
FR2076686A5 (enExample) * 1970-01-23 1971-10-15 Sovcor Electronique
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication
SE389991B (sv) * 1974-09-19 1976-11-29 Ericsson Telefon Ab L M Metod for kapsling av elektriska komponenter samt anordning herfor
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4268942A (en) * 1979-09-04 1981-05-26 Western Electric Company, Inc. Method and apparatus for manufacturing boxed encapsulated capacitors
DE2952297A1 (de) * 1979-12-24 1981-07-02 Werner Dipl.-Ing. 6840 Lampertheim Schaller Verfahren und vorrichtung zur herstellung von elektronischen geraeten, insbesondere beruehrungslosen sensoren und modulen
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
US4374080A (en) * 1981-01-13 1983-02-15 Indy Electronics, Inc. Method and apparatus for encapsulation casting
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

Also Published As

Publication number Publication date
ES545564A0 (es) 1986-09-01
IT8403538A0 (it) 1984-07-27
IT1180514B (it) 1987-09-23
KR900001116B1 (ko) 1990-02-26
EP0169820A3 (en) 1987-08-26
PT80874A (en) 1985-08-01
FI852577A7 (fi) 1986-01-28
FI852577A0 (fi) 1985-06-28
ES8609872A1 (es) 1986-09-01
KR860001499A (ko) 1986-02-26
PT80874B (en) 1986-11-24
EP0169820A2 (en) 1986-01-29
GR851658B (enExample) 1985-11-26
US4720916A (en) 1988-01-26
JPS6147602A (ja) 1986-03-08

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Legal Events

Date Code Title Description
FD Application lapsed

Owner name: ARCOTRONICS ITALIA S.P.A.