ES2167174B1 - COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H". - Google Patents

COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Info

Publication number
ES2167174B1
ES2167174B1 ES9902233A ES9902233A ES2167174B1 ES 2167174 B1 ES2167174 B1 ES 2167174B1 ES 9902233 A ES9902233 A ES 9902233A ES 9902233 A ES9902233 A ES 9902233A ES 2167174 B1 ES2167174 B1 ES 2167174B1
Authority
ES
Spain
Prior art keywords
epoxy resin
composition
thermal class
class epoxy
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES9902233A
Other languages
Spanish (es)
Other versions
ES2167174A1 (en
Inventor
La Fuente Garcia Ana Maria De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to ES9902233A priority Critical patent/ES2167174B1/en
Publication of ES2167174A1 publication Critical patent/ES2167174A1/en
Application granted granted Critical
Publication of ES2167174B1 publication Critical patent/ES2167174B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

Composición de una resina epoxi de clase térmica "H" que comprende utilizar: resina epoxi 55,5% en peso. Endurecedor 44,4% en peso. Catalizador 0,1% en peso.Composition of a thermal class "H" epoxy resin which comprises using: 55.5% by weight epoxy resin. Hardener 44.4% by weight. Catalyst 0.1% by weight.

ES9902233A 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H". Expired - Fee Related ES2167174B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES9902233A ES2167174B1 (en) 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES9902233A ES2167174B1 (en) 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Publications (2)

Publication Number Publication Date
ES2167174A1 ES2167174A1 (en) 2002-05-01
ES2167174B1 true ES2167174B1 (en) 2003-10-16

Family

ID=8310211

Family Applications (1)

Application Number Title Priority Date Filing Date
ES9902233A Expired - Fee Related ES2167174B1 (en) 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Country Status (1)

Country Link
ES (1) ES2167174B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113791A (en) * 1977-03-03 1978-09-12 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators
US4224541A (en) * 1978-05-26 1980-09-23 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member
CA1269792A (en) * 1984-05-29 1990-05-29 Russell M. Luck Highly reactive concentrated irradiated catalytic complexes as low temperature curing agents for organic resins
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils

Also Published As

Publication number Publication date
ES2167174A1 (en) 2002-05-01

Similar Documents

Publication Publication Date Title
CY1106076T1 (en) BENZENE GLYCOPYRANOSYLOXYBENZYL DERIVATIVES AND MEDICINAL COMPOSITIONS CONTAINING THE SAME
DE69903256D1 (en) CURABLE EPOXY RESIN COMPOSITIONS
BR0010215A (en) Indoline derivatives as progesterone antagonists
ES2172864T3 (en) 2-FUNGICIDE METOXIBENZOPHENONES.
BR0113930A (en) Heterocyclic Chemokine Receptor-Binding Compounds
BR0014189A (en) Substituted acid derivatives useful as antidiabetic and antiobesity agents and method
BR9806852A (en) Vitronectin receptor antagonists
BR9807973A (en) Light-curing composition, and, process for light-curing
ES2135218T3 (en) EPOXIDIC ADHESIVES WITH DITIO-OXAMIDES ADHESION PROMOTERS.
ATE438638T1 (en) SULFONIUM SALTS AS PHOTOINITIATORS FOR RADIATION CURING SYSTEMS
HN2002000300A (en) NEW DERIVATIVES OF PIPERAZINA
AR029942A1 (en) COMPOUNDS DERIVED FROM 1,3-DIHIDRO-2H-INDOL-2-ONA, ITS USE, PROCEDURE FOR PREPARATION AND PHARMACEUTICAL COMPOSITIONS THAT INCLUDE THEM, MEDICINES CONSTITUTED BY SUCH COMPOUNDS AND INTERMEDIATE COMPOUNDS
DK1385518T3 (en) Benzimidazolone compounds
AR011040A1 (en) THERMOPLASTIC MOLDING COMPOSITIONS AND A PROCEDURE FOR THEIR OBTAINING
ATE288900T1 (en) SUBSTITUTED BENZOYLCYCLOHEXANDIONE
DE60028600D1 (en) UV-CURABLE COMPOSITIONS
BR0212353A (en) Compound, pharmaceutical composition, and use of a compound
HN2001000235A (en) DERIVATIVES BRIDGES OF PIPERAZINA
ATE89274T1 (en) IMIDAZOLINE COMPOUNDS.
ES2159271B1 (en) METHOD FOR THE PREPARATION OF 5-CIANO-1- (4-FLUOROPHENIL) -1,3-DIHYDROISOBENZOFURANS
BR9903263A (en) Resins and composites containing these
DE60232289D1 (en) Photopolymerizable compounds
MX195932B (en) Powder coating compositions, including extended isocyanurates as curing agents
HN1998000045A (en) PHARMACEUTICAL COMPOSITIONS
TR200202195T2 (en) Step-alkylation of 5-substituted 1- (4-fluorophenyl) -1,3- dihydroisobenzofuran

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 2167174B1

Country of ref document: ES

FD2A Announcement of lapse in spain

Effective date: 20180807