EP4409243A4 - Etalonthermometrie für plasmaumgebungen - Google Patents

Etalonthermometrie für plasmaumgebungen

Info

Publication number
EP4409243A4
EP4409243A4 EP22877102.8A EP22877102A EP4409243A4 EP 4409243 A4 EP4409243 A4 EP 4409243A4 EP 22877102 A EP22877102 A EP 22877102A EP 4409243 A4 EP4409243 A4 EP 4409243A4
Authority
EP
European Patent Office
Prior art keywords
thermometry
etalon
plasma environments
environments
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22877102.8A
Other languages
English (en)
French (fr)
Other versions
EP4409243A1 (de
Inventor
Bruce E Adams
Samuel C Howells
Alvaro Garcia
Barry P Craver
Tony Jefferson Gnanaprakasa
Lei Lian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP4409243A1 publication Critical patent/EP4409243A1/de
Publication of EP4409243A4 publication Critical patent/EP4409243A4/de
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/58—Radiation pyrometry, e.g. infrared or optical thermometry using absorption; using extinction effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance
    • G01K11/125—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance using changes in reflectance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/58—Radiation pyrometry, e.g. infrared or optical thermometry using absorption; using extinction effect
    • G01J2005/583—Interferences, i.e. fringe variation with temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24571—Measurements of non-electric or non-magnetic variables
    • H01J2237/24585—Other variables, e.g. energy, mass, velocity, time, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
EP22877102.8A 2021-09-28 2022-09-06 Etalonthermometrie für plasmaumgebungen Pending EP4409243A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/487,993 US12078547B2 (en) 2021-09-28 2021-09-28 Etalon thermometry for plasma environments
PCT/US2022/042598 WO2023055537A1 (en) 2021-09-28 2022-09-06 Etalon thermometry for plasma environments

Publications (2)

Publication Number Publication Date
EP4409243A1 EP4409243A1 (de) 2024-08-07
EP4409243A4 true EP4409243A4 (de) 2025-11-26

Family

ID=85721881

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22877102.8A Pending EP4409243A4 (de) 2021-09-28 2022-09-06 Etalonthermometrie für plasmaumgebungen

Country Status (7)

Country Link
US (2) US12078547B2 (de)
EP (1) EP4409243A4 (de)
JP (1) JP7809797B2 (de)
KR (1) KR20240047466A (de)
CN (1) CN117999470A (de)
TW (2) TWI890955B (de)
WO (1) WO2023055537A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025258574A1 (ja) * 2024-06-11 2025-12-18 国立大学法人広島大学 温度測定装置、温度測定方法及びプログラム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150221535A1 (en) * 2014-01-31 2015-08-06 Andrew Nguyen Temperature measurement using silicon wafer reflection interference
US20200025631A1 (en) * 2018-07-19 2020-01-23 Applied Materials, Inc. Temperature measurement using etalons

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5263776A (en) 1992-09-25 1993-11-23 International Business Machines Corporation Multi-wavelength optical thermometry
US5682236A (en) 1993-07-02 1997-10-28 Metrolaser Remote measurement of near-surface physical properties using optically smart surfaces
US20010026357A1 (en) 1996-04-26 2001-10-04 Nikon Corporation Position transducer and exposure apparatus with same
KR20120001929A (ko) 2010-06-30 2012-01-05 주식회사 나노트론 반도체 성장 장비용 실시간 데이터 측정 장치
JP5575600B2 (ja) 2010-09-30 2014-08-20 東京エレクトロン株式会社 温度測定方法、記憶媒体、プログラム
WO2013148066A1 (en) 2012-03-30 2013-10-03 Applied Materials, Inc. Laser noise elimination in transmission thermometry
JP5993207B2 (ja) 2012-05-22 2016-09-14 東京エレクトロン株式会社 光干渉システム及び基板処理装置
WO2016073506A1 (en) 2014-11-05 2016-05-12 Coriant Advanced Technology, LLC Photonic integrated circuit incorporating a bandgap temperature sensor
JP6944347B2 (ja) * 2017-11-07 2021-10-06 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
KR102421732B1 (ko) * 2018-04-20 2022-07-18 삼성전자주식회사 반도체 기판 측정 장치 및 이를 이용한 플라즈마 처리 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150221535A1 (en) * 2014-01-31 2015-08-06 Andrew Nguyen Temperature measurement using silicon wafer reflection interference
US20200025631A1 (en) * 2018-07-19 2020-01-23 Applied Materials, Inc. Temperature measurement using etalons

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2023055537A1 *
SITTER H ET AL: "Exact determination of the real substrate temperature and film thickness in vacuum epitaxial growth systems by visible laser interferometry", VACUUM VOL. 46 NUMBER 1 JAN. 1995, 1 January 1995 (1995-01-01), Great Britain, pages 69 - 76, XP093325091, Retrieved from the Internet <URL:https://www.sciencedirect.com/science/article/pii/0042207X94E0019U?pes=vor&utm_source=scopus&getft_integrator=scopus> [retrieved on 20251014], DOI: 10.1016/0042-207X(94)E0019-U *

Also Published As

Publication number Publication date
TW202542492A (zh) 2025-11-01
KR20240047466A (ko) 2024-04-12
US12078547B2 (en) 2024-09-03
US20230102821A1 (en) 2023-03-30
JP2024536097A (ja) 2024-10-04
TW202326083A (zh) 2023-07-01
TWI890955B (zh) 2025-07-21
WO2023055537A1 (en) 2023-04-06
US20240385048A1 (en) 2024-11-21
EP4409243A1 (de) 2024-08-07
CN117999470A (zh) 2024-05-07
JP7809797B2 (ja) 2026-02-02

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