FI20041478A0 - The cooling for a heating component - Google Patents

The cooling for a heating component

Info

Publication number
FI20041478A0
FI20041478A0 FI20041478A FI20041478A FI20041478A0 FI 20041478 A0 FI20041478 A0 FI 20041478A0 FI 20041478 A FI20041478 A FI 20041478A FI 20041478 A FI20041478 A FI 20041478A FI 20041478 A0 FI20041478 A0 FI 20041478A0
Authority
FI
Finland
Prior art keywords
cooling
heating component
heating
component
Prior art date
Application number
FI20041478A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20041478A (en
Inventor
Juhani Helosvuori
Risto Laurila
Markku Talja
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20041478A priority Critical patent/FI20041478A/en
Publication of FI20041478A0 publication Critical patent/FI20041478A0/en
Priority to PCT/FI2005/000487 priority patent/WO2006053937A1/en
Publication of FI20041478A publication Critical patent/FI20041478A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0212—Condensation eliminators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI20041478A 2004-11-17 2004-11-17 Cooling of the warming component FI20041478A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20041478A FI20041478A (en) 2004-11-17 2004-11-17 Cooling of the warming component
PCT/FI2005/000487 WO2006053937A1 (en) 2004-11-17 2005-11-16 Cooling of a heated component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20041478A FI20041478A (en) 2004-11-17 2004-11-17 Cooling of the warming component

Publications (2)

Publication Number Publication Date
FI20041478A0 true FI20041478A0 (en) 2004-11-17
FI20041478A FI20041478A (en) 2006-05-18

Family

ID=33515237

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20041478A FI20041478A (en) 2004-11-17 2004-11-17 Cooling of the warming component

Country Status (2)

Country Link
FI (1) FI20041478A (en)
WO (1) WO2006053937A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2595463B8 (en) * 2011-11-17 2017-08-02 ABB Schweiz AG Method and arrangement for reducing the amount of condensed moisture inside an enclosure for electrical equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107549A1 (en) * 1970-02-19 1971-09-02 Texas Instruments Inc Carrier of an electronic circuit with a collecting system with heat conduction properties for all directions
GB2151504B (en) * 1983-12-20 1988-06-08 Brian James Wills Moisture extractor and air purifier
US4594082A (en) * 1984-11-19 1986-06-10 Harris Corporation Dehydrating air-filtering apparatus
US4586342A (en) * 1985-02-20 1986-05-06 Nissin Electric Co., Ltd. Dehumidifying and cooling apparatus
JP3232908B2 (en) * 1994-09-20 2001-11-26 株式会社日立製作所 Electronic equipment
US5482629A (en) * 1994-12-07 1996-01-09 Universal Environmental Technologies, Inc. Method and apparatus for separating particles from liquids
US6799628B1 (en) * 2000-07-20 2004-10-05 Honeywell International Inc. Heat exchanger having silicon nitride substrate for mounting high power electronic components

Also Published As

Publication number Publication date
WO2006053937A1 (en) 2006-05-26
FI20041478A (en) 2006-05-18

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Legal Events

Date Code Title Description
FD Application lapsed