FI126591B - Method for Grounding Multilayer Tubes, Polymer Tubes, and Pipelines Including Multilayer Tubes - Google Patents

Method for Grounding Multilayer Tubes, Polymer Tubes, and Pipelines Including Multilayer Tubes Download PDF

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Publication number
FI126591B
FI126591B FI20136341A FI20136341A FI126591B FI 126591 B FI126591 B FI 126591B FI 20136341 A FI20136341 A FI 20136341A FI 20136341 A FI20136341 A FI 20136341A FI 126591 B FI126591 B FI 126591B
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FI
Finland
Prior art keywords
conductive layer
conductive
tube
wall structure
layer
Prior art date
Application number
FI20136341A
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Finnish (fi)
Swedish (sv)
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FI20136341A (en
Inventor
Patrick Jansson
Original Assignee
Uponor Infra Oy
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Publication date
Application filed by Uponor Infra Oy filed Critical Uponor Infra Oy
Priority to FI20136341A priority Critical patent/FI126591B/en
Priority to PCT/FI2014/051069 priority patent/WO2015101718A1/en
Publication of FI20136341A publication Critical patent/FI20136341A/en
Application granted granted Critical
Publication of FI126591B publication Critical patent/FI126591B/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L25/00Constructive types of pipe joints not provided for in groups F16L13/00 - F16L23/00 ; Details of pipe joints not otherwise provided for, e.g. electrically conducting or insulating means
    • F16L25/01Constructive types of pipe joints not provided for in groups F16L13/00 - F16L23/00 ; Details of pipe joints not otherwise provided for, e.g. electrically conducting or insulating means specially adapted for realising electrical conduction between the two pipe ends of the joint or between parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00Layered products having a non-planar shape
    • B32B1/08Tubular products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L9/00Rigid pipes
    • F16L9/12Rigid pipes of plastics with or without reinforcement
    • F16L9/121Rigid pipes of plastics with or without reinforcement with three layers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L9/00Rigid pipes
    • F16L9/12Rigid pipes of plastics with or without reinforcement
    • F16L9/125Rigid pipes of plastics with or without reinforcement electrically conducting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/60Connections between or with tubular conductors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/105Metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/107Ceramic
    • B32B2264/108Carbon, e.g. graphite particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514Oriented
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2597/00Tubular articles, e.g. hoses, pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L47/00Connecting arrangements or other fittings specially adapted to be made of plastics or to be used with pipes made of plastics
    • F16L47/02Welded joints; Adhesive joints

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)

Description

METHOD OF GROUNDING MULTILAYER PIPES. POLYMER PIPE. AND PIPELINE COMPRISING MULTILAYER PIPES
Technical Field
The present invention relates to multilayer pipes. In particular, the present invention concerns pipelines or pipings formed by a plurality of multilayer pipes comprising at least a first conductive layer, which pipes are grounded by a conductive link. The present invention also concerns pipes as wells as methods for grounding multilayer pipes comprising at least a first conductive layer to provide a pipe, which allows for grounding of the at least first conductive layer.
Background Art
Flammable liquids and gases, such as gasoline and other hydrocarbons, dry substances, such as dust particles, as well as many other materials are capable of inducing a static charge. If the charge is not conducted out of a system containing these materials, there is a risk of spark ignition. For this reason, only electrically conductive, or at least dissipative, materials can be used in direct contact with media of the above mentioned types.
Suitable conduits for materials of the above kind are represented by multilayer polymer pipes, where the main layer is made of a non-conductive material and conductive layers have been added on the inside or outside (or both) of the pipe. This construction offers a cost effective alternative to pipes made fully of conductive material. However, it also poses some demands on jointing and grounding of the pipes.
Thus, when the conductive layer of the multilayer pipe is located on the inside of the pipe, it is shielded from the surrounding by the insulating main polymer layer. It is necessary to find a specific way to ground the inner conductive layer. It is also of interest to find grounding methods that function as a conductive link between two conductive multilayer pipes that are joined. If the conduction layer is grounded in the proximity of the joint, it is not necessary to ground every single pipe over its entire length, since the whole pipeline is then conductive from end to end. A number of patents deal with jointing of conductive polymer pipes. EP 0 975 911 describes a method of leading away static electricity in mutually joined conductive polymer pipes. According to the method, a sleeve-like body of conductive material is placed in the ends of two pipe-parts to be joined end-to-end, so as to internally bridge the intermediate joint; and a contact pressure is generated between the sleeve-like body and the inner surfaces of the barrier layers at the ends of the two pipe-parts so as to provide an inner, electrically conductive connection between the conductive barrier layers of the mutually joined pipe-parts. US 5 951 812 provides a method of joining two pieces of fiberglass reinforced pipe using a cylindrical joining member adapted to receive the two ends of the pipes. The joining method comprises placing the ends of the pipes inside the joining member and arranging a conductive adhesive between the joining member and the pipes so that the adhesive conducts electricity from one pipe piece to the other pipe piece. The conductive adhesive extends along the inside and the outside pipe conductive surfaces and contacts the inside and the outside conductive surfaces so that static charge on the inside pipe surface can pass to the outside pipe surface. US 3 943 273 discloses a conducting plastic pipe system wherein one part of the pipes is shaped as a male pipe part and the other as a female plastic pipe part with conducting covering layers which are interconnected by means of a conducting sealing ring between the male and female part. In case there are outer covering layers, the covering layer is extended onto the inner side of the muff end of the female pipe part. JP 07310710 relates to a connecting member for antistatic synthetic resin members. To provide a connecting member capable of connecting an antistatic synthetic resin member with the antistatic function thereof maintained. According to the reference, a connecting section for catching the end of an antistatic synthetic resin member is formed at both side ends of a connecting member body. Also, antistatic jointing layers are formed on the surface of the body for jointing antistatic layers formed on the surface of the member inserted and fixed in the section at both side ends. EP 2 167 861 discloses a method for jointing two multilayer pipes comprising at least one conductive layer covered by a non-conductive layer by grounding the conductive layer at the joint using a conductive bridge that extends from the conductive layer through the non-conductive layer to the outer surface of the pipe.
As will appear from the above survey, the known solutions are complex and require the use of separate sealing rings and joining members potentially coupled with the use of resins and adhesives. The know solutions require a complex procedure of boring holes in the wall of the pipes at the joints, prior to jointing the pipes and then filling the holes.
Summary of Invention
Technical Problem
It is an aim of the present invention to eliminate at least a part of the problems associated with the known solutions and to provide a new way of grounding conductive multilayer pipes made of polymer materials in particular to provide efficient grounding of at least a first conductive layer even if these are covered by a non-conductive layer.
It is another aim to provide new pipelines comprising a plurality of multilayer pipes jointed together to form a continuous conduit with proper grounding of the conductive layers.
These and other objects, together with the advantages thereof over known methods and pipe joints, are achieved by the present invention as hereinafter described and claimed.
Solution to Problem
The present invention is based on the idea that at a pipe is provided with at least one conductive contact plug extending from the inside to the outside of the pipe, which plug forms a conductive bridge or link from the conductive inside layer of the pipe to the outside.
Suitably the plug comprises an aperture or hole filled with a conductive material. Preferably, the aperture(s) or hole(s) is/are filled with a conductive, melt-processible material, which is compatible with the material of the conductive layer. The conductive material that fills the aperture serves as a conductive link from the conductive inner or first conductive layer to the outside surface of the pipe. The aperture preferably extends from the inner surface of the pipe essentially transversally to the central axis of the pipe.
If the outside layer of the pipe is non-conductive, the inside layer can be grounded through grounding of the conductive bridge formed by the plug. If the outside layer of the pipe is at least partially conductive, the inside layer can be grounded through any point on the outside layer of the pipe, as the conductive inner and outside layer are connected through the conductive bridge.
In a particular embodiment, a pipe joint contact from the inside to the outside of the pipe is achieved by forming in the pipe wall at least one pair of aperture or hole, whereby the aperture extends from the outer surface of the pipe to the conductive layer. The pair of apertures is positioned at the joint (or in the following “over the joint”), i.e. one on each (opposite) side of the joint and in the proximity of said joint. Each of the apertures is filled with conductive material.
Based on this method, in a pipeline or piping according to the invention, the conductive layer of the pipe is grounded by the conductive link extending from the conductive layer through any overlapping non-conductive layers. In the pipeline, the pair of apertures present on opposite sides and in the proximity of the joint provide for inductive links that prevent induction of static charges at the joint.
More specifically, the method according to the present invention of grounding multilayer pipes is mainly characterized by what is defined in claim 1. A pipe according to the present invention is characterized by what is stated in the characterizing part of claim 15.
The pipeline or piping according to the present invention is characterized by what is stated in the characterizing part of claim 19.
Advantageous Effects of Invention
Considerable advantages are obtained by the present invention. Thus, no production of extra parts is needed - the joint can be processed at the installation site using materials readily available. The inner surface is smooth at the conductive link and the grounding of the conductive layers is secure. A particularly preferred feature resides in the fact that the grounding system does not change the dimensions of the pipe. Furthermore, by mounting a sleeve around the joint, the pressure rating of the pipe can be maintained.
By providing the conductive links close to the joints between two pipes it is possible to provide grounding of two pipes at a common grounding site which is located at the jointing area.
By providing the conductive links close to the joint between two pipes it is even possible to conductively join together the adjacent pipes by forming an external conductive bridge between the links of the two pipes.
By providing all pipes of a pipeline with a conductive link according to the invention, the conductive inner layer is connected to form an integral conductive line which can be grounded at one single point. The conductive link can be provided after the pipes have been jointed. This improves the production process for piping.
In a preferred embodiment, the aperture has a conical shape, whereby the apex of the cone is directed toward the inner surface of the pipe and the base of the cone is directed towards the outer surface of the pipe. The conical shape improves conduction or dissipation of electrical charges. The conical shape with the apex directed towards the inner surface will also reduce or eliminate the danger of melt-processible material flowing into the cylindrical cavity of the pipe during the filling of the aperture.
Brief Description of Drawings
Reference is made to the appended drawings, in which
Figure 1 shows the longitudinal cross-section of a first embodiment of a pipe comprising a pair of inductive link at opposite sides and in the proximity of a joint formed by two pipes joined together end-to-end; and
Figure 2 shows the longitudinal cross-section of a second embodiment, whereby the inductive link comprises a friction welding plug.
Description of Embodiments
As evident from above, and in reference to Fig 1 and Fig 2, the present invention relates to grounding of multi-layered polymer pipes 1, 2, in particular conductive multilayer pipes. The present invention provides for good grounding of the conductive layer 7’, 7”. A wall structure of the pipes 1, 2 which may be joined together typically have at least two layers, an outer layer B and an inner layer A. The wall structure may comprise further layers, e.g. at least one middle layer located between the inner and the outer layers. Preferably, at least a part of the layers is produced from materials, which can be coextruded. Typically, polyolefins, such as polyethylene or polypropylene, are used for making the structural layers of the pipe wall or wall structure.
At least a first layer 7’, 7” is electrically conductive or dissipative. And at least one of the conductive layers is circumferentially covered by an outer non-conductive layer 5,8. Typically, there is one or two conductive or dissipative layer(s) 7’, 7”, which is/are covered by an outer or outermost layer. According to one embodiment, the outermost layer/surface layer 5, 8 of the pipe is non-conductive. In this embodiment, the conductive link according to the invention extends from an inner surface A of the pipes 1, 2 to an outer surface B of the pipes 1, 2 from the first conductive layer 7’, 7”’ through the non-conductive layer 5, 8 to an outer surface B of the pipes 1, 2. The conductive link provides a conductive tab, which can be grounded.
According to another embodiment, the pipes 1, 2 comprise two conductive layers, a first or inner conductive layer 7’, 7” and a second or outer conductive layer 4’, 4” that is located at a distance from the first conductive layer 7’, 7”. The outer conductive layer can be continuous or, preferably, in the shape of conductive stripes, for example stripes which are longitudinally (i.e. axially) orientated with respect to the pipe. An intermediate layer 5, 8 is located between the first and the second conductive layer. Typically, the intermediate layer 5, 8 is a structural, non-conductive layer. The second conductive layer 4’, 4” forms the outer surface B of the wall structure of the pipes 1, 2, and the two conductive layers are connected through the conductive link. Naturally, it is possible to have pipes with more than two conductive layers. There can be several structural and/or non-conductive layers, also.
The conductive or dissipative layer(s) discussed above consist of a polymer material, preferably based on a thermoplastic material, which has been made permanently conductive. The properties of electrical conductivity can be obtained by blending the polymer material with conductive particles, such as fillers comprising carbon black or metal particles, conductive fibres or nanocomposites, including conductive carbon nanotubes. The layer may also contain, optionally and preferably in combination with the above conductive particles or fibres, inherently conductive polymers (ICPs), such as polyacetylene, polythiophene, polyaniline or polypyrrole, or ionomers contaning alkaline and/or earth alkaline metal ions or mixtures thereof. Preferably, the material has a surface resistivity in the conductive range, in particular the surface resistivity is from 1 to 106ohm/sq (ASTM D-257). The layer may also be dissipative, which stands for surface resistivity of about 107 to 1012 ohm/sq (ASTM D-257).
Although the term “conductive” alone is being used in the present description on some occasions to designate the properties of the inner layer, it should be understood that also “dissipative” properties are being referred to.
The term “in the proximity of the joint” means that the distance of each aperture in the pair of apertures is such that no static charge can be induced between the apertures in the pair of apertures over the joint. This distance may vary depending on for example the dimensions of the pipe. Typically, the distance of the bore and, correspondingly, of the conductive plug filling the bore, to the end of the pipe is about 5 to 300 mm, in particular about 7.5 to 200 mm, in particular about 10 to 150 mm, so as to allow for end cutting of the pipe before joining with an adjacent pipe by, e.g. but welding or using a welding sleeve (electrofusion sleeve). The distance is calculated from the rim of the bore closest to the end of the pipe. The bore is preferably located in an area or zone of the pipe which is not subjected to heating during the forming of a joint between adjacent pipes for example by welding.
The term “over the joint” means that at least one aperture is present on each site of a joint.
The weight ratio between the structural and the conductive material in the pipe varies depending on the mechanical strength requirements. The structural laycr(s) determine(s) the nominal pressure of the pipe.
The thickness of the conductive layer(s) varies depending on the application, but typically it is in the range of about 0.01 to 50 mm, in particular about 0.1 to 10 mm, preferably about 0.2 to 5 mm. The total wall thickness of the pipe is about 2 to 150 mm, typically about 3 to 30 mm. The cross-sectional diameter can vary widely between about 32 and 2000 mm, typically from about 63 to 400 mm.
In a preferred embodiment, at least two pipes 1, 2 of the above indicated type are joined together to form a continuous pipeline.
In a pipeline formed by joining together at least two pipes of the above kind, a conductive link is formed from a first conductive layer 7’, 7” to the outer surface B of the pipeline 1, 2 to allow for grounding of the layer 7’, 7”. The conductive link also guarantees undisturbed conductivity. The positioning of conductive links on opposite sides of the joint 3 and in the proximity of the joint 3 prevents induction of electrical charges at the joint 3. Basically, at least one, generally 1 to about 10, and preferably 1 to 4, in particular one or two pairs of apertures are formed in the pipe wall, which apertures extend through the wall from the inner, at least one first conductive layer 7’, 7” through the non-conductive layer 5, 8 to the outer surface B of the pipes 1, 2. The pair of apertures can be formed on one side of the pipe wall, but preferably the pairs of apertures 6 are present on opposite sides on the circumference of the pipe wall. When pairs of apertures are placed evenly around the circumference of the pipe, the grounding spots are equally evenly distributed and thus the distance from static charge induction points to the grounding spots is the shortest possible. Thus, generally a symmetrical distribution of the pairs of apertures 6 along the circumference of the pipe is preferred.
Typically, the aperture 6 has a conical cross-section, and the diameter at the base of the cone thereof is about 5 to 50 mm, in particular about 10 to 30 mm. The diameter at the apex of the cone is about 1 to 25 mm, in particular about 5 to 15 mm. The depth of the aperture 6 depends on the distance between the first conductive layer 7’, 7” and the surface B of the pipes 1, 2. Typically, with the above wall thicknesses, the first conductive layer 7’, 7” is located at about 3 to 30 mm from the surface B. When the first conductive layer 7’, 7”’, which is to be grounded is located on the inside of the pipes 1, 2, the aperture 6 will preferably extend through the whole wall of the pipes 1,2. The aperture 6 preferably extends essentially transversally to the central axis x of the pipes 1, 2. In practice, since the aperture 6 is formed manually, i.e. by on-site drilling or milling, some inclination is also possible. Preferably, the aperture 6 has a conical shape, whereby the apex of the cone is directed toward the inner surface A of the pipes 1, 2 and the base of the cone is directed towards the outer surface B of the pipes 1, 2. has a conical cross-section, The aperture 6 may have a circular cross-section, and the diameter at the base thereof is about 5 to 50 mm, in particular about 10 to 30 mm.
After the forming of the aperture 6, a conductive link is formed by filling the aperture 6 with conductive material 6’, said conductive material 6’ forming a conductive link from the first conductive layer 7’, 7” through the non-conductive layer 5, 8 to the outer surface B of the pipes 1, 2 for grounding of the at least first conductive layer(s). The conductive material 6’ can be introduced by extrusion or by fitting a solid piece of material into the aperture 6.
Other ways of producing a suitable link or conductive plug 16’ is to use an electrofusion material, which can be heated and melted in the aperture 6. A further way of achieving a suitable conductive plug 16’ is by friction welding, by which method the plug 16’ is rotated or vibrated at relatively high speed while applying a force. The friction heat generated at the interface between the plug 16’ and the pipe wall softens or melts both components, and they thereby weld to each other.
In the grounding method, the ends of two multilayer pipes are fit against each other in abutting relationship. The ends of the pipes 1, 2 are secured to each other to form a joint 3 between the pipes 1, 2. One particular convenient way of securing the pipes 1, 2 is to use an electro fusion fitting, which is placed as a sleeve around the joint 3.
The invention provides various embodiments for achieving grounding of the at least first conductive layer 7’, 7”. These are shown in more detail in Figures 1 and 2:
Figure 1 relates to a first embodiment of the invention, wherein a plug 16’ comprising conductive material is inserted into a hole or aperture 6 drilled into a pipe wall. The two pipes comprise two conductive layers 4’, 4” and 7’, 7”, which are positioned on opposite sides of the structural, non-conductive layer 5, 8.
The method according to this embodiment may be carried out as described below.
First, at least a pair of aperture 6 is drilled through the pipe wall 1 and extends through the wall from the inner surface A to the outer surface B. Each aperture 6 of the pair of aperture is positioned on an opposite side and in the proximity of the joint 3.
The aperture 6 is subsequently filled conductive material 6’, whereby the conductive material forms a conductive link from the at least first conductive layer 7’, 7” through the non-conductive layer 5, 8 to the outer surface B for grounding the at least first conductive layer 7’, 7”.
Optionally, in a further method step the filling is performed by extruding a molten mass of the conductive material 6’ into the aperture 6 by heating the conductive material and placing it into the aperture 6. The properties of the molten material 6 are such that it is fluid enough to be placed or pushed in the aperture 6 but solid enough not to flow freely into the pipe 1, but only flow over an edge of the surface A, B of the pipes 1, 2. By controlling the temperature and pressure of the molten material 6’, a sufficient flow length and profile can be achieved when filling the aperture 6 with the extruder. In one embodiment, he molten material 6’ is prevented from flowing into the pipes 1, 2 by using a stopper 9. Alternatively, a balloon can be used. The balloon can be inserted into the pipes 1, 2 at the area where the hole 6 has been drilled. The balloon is pressurized and allows a certain amount of the molten conductive material to flow to the inside surface of the pipes 1, 2, covering the area around the circumference of the hole 6.
The molten conductive material 6’ is subsequently compressed with the stopper 9 as indicated in Fig 1 with the arrows. This way, the inner surface A and the outer surface B are smoothened around the circumference of the aperture 6 in order to increase a contact area of the at least first conductive layer 7’, 7”.
The stopper 9 is then removed or the balloon is then de-pressurized and pulled out when the extrusion is finished and the material 6’ has been allowed to cool down to a level well below the melting point of the material 6’.
In an alternative variant of the first embodiment, a solid plug 16’ is used instead of the extrusion method described above. In this alternative, a hole 16 is drilled through the pipe wall, and a plug 16’ of conductive material is mechanically inserted.
Figure 2 shows a second embodiment comprising the use of a friction welding plug 16’.
The methods steps are largely the same as above explained for the first embodiment. Thus, the pipe ends 1 and 2 are brought together. A hole 16 is milled from the outside of the pipes 1, 2 to the inner layers 7’, 7". The shape of the milling bit is preferably conical. A plug 16’ made of conductive material and having same shape as the milling bit is friction welded to the milled opening 16. Jointing is continued preferably with an electrofusion fitting (not shown).
In an alternative embodiment, a hole or aperture 6, 16 is drilled or milled into the pipes 1, 2, from the outside as far as to the conductive layer 7’, 7”. However, it should be noted that with pipes 1, 2 having a larger diameter, the hole 6, 16 can also be drilled /milled and filled from the inside of the pipes 1, 2.
To avoid perforating the pipe wall, the drilling or milling means can be provided with an indicator light, e.g. a led light, with a voltage source could be connected. Using the inner layer as grounding, the indicator light can be switched on when the bore or bit is touching the surface and an electric circuit is formed. This embodiment provides for exact indication of the drilling/milling depth.
As discussed briefly above, the above description and the drawings mainly relate to an interesting embodiment, wherein there are at least two conductive plugs at abutting ends of two pipes, which plugs are positioned close to the joint between the pipes. Thus, in practice, a pipe produced for use in such a method will exhibit at least two conductive plugs extending through its pipe wall - preferably one at each end.
It is however also possible to achieve grounding of the pipes by merely providing one conductive plug for each pipe. Such a conductive plug can be located at any part of the pipe, i.e. in the middle or at one of the ends.
Industrial Applicability
The present technology can be used for any kind of pipelines in which multilayered polymer pipes, in which at least one dissipating or conductive layer is included. Typical applications included are pipelines, for example underground pipelines, for waste collecting systems, pipelines for conducting powders and other solid matters which may give rise to static electric charges, as well as pipelines for collecting and conducting gases which contain potentially explosive gas, such as biogas containing hydrogen, methane and carbon dioxide, collected from landfill sites.
Reference Signs List A inner surface B outer surface 1; 2 multi-layered polymer pipe 7; 7” inner conductive layer 5; 8 non-conductive layer 4’, 4” outer conductive layer 3 joint 6; 16 aperture 6’; 16’ conductive material/plug 9 stopper
Citation List
Patent Literature EP 0 975 911 US 5 951 812 US 3 943 273 JP 07310710 EP2 167 861

Claims (22)

1. Menetelmä putken (1,2) maadoittamiseksi, joka putki käsittää monikerroksisen seinämärakenteen, jolla on sisäpinta (A) ja ulkopinta (B) ja joka sisältää vähintään ensimmäisen johtavan kerroksen (7, 7"), joka on peitetty johtamattomalla kerroksella (5,8), joka on sijoitettu ensimmäisen johtavan kerroksen (7', 7") ulkopuolelle, tunnettu siitä, että - muodostetaan seinämärakenteeseen vähintään yksi aukko (6), jolloin kukin aukko (6) suuntautuu seinämärakenteen läpi sisäpinnalta (A) ulkopinnalle (B), joka aukko sijaitsee sellaisella putken alueella, joka ei ole altis kuumennukselle, kun vierekkäisten putkien liitos muodostetaan esimerkiksi hitsaamalla, ja - täytetään aukko (6) ekstruusiolla saatavalla, johtavalla materiaalilla (6'), joka mainittu johtava materiaali muodostaa johtavan linkin mainitulta vähintään ensimmäiseltä johtavalta kerrokselta (7', 7") johtamattoman kerroksen (5, 8) läpi ulkopinnalle (B) mainitun vähintään ensimmäisen johtavan kerroksen (7', 7") maadoittamiseksi.A method for grounding a tube (1,2), comprising a multilayer wall structure having an inner surface (A) and an outer surface (B) and comprising at least a first conductive layer (7, 7 ") covered with a non-conductive layer (5, 8) located outside the first conductive layer (7 ', 7 "), characterized in that - at least one opening (6) is formed in the wall structure, each opening (6) extending through the wall structure from the inner surface (A) to the outer surface (B), which opening is located in a region of the tube which is not subject to heat when the junction of adjacent tubes is formed by, for example, welding, and - filling the opening (6) with extruded conductive material (6 '), said conductive material forming a conductive link from said at least first conductive layer (7 ', 7 ") through a non-conductive layer (5, 8) on the outer surface (B) of said at least first conductive to ground the layer (7 ', 7 "). 2. Patenttivaatimuksen 1 mukainen menetelmä kahden putken (1,2) välisen liitoksen (3) maadoittamiseksi, joista putkista (1,2) kukin käsittää monikerroksisen seinämärakenteen, jolla on sisäpinta (A) ja ulkopinta (B) ja joka sisältää vähintään ensimmäisen johtavan kerroksen (7, 7"), joka on peitetty johtamattomalla kerroksella (5, 8), joka on sijoitettu ensimmäisen johtavan kerroksen (7', 7") ulkopuolelle, joka menetelmä käsittää vaiheet, joissa - muodostetaan vähintään yksi pari aukkoja (6) seinämärakenteeseen, jolloin kukin aukkojen parin aukko (6) on sijoitettu liitoksen (3) vastakkaiselle puolelle ja sen lähelle, jolloin kukin aukko (6) suuntautuu seinämärakenteen läpi sisäpinnalta (A) ulkopinnalle (B), ja - täytetään aukko (6) johtavalla materiaalilla (6'), joka mainittu johtava materiaali muodostaa johtavan linkin mainitulta vähintään ensimmäiseltä johtavalta kerrokselta (7', 7") johtamattoman kerroksen (5, 8) läpi ulkopinnalle (B) mainitun vähintään ensimmäisen johtavan kerroksen (7', 7") maadoittamiseksi.A method for grounding a connection (3) between two tubes (1,2) according to claim 1, each of which tubes comprises a multilayer wall structure having an inner surface (A) and an outer surface (B) and comprising at least a first conductive layer. (7, 7 ") covered with a non-conductive layer (5, 8) disposed outside the first conductive layer (7 ', 7"), the method comprising the steps of: - forming at least one pair of openings (6) in the wall structure, wherein each aperture (6) of the pair of apertures is disposed on and adjacent to the opposite side of the joint (3), each aperture (6) extending through the wall structure from the inner surface (A) to the outer surface (B), and ), said conductive material forming a conductive link from said at least first conductive layer (7 ', 7 ") through a non-conductive layer (5, 8) to said outer surface (B) at least to ground the first conductive layer (7 ', 7 "). 3. Patenttivaatimuksen 1 tai 2 mukainen menetelmä, jossa aukon (6) täyttäminen edelleen käsittää menetelmäv aiheet, joissa - ekstmdoidaan sulaa johtavan materiaalin massaa (6') aukkoon (6), ja - rajoitetaan sulan materiaalin (6') virtausta putkeen (1,2) tulpalla (9) samalla, kun sallitaan sulan materiaalin (6') osan virrata putken (1,2) seinämärakenteen sisäpinnan (A) ja ulkopinnan (B) ylitse, ja puristetaan sulaa materiaalia (6') tulpalla (9) pinnan (A, B) tasoittamiseksi aukon (6) kehän ympärillä vähintään ensimmäisen johtavan kerroksen (T, 7") kontaktialueen suurentamiseksi.The method according to claim 1 or 2, wherein filling the aperture (6) further comprises methods of: - extending a mass (6 ') of molten conductive material to the aperture (6), and - restricting the flow of molten material (6') into the tube (1); 2) a stopper (9) while allowing a portion of the molten material (6 ') to flow over the inner surface (A) and the outer surface (B) of the wall structure of the tube (1,2), and to press the molten material (6') A, B) for flattening around the periphery of the opening (6) to enlarge the contact area of at least the first conductive layer (T, 7 "). 4. Patenttivaatimuksen 1 tai 2 mukainen menetelmä, jossa aukko (6) muodostetaan koneistamalla putken (1,2) ulkopintaa (B) vähintään mainittuun ensimmäiseen kerrokseen (T, 7"), ja tulppa (16'), joka käsittää johtavaa materiaalia ja joka on muodoltaan samanlainen kuin koneistettu aukko (6), kitkahitsataan koneistettuun aukkoon (6).A method according to claim 1 or 2, wherein the opening (6) is formed by machining the outer surface (B) of the tube (1,2) to at least said first layer (T, 7 ") and a stopper (16 ') comprising conductive material and is similar in shape to the machined opening (6), friction welded to the machined opening (6). 5. Patenttivaatimuksen 1 tai 2 mukainen menetelmä, jossa aukko (6) muodostetaan koneistamalla putken (1,2) sisäpintaa (A) vähintään mainittuun ensimmäiseen kerrokseen (7', 7"), ja tulppa (16'), joka käsittää johtavaa materiaalia ja joka on muodoltaan samanlainen kuin koneistettu aukko (6), kitkahitsataan koneistettuun aukkoon (6).A method according to claim 1 or 2, wherein the opening (6) is formed by machining the inner surface (A) of the tube (1,2) to at least said first layer (7 ', 7 ") and a stopper (16') comprising conductive material and which is similar in shape to the machined opening (6), is friction welded to the machined opening (6). 6. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa putken seinämärakenne (1,2) käsittää ensimmäisen johtavan kerroksen (7', 7") ja johtamattoman kerroksen (5, 8), joka jälkimmäinen muodostaa putken (1, 2) ulkopinnan (B), jolloin ensimmäinen johtava kerros (7', 7") on maadoitettu johtavalla linkillä.A method according to any one of the preceding claims, wherein the tube wall structure (1,2) comprises a first conductive layer (7 ', 7 ") and a non-conductive layer (5, 8), the latter forming the outer surface (B) of the tube (1, 2). , wherein the first conductive layer (7 ', 7 ") is grounded by a conductive link. 7. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa johtava materiaali (6') on johtava polymeeri.The method according to any one of the preceding claims, wherein the conductive material (6 ') is a conductive polymer. 8. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa aukko (6) on muodoltaan kartiomainen, jolloin kartion huippu suuntautuu kohti putken (1,2) sisäpintaa (A).A method according to any one of the preceding claims, wherein the aperture (6) is conical in shape with the tip of the cone facing toward the inner surface (A) of the tube (1,2). 9. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa muodostetaan Ι-ΙΟ paria, edullisesti 1-4 paria, johtavia linkkejä, jotka maadoittavat ensimmäisen johtavan kerroksen (7', 7").A method according to any one of the preceding claims, wherein Ι-ΙΟ pairs, preferably 1-4 pairs, of conductive links are formed which ground the first conductive layer (7 ', 7 "). 10. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä kahden putken (1, 2) liittämiseksi, joka putki käsittää monikerroksisen seinämärakenteen, jolla on sisäpinta (A) ja ulkopinta (B) ja joka sisältää vähintään ensimmäisen johtavan kerroksen (7, 7"), joka on peitetty johtamattomalla kerroksella (5, 8), joka on sijoitettu johtavan kerroksen (7', 7") ulkopuolelle, jossa menetelmässä - kahden monikerroksisen putken (1,2) päät sovitetaan toisiaan vastaan puskuliitossuhteeseen, - putkien (1,2) päät kiinnitetään toisiinsa putkien (1,2) välisen liitoksen (3) muodostamiseksi, ja - mainittu vähintään yksi johtava kerros (7', 7") maadoitetaan.A method for joining two pipes (1, 2) according to any one of the preceding claims, comprising a multilayer wall structure having an inner surface (A) and an outer surface (B) and comprising at least a first conductive layer (7, 7 ") which is covered with a non-conductive layer (5, 8) disposed outside the conductive layer (7 ', 7 "), in which: - the ends of two multilayer tubes (1,2) are matched to each other in a butt joint relationship, - the ends of the tubes (1,2) are fixed to each other forming a connection (3) between the pipes (1,2), and - said at least one conductive layer (7 ', 7 ") being grounded. 11. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa kukin putkien kerroksista muodostetaan polymeerimateriaalista.The method according to any one of the preceding claims, wherein each of the pipe layers is formed of a polymeric material. 12. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa putkien kerrokset muodostetaan polymeerimateriaalista, jotka ovat - koekstrudoitavissa, - toisiinsa hitsattavissa, tai - kumpaakin näistä.The method according to any one of the preceding claims, wherein the layers of the tubes are formed of a polymeric material which is - coextrudable, - weldable to one another, or - each of these. 13. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa kaksi putkea liitetään yhteen puskufuusiohitsauksella tai sähköfuusiohitsauksella käyttämällä sähköfuusioholkkeja.The method according to any one of the preceding claims, wherein the two tubes are joined by butt fusion welding or electro-fusion welding using electrofusion bushings. 14. Jonkin edellä olevan patenttivaatimuksen mukainen menetelmä, jossa putken (1, 2) seinämärakenne käsittää ensimmäisen johtavan kerroksen (7', 7"), toisen johtavan kerroksen (4', 4"), joka sijaitsee etäisyyden päässä ensimmäisestä johtavasta kerroksesta (7', 7"), ja johtamattoman välikerroksen (5, 8), joka sijaitsee ensimmäisen ja toisen johtavan kerroksen välissä, jolloin toinen johtava kerros (4', 4") muodostaa putken (1, 2) ulkopinnan (B) ja ensimmäinen ja toinen johtava kerros on yhdistetty johtavan linkin avulla, joka mainittu ensimmäinen johtava kerros (7', 7") on maadoitettu toisen johtavan kerroksen (4', 4") minkä tahansa kohdan läpi.The method according to any one of the preceding claims, wherein the wall structure of the tube (1, 2) comprises a first conductive layer (7 ', 7 "), a second conductive layer (4', 4") located at a distance from the first conductive layer (7 '). , 7 "), and a non-conductive intermediate layer (5, 8) disposed between the first and second conductive layers, wherein the second conductive layer (4 ', 4") forms the outer surface (B) of the tube (1, 2) and the first and second conductive the layer is connected by a conductive link, said first conductive layer (7 ', 7 ") being grounded through any point of the second conductive layer (4', 4"). 15. Polymeeriputki (1), jolla on sisäpinnan (A) ja ulkopinnan (B) käsittävä seinämärakenne (1, 2) ja joka käsittää vähintään ensimmäisen johtavan kerroksen (7', 7"), joka on peitetty johtamattomalla kerroksella (5, 8), joka sijaitsee ensimmäisen johtavan kerroksen (7', 7") ulkopinnalla, tunnettu siitä, että putki (1,2) käsittää - vähintään yhden seinämärakenteessa olevan aukon (6), - joka aukko sijaitsee alueella, jota ei lämmitetä, kun putki yhdistetään toiseen putkeen hitsaamalla, ja - joka aukko (6) suuntautuu seinämärakenteen läpi sisäpinnasta (A) ulkopintaan (B), ja jolloin aukko (6) on täytetty johtavalla materiaalilla, joka johtava materiaali muodostaa johtavan linkin vähintään ensimmäisestä johtavasta kerroksesta (7', 7") johtamattoman kerroksen (5, 8) läpi ulkopinnalle (B) vähintään ensimmäisen johtavan kerroksen (7', 7") maadoittamiseksi.A polymer tube (1) having a wall structure (1, 2) comprising an inner surface (A) and an outer surface (B) and comprising at least a first conductive layer (7 ', 7 ") covered with a non-conductive layer (5, 8). located on the outer surface of the first conductive layer (7 ', 7 "), characterized in that the tube (1,2) comprises - at least one opening (6) in the wall structure, - which opening is located in an unheated region when the tube is connected to another welding to the tube, and - the opening (6) extending through the wall structure from the inner surface (A) to the outer surface (B), and wherein the opening (6) is filled with conductive material, the conductive material forming a conductive link from at least the first conductive layer (7 ', 7 ") through a non-conductive layer (5, 8) to the outer surface (B) to ground at least the first conductive layer (7 ', 7 "). 16. Patenttivaatimuksen 15 mukainen polymeeriputki (1), jossa on ensimmäinen pää ja toinen, vastakkainen pää, jossa putken seinämän alueella ensimmäisen pään lähellä on vähintään yksi johtavalla materiaalilla täytetty aukko, kun taas vastakkaisen, toisen pään lähellä olevalla alueella ei ole tällaisia aukkoja.The polymer tube (1) according to claim 15, having a first end and a second opposing end, wherein at least one opening filled with conductive material is provided in the region of the tube wall near the first end, whereas there are no such apertures in the region near the opposite end. 17. Patenttivaatimuksen 15 tai 16 mukainen polymeeriputki (1), jossa putken (1, 2) seinämärakenne käsittää ensimmäisen johtavan kerroksen (7', 7"), toisen johtavan kerroksen (4', 4"), joka sijaitsee etäisyyden päässä ensimmäisestä johtavasta kerroksesta (7', 7"), ja johtamattoman välikerroksen (5, 8), joka sijaitsee ensimmäisen ja toisen johtavan kerroksen välissä, jolloin toinen johtava kerros (4', 4") muodostaa putken (1, 2) ulkopinnan (B) ja ensimmäinen ja toinen johtava kerros on yhdistetty johtavan linkin avulla, joka mainittu ensimmäinen johtava kerros (7', 7") on maadoitettu toisen johtavan kerroksen (4', 4") minkä tahansa kohdan läpi. 18. lonkin patenttivaatimuksen 15-17 mukainen polymeeriputki (1), jossa putken (1, 2) seinämärakenne käsittää toisen johtavan kerroksen (4', 4"), joka sijaitsee seinämärakenteen ulkopinnalla, joka toinen johtava kerros on jatkuvan johtavan kerroksen muodossa tai, edullisesti, johtavien nauhojen muodossa.The polymer tube (1) according to claim 15 or 16, wherein the wall structure of the tube (1, 2) comprises a first conductive layer (7 ', 7 "), a second conductive layer (4', 4") spaced from the first conductive layer. (7 ', 7 ") and a non-conductive intermediate layer (5, 8) disposed between the first and second conductive layers, wherein the second conductive layer (4', 4") forms the outer surface (B) of the tube (1, 2) and and the second conductive layer is connected by a conductive link, said first conductive layer (7 ', 7 ") being grounded through any point of the second conductive layer (4', 4"). The polymer tube (1) according to any one of claims 15 to 17, wherein the wall structure of the tube (1, 2) comprises a second conductive layer (4 ', 4 ") located on the outer surface of the wall structure, the second conductive layer being in the form of a continuous conductive layer; , in the form of conductive tapes. 19. Putkisto, joka käsittää vähintään kaksi monikerroksista putkea (1, 2), jotka on liitetty putkien (1, 2) välisellä liitoksella (3), jolloin kunkin putken (1, 2) seinämärakenne käsittää sisäpinnan (A) ja ulkopinnan (B) ja jossa on vähintään ensimmäinen johtava kerros (7', 7"), joka on peitetty johtamattomalla kerroksella (5, 8), joka sijaitsee ensimmäisen johtavan kerroksen (7', 7") ulkopuolella, tunnettu siitä, että kukin putkiston putkista (1,2) käsittää vähintään yhden seinämärakenteessa olevan aukon (6), joka kukin aukko (6) suuntautuu seinämärakenteen läpi sisäpinnalta (A) ulkopinnalle (B) ja jolloin aukko (6) on täytetty ekstrudoimalla saatavalla, johtavalla materiaalilla, joka johtava materiaali muodostaa johtavan linkin vähintään ensimmäiseltä johtavalta kerrokselta (7', 7") johtamattoman kerroksen (5, 8) läpi ulkopinnalle (B) ensimmäisen johtavan kerroksen (7', 7") maadoittamiseksi, jolloin putket (1,2) käsittävät vähintään yhden seinämärakenteessa olevien aukkojen (6) parin, jolloin kukin aukkojen parin aukko (6) sijaitsee liitoksen (3) vastakkaisella puolella ja sen lähellä.Piping comprising at least two multilayer pipes (1, 2) connected by a connection (3) between the pipes (1, 2), the wall structure of each pipe (1, 2) comprising an inner surface (A) and an outer surface (B) and having at least a first conductive layer (7 ', 7 ") covered with a non-conductive layer (5, 8) located outside the first conductive layer (7', 7"), characterized in that each of the pipes (1, 2) comprises at least one opening (6) in the wall structure, each opening (6) extending through the wall structure from the inner surface (A) to the outer surface (B) and wherein the opening (6) is filled with extrudable conductive material from the first conductive layer (7 ', 7 ") through the non-conductive layer (5, 8) to the outer surface (B) to ground the first conductive layer (7', 7"), the tubes (1,2) comprising at least one n pair of openings (6) in the wall structure, each opening (6) of the pair of openings being located on and opposite to the opposite side of the joint (3). 20. Patenttivaatimuksen 19 mukainen putkisto, jossa putken (1, 2) seinämärakenne käsittää ensimmäisen johtavan kerroksen (7', 7"), toisen johtavan kerroksen (4', 4"), joka sijaitsee etäisyyden päässä ensimmäisestä johtavasta kerroksesta (7', 7"), ja johtamattoman välikerroksen (5, 8), joka sijaitsee ensimmäisen ja toisen johtavan kerroksen välissä, jolloin toinen johtava kerros (4', 4") muodostaa putken (1,2) ulkopinnan (B) ja ensimmäinen ja toinen johtava kerros on yhdistetty johtavan linkin avulla, joka mainittu ensimmäinen johtava kerros (7', 7") on maadoitettu toisen johtavan kerroksen (4', 4") minkä tahansa kohdan läpi.Piping system according to claim 19, wherein the wall structure of the pipe (1, 2) comprises a first conductive layer (7 ', 7 "), a second conductive layer (4', 4") located at a distance from the first conductive layer (7 ', 7). "), and a non-conductive intermediate layer (5, 8) disposed between the first and second conductive layers, wherein the second conductive layer (4 ', 4") forms the outer surface (B) of the tube (1,2) and the first and second conductive layers are connected by a conductive link, said first conductive layer (7 ', 7 ") being grounded through any point of the second conductive layer (4', 4"). 21. Patenttivaatimuksen 19 tai 20 mukainen putkisto, jossa johtava materiaali (6') on johtava polymeeri.Piping system according to claim 19 or 20, wherein the conductive material (6 ') is a conductive polymer. 22. .Tonkin patenttivaatimuksen 19-21 mukainen putkisto, jossa johtava linkki suuntautuu ensimmäisestä johtavasta kerroksesta (7', 7") johtamattoman kerroksen (5, 8) läpi olennaisesti kohtisuoraan putkien (1,2) keskiakseliin (x) nähden ja jossa aukko (6) on muodoltaan kartiomainen, jolloin kartion huippu suuntautuu kohti putken (1,2) sisäpintaa (A).Piping system according to any one of claims 19 to 21, wherein the conductive link extends from the first conductive layer (7 ', 7 ") through a non-conducting layer (5, 8) substantially perpendicular to the center axis (x) of the tubes (1,2) and 6) is conical in shape with the tip of the cone facing toward the inner surface (A) of the tube (1,2). 23. Jonkin patenttivaatimuksen 19-22 mukainen putkisto, jossa putkien (1, 2) seinämärakenne käsittää toisen johtavan kerroksen (4', 4"), joka sijaitsee seinämärakenteen ulkopinnalla, joka toinen johtava kerros on jatkuvan johtavan kerroksen muodossa tai, edullisesti, johtavien nauhojen muodossa.Piping system according to any one of claims 19 to 22, wherein the wall structure of the tubes (1, 2) comprises a second conductive layer (4 ', 4 ") located on the outer surface of the wall structure, the second conductive layer being in the form of a continuous conductive layer or in terms of.
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