EP4342268A1

EP4342268A1 - Media-tight insert molding of electronics circuit boards with external contacting

Info

Publication number: EP4342268A1
Application number: EP22729090.5A
Authority: EP
Inventors: Grégory Schaffner; Arthur RÖNISCH
Original assignee: Duotec GmbH
Current assignee: Duotec GmbH
Priority date: 2021-05-21
Filing date: 2022-05-11
Publication date: 2024-03-27
Also published as: DE102021113343A1; WO2022243134A1

Abstract

The invention relates to a printed circuit board arrangement (100) comprising a printed circuit board (1), the board surface of which extends horizontally and which comprises a vertical top side and underside, wherein it has a planar component portion with at least one electronics component (3), in particular a plurality of electronics components (3), arranged thereon, wherein the component portion is enclosed in sealed fashion in a plastics protective layer. A top-side delimitation conductor track is arranged on the top side of the printed circuit board (1) and, across a conductor track length, extends with a conductor track width on the top side and, across its conductor track length, divides the top side into two top-side regions that are completely and uninterruptedly separated from one another, wherein a first of said top-side regions is formed by the component portion and a second of said top-side regions is formed by a planar contact portion of the printed circuit board (1), which is arranged in portions outside the plastics protective layer (2), wherein the top-side delimitation conductor track, uninterruptedly across its conductor track length, is arranged at least with a part of its conductor track width within the plastics protective layer (2) and is sealingly connected thereto, wherein an adhesion promoter is applied in particular to the top-side delimitation conductor track (41) across the conductor track length thereof and ensures a sealing connection between the plastics protective layer (2) and the delimitation conductor track (41).

Description

Applicant: duotec GmbH 58553 Halver

Media-tight overmoulding of electronic circuit boards with

external contacting

The invention relates to a printed circuit board arrangement according to the preamble of claim 1 and a method for producing the printed circuit board arrangement.

In the prior art, various approaches to the realization of generic circuit board assemblies are already known in which electronic components that are arranged on a circuit board in a

Plastic protective layer sealed enclosed. The background to such printed circuit board arrangements is that they are intended to provide electronic components whose electronic components or at least one electronic component are sealed from the environment, so that short circuits between the electronic components can be avoided if, for example, the respective electronic component with its electronic components is immersed in water . For example, such sealed electronic components are used in vehicle construction or in medical technology. The use of such sealed electronic components has the advantage, for example, that maintenance and/or cleaning of a device in which the electronic components are installed is simplified and For example, the manufacture of easy-to-maintain and/or easy-to-clean devices is simplified by using these electronic components. In the prior art, the approach is usually followed that such sealed electronic components are realized by casting a printed circuit board, on which at least one electronic component is arranged, in a plastic capsule, with electrical contacts extending out of the plastic capsule from the printed circuit board in order to to ensure that the at least one electronic component can be contacted. Although the complete encapsulation of the printed circuit board largely ensures adequate sealing of the electronic components, the realization of the electrical contacts that extend out of the plastic capsule is complex and expensive, especially for the realization of electronic components that use standard processes with other electronic components are to be electrically connected. To simplify and reduce production, consideration was also given to encapsulating surface areas of printed circuit boards in which electronic components to be protected by a seal are arranged, by placing a sealing ring around such a surface section and pressing a plastic protective sleeve into the compression ring with sufficient pressure. It has been found, however, that a not inconsiderable pressing force is required for this and that special requirements are placed on the material of the sealing ring so that adequate sealing is ensured.

The object of the present invention is to provide a printed circuit board arrangement with a printed circuit board on which electronic components are arranged which are sealed from the environment, with which at least one of the above-mentioned disadvantages or one of the above-mentioned problems of conventional printed circuit board arrangements can be at least partially eliminated.

As a solution to the stated problem underlying the invention, the invention proposes a printed circuit board arrangement with the features according to claim 1 .

According to the invention, the printed circuit board arrangement has a printed circuit board which extends horizontally with its board surface. The printed circuit board has a top and a bottom, with the top facing vertically up and the bottom facing vertically down. Top and bottom are the respective sides of the plate surface. Of course, the printed circuit board, which is designed like a plate, has board narrow sides, in addition to the top and bottom, like any conventional board, which connect the top and bottom and run along the vertical. The printed circuit board has a flat component section on which at least one electronic component, in particular several electronic components, for example logic modules, resistors, transistors, capacitors, etc., are arranged. The component section is in one

The plastic protective layer is enclosed in a sealed manner, ie the component section is sealed off from the environment around the printed circuit board arrangement and is therefore protected from the environment by the plastic protective layer. The component section is preferably enclosed in the plastic protective layer in a sealed manner in such a way that the plastic protective layer can be in particular a duration of 60 minutes, prevents water from reaching the component section. The component section is a flat section of the board surface of the printed circuit board, ie a flat section on the top and/or underside of the printed circuit board. Because the component section is enclosed in a sealed manner in the plastic protective layer, the electronic components arranged on the component section are also in the

Plastic protective layer sealed enclosed. The plastic protective layer thus encloses the flat component section and the electronic components arranged on it in a sealed manner. Generally preferably, the sealing meets the requirements of IP68. The top and bottom are the two board surface sides of the printed circuit board that face away from each other vertically. They are thus defined relative to one another, but not with reference to a specific position of the printed circuit board in space. In one embodiment, the component section extends exclusively on the upper side of the printed circuit board; in a further embodiment, the component section extends on the upper and lower side. The component section can be a coherent planar component section or have several separate planar component subsections, in which case each of the component subsections is sealed and enclosed in the plastic protective layer, in which case the plastic protective layer can be continuous or several

Plastic protective layer sub-sections may have, which are each associated with at least one of the component sub-sections and enclose them sealingly.

A top demarcation trace is located on top of the circuit board. The demarcation track is made of a metal or a metal alloy, for example copper or a copper alloy. As is usual when realizing conductor tracks on printed circuit boards, the delimiting conductor track is produced on the printed circuit board using a conventional manufacturing process. The delineation trace has a trace length and a trace width, thereby defining the horizontal dimensions of the trace. The trace runs over its trace length with its trace width at the top and divides the top into two top regions that are completely and uninterruptedly separated from one another. The trace width can vary or be constant along the trace length. The delimitation conductor track on the upper side runs with its conductor track length on the upper side in such a way that it divides the upper side into two upper-side regions which are defined by it and are uninterruptedly separated from one another by it. The conductor track thus runs over its conductor track length either in an uninterruptedly closed manner around a first upper side area - with the provision of several component subsections on the upper side, the delimiting conductor track has several conductor track sections, which are each assigned to one of the component subsections and continuously run around them - and separates this first upper side area thus from the remaining area of the top, or the demarcation trace runs uninterrupted between two ends of the top of the printed circuit board, so that the demarcation trace together with the course of the extension end of the top between the two said ends of the top defines the first top-side region which is defined by the demarcation trace is demarcated from the rest of the top area. Accordingly, the Of course, the delimiting conductor track also has a conductor track section that is assigned to a component subsection, the conductor track section running between two ends of the top side of the printed circuit board and, together with the extension end of the top side running between the two ends, separating the component subsection from the rest of the top side. According to the invention, a first of the upper side regions, into which the delimiting conductor track divides the upper side, is formed by the component section, and a second of these upper side regions is formed by a flat contact section of the printed circuit board. The contact section is arranged at least in sections, in particular in sections, outside of the plastic protective layer. Preferably, the first upper side region is directly adjacent to the demarcation conductor track and is thus arranged directly next to the demarcation conductor track, whereas the demarcation conductor track is arranged on the second upper side region. The delimitation conductor track on the upper side is arranged uninterrupted over its conductor track length, at least with part of its conductor track width, within the plastic protective layer and is connected to it in a sealed manner. The top-side delimiting conductor track is preferably arranged with at least that part of its conductor track width that is uninterrupted over its conductor track length within the plastic protective layer and is connected to it in a sealed manner that faces the first top side area, in particular directly adjoins the first top side area. An adhesion promoter is particularly preferably applied to the top-side delimiting conductor along its length of the conductor, which ensures a sealing connection between the plastic protective layer and the delimiting conductor. The adhesion promoter is preferred over the Conductor track length of the conductor track applied continuously in that part of the conductor track width of the delimitation conductor track, which is arranged inside the plastic protective layer. In general, the delimitation trace extends uninterrupted with its trace length, starting from a first end, to a second end. Preferably, either the first and second ends of the demarcation trace are directly adjacent to each other, so that the demarcation trace forms a closed ring, or the first and second end of the demarcation trace are each at an edge of the printed circuit board, which delimits the top side of the printed circuit board and at which the top side is divided into a Board narrow side of the circuit board passes. The adhesion promoter is preferably applied continuously, starting from the first to the second end of the delimiting conductor track. An adhesive, for example a polymer-based adhesive, is provided as an adhesion promoter.

In one embodiment, at least two spaced-apart contacts are arranged on the contact section outside the plastic protective layer, from each of which an electrical line leads to the electronic components and electrically conductively connects the respective contact to the electronic components. The electronic components can thus be contacted via the contact sections from outside the volume enclosed by the plastic protective layer, in which the electronic components are located. Different potentials can be applied to the two contacts in order, for example, to supply at least one of the electronic components with electrical energy and/or to supply at least one of the electronic components with a data signal and/or to read a data signal from it. The two contacts thus represent each represents a connection option for an electronic connection of at least one of the electronic components.

The electrical line can be formed by a conductor track, for example. For example, at least one of the contacts can be defined by a

Surface section of the contact section can be formed, to which a connection line can be connected, with an electrical line designed as a conductor track leading from this surface section of the contact section into the volume closed off by the plastic protective layer. Such a conductor track can, for example, run from the surface section to an intermediate layer of the circuit board and in this intermediate layer of the circuit board, i. H. spaced from the vertical upper side and vertical lower side, extend into the horizontal extent of the component section and lead from there to the upper side, on which it, enclosed by the plastic protective layer, rests in an electrically conductive manner on at least one electronic component arranged in the component section.

At least one of the contacts is therefore preferably at a distance from the top-side delimiting conductor track so that it is not electrically conductively connected to it, with the electrical line leading from this contact to the at least one electronic component preferably being formed by a connecting conductor track which is at least partially within the Printed circuit board and thus runs vertically spaced from the top and bottom of the circuit board. The printed circuit board is preferably designed as a multilayer printed circuit board, with the connecting conductor running at least over a horizontal section, starting from the horizontal position of the contact to the horizontal area of the component section in an intermediate layer of the multilayer printed circuit board. At least one is generally preferred, in particular precisely one of the contacts is formed at least in sections by the top-side delimitation conductor track. This embodiment can be combined with the aforementioned embodiment. Since the delimiting conductor track is used to form one of the contacts at least in sections, the delimiting conductor track itself can ensure electrical contacting of the contact with the at least one electronic component provided in the component section. For example, the contact can be formed entirely by the top-side delimiting conductor track or by an electrically conductive surface section of the contact section, which is directly electrically conductively connected to the delimiting conductor track. In advantageous embodiments, three or more contacts spaced apart from one another can also be provided on the contact section outside the plastic protective layer, via which a respective different connection of electronic components arranged in the component section can be contacted. The various contacts are therefore not directly connected to one another in an electrically conductive manner, but at most via electronic components arranged in the component section. The provision of more than two contacts can further improve the variability or applicability of the printed circuit board arrangement, since more complex communication or supply can be achieved between external connection lines and the at least one electronic component.

In one embodiment, at least one of the contacts is designed as a recess, in particular for receiving a conductive thread. The recess is provided in the printed circuit board. The cutout can, for example, be a hole-like lead-through in the circuit board which is therefore completely surrounded by the circuit board be, which extends vertically through the circuit board. The cutout can, for example, also be a cutout starting from an edge region of the printed circuit board. Forming the contact as a recess in the printed circuit board makes it particularly possible for the contact to be able to be contacted via a conductive yarn that is accommodated in the recess. The cutout is particularly preferably designed to enable the contact to be contacted by a conductive thread, which at the same time serves to fasten the printed circuit board arrangement to a piece of clothing. The thread can preferably be arranged in the recess by means of an embroidery process, so that it is accommodated in the recess and can serve to fasten the circuit board arrangement to a piece of clothing. The cutout preferably has a diameter of at least 0.5 mm, in particular from 0.5 mm to 5 mm, in particular from 0.5 mm to 2 mm, in particular from 1 mm to 2 mm. In general, the recess preferably runs vertically through the printed circuit board and is completely delimited by a printed circuit board area over its extent running horizontally within the printed circuit board. The geometry of the cutout is thus defined by the printed circuit board area that delimits it. As explained above, the cutout can be open towards the edge of the printed circuit board, for example, or can be designed as a hole-like passage. The printed circuit board area delimiting the cutout is preferably coated to prevent water arranged in the cutout from penetrating into the printed circuit board via the printed circuit board area. The coating can be formed, for example, by an electrically conductive coating, which brings with it the particular advantage that the coating of the printed circuit board area prevents water from penetrating into the printed circuit board at the boundary of the cutout can as well as promoting electrical contactability with a conductive thread that runs vertically through the cutout and rests against the printed circuit board area delimiting the cutout, with the contact of the conductive thread with the printed circuit board area coated with an electrically conductive material directly creating an electrical connection between the conductive thread acting as a lead wire and the contact is achieved. In another embodiment, the coating can also be formed by an insulating layer, with the contact forming an electrically conductive surface section of the printed circuit board on the top and/or bottom of the cutout. The cutout is particularly preferably designed as a hollow-cylindrical lead-through in the circuit board, the hollow-cylindrical wall of which, continuous from the top to the underside of the circuit board, is continuously coated, for example with an electrically conductive or an insulating coating.

In one embodiment, the top-side delimitation conductor track encloses the first top-side region in a closed, annular manner. In one embodiment, which can be combined with the one mentioned above, on the underside of the printed circuit board there is a delimiting conductor track on the underside, which runs over its conductor path length with its conductor path width on the underside and over its conductor path length divides the underside into two underside areas that are completely and uninterruptedly separated from one another . A first of these underside areas is formed by the component section. A second of these underside areas is formed by the contact portion of the printed circuit board. The underside delineation trace is uninterrupted along its trace length with at least one Part of their trace width arranged within the plastic layer and connected to this sealing. An adhesion promoter is particularly preferably applied to the underside delimiting conductor track over its conductor track length, which ensures a sealing connection between the plastic protective layer and the underside delimiting conductor track. The delimiting conductor track on the underside preferably encloses the first underside region in a closed manner. In the described preferred embodiment, in which an underside delimiting conductor track is provided on the underside of the printed circuit board, the component section thus has the first upper side area and the first underside area, with at least one electronic component preferably being arranged in the first upper side area under the first underside area. First top area and first bottom area can extend over the same horizontal area. The same can be said for the second

Top side area and second bottom side area apply. The above statements relating to the upper-side delimitation conductor track and its configuration, in particular with reference to the configuration as comprising conductor track sections, each having a

Separating the component sub-section from the contact section can be applied to corresponding embodiments with correspondingly designed delimiting conductor tracks on the underside. By providing a top and bottom delimiting conductor track, the component section can extend over the top and bottom of the printed circuit board and thus have a larger area, so that electronic components can be arranged particularly variably on the component section. The demarcation traces at the top and bottom ensure in each case a watertight sealing connection of the plastic protective layer and thus a watertight volume closed off by the plastic protective layer, in which electronic components can be arranged protected from water.

In one embodiment, a first of the contacts is at least partially formed by the top-side demarcation trace and a second of the contacts is at least partially formed by the bottom-side demarcation trace. The formation of the contact through the lower-side delimitation conductor track can be implemented in corresponding embodiments as in various embodiments with regard to the formation of a contact through the upper-side delimitation conductor track.

In one embodiment, the top demarcation trace and the bottom one extend

Delimitation traces each with their trace lengths from a first end to a second end, the first ends of the top and bottom delineation traces being connected to one another by a first board narrow side section of the circuit board and the second ends of the top and bottom delineation circuit traces being connected to one another by a second board narrow side section of the circuit board are connected to each other. top and bottom

Delimitation conductor tracks thus open with their conductor track ends in each case on a board narrow side of the circuit board and thus on an absolute horizontal extension end of the top or bottom. By the upper and lower-side demarcation conductor tracks with their ends at the absolute extension ends and thus at the narrow side transitioning edges of the printed circuit board, the largest possible first upper side section or first lower side section can be provided, and moreover, the watertight seal can be improved as a result, particularly in preferred embodiments explained below. The plastic protective layer is particularly preferably connected to the first and second board narrow side sections in a sealing manner, forming a sealing ring that runs around the printed circuit board and delimits a volume in the plastic protective layer in which the first upper side area and the first lower side area are enclosed in a sealed manner. the

Board narrow side sections of the printed circuit board are sections of the respective board narrow sides that run across the respective board narrow sides and thus vertically over the extension of the circuit board, via which the first and second ends of upper and lower-side delimiting conductor tracks are connected to one another. Since the protective plastic layer is connected in a sealed manner to the upper and lower-side delimiting conductor track and to the first and second board narrow side sections, a sealing ring is formed between the plastic protective layer and the printed circuit board that is closed around the printed circuit board, namely via the sealing connection of the plastic protective layer to the ones applied to the printed circuit board Delimitation conductor tracks and the plate narrow side sections. This sealing ring defines, in a certain horizontal direction, one end of the volume in the protective plastic layer in which the first upper side area and the first lower side area are sealingly enclosed. Starting from this sealing ring, the volume extends along the given horizontal direction to the opposite one End, which can be given, for example, by a further delimiting conductor track section or an absolute geometric extension end of the volume at an absolute geometric extension end of the circuit board or outside this end of the circuit board, wherein, for example, the volume can be a blind hole-like volume in the plastic protective layer, the end of which at the open Side of the blind hole is limited by the sealing ring by the circuit board is arranged with its cross-section perpendicular to said specific horizontal direction. It has been found that the provision of such a sealing ring that is closed around the printed circuit board is particularly advantageous for ensuring a reliably sealed volume and for providing a large-area component section. The inventors have found that the plate narrow side sections can be formed with a sufficient roughness that can enable a sealing connection of the plastic protective layer with the respective plate narrow side section.

Particularly preferably, the board narrow-side sections each have a narrow-side conductor track that extends between the ends of the delimiting conductor tracks connected by the respective board narrow-side section and connects them to one another, forming a sealing conductor track that is formed by the delimitation conductor tracks and the plate narrow-side conductor tracks and runs uninterruptedly around the conductor track. The first

Plate narrow-side section thus has a first narrow-side conductor track, which connects the first ends of the upper and lower-side delimiting conductor tracks to one another connects, and the second plate edge portion has a second edge conductive trace that connects the second ends of top and bottom side demarcation conductive traces together. The implementation of the peripheral sealing conductor track, which is formed by the top and bottom delimiting conductor tracks and the narrow side conductor tracks, is particularly advantageous for the reliable sealing of the plastic layer on the sealing ring, which is thus formed by the peripheral sealing conductor track.

In general, it has been found to be advantageous that, in order to form a sealing ring, an adhesion promoter ring running uninterruptedly around the printed circuit board is applied to the upper and lower-side delimiting conductor tracks and the board narrow-side sections, in particular the narrow-side conductor tracks of the board narrow-side sections, and connected to these, i. H. the top and side demarcation traces and the

Plate narrow side sections, is sealingly connected, wherein the adhesion promoter ring is sealingly connected to the plastic protective layer. The adhesion promoter ring can be realized by an adhesion promoter as explained above. The provision of an adhesion promoter ring, which forms the sealing ring, is particularly advantageous for the reliably sealing connection with the plastic protective layer. The adhesion promoter ring ensures a reliable, watertight sealing connection of the plastic protective layer with the delimiting conductor tracks or the narrow side sections of the board.

In one embodiment, the top-side delimiting conductor track has a first conductor track section with which it forms the first top-side region in a ring shape encloses closed, and a second conductor track section, wherein the second conductor track section and the underside

Delimitation traces each extend with their trace lengths from a first end to a second end, the first end of the second trace section of the delimitation trace on the top and the first end of the delimitation trace on the underside being connected to one another by the first board narrow side section of the printed circuit board and the second end of the second trace section of the The upper-side delimitation conductor track and the second end of the lower-side delimitation conductor track are connected to one another by the second board narrow-side section of the printed circuit board, the plastic protective layer being sealingly connected to the first and second board narrow-side sections, respectively, and to the second conductor track section of the upper-side delimitation conductor track and the lower-side delimitation conductor track being sealingly connected under formation of the sealing ring that is closed around the printed circuit board. The provision of a first conductor track section and a second conductor track section of the top-side delimiting conductor track is particularly advantageous, since this allows two sealing zones to be provided in series one behind the other. Preferably, the first upper side region, which is enclosed in a ring-shaped manner by the first conductor track section, lies within the volume delimited by the sealing ring in the plastic protective layer. Particularly preferably, the underside demarcation conductor track also has a first and a second conductor track section, the first conductor track section of the underside demarcation conductor track enclosing the first underside region in a closed manner and the second conductor track section of the lower-side delimitation conductor track forms the first and the second end of the lower-side delimitation conductor track, which are connected to the first and second ends of the second conductor track section of the upper-side delimitation conductor track via the board narrow side sections of the printed circuit board. As a result, an electronic component arranged in the first underside area can be sealed particularly reliably watertight, as explained for the top side.

In one embodiment, the contact portion is continuously coated with a protective layer on each surface that runs vertically between the top and bottom of the circuit board. The protective layer is a waterproof layer that prevents water from penetrating the circuit board at all vertical surface portions of the circuit board. More preferably, the contact portion is coated on its entire surface, so that water penetration at any

Surface area of the contact portion is excluded. The coating is preferably electrically conductive in first surface sections of the contact section and electrically insulating in second surface sections of the contact section, the contacts explained above being formed from the first surface sections and the second

Surface sections insulate the contacts from each other.

The invention also relates to a method for producing a printed circuit board arrangement comprising a printed circuit board which extends horizontally with its plate surface and has a top and bottom side, at least one electronic component being arranged on a flat component section of the printed circuit board. According to the invention, a top-side at the top of the circuit board Arranged delimitation conductor track, which runs over a conductor track length with a conductor track width at the top and divides the top into two completely and continuously separated upper-side regions over its conductor track length. A first of these upper side areas is formed by the component section, and a second of these upper side areas is formed by a flat contact section of the printed circuit board. A plastic protective layer is then applied to the printed circuit board, in particular by means of an injection molding process, in such a way that the component section is completely enclosed in the plastic protective layer and the top-side delimiting conductor track is arranged uninterrupted over its conductor track length at least with part of its conductor track width within the plastic protective layer and is connected to it in a sealed manner . When the protective plastic layer is applied, it is connected to the conductor track in a waterproof manner. An adhesion promoter is particularly preferably applied to the top-side delimiting conductor track over its conductor track length before the protective plastic layer is applied to the printed circuit board. Particularly preferably, the contact portion is clamped in a tool carrier, while the

Plastic protective layer is applied. The tool carrier is preferably arranged exclusively outside the component section on the printed circuit board, while the plastic protective layer is being applied. Electronic components are preferably provided exclusively in the component section, so that the contact section is free of electronic components. Thus, all electronic components of the printed circuit board arrangement are sealed watertight within the component section and thus by the protective plastic layer encapsulated.

The invention also relates to a washable item of clothing comprising a printed circuit board arrangement according to the invention. The circuit board assembly is integrated into the garment in such a way that when the garment is immersed in water at 30° C. for 30 minutes

Circuit board assembly is directly in contact with the water and is thus exposed to the water. the

The printed circuit board arrangement is therefore not arranged in a protected, watertight, sealed area of the article of clothing, but can be directly exposed to the water if the article of clothing is correspondingly submerged. It is thus possible to dispense with watertight encapsulation measures, which can be disadvantageous for the wearing comfort of a piece of clothing, since the printed circuit board arrangement itself ensures adequate sealing of its electronic components due to its configuration according to the invention.

The invention is explained in more detail below with reference to three figures using exemplary embodiments.

Show it:

FIG. 1: a first embodiment of a printed circuit board arrangement according to the invention in a schematic representation of the principle;

FIG. 2: in a schematic representation of the principles, a second embodiment of a printed circuit board arrangement according to the invention;

Figure 3: in a schematic representation of a third embodiment of a printed circuit board assembly according to the invention.

In Figure 1 is an embodiment of an inventive Printed circuit board assembly 100 shown schematically simplified. The printed circuit board arrangement 100 comprises a printed circuit board 1 with its board surface extending horizontally. FIG. 1 shows the upper side of the printed circuit board 1 and two of its board narrow sides. The top of circuit board 1 consists of a first top area 120 and a second top area 110. The two top areas 120, 110 are separated from one another without interruption by a top-side delimitation conductor track 41, so that top-side delimitation conductor track 41 divides the top side of circuit board 1 into two top-side areas. The top-side delimitation conductor track is still completely assigned to the second top-side area 110 so that it is by definition completely arranged in the second top-side area 110 and directly adjoins the first top-side area 120 . The first upper side area 120 is formed by a flat component section of the printed circuit board 1 . The component section designates the section of the printed circuit board 1 on which at least one electronic component 3 is arranged. In the present case, exactly one electronic component 3 is arranged in the component section. According to the invention, no electronic component 3 is arranged in the contact section. The component section and thus also the electronic component 3 is sealed in a plastic protective layer 2 . In the present case, this is ensured by the fact that a top-side demarcation conductor track 41 and a bottom-side demarcation conductor track (not shown) are arranged on the top and bottom sides (the underside is not shown here), with the top-side demarcation conductor track 41 and the bottom-side demarcation conductor track with their conductor track lengths of extend a first end to a second end and the first ends of upper and lower side

Delimitation conductor track and the second ends of the upper and lower-side delimitation conductor tracks are connected to one another via narrow-side conductor tracks 42, so that the upper and lower-side delimitation conductor tracks and narrow-side conductor tracks 42 together form a sealing ring 4 that runs uninterruptedly around the printed circuit board 1. It can be seen from Figure 1 that the top-side delimiting conductor track 41 divides the top into a first top-side area 120 and a second top-side area 110, whereas the narrow-side conductor track 42, which can be seen in Figure 1, divides the lateral narrow side shown in Figure 1 into a first narrow-side area 12 and a second narrow-side area 11 divided. The first upper side area 120 and the first narrow side area 12 are arranged completely encapsulated in the plastic protective layer 2 and are sealed watertight with respect to the environment of the circuit board arrangement 100 by the sealing ring 4, on which the plastic protective layer 2 bears in a sealing manner and which is connected to the circuit board 1 in a sealing manner.

In the exemplary embodiment described in Figure 1, the sealing ring 4 runs completely within the horizontal extension of the plastic protective layer 2. If the circuit board arrangement 100 is submerged, water can still get into the plastic protective layer 2, starting from the second upper side region 110 on the top side of the circuit board 1, but only until the sealing ring 4 is reached, where further penetration of water is prevented by the sealing connection of the sealing ring 4 with the printed circuit board 1 and the plastic protective layer 2 . From Figure 1 can also be seen that in the second Top area 110, which is formed by the contact portion of the circuit board 1, three contacts 5 are provided. The contacts 5 are each designed as recesses running through the printed circuit board 1 along the vertical, these recesses being designed as bushings in the printed circuit board 1 in the manner of hollow cylinders.

An uninterrupted electrically conductive coating is provided both around the hollow-cylindrical lead-through on the upper side and over the entire hollow-cylinder wall. This electrically conductive coating serves to allow an electrically conductive yarn to be inserted into the respective feedthrough or the respective contact 5 using an embroidery process in order to contact the respective contact 5 by using the electrically conductive yarn as a connection line on the electrically conductive coating of the printed circuit board 1 is applied, as well as the further sealing of the printed circuit board 1. Because the coating is provided over the entire hollow cylinder wall of the bushings or contacts 5, penetration of water through the hollow cylinder wall and thus through the printed circuit board area of the printed circuit board 1 delimiting the recess is avoided .

FIG. 2 shows a further embodiment of a printed circuit board arrangement 100 according to the invention in a simplified, schematic manner. The printed circuit board arrangement 100 according to FIG. 2 differs from that

Circuit board arrangement 100 according to FIG extends. With this out of the

The plastic protective layer 2 extending section forms the upper-side delimitation conductor track 41 a contact 5 of the circuit board 1 from. In addition, only one further contact 5 is provided in the lower surface area 110 of the printed circuit board 1, which, analogously to the contacts 5 explained in the exemplary embodiment according to FIG. In the embodiment according to FIG

Plastic protective layer 2 with the circuit board 1 by being sealingly connected to both the circuit board 1 and the plastic protective layer 2. On the other hand, it forms a contact of the printed circuit board 1 itself. At this point it should be noted that, of course, starting from the contacts 5 shown in the exemplary embodiments shown, an electrical line leads to the electronic component 3 in each case. The electrical line is not shown here. In the exemplary embodiments described, the electrical line, which leads from the contacts 5 designed as a feedthrough to the electronic component 3, is formed in sections by a connecting conductor track which runs within the printed circuit board 1 and is thus vertically spaced from the top and bottom of the printed circuit board 1 and which runs vertically is plated through to the electronic component 3 . In the case of the contact 5 formed by the delimiting conductor track 41, the connecting conductor track is provided on the first upper side region 120 and runs from the top-side delimiting conductor track 41 to the electronic component 3.

In Figure 3 is another embodiment of a circuit board assembly 100 according to the invention shown simplified schematically. The printed circuit board arrangement 100 shown in FIG. 3 differs from the printed circuit board arrangement 100 shown in FIG. In the case of the circuit board arrangement 100, the component section is provided exclusively on the upper side of the circuit board 1. In the exemplary embodiment according to FIG. 3, the upper-side delimiting conductor track 41 lies completely within the horizontal extent of the plastic protective layer 2 and provides a seal between the plastic protective layer 2 and the printed circuit board 1 that is continuously closed around the first surface area and thus around the component section.

Media-tight overmoulding of electronic circuit boards with

external contacting

Reference List

1 circuit board

2 plastic protective layer

3 electronic component 4 sealing ring

5 contact

11 second narrow side area

12 first narrow side area

41 delimitation conductor track 42 narrow-side conductor track 00 circuit board arrangement 10 second upper-side region 20 first upper-side region

Claims

Media-tight encapsulation of electronic circuit boards with external contacts patent claims

1. Printed circuit board arrangement (100) comprising a printed circuit board (1) which extends horizontally with its board surface and which comprises a vertical top and bottom side, wherein it has a flat component section on which at least one electronic component (3), in particular a plurality of electronic components (3) are arranged, the component section being enclosed in a sealed manner in a plastic protective layer, characterized in that a top-side delimiting conductor track is arranged on the upper side of the printed circuit board (1), which runs over a conductor track length with a conductor track width on the upper side and over its conductor track length the upper side divided into two upper side areas that are completely and uninterruptedly separated from one another, with a first of these upper side areas being formed by the component section and a second of these upper side areas being formed by a flat contact section of the printed circuit board (1), which is at least partially ice outside the plastic protective layer (2) is arranged, wherein the The upper-side delimiting conductor track is arranged uninterrupted over its conductor track length at least with part of its conductor track width within the plastic protective layer (2) and is connected to it in a sealing manner, with an adhesion promoter being applied in particular to the upper-side delimiting conductor track (41) over its conductor track length, which promotes a sealing connection between the protective plastic layer (2) and the delimitation conductor track (41).

2. Circuit board arrangement (100) according to claim 1, characterized in that on the contact portion outside of

plastic protective layer (2), at least two spaced-apart contacts (5) are arranged, from each of which an electrical line leads to the at least one electronic component (3) and electrically conductively connects the respective contact (5) to the electronic component (3), in particular one of the contacts (5) is formed at least in sections by the top-side delimiting conductor track (41) and/or one of the contacts (5) is at a distance from the top-side delimiting conductor track (41) and the electrical line leading from it to the at least one electronic component (3). is formed by a connecting conductor track which runs at least in sections within the printed circuit board (1) and spaced vertically from the top and bottom of the printed circuit board (1).

3. Circuit board arrangement (100) according to claim 2, characterized in that at least one of the contacts (5) as a recess for recording of a conductive yarn and can be contacted in particular via the received conductive yarn, in particular by means of an embroidery process, with attachment of the printed circuit board arrangement (100) to a clothing fabric.

4. Printed circuit board arrangement (100) according to claim 3, characterized in that the cutout runs vertically through the printed circuit board (1) and is completely bounded by a printed circuit board area over its horizontal extent within the printed circuit board (1), the cutout delimiting the cutout circuit board area is coated to prevent water arranged in the cutout from penetrating into the circuit board (1) via the circuit board area, with at least one of the contacts (5) in particular being designed as a hollow-cylindrical passage in the circuit board (1), whose opening extends from the top to to the underside of the printed circuit board (1) continuous hollow cylinder wall is continuously coated.

5. Printed circuit board arrangement (100) according to one of the preceding claims, characterized in that the top-side delimiting conductor track (41) encloses the first top-side region (120) in a closed ring-shaped manner and/or that a bottom-side delimiting conductor track is arranged on the underside of the circuit board (1) which runs over their trace length with their trace width at the bottom and over their trace length away divides the underside into two completely and uninterruptedly separated underside areas, with a first of these underside areas of the component section is formed and a second of these underside areas is formed by the contact section of the printed circuit board (1), the underside delimiting conductor track being arranged uninterrupted over its conductor track length at least with part of its conductor track width inside the plastic protective layer (2) and being sealed to it, wherein especially the bottom one

An adhesion promoter is applied over the length of the delimitation conductor, which ensures a sealing connection between the plastic protective layer (2) and the delimitation conductor on the underside, with the delimitation conductor on the underside in particular enclosing the first underside area in a closed ring shape.

6. Printed circuit board arrangement (100) according to claims 4 and 5, characterized in that a first of the contacts (5) is formed at least partially by the upper-side delimiting conductor track (41) and a second of the contacts (5) is at least partially formed by the lower-side delimiting conductor track is.

7. Printed circuit board arrangement (100) according to one of Claims 5 or 6, characterized in that the top-side delimiting conductor track (41) and the bottom-side delimiting conductor track each extend with their conductor track lengths from a first end to a second end, the first ends extending from the top - and the lower-side delimitation conductor track are connected to one another by a first plate narrow-side section of the printed circuit board (1) and the second ends of the upper and lower-side delimitation conductor track are connected to one another by a second plate narrow side section of the printed circuit board (1), wherein the

Plastic protective layer (2) is connected to the first and the second board narrow side section in a sealing manner, forming a sealing ring (4) which runs around the printed circuit board (1) in a closed manner and delimits a volume in the plastic protective layer (2) in which the first upper side region (120) and the first bottom portion are sealingly enclosed.

8. Printed circuit board arrangement (100) according to Claim 7, characterized in that the board narrow-side sections each have a narrow-side conductor track (42) which extends between the ends of the delimiting conductor tracks connected by the respective board narrow-side section and connects them to one another, forming a through the delimiting conductor tracks and the board narrow-side conductor tracks trained, uninterrupted around the printed circuit board (1) peripheral sealing conductor track.

9. Printed circuit board arrangement (100) according to one of Claims 7 or 8, characterized in that to form the sealing ring (4), an adhesion promoter ring that runs uninterruptedly around the printed circuit board (1) is applied to the upper and lower-side delimiting conductor tracks and the board narrow side sections and seals with them is connected, which is sealingly connected to the plastic protective layer 82).

10. Printed circuit board arrangement (100) according to one of Claims 5 to 9, characterized in that the top-side delimiting conductor track (41) has a first conductor track section, with which it encloses the first top-side region (120) in a closed manner, and a second conductor track section, with the second trace section and the bottom

The delimitation conductor track extends in each case with their conductor track lengths from a first end to a second end, the first ends of the second conductor track section of the upper-side delimitation conductor track and the lower-side delimitation conductor track being connected to one another by the first board narrow side section of the printed circuit board (1) and the second ends of the second conductor track section of the upper-side delimitation conductor track and the lower-side delimitation conductor track are connected to one another by the second plate narrow side section of the printed circuit board (1), the

11. Circuit board arrangement (100) according to any one of the preceding claims, characterized in that the contact section on each surface that runs vertically between the top and bottom of the circuit board (1), is continuously coated with a protective layer.

12. A method for producing a printed circuit board arrangement (100) comprising a printed circuit board (1) which extends horizontally with its plate surface and has an upper side and a lower side, at least one electronic component (3) being arranged on a flat component section of the printed circuit board (1), characterized in that characterized in that a top-side delimiting conductor track (41) is arranged on the top side of the printed circuit board (1), which runs over a conductor track length with a conductor track width at the top and over its conductor track length the top side is divided into two top side regions (120, 110), with a first of these upper side areas (120) being formed by the component section and a second of these upper side areas (110) being formed by a flat contact section of the printed circuit board (1), with a protective plastic layer (2), in particular by means of an injection molding process, being applied to the circuit board (1) d is applied in such a way that the component section is completely enclosed in the plastic protective layer (2) and the top-side delimiting conductor track is arranged uninterrupted over its conductor track length at least with part of its conductor track width within the plastic protective layer (2) and is connected to it in a sealed manner, with particular reference to the an adhesion promoter is applied to the top-side delimiting conductor track (41) over the length of its conductor track before the protective plastic layer (2) is applied to the printed circuit board (1), with the contact section in particular being clamped in a tool holder while the protective plastic layer (2) is applied becomes.

13. A washable garment comprising a

Printed circuit board assembly (100) according to any one of claims 1 to 11, wherein the printed circuit board assembly (100) is integrated into the garment in such a way that when the garment is immersed in 30° warm water for 30 minutes, the printed circuit board assembly (100) is in direct contact with the water is.