EP4717970A1

EP4717970A1 - Heatsink assembly for a vehicle lighting device

Info

Publication number: EP4717970A1
Application number: EP24203063.3A
Authority: EP
Inventors: Alvaro Andres; Mohamednabil SHAHULHAMEED
Original assignee: Valeo Vision SAS
Current assignee: Valeo Vision SAS
Priority date: 2024-09-26
Filing date: 2024-09-26
Publication date: 2026-04-01

Abstract

The present invention pertains to a heatsink assembly 100 for a vehicle lighting device. The heatsink assembly 100 includes a base member (102) and at least one fin (104) attached to the base member (102) in substantially perpendicular configuration. One or more through holes (106) may be formed in the base member (102) at a predetermined heat flux zone(s) (112). The holes (106) may be covered at least from one side by a PCB (108a, 108b) to prevent leakage of light through the holes (106) when light source(s) 110 provided on the PCB is/are turned ON. The removal of material from the predetermined heat flux zone (112) of the base member (102) reduces overall weight of the heatsink assembly (100) without considerably affecting cooling efficiency of the heatsink assembly (100).

Description

TECHNICAL FIELD OF THE INVENTION

The present invention relates to a heatsink assembly for a vehicle lighting device, and more particularly to a heatsink assembly having a base portion with holes/hollow portions.

BACKGROUND OF THE INVENTION

Vehicle lighting devices such as headlamp, tail lamp etc. have one or more light sources for achieving desired lighting function. The light sources, especially semiconductor light emitting devices generate heat during operation, thus increasing temperature of the lighting device. This increased temperature reduces the efficiency of the semiconductor light emitting device. Heatsinks are used to efficiently dissipate the heat generated by the semiconductor light sources. The heat generated by the light sources may be transferred to the heatsink, and then the heatsink dissipates the heat to the surrounding environment.
The heatsink may include a base structure and fins attached to the base structure. A printed circuit board (PCB) having light sources may be mounted on the base structure, and fins are exposed to outside air either by natural cooling or forced cooling methods. The conventional heatsink is considered to be one of the heaviest parts of the lighting device. This adds into the overall weight of the lighting device and increases the cost of the lighting device.
The prior art and the conventional heatsink assembly have various disadvantages as described above and there is a need for an improved heatsink that can overcome the disadvantages of the conventional heatsink.

SUMMARY OF THE INVENTION

An object of the present invention is to solve the disadvantages described above of known heatsink assembly. In particular, the object of the present invention is to provide a heatsink assembly with reduced weight.
Another object of the present invention is to optimize weight of a heatsink assembly by removing material without considerably affecting heat transfer efficiency of the heatsink assembly.
Yet another object of the present invention is to provide a heatsink assembly having a horizontal base member and vertical fin configuration, wherein the base member has one or more holes at predetermined locations.
Yet another object of the present invention is to optimize weight of a heatsink assembly by removing material from a base member of the heatsink assembly with negligible light leakage.
The present invention is directed towards a heatsink assembly for a lighting module. The heatsink assembly may include a base member having a first surface and a second surface opposite to the first surface. At least one fin may be provided extending from at least a portion of the base member, in a predefined angular orientation. At least one through hole may be formed on the base member at a predefined location. The predefined location of the at least one through hole may be positioned substantially in a predetermined heat flux zone of the base member. Preferably, the predetermined heat flux zone may be the portion of the base member having less contribution in transferring heat from the light sources to the fin(s) when compared to the other portions of the base member. Therefore, removing material from the predetermined heat flux zone to form the hole(s) may not affect the heat transfer efficiency of the base member to a considerable extent, and the weight of heatsink assembly may be reduced without considerably affecting cooling efficiency of the heatsink assembly. Further, the through hole may have openings on the first surface and the second surface of the base member. The base member may have a predefined thickness between the first surface and the second surface. The base member may be adapted to support PCB(s) on the first surface and/or the second surface, and the base member may be positioned inside a lighting module. There may be provided a plurality of parallel fins attached to the base member, and the fins may be exposed to outside air by either natural cooling or forced cooling arrangement. The fins may be integrally formed with the base member or the fins may be attached to the base member by any suitable securing means such as but not limited to welding.
In a non-limiting embodiment of the present invention, the predefined angular orientation of the at least one fin may be substantially perpendicular to a plane of the base member. The plane of the base member may be defined as a plane in which the base member extends. The fin(s) may be attached to an end portion of the base member, and may extend in a direction substantially perpendicular to the plane of the base member. Alternatively, the fin(s) may extend in any other predefined angular orientation with the plane of the base member. When a PCB is mounted on the base member and the light sources provided on the PCB are switched ON, the base member receives the heat generated by the light sources and carries the heat to the fin(s) by conduction.
In a non-limiting embodiment of the present invention, the at least one through hole may have at least one of a polygonal shape, or a circular shape, or a semi-circular shape, or an oval shape, or any irregular shape. The shape of the hole more preferably refers to the shape of the openings of the through hole on the first surface and/or second surface of the base member. The said irregular shape may be formed by connecting curved lines and/or straight lines in a non-uniform manner.
In a non-limiting embodiment of the present invention, the base member may include a plurality of through holes with at least one through hole having different shape. Preferably, two or more through holes having same or different shapes may be formed on the base member. The shape of each through hole may be defined based on thermal analysis of the heatsink assembly, such that the removal of material may not majorly affect heat transfer efficiency of the base member or cooling efficiency of the heatsink assembly.
In a non-limiting embodiment of the present invention, the base member may include plurality of through holes with at least one through hole having different cross-sectional area. Preferably, two or more through holes having same or different cross-sectional areas may be formed on the base member. The through holes may have same or different shapes. The shape and the cross-sectional area of each through hole may be defined based on thermal analysis of the heatsink assembly, such that the removal of material may not majorly affect heat transfer efficiency of the base member or cooling efficiency of the heatsink assembly.
In a non-limiting embodiment of the present invention, the predetermined heat flux zone may be defined in a portion of the base member having substantially less heat flux when compared to the remaining area of the base member. To determine the predetermined heat flux zone of the base member, the thermal analysis of the heatsink assembly may be performed and heat flux values across the base member are determined. The predetermined heat flux zone may be defined by a portion or portions of the base member having heat flux values less than a predefined heat flux value. The predefined heat flux value may be determined based on the cooling requirements of the lighting module.
In a non-limiting embodiment of the present invention, the first surface may support a first printed circuit board (PCB) having at least one light source.
The first PCB may be adapted to cover opening(s) of the through hole(s) on the first surface. The light source(s) may be provided on the first PCB at predefined locations. Alternatively, two or more PCBs may be supported on the first surface and at least one of the PCBs may cover the opening(s) of the through hole(s) on the first surface. As the openings of the through holes are covered by the PCB, light leakage through the through holes is prevented.
In a non-limiting embodiment of the present invention, the second surface may support a second PCB having at least one light source. The second PCB may be adapted to cover opening(s) of the hole(s) on the second surface. The light source(s) may be provided on the second PCB at predefined locations. Alternatively, two or more PCBs may be supported on the second surface and at least one of the PCBs may cover the opening(s) of the through hole(s) on the second surface. As the openings of the through holes on the first surface and/or the second surface are covered by the PCB, light leakage through the holes is prevented. At least one of the openings of each through hole may be covered by the PCB to prevent light leakage through the hole.
In another non-limiting embodiment of the present invention, the first PCB may be secured to the first surface of the base member by a thermal glue. Alternatively, any other securing means such as screwing, clamping etc. may be used to secure the first PCB to the first surface.
In a non-limiting embodiment of the present invention, the second PCB may be secured to the second surface of the base member by a thermal glue. Alternatively, any other securing means such as screwing, clamping etc. may be used to secure the second PCB to the second surface.
In a non-limiting embodiment of the present invention, total cross-sectional area of the through hole(s) may be in the range of 5% to 25% of area of the first surface of the base member, or in the range of 5% to 25% of area of the second surface of the base member. The total cross-sectional area of the holes may be determined by summation of the cross-sectional areas of all the through holes formed in the base member.
In a non-limiting embodiment of the present invention, total cross-sectional area of the through hole(s) may be in the range of 15% to 25% of area of the first surface of the base member, or in the range of 15% to 25% of area of the second surface of the base member. The total cross-sectional area of the holes may be determined by summation of the cross-sectional areas of all the through holes formed in the base member.
The present invention also relates to a vehicle lighting device. The vehicle lighting device may include at least one lighting module including the heatsink assembly as described above. At least one reflector unit and at least one lens may be provided in a predefined configuration with the heatsink assembly. The vehicle lighting device may be a headlamp or a tail lamp or any other suitable lighting device. The vehicle lighting device may include two PCBs mounted on opposite sides of the base member of the heatsink assembly and two reflector units each corresponding to each of the PCBs.

BRIEF DESCRIPTION OF DRAWINGS

To complete the description and to provide a better understanding of the invention, a set of drawings is provided. Said drawings form an integral part of the description and illustrate an embodiment of the invention, which should not be construed as restricting the scope of the invention, but only as an example of how the invention can be carried out. The drawings comprise the following characteristics.

Fig. 1A illustrates a schematic perspective view from top side of a heatsink assembly, according to an embodiment of the present invention;
Fig. 1B illustrates a schematic perspective view from bottom side of the heatsink assembly, according to an embodiment of the present invention;
Fig. 1C illustrates a schematic side view of the heatsink assembly taken in the direction of arrow 'V1' in Fig. 1A, according to an embodiment of the present invention;
Fig. 2 illustrates a schematic top view of the heatsink assembly, according to an embodiment of the present invention;
Figs. 3A and 3B illustrate schematic perspective views of the heatsink assembly with single PCB, according to an embodiment of the present invention;
Fig. 4A illustrates a schematic perspective view of the heatsink assembly with two PCBs, according to an embodiment of the present invention;
Fig. 4B illustrates a schematic side view of the heatsink assembly of Fig. 4A, according to an embodiment of the present invention;
Fig. 5 illustrates a schematic perspective view from top side of a lighting module, according to an embodiment of the present invention;
Fig. 6A illustrates a schematic perspective view of a lighting module with transparent reflector units, according to an alternate embodiment of the present invention;
Fig. 6B illustrates a schematic perspective view from the bottom side of the lighting module taken in the direction of arrow 'V2' in Fig. 6A, according to an embodiment of the present invention; and
Fig. 6C illustrates a sectional view of the lighting module taken along line A-A in Fig. 6A, according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The characteristics, variants and different modes of realization of the invention may be associated with each other in various combinations, in so far as they are not incompatible or exclusive with each other. In particular, variants of the invention comprising only a selection of features subsequently described in from the other features described may be imagined, if this selection of features is enough to confer a technical advantage and/or to differentiate the invention from prior art.
Items shown in the drawings are not to the scale and are simplified to increase clarity of disclosure.
The following embodiments are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference is to the same embodiment, or that the features apply only to one embodiment. Simple features of different embodiments may also be combined and/or interchanged to provide further embodiments.
In the present description, certain elements or parameters may be indexed, for example first element or second element as well as first parameter and second parameter or first criterion and second criterion, etc. In this case, it is a simple indexing operation to differentiate and name elements or parameters or criteria which are close, but not identical. In this case, simple indexing is used to differentiate and name elements or parameters or criteria which are close, but not identical. This indexing does not imply that one element, parameter or criterion has priority over another, and such names can easily be interchanged without going beyond the scope of this description. Nor does this indexing imply an order in time, for example to assess a particular criterion.
In the following description, the expression "plane of the base member" refers to a plane in which the base member extends, the base member preferably being a flat plate like structure. Further, the expression "irregular shape" refers to any shape formed by straight and/or curved lines in an irregular/non-uniform manner. Moreover, the expression "predetermined heat flux zone" refers to a zone/portion of the base member having heat flux less than a predefined heat flux value when the lighting module is operational i.e. when the light sources are switched ON. Further, the expression "dominant heat flux zone" refers to a zone/portion of the base member that has heat flux value greater than a predefined heat flux value when the lighting module is operational. Furthermore, the "total cross-sectional area of the holes" may be defined as summation of cross-sectional areas of all the through holes formed on the base member.
Figs. 1A to 1C show a heatsink assembly 100, according to an embodiment of the present invention. The heatsink assembly 100 includes a base member 102 having a first surface 102a and a second surface 102b, and a predefined thickness provided between the first surface 102a and the second surface 102b. At least one fin 104 is provided extending from a portion of the base member 102 in a predefined angular orientation with respect to the base member 102. Preferably, a plurality of fins 104 may be integrally formed with the base member 102 or may be secured to at least one end of the base member 102. Preferably, the fins 104 may be orientated substantially perpendicular to a plane of the base member 102. Alternatively, the fins 104 may be provided in any other angular orientation with respect to the base member 102. One or more through holes 106, 107 are formed on the base member 104 at predetermined locations. The through hole 106, 107 may have opening 106a, 107a on the first surface 102a and opening 106b, 107b on the second surface 102b. The location of the holes 106, 107 on the base member 102 may be predetermined based on thermal analysis of the heatsink assembly 100 considering location(s) and power of light sources.
As shown in Fig. 2, the heatsink assembly 100 may include one or more portions 116 provided at the locations of light source(s) when a printed circuit board (PCB) is mounted on the base member 102. The heat generated by the light source(s) is conducted through the base member 102 to the fins 104 and then dissipated to the atmosphere either by natural convection or by forced convection. Based on thermal analysis, a predetermined heat flux zone 112 may be defined as a portion(s) of the base member 102 having insignificant contribution in the total heat conduction from the portions 116 to the fins 104. Remaining portion(s) of the base member 102 may be considered as a dominant heat flux zone 114 which has considerable contribution in the total heat conduction from the portions 116 to the fins 104. The through holes 106, 107 may be substantially formed in the predetermined heat flux zone 112, thereby not considerably affecting the cooling efficiency of the heatsink assembly 100. It is to be understood that, during thermal analysis of the heatsink assembly 100, the zone(s) or portion(s) of the base member 102 having heat flux value(s) less than a predefined heat flux value may be considered as predetermined heat flux zone 112. Similarly, the zone(s) or portion(s) of the base member 102 having heat flux value(s) equal to or more than the predefined heat flux value may be considered as dominant heat flux zone 114. The predefined heat flux value may be determined based on cooling requirements of a lighting module.
In an embodiment of the present invention, plurality of through holes 106, 107 may be formed on the base member 102. Each of the holes 106, 107 may be formed in any polygonal shape or circular shape or oval shape or any other irregular shape. More specifically, the shape of the through hole 106, 107 refers to the shape of the openings 106a, 106b, 107a, 107b of the through hole 106, 107. The plurality of holes 106, 107 may have similar shape or may have different shapes as per the requirement. For example, as can be seen in Figs. 1A and 1B, shape of the through hole 106 is different from the shape of the through hole 107. Further, the cross-sectional area of each of the plurality of holes 106, 107 may be same or different. For example, in Figs. 1A and 1B, the cross-sectional area of holes represented by the reference number 106 is different from the cross-sectional area represented by the reference number 107. The shape and cross-sectional area of each through hole 106, 107 may be defined based on the heat flux values at the location of the through hole 106, 107 on the base member 102, such that forming through hole 106, 107 by removing material does not much affect the heat conduction through base member 102 from light sources to the fins 104. The total cross-sectional area of the holes 106, 107 may be in the range of 5% to 25%, preferably 15% to 25% of area of the first surface (102a) or of area of the second surface (102b) of the base member (102). In case of plurality of holes 106, 107, the total cross-sectional area of the holes 106, 107 may be derived by summation of the cross-sectional area of each through hole 106, 107.
Figs. 3A and 3B show one embodiment of the present invention, wherein a single printed circuit board (PCB) is mounted on the base member 102. As shown in Fig. 3A, a first PCB 108a may be supported on the first surface 102a of the base member 102. The first PCB 108a may be secured to the first surface 102a by any known securing means such as but not limited to thermal glue. The first PCB 108a may include one or more light sources 110 mounted on the first PCB 108a at predefined locations such that when the first PCB 108a is secured to the first surface 102a, the light sources are positioned at the location of the portions 116 of the base member 102. In Fig. 3B, the first PCB is made transparent to show the positions of the through holes 106, 107. As can be seen from Fig. 3B, the first PCB 108a covers the holes 106, 107 from the side of the first surface 102a. More specifically, the first PCB 108a covers openings 106a, 107a of the holes 106, 107 on the first surface 102a. Therefore, when the light sources 110 are switched ON in presence of a reflector, the light may not pass through the holes 106, 107 towards opposite side i.e. towards the second surface 102b of the base member 102, thereby eliminating risk of light leakage.
In an alternate embodiment of the present invention, a plurality of PCBs (not shown) may be secured to the first surface 102a wherein the plurality of PCBs are positioned on the base member 102 such that the openings 106a, 107a of through holes 106, 107 on the first surface 102a are covered by at least one PCB.
Figs. 4A and 4B show another embodiment of the present invention wherein two PCBs are mounted on the opposite sides/surfaces of the base member 102. As shown, a first PCB 108a may be secured to the first surface 102a of the base member 102 and a second PCB 108b may be secured to the second surface 102b of the base member 102. Each of the first PCB 108a and the second PCB 108b have at least one light source 110 provided at a predefined location. The position of light sources 110 provided on the first PCB 108a may be different from the position of light sources 110 provided on the second PCB 108b. So, the base member 102 is configured to receive heat generated from the light sources 110 of both the PCBs 108a, 108b and transfers the heat to fins 104 by conduction. The through holes 106, 107 (not visible) may be formed on the base member 102 in a predetermined heat flux zone 112 determined based on thermal analysis of the heatsink assembly 100, similar to the explanation of Fig. 2. At least one of the first PCB 108a and the second PCB 108b covers the openings 106a, 106b, 107a, 107b of the holes 106, 107 on the first surface 102a and/or the second surface 102b as the case may be. Preferably, at least one of the openings 106a, 106b, 107a, 107b of each through hole 106, 107 may be covered by either the first PCB 108a or the second PCB 108b. More preferably, the first PCB 108a may cover the openings 106a, 107a of the holes 106, 107 on the first surface 102a and the second PCB 108b may cover the openings 106b, 107b of the holes 106, 107 on the second surface 102b. Thus, the light emitted by the light sources 110 of the first PCB 108a, after reflecting from corresponding reflector may not travel through the holes 106, 107 to the opposite side of the base member 102. Moreover, the light emitted by the light sources 110 of the second PCB 108b, after reflecting from corresponding reflector may not travel through the holes 106, 107 to the opposite side of the base member 102. The first PCB 108a and the second PCB 108b may be secured to the first surface 102a and the second surface 102b, respectively by any known securing means such as but not limited to a thermal glue.
In an alternate embodiment of the present invention, a plurality of PCBs may be secured to each of the first surface 102a and the second surface 102b The plurality of PCBs may be positioned on the base member 102 such that the openings 106a, 107a of through holes 106, 107 on the first surface 102a and/or the openings 106b, 107b of through holes on the second surface 102b are covered by at least one PCB. Preferably, at least one of the openings 106a, 106b, 107a, 107b of the through hole 106, 107 may be covered by at least one of the plurality of PCBs to prevent light leakage through the hole(s).
Fig. 5 shows a lighting module 200 according to an embodiment of the present invention. The lighting module 200 includes the heatsink assembly 100 as described above in the description of Figs. 3A and 3B. The first PCB 108a is secured to the first surface 102a of the base member 102. The first PCB 108a have at least one light source 110 mounted at predefined location(s) on the PCB 108a. The first PCB 108a is secured to the first surface 102a of the base member 102 such that the PCB 108a covers the openings 106a, 107a of through holes 106, 107 on the first surface 102a. Further, a reflector unit 202 is provided along with a lens 204 to properly distribute the light emitted by the light sources 110 outward through the lens 204. The reflector unit 202 may have one or more reflective portions 203 formed therein corresponding to the light source(s) 110. The reflective portions 203 reflects the light emitted by the corresponding light sources 110 towards the lens 204. It is to be noted that in Fig. 5, the reflector unit 202 is made transparent to show arrangement of the first PCB 108a and light sources 110 with respect to the reflective portions 203 of the reflector unit 202. The lighting module 200 may be used in headlight for lighting functions such as high beam and/or low beam. The lighting module 200 may also be used in other vehicle lighting devices such as tail lamp etc., as per the requirement.
Figs. 6A to 6C show a lighting module 300 according to another embodiment of the present invention. The lighting module 300 includes the heatsink assembly 100 as described above in the description of Figs. 4A and 4B. The first PCB 108a may be secured to the first surface 102a of the base member 102 and the second PCB 108b may be secured to the second surface 102b of the base member 102. Each of the first PCB 108a and the second PCB 108b have at least one light source 110 mounted at predefined locations on the PCBs 108a, 108b. The first PCB 108a is secured to the first surface 102a of the base member 102 and the second PCB 108b is secured to the second surface 102b of the base member 102 such that at least one of the PCBs 108a, 108b covers the openings 106a, 106b, 107a, 107b of the through hole(s) 106, 107 on the first surface 102a or the second surface 102b as the case may be. Preferably, both the first and the second PCBs 108a, 108b are configured to cover the openings 106a, 106b, 107a, 107b of the through hole 106, 107 on the first surface 102a and the second surface 102b, of the base member 102, respectively. Further, a first reflector unit 302a is provided corresponding to the first PCB 108a and a second reflector unit 302b is provided corresponding to the second PCB 108b. A lens 304 may be provided in a predefined configuration with the first reflector 302a and the second reflector 302b such that the light emitted by the light sources 110 of the first PCB 108a and the second PCB 108b is reflected from the corresponding first reflector 302a and the second reflector 302b, and distributed outward through the lens 304. Alternatively, there may be provided two lenses (not shown), one lens corresponding to the first PCB 108a and another lens corresponding to the second PCB 108b. The first reflective unit 302a may have one or more reflective portions 303a formed therein corresponding to the light sources 110 of the first PCB 108a. Similarly, the second reflective unit 302b may have one or more reflective portions 303b formed therein corresponding to the light sources 110 of the second PCB 108b. The reflective portions 303a, 303b reflect the light emitted by the corresponding light sources 110 towards the lens 304. It is to be noted that in Figs. 6A and 6B, the first reflector unit 302a and the second reflector unit 302b are made transparent to show arrangement of the first PCB 108a, the second PCB 108b and light sources 110 with respect to the reflector units 302a, 302b. The lighting module 300 may be used in headlight for lighting functions such as high beam and/or low beam. The lighting module 300 may also be used in other vehicle lighting devices such as tail lamp etc. as per the lighting requirement.
The person skilled in the art realizes that the present invention by no means is limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims. In addition, the skilled person readily realizes that the different embodiments described herein may be combined freely to obtain new combinations.

Additionally, variations to the disclosed embodiments can be understood and effected by the skilled person in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantages.

LIST OF REFERENCE SIGNS

100	Heatsink assembly
102	Base member
102a	First surface
102b	Second surface
104	Fins
106, 107	Hole
106a, 106b, 107a, 107b	Opening
108a	First PCB
108b	Second PCB
110	Light source
112	Predetermined heat flux zone
114	Dominant heat flux zone
116	Locations of light sources
200, 300	Lighting Module
202	Reflector unit
302a	First reflector unit
302b	Second reflector unit
203, 303a, 303b	Reflective portions
204, 304	Lens

Claims

A heatsink assembly (100) for a lighting module (200, 300), the heatsink assembly (100) comprising:
a base member (102) having a first surface (102a) and a second surface (102b) opposite to the first surface (102a);

at least one fin (104) extending from at least a portion of the base member (102), in a predefined angular orientation; and

at least one through hole (106, 107) formed on the base member (102) at a predefined location,

wherein the predefined location of the at least one through hole (106, 107) is positioned substantially in a predetermined heat flux zone (112) of the base member (102).
The heatsink assembly (100) according to claim 1, wherein the predefined angular orientation of the at least one fin (104) is substantially perpendicular to a plane of the base member (102).
The heatsink assembly (100) according to any of the preceding claims, wherein the at least one through hole (106, 107) has at least one of a polygonal shape, a circular shape, a semi-circular shape, an oval shape, or any irregular shape.
The heatsink assembly (100) according to any of the preceding claims, wherein the base member (102) includes plurality of through holes (106, 107) with at least one through hole (106, 107) having different shape.
The heatsink assembly (100) according to any of the preceding claims, wherein the base member (102) includes plurality of through holes (106, 107) with at least one through hole (106, 107) having different cross-sectional area.
The heatsink assembly (100) according to any of the preceding claims, wherein the predetermined heat flux zone (112) is defined in a portion of the base member (102) having substantially less heat flux when compared to remaining area of the base member (102).
The heatsink assembly (100) according to any of the preceding claims, wherein the first surface (102a) supports a first PCB (108a) having at least one light source (110), the first PCB (108a) being configured to cover opening(s) (106a, 107a) of the through hole(s) (106, 107) on the first surface (102a).
The heatsink assembly (100) according to any of the preceding claims, wherein the second surface (102b) supports a second PCB (108b) having at least one light source (110), the second PCB (108b) being configured to cover opening(s) (106b, 107b) of the through hole(s) (106, 107) on the second surface (102b).
The heatsink assembly (100) according to claim 7 or claim 8, wherein the first PCB (108a) is secured to the first surface (102a) of the base member (102), by a thermal glue.
The heatsink assembly (100) according to claim 8, wherein the second PCB (108b) is secured to the second surface (102b) of the base member (102) by a thermal glue.
The heatsink assembly (100) according to any of the preceding claims, wherein total cross-sectional area of the through hole(s) (106, 107) is in the range of 5% to 25% of area of the first surface (102a) of the base member (102), or in the range of 5% to 25% of area of the second surface (102b) of the base member (102).
The heatsink assembly (100) according to any of the claims 1 to 10, wherein total cross-sectional area of the through hole(s) (106, 107) is in the range of 15% to 25% of area of the first surface (102a) of the base member (102), or in the range of 15% to 25% of area of the second surface (102b) of the base member (102).
A vehicle lighting device, comprising:
at least one lighting module (200, 300) including the heatsink assembly (100) according to any of the preceding claims, wherein at least one reflector unit (202, 302a, 302b), and at least one lens (204, 304) are provided in a predefined configuration with the heatsink assembly (100).