FI20095340A0 - Enclosure for vibration sensor, and sensor for vibration measurement - Google Patents

Enclosure for vibration sensor, and sensor for vibration measurement

Info

Publication number
FI20095340A0
FI20095340A0 FI20095340A FI20095340A FI20095340A0 FI 20095340 A0 FI20095340 A0 FI 20095340A0 FI 20095340 A FI20095340 A FI 20095340A FI 20095340 A FI20095340 A FI 20095340A FI 20095340 A0 FI20095340 A0 FI 20095340A0
Authority
FI
Finland
Prior art keywords
sensor
vibration
enclosure
measurement
vibration measurement
Prior art date
Application number
FI20095340A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Teuvo Sillanpaeae
Anu Kaerkkaeinen
Panu Pekko
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20095340A priority Critical patent/FI20095340A0/en
Publication of FI20095340A0 publication Critical patent/FI20095340A0/en
Priority to PCT/FI2010/050247 priority patent/WO2010112676A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0064Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0285Vibration sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00Microstructural systems or auxiliary parts thereof
    • B81B2207/09Packages
    • B81B2207/091Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/092Buried interconnects in the substrate or in the lid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00Microstructural systems or auxiliary parts thereof
    • B81B2207/09Packages
    • B81B2207/091Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094Feed-through, via
    • B81B2207/095Feed-through, via through the lid

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
FI20095340A 2009-03-30 2009-03-30 Enclosure for vibration sensor, and sensor for vibration measurement FI20095340A0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20095340A FI20095340A0 (en) 2009-03-30 2009-03-30 Enclosure for vibration sensor, and sensor for vibration measurement
PCT/FI2010/050247 WO2010112676A1 (en) 2009-03-30 2010-03-29 A casing of a sensor measuring oscillations, and a sensor for measuring oscillations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20095340A FI20095340A0 (en) 2009-03-30 2009-03-30 Enclosure for vibration sensor, and sensor for vibration measurement

Publications (1)

Publication Number Publication Date
FI20095340A0 true FI20095340A0 (en) 2009-03-30

Family

ID=40510337

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095340A FI20095340A0 (en) 2009-03-30 2009-03-30 Enclosure for vibration sensor, and sensor for vibration measurement

Country Status (2)

Country Link
FI (1) FI20095340A0 (en)
WO (1) WO2010112676A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2514713B1 (en) * 2011-04-20 2013-10-02 Tronics Microsystems S.A. A micro-electromechanical system (MEMS) device
EP2736071B8 (en) 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
DE102013100197A1 (en) * 2013-01-10 2014-07-10 Continental Automotive Gmbh Sensing unit for motor car, has injection molded plastic carrier which is positioned on opposite side to sensor element, and formed of electrical contacts with respect to the circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004364041A (en) * 2003-06-05 2004-12-24 Fujitsu Media Device Kk Surface acoustic wave device and manufacturing method thereof
WO2006041513A1 (en) * 2004-10-07 2006-04-20 Metis Design Corporation Sensor infrastructure
JP2006156513A (en) * 2004-11-26 2006-06-15 Sohki:Kk Lid for package and its manufacturing method
JP2008244244A (en) * 2007-03-28 2008-10-09 Sony Corp Electro-mechanical apparatus and electric/electronic device
WO2009031285A1 (en) * 2007-09-03 2009-03-12 Panasonic Corporation Inertia force sensor

Also Published As

Publication number Publication date
WO2010112676A1 (en) 2010-10-07

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