FI20225704A1 - A method for manufacturing a patterned polymer film structure - Google Patents
A method for manufacturing a patterned polymer film structureInfo
- Publication number
- FI20225704A1 FI20225704A1 FI20225704A FI20225704A FI20225704A1 FI 20225704 A1 FI20225704 A1 FI 20225704A1 FI 20225704 A FI20225704 A FI 20225704A FI 20225704 A FI20225704 A FI 20225704A FI 20225704 A1 FI20225704 A1 FI 20225704A1
- Authority
- FI
- Finland
- Prior art keywords
- manufacturing
- polymer film
- substrate
- film structure
- oxidant layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229920006254 polymer film Polymers 0.000 title 1
- 239000007800 oxidant agent Substances 0.000 abstract 5
- 230000001590 oxidative effect Effects 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/34—Polymerisation in gaseous state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F32/08—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/481—Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The present invention relates to a method for manufacturing a patterned film on a substrate, the method comprising forming an oxidant layer on a substrate by applying a solution comprising an oxidant on the surface of the substrate; drying the oxidant layer; applying a de-activating agent on the oxidant layer according to a pattern, to partially de-activate the oxidant layer; and forming a polymer layer by exposing the surface to a monomer vapour at a polymerisation temperature of 20 – 95 °C under atmospheric pressure. Fig. 4
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20225704A FI20225704A1 (en) | 2022-08-05 | 2022-08-05 | A method for manufacturing a patterned polymer film structure |
PCT/FI2023/050451 WO2024028539A1 (en) | 2022-08-05 | 2023-08-02 | A method for manufacturing a patterned polymer film structure |
TW112129393A TW202410976A (en) | 2022-08-05 | 2023-08-04 | Method for manufacturing patterned film on substrate, device comprising the same, and sysyem for manufactring the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20225704A FI20225704A1 (en) | 2022-08-05 | 2022-08-05 | A method for manufacturing a patterned polymer film structure |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20225704A1 true FI20225704A1 (en) | 2024-02-06 |
Family
ID=87570107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20225704A FI20225704A1 (en) | 2022-08-05 | 2022-08-05 | A method for manufacturing a patterned polymer film structure |
Country Status (3)
Country | Link |
---|---|
FI (1) | FI20225704A1 (en) |
TW (1) | TW202410976A (en) |
WO (1) | WO2024028539A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130014090A (en) * | 2011-07-29 | 2013-02-07 | 경희대학교 산학협력단 | Method for forming conducting polymer electrode and method for manufacturing organic thin-film transistor using the same |
TWI647101B (en) * | 2016-06-02 | 2019-01-11 | 美樺興業股份有限公司 | Patterned film structure, patterned film composite structure, method of selective inhibition of formation of organic film and method of selective adjustment of thickness of organic film |
US20210238372A1 (en) | 2018-05-04 | 2021-08-05 | Turun Yliopisto | Method for producing a pedot film |
FI129918B (en) | 2019-05-02 | 2022-10-31 | Turun Yliopisto | Method for fabricating a film |
TWI835121B (en) | 2021-04-23 | 2024-03-11 | 加拿大商光子控制公司 | Flexible fiber temperature probe, assembly method thereof and device including temperature sensor |
-
2022
- 2022-08-05 FI FI20225704A patent/FI20225704A1/en unknown
-
2023
- 2023-08-02 WO PCT/FI2023/050451 patent/WO2024028539A1/en unknown
- 2023-08-04 TW TW112129393A patent/TW202410976A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202410976A (en) | 2024-03-16 |
WO2024028539A1 (en) | 2024-02-08 |
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