FI20095436A - Sähkökäyttö - Google Patents

Sähkökäyttö Download PDF

Info

Publication number
FI20095436A
FI20095436A FI20095436A FI20095436A FI20095436A FI 20095436 A FI20095436 A FI 20095436A FI 20095436 A FI20095436 A FI 20095436A FI 20095436 A FI20095436 A FI 20095436A FI 20095436 A FI20095436 A FI 20095436A
Authority
FI
Finland
Prior art keywords
electric power
electric
power
Prior art date
Application number
FI20095436A
Other languages
English (en)
Swedish (sv)
Other versions
FI20095436A0 (fi
Inventor
Mika Silvennoinen
Mika Vartiainen
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20095436A priority Critical patent/FI20095436A/fi
Publication of FI20095436A0 publication Critical patent/FI20095436A0/fi
Priority to EP10159187.3A priority patent/EP2244361A3/en
Priority to US12/761,546 priority patent/US8134832B2/en
Priority to CN2010101520378A priority patent/CN101873788B/zh
Publication of FI20095436A publication Critical patent/FI20095436A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H02B1/565—Cooling; Ventilation for cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
FI20095436A 2009-04-21 2009-04-21 Sähkökäyttö FI20095436A (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20095436A FI20095436A (fi) 2009-04-21 2009-04-21 Sähkökäyttö
EP10159187.3A EP2244361A3 (en) 2009-04-21 2010-04-07 Electric drive
US12/761,546 US8134832B2 (en) 2009-04-21 2010-04-16 Electric drive
CN2010101520378A CN101873788B (zh) 2009-04-21 2010-04-19 电驱动装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20095436A FI20095436A (fi) 2009-04-21 2009-04-21 Sähkökäyttö

Publications (2)

Publication Number Publication Date
FI20095436A0 FI20095436A0 (fi) 2009-04-21
FI20095436A true FI20095436A (fi) 2010-10-22

Family

ID=40590315

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095436A FI20095436A (fi) 2009-04-21 2009-04-21 Sähkökäyttö

Country Status (4)

Country Link
US (1) US8134832B2 (fi)
EP (1) EP2244361A3 (fi)
CN (1) CN101873788B (fi)
FI (1) FI20095436A (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687431B (zh) * 2012-09-20 2016-12-21 施耐德东芝换流器欧洲公司 用于具有散热需求的设备的安装装置
EP3086365A1 (en) * 2015-04-23 2016-10-26 ABB Technology Oy Compensation of power electronic module flatness deviations
EP3490353A1 (de) * 2017-11-27 2019-05-29 Siemens Aktiengesellschaft Kühlsystem mit parallelen kühlkanälen

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2226057C3 (de) * 1972-05-29 1979-04-05 Brown, Boveri & Cie Ag, 6800 Mannheim Einrichtung zur Luftkühlung eines Stromrichters
EP0655881A1 (de) * 1993-11-26 1995-05-31 Siemens Aktiengesellschaft Gehäuse
DE10061143A1 (de) * 2000-12-08 2002-06-13 Abb Research Ltd Vorrichtung zur gleichzeitigen Kühlung mehrerer verteilt angeordneter Bauelemente
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
JP4066657B2 (ja) * 2001-12-27 2008-03-26 株式会社明電舎 屋外盤
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
FI20031714A0 (fi) 2003-11-24 2003-11-24 Abb Oy Invertteri
US20050264995A1 (en) * 2004-05-28 2005-12-01 Lsi Logic Corporation Downdraft cooling system for in-line devices
US7187549B2 (en) * 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow
JPWO2006103721A1 (ja) 2005-03-25 2008-09-04 三菱電機株式会社 電力変換装置の冷却構造
CN2819623Y (zh) * 2005-07-21 2006-09-20 桐乡市三精自动化科技有限公司 隔离式冷却风道的变频调速器
DE102006052872A1 (de) * 2006-11-09 2008-05-15 Tyco Electronics Raychem Gmbh Elektrisches Leistungsmodul
CN101202528B (zh) * 2006-12-11 2012-10-10 丹佛斯传动有限公司 电子装置及电动机变频器
CN101202529A (zh) * 2006-12-11 2008-06-18 丹佛斯传动有限公司 电子装置及电动机变频器
CN201018400Y (zh) * 2007-02-28 2008-02-06 李佩术 分隔封闭式防雨防尘易维护变频调速器及其控制一体化柜
US7639499B1 (en) * 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US7791884B2 (en) * 2008-11-10 2010-09-07 Rockwell Automation Technologies, Inc. Motor drive with heat pipe air cooling

Also Published As

Publication number Publication date
US20100265659A1 (en) 2010-10-21
US8134832B2 (en) 2012-03-13
CN101873788A (zh) 2010-10-27
CN101873788B (zh) 2013-06-05
EP2244361A3 (en) 2016-05-11
EP2244361A2 (en) 2010-10-27
FI20095436A0 (fi) 2009-04-21

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Legal Events

Date Code Title Description
FD Application lapsed