CROSS-REFERENCE TO RELATED APPLICATIONS
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This application claims priority to
Chinese Patent Application 202321201643.3 filed on May 17, 2023 , which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
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This application relates to the field of electronic atomization technologies, and in particular, to a heating assembly, an atomizer, and an electronic atomization device.
BACKGROUND
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An electronic atomization device includes components such as a heating assembly, a battery, and a control circuit. As a core component of the electronic atomization device, characteristics of the heating assembly determine an atomization effect and user experience of the electronic atomization device.
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A relatively common atomization manner for an existing heating assembly is resistive heating. Specifically, the heating assembly includes a substrate and a heating film disposed on the surface of the substrate. The substrate is provided with a plurality of through-holes for guiding an aerosol generating substrate. The plurality of through-holes are distributed independently of each other. When the aperture of the through-hole is small, liquid guidance resistance is high, which can easily lead to insufficient liquid supply or gas backflow, causing the heating film to burn out. When the aperture of the through-hole is large, liquid supply is sufficient, but liquid spitting accompanied by noise is prone to occur.
SUMMARY
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A heating assembly, an atomizer, and an electronic atomization device provided in this application aim to ensure sufficient liquid supply while reducing gas backflow and preventing liquid spitting.
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To resolve the foregoing technical problem, a first technical solution provided in this application is to provide a heating assembly, applied to an electronic atomization device, and used for atomizing an aerosol generating substrate. The heating assembly includes: a substrate, including a liquid absorption surface and an atomization surface that are oppositely disposed, where at least one liquid guide channel that runs through the liquid absorption surface and the atomization surface is provided on the substrate; and the liquid guide channel includes at least two liquid guide holes, and the liquid guide holes run through the liquid absorption surface and the atomization surface; and ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the atomization surface overlap with each other and ports that are of two adjacent liquid guide holes and that are located on the liquid absorption surface are spaced apart from each other.
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In an implementation, cross-sectional shapes of the liquid guide holes are the same everywhere; and the cross-sectional area of the liquid guide hole gradually decreases along the direction from the atomization surface to the liquid absorption surface.
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In an implementation, the longitudinal sectional shape of the liquid guide hole is an isosceles trapezoid, and the cross-sectional shape of the liquid guide hole is a circular shape.
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In an implementation, a plurality of liquid guide channels are disposed on the substrate, and the plurality of liquid guide channels are arranged in a plurality of rows and a plurality of columns.
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In an implementation, a spacing between any two adjacent rows of liquid guide channels is the same, and a spacing between any two adjacent columns of liquid guide channels is the same.
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In an implementation, a quantity of liquid guide holes in each liquid guide channel is the same.
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In an implementation, all the liquid guide holes in each of the liquid guide channels in the same row are arranged in a one-dimensional array.
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In an implementation, the hole center distance between adjacent liquid guide holes in the liquid guide channel is greater than or equal to 20 µm and less than or equal to 60 µm; and/or the hole center distance between liquid guide channels in two adjacent rows is greater than or equal to 60 µm and less than or equal to 140 µm.
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In an implementation, the equivalent diameter of a port that is of the liquid guide hole and that is located on the atomization surface is greater than or equal to 30 µm and less than or equal to 70 µm; and/or the equivalent diameter of a port that is of the liquid guide hole and that is located on the liquid absorption surface is greater than or equal to 10 µm and less than or equal to 50 µm.
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In an implementation, the substrate is a dense substrate or a porous substrate.
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In an implementation, the substrate is a dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or
the substrate is a porous substrate, and the material of the substrate is porous ceramics.
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In an implementation, the thickness of the substrate is 0.5 mm-2.5 mm.
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In an implementation, the heating assembly further includes a heating layer, a pin conductive layer, and a protective layer; the heating layer is disposed on the atomization surface; one pin conductive layer is disposed at each of two opposite ends of the heating layer, and the pin conductive layer is connected to the heating layer; and the protective layer is disposed on the surface of the heating layer away from the substrate, and the protective layer is used for protecting the heating layer.
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In an implementation, the substrate includes a micro-pore region and a blank region adjacent to the micro-pore region; a plurality of liquid guide holes are disposed in the micro-pore region; no liquid guide hole is disposed in the blank region; and at least a part of the heating layer is disposed in the micro-pore region, and at least a part of the pin conductive layer is disposed in the blank region.
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To resolve the foregoing technical problem, a second technical solution provided in this application is to provide an atomizer, including a liquid storage cavity and a heating assembly; the liquid storage cavity is used for storing an aerosol generating substrate; the heating assembly is in fluid communication with the liquid storage cavity, and the heating assembly is used for atomizing the aerosol generating substrate; and the heating assembly is the heating assembly according to any one of the foregoing items.
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To resolve the foregoing technical problem, a third technical solution provided in this application is to provide an electronic atomization device, including: the foregoing atomizer and a main unit, where the main unit is used for providing electric energy for a heating assembly of the atomizer to work and controlling the heating assembly of the atomizer to atomize the aerosol generating substrate.
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Beneficial effects of this application: Different from a conventional technology, this application discloses a heating assembly, an atomizer, and an electronic atomization device. The heating assembly includes: a substrate, including a liquid absorption surface and an atomization surface that are oppositely disposed, where at least one liquid guide channel that runs through the liquid absorption surface and the atomization surface is provided on the substrate; and the liquid guide channel includes at least two liquid guide holes, and the liquid guide holes run through the liquid absorption surface and the atomization surface; and ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the atomization surface overlap with each other and ports that are of two adjacent liquid guide holes and that are located on the liquid absorption surface are spaced apart from each other. Ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the atomization surface overlap with each other, so as to increase the volume porosity on the atomization surface, improve the liquid feeding effect, and ensure sufficient liquid feeding. Ports that are of two adjacent liquid guide holes in the liquid guide channel and that are located on the liquid absorption surface are spaced apart from each other, so as to avoid an excessively large amount of liquid to be provided on the atomization surface, thereby preventing liquid spitting, and helping to reduce backflow during heating and atomization.
BRIEF DESCRIPTION OF THE DRAWINGS
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To describe the technical solutions of the embodiments of this application more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments. Apparently, the accompanying drawings in the following description show only some embodiments of this application, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.
- FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device according to this application;
- FIG. 2 is a schematic structural diagram of an atomizer according to an embodiment of this application;
- FIG. 3 is a schematic structural diagram of a heating assembly according to an embodiment of this application;
- FIG. 4 is a schematic cross-sectional diagram of the heating assembly shown in FIG. 3 along a line A-A;
- FIG. 5a is a schematic diagram of a local structure of an implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 5b is a schematic cross-sectional diagram of the substrate shown in FIG. 5a along a line B-B;
- FIG. 6a is a schematic diagram of a partial structure of another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 6b is a schematic cross-sectional diagram of the substrate shown in FIG. 6a along a line C-C;
- FIG. 7a is a schematic diagram of a local structure of still another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 7b is a schematic cross-sectional diagram of the substrate shown in FIG. 7a along a line D-D;
- FIG. 8a is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 8b is a schematic cross-sectional diagram of the substrate shown in FIG. 8a along a line E-E;
- FIG. 9 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 10 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 11 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 12 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3;
- FIG. 13 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3; and
- FIG. 14 is a comparison diagram of atomization amounts of different implementations of a substrate.
DETAILED DESCRIPTION
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The technical solutions in embodiments of this application are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are merely some rather than all of the embodiments of this application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.
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In the following description, for the purpose of illustration rather than limitation, specific details such as the specific system structure, interface, and technology are proposed to thoroughly understand the present application.
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The terms "first", "second", and "third" in this application are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or implicit indication of the number of indicated technical features. Therefore, features defining "first", "second", and "third" can explicitly or implicitly include at least one of the features. In description of this application, "plurality of" means at least two, such as two and three unless it is specifically defined otherwise. All directional indications (for example, upper, lower, left, right, front, and back) in the embodiments of the present application are only used for explaining relative position relationships, movement situations, or the like between the various components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications change accordingly. In the embodiments of the present application, the terms "include", "have", and their any variations are intended to cover non-exclusive encompassing. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but further optionally includes a step or unit that is not listed, or further optionally includes another step or component that is intrinsic to the process, method, product, or apparatus.
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Embodiment mentioned in the specification means that particular features, structures, or characteristics described with reference to the embodiment may be included in at least one embodiment of this application. The term appearing at different positions of this specification may not refer to the same embodiment or an independent or alternative embodiment that is mutually exclusive with another embodiment. A person skilled in the art explicitly or implicitly understands that the embodiments described in the specification may be combined with other embodiments.
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The following describes this application in detail with reference to the accompanying drawings and embodiments.
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With reference to FIG. 1, FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device according to this application.
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In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 may be used for atomizing an aerosol generating substrate. The electronic atomization device 100 includes an atomizer 1 and a main unit 2 that are electrically connected to each other.
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The atomizer 1 is used for storing the aerosol generating substrate and atomize the aerosol generating substrate to form an aerosol that can be inhaled by a user. The atomizer 1 specifically may be applied to different fields such as medical care, cosmetology, and recreation inhalation. In a specific embodiment, the atomizer 1 may be applied to an electronic aerosolization device, to atomize the aerosol generating substrate and generate aerosols for inhalation by the user. The following embodiments are all described by using recreation inhalation as an example.
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Reference may be made to a specific structure and functions of the atomizer 1 involved in the following embodiments for a specific structure and functions of the atomizer 1, same or similar technical effects may also be implemented, and details are not described herein again.
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The main unit 2 includes a battery (not shown in the figure) and a controller (not shown in the figure). The battery is used for supplying electric energy to operation of the atomizer 1, to cause the atomizer 1 to atomize the aerosol generating substrate to form an aerosol. The controller is used for controlling the atomizer 1 to operate, that is, control the atomizer 1 to atomize the aerosol generating substrate. The main unit 2 further includes other components such as a battery holder and an airflow sensor.
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The atomizer 1 and the main unit 2 may be integrally arranged or may be detachably connected to each other, which may be designed according to a specific requirement.
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With reference to FIG. 2, FIG. 2 is a schematic structural diagram of an atomizer according to an embodiment of this application.
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The atomizer 1 includes a housing 10, a heating assembly 11, and an atomization base 12. The atomization base 12 has an installation cavity (not marked in the figure), and the heating assembly 11 is disposed in the installation cavity. The heating assembly 11 and the atomization base 12 are disposed inside the housing 10 together. The housing 10 is formed with an aerosol outlet channel 13. The inner surface of the housing 10, the outer surface of the aerosol outlet channel 13, and the top surface of the atomization base 12 cooperate to form a liquid storage cavity 14. The liquid storage cavity 14 is used for storing a liquid aerosol generating substrate. The heating assembly 11 is electrically connected to the main unit 2, so as to atomize the aerosol generating substrate to generate an aerosol.
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The atomization base 12 includes an upper base 121 and a lower base 122, and the upper base 121 cooperates with the lower base 122 to form an installation cavity. The surface of the heating assembly 11 that faces away from the liquid storage cavity 14 cooperates with the cavity wall of the mounting cavity to form an atomization cavity 120. A liquid discharge channel 1211 is provided above the upper base 121. The aerosol generating substrate in the liquid storage cavity 14 flows into the heating assembly 11 through the liquid discharge channel 1211, that is, the heating assembly 11 is in fluid communication with the liquid storage cavity 14. The lower base 122 is provided with an air inlet channel 15. External air enters the atomization cavity 120 through the air inlet channel 15, carrying an aerosol atomized by the heating assembly 11 to flow to the aerosol outlet channel 13. The user inhales the aerosol through a port of the aerosol outlet channel 13.
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With reference to FIG. 3 to FIG. 13, FIG. 3 is a schematic structural diagram of a heating assembly according to an embodiment of this application; FIG. 4 is a schematic cross-sectional diagram of the heating assembly shown in FIG. 3 along a line A-A; FIG. 5a is a schematic diagram of a local structure of an implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 5b is a schematic cross-sectional diagram of the substrate shown in FIG. 5a along a line B-B; FIG. 6a is a schematic diagram of a partial structure of another implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 6b is a schematic cross-sectional diagram of the substrate shown in FIG. 6a along a line C-C; FIG. 7a is a schematic diagram of a local structure of still another implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 7b is a schematic cross-sectional diagram of the substrate shown in FIG. 7a along a line D-D; FIG. 8a is a schematic diagram of a local structure of still another implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 8b is a schematic cross-sectional diagram of the substrate shown in FIG. 8a along a line E-E; FIG. 9 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 10 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 11 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 12 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3; and FIG. 13 is a schematic diagram of a top view of still another implementation of a substrate of the heating assembly shown in FIG. 3.
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A heating assembly 11 includes a substrate 111. The substrate 111 includes a liquid absorption surface 1111 and an atomization surface 1112 that are oppositely disposed. At least one liquid guide channel 1113 that runs through the liquid absorption surface 1111 and the atomization surface 1112 is provided on the substrate 111. The liquid guide channel 1113 includes at least two liquid guide holes 1113a, the liquid guide holes 1113a run through the liquid absorption surface 1111 and the atomization surface 1112, the liquid guide hole 1113a has a capillarity action, and the liquid guide hole 1113a is used for guiding an aerosol generating substrate from the liquid absorption surface 1111 to the atomization surface 1112. That is, the liquid guide channel 1113 is configured to guide the aerosol generating substrate from the liquid absorption surface 1111 to the atomization surface 1112. The liquid guide hole 1113a extends along a straight line.
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In this embodiment, ports that are of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 and that are located on the liquid absorption surface 1111 are spaced apart from each other. Because ports that are of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, the two adjacent liquid guide holes 1113a in the liquid guide channel 1113 communicate with each other. That ports of two liquid guide holes 1113a located on the atomization surface 1112 overlap with each other means that the ports of the two liquid guide holes 1113a located on the atomization surface 1112 partially overlap with each other, so that hole section parts of the two liquid guide holes 1113a close to the atomization surface 1112 communicate with each other. For example, referring to FIG. 5b, parts of two liquid guide holes 1113a located above a dashed line L communicate with each other, and parts of the two liquid guide holes 1113a located below the dashed line L are independent from each other.
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Ports that are of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and at least one liquid guide channel 1113 is provided on the substrate 111, so that the volume porosity on the atomization surface 1112 is increased, thereby enhancing liquid supply performance, ensuring sufficient liquid supply, and facilitating an increased atomization amount. In addition, this does not affect current passage within a heating layer 112 (to be introduced later) on the atomization surface 1112. The liquid guide hole 1113a extends along a straight line. In the liquid guide channel 1113, ports of two adjacent liquid guide holes 1113a located on the atomization surface 1112 overlap with each other, while ports thereof located on the liquid absorption surface 1111 are spaced apart from each other. From this, it can be learned that the equivalent diameter of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 is smaller than the equivalent diameter of the port of the liquid guide hole 1113a on the atomization surface 1112. This increases resistance to gas backflow bubbles, thereby helping to reduce gas backflow. By setting the equivalent diameter of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 to be smaller than that of the port of the liquid guide hole 1113a on the atomization surface 1112, the capillary pressure within the liquid guide hole 1113a increases along the direction from the atomization surface 1112 toward the liquid absorption surface 1111. This can prevent phenomena such as liquid spitting on the atomization surface 1112 caused by excessive liquid supply.
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The equivalent diameter of a port that is of the liquid guide hole 1113a and that is located on the atomization surface 1112 is greater than or equal to 30 µm and less than or equal to 70 µm; and/or the equivalent diameter of a port that is of the liquid guide hole 1113a and that is located on the liquid absorption surface 1111 is greater than or equal to 10 µm and less than or equal to 50 µm. It should be noted that the equivalent diameter of the port of the liquid guide hole 1113a on the atomization surface 1112 affects the particle size distribution range of the aerosol. A smaller equivalent diameter results in a smaller particle size. Setting the equivalent diameter of the port of the liquid guide hole 1113a on the atomization surface 1112 to be greater than or equal to 30 µm and less than or equal to 70 µm ensures that the aerosol particle size distribution falls within an optimal range, thereby maintaining a favorable taste. The equivalent diameter of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 affects the flow resistance of the aerosol generating substrate. The smaller the equivalent diameter, the more favorable it is for reducing gas backflow and preventing bubble formation on the liquid absorption surface 1111. By setting the equivalent diameter of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 to be greater than or equal to 10 µm and less than or equal to 50 µm, gas backflow is reduced, thereby maintaining smooth and sufficient liquid supply.
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As an example, a laser etching process is employed to form a conical liquid guide hole 1113a (the cross-sectional shape of the liquid guide hole 1113a is circular, and the longitudinal sectional shape of the liquid guide hole 1113a is an isosceles trapezoid). The aperture of the port of the liquid guide hole 1113a on the atomization surface 1112 is larger than that of the port of the liquid guide hole 1113a on the liquid absorption surface 1111, and the difference between the aperture of the port of the liquid guide hole 1113a on the atomization surface 1112 and that of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 can be controlled within 20 µm. If the aperture of the port of the liquid guide hole 1113a on the atomization surface 1112 is less than 30 µm, and the aperture of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 is less than 10 µm, insufficient liquid supply is likely to occur. If the aperture of the port of the liquid guide holes 1113a on the atomization surface 1112 is greater than 70 µm, and the aperture of the port of the liquid guide hole 1113a on the liquid absorption surface 1111 is greater than 50 µm, liquid leakage is likely to occur.
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Still referring to FIG. 3 and FIG. 4, the heating assembly 11 further includes a heating layer 112, a pin conductive layer 113, and a protective layer 114. The heating layer 112 is used for electrically heating and atomizing the aerosol generating substrate. The heating layer 112 is disposed on the atomization surface 1112 of the substrate 111. One pin conductive layer 113 is separately provided at two opposite ends of the heating layer 112, and the pin conductive layer 113 is connected to the heating layer 112. The pin conductive layer 113 is configured to be electrically connected to the main unit 2, and the heating layer 112 is electrically connected to the main unit 2 by using the pin conductive layer 113. By disposing the pin conductive layer 113, contact resistance of the heating layer 112 for implementing an electrical connection is reduced. For example, the heating assembly 11 is electrically connected to the main unit 2 via a pogo pin. The pogo pin contacts the pin conductive layer 113, and the pin conductive layer 113 has a relatively large contact area, thereby reducing contact resistance between the heating layer 112 and the pogo pin. The protective layer 114 is disposed on the surface of the heating layer 112 far away from the substrate 111. The protective layer 114 is used for preventing or reducing a risk of corrosion and oxidization of the heating layer 112 after heating, and prolonging the service life of the heating layer 112.
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In an implementation, the heating layer 112 is formed by using a physical vapor deposition process (for example, magnetron sputtering process) or a chemical vapor deposition process, or is formed by using a screen printing process. The thickness of the heating layer 112 formed by using the physical vapor deposition process or the chemical vapor deposition process is less than that of the heating layer 112 formed by using the screen printing process.
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In an implementation, the heating layer 112 has a long strip shape and extends along a straight line. Two pin conductive layers 113 are respectively disposed at two opposite ends of the heating layer 112, and a current flow direction of the heating layer 112 is a direction in which one pin conductive layer 113 points to the other pin conductive layer 113. The pin conductive layer 113 covers a part of the heating layer 112. A remaining part of the heating layer 112 that is not covered by the pin conductive layer 113 is covered by the protective layer 114.
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In an implementation, the substrate 111 includes a micro-pore region 1114 and a blank region 1115 adjacent to the micro-pore region 1114. A plurality of liquid guide holes 1113a are provided in the micro-pore region 1114, and the plurality of liquid guide holes 1113a may be liquid guide channels 1113, or may be independent liquid guide holes 1113a. Specifically, the plurality of liquid guide holes 1113a in the micro-pore region 1114 may be formed by using processes such as laser and erosion. The blank region 1115 is not provided with a liquid guide hole 1113a. The blank region 1115 in this application is a region in which a liquid guide hole 1113a can be formed but no liquid guide hole 1113a is formed, but is not a region around the micro-pore region 1114 and in which a liquid guide hole 1113a cannot be formed. The blank region 1115 is not provided with a liquid guide hole 1113a, so that the quantity of liquid guide holes 1113a on the substrate 111 is reduced, thereby improving strength of the substrate 111 and reducing production costs of providing the liquid guide hole 1113a on the substrate 111. At least a part of the heating layer 112 is disposed in the micro-pore region 1114. The heating layer 112 is configured to atomize the aerosol generating substrate on the atomization surface 1112. At least a part of the pin conductive layer 113 is disposed in the blank region 1115, to ensure continuity and stability of the pin conductive layer 113.
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For example, the blank region 1115 is disposed around the micro-pore region 1114 by one circle. One part of the heating layer 112 is disposed in the micro-pore region 1114, and the other part extends to the blank region 1115. One part of the pin conductive layer 113 is disposed in the blank region 1115, and the other part extends to the micro-pore region 1114. The heating layer 112 and the pin conductive layer 113 have a laminated part in both the blank region 1115 and the micro-pore region 1114.
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It should be noted that the liquid guide channel 1113 is disposed in the micro-pore region 1114. In an implementation, some regions in the micro-pore region 1114 are provided with liquid guide channels 1113, and remaining regions, in which no liquid guide channel 1113 is provided, in the micro-pore region 1114 are provided with a plurality of liquid guide holes 1113a (as shown in FIG. 3) that are independent of each other. When there are a plurality of liquid guide channels 1113 disposed in the micro-pore region 1114, the plurality of liquid guide channels 1113 may be arranged in a regular manner (for example, arranged in an array), or may be arranged in an irregular manner. In an implementation, all regions in the micro-pore region 1114 are used to be provided with the liquid guide channel 1113, that is, the micro-pore region 1114 is provided with a plurality of liquid guide channels 1113, and liquid guide holes 1113a independent of each other are not provided. The plurality of liquid guide channels 1113 may be arranged in a regular manner (for example, arranged in an array), or may be arranged in an irregular manner, which is specifically designed according to a requirement. The plurality of liquid guide channels 1113 provided on the substrate 111 are described in detail below.
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In an implementation, the substrate 111 is provided with a plurality of liquid guide channels 1113, and the plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns (as shown in FIG. 5a to FIG. 13). That is, in a specific embodiment of this application, an isolated liquid guide hole 1113a is not included.
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Optionally, a spacing between any two adjacent rows of liquid guide channels 1113 is the same, and a spacing between any two adjacent columns of liquid guide channels 1113 is the same, so as to facilitate processing, thereby reducing processing difficulty. It may be understood that a spacing between any two adjacent rows of liquid guide channels 1113 may be different, and a spacing between any two adjacent columns of liquid guide channels 1113 may be different, which is specifically designed according to a requirement.
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Optionally, the quantity of liquid guide holes 1113a in each liquid guide channel 1113 is the same, so as to facilitate processing, thereby reducing processing difficulty. It may be understood that the quantity of liquid guide holes 1113a in each liquid guide channel 1113 may alternatively be different, which is specifically designed according to a requirement.
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Optionally, all the liquid guide holes 1113a in each liquid guide channel 1113 in the same row are arranged in a one-dimensional array, so as to facilitate processing, thereby reducing processing difficulty. The plurality of liquid guide holes 1113a in each liquid guide channel 1113 are arranged in a one-dimensional array along the current flow direction of the heating layer 112, and this disposition manner does not affect current passage in the heating layer 112 on the atomization surface 1112. It may be understood that a distribution manner of the plurality of liquid guide holes 1113a in each liquid guide channel 1113 is not limited to one-dimensional array distribution, and is specifically designed according to a requirement.
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In an implementation, cross-sectional shapes of the liquid guide holes 1113a are the same everywhere; and the cross-sectional area of the liquid guide hole 1113a gradually decreases along the direction from the atomization surface 1112 to the liquid absorption surface 1111. Optionally, the cross-sectional shape of the liquid guide hole 1113a is a circle, and the longitudinal sectional shape of the liquid guide hole 1113a is an isosceles trapezoid (as shown in FIG. 3 to FIG. 7b). Optionally, the cross-sectional shape of the liquid guide hole 1113a is a circle, and the longitudinal sectional shape of the liquid guide hole 1113a is a right-angle trapezoid (as shown in FIG. 8a and FIG. 8b). The cross section refers to a section along the direction parallel to the atomization surface 1112, and the longitudinal section refers to a section along the thickness direction of the substrate 111.
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For example, as shown in FIG. 5a and FIG. 5b, and as shown in FIG. 8a and FIG. 8b, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes two liquid guide holes 1113a. The two liquid guide holes 1113a are arranged in one dimension along the current flow direction of the heating layer 112. Ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the liquid absorption surface 1111 are spaced apart from each other. In the direction from the atomization surface 1112 to the liquid absorption surface 1111, the sectional shape of the liquid guide hole 1113a is an isosceles trapezoid (as shown in FIG. 5a and FIG. 5b), or the sectional shape of the liquid guide hole 1113a is a right-angle trapezoid (as shown in FIG. 8a and FIG. 8b).
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For example, as shown in FIG. 6a and FIG. 6b, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes five liquid guide holes 1113a. The five liquid guide holes 1113a are arranged in one dimension along the current flow direction of the heating layer 112. Ports that are of two adjacent liquid guide holes 1113a in the five liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a and that are located on the liquid absorption surface 1111 are spaced apart from each other. In the direction from the atomization surface 1112 to the liquid absorption surface 1111, the sectional shape of the liquid guide hole 1113a is an isosceles trapezoid.
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For example, as shown in FIG. 7a and FIG. 7b, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes 12 liquid guide holes 1113a. The 12 liquid guide holes 1113a are arranged in one dimension along the current flow direction of the heating layer 112. Ports that are of two adjacent liquid guide holes 1113a in the 12 liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a and that are located on the liquid absorption surface 1111 are spaced apart from each other. In the direction from the atomization surface 1112 to the liquid absorption surface 1111, the sectional shape of the liquid guide hole 1113a is an isosceles trapezoid.
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For example, as shown in FIG. 9, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes two liquid guide holes 1113a. An arrangement direction of the two liquid guide holes 1113a form an acute angle with the current flow direction of the heating layer 112, and the arrangement direction of the two liquid guide holes 1113a of each liquid guide channel 1113 forms the same angle with the current flow direction of the heating layer 112. Ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the liquid absorption surface 1111 are spaced apart from each other.
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For example, as shown in FIG. 10, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes two liquid guide holes 1113a. The arrangement direction of the two liquid guide holes 1113a forms an acute angle with the current flow direction of the heating layer 112. Liquid guide channels 1113 in odd-numbered rows and liquid guide channels 1113 in even-numbered rows are arranged axisymmetrically. Ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the liquid absorption surface 1111 are spaced apart from each other.
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For example, as shown in FIG. 11, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes two liquid guide holes 1113a. An arrangement direction of two liquid guide holes 1113a in a liquid guide channels 1113 in an odd-numbered row is parallel to the current flow direction of the heating layer 112, while an arrangement direction of two liquid guide holes 1113a in a liquid guide channels 1113 in an even-numbered row is perpendicular to the current flow direction of the heating layer 112. Ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a of each liquid guide channel 1113 and that are located on the liquid absorption surface 1111 are spaced apart from each other.
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For example, as shown in FIG. 12, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes three liquid guide holes 1113a. Ports that are of any two liquid guide holes 1113a in the three liquid guide holes 1113a and that are located on the atomization surface 1112 overlap with each other, and ports that are of the two liquid guide holes 1113a and that are located on the liquid absorption surface 1111 are spaced apart from each other. Connection lines between the centers of the three liquid guide holes 1113a form an equilateral triangle.
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For example, as shown in FIG. 13, the substrate 111 is provided with a plurality of liquid guide channels 1113. The plurality of liquid guide channels 1113 are arranged in a plurality of rows and a plurality of columns. The row direction is the same as the current flow direction of the heating layer 112. A spacing between two adjacent rows of liquid guide channels 1113 is the same. A spacing between two adjacent columns of liquid guide channels 1113 is the same. Each liquid guide channel 1113 includes four liquid guide holes 1113a. Connection lines of the centers of the four liquid guide holes 1113a form a square. The four liquid guide holes 1113a are arranged in a two-dimensional array, and two liquid guide holes 1113a on the diagonal do not overlap.
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It should be noted that, when all liquid guide holes 1113a in each liquid guide channel 1113 in the same row are arranged in a one-dimensional array (for example, the implementations shown in FIG. 5a to FIG. 7b), the hole-center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is greater than or equal to 20 µm and less than or equal to 60 µm. It may be understood that, the hole-center distance L1 between adjacent liquid guide holes 1113a in each group of liquid guide holes 1113a affects the porosity of the substrate 111, thereby affecting a liquid supply capability. The hole-center distance L1 is set to be greater than or equal to 20 µm and less than or equal to 60 µm, so that the substrate 111 has a good liquid supply capability and can ensure strength of the substrate 111; and/or the hole-center distance L2 between two adjacent rows of liquid guide channels 1113 is greater than or equal to 60 µm and less than or equal to 140 µm. It may be understood that, the hole-center distance L2 between two adjacent rows of liquid guide channels 1113 affects a current flow area on the heating layer 112, and further affects resistance of the heating layer 112. The hole-center distance L2 is set to be greater than or equal to 60 µm and less than or equal to 140 µm, to ensure an effective width of a part of the heating layer 112 between two adjacent rows of the liquid guide channels 1113. The substrate 111 has high porosity while avoiding excessive resistance in the heating layer 112 that would cause localized overheating, thereby preventing issues such as fracture or fusing of the heating layer 112.
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The aperture of the liquid guide hole 1113a is greater than or equal to 20 µm and less than or equal to 60 µm, and the hole-center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is greater than or equal to 20 µm and less than or equal to 60 µm. The foregoing design is performed for the aperture of the liquid guide hole 1113a and the hole-center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113, so as to control an overlapping area of the adjacent liquid guide holes 1113a in the liquid guide channel 1113 on the atomization surface 1112.
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For example, the hole-center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is greater than or equal to 20 µm and less than or equal to 40 µm. For example, the hole-center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is 30 µm. For example, the hole-center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is 50 µm. For example, the hole-center distance L2 between two adjacent rows of liquid guide channels 1113 is greater than or equal to 60 µm and less than or equal to 100 µm. For example, the hole-center distance L2 between two adjacent rows of the liquid guide channels 1113 is greater than or equal to 80 µm and less than or equal to 120 µm.
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In an implementation, the substrate 111 is a dense substrate. Optionally, the material of the substrate 111 is at least one of glass and dense ceramic. It may be understood that the material of the substrate 111 includes, but is not limited to, glass and dense ceramic, and is specifically designed according to a requirement. When the substrate 111 is made of a dense material such as glass, the smooth surface of the substrate 111 allows for deposition of a continuous and stable metal film on the substrate 111 via physical vapor deposition or chemical vapor deposition to form the heating layer 112. The thickness of the heating layer 112 ranges from several micrometers to nanometers, which not only enables miniaturization of the heating assembly 11 but also conserves the material used for the heating layer 112.
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In an implementation, the substrate 111 is a porous substrate. Optionally, the material of the substrate 111 is porous ceramic. Porous ceramic is a type of porous ceramic material with an open-cell aperture and high open porosity, prepared through forming and specific high-temperature sintering processes of raw materials. A plurality of disordered pores are formed in the porous ceramic during the preparation process.
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In an implementation, the thickness of the substrate 111 is 0.5 mm-2.5 mm. When the thickness of the substrate 111 is greater than 2.5 mm, liquid supply requirements cannot be met, leading to a decrease in the aerosol amount and causing significant heat loss. It becomes difficult to penetrate during formation of the liquid guide hole 1113a, resulting in high costs for creating the liquid guide hole 1113a. When the thickness of the substrate 111 is less than 0.5 mm, the strength of the substrate 111 cannot be guaranteed, which is inconducive to improving the performance of the electronic atomization device. Optionally, the thickness of the substrate 111 is 0.5 mm-1 mm. Optionally, the thickness of the substrate 111 is 1.5 mm-2.5 mm.
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In an implementation, the liquid absorption surface 1111 and the atomization surface 1112 are disposed parallel to each other, to facilitate processing and assembly.
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Referring to FIG. 14, FIG. 14 is a comparison diagram of atomization amounts of different implementations of a substrate.
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This application further performs test comparison on different implementations of the substrate 111, including a first test part, a second test part, a third test part, and a fourth test part. The first test part is a substrate structure in a conventional technology. A plurality of liquid guide holes on the substrate are independent of each other, and the plurality of liquid guide holes are arranged in a plurality of rows and a plurality of columns. The second test part is the substrate 111 shown in
FIG. 5a and
FIG. 5b. The third test part is the substrate 111 shown in
FIG. 6a and
FIG. 6b. The fourth test part is the substrate 111 shown in
FIG. 7a and
FIG. 7b. Test results are shown in the following Table 1 and
FIG. 14.
Table 1 | Solution | D1 µm | D2 µm | L1 µm | L2 µm | Substrate volume µm3 | Perforation volume µm3 | Porosity | Atomization amount mg |
| First test part | | | | | 0.157 | 0.0214 | 12.0% | 9.03 |
| Second test part | 50 | 30 | 45 | 100 | 0.149 | 0.0294 | 16.5% | 9.47 |
| Third test part | 0.142 | 0.0364 | 20.4% | 9.36 |
| Fourth test part | | | | | 0.118 | 0.0604 | 33.9% | 9.35 |
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D1 is the port aperture of the liquid guide hole 1113a on the atomization surface 1112. D2 is the port aperture of the liquid guide hole 1113a on the liquid absorption surface 1111. For the first test part, L1 is a spacing between two adjacent columns of liquid guide holes, and L2 is a spacing between two adjacent rows of liquid guide holes. For the second test part to the fourth test part, L1 is a hole-center distance between adjacent liquid guide holes 1113a in each group of liquid guide channels 1113, and L2 is a hole-center distance between two adjacent rows of liquid guide channels 1113.
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It can be known according to Table 1 and FIG. 14 that, the disposition manner of the liquid guide hole 1113a of the substrate 111 provided in this application improves the porosity and the atomization amount.
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The foregoing descriptions are merely implementations of this application, and the patent scope of this application is not limited thereto. All equivalent structure or process changes made according to the content of this specification and accompanying drawings in this application or by directly or indirectly applying this application in other related technical fields shall similarly fall within the patent protection scope of this application.