ES462703A1 - Perfeccionamientos introducidos en una disposicion de recti-ficador para corriente de alta intensidad. - Google Patents

Perfeccionamientos introducidos en una disposicion de recti-ficador para corriente de alta intensidad.

Info

Publication number
ES462703A1
ES462703A1 ES462703A ES462703A ES462703A1 ES 462703 A1 ES462703 A1 ES 462703A1 ES 462703 A ES462703 A ES 462703A ES 462703 A ES462703 A ES 462703A ES 462703 A1 ES462703 A1 ES 462703A1
Authority
ES
Spain
Prior art keywords
high current
rectifier arrangement
compartment
periphery
cooling agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES462703A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HA Schlatter AG
Original Assignee
HA Schlatter AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HA Schlatter AG filed Critical HA Schlatter AG
Publication of ES462703A1 publication Critical patent/ES462703A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
  • Die Bonding (AREA)
  • Motor Or Generator Current Collectors (AREA)

Abstract

Perfeccionamientos introducidos en una disposición de rectificador para corriente de alta intensidad con al menos un elemento rectificador semiconductor que presenta superficies de contacto entre cuerpos de contacto provistos de canales de refrigerante, de los cuales uno es móvil y está pretensazo hacia el otro cuerpo de contacto por medio de fuerza de muelle y se encuentra unido eléctricamente con una pieza de muelle y se encuentra unido eléctricamente con una pieza de conexión correspondiente a través de un conductor de unión deformable, caracterizados porque el cuerpo de contacto móvil está realizado en forma de pistón y se halla dispuesto con holgura radial en un recinto conformado a manera de cilindro en la pieza de conexión asociada, y está también rodeado por el lado de la periferia por el conductor de unión que puentea la holgura radial respecto de la pared interior del recinto, y porque está conformado también en su periferia, pero quedando desplazado con relación al conductor de unión, y está unido con efecto de obturación con canales de refrigerante existentes en la pieza de conexión.
ES462703A 1976-09-29 1977-09-28 Perfeccionamientos introducidos en una disposicion de recti-ficador para corriente de alta intensidad. Expired ES462703A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1229576A CH601918A5 (es) 1976-09-29 1976-09-29

Publications (1)

Publication Number Publication Date
ES462703A1 true ES462703A1 (es) 1978-06-01

Family

ID=4381665

Family Applications (1)

Application Number Title Priority Date Filing Date
ES462703A Expired ES462703A1 (es) 1976-09-29 1977-09-28 Perfeccionamientos introducidos en una disposicion de recti-ficador para corriente de alta intensidad.

Country Status (14)

Country Link
US (1) US4128870A (es)
JP (1) JPS606545B2 (es)
AT (1) AT375214B (es)
BE (1) BE859193A (es)
CA (1) CA1073046A (es)
CH (1) CH601918A5 (es)
DE (1) DE2740630C2 (es)
ES (1) ES462703A1 (es)
FR (1) FR2366696A1 (es)
GB (1) GB1547008A (es)
IT (1) IT1087540B (es)
NL (1) NL7710591A (es)
SE (1) SE423583B (es)
SU (1) SU674696A3 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
DE3409037A1 (de) * 1984-03-13 1985-09-19 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet
US4603344A (en) * 1984-07-30 1986-07-29 Sundstrand Corporation Rotating rectifier assembly
US4614964A (en) * 1984-08-15 1986-09-30 Sundstrand Corporation Coaxial semiconductor package
CH673188A5 (es) * 1987-08-03 1990-02-15 Schlatter Ag
US4943890A (en) * 1989-07-19 1990-07-24 Benshaw, Inc. Solid state motor starter
US5530414A (en) * 1993-09-15 1996-06-25 Saftronics, Inc. Switching accessory for use with motor starters
US6501650B2 (en) 2001-03-30 2002-12-31 General Electric Company Series-parallel fans system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395321A (en) * 1966-07-11 1968-07-30 Int Rectifier Corp Compression bonded semiconductor device assembly
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
US3559001A (en) * 1968-08-21 1971-01-26 Motorola Inc Semiconductor housing assembly
US3652903A (en) * 1971-02-01 1972-03-28 Gen Electric Fluid cooled pressure assembly
US3727114A (en) * 1971-08-03 1973-04-10 Mitsubishi Electric Corp Air cooled semiconductor stack
US3723836A (en) * 1972-03-15 1973-03-27 Motorola Inc High power semiconductor device included in a standard outline housing
DE2332896B2 (de) * 1973-06-28 1978-12-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit einem scheibenförmigen Gehäuse für ein Dioden- oder Thyristorelement
DE2529954C2 (de) * 1975-07-04 1977-07-07 Siemens Ag Stromrichterventil
US4015184A (en) * 1975-11-20 1977-03-29 Clinton Supply Company Silicon junction diode rectifier power pack

Also Published As

Publication number Publication date
SE423583B (sv) 1982-05-10
BE859193A (fr) 1978-03-29
DE2740630C2 (de) 1985-01-17
IT1087540B (it) 1985-06-04
US4128870A (en) 1978-12-05
NL7710591A (nl) 1978-03-31
ATA673777A (de) 1983-11-15
SU674696A3 (ru) 1979-07-15
JPS606545B2 (ja) 1985-02-19
SE7710110L (sv) 1978-03-30
FR2366696B1 (es) 1981-01-09
CA1073046A (en) 1980-03-04
FR2366696A1 (fr) 1978-04-28
DE2740630A1 (de) 1978-03-30
CH601918A5 (es) 1978-07-14
GB1547008A (en) 1979-06-06
JPS5342324A (en) 1978-04-17
AT375214B (de) 1984-07-10

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19971103