ES417271A1 - Perfeccionamientos en las disposiciones de semiconductores. - Google Patents

Perfeccionamientos en las disposiciones de semiconductores.

Info

Publication number
ES417271A1
ES417271A1 ES73417271A ES417271A ES417271A1 ES 417271 A1 ES417271 A1 ES 417271A1 ES 73417271 A ES73417271 A ES 73417271A ES 417271 A ES417271 A ES 417271A ES 417271 A1 ES417271 A1 ES 417271A1
Authority
ES
Spain
Prior art keywords
recesses
semiconductor
slit
tablets
electrical circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES73417271A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of ES417271A1 publication Critical patent/ES417271A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
ES73417271A 1972-07-29 1973-07-26 Perfeccionamientos en las disposiciones de semiconductores. Expired ES417271A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2237366A DE2237366A1 (de) 1972-07-29 1972-07-29 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
ES417271A1 true ES417271A1 (es) 1976-03-16

Family

ID=5852087

Family Applications (1)

Application Number Title Priority Date Filing Date
ES73417271A Expired ES417271A1 (es) 1972-07-29 1973-07-26 Perfeccionamientos en las disposiciones de semiconductores.

Country Status (11)

Country Link
US (1) US3877065A (es)
JP (1) JPS4953772A (es)
AR (1) AR195531A1 (es)
BR (1) BR7305747D0 (es)
CH (1) CH568657A5 (es)
DE (1) DE2237366A1 (es)
ES (1) ES417271A1 (es)
FR (1) FR2195067A1 (es)
GB (1) GB1445131A (es)
IT (1) IT993617B (es)
SE (1) SE381954B (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4355719A (en) * 1980-08-18 1982-10-26 National Semiconductor Corporation Mechanical shock and impact resistant ceramic semiconductor package and method of making the same
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
US3560813A (en) * 1969-03-13 1971-02-02 Fairchild Camera Instr Co Hybridized monolithic array package
US3568036A (en) * 1969-12-15 1971-03-02 Electronic Devices Inc Voltage-multiplier assembly
US3739438A (en) * 1970-02-25 1973-06-19 Union Carbide Corp System for molding electronic components

Also Published As

Publication number Publication date
IT993617B (it) 1975-09-30
FR2195067A1 (es) 1974-03-01
SE381954B (sv) 1975-12-22
US3877065A (en) 1975-04-08
DE2237366A1 (de) 1974-02-14
GB1445131A (en) 1976-08-04
JPS4953772A (es) 1974-05-24
AR195531A1 (es) 1973-10-15
CH568657A5 (es) 1975-10-31
BR7305747D0 (pt) 1974-07-11

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