EP4663818A4 - Plattiertes element und verschlussleiste - Google Patents

Plattiertes element und verschlussleiste

Info

Publication number
EP4663818A4
EP4663818A4 EP23921022.2A EP23921022A EP4663818A4 EP 4663818 A4 EP4663818 A4 EP 4663818A4 EP 23921022 A EP23921022 A EP 23921022A EP 4663818 A4 EP4663818 A4 EP 4663818A4
Authority
EP
European Patent Office
Prior art keywords
closure strip
plated element
plated
closure
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23921022.2A
Other languages
English (en)
French (fr)
Other versions
EP4663818A1 (de
Inventor
Yuki Urita
Makoto Sasaki
Takuya Abe
Takashi Nakamura
Masayuki Iimori
Ryosuke Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YKK Corp
Original Assignee
YKK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YKK Corp filed Critical YKK Corp
Publication of EP4663818A1 publication Critical patent/EP4663818A1/de
Publication of EP4663818A4 publication Critical patent/EP4663818A4/de
Pending legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
    • A44B19/00—Slide fasteners
    • A44B19/42—Making by processes not fully provided for in one other class, e.g. B21D53/50, B21F45/18, B22D17/16, B29D5/00
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
    • A44B19/00—Slide fasteners
    • A44B19/02—Slide fasteners with a series of separate interlocking members secured to each stringer tape
    • A44B19/04—Stringers arranged edge-to-edge when fastened, e.g. abutting stringers
    • A44B19/06—Stringers arranged edge-to-edge when fastened, e.g. abutting stringers with substantially rectangular members having interlocking projections and pieces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/02—Slide fasteners
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrotherapy Devices (AREA)
EP23921022.2A 2023-02-06 2023-02-06 Plattiertes element und verschlussleiste Pending EP4663818A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/003857 WO2024166186A1 (ja) 2023-02-06 2023-02-06 めっき材、及びファスナーストリンガー

Publications (2)

Publication Number Publication Date
EP4663818A1 EP4663818A1 (de) 2025-12-17
EP4663818A4 true EP4663818A4 (de) 2026-05-20

Family

ID=92262124

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23921022.2A Pending EP4663818A4 (de) 2023-02-06 2023-02-06 Plattiertes element und verschlussleiste

Country Status (7)

Country Link
EP (1) EP4663818A4 (de)
JP (1) JP7847678B2 (de)
KR (1) KR20250145049A (de)
CN (1) CN120584220A (de)
MX (1) MX2025009144A (de)
TW (1) TWI887832B (de)
WO (1) WO2024166186A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN122160683B (zh) * 2026-04-30 2026-07-21 歌尔股份有限公司 一种导磁板组件、发声装置和电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080038574A1 (en) * 2004-07-07 2008-02-14 Cheng-Fu Yu Electronic Component Having Tin Rich Deposit Layer and the Process for Depositing the Same
EP3611294A1 (de) * 2017-04-14 2020-02-19 YKK Corporation Galvanisierungsverfahren und -vorrichtung
CN111254467A (zh) * 2020-01-20 2020-06-09 广东省焊接技术研究所（广东省中乌研究院） 一种梯度结构镍钨合金、制备方法及新型层状结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166910A (ja) * 2003-12-02 2005-06-23 Fujikura Ltd プリント配線板およびその製造方法
JP5940256B2 (ja) * 2011-07-13 2016-06-29 住友金属鉱山株式会社 銅電気めっき方法及びその銅電気めっき方法を用いて成膜された銅めっき被膜を有する金属化樹脂フィルム
JP2013133504A (ja) * 2011-12-27 2013-07-08 Toyama Sumitomo Denko Kk 金属多孔体の製造方法及び金属多孔体
US9388502B2 (en) * 2012-07-12 2016-07-12 Ykk Corporation Button or fastener member of copper-plated aluminum or aluminum alloy and method of production thereof
US11781234B2 (en) * 2018-12-26 2023-10-10 Mitsubishi Materials Corporation Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products
JP7596662B2 (ja) * 2019-08-06 2024-12-10 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
JP7604778B2 (ja) * 2020-03-19 2024-12-24 三菱マテリアル株式会社 Ｃｕ－Ｎｉ－Ｓｉ系銅合金板、めっき皮膜付Ｃｕ－Ｎｉ－Ｓｉ系銅合金板及びこれらの製造方法
CN117836472A (zh) * 2021-08-06 2024-04-05 Ykk株式会社 拉链牙链带、拉链链条及拉链的制造方法、以及电镀装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080038574A1 (en) * 2004-07-07 2008-02-14 Cheng-Fu Yu Electronic Component Having Tin Rich Deposit Layer and the Process for Depositing the Same
EP3611294A1 (de) * 2017-04-14 2020-02-19 YKK Corporation Galvanisierungsverfahren und -vorrichtung
CN111254467A (zh) * 2020-01-20 2020-06-09 广东省焊接技术研究所（广东省中乌研究院） 一种梯度结构镍钨合金、制备方法及新型层状结构

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2024166186A1 *

Also Published As

Publication number Publication date
TW202432901A (zh) 2024-08-16
JP7847678B2 (ja) 2026-04-17
JPWO2024166186A1 (de) 2024-08-15
CN120584220A (zh) 2025-09-02
EP4663818A1 (de) 2025-12-17
WO2024166186A1 (ja) 2024-08-15
MX2025009144A (es) 2025-09-02
TWI887832B (zh) 2025-06-21
KR20250145049A (ko) 2025-10-13

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A4 Supplementary search report drawn up and despatched

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RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 7/02 20060101AFI20260416BHEP

Ipc: A44B 19/42 20060101ALI20260416BHEP

Ipc: C25D 5/10 20060101ALI20260416BHEP

Ipc: C25D 17/16 20060101ALI20260416BHEP

Ipc: A44B 19/06 20060101ALI20260416BHEP

Ipc: C25D 5/00 20060101ALI20260416BHEP

Ipc: C25D 5/22 20060101ALI20260416BHEP

Ipc: C25D 7/06 20060101ALI20260416BHEP

Ipc: C25D 17/00 20060101ALI20260416BHEP

Ipc: C25D 21/10 20060101ALI20260416BHEP