FI850893A7 - Menetelmä ja laite kytkentäjohdon asentamiseksi kannatinlevylle. - Google Patents

Menetelmä ja laite kytkentäjohdon asentamiseksi kannatinlevylle. Download PDF

Info

Publication number
FI850893A7
FI850893A7 FI850893A FI850893A FI850893A7 FI 850893 A7 FI850893 A7 FI 850893A7 FI 850893 A FI850893 A FI 850893A FI 850893 A FI850893 A FI 850893A FI 850893 A7 FI850893 A7 FI 850893A7
Authority
FI
Finland
Prior art keywords
installing
support plate
connecting cable
cable
support
Prior art date
Application number
FI850893A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI850893L (fi
FI850893A0 (fi
Inventor
Rudolf Winter
Albert Horner
Adalbert Lindner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19843408345 external-priority patent/DE3408345A1/de
Priority claimed from DE19843408338 external-priority patent/DE3408338A1/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI850893A0 publication Critical patent/FI850893A0/fi
Publication of FI850893A7 publication Critical patent/FI850893A7/fi
Publication of FI850893L publication Critical patent/FI850893L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/20—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/16—Insulating conductors or cables by passing through or dipping in a liquid bath; by spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
FI850893A 1984-03-07 1985-03-06 Foerfarande och anordning foer foerlaeggning av en kopplingsledning pao en baerplatta. FI850893L (fi)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3408324 1984-03-07
DE19843408345 DE3408345A1 (de) 1984-03-07 1984-03-07 Verfahren zum ueberziehen eines elektrischen drahtes mit einer schmelzkleberschicht
DE19843408338 DE3408338A1 (de) 1984-03-07 1984-03-07 Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte

Publications (3)

Publication Number Publication Date
FI850893A0 FI850893A0 (fi) 1985-03-06
FI850893A7 true FI850893A7 (fi) 1985-09-08
FI850893L FI850893L (fi) 1985-09-08

Family

ID=27191769

Family Applications (1)

Application Number Title Priority Date Filing Date
FI850893A FI850893L (fi) 1984-03-07 1985-03-06 Foerfarande och anordning foer foerlaeggning av en kopplingsledning pao en baerplatta.

Country Status (5)

Country Link
AT (1) AT393193B (cs)
CH (1) CH667563A5 (cs)
FI (1) FI850893L (cs)
GR (1) GR850557B (cs)
LU (1) LU85795A1 (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3639193A (en) * 1968-06-03 1972-02-01 Gen Alarm Corp Apparatus for forming a wiring system
US3627192A (en) * 1969-02-03 1971-12-14 Bearings Seale & Gears Inc Wire lead bonding tool

Also Published As

Publication number Publication date
GR850557B (cs) 1985-07-03
FI850893L (fi) 1985-09-08
ATA67585A (de) 1991-01-15
FI850893A0 (fi) 1985-03-06
LU85795A1 (de) 1985-12-12
CH667563A5 (de) 1988-10-14
AT393193B (de) 1991-08-26

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Legal Events

Date Code Title Description
FD Application lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT