ES2940194R1 - Montaje de tarjeta de circuito - Google Patents

Montaje de tarjeta de circuito

Info

Publication number
ES2940194R1
ES2940194R1 ES202230875A ES202230875A ES2940194R1 ES 2940194 R1 ES2940194 R1 ES 2940194R1 ES 202230875 A ES202230875 A ES 202230875A ES 202230875 A ES202230875 A ES 202230875A ES 2940194 R1 ES2940194 R1 ES 2940194R1
Authority
ES
Spain
Prior art keywords
circuit board
board assembly
assembly
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
ES202230875A
Other languages
English (en)
Other versions
ES2940194A2 (es
Inventor
Joo-Han Kim
Brian Hoden
Lucius Akalanne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ametek Inc
Original Assignee
Ametek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ametek Inc filed Critical Ametek Inc
Publication of ES2940194A2 publication Critical patent/ES2940194A2/es
Publication of ES2940194R1 publication Critical patent/ES2940194R1/es
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
    • H05K5/0211—Thermal buffers, e.g. latent heat absorbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/1418—Card guides, e.g. grooves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00—Cosmonautic vehicles
    • B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/52—Protection, safety or emergency devices; Survival aids
    • B64G1/58—Thermal protection, e.g. heat shields
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B15/00—Self-propelled projectiles or missiles, e.g. rockets; Guided missiles
    • F42B15/34—Protection against overheating or radiation, e.g. heat shields; Additional cooling arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Credit Cards Or The Like (AREA)
  • Paper (AREA)
ES202230875A 2021-11-02 2022-10-11 Montaje de tarjeta de circuito Pending ES2940194R1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US202163274557P 2021-11-02 2021-11-02

Publications (2)

Publication Number Publication Date
ES2940194A2 ES2940194A2 (es) 2023-05-04
ES2940194R1 true ES2940194R1 (es) 2023-05-08

Family

ID=83902119

Family Applications (1)

Application Number Title Priority Date Filing Date
ES202230875A Pending ES2940194R1 (es) 2021-11-02 2022-10-11 Montaje de tarjeta de circuito

Country Status (7)

Country Link
US (1) US20230134978A1 (es)
AU (1) AU2022218491A1 (es)
CA (1) CA3170441A1 (es)
DE (1) DE102022128694A1 (es)
ES (1) ES2940194R1 (es)
FR (1) FR3128848A1 (es)
GB (1) GB2614364A (es)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210082A1 (en) * 2006-03-09 2007-09-13 English Gerald R EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US20180068926A1 (en) * 2015-03-27 2018-03-08 Intel Corporation Energy storage material for thermal management and associated techniques and configurations
US20210055770A1 (en) * 2019-08-22 2021-02-25 Abaco Systems, Inc. Electronics chassis with oscillating heat pipe (ohp)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069975B1 (en) * 1999-09-16 2006-07-04 Raytheon Company Method and apparatus for cooling with a phase change material and heat pipes
US7646606B2 (en) * 2008-05-13 2010-01-12 Honeywell International Inc. IGBT packaging and cooling using PCM and liquid
US8937384B2 (en) * 2012-04-25 2015-01-20 Qualcomm Incorporated Thermal management of integrated circuits using phase change material and heat spreaders
US10485138B2 (en) * 2014-11-12 2019-11-19 Ge Aviation Systems Llc Heat sink assemblies for transient cooling
US9913411B2 (en) * 2016-04-27 2018-03-06 General Electric Company Thermal capacitance system
US9918407B2 (en) * 2016-08-02 2018-03-13 Qualcomm Incorporated Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device
US20200100388A1 (en) * 2018-09-25 2020-03-26 Ge Aviation Systems Llc Cold plate for power module
CN112351650A (zh) * 2020-10-30 2021-02-09 西南电子技术研究所（中国电子科技集团公司第十研究所） 弹载瞬态热控电子模块复合相变冷板的设计方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210082A1 (en) * 2006-03-09 2007-09-13 English Gerald R EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US20180068926A1 (en) * 2015-03-27 2018-03-08 Intel Corporation Energy storage material for thermal management and associated techniques and configurations
US20210055770A1 (en) * 2019-08-22 2021-02-25 Abaco Systems, Inc. Electronics chassis with oscillating heat pipe (ohp)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
TAN F L ET AL. Thermal Management of Mobile Phone using Phase Change Material. Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th, 20071210 IEEE, Piscataway, NJ, USA. Anonymous, 10/12/2007, Páginas 836 - 842 [en línea][recuperado el 17/04/2023]. ISBN 978-1-4244-1324-9 ; ISBN 1-4244-1324-9, Introduction: Pág. 1, Col. 2 *

Also Published As

Publication number Publication date
AU2022218491A1 (en) 2023-05-18
US20230134978A1 (en) 2023-05-04
GB2614364A (en) 2023-07-05
GB202212225D0 (en) 2022-10-05
ES2940194A2 (es) 2023-05-04
FR3128848A1 (fr) 2023-05-05
DE102022128694A1 (de) 2023-05-04
CA3170441A1 (en) 2023-05-02

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