ES2156664B1 - THERMOFUSIBLE COMPOUNDS BASED ON POLYPIRROL, PROCEDURE FOR PREPARATION AND USE AS ADHESIVE. - Google Patents
THERMOFUSIBLE COMPOUNDS BASED ON POLYPIRROL, PROCEDURE FOR PREPARATION AND USE AS ADHESIVE.Info
- Publication number
- ES2156664B1 ES2156664B1 ES9800626A ES9800626A ES2156664B1 ES 2156664 B1 ES2156664 B1 ES 2156664B1 ES 9800626 A ES9800626 A ES 9800626A ES 9800626 A ES9800626 A ES 9800626A ES 2156664 B1 ES2156664 B1 ES 2156664B1
- Authority
- ES
- Spain
- Prior art keywords
- weight
- adhesives
- adhesive
- procedure
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Compuestos termofusibles a base de polipirrol, procedimiento para su preparación y su utilización como adhesivo, constituidos por mezclas de polipirrol conductor, en una proporción comprendida entre el 0,1% y el 90% en peso y copolímero de etileno y acetato de vinilo (EVA) en una proporción, en peso, comprendida entre el 99,9% y el 10%. Estas composiciones tienen propiedades mecánicas y de adhesión comparables a las de los termofusibles convencionales presentando, además, un buen nivel de conductividad eléctrica, por lo que son indicadas para fabricar adhesivos conductores termofusibles para aplicaciones de blindaje a interferencias electromagnéticas. Los nuevos adhesivos son útiles para aplicaciones electrónicas y de telecomunicaciones donde el peso sea una limitación, tales como juntas sellantes conductoras para aparatos de telefonía móvil, ordenadores portátiles y buscapersonas; así como para apantallar elementos o partes que irradien o reciban energía electromagnética en exceso respectoa valores permitidos. De aplicación en adhesivos.Thermofusible compounds based on polypyrrole, a procedure for their preparation and use as an adhesive, consisting of mixtures of conductive polypyrrole, in a proportion between 0.1% and 90% by weight and copolymer of ethylene and vinyl acetate (EVA) ) in a proportion, by weight, between 99.9% and 10%. These compositions have mechanical and adhesion properties comparable to those of conventional hot melts, also presenting a good level of electrical conductivity, and are therefore suitable for manufacturing hot melt conductive adhesives for shielding applications to electromagnetic interference. The new adhesives are useful for electronic and telecommunications applications where the weight is a limitation, such as conductive sealant joints for mobile telephony devices, laptops and pagers; as well as to shield elements or parts that radiate or receive electromagnetic energy in excess of permitted values. Application in adhesives.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9800626A ES2156664B1 (en) | 1998-03-24 | 1998-03-24 | THERMOFUSIBLE COMPOUNDS BASED ON POLYPIRROL, PROCEDURE FOR PREPARATION AND USE AS ADHESIVE. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9800626A ES2156664B1 (en) | 1998-03-24 | 1998-03-24 | THERMOFUSIBLE COMPOUNDS BASED ON POLYPIRROL, PROCEDURE FOR PREPARATION AND USE AS ADHESIVE. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2156664A1 ES2156664A1 (en) | 2001-07-01 |
ES2156664B1 true ES2156664B1 (en) | 2001-12-01 |
Family
ID=8303214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES9800626A Expired - Fee Related ES2156664B1 (en) | 1998-03-24 | 1998-03-24 | THERMOFUSIBLE COMPOUNDS BASED ON POLYPIRROL, PROCEDURE FOR PREPARATION AND USE AS ADHESIVE. |
Country Status (1)
Country | Link |
---|---|
ES (1) | ES2156664B1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3506659A1 (en) * | 1985-02-26 | 1986-08-28 | Basf Ag, 6700 Ludwigshafen | COMPOSITE ELECTRODE |
ATE155153T1 (en) * | 1990-01-24 | 1997-07-15 | Dsm Nv | METHOD FOR PRODUCING INTRINSICALLY CONDUCTIVE MOLDED BODY. |
JPH04149267A (en) * | 1990-10-12 | 1992-05-22 | Bridgestone Corp | Production of electroconductive polymer composite material |
US5532025A (en) * | 1993-07-23 | 1996-07-02 | Kinlen; Patrick J. | Corrosion inhibiting compositions |
US5645764A (en) * | 1995-01-19 | 1997-07-08 | International Business Machines Corporation | Electrically conductive pressure sensitive adhesives |
-
1998
- 1998-03-24 ES ES9800626A patent/ES2156664B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ES2156664A1 (en) | 2001-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EC2A | Search report published |
Date of ref document: 20010701 Kind code of ref document: A1 Effective date: 20010701 |
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FD1A | Patent lapsed |
Effective date: 20050326 |