FI20115940A0 - Nestejäähdytyselementti - Google Patents

Nestejäähdytyselementti

Info

Publication number
FI20115940A0
FI20115940A0 FI20115940A FI20115940A FI20115940A0 FI 20115940 A0 FI20115940 A0 FI 20115940A0 FI 20115940 A FI20115940 A FI 20115940A FI 20115940 A FI20115940 A FI 20115940A FI 20115940 A0 FI20115940 A0 FI 20115940A0
Authority
FI
Finland
Prior art keywords
liquid cooling
cooling assembly
assembly
liquid
cooling
Prior art date
Application number
FI20115940A
Other languages
English (en)
Swedish (sv)
Inventor
Raimo Heine
Jaani Hyytiaeinen
Antti Puupponen
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20115940A priority Critical patent/FI20115940A0/fi
Publication of FI20115940A0 publication Critical patent/FI20115940A0/fi
Priority to DE201220103524 priority patent/DE202012103524U1/de
Priority to CN201220494399.XU priority patent/CN203027645U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI20115940A 2011-09-26 2011-09-26 Nestejäähdytyselementti FI20115940A0 (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20115940A FI20115940A0 (fi) 2011-09-26 2011-09-26 Nestejäähdytyselementti
DE201220103524 DE202012103524U1 (de) 2011-09-26 2012-09-17 Flüssigkeitskühlelement
CN201220494399.XU CN203027645U (zh) 2011-09-26 2012-09-25 液体冷却元件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20115940A FI20115940A0 (fi) 2011-09-26 2011-09-26 Nestejäähdytyselementti

Publications (1)

Publication Number Publication Date
FI20115940A0 true FI20115940A0 (fi) 2011-09-26

Family

ID=44718845

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20115940A FI20115940A0 (fi) 2011-09-26 2011-09-26 Nestejäähdytyselementti

Country Status (3)

Country Link
CN (1) CN203027645U (fi)
DE (1) DE202012103524U1 (fi)
FI (1) FI20115940A0 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636411B (zh) * 2015-12-30 2018-02-16 中国电子科技集团公司第二十六研究所 液冷用金属流道制作方法及液冷金属流道冷板

Also Published As

Publication number Publication date
DE202012103524U1 (de) 2012-10-05
CN203027645U (zh) 2013-06-26

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Legal Events

Date Code Title Description
FD Application lapsed