FI20106357A0 - Method and apparatus for an action directed to a portion of an electronic structure - Google Patents

Method and apparatus for an action directed to a portion of an electronic structure

Info

Publication number
FI20106357A0
FI20106357A0 FI20106357A FI20106357A FI20106357A0 FI 20106357 A0 FI20106357 A0 FI 20106357A0 FI 20106357 A FI20106357 A FI 20106357A FI 20106357 A FI20106357 A FI 20106357A FI 20106357 A0 FI20106357 A0 FI 20106357A0
Authority
FI
Finland
Prior art keywords
electronic structure
action directed
directed
action
electronic
Prior art date
Application number
FI20106357A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Kimmo Jokelainen
Ville Moilanen
Hannu Vasama
Kimmo Maekelae
Ahti Haapalainen
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20106357A priority Critical patent/FI20106357A0/en
Publication of FI20106357A0 publication Critical patent/FI20106357A0/en
Priority to PCT/FI2011/051138 priority patent/WO2012085347A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
FI20106357A 2010-12-21 2010-12-21 Method and apparatus for an action directed to a portion of an electronic structure FI20106357A0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20106357A FI20106357A0 (en) 2010-12-21 2010-12-21 Method and apparatus for an action directed to a portion of an electronic structure
PCT/FI2011/051138 WO2012085347A1 (en) 2010-12-21 2011-12-20 Method and apparatus for performing an operation aimed at a part of an electronic structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20106357A FI20106357A0 (en) 2010-12-21 2010-12-21 Method and apparatus for an action directed to a portion of an electronic structure

Publications (1)

Publication Number Publication Date
FI20106357A0 true FI20106357A0 (en) 2010-12-21

Family

ID=43415046

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20106357A FI20106357A0 (en) 2010-12-21 2010-12-21 Method and apparatus for an action directed to a portion of an electronic structure

Country Status (2)

Country Link
FI (1) FI20106357A0 (en)
WO (1) WO2012085347A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111229990B (en) * 2020-01-19 2021-08-17 中义(杭州)医药科技有限公司 Electronic chip tray filler

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
JP5017147B2 (en) * 2008-03-06 2012-09-05 東京エレクトロン株式会社 Substrate processing method, program, computer storage medium, and substrate processing system
US20100154870A1 (en) * 2008-06-20 2010-06-24 Nicholas Bateman Use of Pattern Recognition to Align Patterns in a Downstream Process

Also Published As

Publication number Publication date
WO2012085347A1 (en) 2012-06-28

Similar Documents

Publication Publication Date Title
FI20115610A0 (en) Security device for a firearm and method of using the security device
FI20105949A (en) Method and apparatus for attaching a tower structure to a foundation
DE102011050316A8 (en) Mechanical stripping of coated boards
FI20095614A (en) Method for performing pyrolysis and pyrolysis apparatus
FI20115150A0 (en) Method and apparatus for estimating energy consumption
FI20116054L (en) Method for device of energy supply, and device for energy supply
FI20115424A0 (en) Procedure for surface modification of an object
FI20115812A0 (en) Insulation board and process for making them
FI20135878A (en) Method of producing an elastic circuit board and elastic circuit board
FI20125926A (en) Apparatus for lifting and immersing an object with large dimensions and large mass
FI20115534A0 (en) Method and structure for protecting a passivating layer
FI20106357A0 (en) Method and apparatus for an action directed to a portion of an electronic structure
FI20116136A (en) Method and apparatus for following a fiber web
FI20105096A (en) Reinforced structural module and method of manufacture thereof
FI20115449A0 (en) Method and arrangement for adapting the effect of a polymer to soil
FI20115249A0 (en) Method and apparatus for controlling a clock signal generator
FI20106376A0 (en) Method and apparatus for mounting a wind turbine to a high basic structure
FI20125912A (en) Procedure and module for installation of installations in a ship
FI20100032A0 (en) Process and apparatus for degassing a solution
FI20115773A0 (en) Device and method for measuring particles
FI20105983A0 (en) Method and device for submersible drilling
FI20105408A0 (en) Bracket for an electronic device and manufacturing process of a bracket
FI20110070A0 (en) Device and method for reducing pieces
FI20110184A0 (en) Cathode and method of producing a cathode
FI20105449A0 (en) Procedure for surface modification of an object

Legal Events

Date Code Title Description
FD Application lapsed