FI11192U1 - Heat Sink - Google Patents
Heat SinkInfo
- Publication number
- FI11192U1 FI11192U1 FIU20154221U FIU20154221U FI11192U1 FI 11192 U1 FI11192 U1 FI 11192U1 FI U20154221 U FIU20154221 U FI U20154221U FI U20154221 U FIU20154221 U FI U20154221U FI 11192 U1 FI11192 U1 FI 11192U1
- Authority
- FI
- Finland
- Prior art keywords
- heat sink
- sink
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202015007580.0U DE202015007580U1 (en) | 2015-11-03 | 2015-11-03 | heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
FI11192U1 true FI11192U1 (en) | 2016-04-11 |
Family
ID=55274269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FIU20154221U FI11192U1 (en) | 2015-11-03 | 2015-12-16 | Heat Sink |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN205648296U (en) |
DE (1) | DE202015007580U1 (en) |
FI (1) | FI11192U1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108010894A (en) * | 2018-01-04 | 2018-05-08 | 钦州学院 | The augmentation of heat transfer cpu heat of imitative camphortree leaf microstructural surfaces |
GB2575015B (en) * | 2018-05-23 | 2023-02-22 | Veragon Srl | Atmospheric water generator using a finned heat exchanger |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957194A (en) | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6691768B2 (en) | 2001-06-25 | 2004-02-17 | Sun Microsystems, Inc. | Heatsink design for uniform heat dissipation |
CN102427695A (en) | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Copper-aluminum composite stepped cooling fin |
-
2015
- 2015-11-03 DE DE202015007580.0U patent/DE202015007580U1/en active Active
- 2015-12-16 FI FIU20154221U patent/FI11192U1/en active IP Right Grant
-
2016
- 2016-01-14 CN CN201620036653.XU patent/CN205648296U/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE202015007580U1 (en) | 2016-01-14 |
CN205648296U (en) | 2016-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FGU | Utility model registered |
Ref document number: 11192 Country of ref document: FI Kind code of ref document: U1 |
|
PCU | New assignee or owner (utility models) |
Owner name: ABB SCHWEIZ AG |