FI20225704A1 - A method for manufacturing a patterned polymer film structure - Google Patents

A method for manufacturing a patterned polymer film structure

Info

Publication number
FI20225704A1
FI20225704A1 FI20225704A FI20225704A FI20225704A1 FI 20225704 A1 FI20225704 A1 FI 20225704A1 FI 20225704 A FI20225704 A FI 20225704A FI 20225704 A FI20225704 A FI 20225704A FI 20225704 A1 FI20225704 A1 FI 20225704A1
Authority
FI
Finland
Prior art keywords
manufacturing
polymer film
substrate
film structure
oxidant layer
Prior art date
Application number
FI20225704A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Carita Kvarnström
Mikko Salomäki
Pia Damlin
Kari Loikas
Mauri Nauma
Rahul Yewale
Original Assignee
Turun Yliopisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Turun Yliopisto filed Critical Turun Yliopisto
Priority to FI20225704A priority Critical patent/FI20225704A1/en
Priority to PCT/FI2023/050451 priority patent/WO2024028539A1/en
Priority to TW112129393A priority patent/TW202410976A/en
Publication of FI20225704A1 publication Critical patent/FI20225704A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/34Polymerisation in gaseous state
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • H10K85/111Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/08Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621Providing a shape to conductive layers, e.g. patterning or selective deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/481Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The present invention relates to a method for manufacturing a patterned film on a substrate, the method comprising forming an oxidant layer on a substrate by applying a solution comprising an oxidant on the surface of the substrate; drying the oxidant layer; applying a de-activating agent on the oxidant layer according to a pattern, to partially de-activate the oxidant layer; and forming a polymer layer by exposing the surface to a monomer vapour at a polymerisation temperature of 20 – 95 °C under atmospheric pressure. Fig. 4
FI20225704A 2022-08-05 2022-08-05 A method for manufacturing a patterned polymer film structure FI20225704A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20225704A FI20225704A1 (en) 2022-08-05 2022-08-05 A method for manufacturing a patterned polymer film structure
PCT/FI2023/050451 WO2024028539A1 (en) 2022-08-05 2023-08-02 A method for manufacturing a patterned polymer film structure
TW112129393A TW202410976A (en) 2022-08-05 2023-08-04 Method for manufacturing patterned film on substrate, device comprising the same, and sysyem for manufactring the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20225704A FI20225704A1 (en) 2022-08-05 2022-08-05 A method for manufacturing a patterned polymer film structure

Publications (1)

Publication Number Publication Date
FI20225704A1 true FI20225704A1 (en) 2024-02-06

Family

ID=87570107

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20225704A FI20225704A1 (en) 2022-08-05 2022-08-05 A method for manufacturing a patterned polymer film structure

Country Status (3)

Country Link
FI (1) FI20225704A1 (en)
TW (1) TW202410976A (en)
WO (1) WO2024028539A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130014090A (en) * 2011-07-29 2013-02-07 경희대학교 산학협력단 Method for forming conducting polymer electrode and method for manufacturing organic thin-film transistor using the same
TWI647101B (en) * 2016-06-02 2019-01-11 美樺興業股份有限公司 Patterned film structure, patterned film composite structure, method of selective inhibition of formation of organic film and method of selective adjustment of thickness of organic film
US20210238372A1 (en) 2018-05-04 2021-08-05 Turun Yliopisto Method for producing a pedot film
FI129918B (en) 2019-05-02 2022-10-31 Turun Yliopisto Method for fabricating a film
TWI835121B (en) 2021-04-23 2024-03-11 加拿大商光子控制公司 Flexible fiber temperature probe, assembly method thereof and device including temperature sensor

Also Published As

Publication number Publication date
TW202410976A (en) 2024-03-16
WO2024028539A1 (en) 2024-02-08

Similar Documents

Publication Publication Date Title
KR102233577B1 (en) Method for forming patterns of a semiconductor device
KR102182550B1 (en) Method of forming induced self-assembly layer on a substrate
TW200510937A (en) Antireflective film material, and antireflective film and pattern formation method using the same
TW200731027A (en) Process for producing a substrate with metal wiring
JP2015516891A5 (en)
US20210408504A1 (en) Display panel and preparation method thereof
US20100098941A1 (en) Polymer microstructure with tilted micropillar array and method of fabricating the same
KR20100065819A (en) Nano-imprint lithography process
JP2014053558A (en) Pattern formation method
JP2015523227A (en) Ultra-oleophobic surface and method for producing the same
FI20225704A1 (en) A method for manufacturing a patterned polymer film structure
KR20060104737A (en) Mold-release treating method of imprint mold for printed circuit board
Cheng et al. Solvent‐Free Synthesis of Selectively Wetting Multilayer and Janus Membranes
KR100432330B1 (en) Method for plasma hardening photoresist in etching of semiconductor and superconductor films
US6855646B2 (en) Plasma polymerized electron beam resist
Miller et al. Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique
Schulz et al. Mask fabrication by nanoimprint lithography using antisticking layers
CN108231547B (en) Method for forming semiconductor device
WO2018138283A4 (en) Solvent transfer printing method
KR100734664B1 (en) Method for forming a minute pattern using a langmuir-blodegett way
KR930702702A (en) Method and apparatus for manufacturing two-layer structure resist
KR20080023474A (en) Metal patterning method using solid bridge
KR101716851B1 (en) Method for manufacturing a micro/nano pattern using solution materials
JPH0143453B2 (en)
US5856067A (en) Contact photolithographic process for realizing metal lines on a substrate by varying exposure energy