EP4363828A1 - Dispositif de détection et procédé de caractérisation d'un copeau de métal - Google Patents

Dispositif de détection et procédé de caractérisation d'un copeau de métal

Info

Publication number
EP4363828A1
EP4363828A1 EP22736286.0A EP22736286A EP4363828A1 EP 4363828 A1 EP4363828 A1 EP 4363828A1 EP 22736286 A EP22736286 A EP 22736286A EP 4363828 A1 EP4363828 A1 EP 4363828A1
Authority
EP
European Patent Office
Prior art keywords
chip
signal
span
classifier
sensor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22736286.0A
Other languages
German (de)
English (en)
Inventor
Michael AUFREITER
Daniel Kagerbauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Immox GmbH
Original Assignee
Immox GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Immox GmbH filed Critical Immox GmbH
Publication of EP4363828A1 publication Critical patent/EP4363828A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M13/00—Testing of machine parts
    • G01M13/02—Gearings; Transmission mechanisms
    • G01M13/021—Gearings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/02—Investigating particle size or size distribution
    • G01N15/0266—Investigating particle size or size distribution with electrical classification
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/10—Investigating individual particles
    • G01N15/1031—Investigating individual particles by measuring electrical or magnetic effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/80—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating mechanical hardness, e.g. by investigating saturation or remanence of ferromagnetic material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/10—Investigating individual particles
    • G01N2015/1029—Particle size

Definitions

  • the present invention relates to a sensor device for characterizing a chip.
  • the present invention relates to a method for characterizing a chip with a sensor device.
  • Gears are used for the transmission and conversion of movements, energy and/or forces and are used for this purpose in various technical systems, such as in wind turbines, on ships, in helicopters, in cable cars or in vehicles.
  • gears wear out in practical use because they are mechanically stressed during the transmission and transformation of movement, energy and/or forces.
  • functionally important components such as gears or roller bearings are lubricated with the aim of achieving a hydrodynamic lubricating state in order to reduce mechanical friction in the transmission and to protect the transmission from overheating.
  • a hydrodynamic lubricating state cannot always be guaranteed, for example due to dynamic loads and starting and braking processes, so that components in the transmission wear out.
  • Different types of damage such as pit damage, micropitting or galling, occur in gears as well as in rolling or plain bearings.
  • the damage or damage patterns are subject to different technical standards (e.g. DIN 3979). As these standards also define, wear is understood there as the removal of material by which two bodies slide against one another. In the following, this damage is referred to as wear.
  • the wear or the gear detachments thus enter the lubricating circuit and are present as artefacts in the form of metal particles or metal chips in the lubricating circuit.
  • other suspended matter or different phases in the lubricating circuit such as non-metallic particles, such as soot or air bubbles, can also be present.
  • gearbox maintenance or gearbox repairs are sometimes associated with a great deal of effort, such maintenance work or repairs can lead to long downtimes, which can sometimes result in high costs.
  • a high level of operational reliability is desired, such as in helicopters, and there wear and tear must be monitored to a particular extent.
  • a known way of monitoring transmissions are so-called particle counters, which count the number of metallic wear particles from transmission components. These particle counters use either optical or electrical methods. If the electrical method is used, an electrical field is induced in a lubricant line, for example, in order to count metal chips.
  • optical systems In order to increase the safety, plannability and economic efficiency of a technical system with a transmission, it would therefore be desirable not only to verify the wear quantitatively by counting particles, but also to be able to evaluate the wear qualitatively and to subdivide it into critical and non-critical wear phenomena. divorce This is currently only possible through laboratory tests or through on-site "assessments" by an expert.
  • the publications EP 1 933 129 B1, EP 3 349 000 A1 each relate to devices and methods, wherein an impedance change caused by the metal particles is compared between a measuring coil and a reference coil to characterize metal particles.
  • Document EP 2 121 203 B1 identifies metal objects on a conveyor belt by comparing a magnetically unaffected state of a coil with a magnetically influenced state.
  • the publications DE 102010011 936 A1 and WO 2015 140411 A2 relate to a measuring arrangement for analyzing samples in a sample container.
  • the document EP 2 455 774 A1 relates to a sensor device with a chip catcher with a permanent magnet. If the attractive effect of the permanent magnet is to be neutralized, an opposing field is generated with an induction coil and the magnetically held chip can be removed.
  • the object of the present invention is therefore to address one of the problems mentioned above, to improve the general prior art or to provide an alternative to what was previously known.
  • a solution is to be provided with which, in addition to detecting a chip, continuous monitoring and evaluation of the chip is also made possible in order to be able to assess a potential risk of wear on site and during operation.
  • a sensor device for characterizing a chip is provided.
  • Characterizing means that properties of the chip are identified or determined with the sensor device, such as a degree of hardness of the chip, a chip size, ie its volume, or a material from which the chip is formed.
  • the degree of hardness can also be understood synonymously as a hardness class.
  • the characterization can also be understood as an analysis of the span. It is therefore proposed to characterize and evaluate a chip with the sensor device on site and during operation.
  • the chip is a particle that has become detached from a gear part, for example.
  • the chip can thus be understood as a metal particle or metallic contamination.
  • the chip can also be referred to synonymously as a chip.
  • the chip is preferably a metal chip or a metallic chip.
  • the sensor submission includes a chip analysis area, where the chip analysis area is a spatial area.
  • the chip analysis area describes a spatial area in which the characterization or analysis of the chip is carried out.
  • the chip can be held in the analysis area by a chip catcher, for example, in order to provide a stationary analysis of the chip in the analysis area.
  • the chip analysis area is a spatial section within a lubricating line in a lubricating oil circuit of a transmission or a spatial section in a coolant line in a coolant circuit.
  • the sensor application includes a signal generator with at least one transmission coil, the signal generator being set up to generate an electrical excitation signal and to couple it with the transmission coil as a magnetic signal into the chip analysis area.
  • an electrical signal with a signal generator, for example with a function generator as the signal source, which is electrically conductively connected to the transmission coil.
  • the electrical excitation signal can, for example, be an alternating signal, for example a sinusoidal signal.
  • the transmission coil is, for example, a copper coil wound around a magnetic core.
  • the transmission coil can also be interpreted synonymously as an excitation coil. Coupling can also be understood as induction. It is thus proposed to introduce an electromagnetic signal into the chip analysis area in which a chip or chips is or are arranged. The chip or, if applicable, the chips are thus excited by the excitation signal, which is coupled into the chip analysis area as a magnetic signal.
  • the signal generator with the transmitter coil can thus also be understood as a transmitter unit that introduces an electrical signal as a magnetic signal into the chip analysis area for electrical or magnetic excitation of the chip.
  • the sensor device also includes a chip classifier with at least one receiver sensor, the chip classifier being set up to receive a chip signal from the chip analysis area with the receiver sensor, the chip signal being a is the magnetization signal excited by the excitation signal, which is generated by at least one chip to be classified.
  • the receiver sensor is, for example, a receiver coil, a receiving element that is set up to use the Hall effect to receive the span signal (Hall sensor), a receiving element that is set up to use the magnetoresistive effect to receive the span signal (magnetore - sistiver sensor), or the like. It is therefore proposed to measure the span signal with the receiver sensor.
  • the sensor device preferably comprises a chip classifier with at least one receiver coil, with the chip classifier being set up to receive a chip signal from the chip analysis area with the receiver coil, with the chip signal being a magnetization signal excited by the excitation signal, which is generated by at least one chip to be classified.
  • the span signal is a magnetic signal that the span generates due to its excitation by the excitation signal.
  • an electromagnetic signal is introduced into the chip analysis area for electrical or magnetic excitation of the chip with the signal generator and the transmission coil.
  • the chip generates a measurable signal that is measured out of phase with the excitation signal, preferably with a receiver coil.
  • the span signal induces a voltage in the receiver coil and generates a measurable voltage or current.
  • the span classifier can thus also be understood as a receiving or measuring unit that measures the span signal, preferably with a receiver coil.
  • the receiver coil can be formed from a large number of coils which are connected together in an array.
  • the receiver coil or coils and/or the transmitter coil is or are wound copper coils, for example.
  • This basic principle applies analogously to at least one receiver sensor that is designed with a receiving element that is set up to use a Hall effect and/or a magnetoresistive effect to receive the span signal. Due to the magnetic excitation, the span generates a measurable signal, which is measured with the receiving element out of phase with the excitation signal, namely the span signal. The span signal induces a voltage in the receiving element and generates a measurable voltage or current or leads to a measurable change in resistance in the receiving element.
  • the span classifier can thus also be used as a receiving or measuring unit that measures the span signal with a Hall sensor and/or a magnetoresistive sensor.
  • a receiving element that is set up to use a Hall effect and/or a magnetoresistive effect to receive the chip signal can also be referred to as a Hall sensor and/or magnetoresistive sensor.
  • the receiving element can be formed from a large number of sensors which are interconnected in an array.
  • a plurality of one item or one object is present if at least two items or objects are present.
  • the chip classifier is also set up to classify the at least one chip in the chip analysis area by evaluating a phase shift between the excitation signal and the chip signal and/or an amplitude of the chip signal.
  • the chip classifier also works as an evaluation unit or comprises such a unit.
  • the span classifier thus takes into account the excitation signal and the span signal and can determine and/or further process a phase shift between the two signals. Additionally or alternatively, the span classifier can determine and/or further process an amplitude of the span signal.
  • the phase shift is also known as phase difference or phase position and describes, for example, two sinusoidal oscillations whose phase angles are shifted relative to one another if their period durations are the same but the times of their zero crossings are different.
  • the amplitude of the span signal describes the maximum deflection of the span signal from the position of the arithmetic mean. The amplitude is also known as the peak value.
  • Classification thus refers to the fact that the properties of the chip to be classified are to be determined, such as a degree of hardness or a hardness class of the chip, a chip size or a chip material. It goes without saying that the classification also includes a detection of the chip. Accordingly, the sensor device is also set up to detect the at least one chip in the chip analysis area by evaluating a phase shift between the excitation signal and the chip signal and/or an amplitude of the chip signal. It is preferably proposed to evaluate or take into account an absolute value of the amplitude of the span signal for characterizing the span. It is therefore proposed to determine the amplitude as an absolute value.
  • metal chips with different properties can be present and the different properties allow conclusions to be drawn about the extent and/or origin of the damage or wear.
  • degree of hardness of the chip is a suitable indicator of whether there is critical or less critical gear damage or gear wear.
  • a degree of hardness of the chip can be inferred. If, for example, a hard-magnetic chip is detected, it can be assumed that a more critical gear part has been damaged. Critical gear parts are usually hardened and therefore have hard magnetic properties. If, on the other hand, a soft-magnetic chip is detected, non-critical wear can be assumed, since soft-magnetic metals are used on less relevant gear components.
  • a chip size can also be determined by evaluating the phase shift and/or the amplitude.
  • the chip size can also be understood as the chip volume. If a large chip is detected, the extent of the damage to a transmission part can thus be inferred.
  • phase shift and/or the amplitude it is also possible to determine a material of the chip, since the chips made from different materials have different magnetic properties, such as different susceptibility.
  • chips as a wear indicator in the lubricating circuit of a gearbox.
  • the characterization of the chips is carried out by evaluating the phase shift between the excitation signal and the chip signal and/or the amplitude of the chip signal.
  • An intelligent sensor for monitoring the condition of a transmission is thus provided, which can be used in different technical systems.
  • phase shift between the excitation signal and the chip signal and/or an amplitude of the chip signal is optional in embodiments in order to analyze the at least one chip in the chip analysis area classify.
  • Other or further evaluation methods can be provided in order to classify the at least one chip in the chip analysis area.
  • the chip classifier is preferably set up to classify the at least one chip in the chip analysis area as a function of the chip signal and/or the excitation signal using an evaluation method, namely using at least one evaluation method from the list of evaluation methods having:
  • Classification by means of a frequency analysis for example by means of a Fourier transform such as a DFT (Discrete Fourier Transform), an FFT (Fast Fourier Transform) or an STFT (Short-Time Fourier Transform); - Classification using a wavelet analysis;
  • a Fourier transform such as a DFT (Discrete Fourier Transform), an FFT (Fast Fourier Transform) or an STFT (Short-Time Fourier Transform); - Classification using a wavelet analysis;
  • the chip classifier is preferably set up at least to determine a degree of hardness, a chip size and/or a chip material of the at least one chip to be classified. These variables are determined by deriving or determining magnetic parameters such as an area under a hysteresis curve, magnetization or other magnetic properties by evaluating the phase shift and/or the amplitude of the span signal and/or by evaluating them using an evaluation method. to be determined.
  • the receiver sensor is preferably designed with a receiver coil.
  • a chip classifier with at least one receiver coil is therefore proposed, with the chip classifier being set up to receive a chip signal from the chip analysis area with the receiver coil, with the chip signal being a magnetization signal excited by the excitation signal, which is generated by at least one chip to be classified.
  • the mode of operation with a receiver coil has already been described above.
  • the span signal induces a voltage in the receiver coil and produces a measurable voltage or current.
  • the span classifier can thus also be understood as a receiving or measuring unit that measures the span signal with a receiver coil.
  • the receiver sensor is preferably designed with a receiving element that is set up to use a Hall effect and/or a magnetoresistive effect to receive the span signal.
  • the chip classifier is thus set up to Receiving a chip signal from the chip analysis area with a Hall sensor and/or with a magnetoresistive sensor. It is therefore proposed to use a Hall sensor and/or a magnetoresistive sensor as a receiver for the chip signal in addition or as an alternative to the receiver coil. Hall effect and magnetoresistive effect are known in principle. It is therefore proposed to use sensors for measuring magnetic fields or magnetic signals that use the Hall effect and/or the magnetoresistive effect.
  • the chip signal from the chip analysis area is thus measured with the Hall sensor and/or the magnetoresistive sensor, the chip signal being a magnetization signal excited by the excitation signal, which is generated by at least one chip to be classified.
  • a combination of receiver coil, Hall sensor and/or magnetoresistive sensor can also be provided.
  • the chip classifier evaluates an in-phase component to identify a chip size of the chip and/or a chip material of the chip, which more preferably is proportional to a magnetization of the chip.
  • the so-called in-phase component is known from signal processing and is determined by demodulating the excitation signal and the span signal with the original phase position (English: in phase). It has been recognized here that the in-phase component is proportional to a magnetization of the chip. The magnetization can be used to draw conclusions about the chip size and/or the chip material.
  • the chip classifier evaluates an out-of-phase component to identify a degree of hardness of the chip and/or a chip material, which more preferably is proportional to an area under a hysteresis curve of the chip.
  • the so-called out-of-phase component is also known from signal processing and is determined by demodulating the excitation signal and the span signal with a fixed, phase-shifted reference frequency.
  • the out-of-phase component is also known as quadrature. It has been recognized herein that the out-of-phase component is proportional to an area under a hysteresis curve of the span. It was also recognized that the area under the hysteresis curve allows conclusions to be drawn about the degree of hardness of the chip.
  • a narrow hysteresis curve with a larger saturation magnetization is indicative of a low degree of hardness (magnetically soft) and a broad and flatter hysteresis curve in comparison is an indicator of a higher degree of hardness (magnetically hard).
  • different hardness classes can be determined by evaluating the out-of-phase component. It goes without saying that the in-phase component and the out-of-phase component are determined from the excitation signal and/or the span signal, for example by means of a frequency analysis.
  • the excitation signal is an AC voltage signal, for example a sinusoidal, a triangular or a square-wave AC voltage signal.
  • the use of an AC voltage signal as the excitation signal is advantageous because the span signal can be measured multiple times and out of phase, since it is repeatedly excited by the alternating AC voltage signal.
  • the AC voltage signal can also be implemented as an AC signal.
  • the excitation signal has a frequency which is in a frequency range from 100 Hz to 10 kHz.
  • This frequency range is a frequency range with which the penetration depth of the excitation signal can also be set and the span signal can thus be tuned if, for example, it cannot be measured well enough.
  • the frequency of the excitation signal is varied in a predefined sequence in order to vary the penetration depth of the excitation signal into the chip. It is therefore proposed that the excitation signal is not operated at a constant frequency, but that a frequency change is carried out. In a specific example, a first frequency is first set for a first period of time, then the frequency is changed, and a second frequency is set for a second period of time. The penetration depth of the excitation signal as a magnetic signal in the chip can also be adjusted.
  • the signal generator is set up to generate the electrical excitation signal with a sinusoidal curve and/or a triangular curve and/or a rectangular curve in order to set a penetration depth of the excitation signal into the chip.
  • the electrical excitation signal is particularly preferably designed with a sine curve, since the sine signal causes fewer harmonics in the chip signal. It is preferably proposed that the chip classifier has a material database, with material data being stored in the material database.
  • comparison data such as coercive field strengths, susceptibilities, remanences, magnetic saturations or hysteresis curves are provided as material data.
  • the material data are interpolated and can be stored as data sets in a storage unit.
  • the storage for the material data can be part of the chip classifier or it can be an external database. It goes without saying that in the latter case the span classifier is set up accordingly to read out the external database.
  • the chip classifier be set up to determine at least a first hardness class and/or a second hardness class of the chip by comparing it with the material data.
  • the first hardness class can, for example, be a hardness class that indicates that the classified chip has a soft-magnetic design.
  • the second hardness class can, for example, be a hardness class that indicates that the classified chip is hard-magnetic. Further intermediate gradations of the hardness classes can also be provided.
  • the chip classifier be set up to determine at least one chip size of the chip by comparing it with the material data.
  • the chip size can also be considered as a volume.
  • the chip size can be determined from the comparison data described above.
  • the chip classifier be set up to determine at least one chip material of the chip by comparing it with the material data.
  • Chip material describes the material from which the chip is formed, such as hardened steel.
  • the material data preferably include at least one comparison signal profile. It is therefore proposed that at least one comparison signal curve is part of the material data and the recorded chip signal can be compared with the comparison signal curve. A large number of comparison signal curves can also be stored in the material data, which can be interpreted as a characteristic diagram. Accordingly, it is proposed that the chip to be classified in the chip analysis area be compared to classify with the at least one comparison waveform in order to determine, for example, the degree of hardness of the chip, the chip size or the chip material.
  • the presence of the first and/or second hardness class is determined by comparing the chip signal with the comparison signal curves.
  • the chip classifier is preferably set up to determine whether the first and/or second hardness class is present by comparing the chip signal with the comparison signal curves.
  • the chip classifier be designed with a multiplicity of receiver coils, with the receiver coils being distributed over a sensor surface within a sensor head.
  • the chip classifier be designed with a large number of Hall sensors and/or magnetoresistive sensors, with the Hall sensors and/or magnetoresistive sensors being distributed on a sensor surface within a sensor head.
  • a localization of the span can be provided.
  • a local determination of the chip can also be provided by using a plurality of Hall sensors and/or magnetoresistive sensors. The local determination relates to the position of the chip on the sensor head. The location determination is intended to detect multiple different chips to provide an independent characterization of different chips placed on the sensor head.
  • a determination of the size of the chip can additionally or alternatively be provided. Additionally or alternatively, a size determination of the chip can additionally or alternatively be provided by using a multiplicity of Hall sensors and/or magnetoresistive sensors. For example, if a span is arranged over several receiver coils, the span size can be determined by evaluating the span signals of the receiver coils that are arranged in the vicinity of the span to be classified. The reflected span signal is most pronounced there.
  • the coils can be connected up as an array and read out individually with a selection circuit, for example with a multiplexer.
  • a chip is arranged over several Hall sensors and/or magnetoresistive sensors, by evaluating the chip signals from the Hall sensors and/or magnetoresistive sensors placed in the vicinity of the chip to be classified, the chip size is determined. The reflected span signal is most pronounced there.
  • the Hall sensors and/or magnetoresistive sensors can be connected up as an array and read out individually with a selection circuit, for example with a multiplexer or a bus system.
  • the receiver coils are distributed in a honeycomb pattern within a sensor head.
  • the Hall sensors and/or magnetoresistive sensors are distributed within a sensor head in a chessboard pattern, i.e., like a chessboard, next to each other in two directions. The packing density can thus be increased.
  • the at least one receiver coil preferably has a coil axis which is designed to be essentially normal with respect to a sensor surface plane. This orientation to the sensor surface allows the influence of the exciter signal on the chip signal to be minimized. With this arrangement, an excitation field is formed that is normal to the receiver coil. This minimizes the influence of the excitation signal on the receiver coil. Additionally or alternatively, the at least one Hall sensor and/or magnetoresistive sensor has at least one sensor axis, which is designed to be perpendicular to a sensor surface plane, in particular to minimize an influence of the exciter signal on the chip signal.
  • the Hall sensor and/or magnetoresistive sensor in such a way that it measures the excitation signal as little as possible or at least one axis of a multi-axis sensor measures the excitation signal as little as possible.
  • the at least one Hall sensor and/or the at least one magnetoresistive sensor is designed with multiple axes, in particular three axes. This minimizes the influence of the excitation signal on the receiver coil.
  • the sensor device preferably has a chip catcher in order to keep the at least one chip to be classified in the chip analysis area. It is therefore proposed to provide a device that keeps the chip or chips to be classified stationary in the chip analysis area. This can also be interpreted as catching the chip or chips.
  • the chip catcher is set up to hold the at least one chip to be classified magnetically with a magnetic field in the chip analysis area.
  • the chip catcher can be designed, for example, as a coil that is energized with a direct current.
  • the chip catcher can also be designed with a magnet, for example with a permanent magnet.
  • the chip catcher is set up to mechanically hold the chip to be classified with a fluid-permeable filter structure in the chip analysis area.
  • the chip catcher can be designed with a metal grid, or with a basket or a net.
  • the chip catcher is designed as a DC-operated coil in order to hold the at least one chip to be classified magnetically with a magnetic field in the chip analysis area.
  • An adjustable magnetic field can advantageously be realized with a DC-operated coil. In this way, the magnet catcher can be switched off if necessary.
  • the magnetic field can be switched on and off with a control unit. For example, the chip area can be cleaned.
  • the magnetic field of the chip catcher can be switched off for maintenance. After switching off, the chips are no longer held magnetically by the chip catcher and can therefore be easily removed.
  • the chip analysis area is preferably a spatial area within a line through which a liquid flows. It is thus proposed that the sensor device can be inserted and used in all lines through which a liquid flows, such as a line of a lubricating circuit or a cooling circuit. The sensor device described above can accordingly also be installed in any line through which a liquid flows.
  • the liquid is oil and/or a liquid coolant
  • the line is a lubricant line and/or a coolant line. It is preferably proposed that the span classifier be set up to provide the span signal via a communication unit to an external processing unit for external evaluation.
  • the chip classifier be set up to provide a result of the evaluation via a communication unit, the result of the evaluation being in particular a classified hardness class, a classified chip size and/or a classified chip material.
  • the result of the evaluation or the classification can thus be further processed and, for example, made available to a process computer for process monitoring, analyzed with an analysis unit or made available to a reporting unit in order to indicate a need for maintenance or repair.
  • the signal generator is preferably set up to provide the excitation signal as a reference signal to the chip classifier and/or an external processing unit via a communication unit.
  • the external processing unit is, for example, an external process computer or an external control unit.
  • the external process computer or the external control unit can be part of the technical system in which the sensor device is used.
  • the chip classifier has a calculation unit in order to classify the at least one chip in the chip analysis area by evaluating a phase shift between the exciter signal and the chip signal and/or an amplitude of the chip signal; and/or to classify the at least one chip in the chip analysis area depending on the chip signal and/or the excitation signal by means of an evaluation method.
  • the calculation unit can be an internal calculation unit that is part of the sensor device, such as a microcontroller.
  • the calculation unit can also be an external calculation unit, such as an external process computer or an external control unit.
  • a method for characterizing a chip with a sensor device which has at least one signal generator and one chip classifier.
  • the method comprises the steps: generating an electrical excitation signal with the signal generator with a transmission coil, the signal generator being set up to generate the electrical excitation signal and to couple it with the transmission coil into a chip analysis area as a magnetic signal, the chip analysis area being a spatial area;
  • the span classifier receiving a span signal with the span classifier with at least one receiver sensor, the span classifier being set up to receive the span signal from the span analysis area with the receiver sensor, the span signal being a magnetization signal excited by the exciter signal, which is generated by at least one span to be classified;
  • the chip classifier being set up to classify the at least one chip in the chip analysis area by evaluating a phase shift between the excitation signal and the chip signal and/or an amplitude of the chip signal.
  • the sensor device is designed according to one of the above embodiments.
  • the evaluation step also includes the steps:
  • determining a chip size and/or a chip material of the chip to be classified by determining an in-phase component with the chip classifier, which component is preferably proportional to a magnetization of the chip, and/or
  • determining at least one hardness class and/or chip material of the chip to be classified by determining an out-of-phase component, which is preferably proportional to an area under a hysteresis curve of the chip.
  • 1 schematically shows a lubrication circuit of a transmission with a sensor device in one embodiment.
  • FIG. 2 schematically shows a block diagram of a sensor device according to the invention in one embodiment.
  • 3 schematically shows part of a sensor device in one embodiment, which is introduced into a line through which a liquid flows.
  • 4 schematically shows a sectional side view of part of a sensor device with a primary coil and a multiplicity of receiver coils in one embodiment.
  • 5 schematically shows a sectional plan view of part of a sensor device with a multiplicity of receiver coils in one embodiment.
  • FIG. 6 shows six diagrams illustrating an evaluation of a phase shift between an excitation signal and a span signal and an evaluation of an amplitude of the span signal.
  • FIG. 7 shows a diagram in which two hysteresis curves are shown schematically.
  • FIG. 8 schematically shows a flow chart of the method according to the invention in one embodiment.
  • FIG. 1 shows a lubrication circuit 10 of a transmission 11 with a sensor device 100 in one embodiment.
  • the gear 11 is shown as a spur gear for the sake of clarity.
  • a pump 12 is part of the lubricating circuit 10 and is set up to pump lubricating oil 13 in a circuit.
  • the lubricating oil 13 is intended to reduce wear on the gear 11 and reduces the mechanical friction in the spur gear shown. Signs of wear such as pit damage or detachment of gear components can occur as a result of the mechanical stress on the gear.
  • the wear or the transmission detachments thus enter the lubricating circuit 10 and are present as artefacts in the form of metal particles or metal chips 14, 15 in the lubricating circuit.
  • Example- 1 shows two hard-magnetic chips or particles 15 and a soft-magnetic chip or particles 14, which may have become detached at different points in time.
  • suspended matter 16 is also present in the lubricating circuit, such as non-metallic dirt particles.
  • a filter 17 is provided to filter out suspended matter 16 from the lubricating oil 13 .
  • the metal chips are filtered by the sensor device 100 .
  • the sensor device can have a chip catcher in order to keep the at least one chip or chips 14, 15 to be classified in the chip analysis area 110.
  • the sensor device 100 for characterizing the chip is part of the lubrication circuit 10.
  • the sensor device 100 is designed, for example, as shown in FIG. 2, 3, 4 or 5.
  • FIG. The sensor device 100 is introduced into the line 18 through which the liquid flows and has a chip analysis area 110, which is a spatial area within the line 18 and is shown as a dotted area.
  • Sensor device 100 has a signal generator, not shown in FIG. 1, with at least one transmission coil, the signal generator being set up to generate an electrical excitation signal and to couple it into chip analysis region 110 with the transmission coil as a magnetic signal.
  • the coupling of the excitation signal as a magnetic signal into the chip analysis area 110 is illustrated in FIG. 1 by indicated field lines.
  • FIG. 1 shows a lubrication circuit 10 of a spur gear.
  • the sensor device 100 shown can also be introduced in any other line 18 through which a liquid flows.
  • the functional principle of the sensor device 100 is not limited to a lubricating circuit 10 of a transmission, but can also be introduced, for example, in a coolant circuit or directly in a transmission.
  • FIG. 2 schematically shows a block circuit diagram of a sensor device 100, as shown in FIG. 1, for example.
  • Sensor device 100 is provided for characterizing a chip 14, 15 and includes a chip analysis area 110, wherein chip analysis area 110 is a spatial area, for example within line 18 through which liquid flows, as shown in FIG.
  • the sensor device 100 comprises a signal generator 200 with at least one transmission coil 210, the signal generator being set up to generate an electrical excitation signal 220 and to couple it with the transmission coil 210 as a magnetic signal 230 into the chip analysis region 110.
  • the electrical excitation signal 220 can be generated, for example, with a function generator 240 as a sinusoidal AC voltage signal with a frequency in a frequency range from 100 Hz to 10 kHz.
  • the frequency of the excitation signal 220 can be varied in a predefined sequence in order to set a penetration depth into the chip 14, 15.
  • an amplifier 250 can be provided in order to amplify the electrical excitation signal 220 .
  • the electrical excitation signal 220 is converted into a magnetic signal 230 in the transmission coil and is thus coupled into the chip analysis area 110 .
  • the magnetic signal 230 magnetically excites the chip 14, 15 so that a characteristic and measurable chip signal 260 is generated based on the excitation by the magnetic signal 230.
  • the sensor device also includes a chip classifier 300 with at least one receiver coil 310, with the chip classifier 300 being set up to receive the chip signal 260 from the chip analysis area 110 with the receiver coil.
  • the receiver coil can thus also be understood as a measuring coil.
  • the span signal 260 is a magnetization signal excited by the exciter signal, which is generated by at least one span 14, 15 to be classified.
  • At least one Hall sensor and/or a magnetoresistive sensor can be used.
  • a use of the receiver coil is shown in the exemplary embodiments.
  • the chip classifier 300 is set up to classify the at least one chip 14, 15 in the chip analysis area 110 by evaluating a phase shift between the exciter signal 220 and the chip signal 260 and/or an amplitude of the chip signal 260.
  • the chip classifier 300 evaluates an in-phase component to identify a chip size of the chip 14, 15 and/or a chip material of the chip 14, 15 which is proportional to a magnetization of the chip. Additionally or alternatively, to identify a degree of hardness of the chip 14, 15 and/or a chip material of the chip 14, 15, the chip classifier 300 evaluates an out-of-phase component that is proportional to an area under a hysteresis curve of the chip, such as in FIG Figures 6 and 7 illustrate.
  • the span classifier 300 can also have an amplifier 330 in order to amplify the span signal 260 measured with the receiver coil 310 into a desired working range.
  • a selection circuit 320 can also be provided be to evaluate the plurality of receiver coils 310 independently, such as a multiplexer.
  • the chip classifier 300 can also have a material database 340, with material data being stored in the material database, such as coercive field strengths, susceptibilities, remanences, magnetic saturations or hysteresis curves.
  • the chip classifier 300 is set up with a calculation unit 350 to determine at least a first hardness class and/or a second hardness class, a chip size and/or a chip material of the chip 14, 15 by comparing it with the material data. For example, it can be determined whether a soft-magnetic chip 14 or a hard-magnetic chip 15 is present. In addition, the chip size or the chip volume can be determined and the material of the chip 14 or 15 can also be determined. In this way, critical or non-critical wear or critical or non-critical gear damage can be inferred.
  • the calculation unit 350 is embodied as a microcontroller, for example.
  • the material database 340 is shown in FIG. 2 as part of the chip classifier, but it can also be an external database and the calculation unit 350 can communicate with the external database via a means of communication, for example.
  • the material data can also include comparison signal curves, with the presence of the first and/or second hardness class being determined by comparing the chip signal 260 with the comparison signal curves, namely by the calculation unit. A comparison with several signal profiles of the chip signal 260 stored in the material database 340 therefore takes place.
  • the signal curves can be stored in the material database 340 as a characteristic diagram, for example.
  • the chip classifier 300 After the chip classifier 300 has classified the at least one chip 14, 15 in the chip analysis area by evaluating a phase shift between the exciter signal 220 and the chip signal 260 and/or an amplitude of the chip signal 260, the result of the classification can be processed further and sent to a process computer 400, for example Provided process monitoring, analyzed with an analysis unit 410 or displayed on a reporting unit 420 to initiate maintenance or repair.
  • a process computer 400 for example Provided process monitoring, analyzed with an analysis unit 410 or displayed on a reporting unit 420 to initiate maintenance or repair.
  • FIG. 3 shows part of a sensor device 100 for characterizing a chip, as shown in FIG. 1 or 2, for example.
  • the sensor device 100 has a chip analysis area 110, which is a spatial area within a line 18 through which a liquid flows.
  • the sensor device 100 has a signal generator with at least one transmission coil, which is not shown.
  • the signal generator is set up to generate an electrical excitation signal 220 and to couple it into the chip analysis region 110 as a magnetic signal 230 using a transmitter coil (also not shown).
  • Sensor device 100 also has a chip catcher 270 to hold the at least one chip 14, 15 to be classified in chip analysis area 110, specifically stationary on a sensor head of sensor device 100.
  • Chip catcher 270 is shown only indirectly in FIG Metal chips 14, 15 adhere to the sensor head of the sensor device 100.
  • the chip catcher 270 is set up to magnetically hold the at least one chip to be classified with a magnetic field in the chip analysis area 110 .
  • the chip catcher can be embodied, for example, as a DC-operated coil, in order to magnetically hold the at least one chip 14, 15 to be classified in the chip analysis area 110 with a magnetic field, with the magnetic field being designed such that it can be switched on and off with a control unit for cleaning the chip area .
  • Figure 4 shows a sectional side view of part of a sensor device 100 with a transmitter coil 210 and a large number of receiver coils 310.
  • the receiver coils are distributed on a sensor surface 290 within a sensor head 280 in order to determine the location and/or size of the chip 14, 15 to provide.
  • the receiver coil 310 has a coil axis which is designed to be normal with respect to the sensor surface plane 290 in order to minimize an influence of the excitation signal on the chip signal.
  • the transmission coil 210 also has a coil axis which is designed to be essentially parallel with respect to the sensor surface plane 290 .
  • the coil axis of the transmission coil can alternatively be designed to be essentially vertical in relation to the sensor surface plane 290, in particular if the transmission coil is wound around a vertical leg. This orientation can reduce the influence of the excitation signal, which is coupled into the chip analysis area 110 as a magnetic signal 230, and the chip signal can be measured better, since the excitation field is normal to the receiver coil.
  • Figure 5 illustrates part of a sensor device 100 with a large number of receiver coils 310, the receiver coils 310 being distributed over a sensor surface 290 within a sensor head 280 in order to provide a local determination and/or a size determination of the chip 14, 15. wherein the receiver coils 310 are arranged in a honeycomb distribution within a sensor head 280 .
  • the figure 5 shown is, for example, a sectional plan view of figure 4.
  • FIG. 6 illustrates the evaluation principle for characterizing a chip.
  • the chip classifier is set up to classify the at least one chip to be classified in the chip analysis area by evaluating a phase shift between the exciter signal and the chip signal and/or an amplitude of the chip signal.
  • the chip classifier is thus set up, for example, to determine a chip size, a chip material and/or a hardness class of the chip.
  • three diagrams A1 to A3 are shown, which illustrate a characterization of a soft-magnetic chip.
  • three diagrams B1 to B3 are shown, which illustrate a characterization of a hard-magnetic chip.
  • FIGs A1 and B1 Two different hysteresis curves are shown in diagrams A1 and B1.
  • the magnetization M is plotted on the Y-axis and the magnetic field strength H on the X-axis.
  • the intersection points of the curves with the Y-axis correspond to the positive and negative remanence.
  • the intersections with the X-axis correspond to the positive and negative coercivity.
  • the dotted lines correspond to the course of a new curve.
  • the curves A1 and B1 saturate both in the positive and in the negative direction, regardless of whether the magnetic field strength see is further increased positively or negatively. This is known as magnetic saturation.
  • the two hysteresis curves thus also show positive and negative magnetic saturation.
  • diagram A1 a narrow hysteresis curve appears in comparison to diagram B1, which suggests a soft span.
  • the hysteresis curve in diagram B1 is wider and lower than diagram A1, so that a hard-magnetic chip can be inferred. This relationship is illustrated in FIG. 6 and also in FIG.
  • the electrical excitation signal 220 and the span signal 260 are illustrated by way of example in the diagrams A2 and B2.
  • the voltage U is plotted over time t.
  • the voltage waveforms 220 and 260 are illustrated in the same diagram, the amplitude values of the signal waveforms 220 and 260 can be different.
  • a different phase shift occurs between the electrical excitation signal 220 and the chip signal 260 due to the different material properties of the chips.
  • a chip signal that is generated by a soft-magnetic chip is shown in diagram A2.
  • Diagram B2 illustrates an example of a chip signal that is generated by a hard-magnetic chip. The chip can thus be classified by evaluating the phase shift, for example in relation to a degree of hardness.
  • FIGS. A3 and B3 show diagrams A2 and B2 in a different representation, namely as rotating space vectors. As can be seen, the space vectors 220 and 260 rotate synchronously with one another at a different phase angle. A phase shift can thus also be determined on the basis of the phase angle.
  • FIG. 7 shows two hysteresis curves as an example, which are drawn in a three-axis diagram.
  • the magnetic field strength H is plotted on the X-axis.
  • the magnetic flux density B is plotted on a first Y-axis and the magnetization M is plotted on a second Y-axis.
  • hard-magnetic and soft-magnetic chips differ in the different areas of the hysteresis curves. This knowledge is used not only to identify a chip in the chip analysis area, but also to characterize it, for example with regard to its size (chip volume), its magnetic properties (degree of hardness) or its material properties (chip material).
  • FIG. 8 shows a flow chart of a method for characterizing a chip with a sensor device.
  • an electrical excitation signal is generated using a signal generator with a transmission coil, the signal generator being set up to generate the electrical excitation signal and to couple it with the transmission coil into a chip analysis area as a magnetic signal, the chip analysis area being a spatial area is.
  • a chip signal is received with a chip classifier with at least one receiver coil, with the chip classifier being set up to receive the chip signal from a chip analysis area with the receiver coil, with the chip signal being a magnetization signal excited by the excitation signal that is generated by at least one chip to be classified.
  • step S3 the chip signal is evaluated using the chip classifier, the chip classifier being set up to classify the at least one chip in the chip analysis area by evaluating a phase shift between the excitation signal and the chip signal and/or an amplitude of the chip signal.
  • step S3 two further preferred steps S3.1 and S3.2 are illustrated in step S3.
  • step S3.1 a chip size and/or a chip material of the chip to be classified is determined by determining an in-phase component with the chip classifier, which component is proportional to a magnetization of the chip.
  • step S3.2 at least one hardness class and/or a chip material of the chip to be classified is determined by determining an out-of-phase component that is proportional to an area under a hysteresis curve of the chip.
  • a sensor device for characterizing a chip comprising a chip analysis area, the chip analysis area being a spatial area; a signal generator with at least one transmission unit, wherein the signal generator is set up to generate an electrical excitation signal and to couple it into the chip analysis area with the transmission unit as a magnetic signal; a chip classifier with at least one receiver sensor, the chip classifier being set up to receive a chip signal from the chip analysis area with the receiver sensor, the chip signal being a magnetization signal excited by the excitation signal, which is generated by at least one chip to be classified, characterized in that the chip classifier is also set up to classify the at least one chip in the chip analysis area by evaluating a phase shift between the excitation signal and the chip signal and/or an amplitude of the chip signal.
  • the transmitter coil As an alternative to the transmitter coil, it is therefore proposed to use a signal generator with at least one transmitter unit, the signal generator being set up to generate an electrical excitation signal and to couple it with the transmitter unit as a magnetic signal into the chip analysis area. It is therefore proposed to use any other technical device instead of a transmission coil in order to generate the electrical excitation signal.
  • a signal generator with at least one transmission coil, the signal generator being set up to generate an electrical excitation signal and to couple it with the transmission coil as a magnetic signal into the chip analysis area is an optional feature.
  • a sensor device can also be provided which is set up only to receive the span signal and evaluates the span signal.
  • a sensor device for characterizing a span comprising: a span classifier with at least one receiver sensor, the span classifier being set up to receive a span signal with the receiver sensor, the span signal being a magnetization signal excited by an excitation signal, which is generated from at least one span to be classified, the span classifier being set up to classify the at least one span by evaluating a phase shift between the excitation signal and the span signal and/or an amplitude of the span signal.
  • the above sensor device with a generic transmission unit or without a signal generator is preferably designed according to one of the above embodiments.
  • the method step of generating an electrical excitation signal using the signal generator with a transmission coil, the signal generator being set up to generate the electrical excitation signal and to couple it with the transmission coil into a chip analysis area as a magnetic signal, the chip analysis area being a spatial area is a optional feature.
  • a method can also be provided which is set up only for receiving and evaluating the span signal.
  • a method for characterizing a chip with a sensor device which has at least one chip classifier.
  • the method comprises the steps: Receiving a span signal with the span classifier with at least one receiver sensor, the span classifier being set up to receive a generated span signal with the receiver sensor, the span signal being a magnetization signal excited by an excitation signal, which is generated by at least one to be classified chip is generated; and evaluating the span signal with the span classifier, the span classifier being set up to classify the at least one span by evaluating a phase shift between the excitation signal and the span signal and/or an amplitude of the span signal.
  • a measurement method is thus proposed.
  • the feature is to classify the at least one span by evaluating a phase shift between the excitation signal and the span signal and/or an amplitude of the span signal is an optional feature. It is proposed generically to evaluate the received span signal to classify the span. So it will proposed to evaluate a span signal, which is a magnetic signal generated by excitation and in which span is generated in response to the excitation. In contrast, known methods for characterizing a span use comparison coils in order to characterize the span based on a change in impedance between a measuring coil and a reference coil, as already described above in the introduction.

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Abstract

L'invention concerne un dispositif de détection pour la caractérisation d'un copeau (14, 15), comprenant une zone d'analyse de copeau (110), cette zone d'analyse de copeau étant une zone spatiale; un générateur de signal (200) comprenant au moins une bobine émettrice (210), le générateur de signal étant conçu pour générer un signal d'excitation électrique (220) et pour l'injecter au moyen de la bobine émettrice (210) en tant que signal magnétique (230) dans la zone d'analyse de copeau; un classificateur de copeau (300) comprenant au moins une bobine réceptrice (310), le classificateur de copeau étant conçu pour recevoir un signal de copeau provenant de la zone d'analyse de copeau au moyen de la bobine réceptrice, le signal de copeau étant un signal de magnétisation excité par le signal d'excitation et généré par au moins un copeau à classifier. L'invention concerne en outre un procédé de caractérisation d'un copeau au moyen d'un dispositif de détection qui comporte au moins un générateur de signal et un classificateur de copeau.
EP22736286.0A 2021-07-02 2022-07-01 Dispositif de détection et procédé de caractérisation d'un copeau de métal Pending EP4363828A1 (fr)

Applications Claiming Priority (2)

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DE102021117119.9A DE102021117119A1 (de) 2021-07-02 2021-07-02 Sensoreinrichtung und Verfahren zur Charakterisierung eines Metallspans
PCT/EP2022/068308 WO2023275372A1 (fr) 2021-07-02 2022-07-01 Dispositif de détection et procédé de caractérisation d'un copeau de métal

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DE102007039435A1 (de) 2006-12-15 2008-06-19 Prüftechnik Dieter Busch AG Vorrichtung und Verfahren zum Erfassen von Partikeln in einer strömenden Flüssigkeit
AT504527B1 (de) 2007-02-23 2008-06-15 Evk Di Kerschhaggl Gmbh Verfahren und vorrichtung zum unterscheiden von ein elektromagnetisches wechselfeld beeinflussenden objekten, insbesondere metallobjekten
DE102010011936B4 (de) 2010-03-12 2015-09-24 Technische Universität Braunschweig Verfahren und Einrichtung zur Bestimmung von geometrischen, magnetischen und/oder elektrischen Eigenschaften magnetischer, dielektrischer und/oder elektrisch leitfähiger Partikel in einer Probe
EP2455774B1 (fr) 2010-11-19 2013-08-21 ARGO-HYTOS GmbH Dispositif de capteur et son procédé de fonctionnement
DE102011077068A1 (de) * 2011-06-07 2012-12-13 Hilti Aktiengesellschaft Verfahren und Vorrichtung zum Detektieren eines leitfähigen Objektes
FI127032B (fi) 2014-03-21 2017-10-13 Magnasense Tech Oy Mittausjärjestely, laite varustettuna mittausjärjestelyllä ja menetelmä näytteen mittaamiseksi
DK3224606T3 (da) 2014-11-28 2019-11-18 Parker Hannifin Mfg Limited Sensorapparat
DE102018209651A1 (de) * 2018-06-15 2019-12-19 Forschungszentrum Jülich GmbH Vorrichtung und Verfahren zur magnetischen Partikelbestimmung

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