ES360009A1 - Process and device for depositing on surfaces - Google Patents
Process and device for depositing on surfacesInfo
- Publication number
- ES360009A1 ES360009A1 ES360009A ES360009A ES360009A1 ES 360009 A1 ES360009 A1 ES 360009A1 ES 360009 A ES360009 A ES 360009A ES 360009 A ES360009 A ES 360009A ES 360009 A1 ES360009 A1 ES 360009A1
- Authority
- ES
- Spain
- Prior art keywords
- deposited
- constituted
- wall
- atmosphere
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Adornments (AREA)
Abstract
Method for coating surfaces consisting of immersing the surfaces in a rarefied atmosphere of rare gas subjected to a high-frequency electromagnetic field whose production means are constituted by the material to be deposited and are submerged in said atmosphere, characterized in that it is available a wall constituted by the material to be deposited and split end to end inside the production medium of the high frequency field and said wall is electrically connected to said medium. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT262715D | |||
BE50663 | 1967-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES360009A1 true ES360009A1 (en) | 1970-10-16 |
Family
ID=25608192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES360009A Expired ES360009A1 (en) | 1967-11-10 | 1968-11-08 | Process and device for depositing on surfaces |
Country Status (9)
Country | Link |
---|---|
US (1) | US3619402A (en) |
JP (1) | JPS4929818B1 (en) |
AT (1) | AT279994B (en) |
DE (1) | DE1765850A1 (en) |
DK (1) | DK131005B (en) |
ES (1) | ES360009A1 (en) |
LU (1) | LU57245A1 (en) |
NO (1) | NO120815B (en) |
SE (1) | SE347296B (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1365492A (en) * | 1971-02-05 | 1974-09-04 | Triplex Safety Glass Co | Metal oxide films |
DE2558947A1 (en) * | 1975-12-29 | 1977-07-14 | Max Planck Gesellschaft | MULTILAYER METAL ELECTRODES |
JPS54155009A (en) * | 1978-05-26 | 1979-12-06 | Matsushita Electric Ind Co Ltd | Wireless transmission/reception stereo system |
US4406252A (en) * | 1980-12-29 | 1983-09-27 | Rockwell International Corporation | Inductive heating arrangement for evaporating thin film alloy onto a substrate |
DE3206421A1 (en) * | 1982-02-23 | 1983-09-01 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING LAYERS FROM HIGH-MELTING METALS OR METAL COMPOUNDS THROUGH VAPOR PHASE DEPOSITION |
US4491509A (en) * | 1984-03-09 | 1985-01-01 | At&T Technologies, Inc. | Methods of and apparatus for sputtering material onto a substrate |
US5437778A (en) * | 1990-07-10 | 1995-08-01 | Telic Technologies Corporation | Slotted cylindrical hollow cathode/magnetron sputtering device |
US5073245A (en) * | 1990-07-10 | 1991-12-17 | Hedgcoth Virgle L | Slotted cylindrical hollow cathode/magnetron sputtering device |
US5567261A (en) * | 1992-08-06 | 1996-10-22 | Leonhard Kurz Gmbh & Co. | Method and apparatus for decorating articles having a conical peripheral surface portion |
US5391281A (en) * | 1993-04-09 | 1995-02-21 | Materials Research Corp. | Plasma shaping plug for control of sputter etching |
US6264812B1 (en) | 1995-11-15 | 2001-07-24 | Applied Materials, Inc. | Method and apparatus for generating a plasma |
US6368469B1 (en) * | 1996-05-09 | 2002-04-09 | Applied Materials, Inc. | Coils for generating a plasma and for sputtering |
KR100489918B1 (en) * | 1996-05-09 | 2005-08-04 | 어플라이드 머티어리얼스, 인코포레이티드 | Coils for generating a plasma and for sputtering |
US6254737B1 (en) | 1996-10-08 | 2001-07-03 | Applied Materials, Inc. | Active shield for generating a plasma for sputtering |
US6190513B1 (en) | 1997-05-14 | 2001-02-20 | Applied Materials, Inc. | Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition |
US6217715B1 (en) * | 1997-02-06 | 2001-04-17 | Applied Materials, Inc. | Coating of vacuum chambers to reduce pump down time and base pressure |
US6103070A (en) * | 1997-05-14 | 2000-08-15 | Applied Materials, Inc. | Powered shield source for high density plasma |
US6077402A (en) * | 1997-05-16 | 2000-06-20 | Applied Materials, Inc. | Central coil design for ionized metal plasma deposition |
US6565717B1 (en) | 1997-09-15 | 2003-05-20 | Applied Materials, Inc. | Apparatus for sputtering ionized material in a medium to high density plasma |
US6168690B1 (en) * | 1997-09-29 | 2001-01-02 | Lam Research Corporation | Methods and apparatus for physical vapor deposition |
US6146508A (en) * | 1998-04-22 | 2000-11-14 | Applied Materials, Inc. | Sputtering method and apparatus with small diameter RF coil |
US6132566A (en) * | 1998-07-30 | 2000-10-17 | Applied Materials, Inc. | Apparatus and method for sputtering ionized material in a plasma |
DE19923018C2 (en) * | 1999-05-19 | 2001-09-27 | Univ Dresden Tech | Device for processing band-shaped workpieces using resonant high-frequency plasmas |
JP4677123B2 (en) * | 2001-05-31 | 2011-04-27 | 株式会社アルバック | Apparatus and method for forming dense hard thin film using high-density helicon plasma |
US8158016B2 (en) * | 2004-02-04 | 2012-04-17 | Veeco Instruments, Inc. | Methods of operating an electromagnet of an ion source |
US7557362B2 (en) * | 2004-02-04 | 2009-07-07 | Veeco Instruments Inc. | Ion sources and methods for generating an ion beam with a controllable ion current density distribution |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3250694A (en) * | 1962-10-17 | 1966-05-10 | Ibm | Apparatus for coating articles by cathode sputtering |
US3291715A (en) * | 1963-08-19 | 1966-12-13 | Litton Systems Inc | Apparatus for cathode sputtering including a plasmaconfining chamber |
NL130959C (en) * | 1965-12-17 | |||
US3451917A (en) * | 1966-01-10 | 1969-06-24 | Bendix Corp | Radio frequency sputtering apparatus |
US3501393A (en) * | 1967-05-05 | 1970-03-17 | Litton Systems Inc | Apparatus for sputtering wherein the plasma is confined by the target structure |
-
1968
- 1968-07-26 DE DE19681765850 patent/DE1765850A1/en active Pending
- 1968-10-11 US US766682A patent/US3619402A/en not_active Expired - Lifetime
- 1968-11-05 LU LU57245D patent/LU57245A1/xx unknown
- 1968-11-06 SE SE15034/68A patent/SE347296B/xx unknown
- 1968-11-08 ES ES360009A patent/ES360009A1/en not_active Expired
- 1968-11-08 DK DK545068AA patent/DK131005B/en unknown
- 1968-11-08 NO NO4448/68A patent/NO120815B/no unknown
- 1968-11-08 AT AT1089868A patent/AT279994B/en not_active IP Right Cessation
- 1968-11-11 JP JP43081956A patent/JPS4929818B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
NO120815B (en) | 1970-12-07 |
AT279994B (en) | 1970-03-25 |
US3619402A (en) | 1971-11-09 |
SE347296B (en) | 1972-07-31 |
LU57245A1 (en) | 1969-02-11 |
DE1765850A1 (en) | 1971-10-28 |
JPS4929818B1 (en) | 1974-08-07 |
DK131005C (en) | 1975-11-10 |
DK131005B (en) | 1975-05-12 |
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