FI20095340A0 - Enclosure for vibration sensor, and sensor for vibration measurement - Google Patents
Enclosure for vibration sensor, and sensor for vibration measurementInfo
- Publication number
- FI20095340A0 FI20095340A0 FI20095340A FI20095340A FI20095340A0 FI 20095340 A0 FI20095340 A0 FI 20095340A0 FI 20095340 A FI20095340 A FI 20095340A FI 20095340 A FI20095340 A FI 20095340A FI 20095340 A0 FI20095340 A0 FI 20095340A0
- Authority
- FI
- Finland
- Prior art keywords
- sensor
- vibration
- enclosure
- measurement
- vibration measurement
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0285—Vibration sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/092—Buried interconnects in the substrate or in the lid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/094—Feed-through, via
- B81B2207/095—Feed-through, via through the lid
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095340A FI20095340A0 (en) | 2009-03-30 | 2009-03-30 | Enclosure for vibration sensor, and sensor for vibration measurement |
PCT/FI2010/050247 WO2010112676A1 (en) | 2009-03-30 | 2010-03-29 | A casing of a sensor measuring oscillations, and a sensor for measuring oscillations |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095340A FI20095340A0 (en) | 2009-03-30 | 2009-03-30 | Enclosure for vibration sensor, and sensor for vibration measurement |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20095340A0 true FI20095340A0 (en) | 2009-03-30 |
Family
ID=40510337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20095340A FI20095340A0 (en) | 2009-03-30 | 2009-03-30 | Enclosure for vibration sensor, and sensor for vibration measurement |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI20095340A0 (en) |
WO (1) | WO2010112676A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2514713B1 (en) * | 2011-04-20 | 2013-10-02 | Tronics Microsystems S.A. | A micro-electromechanical system (MEMS) device |
EP2736071B8 (en) | 2012-11-22 | 2017-04-19 | Tronic's Microsystems S.A. | Wafer level package with getter |
DE102013100197A1 (en) * | 2013-01-10 | 2014-07-10 | Continental Automotive Gmbh | Sensing unit for motor car, has injection molded plastic carrier which is positioned on opposite side to sensor element, and formed of electrical contacts with respect to the circuit board |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004364041A (en) * | 2003-06-05 | 2004-12-24 | Fujitsu Media Device Kk | Surface acoustic wave device and manufacturing method thereof |
WO2006041513A1 (en) * | 2004-10-07 | 2006-04-20 | Metis Design Corporation | Sensor infrastructure |
JP2006156513A (en) * | 2004-11-26 | 2006-06-15 | Sohki:Kk | Lid for package and its manufacturing method |
JP2008244244A (en) * | 2007-03-28 | 2008-10-09 | Sony Corp | Electro-mechanical apparatus and electric/electronic device |
WO2009031285A1 (en) * | 2007-09-03 | 2009-03-12 | Panasonic Corporation | Inertia force sensor |
-
2009
- 2009-03-30 FI FI20095340A patent/FI20095340A0/en unknown
-
2010
- 2010-03-29 WO PCT/FI2010/050247 patent/WO2010112676A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2010112676A1 (en) | 2010-10-07 |
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