Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Lavis SA
Original Assignee
Lavis SA
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Filing date
Publication date
Application filed by Lavis SAfiledCriticalLavis SA
Priority to ES0321577ApriorityCriticalpatent/ES321577A1/en
Publication of ES321577A1publicationCriticalpatent/ES321577A1/en
Improvements in the manufacture of printed circuits, characterized by comprising the constitution of an insulating support firmly attached by molding to one of the faces of the printed circuit, having a thickness equivalent to the necessary separation of the terminals of the electronic components with respect to the circuit, to avoid heating them in the weld and also having the same number of holes and in the same arrangement as the printed circuit itself as well as expansions perpendicular to the circuit itself, for the support of elements in vertical arrangement, the height of which is equivalent to these, to the length of said vertical components. (Machine-translation by Google Translate, not legally binding)
ES0321577A1965-12-301965-12-30Improvements in the manufacture of printed circuits. (Machine-translation by Google Translate, not legally binding)
ExpiredES321577A1
(en)
Method for manufacturing conductive cross-connections through an insulating workpiece in connection with the manufacture of printed circuits on the surfaces of the workpiece.