FI20146029A - Taipuisa valaiseva monikerrosrakenne - Google Patents

Taipuisa valaiseva monikerrosrakenne

Info

Publication number
FI20146029A
FI20146029A FI20146029A FI20146029A FI20146029A FI 20146029 A FI20146029 A FI 20146029A FI 20146029 A FI20146029 A FI 20146029A FI 20146029 A FI20146029 A FI 20146029A FI 20146029 A FI20146029 A FI 20146029A
Authority
FI
Finland
Prior art keywords
multilayer structure
flexible illuminating
illuminating multilayer
flexible
multilayer
Prior art date
Application number
FI20146029A
Other languages
English (en)
Swedish (sv)
Other versions
FI128468B (fi
Inventor
Pekka Makkonen
Kimmo Keränen
Original Assignee
Flexbright Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FI20146029A priority Critical patent/FI128468B/fi
Application filed by Flexbright Oy filed Critical Flexbright Oy
Priority to AU2015352315A priority patent/AU2015352315A1/en
Priority to CA2967747A priority patent/CA2967747C/en
Priority to PCT/FI2015/050789 priority patent/WO2016083663A1/en
Priority to RU2017122052A priority patent/RU2672667C1/ru
Priority to CN201580063679.1A priority patent/CN107110468A/zh
Priority to US15/529,253 priority patent/US20170265307A1/en
Priority to EP15862372.8A priority patent/EP3224535A4/en
Publication of FI20146029A publication Critical patent/FI20146029A/fi
Priority to US16/368,329 priority patent/US20190223295A1/en
Application granted granted Critical
Publication of FI128468B publication Critical patent/FI128468B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/175—Controlling the light source by remote control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/32—Stacked devices having two or more layers, each emitting at different wavelengths
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/60—Light sources with three-dimensionally disposed light-generating elements on stacked substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
FI20146029A 2014-11-24 2014-11-24 Taipuisa valaiseva monikerrosrakenne FI128468B (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20146029A FI128468B (fi) 2014-11-24 2014-11-24 Taipuisa valaiseva monikerrosrakenne
CA2967747A CA2967747C (en) 2014-11-24 2015-11-12 Flexible illuminating multilayer structure
PCT/FI2015/050789 WO2016083663A1 (en) 2014-11-24 2015-11-12 Flexible illuminating multilayer structure
RU2017122052A RU2672667C1 (ru) 2014-11-24 2015-11-12 Гибкая осветительная многослойная конструкция
AU2015352315A AU2015352315A1 (en) 2014-11-24 2015-11-12 Flexible illuminating multilayer structure
CN201580063679.1A CN107110468A (zh) 2014-11-24 2015-11-12 柔性照明多层结构
US15/529,253 US20170265307A1 (en) 2014-11-24 2015-11-12 Flexible illuminating multilayer structure
EP15862372.8A EP3224535A4 (en) 2014-11-24 2015-11-12 Flexible illuminating multilayer structure
US16/368,329 US20190223295A1 (en) 2014-11-24 2019-03-28 Flexible illuminating multilayer structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20146029A FI128468B (fi) 2014-11-24 2014-11-24 Taipuisa valaiseva monikerrosrakenne

Publications (2)

Publication Number Publication Date
FI20146029A true FI20146029A (fi) 2016-05-25
FI128468B FI128468B (fi) 2020-06-15

Family

ID=56073671

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20146029A FI128468B (fi) 2014-11-24 2014-11-24 Taipuisa valaiseva monikerrosrakenne

Country Status (8)

Country Link
US (2) US20170265307A1 (fi)
EP (1) EP3224535A4 (fi)
CN (1) CN107110468A (fi)
AU (1) AU2015352315A1 (fi)
CA (1) CA2967747C (fi)
FI (1) FI128468B (fi)
RU (1) RU2672667C1 (fi)
WO (1) WO2016083663A1 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10132478B2 (en) * 2016-03-06 2018-11-20 Svv Technology Innovations, Inc. Flexible solid-state illumination devices
CA3028575C (en) * 2016-06-21 2021-05-04 Ledfoil Finland Oy Led screen or illumination means with a flexible film structure
FI11865U1 (fi) * 2017-06-13 2017-11-22 Flexbright Oy Valaiseva rakenne
US10989377B2 (en) 2017-09-14 2021-04-27 Signify Holding B.V. Lighting device and a method of manufacturing a lighting device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012380A (ja) * 1996-06-25 1998-01-16 Idemitsu Kosan Co Ltd 多色発光装置およびその製造方法
US6211626B1 (en) * 1997-08-26 2001-04-03 Color Kinetics, Incorporated Illumination components
US20030133292A1 (en) * 1999-11-18 2003-07-17 Mueller George G. Methods and apparatus for generating and modulating white light illumination conditions
US7858994B2 (en) * 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
KR101249230B1 (ko) * 2005-03-30 2013-04-01 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 플렉시블 ｌｅｄ 어레이
CN101292574B (zh) * 2005-08-17 2012-12-26 皇家飞利浦电子股份有限公司 数字控制的照明器系统
US20080137008A1 (en) * 2006-12-06 2008-06-12 General Electric Company Color tunable oled illumination display and method for controlled display illumination
US7498603B2 (en) * 2006-12-06 2009-03-03 General Electric Company Color tunable illumination source and method for controlled illumination
CN105185780B (zh) * 2007-11-02 2019-04-05 村田整合被动式解决方案公司 多层结构及其制造方法
RU2413703C2 (ru) * 2009-02-27 2011-03-10 Борис Данилович Свиридов Способ получения строительного древошлакового композита
EP2273579A1 (en) * 2009-07-10 2011-01-12 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO A method of encapsulating a flexible optoelectronic multi-layered structure
US8314566B2 (en) * 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
DE102011087887A1 (de) * 2011-12-07 2013-06-13 Osram Gmbh Leuchtdiodenanordnung
WO2013116229A1 (en) * 2012-01-30 2013-08-08 Dali Systems Co. Ltd. Frequency translation in a virtualized distributed antenna system
CN104081109A (zh) * 2012-02-02 2014-10-01 宝洁公司 双向光片
EP2875700B1 (en) * 2012-07-20 2018-03-14 Philips Lighting Holding B.V. Methods and apparatus for adaptable lighting unit, to receive drive data from external source
JP2015535420A (ja) * 2012-08-13 2015-12-10 トライアングル リソース ホールディング （スイッツァランド） アーゲーＴｒｉａｎｇｌｅ Ｒｅｓｏｕｒｃｅ Ｈｏｌｄｉｎｇ （Ｓｗｉｔｚｅｒｌａｎｄ） Ａｇ 熱光起電力装置用多層構造体、及び、その多層構造体を含む熱光起電力装置
US9989195B2 (en) * 2013-05-14 2018-06-05 Philips Lighting Holding B.V. Illumination device with folded light source carrier and method of assembly
CN103943762A (zh) * 2014-04-22 2014-07-23 佛山佛塑科技集团股份有限公司 具有多层结构的led照明用远程荧光粉配光薄膜及其制备方法
CN110060987B (zh) * 2014-06-18 2021-03-12 艾克斯展示公司技术有限公司 微组装led显示器
CN105042492A (zh) * 2015-08-10 2015-11-11 苏州晶雷光电照明科技有限公司 基于太阳能电池面板的不同噪声下变色的led灯带

Also Published As

Publication number Publication date
CA2967747A1 (en) 2016-06-02
CA2967747C (en) 2019-12-17
FI128468B (fi) 2020-06-15
EP3224535A4 (en) 2018-09-12
CN107110468A (zh) 2017-08-29
WO2016083663A1 (en) 2016-06-02
AU2015352315A1 (en) 2017-06-08
US20170265307A1 (en) 2017-09-14
EP3224535A1 (en) 2017-10-04
US20190223295A1 (en) 2019-07-18
RU2672667C1 (ru) 2018-11-19

Similar Documents

Publication Publication Date Title
FIC20240010I1 (fi) Sipaglukosidaasi alfa
DK3125836T3 (da) Vejrtrækningshjæpeapparat
DK3094728T3 (da) Kiralt design
BR112016018920A2 (pt) stent altamente flexível
FR3019458B1 (fr) Refracteur
DE112015004002A5 (de) Leuchtdiodenbauteil
MA40254A (fr) Polymorphes du selinexor
FR3030155B1 (fr) Multiplexeur analogique
DE102015102730B8 (de) Verbinder
FI20145938A (fi) Käyttöyksikkö
BR112016016826A2 (pt) suporte flexível
CL2014002313S1 (es) Aparato de iluminacion
FI20146029A (fi) Taipuisa valaiseva monikerrosrakenne
BR112017018419A2 (pt) endoscópio flexível
DK3190964T3 (da) Spirometer
DK3412700T3 (da) Forbindelser
DE112015005367A5 (de) Lichtemittierendes Bauelement
BR112017003965A2 (pt) polipeptídeos vip3 modificados
DK3122230T3 (da) Endoskopisk instrument
FI20165054A (fi) Joustava piirilevy
ES1117755Y (es) Embarcación
DK3399899T3 (da) Håndholdt endoskop
ITUA20162672A1 (it) Video-endoscopio odontoiatrico
ES1120731Y (es) Contera flexible
ES1136434Y (es) Unidad termoaislante flexible multicapa

Legal Events

Date Code Title Description
FG Patent granted

Ref document number: 128468

Country of ref document: FI

Kind code of ref document: B

MM Patent lapsed