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Individual
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Individual
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Application filed by IndividualfiledCriticalIndividual
Priority to ES0031035UpriorityCriticalpatent/ES31035Y/en
Publication of ES31035UpublicationCriticalpatent/ES31035U/en
Application grantedgrantedCritical
Publication of ES31035YpublicationCriticalpatent/ES31035Y/en
Connections Effected By Soldering, Adhesion, Or Permanent Deformation
(AREA)
Abstract
A multi-core soldering wire, characterized in that its tin-lead alloy casing occludes a minimum of three different parallel and slightly separated channels, filled with resins, which can be of the same or different. chemical composition. (Machine-translation by Google Translate, not legally binding)