ES2184580A1 - Procedure for structural verification of analogue integrated circuits based on the internal and concurrent observation of temperature - Google Patents

Procedure for structural verification of analogue integrated circuits based on the internal and concurrent observation of temperature

Info

Publication number
ES2184580A1
ES2184580A1 ES200002735A ES200002735A ES2184580A1 ES 2184580 A1 ES2184580 A1 ES 2184580A1 ES 200002735 A ES200002735 A ES 200002735A ES 200002735 A ES200002735 A ES 200002735A ES 2184580 A1 ES2184580 A1 ES 2184580A1
Authority
ES
Spain
Prior art keywords
temperature
procedure
integrated circuits
internal
circuits based
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200002735A
Other languages
Spanish (es)
Other versions
ES2184580B2 (en
Inventor
Sanahujes Josep Altet
Cervera Xavier Aragones
Jimenez Jose Luis Gonzalez
Pena Diego Mateo
Echeto Francesc De B Moll
Sola Jose Antonio Rubio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitat Politecnica de Catalunya UPC
Original Assignee
Universitat Politecnica de Catalunya UPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitat Politecnica de Catalunya UPC filed Critical Universitat Politecnica de Catalunya UPC
Priority to ES200002735A priority Critical patent/ES2184580B2/en
Publication of ES2184580A1 publication Critical patent/ES2184580A1/en
Application granted granted Critical
Publication of ES2184580B2 publication Critical patent/ES2184580B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

Procedure for structural verification of analogue integrated circuits based on the internal and concurrent observation of temperature. Procedure for detecting structural anomalies in analogue integrated circuits (2) consistent in the dynamic measurement (in time) of the temperature at various points (3, 4) of the surface of the semiconductor glass (1), carried out using temperature sensor circuits (5) integrated into the glass itself (1) of the circuit (2) being verified. The information from these sensors (6) is used to discriminate the defective circuits and its possible diagnosis and/or correction.
ES200002735A 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION. Expired - Fee Related ES2184580B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES200002735A ES2184580B2 (en) 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200002735A ES2184580B2 (en) 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Publications (2)

Publication Number Publication Date
ES2184580A1 true ES2184580A1 (en) 2003-04-01
ES2184580B2 ES2184580B2 (en) 2004-03-16

Family

ID=8495641

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200002735A Expired - Fee Related ES2184580B2 (en) 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Country Status (1)

Country Link
ES (1) ES2184580B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012200384A1 (en) 2011-12-29 2013-07-04 Continental Automotive Gmbh On a carrier arranged circuit arrangement with temperature monitoring and method for detecting an overtemperature

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436494A (en) * 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
US5994752A (en) * 1995-09-18 1999-11-30 Siemens Aktiengesellschaft Field-effect-controllable semiconductor component with a plurality of temperature sensors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436494A (en) * 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
US5994752A (en) * 1995-09-18 1999-11-30 Siemens Aktiengesellschaft Field-effect-controllable semiconductor component with a plurality of temperature sensors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012200384A1 (en) 2011-12-29 2013-07-04 Continental Automotive Gmbh On a carrier arranged circuit arrangement with temperature monitoring and method for detecting an overtemperature
DE102012200384B4 (en) 2011-12-29 2018-03-15 Continental Automotive Gmbh On a carrier arranged circuit arrangement with temperature monitoring and method for detecting an overtemperature

Also Published As

Publication number Publication date
ES2184580B2 (en) 2004-03-16

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