ES2067030T3 - PROCEDURE FOR THE PREPARATION OF POLOXAZOLIDINES FINISHED IN EPOXY AND OF ELECTRICAL STRATIFICATES BASED ON THEM. - Google Patents
PROCEDURE FOR THE PREPARATION OF POLOXAZOLIDINES FINISHED IN EPOXY AND OF ELECTRICAL STRATIFICATES BASED ON THEM.Info
- Publication number
- ES2067030T3 ES2067030T3 ES90909068T ES90909068T ES2067030T3 ES 2067030 T3 ES2067030 T3 ES 2067030T3 ES 90909068 T ES90909068 T ES 90909068T ES 90909068 T ES90909068 T ES 90909068T ES 2067030 T3 ES2067030 T3 ES 2067030T3
- Authority
- ES
- Spain
- Prior art keywords
- preparation
- epoxy
- electrical
- stratificates
- poloxazolidines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/09—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
- C08G18/092—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Abstract
Epoxy-terminated polyoxazolidone having from about 5 to about 30 weight percent of the isocyanate content are described. These polyoxazolidone are prepared by a process in which various process parameters are controlled in a targeted manner to give a product having from about 50 to about 100 percent of isocyanate groups converted to oxazolidone rings and from about 0 to about 50 percent of the isocyanate groups converted to isocyanurate rings. These epoxy terminated polyoxazolidones exhibit high glass transition temperatures and high resistance to chemicals when cured. They are useful for the preparation of electrical laminates, particularly laminates used in the preparation of electrical circuit boards.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB898912952A GB8912952D0 (en) | 1989-06-06 | 1989-06-06 | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
SG9590553 | 1995-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2067030T3 true ES2067030T3 (en) | 1995-03-16 |
Family
ID=26295443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES90909068T Expired - Lifetime ES2067030T3 (en) | 1989-06-06 | 1990-05-25 | PROCEDURE FOR THE PREPARATION OF POLOXAZOLIDINES FINISHED IN EPOXY AND OF ELECTRICAL STRATIFICATES BASED ON THEM. |
Country Status (14)
Country | Link |
---|---|
US (1) | US5112932A (en) |
EP (1) | EP0478606B1 (en) |
JP (1) | JP2859956B2 (en) |
KR (1) | KR0160755B1 (en) |
AT (1) | ATE115596T1 (en) |
AU (1) | AU628596B2 (en) |
BR (1) | BR9007428A (en) |
CA (1) | CA2018265A1 (en) |
DE (1) | DE69015188T2 (en) |
DK (1) | DK0478606T3 (en) |
ES (1) | ES2067030T3 (en) |
GB (1) | GB8912952D0 (en) |
NZ (1) | NZ233933A (en) |
WO (1) | WO1990015089A1 (en) |
Families Citing this family (120)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3322909B2 (en) * | 1991-08-15 | 2002-09-09 | 旭化成エポキシ株式会社 | Epoxy resin composition |
DE4223622A1 (en) * | 1992-07-17 | 1994-01-20 | Siemens Ag | Prepolymer epoxy resin mixture containing oxazolidinone structures |
DE4223630A1 (en) * | 1992-07-17 | 1994-01-20 | Siemens Ag | Prepolymer epoxy resin mixture containing oxazolidinone structures |
DE4223632A1 (en) * | 1992-07-17 | 1994-01-20 | Siemens Ag | Process for producing a flame-retardant epoxy molding compound |
US5290903A (en) * | 1992-11-09 | 1994-03-01 | Norton Company | Composite abrasive wheels |
US5314983A (en) * | 1992-11-09 | 1994-05-24 | Enichem S.P.A. | Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides |
CA2115533C (en) * | 1994-02-11 | 2002-06-18 | Hiroshi Uchida | Urethane modified epoxy resin compositions |
US5545697A (en) * | 1994-02-14 | 1996-08-13 | Ciba-Geigy Corporation | Urethane modified epoxy resin compositions |
US5480958A (en) * | 1994-09-21 | 1996-01-02 | Air Products And Chemicals, Inc. | Polyepoxide resins incorporating epoxy terminated urethanes as tougheners |
EP0828774B1 (en) * | 1995-05-24 | 1999-08-11 | Siemens Aktiengesellschaft | Epoxy resin moulding materials fire-proofed without halogens |
US5686541A (en) * | 1995-11-14 | 1997-11-11 | National Science Council | Modification of epoxy resins with urethane prepolymer for electronic encapsulation |
GB2315490B (en) * | 1996-07-22 | 2001-02-07 | Dow Deutschland Inc | Improved curing catalysts for curing epoxy resins |
WO1998044017A1 (en) * | 1997-03-27 | 1998-10-08 | Mitsubishi Rayon Co., Ltd. | Epoxy resin composition for frp, prepreg, and tubular molding produced therefrom |
US6353080B1 (en) | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
GB9817799D0 (en) | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
GB9827367D0 (en) * | 1998-12-11 | 1999-02-03 | Dow Deutschland Inc | Adhesive resin composition |
WO2005118604A1 (en) | 2004-05-28 | 2005-12-15 | Dow Global Technologies Inc. | Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
KR100866653B1 (en) * | 2004-06-29 | 2008-11-04 | 아사히 가세이 케미칼즈 가부시키가이샤 | Flame-retardant epoxy resin composition |
CN101151294B (en) * | 2005-04-07 | 2011-02-09 | 旭化成电子材料株式会社 | Epoxy resin composition |
EP1818044A1 (en) | 2005-11-25 | 2007-08-15 | DSMIP Assets B.V. | Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups |
EP1966268A1 (en) * | 2005-12-22 | 2008-09-10 | Dow Gloval Technologies Inc. | A curable epoxy resin composition and laminates made therefrom |
CN103059267A (en) * | 2007-05-09 | 2013-04-24 | 陶氏环球技术公司 | Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof |
JP2010527403A (en) * | 2007-05-16 | 2010-08-12 | ダウ グローバル テクノロジーズ インコーポレイティド | Flame retardant composition |
BRPI0811680A2 (en) | 2007-06-20 | 2015-02-10 | Dow Global Technologies Inc | "STRUCTURAL STICKER OF A COMPONENT AND METHOD" |
US8404310B2 (en) * | 2007-08-02 | 2013-03-26 | Dow Global Technologies Llc | Thermoset dampener material |
CA2696785A1 (en) * | 2007-09-11 | 2009-03-19 | Dow Global Technologies Inc. | Isocyanate modified epoxy resin for fusion bonded epoxy foam applications |
CN101878239B (en) * | 2007-09-28 | 2014-06-18 | 陶氏环球技术有限责任公司 | Epoxy resin formulations |
BRPI0816499A2 (en) * | 2007-10-05 | 2019-09-24 | Dow Global Technologies Inc | powder coating epoxy resin composition and article |
KR20100084561A (en) | 2007-10-26 | 2010-07-26 | 다우 글로벌 테크놀로지스 인크. | Epoxy resin composition containing isocyanurates for use in electrical laminates |
CN101842401B (en) * | 2007-10-31 | 2015-06-24 | 陶氏环球技术公司 | Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications |
EP2217637B1 (en) * | 2007-11-29 | 2011-05-11 | Dow Global Technologies LLC | Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
EP2244871A1 (en) | 2007-11-29 | 2010-11-03 | Dow Global Technologies Inc. | Microwave heatable monovinyl aromatic polymers |
WO2009089145A1 (en) * | 2008-01-08 | 2009-07-16 | Dow Global Technologies Inc. | High tg epoxy systems for composite application |
US20110263754A1 (en) * | 2009-01-06 | 2011-10-27 | Dow Global Technologies Llc | Metallic compounds in non-brominated flame retardant epoxy resins |
CN102272190A (en) * | 2009-01-06 | 2011-12-07 | 陶氏环球技术有限责任公司 | Metal stabilizers for epoxy resins and advancement process |
EP2401339A1 (en) | 2009-02-26 | 2012-01-04 | Dow Global Technologies LLC | One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
US7947785B2 (en) * | 2009-05-21 | 2011-05-24 | New Jersey Institute Of Technology | Polyoxazolidones derived from bisanhydrohexitols |
KR100929380B1 (en) | 2009-06-18 | 2009-12-02 | 주식회사 신아티앤씨 | Manufacturing method of flame-retardant epoxy compound |
CN106832224A (en) | 2009-06-22 | 2017-06-13 | 蓝立方知识产权有限责任公司 | The hardener composition of epoxy resin |
EP2284004A1 (en) | 2009-08-13 | 2011-02-16 | Nan Ya Plastics Corp. | Electric circuit board composition and a method of preparing circuit board |
KR20120112447A (en) | 2009-11-05 | 2012-10-11 | 다우 글로벌 테크놀로지스 엘엘씨 | Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes |
CN105713179A (en) * | 2009-11-12 | 2016-06-29 | 陶氏环球技术有限责任公司 | Polyoxazolidone Resins |
WO2011087486A1 (en) | 2009-12-22 | 2011-07-21 | Dow Global Technologies Inc. | Oxazolidone ring contaning adducts |
WO2011094004A2 (en) | 2010-01-29 | 2011-08-04 | Dow Global Technologies Llc | Compositions having phosphorus-containing compounds |
CA2803289A1 (en) | 2010-06-23 | 2011-12-29 | Dow Global Technologies Llc | Powder coatings compositions |
WO2012000171A1 (en) | 2010-06-29 | 2012-01-05 | Dow Global Technologies Llc | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
KR20130108100A (en) | 2010-06-29 | 2013-10-02 | 다우 글로벌 테크놀로지스 엘엘씨 | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
JP2011063804A (en) * | 2010-10-15 | 2011-03-31 | Hitachi Chem Co Ltd | Prepreg for printed circuit board and laminated board using the same |
US20120095132A1 (en) * | 2010-10-19 | 2012-04-19 | Chung-Hao Chang | Halogen- and phosphorus-free thermosetting resin composition |
BR112013010668A2 (en) | 2010-12-26 | 2021-03-23 | Dow Global Technologies Llc | one-part structural adhesive and method of applying structural adhesive |
US9408296B2 (en) | 2010-12-28 | 2016-08-02 | Mitsui Chemicals Tohcello, Inc. | Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same |
US9309354B2 (en) | 2011-06-24 | 2016-04-12 | Dow Global Technologies Llc | Thermosetting composition and process for preparing fiber-reinforced composites |
KR101969083B1 (en) | 2011-06-30 | 2019-04-15 | 다우 글로벌 테크놀로지스 엘엘씨 | Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups |
CN103842436A (en) * | 2011-08-01 | 2014-06-04 | 陶氏环球技术有限责任公司 | An oxazolidone ring containing vinyl ester resin and products therefrom |
BR112014018126B1 (en) | 2012-03-23 | 2021-07-13 | Dow Global Technologies Llc | THERMO-CURABLE STRUCTURAL ADHESIVE AND PROCESS TO JOIN AND WELD METALLIC MEMBERS |
US9840070B2 (en) | 2012-03-23 | 2017-12-12 | Dow Global Technologies Llc | Crash-durable adhesive with enhanced stress durability |
KR20150073173A (en) * | 2012-10-17 | 2015-06-30 | 다우 글로벌 테크놀로지스 엘엘씨 | Core shell rubber modified solid epoxy resins |
EP2909250B1 (en) | 2012-10-17 | 2016-12-07 | Blue Cube IP LLC | Toughened, curable epoxy compositions for high temperature applications |
WO2014062407A2 (en) | 2012-10-19 | 2014-04-24 | Dow Global Technologies Llc | Anhydride-cured epoxy resin systems containing divinylarene dioxides |
EP2917278A4 (en) | 2012-11-07 | 2016-06-08 | Dow Global Technologies Llc | A curable epoxy composition and a composite made therefrom |
US9688807B2 (en) | 2012-11-13 | 2017-06-27 | Dow Global Technologies Llc | Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes |
BR112015010679A2 (en) | 2012-11-13 | 2017-07-11 | Dow Global Technologies Llc | curable epoxy resin system, process for forming a fiber reinforced epoxy composite and cured fiber reinforced composite |
EP2935389B1 (en) | 2012-12-21 | 2017-11-29 | Dow Global Technologies LLC | Non-isocyanate sealant for electrical cable joining |
CN104955865B (en) | 2012-12-21 | 2017-12-19 | 陶氏环球技术有限责任公司 | Thiol-cured elastomeric epoxy |
EP2935392B1 (en) | 2012-12-21 | 2020-01-22 | Dow Global Technologies LLC | Phase-segmented non-isocyanate elastomers |
WO2014197834A1 (en) | 2013-06-06 | 2014-12-11 | Halliburton Energy Services, Inc. | Fluid loss well treatment |
WO2015023615A1 (en) * | 2013-08-16 | 2015-02-19 | Dow Global Technologies Llc | 1k thermoset epoxy composition |
CN105518044B (en) | 2013-09-16 | 2019-05-21 | 陶氏环球技术有限责任公司 | Polyurethane elastomer for submarine pipeline insulating materials |
JP6400707B2 (en) | 2013-12-18 | 2018-10-03 | ダウ グローバル テクノロジーズ エルエルシー | Method for forming an organic polymer in the reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents |
WO2015164031A1 (en) | 2014-04-22 | 2015-10-29 | Dow Global Technologies Llc | Polyurethane-acrylate epoxy adhesive |
WO2015167881A1 (en) | 2014-05-01 | 2015-11-05 | Dow Global Technologies Llc | Prepreg manufacturing and drying process |
EP3152251B1 (en) | 2014-06-09 | 2018-05-02 | Dow Global Technologies LLC | Process for making curable, multi-layer fiber-reinforced prepreg |
WO2016014284A1 (en) | 2014-07-23 | 2016-01-28 | Dow Global Technologies Llc | Structural adhesives having improved wash-off resistance and method for dispensing same |
DE102014226838A1 (en) * | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Oxazolidinone and isocyanurate crosslinked matrix for fiber reinforced material |
DE102014226842A1 (en) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Catalyst composition for curing epoxide group-containing resins |
US20170369635A1 (en) | 2014-12-24 | 2017-12-28 | Dow Global Technologies Llc | Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system |
CN104497271A (en) * | 2014-12-24 | 2015-04-08 | 济南圣泉集团股份有限公司 | Modified epoxy resin and modified epoxy resin composition |
CN107001897A (en) | 2014-12-31 | 2017-08-01 | 陶氏环球技术有限责任公司 | Impact resistance epoxy adhesive composition with improved low-temperature impact resistance and resistance to washability |
CN107743503B (en) | 2015-06-25 | 2020-03-31 | 陶氏环球技术有限责任公司 | Novel epoxy resin system for manufacturing carbon fiber composite material |
KR102626998B1 (en) | 2015-09-10 | 2024-01-19 | 다우 글로벌 테크놀로지스 엘엘씨 | High modulus, toughened, one-component epoxy structural adhesive with high aspect ratio fillers. |
KR102625909B1 (en) | 2015-09-10 | 2024-01-18 | 다우 글로벌 테크놀로지스 엘엘씨 | One-component toughened epoxy adhesive with improved adhesion to oily surfaces and high wash-off resistance. |
CN105295041B (en) * | 2015-12-03 | 2017-07-25 | 苏州太湖电工新材料股份有限公司 | A kind of polyoxazolidone resins, its preparation method and the application in impregnating varnish |
CN106916282B (en) | 2015-12-28 | 2019-07-26 | 广东生益科技股份有限公司 | A kind of composition epoxy resin and prepreg and laminate using it |
WO2017127253A1 (en) | 2016-01-19 | 2017-07-27 | Dow Global Technologies Llc | One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same |
CN107227001B (en) * | 2016-03-25 | 2019-06-14 | 广东生益科技股份有限公司 | A kind of halogen-free thermosetting resin composite and prepreg, laminate and printed circuit board containing it |
WO2018017280A1 (en) | 2016-07-17 | 2018-01-25 | Dow Global Technologies Llc | In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin |
KR102448348B1 (en) * | 2016-08-19 | 2022-09-28 | 코베스트로 도이칠란트 아게 | Method for synthesizing polyoxazolidinone compounds |
US11390741B2 (en) | 2016-08-19 | 2022-07-19 | Dow Global Technologies Llc | Epoxy resin compositions containing an internal mold release agent |
EP3529328B1 (en) | 2016-10-24 | 2020-06-24 | Dow Global Technologies LLC | Epoxy adhesive resistant to open bead humidity exposure |
WO2018081032A1 (en) | 2016-10-25 | 2018-05-03 | Dow Global Technologies Llc | Epoxy adhesive having improved low-temperature impact resistance |
EP3532527A1 (en) | 2016-10-28 | 2019-09-04 | Dow Global Technologies, LLC | Crash durable epoxy adhesive having improved low-temperature impact resistance |
CN106519185B (en) * | 2016-11-16 | 2020-03-31 | 苏州太湖电工新材料股份有限公司 | Polyoxazolidone resin, preparation method thereof and application thereof in insulating paint |
EP3585854B1 (en) | 2017-02-26 | 2021-10-13 | Dow Global Technologies, LLC | One-component toughened epoxy adhesives containing a mixture of latent curing agents |
EP3592796B1 (en) | 2017-03-09 | 2021-04-21 | Dow Global Technologies LLC | Stable epoxy/internal mold release agent blends for the manufacture of composite articles |
EP3596182B1 (en) | 2017-03-17 | 2021-06-30 | Dow Global Technologies LLC | Epoxy-acrylic hybrid adhesive |
US10344115B2 (en) | 2017-05-25 | 2019-07-09 | International Business Machines Corporation | Amine glyoxal resins |
WO2018226288A1 (en) | 2017-06-07 | 2018-12-13 | Dow Global Technologies Llc | Molding compound having randomly oriented filaments and methods for making and using same |
CN111315839B (en) | 2017-08-15 | 2022-09-20 | Ddp特种电子材料美国公司 | Room temperature curable two-part toughened epoxy adhesive |
JP7295095B2 (en) | 2017-09-12 | 2023-06-20 | ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー | One component reinforced epoxy adhesive |
US11492525B2 (en) | 2017-09-12 | 2022-11-08 | Ddp Specialty Electronic Materials Us, Llc | Adhesive formulation |
CA3077272A1 (en) * | 2017-09-29 | 2019-04-04 | Basf Se | Thermoplastic polyoxazolidones from diisocyanates and diglycidyl ether of 2-phenyl-1,3-propanediol derivatives |
KR20240025034A (en) | 2018-01-08 | 2024-02-26 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | Epoxy resin adhesive compositions |
US11472910B2 (en) | 2018-05-18 | 2022-10-18 | Dow Global Technologies Llc | Polyisocyanate component, a polyurethane foaming system and an article made therefrom |
EP3802723B1 (en) * | 2018-05-29 | 2022-09-21 | DDP Specialty Electronic Materials US, LLC | Method for bonding using one-component epoxy adhesive mixtures |
EP3802678A1 (en) | 2018-06-05 | 2021-04-14 | Dow Global Technologies, LLC | Method for recycling epoxy-fiber composites into polyolefins |
WO2019240897A1 (en) | 2018-06-15 | 2019-12-19 | Dow Global Technologies Llc | Toughened epoxy compositions |
WO2020005393A1 (en) | 2018-06-26 | 2020-01-02 | Dow Global Technologies Llc | Fibre-reinforced composite and process of making this composite |
EP3824012B1 (en) * | 2018-07-18 | 2022-09-07 | Basf Se | Bulk polymerisation of polyoxazolidone |
CN112638973B (en) * | 2018-07-30 | 2023-03-31 | 陶氏环球技术有限责任公司 | Curable resin composition |
KR20210053311A (en) | 2018-08-31 | 2021-05-11 | 다우 글로벌 테크놀로지스 엘엘씨 | Epoxy composite formulation |
US11225542B1 (en) * | 2018-11-09 | 2022-01-18 | ASK Chemicals LLC | Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder |
US11732085B2 (en) | 2019-02-15 | 2023-08-22 | Dow Global Technologies Llc | Epoxy composition |
EP3973011A1 (en) | 2019-05-21 | 2022-03-30 | DDP Specialty Electronic Materials US, LLC | Epoxy adhesive composition and method of use |
US20220195267A1 (en) | 2019-06-18 | 2022-06-23 | Ddp Specialty Electronic Materials Us, Llc | One-component toughened epoxy adhesives with improved humidity resistance |
JPWO2021100649A1 (en) * | 2019-11-18 | 2021-05-27 | ||
US20210253772A1 (en) * | 2020-02-18 | 2021-08-19 | Covestro Llc | Polyoxazolidinone compositions |
EP4011927A1 (en) | 2020-12-10 | 2022-06-15 | Covestro Deutschland AG | Composition comprising epoxy-functional oxazolidinone |
WO2022122606A1 (en) | 2020-12-10 | 2022-06-16 | Covestro Deutschland Ag | Composition comprising epoxy-functional oxazolidinone |
WO2024076408A1 (en) | 2022-10-06 | 2024-04-11 | Ddp Specialty Electronic Materials Us, Llc | Two-component adhesive composition |
WO2024076409A1 (en) | 2022-10-06 | 2024-04-11 | Ddp Specialty Electronic Materials Us, Llc | Two-component adhesive composition |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305494A (en) * | 1963-04-12 | 1967-02-21 | Baker Chem Co J T | Oxazolidonyl sulfones and method of making same |
US3334110A (en) * | 1965-08-16 | 1967-08-01 | Baker Chem Co J T | Method for preparing epoxyoxazolidinones |
US3494888A (en) * | 1966-08-30 | 1970-02-10 | Wilbur R Mcelroy | Resin compositions from polyepoxides and isocyanate polymers |
US3471442A (en) * | 1967-02-02 | 1969-10-07 | American Cyanamid Co | Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates |
US3694406A (en) * | 1970-07-31 | 1972-09-26 | Us Air Force | Preparation of polyoxazolidones |
US3767624A (en) * | 1971-12-27 | 1973-10-23 | Dow Chemical Co | Oxazolidinone modified epoxy novolac resin |
JPS5231000B2 (en) * | 1972-11-29 | 1977-08-11 | ||
JPS5315757B2 (en) * | 1973-08-31 | 1978-05-26 | ||
JPS57131219A (en) * | 1981-02-06 | 1982-08-14 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition |
ZA839459B (en) * | 1982-12-30 | 1985-08-28 | Mobil Oil Corp | Polyoxazolidone powder coating compositions |
DE3323122A1 (en) * | 1983-06-27 | 1985-05-23 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING REACTION RESIN MOLDINGS |
FR2549277B1 (en) * | 1983-07-13 | 1985-10-25 | Alsthom Atlantique | METHOD OF INSULATION BY IMPREGNATION OF AN ELECTRICAL WINDING, AND VARNISH WITHOUT STABILIZED SOLVENT FOR USE IN THIS PROCESS |
GB8412900D0 (en) * | 1984-05-21 | 1984-06-27 | Secr Defence | Thermosetting resin compositions |
DE3720759A1 (en) * | 1987-06-24 | 1989-01-05 | Bayer Ag | EPOXY RESINS CONTAINING OXAZOLIDONE GROUPS |
-
1989
- 1989-06-06 GB GB898912952A patent/GB8912952D0/en active Pending
-
1990
- 1990-05-25 EP EP90909068A patent/EP0478606B1/en not_active Expired - Lifetime
- 1990-05-25 DK DK90909068.0T patent/DK0478606T3/en active
- 1990-05-25 BR BR909007428A patent/BR9007428A/en not_active IP Right Cessation
- 1990-05-25 ES ES90909068T patent/ES2067030T3/en not_active Expired - Lifetime
- 1990-05-25 DE DE69015188T patent/DE69015188T2/en not_active Expired - Lifetime
- 1990-05-25 JP JP2508802A patent/JP2859956B2/en not_active Expired - Lifetime
- 1990-05-25 AU AU58291/90A patent/AU628596B2/en not_active Ceased
- 1990-05-25 AT AT90909068T patent/ATE115596T1/en active
- 1990-05-25 WO PCT/US1990/002973 patent/WO1990015089A1/en active IP Right Grant
- 1990-06-01 US US07/531,963 patent/US5112932A/en not_active Expired - Lifetime
- 1990-06-05 CA CA002018265A patent/CA2018265A1/en not_active Abandoned
- 1990-06-05 NZ NZ233933A patent/NZ233933A/en unknown
-
1991
- 1991-12-06 KR KR1019910701786A patent/KR0160755B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU5829190A (en) | 1991-01-07 |
DK0478606T3 (en) | 1995-05-15 |
KR920701289A (en) | 1992-08-11 |
CA2018265A1 (en) | 1990-12-06 |
DE69015188T2 (en) | 1995-05-04 |
ATE115596T1 (en) | 1994-12-15 |
EP0478606A4 (en) | 1992-05-13 |
GB8912952D0 (en) | 1989-07-26 |
KR0160755B1 (en) | 1999-01-15 |
DE69015188D1 (en) | 1995-01-26 |
AU628596B2 (en) | 1992-09-17 |
JP2859956B2 (en) | 1999-02-24 |
BR9007428A (en) | 1992-07-21 |
WO1990015089A1 (en) | 1990-12-13 |
NZ233933A (en) | 1993-05-26 |
JPH04506678A (en) | 1992-11-19 |
EP0478606A1 (en) | 1992-04-08 |
US5112932A (en) | 1992-05-12 |
EP0478606B1 (en) | 1994-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2067030T3 (en) | PROCEDURE FOR THE PREPARATION OF POLOXAZOLIDINES FINISHED IN EPOXY AND OF ELECTRICAL STRATIFICATES BASED ON THEM. | |
FI901083A0 (en) | Epoxidhartsblandningar | |
DE69020820T2 (en) | Resin compositions comprising aromatic cyanate esters, polyepoxide compounds and thermoplastic polymers, and prepregs made therefrom. | |
DE59403338D1 (en) | Oleophobically modified microporous polymers | |
BR8800708A (en) | CURED CEMENT ARTICLE AND PROCESS TO PREPARE A HIGH-RESISTANCE CURED CEMENT ARTICLE | |
FI874046A0 (en) | FOERFARANDE FOER FRAMSTAELLNING AV EN MED LAONGA FIBRER ARMERAD POLYAMIDBASERAD KOMPOSIT. | |
DE3886174D1 (en) | 1 K RTV compositions hardening with elimination of oximes. | |
ATE142660T1 (en) | PRODUCTION OF CHAIN EXTENDED EPOXY RESINS | |
DE59008005D1 (en) | Process for the production of high molecular weight copolyarylene sulfides. | |
DK540086A (en) | IMMEDIATE POLYMERS AND METHOD OF PRODUCING THEREOF | |
ATE72450T1 (en) | PROCESS FOR THE MANUFACTURE OF PREPREGS AND THEIR USE. | |
DE3782640T2 (en) | METHOD FOR PRODUCING HEAT-CURABLE COMPOSITIONS WITH HIGH OPERATING TEMPERATURES. | |
PT83730B (en) | PROCESS FOR THE PREPARATION OF POLYMERS BEHAVIORING IMIDA GROUPS | |
MY130153A (en) | Epoxy-terminated polyoxazolidones, process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones. | |
BR8002771A (en) | PROCESS FOR THE PREPARATION OF FIBRILLES BASED ON POLYOLEFINS AND FIBRILLES BASED ON POLYOLEFINS | |
NO854180L (en) | PROCEDURE FOR THE PREPARATION OF TRIAZINE OR TRAZINE AND OKSAZOLINE-GROUPED EPOXY RESIN | |
BR9002460A (en) | UNCURED COMPOSITION, CURING COMPOSITION, CURING PRODUCT AND PROCESS TO OBTAIN AN UNCURED COMPOSITION | |
ATE128473T1 (en) | EPOXY RESIN MIXTURES. | |
ES2012452B3 (en) | MODIFIED ARTICLES OF LINKED POLYMERS. | |
DE59003063D1 (en) | Process for the production of polyimides. | |
ATE65524T1 (en) | NEW SOLUBLE AND/OR FUSABLE POLYAMIDEMIDE POLYIMIDE BLOCK COPOLYMERS. | |
DE69005566T2 (en) | PRODUCTION OF PARA-PHENYLENE DIAMINES. | |
DE3885298T2 (en) | AROMATIC DIAMINES WITH SULPHONE GROUPS, THEIR PRODUCTION AND THEIR USE AS EPOXY CURING AGENTS. | |
BR8705685A (en) | POLYMERS WITH IMIDAS GROUPS, AND PROCESSES FOR PREPARING HARDENED POLYMERS AND THERMO-HARDENING POLYMERS | |
BR9005268A (en) | MIXTURE AND PROCESS FOR PREPARING THE SAME, CURING COMPOSITION AND PROCESS FOR PREPARING THE SAME, PRODUCT, ELECTRICAL OR ELECTRONIC COMPONENT AND PROCESS FOR PREPARING THE SAME |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 478606 Country of ref document: ES |