ES2137850B1 - ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS. - Google Patents

ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS.

Info

Publication number
ES2137850B1
ES2137850B1 ES9701295A ES9701295A ES2137850B1 ES 2137850 B1 ES2137850 B1 ES 2137850B1 ES 9701295 A ES9701295 A ES 9701295A ES 9701295 A ES9701295 A ES 9701295A ES 2137850 B1 ES2137850 B1 ES 2137850B1
Authority
ES
Spain
Prior art keywords
chip
microsensors
silicone
humid environments
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES9701295A
Other languages
Spanish (es)
Other versions
ES2137850A1 (en
Inventor
Heiko Elmar Krassow
Segura Francesca Campabadal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Priority to ES9701295A priority Critical patent/ES2137850B1/en
Publication of ES2137850A1 publication Critical patent/ES2137850A1/en
Application granted granted Critical
Publication of ES2137850B1 publication Critical patent/ES2137850B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Abstract

Técnica de encapsulación para microsensores de presión entre ambientes húmedos. La técnica consiste en insertar todo el chip en una silicona. De este modo se evita cualquier unión rígida entre el elemento sensor y la cápsula rígida exterior, con lo que el chip está mecánicamente desacoplado dando lugar a estados de bajo esfuerzo mecánico. La inmersión del chip completo en la silicona proporciona además la encapsulación hermética en el material protector e inerte que aísla los conductores eléctricos, los circuitos, microsoldaduras e hilos de conexión. La utilización de una resina de silicona fotocurable en combinación con procesos fotolitográficos para proteger la parte superior de la superficie del sensor permite además una protección parcial y controlada. Esto hace que el proceso sea especialmente adecuado para la encapsulación de microsensores de silicio ya que permite dejar al descubierto las áreas activas o, sensibles de la parte superior del chip, evitando así cualquier influencia delmaterial de recubrimiento sobre la membrana sensible.Encapsulation technique for pressure microsensors between humid environments. The technique consists of inserting the entire chip in a silicone. In this way any rigid connection between the sensor element and the rigid outer capsule is avoided, whereby the chip is mechanically decoupled giving rise to states of low mechanical stress. The immersion of the complete chip in the silicone also provides hermetic encapsulation in the protective and inert material that isolates the electrical conductors, circuits, micro-solders and connection wires. The use of a photocurable silicone resin in combination with photolithographic processes to protect the upper part of the sensor surface also allows partial and controlled protection. This makes the process especially suitable for encapsulating silicon microsensors as it allows the active or sensitive areas of the upper part of the chip to be exposed, thus avoiding any influence of the coating material on the sensitive membrane.

ES9701295A 1997-06-13 1997-06-13 ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS. Expired - Fee Related ES2137850B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES9701295A ES2137850B1 (en) 1997-06-13 1997-06-13 ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES9701295A ES2137850B1 (en) 1997-06-13 1997-06-13 ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS.

Publications (2)

Publication Number Publication Date
ES2137850A1 ES2137850A1 (en) 1999-12-16
ES2137850B1 true ES2137850B1 (en) 2000-08-16

Family

ID=8299679

Family Applications (1)

Application Number Title Priority Date Filing Date
ES9701295A Expired - Fee Related ES2137850B1 (en) 1997-06-13 1997-06-13 ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS.

Country Status (1)

Country Link
ES (1) ES2137850B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2903624B1 (en) * 2006-07-17 2008-11-28 Oberthur Card Syst Sa METHOD OF MANUFACTURING BY MOLDING A PORTABLE ELECTRONIC ENTITY, AND ENTITY THUS OBTAINED

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823605A (en) * 1987-03-18 1989-04-25 Siemens Aktiengesellschaft Semiconductor pressure sensor with casing and method for its manufacture
US4888226A (en) * 1988-08-08 1989-12-19 American Telephone And Telegraph Company Silicone gel electronic device encapsulant
JPH04258176A (en) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp Semiconductor pressure sensor
DE19524001A1 (en) * 1995-06-30 1997-03-06 Siemens Ag Process for packaging a pressure-sensitive electronic circuit with a protective casing sealing on all sides

Also Published As

Publication number Publication date
ES2137850A1 (en) 1999-12-16

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