ES236494A1 - Procedure for obtaining printed circuits (Machine-translation by Google Translate, not legally binding) - Google Patents

Procedure for obtaining printed circuits (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES236494A1
ES236494A1 ES0236494A ES236494A ES236494A1 ES 236494 A1 ES236494 A1 ES 236494A1 ES 0236494 A ES0236494 A ES 0236494A ES 236494 A ES236494 A ES 236494A ES 236494 A1 ES236494 A1 ES 236494A1
Authority
ES
Spain
Prior art keywords
translation
machine
legally binding
google translate
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0236494A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOUNG LAWRENCE JHON
Original Assignee
YOUNG LAWRENCE JHON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOUNG LAWRENCE JHON filed Critical YOUNG LAWRENCE JHON
Priority to ES0236494A priority Critical patent/ES236494A1/en
Publication of ES236494A1 publication Critical patent/ES236494A1/en
Expired legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Process for obtaining printed circuits, characterized in that it comprises applying to the surface of a base of electrically insulating material, an adhesive layer corresponding at least to the shape of the desired circuit; applying to the surface of the base, or at least to the part thereof covered with adhesive, a layer of finally divided metal; applying pressure corresponding to the shape of the circuit, in order to consolidate the metal and make it compact with the adhesive and the base; removing the unconsolidated metal, and then heating to stabilize the adhesive. (Machine-translation by Google Translate, not legally binding)
ES0236494A 1957-07-10 1957-07-10 Procedure for obtaining printed circuits (Machine-translation by Google Translate, not legally binding) Expired ES236494A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES0236494A ES236494A1 (en) 1957-07-10 1957-07-10 Procedure for obtaining printed circuits (Machine-translation by Google Translate, not legally binding)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES0236494A ES236494A1 (en) 1957-07-10 1957-07-10 Procedure for obtaining printed circuits (Machine-translation by Google Translate, not legally binding)

Publications (1)

Publication Number Publication Date
ES236494A1 true ES236494A1 (en) 1958-01-16

Family

ID=34444616

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0236494A Expired ES236494A1 (en) 1957-07-10 1957-07-10 Procedure for obtaining printed circuits (Machine-translation by Google Translate, not legally binding)

Country Status (1)

Country Link
ES (1) ES236494A1 (en)

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