EP4283376A1 - Electronic device - Google Patents

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Publication number
EP4283376A1
EP4283376A1 EP23174030.9A EP23174030A EP4283376A1 EP 4283376 A1 EP4283376 A1 EP 4283376A1 EP 23174030 A EP23174030 A EP 23174030A EP 4283376 A1 EP4283376 A1 EP 4283376A1
Authority
EP
European Patent Office
Prior art keywords
electronic device
transparent element
light
optical component
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23174030.9A
Other languages
German (de)
French (fr)
Inventor
Chen-wei FAN
Chi-Wei Chi
Wei-Fong Hong
Ssu-Hsin Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Largan Precision Co Ltd
Original Assignee
Largan Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Largan Precision Co Ltd filed Critical Largan Precision Co Ltd
Publication of EP4283376A1 publication Critical patent/EP4283376A1/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/113Anti-reflection coatings using inorganic layer materials only
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/113Anti-reflection coatings using inorganic layer materials only
    • G02B1/115Multilayers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0018Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for preventing ghost images
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/118Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14Protective coatings, e.g. hard coatings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/101Nanooptics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01Head-up displays
    • G02B27/017Head mounted
    • G02B27/0172Head mounted characterised by optical features

Definitions

  • the present disclosure relates to an electronic device. More particularly, the present disclosure relates to a portable electronic device.
  • Fig. 7 is a schematic view of a light L traveling through the optical component 720 according to the prior art.
  • the light L easily reflects between a transparent element 710 and the optical component 720, and hence the stray light is easily formed on the imaging surface of the electronic device according to the prior art so as to influence the functional performance of the optical component. Therefore, an electronic device, which can reduce the reflection of the light between transparent element and the optical component, needs to be developed.
  • an electronic device includes a transparent element, an optical component and an anti-reflecting layer.
  • the transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface.
  • the inner side surface faces towards the inner side, and the outer side surface faces towards the outer side.
  • the optical component is corresponding to the inner side surface of the transparent element.
  • the anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.
  • the anti-reflecting layer includes a nanostructure layer
  • the nanostructure layer includes a plurality of ridge-like protrusions
  • the ridge-like protrusions extend non-directionally from a disposing surface
  • a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface
  • each of the ridge-like protrusions is tapered from the bottom towards the top.
  • the anti-reflecting layer further includes a structure connection film
  • the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer.
  • an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R 4070 , and the following condition is satisfied: R 4070 ⁇ 0.5%.
  • an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 750 nm and 900 nm is R 7590 , and the following condition is satisfied: R 7590 ⁇ 0.65%.
  • an average structural height of the nanostructure layer is larger than or equal to 70 nm and less than or equal to 350 nm.
  • the outer side surface includes an anti-scratch layer.
  • the optical component is an imaging camera.
  • a spacing distance between the inner side surface and the optical component is D, and the following condition is satisfied: D ⁇ 5 mm.
  • the anti-reflecting layer is further disposed on the optical component.
  • the transparent element further includes a light blocking structure.
  • a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component.
  • a number of the transparent element is at least two
  • a number of the optical component is at least two
  • each of the transparent elements is corresponding to each of the optical components.
  • the inner side surface of one of the transparent elements is non-planar.
  • a number of the optical component is at least two, and the optical components are corresponding to the inner side surface of the transparent element.
  • one of the optical components is an imaging camera, and the other one of the optical components is a light-emitting element.
  • the optical components are at least two imaging cameras, and a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras.
  • a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components.
  • the electronic device is a portable electronic device.
  • the present disclosure provides an electronic device, which includes a transparent element, an optical component and an anti-reflecting layer.
  • the transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface, wherein the inner side surface faces towards the inner side, and the outer side surface faces towards the outer side.
  • the optical component is corresponding to the inner side surface of the transparent element.
  • the anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element. Hence, the reflection of the stray light between the transparent element and the optical component can be avoided by disposing the anti-reflecting layer on the inner side surface of the transparent element so as to enhance the image quality.
  • the anti-reflecting layer can include a nanostructure layer, wherein the nanostructure layer includes a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
  • the nanostructure layer can include an aluminum oxide.
  • the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer from the bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light.
  • the anti-reflecting layer can further include a structure connection film, wherein the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer. Therefore, the connecting stability of the nanostructure layer can be enhanced, so that the nanostructure layer can be stably attached on different materials.
  • a partial area of the top of the silicon dioxide layer can be contacted with an air.
  • the nanostructure layer has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer.
  • the outer side surface can include an anti-scratch layer. Therefore, the scratch can be avoided forming on the outer side surface of the transparent element so as to avoid influencing the operation of the optical component.
  • the optical component can be an imaging camera, and the anti-reflecting layer can be further disposed on the optical component, so that the reflection of the light between the elements on the inner side of the electronic device can be further reduced to enhance the image quality.
  • the elements disposed on the imaging camera can be a lens barrel or a lens element, but the present disclosure is not limited thereto.
  • the transparent element can further include a light blocking structure, wherein a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component.
  • the light blocking structure is configured to avoid the light passing through, and the light blocking structure can be the black ink spraying layer formed via the quick drying ink based on the epoxy resin, the blackened coating layer via the chemical vaper deposition, the photoresistive coating layer or the light blocking sheet composed of the black polyethylene terephthalate (PET) material, but the present disclosure is not limited thereto.
  • a number of the transparent element can be at least two, a number of the optical component can be at least two, and each of the transparent elements is corresponding to each of the optical components.
  • the anti-reflecting layer can be adjusted according to the requirement of the optical components.
  • the inner side surface of one of the transparent elements can be non-planar. Therefore, the reflecting path of the light can be changed, or the transparent element can have the refractive power.
  • a number of the optical component can be at least two, and the optical components are corresponding to the inner side surface of the transparent element.
  • the transparent element is only required to be coated once for corresponding to the optical components with different working wavelengths so as to simplify the manufacturing process.
  • One of the optical components can be an imaging camera, and the other one of the optical components can be a light-emitting element, wherein the light-emitting element can be an infrared light-emitting element for the purpose such as the space recognition and the distance measurement.
  • the light-emitting element can be a flash element for the purpose such as the light-filling and the illumination, and the working wavelength of the flash module is between 400 nm and 700 nm corresponding to the wavelength range of the visible light.
  • the optical components can be at least two imaging cameras, wherein a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras, and a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components.
  • the imaging cameras can be an ultra-long-focal telephoto imaging camera, a long-focal portrait imaging camera, a wide-angle imaging camera, a ultra-wide-angle imaging camera or a TOF (Time-Of-Flight) camera module, wherein a field of view of the ultra-long-focal telephoto imaging camera is between about 20 degrees and 30 degrees, a working wavelength of the ultra-long-focal telephoto imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the long-focal portrait imaging camera is about 50 degrees, a working wavelength of the long-focal portrait imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the wide-angle imaging camera is about 90 degrees, a working wavelength of the wide-angle imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the ultra-wide-angle
  • the electronic device can be a portable electronic device.
  • R 4070 When an average reflectivity of at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R 4070 , the following condition can be satisfied: R 4070 ⁇ 0.5%.
  • the following condition can be satisfied: R 7590 ⁇ 0.65%.
  • the low reflectivity can be simultaneously maintained during the wavelength range of the visible light and the wavelength range of the infrared light by the anti-reflecting layer based on the graded refractive index in contrast to the anti-reflecting layer based on the interference principle of the thin film.
  • the reflection of the stray light can be reduced by maintaining the low reflectivity during the wavelength range of the visible light and the wavelength range of the infrared light to enhance the image quality of the imaging camera, and the infrared light component (such as the TOF camera) with the sufficient penetration of the infrared light can be provided so as to avoid influencing the function of the infrared light component.
  • the infrared light component such as the TOF camera
  • An average structural height of the nanostructure layer can be larger than or equal to 70 nm and less than or equal to 350 nm. It should be mentioned that the average height is calculated by the structural heights of at least three or more ridge-like protrusions from the nanostructure layer, wherein the destructive measurement is to measure the vertical height from the absolute bottom (that is, the foot of the mountain) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the cross section.
  • the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the outer surface.
  • Fig. 1A is a three dimensional view of an electronic device 10 according to the 1st example of the present disclosure.
  • Fig. 1B is a partial exploded view of the electronic device 10 according to the 1st example in Fig. 1A .
  • Fig. 1C is a partial perspective view of the electronic device 10 according to the 1st example in Fig. 1A .
  • Fig. 1D is a schematic view of a light L traveling through the optical component 121 according to the 1st example in Fig. 1A .
  • Fig. 1E is a schematic view of the transparent element 110 and the optical component 121 according to the 1st example in Fig. 1A .
  • Figs. 1A is a three dimensional view of an electronic device 10 according to the 1st example of the present disclosure.
  • Fig. 1B is a partial exploded view of the electronic device 10 according to the 1st example in Fig. 1A .
  • Fig. 1C is a partial perspective view of the
  • the electronic device 10 can be a smart electronic device, and the electronic device 10 includes a transparent element 110, a plurality of optical components 121, 122, 123, 124, 125, 126 and an anti-reflecting layer 130, wherein the transparent element 110 is configured to separate an inner side and an outer side of the electronic device 10, so that the light L passes through the transparent element 110 to enter or leave the electronic device 10.
  • the traveling path of the light L in Fig. 1D is only configured to be the schematic view rather than limiting the traveling path of the light L.
  • the optical components 121, 123, 124, 125, 126 are imaging cameras, respectively, and the optical component 122 is a light-emitting element, wherein a field of view of one of the imaging cameras is different from a field of view of another one of the imaging cameras.
  • the optical component 121 is a wide-angle imaging camera
  • the optical component 122 is a flash module
  • the optical component 123 is a long-focal portrait imaging camera
  • the optical component 124 is an ultra-long-focal telephoto imaging camera
  • the optical component 125 is a TOF camera module
  • the optical component 126 is a ultra-wide-angle imaging camera, wherein the TOF camera module can include a transmitting end and a receiving end.
  • a field of view of the optical component 121 is about 90 degrees, a working wavelength of the optical component 121 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the optical component 122 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the optical component 123 is about 50 degrees, a working wavelength of the optical component 123 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the optical component 124 is between about 20 degrees and 30 degrees, a working wavelength of the optical component 124 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the optical component 125 is between 800 nm and 1100 nm corresponding to the wavelength range of the infrared light; a field of view of the optical component 126 is about 130 degrees, a working wavelength of the optical component 126 is between 400 nm and 700 n
  • the transparent element 110 includes an inner side surface 111 (labeled in Fig. 1E ) and an outer side surface 112, wherein the inner side surface 111 faces towards the inner side, and the outer side surface 112 faces towards the outer side. Furthermore, the optical components 121, 122, 123, 124, 125, 126 are corresponding to the inner side surface 111 of the transparent element 110, and the anti-reflecting layer 130 is disposed on at least one portion of the inner side surface 111 of the transparent element 110. In particular, the light L is easily reflected between the transparent element 110 and the optical components 121, 122, 123, 124, 125, 126 to influence the functional performance of the optical components 121, 122, 123, 124, 125, 126.
  • the reflection of the stray light between the transparent element 110 and the optical components 121, 122, 123, 124, 125, 126 can be avoided by disposing the anti-reflecting layer 130 on the inner side surface 111 of the transparent element 110 so as to enhance the image quality.
  • the transparent element 110 is only required to be coated once for corresponding to the optical components 121, 122, 123, 124, 125, 126 with different working wavelengths so as to simplify the manufacturing process.
  • the anti-reflecting layer 130 can be further disposed on the optical components 121, 122, 123, 124, 125, 126, wherein the anti-reflecting layer 130 can be disposed on the optical components such as a lens barrel and a lens element, so that the reflection of the light between the elements inside the electronic device 10 can be further reduced for enhancing the image quality.
  • a spacing distance between the inner side surface 111 and the optical component 121 is D, and the spacing distance D is 1.7 mm.
  • Fig. 1F is a partial enlarged view of the transparent element 110 according to the 1st example in Fig. 1E .
  • Fig. 1G is a partial enlarged view of the inner side surface 111 of the transparent element 110 according to the 1st example in Fig. 1F .
  • Fig. 1H is an enlarged view of the light blocking structure 113 and the anti-reflecting layer 130 according to the 1st example in Fig. 1G .
  • Fig. 1I is an enlarged view of the transparent element 110 and the anti-reflecting layer 130 according to the 1st example in Fig. 1G .
  • Fig. 1J is a scanning electron microscope image of the transparent element 110 and the anti-reflecting layer 130 according to the 1st example in Fig. 1I .
  • Fig. 1K is a scanning electron microscope image of the nanostructure layer 131 according to the 1st example in Fig. 1I .
  • Fig. 1L is a partial enlarged view of the outer side surface 112 of the transparent element 110 according to the 1st example in Fig. 1F .
  • Fig. 1M is a schematic view of the transparent element 110 according to the 1st example in Fig. 1A .
  • Fig. 1N is a partial scanning electron microscope image of the transparent element 110 according to the 1st example in Fig. 1M .
  • Figs. 1K is a scanning electron microscope image of the nanostructure layer 131 according to the 1st example in Fig. 1I .
  • Fig. 1L is a partial enlarged view of the outer side surface 112 of the transparent element 110 according to the 1st example in Fig. 1F .
  • Fig. 1M is a schematic view of the transparent element 110 according to the 1st example in Fig. 1A .
  • the anti-reflecting layer 130 can include a nanostructure layer 131 and a structure connection film 132
  • the outer side surface 112 can include an anti-scratch layer 140
  • the transparent element 110 can further include a light blocking structure 113, wherein the light blocking structure 113 is configured to avoid the light L passing through, a light-transmitting area 150 is remained on the transparent element 110 via the light blocking structure 113, and the light-transmitting area 150 is corresponding to the optical components 121, 122, 123, 124, 125, 126, so that the light L can pass through the transparent element 110 to enter or leave the electronic device 10.
  • the portion except the light-transmitting area 150 can be blocked by disposing the light blocking structure 113 on the transparent element 110 so as to reduce the stray light.
  • the nanostructure layer 131 can include a plurality of ridge-like protrusions (their reference numerals are omitted), wherein the ridge-like protrusions extend non-directionally from a disposing surface (its reference numeral is omitted), a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
  • the nanostructure layer 131 can include an aluminum oxide.
  • the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer 131 from the absolute bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light L reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light L.
  • the destructive measurement is to measure the vertical height from the absolute bottom of the ridge-like protrusions to the top of the ridge-like protrusions during the observation of the structural height of the nanostructure layer 131 from the cross section, wherein the vertical height H1 of the nanostructure layer 131 is 248.7 nm, the vertical height H1' of the nanostructure layer 131 is 247.4 nm, and the vertical height H1" of the nanostructure layer 131 is 203 nm.
  • the average structural height of the nanostructure layer 131 is 233 nm.
  • the vertical height H3 of the structure connection film 132 is 75.15 nm.
  • the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer 131 from the outer surface, wherein the vertical height H2 of the nanostructure layer 131 is 143.6 nm, the vertical height H2' of the nanostructure layer 131 is 143.1 nm, the vertical height H2" of the nanostructure layer 131 is 131.5 nm.
  • the average structural height of the nanostructure layer 131 is 139.4 nm.
  • the structure connection film 132 includes at least one silicon dioxide layer (its reference numeral is omitted), wherein a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer 131, and a partial area of the top of the silicon dioxide layer is contacted with an air. Therefore, the connecting stability of the nanostructure layer 131 can be enhanced, so that the nanostructure layer 131 can be stably attached on different materials. Further, the nanostructure layer 131 has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer 131.
  • the anti-scratch layer 140 can be further disposed on the anti-reflecting layer 130, and a number of the anti-reflecting layer 130 disposed on the outer side surface 112 is a plurality. Therefore, the scratch can be avoided forming on the outer side surface 112 of the transparent element 110 via the anti-scratch layer 140 so as to avoid influencing the operation of the optical components 121, 122, 123, 124, 125, 126.
  • the layer number and the thickness of the anti-reflecting layer 130 are only configured to be the schematic view, so that the layer number and the thickness thereof can be adjusted according to the actual condition, but the present disclosure is not limited thereto.
  • Fig. 1O is a measurement result of the reflectivity according to the 1st example in Fig. 1A .
  • Table 1 lists the result of the reflectivity according to the 1st example.
  • Table 2 lists an average reflectivity R 7590 and an average reflectivity R 4070 according to the 1st example.
  • the average reflectivity of at least one portion of the inner side surface 111 of the transparent element 110 corresponding to a light with a wavelength range between 750 nm and 900 nm is R 7590
  • the average reflectivity of at least one portion of the inner side surface 111 of the transparent element 110 corresponding to a light with a wavelength range between 400 nm and 700 nm is R 4070
  • each of a first reference sheet and a second reference sheet is a plastic substrate (that is corresponding to the transparent element 110)
  • the nanostructure layer 131 is disposed on the surface of each of the plastic substrates so as to be the reference of the reflectivity of the surface of each of the optical components 121, 122, 123, 124, 125, 126 which the nanostructure layer 131 is disposed on.
  • the dot pattern and the inclined-striped pattern in Figs. 1A , 1B , 1F to 1I and 1M are configured to indicate the range of the anti-reflecting layer 130 and the range of the light blocking structure 113, respectively, the thickness of the anti-reflecting layer 130, the thickness of anti-scratch layer 140 and the thickness of the light blocking structure 113 are only configured to be the schematic view, and the thicknesses thereof are not shown according to the actual ratio.
  • Fig. 2A is a partial exploded view of an electronic device 20 according to the 2nd example of the present disclosure.
  • the electronic device 20 can be a smart electronic device, and the electronic device 20 includes a plurality of transparent elements 210, a plurality of optical components 221, 222, 223, 224, 225, 226 and an anti-reflecting layer 230, wherein the transparent elements 210 are configured to separate an inner side and an outer side of the electronic device 20, so that the light (not shown) passes through the transparent elements 210 to enter or leave the electronic device 20.
  • each of the transparent elements 210 is corresponding to each of the optical components 221, 222, 223, 224, 225, 226. Therefore, the anti-reflecting layer 230 can be adjusted according to the requirement of the optical component 221.
  • Fig. 2B is a schematic view of the transparent element 210 and the optical component 221 according to the 2nd example in Fig. 2A .
  • each of the transparent elements 210 includes an inner side surface 211 and an outer side surface 212, wherein the inner side surface 211 faces towards the inner side, and the outer side surface 212 faces towards the outer side.
  • the inner side surface 211 of each of the transparent elements 210 is non-planar. Therefore, the reflecting path of the light can be changed so as to avoid influencing the operation of the optical component 221 by the reflecting light.
  • the transparent elements 210 can have the refractive power.
  • the dot pattern in Fig. 2A is configured to indicate the range of the anti-reflecting layer 230, the optical system and the structural dispositions according to the 2nd example are the same as the optical system and the structural dispositions according to the 1st example, and hence will not be described again herein.
  • Fig. 3A is a three dimensional view of an electronic device 30 according to the 3rd example of the present disclosure.
  • Fig. 3B is a partial exploded view of the electronic device 30 according to the 3rd example in Fig. 3A .
  • the electronic device 30 can be a smart electronic device, and the electronic device 30 includes a transparent element 310, an optical component 320 and an anti-reflecting layer 330.
  • the optical component 320 is a telescopic imaging camera.
  • the optical component 320 is disposed inside the electronic device 30; when the optical component 320 is started, the optical component 320 is lifted from inside of the electronic device 30 so as to keep the consistency of a display area 31 of the electronic device 30 to enhance the displaying effect.
  • the transparent element 310 is configured to separate an inner side and an outer side of the electronic device 30, so that the light (not shown) passes through the transparent element 310 to enter or leave the electronic device 30.
  • the transparent element 310 includes an inner side surface 311 (labeled in Fig. 3D ) and an outer side surface 312, wherein the inner side surface 311 faces towards the inner side, and the outer side surface 312 faces towards the outer side.
  • the optical component 320 is corresponding to the inner side surface 311 of the transparent element 310, and the anti-reflecting layer 330 is disposed on at least one portion of the inner side surface 311 of the transparent element 310.
  • Fig. 3C is a schematic view of the transparent element 310 according to the 3rd example in Fig. 3A .
  • the transparent element 310 can further include a light blocking structure 313, wherein the light blocking structure 313 is configured to avoid the light passing through, a light-transmitting area 350 is remained on the transparent element 310 via the light blocking structure 313, and the light-transmitting area 350 is corresponding to the optical component 320, so that the light can pass through the transparent element 310 to enter or leave the electronic device 30.
  • the portion except the light-transmitting area 350 can be blocked by disposing the light blocking structure 313 on the transparent element 310 so as to reduce the stray light.
  • Fig. 3D is a cross-sectional view of the transparent element 310 along a 3D-3D line in Fig. 3C .
  • Fig. 3E is a partial enlarged view of the transparent element 310 according to the 3rd example in Fig. 3D .
  • a number of the anti-reflecting layer 330 is a plurality, wherein the anti-reflecting layer 330 can include a plurality of high refractive index films and a plurality of low refractive index films, which are alternately stacked, so that the anti-reflecting effect can be achieved based on the interference principle of the thin film.
  • the dot pattern and the inclined-striped pattern in Figs. 3A to 3C are configured to indicate the range of the anti-reflecting layer 330 and the range of the light blocking structure 313, respectively.
  • Fig. 4 is a three dimensional view of an electronic device 40 according to the 4th example of the present disclosure.
  • the electronic device 40 can be an AR (Augmented Reality) head-mounted device, and the electronic device 40 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and an anti-reflecting layer 430, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 40, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 40.
  • the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 430 is disposed on at least one portion of the inner side surface of the transparent element.
  • the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 4th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
  • Fig. 5 is a three dimensional view of an electronic device 50 according to the 5th example of the present disclosure.
  • the electronic device 50 can be an VR (Virtual Reality) head-mounted device, and the electronic device 50 includes a transparent element (its reference numeral is omitted), a plurality of optical components (their reference numerals are omitted) and an anti-reflecting layer 530, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 50, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 50.
  • VR Virtual Reality
  • the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical components are corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 530 is disposed on at least one portion of the inner side surface of the transparent element.
  • the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to the 5th example can be referred to the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
  • Fig. 6 is a three dimensional view of an electronic device 60 according to the 6th example of the present disclosure.
  • the electronic device 60 can be a video capturing device, and the electronic device 60 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and an anti-reflecting layer 630, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 60, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 60.
  • the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 630 is disposed on at least one portion of the inner side surface of the transparent element.
  • the electronic device 60 can further include a fill light module 61 and a focusing assisting module 62, and the electronic device 60 can be disposed on a computer monitor (its reference numeral is omitted).
  • the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 6th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.

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Abstract

An electronic device includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface. The inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.

Description

    BACKGROUND Technical Field
  • The present disclosure relates to an electronic device. More particularly, the present disclosure relates to a portable electronic device.
  • Description of Related Art
  • In recent years, portable electronic devices have developed rapidly. For example, intelligent electronic devices, head-mounted devices and video capturing devices have been filled in the lives of modern people. However, as technology advances, the quality requirements of the electronic device are becoming higher and higher.
  • Fig. 7 is a schematic view of a light L traveling through the optical component 720 according to the prior art. In Fig. 7, the light L easily reflects between a transparent element 710 and the optical component 720, and hence the stray light is easily formed on the imaging surface of the electronic device according to the prior art so as to influence the functional performance of the optical component. Therefore, an electronic device, which can reduce the reflection of the light between transparent element and the optical component, needs to be developed.
  • SUMMARY
  • According to one aspect of the present disclosure, an electronic device includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface. The inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.
  • According to the electronic device of the aforementioned aspect, wherein the anti-reflecting layer includes a nanostructure layer, the nanostructure layer includes a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
  • According to the electronic device of the aforementioned aspect, wherein the anti-reflecting layer further includes a structure connection film, the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer.
  • According to the electronic device of the aforementioned aspect, wherein a partial area of the top of the silicon dioxide layer is contacted with an air.
  • According to the electronic device of the aforementioned aspect, wherein an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, and the following condition is satisfied: R4070 ≤ 0.5%.
  • According to the electronic device of the aforementioned aspect, wherein an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, and the following condition is satisfied: R7590 ≤ 0.65%.
  • According to the electronic device of the aforementioned aspect, wherein an average structural height of the nanostructure layer is larger than or equal to 70 nm and less than or equal to 350 nm.
  • According to the electronic device of the aforementioned aspect, wherein the outer side surface includes an anti-scratch layer.
  • According to the electronic device of the aforementioned aspect, wherein the optical component is an imaging camera.
  • According to the electronic device of the aforementioned aspect, wherein a spacing distance between the inner side surface and the optical component is D, and the following condition is satisfied: D ≤ 5 mm.
  • According to the electronic device of the aforementioned aspect, wherein the anti-reflecting layer is further disposed on the optical component.
  • According to the electronic device of the aforementioned aspect, wherein the transparent element further includes a light blocking structure.
  • According to the electronic device of the aforementioned aspect, wherein a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component.
  • According to the electronic device of the aforementioned aspect, wherein a number of the transparent element is at least two, a number of the optical component is at least two, and each of the transparent elements is corresponding to each of the optical components.
  • According to the electronic device of the aforementioned aspect, wherein the inner side surface of one of the transparent elements is non-planar.
  • According to the electronic device of the aforementioned aspect, wherein a number of the optical component is at least two, and the optical components are corresponding to the inner side surface of the transparent element.
  • According to the electronic device of the aforementioned aspect, wherein one of the optical components is an imaging camera, and the other one of the optical components is a light-emitting element.
  • According to the electronic device of the aforementioned aspect, wherein the optical components are at least two imaging cameras, and a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras.
  • According to the electronic device of the aforementioned aspect, wherein a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components.
  • According to the electronic device of the aforementioned aspect, wherein the electronic device is a portable electronic device.
  • BRIEF DESCRIPTION OF THE DRAWINGS
    • Fig. 1A is a three dimensional view of an electronic device according to the 1st example of the present disclosure.
    • Fig. 1B is a partial exploded view of the electronic device according to the 1st example in Fig. 1A.
    • Fig. 1C is a partial perspective view of the electronic device according to the 1st example in Fig. 1A.
    • Fig. 1D is a schematic view of a light traveling through the optical component according to the 1st example in Fig. 1A.
    • Fig. 1E is a schematic view of the transparent element and the optical component according to the 1st example in Fig. 1A.
    • Fig. 1F is a partial enlarged view of the transparent element according to the 1st example in Fig. 1E.
    • Fig. 1G is a partial enlarged view of the inner side surface of the transparent element according to the 1st example in Fig. 1F.
    • Fig. 1H is an enlarged view of the light blocking structure and the anti-reflecting layer according to the 1st example in Fig. 1G.
    • Fig. 1I is an enlarged view of the transparent element and the anti-reflecting layer according to the 1st example in Fig. 1G.
    • Fig. 1J is a scanning electron microscope image of the transparent element and the anti-reflecting layer according to the 1st example in Fig. 1I.
    • Fig. 1K is a scanning electron microscope image of the nanostructure layer according to the 1st example in Fig. 1I.
    • Fig. 1L is a partial enlarged view of the outer side surface of the transparent element according to the 1st example in Fig. 1F.
    • Fig. 1M is a schematic view of the transparent element according to the 1st example in Fig. 1A.
    • Fig. 1N is a partial scanning electron microscope image of the transparent element according to the 1st example in Fig. 1M.
    • Fig. 1O is a measurement result of the reflectivity according to the 1st example in Fig. 1A.
    • Fig. 2A is a partial exploded view of an electronic device according to the 2nd example of the present disclosure.
    • Fig. 2B is a schematic view of the transparent element and the optical component according to the 2nd example in Fig. 2A.
    • Fig. 3A is a three dimensional view of an electronic device according to the 3rd example of the present disclosure.
    • Fig. 3B is a partial exploded view of the electronic device according to the 3rd example in Fig. 3A.
    • Fig. 3C is a schematic view of the transparent element according to the 3rd example in Fig. 3A.
    • Fig. 3D is a cross-sectional view of the transparent element along a 3D-3D line in Fig. 3C.
    • Fig. 3E is a partial enlarged view of the transparent element according to the 3rd example in Fig. 3D.
    • Fig. 4 is a three dimensional view of an electronic device according to the 4th example of the present disclosure.
    • Fig. 5 is a three dimensional view of an electronic device according to the 5th example of the present disclosure.
    • Fig. 6 is a three dimensional view of an electronic device according to the 6th example of the present disclosure.
    • Fig. 7 is a schematic view of a light traveling through the optical component according to the prior art.
    DETAILED DESCRIPTION
  • The present disclosure provides an electronic device, which includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface, wherein the inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element. Hence, the reflection of the stray light between the transparent element and the optical component can be avoided by disposing the anti-reflecting layer on the inner side surface of the transparent element so as to enhance the image quality.
  • The anti-reflecting layer can include a nanostructure layer, wherein the nanostructure layer includes a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top. Moreover, the nanostructure layer can include an aluminum oxide. Further, when the cross section of the light blocking element is observed, the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer from the bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light.
  • The anti-reflecting layer can further include a structure connection film, wherein the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer. Therefore, the connecting stability of the nanostructure layer can be enhanced, so that the nanostructure layer can be stably attached on different materials.
  • A partial area of the top of the silicon dioxide layer can be contacted with an air. In particular, the nanostructure layer has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer.
  • The outer side surface can include an anti-scratch layer. Therefore, the scratch can be avoided forming on the outer side surface of the transparent element so as to avoid influencing the operation of the optical component.
  • The optical component can be an imaging camera, and the anti-reflecting layer can be further disposed on the optical component, so that the reflection of the light between the elements on the inner side of the electronic device can be further reduced to enhance the image quality. Moreover, the elements disposed on the imaging camera can be a lens barrel or a lens element, but the present disclosure is not limited thereto.
  • The transparent element can further include a light blocking structure, wherein a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component. In particular, the light blocking structure is configured to avoid the light passing through, and the light blocking structure can be the black ink spraying layer formed via the quick drying ink based on the epoxy resin, the blackened coating layer via the chemical vaper deposition, the photoresistive coating layer or the light blocking sheet composed of the black polyethylene terephthalate (PET) material, but the present disclosure is not limited thereto.
  • A number of the transparent element can be at least two, a number of the optical component can be at least two, and each of the transparent elements is corresponding to each of the optical components. By each of the transparent elements corresponding to each of the optical components, the anti-reflecting layer can be adjusted according to the requirement of the optical components.
  • The inner side surface of one of the transparent elements can be non-planar. Therefore, the reflecting path of the light can be changed, or the transparent element can have the refractive power.
  • A number of the optical component can be at least two, and the optical components are corresponding to the inner side surface of the transparent element. By the single transparent element corresponding to a plurality of optical components, the transparent element is only required to be coated once for corresponding to the optical components with different working wavelengths so as to simplify the manufacturing process.
  • One of the optical components can be an imaging camera, and the other one of the optical components can be a light-emitting element, wherein the light-emitting element can be an infrared light-emitting element for the purpose such as the space recognition and the distance measurement. Or, the light-emitting element can be a flash element for the purpose such as the light-filling and the illumination, and the working wavelength of the flash module is between 400 nm and 700 nm corresponding to the wavelength range of the visible light.
  • The optical components can be at least two imaging cameras, wherein a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras, and a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components. In particular, the imaging cameras can be an ultra-long-focal telephoto imaging camera, a long-focal portrait imaging camera, a wide-angle imaging camera, a ultra-wide-angle imaging camera or a TOF (Time-Of-Flight) camera module, wherein a field of view of the ultra-long-focal telephoto imaging camera is between about 20 degrees and 30 degrees, a working wavelength of the ultra-long-focal telephoto imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the long-focal portrait imaging camera is about 50 degrees, a working wavelength of the long-focal portrait imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the wide-angle imaging camera is about 90 degrees, a working wavelength of the wide-angle imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the ultra-wide-angle imaging camera is about 130 degrees, a working wavelength of the ultra-wide-angle imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the TOF camera module is between 800 nm and 1100 nm corresponding to the wavelength range of the infrared light.
  • The electronic device can be a portable electronic device.
  • When an average reflectivity of at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, the following condition can be satisfied: R4070 ≤ 0.5%.
  • When an average reflectivity of at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, the following condition can be satisfied: R7590 ≤ 0.65%. In particular, the low reflectivity can be simultaneously maintained during the wavelength range of the visible light and the wavelength range of the infrared light by the anti-reflecting layer based on the graded refractive index in contrast to the anti-reflecting layer based on the interference principle of the thin film. Therefore, the reflection of the stray light can be reduced by maintaining the low reflectivity during the wavelength range of the visible light and the wavelength range of the infrared light to enhance the image quality of the imaging camera, and the infrared light component (such as the TOF camera) with the sufficient penetration of the infrared light can be provided so as to avoid influencing the function of the infrared light component.
  • An average structural height of the nanostructure layer can be larger than or equal to 70 nm and less than or equal to 350 nm. It should be mentioned that the average height is calculated by the structural heights of at least three or more ridge-like protrusions from the nanostructure layer, wherein the destructive measurement is to measure the vertical height from the absolute bottom (that is, the foot of the mountain) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the cross section. Or, the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the outer surface.
  • When a spacing distance between the inner side surface and the optical component is D, the following condition can be satisfied: D ≤ 5 mm. When the spacing distance satisfied the aforementioned condition, the light is not easily reflected between the transparent element and the optical component, and the light cannot enter into the optical component again so as to avoid influencing the image quality.
  • Each of the aforementioned features of the electronic device can be utilized in various combinations for achieving the corresponding effects.
  • According to the aforementioned embodiment, specific examples are provided, and illustrated via figures.
  • <1st example>
  • Fig. 1A is a three dimensional view of an electronic device 10 according to the 1st example of the present disclosure. Fig. 1B is a partial exploded view of the electronic device 10 according to the 1st example in Fig. 1A. Fig. 1C is a partial perspective view of the electronic device 10 according to the 1st example in Fig. 1A. Fig. 1D is a schematic view of a light L traveling through the optical component 121 according to the 1st example in Fig. 1A. Fig. 1E is a schematic view of the transparent element 110 and the optical component 121 according to the 1st example in Fig. 1A. In Figs. 1A to 1E, the electronic device 10 can be a smart electronic device, and the electronic device 10 includes a transparent element 110, a plurality of optical components 121, 122, 123, 124, 125, 126 and an anti-reflecting layer 130, wherein the transparent element 110 is configured to separate an inner side and an outer side of the electronic device 10, so that the light L passes through the transparent element 110 to enter or leave the electronic device 10. It should be mentioned that the traveling path of the light L in Fig. 1D is only configured to be the schematic view rather than limiting the traveling path of the light L.
  • The optical components 121, 123, 124, 125, 126 are imaging cameras, respectively, and the optical component 122 is a light-emitting element, wherein a field of view of one of the imaging cameras is different from a field of view of another one of the imaging cameras. Moreover, the optical component 121 is a wide-angle imaging camera, the optical component 122 is a flash module, the optical component 123 is a long-focal portrait imaging camera, the optical component 124 is an ultra-long-focal telephoto imaging camera, the optical component 125 is a TOF camera module, and the optical component 126 is a ultra-wide-angle imaging camera, wherein the TOF camera module can include a transmitting end and a receiving end. In detail, a field of view of the optical component 121 is about 90 degrees, a working wavelength of the optical component 121 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the optical component 122 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the optical component 123 is about 50 degrees, a working wavelength of the optical component 123 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the optical component 124 is between about 20 degrees and 30 degrees, a working wavelength of the optical component 124 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the optical component 125 is between 800 nm and 1100 nm corresponding to the wavelength range of the infrared light; a field of view of the optical component 126 is about 130 degrees, a working wavelength of the optical component 126 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light.
  • The transparent element 110 includes an inner side surface 111 (labeled in Fig. 1E) and an outer side surface 112, wherein the inner side surface 111 faces towards the inner side, and the outer side surface 112 faces towards the outer side. Furthermore, the optical components 121, 122, 123, 124, 125, 126 are corresponding to the inner side surface 111 of the transparent element 110, and the anti-reflecting layer 130 is disposed on at least one portion of the inner side surface 111 of the transparent element 110. In particular, the light L is easily reflected between the transparent element 110 and the optical components 121, 122, 123, 124, 125, 126 to influence the functional performance of the optical components 121, 122, 123, 124, 125, 126. Therefore, the reflection of the stray light between the transparent element 110 and the optical components 121, 122, 123, 124, 125, 126 can be avoided by disposing the anti-reflecting layer 130 on the inner side surface 111 of the transparent element 110 so as to enhance the image quality. By the single transparent element 110 corresponding to the optical components 121, 122, 123, 124, 125, 126, the transparent element 110 is only required to be coated once for corresponding to the optical components 121, 122, 123, 124, 125, 126 with different working wavelengths so as to simplify the manufacturing process. Moreover, the anti-reflecting layer 130 can be further disposed on the optical components 121, 122, 123, 124, 125, 126, wherein the anti-reflecting layer 130 can be disposed on the optical components such as a lens barrel and a lens element, so that the reflection of the light between the elements inside the electronic device 10 can be further reduced for enhancing the image quality.
  • In Fig. 1E, taking the optical component 121 as the example, a spacing distance between the inner side surface 111 and the optical component 121 is D, and the spacing distance D is 1.7 mm.
  • Fig. 1F is a partial enlarged view of the transparent element 110 according to the 1st example in Fig. 1E. Fig. 1G is a partial enlarged view of the inner side surface 111 of the transparent element 110 according to the 1st example in Fig. 1F. Fig. 1H is an enlarged view of the light blocking structure 113 and the anti-reflecting layer 130 according to the 1st example in Fig. 1G. Fig. 1I is an enlarged view of the transparent element 110 and the anti-reflecting layer 130 according to the 1st example in Fig. 1G. Fig. 1J is a scanning electron microscope image of the transparent element 110 and the anti-reflecting layer 130 according to the 1st example in Fig. 1I. Fig. 1K is a scanning electron microscope image of the nanostructure layer 131 according to the 1st example in Fig. 1I. Fig. 1L is a partial enlarged view of the outer side surface 112 of the transparent element 110 according to the 1st example in Fig. 1F. Fig. 1M is a schematic view of the transparent element 110 according to the 1st example in Fig. 1A. Fig. 1N is a partial scanning electron microscope image of the transparent element 110 according to the 1st example in Fig. 1M. In Figs. 1F to 1N, the anti-reflecting layer 130 can include a nanostructure layer 131 and a structure connection film 132, the outer side surface 112 can include an anti-scratch layer 140, and the transparent element 110 can further include a light blocking structure 113, wherein the light blocking structure 113 is configured to avoid the light L passing through, a light-transmitting area 150 is remained on the transparent element 110 via the light blocking structure 113, and the light-transmitting area 150 is corresponding to the optical components 121, 122, 123, 124, 125, 126, so that the light L can pass through the transparent element 110 to enter or leave the electronic device 10. Moreover, the portion except the light-transmitting area 150 can be blocked by disposing the light blocking structure 113 on the transparent element 110 so as to reduce the stray light.
  • In Figs. 1H to 1K, the nanostructure layer 131 can include a plurality of ridge-like protrusions (their reference numerals are omitted), wherein the ridge-like protrusions extend non-directionally from a disposing surface (its reference numeral is omitted), a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top. Moreover, the nanostructure layer 131 can include an aluminum oxide. Further, when the cross section of the transparent element 110 is observed, the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer 131 from the absolute bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light L reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light L.
  • In Fig. 1J, the destructive measurement is to measure the vertical height from the absolute bottom of the ridge-like protrusions to the top of the ridge-like protrusions during the observation of the structural height of the nanostructure layer 131 from the cross section, wherein the vertical height H1 of the nanostructure layer 131 is 248.7 nm, the vertical height H1' of the nanostructure layer 131 is 247.4 nm, and the vertical height H1" of the nanostructure layer 131 is 203 nm. By the average of the sum of the vertical heights H1, H1', H1", the average structural height of the nanostructure layer 131 is 233 nm. Further, the vertical height H3 of the structure connection film 132 is 75.15 nm.
  • In Fig. 1K, the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer 131 from the outer surface, wherein the vertical height H2 of the nanostructure layer 131 is 143.6 nm, the vertical height H2' of the nanostructure layer 131 is 143.1 nm, the vertical height H2" of the nanostructure layer 131 is 131.5 nm. By the average of the sum of the vertical heights H2, H2', H2", the average structural height of the nanostructure layer 131 is 139.4 nm.
  • Moreover, the structure connection film 132 includes at least one silicon dioxide layer (its reference numeral is omitted), wherein a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer 131, and a partial area of the top of the silicon dioxide layer is contacted with an air. Therefore, the connecting stability of the nanostructure layer 131 can be enhanced, so that the nanostructure layer 131 can be stably attached on different materials. Further, the nanostructure layer 131 has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer 131.
  • In Fig. 1L, the anti-scratch layer 140 can be further disposed on the anti-reflecting layer 130, and a number of the anti-reflecting layer 130 disposed on the outer side surface 112 is a plurality. Therefore, the scratch can be avoided forming on the outer side surface 112 of the transparent element 110 via the anti-scratch layer 140 so as to avoid influencing the operation of the optical components 121, 122, 123, 124, 125, 126. It should be mentioned that the layer number and the thickness of the anti-reflecting layer 130 are only configured to be the schematic view, so that the layer number and the thickness thereof can be adjusted according to the actual condition, but the present disclosure is not limited thereto.
  • Fig. 1O is a measurement result of the reflectivity according to the 1st example in Fig. 1A. Table 1 lists the result of the reflectivity according to the 1st example. Table 2 lists an average reflectivity R7590 and an average reflectivity R4070 according to the 1st example. It should be mentioned that the average reflectivity of at least one portion of the inner side surface 111 of the transparent element 110 corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, the average reflectivity of at least one portion of the inner side surface 111 of the transparent element 110 corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, each of a first reference sheet and a second reference sheet is a plastic substrate (that is corresponding to the transparent element 110), the nanostructure layer 131 is disposed on the surface of each of the plastic substrates so as to be the reference of the reflectivity of the surface of each of the optical components 121, 122, 123, 124, 125, 126 which the nanostructure layer 131 is disposed on.
    Table 1
    wavelength (nm) the reflectivity of the first reference sheet (%) the reflectivity of the second reference sheet (%) wavelength (nm) the reflectivity of the first reference sheet (%) the reflectivity of the second reference sheet (%)
    380 0.0472 0.0472 716 0.0322 0.0335
    381 0.0585 0.1074 717 0.0319 0.0346
    382 0.0998 0.0998 718 0.0316 0.0343
    383 0.1204 0.1204 719 0.0334 0.0341
    384 0.0918 0.0918 720 0.0325 0.0338
    385 0.0403 0.0357 721 0.0336 0.0325
    386 0.052 0.0141 722 0.0325 0.0332
    387 0.0708 0.0577 723 0.0335 0.0349
    388 0.0663 0.0957 724 0.0327 0.0366
    389 0.0938 0.0983 725 0.0354 0.0368
    390 0.0995 0.117 726 0.036 0.0374
    391 0.0931 0.0931 727 0.0368 0.0373
    392 0.079 0.055 728 0.0356 0.0344
    393 0.0716 0.0296 729 0.0367 0.0369
    394 0.0584 0.0584 730 0.0356 0.0375
    395 0.084 0.0995 731 0.0365 0.0392
    396 0.1073 0.0882 732 0.0382 0.0398
    397 0.0665 0.0832 733 0.0386 0.0384
    398 0.071 0.0619 734 0.0392 0.0388
    399 0.058 0.0387 735 0.0393 0.0398
    400 0.0559 0.0373 736 0.0376 0.0388
    401 0.0716 0.0716 737 0.0387 0.0413
    402 0.0693 0.0693 738 0.0391 0.0405
    403 0.0791 0.0791 739 0.0409 0.0423
    404 0.0806 0.0646 740 0.0438 0.0429
    405 0.0626 0.0587 741 0.0429 0.043
    406 0.0529 0.0377 742 0.0417 0.0427
    407 0.0329 0.0294 743 0.0418 0.0425
    408 0.0428 0.0428 744 0.043 0.0444
    409 0.0586 0.0586 745 0.0434 0.0448
    410 0.0591 0.0662 746 0.0477 0.047
    411 0.0616 0.0439 747 0.0471 0.0457
    412 0.049 0.0366 748 0.0455 0.0455
    413 0.0362 0.0241 749 0.0466 0.0466
    414 0.0285 0.0234 750 0.0467 0.0471
    415 0.041 0.041 751 0.0476 0.0483
    416 0.0338 0.0448 752 0.0494 0.0504
    417 0.0459 0.053 753 0.05 0.0514
    418 0.0515 0.0394 754 0.0504 0.0489
    419 0.0417 0.0301 755 0.0504 0.049
    420 0.039 0.0293 756 0.0499 0.0494
    421 0.0347 0.0251 757 0.0505 0.0531
    422 0.0336 0.0358 758 0.0511 0.0525
    423 0.0442 0.0454 759 0.0542 0.0556
    424 0.0444 0.0433 760 0.0561 0.0557
    425 0.0435 0.0315 761 0.0554 0.0553
    426 0.0317 0.0201 762 0.0564 0.0564
    427 0.0252 0.0168 763 0.0545 0.0545
    428 0.0179 0.0192 764 0.0564 0.0564
    429 0.0279 0.0327 765 0.057 0.0582
    430 0.0377 0.0377 766 0.06 0.06
    431 0.0326 0.0252 767 0.0614 0.0614
    432 0.0252 0.0173 768 0.0614 0.0607
    433 0.0245 0.0201 769 0.0625 0.0611
    434 0.021 0.0156 770 0.0601 0.0601
    435 0.0159 0.0155 771 0.0597 0.0609
    436 0.0231 0.0231 772 0.0637 0.0644
    437 0.0266 0.023 773 0.0648 0.0653
    438 0.0251 0.0229 774 0.0671 0.0671
    439 0.0227 0.0081 775 0.0671 0.0669
    440 0.0226 0.0135 776 0.0664 0.0649
    441 0.0155 0.0111 777 0.0682 0.0667
    442 0.0129 0.0096 778 0.0676 0.0685
    443 0.015 0.022 779 0.0717 0.0717
    444 0.0223 0.0223 780 0.0721 0.0717
    445 0.0222 0.0222 781 0.0732 0.0725
    446 0.0167 0.0167 782 0.0743 0.0722
    447 0.0218 0.0146 783 0.0747 0.0746
    448 0.0112 0.0056 784 0.0736 0.0724
    449 0.007 0.0105 785 0.076 0.0755
    450 0.0197 0.0269 786 0.0788 0.0773
    451 0.0215 0.0286 787 0.0795 0.0793
    452 0.025 0.0196 788 0.0799 0.0784
    453 0.0176 0.0141 789 0.0822 0.0808
    454 0.0106 0.0036 790 0.0807 0.08
    455 0.0069 0.0069 791 0.0814 0.0802
    456 0.0069 0.0086 792 0.0819 0.0819
    457 0.0136 0.017 793 0.0846 0.0846
    458 0.0201 0.0201 794 0.0889 0.0875
    459 0.0199 0.0132 795 0.0899 0.0869
    460 0.0114 0.0065 796 0.0901 0.0885
    461 0.0032 0.0032 797 0.089 0.0874
    462 0.0096 0.0096 798 0.0893 0.0884
    463 0.0063 0.0064 799 0.0915 0.0906
    464 0.0138 0.0184 800 0.0931 0.0942
    465 0.018 0.015 801 0.0967 0.0966
    466 0.0132 0.0118 802 0.0972 0.0957
    467 0.0172 0.0115 803 0.0986 0.0962
    468 0.0098 0.0098 804 0.0976 0.0968
    469 0.0055 0.0084 805 0.0989 0.0989
    470 0.0096 0.015 806 0.0999 0.0999
    471 0.0108 0.0106 807 0.1024 0.1024
    472 0.0205 0.0168 808 0.1049 0.1038
    473 0.0173 0.0147 809 0.1074 0.1044
    474 0.0108 0.0059 810 0.1067 0.1051
    475 0.0095 0.005 811 0.1073 0.1051
    476 0.0092 0.0138 812 0.107 0.1056
    477 0.0113 0.0134 813 0.1095 0.1082
    478 0.013 0.0164 814 0.1109 0.1109
    479 0.0167 0.0126 815 0.115 0.1129
    480 0.0123 0.0123 816 0.1161 0.1135
    481 0.0119 0.0098 817 0.117 0.1141
    482 0.0116 0.0078 818 0.1164 0.1147
    483 0.0116 0.0151 819 0.1159 0.1146
    484 0.0183 0.0147 820 0.1192 0.1192
    485 0.0198 0.0182 821 0.1221 0.1221
    486 0.0209 0.0153 822 0.1253 0.1223
    487 0.0136 0.01 823 0.1276 0.1243
    488 0.0133 0.0077 824 0.1258 0.1235
    489 0.0094 0.0098 825 0.1267 0.1242
    490 0.0166 0.0147 826 0.128 0.1277
    491 0.0157 0.0186 827 0.1292 0.1291
    492 0.0192 0.0182 828 0.1326 0.1303
    493 0.0208 0.0178 829 0.1351 0.1333
    494 0.0203 0.0174 830 0.1376 0.1363
    495 0.0169 0.0115 831 0.136 0.1342
    496 0.0139 0.0139 832 0.1381 0.1351
    497 0.0152 0.0167 833 0.1382 0.1374
    498 0.0203 0.0208 834 0.1411 0.1393
    499 0.0232 0.0208 835 0.1442 0.1424
    500 0.0204 0.0204 836 0.1469 0.1436
    501 0.0185 0.0185 837 0.1476 0.147
    502 0.0171 0.0171 838 0.1494 0.1475
    503 0.0169 0.0191 839 0.1494 0.1475
    504 0.0187 0.0195 840 0.1483 0.1482
    505 0.0223 0.0246 841 0.1558 0.1525
    506 0.0266 0.025 842 0.1561 0.1542
    507 0.0222 0.022 843 0.1591 0.1572
    508 0.0231 0.0209 844 0.1603 0.1584
    509 0.0212 0.0203 845 0.1611 0.1576
    510 0.0208 0.0208 846 0.1617 0.159
    511 0.0208 0.0229 847 0.1612 0.1598
    512 0.0248 0.0261 848 0.168 0.1645
    513 0.0245 0.0233 849 0.1665 0.1625
    514 0.0249 0.023 850 0.1723 0.1683
    515 0.0244 0.0227 851 0.173 0.169
    516 0.0207 0.0207 852 0.172 0.168
    517 0.0237 0.0237 853 0.174 0.1721
    518 0.0255 0.0271 854 0.174 0.1735
    519 0.0286 0.0268 855 0.1795 0.1755
    520 0.0272 0.0255 856 0.1835 0.1774
    521 0.0269 0.0263 857 0.1846 0.1824
    522 0.0259 0.0259 858 0.1864 0.1827
    523 0.0256 0.0273 859 0.1844 0.1816
    524 0.0266 0.0277 860 0.1862 0.1834
    525 0.0294 0.0305 861 0.1867 0.1846
    526 0.0298 0.03 862 0.1932 0.1891
    527 0.028 0.028 863 0.1943 0.1909
    528 0.0291 0.0285 864 0.1983 0.1939
    529 0.0289 0.0283 865 0.1987 0.1941
    530 0.0258 0.0272 866 0.1988 0.1966
    531 0.0288 0.0301 867 0.201 0.1974
    532 0.0318 0.0324 868 0.2025 0.2004
    533 0.0315 0.0331 869 0.2055 0.2034
    534 0.0321 0.0309 870 0.2084 0.2043
    535 0.029 0.029 871 0.211 0.2086
    536 0.0294 0.0294 872 0.213 0.2089
    537 0.0311 0.032 873 0.2134 0.2092
    538 0.0327 0.0356 874 0.2137 0.2113
    539 0.0317 0.0331 875 0.2147 0.2143
    540 0.0346 0.0349 876 0.2205 0.2163
    541 0.0334 0.0329 877 0.2221 0.2191
    542 0.0323 0.0323 878 0.2265 0.2211
    543 0.0319 0.0324 879 0.2274 0.2231
    544 0.0318 0.0341 880 0.2273 0.222
    545 0.0345 0.035 881 0.2271 0.224
    546 0.035 0.0363 882 0.2298 0.2271
    547 0.0338 0.0353 883 0.2346 0.2325
    548 0.0351 0.0354 884 0.2392 0.2336
    549 0.0334 0.0338 885 0.241 0.238
    550 0.0337 0.0339 886 0.2437 0.2395
    551 0.0341 0.0357 887 0.246 0.2399
    552 0.0348 0.0367 888 0.2426 0.2403
    553 0.0359 0.0368 889 0.2464 0.2422
    554 0.0373 0.0376 890 0.2497 0.2466
    555 0.0363 0.0363 891 0.2533 0.2494
    556 0.0355 0.036 892 0.2566 0.2522
    557 0.0337 0.0352 893 0.2572 0.2513
    558 0.0351 0.0379 894 0.2567 0.2524
    559 0.0357 0.0387 895 0.2594 0.2551
    560 0.0374 0.039 896 0.2632 0.2589
    561 0.0368 0.0383 897 0.2664 0.2621
    562 0.0374 0.0378 898 0.2703 0.266
    563 0.0364 0.0364 899 0.2746 0.2689
    564 0.0362 0.0366 900 0.2726 0.2679
    565 0.0368 0.0384 901 0.2751 0.2705
    566 0.0361 0.0389 902 0.2771 0.2712
    567 0.037 0.0403 903 0.2788 0.2744
    568 0.0397 0.04 904 0.2834 0.279
    569 0.0373 0.0389 905 0.2868 0.2824
    570 0.0363 0.0367 906 0.2897 0.2853
    571 0.0359 0.0374 907 0.2897 0.2842
    572 0.036 0.0376 908 0.2897 0.2862
    573 0.0376 0.0392 909 0.2931 0.2887
    574 0.0385 0.0401 910 0.295 0.2905
    575 0.0394 0.0395 911 0.2991 0.2955
    576 0.0376 0.0376 912 0.3017 0.298
    577 0.0363 0.0376 913 0.3082 0.3017
    578 0.0364 0.0397 914 0.3057 0.3032
    579 0.0379 0.0397 915 0.3071 0.3018
    580 0.0366 0.0412 916 0.3087 0.3031
    581 0.0392 0.0414 917 0.3138 0.3091
    582 0.0393 0.0405 918 0.3163 0.3116
    583 0.0393 0.0393 919 0.3206 0.316
    584 0.0369 0.0385 920 0.3229 0.3182
    585 0.0369 0.0385 921 0.3236 0.3188
    586 0.0375 0.0393 922 0.3256 0.3208
    587 0.0378 0.0408 923 0.3277 0.321
    588 0.0397 0.0413 924 0.3312 0.3264
    589 0.0401 0.0406 925 0.3346 0.3298
    590 0.0376 0.0393 926 0.3391 0.3343
    591 0.0362 0.0391 927 0.3411 0.3362
    592 0.0356 0.0388 928 0.3419 0.3354
    593 0.0375 0.0391 929 0.3442 0.3343
    594 0.0392 0.0408 930 0.3438 0.3397
    595 0.0397 0.0401 931 0.3498 0.3449
    596 0.0395 0.0395 932 0.3531 0.3475
    597 0.0361 0.0377 933 0.3577 0.3526
    598 0.036 0.0383 934 0.3586 0.3543
    599 0.0358 0.0378 935 0.3601 0.3502
    600 0.0357 0.0388 936 0.3639 0.3561
    601 0.0386 0.039 937 0.3629 0.3571
    602 0.0392 0.0407 938 0.3693 0.3634
    603 0.0377 0.0393 939 0.3709 0.3652
    604 0.0366 0.0381 940 0.3741 0.3688
    605 0.0349 0.0379 941 0.3763 0.371
    606 0.0353 0.0377 942 0.3763 0.371
    607 0.036 0.0385 943 0.3799 0.3724
    608 0.037 0.0387 944 0.3834 0.378
    609 0.0381 0.0396 945 0.3858 0.3783
    610 0.037 0.0385 946 0.3905 0.3837
    611 0.0358 0.0381 947 0.3942 0.3878
    612 0.0344 0.0372 948 0.3956 0.3901
    613 0.0341 0.037 949 0.3969 0.3885
    614 0.0355 0.0383 950 0.4005 0.392
    615 0.0361 0.0381 951 0.4022 0.3936
    616 0.0369 0.0371 952 0.4055 0.3969
    617 0.0341 0.0368 953 0.4089 0.4058
    618 0.0347 0.036 954 0.4143 0.4085
    619 0.0335 0.0348 955 0.4178 0.4103
    620 0.0342 0.0366 956 0.417 0.4081
    621 0.0343 0.037 957 0.4191 0.4101
    622 0.0353 0.0388 958 0.4199 0.4116
    623 0.0357 0.037 959 0.4253 0.4178
    624 0.0352 0.0362 960 0.4296 0.4225
    625 0.0334 0.0347 961 0.4352 0.4261
    626 0.032 0.0346 962 0.4381 0.4266
    627 0.0325 0.0351 963 0.4368 0.4292
    628 0.034 0.0357 964 0.439 0.4294
    629 0.0343 0.0368 965 0.4366 0.4325
    630 0.035 0.0355 966 0.4462 0.4397
    631 0.033 0.0349 967 0.449 0.4424
    632 0.0321 0.0333 968 0.4537 0.447
    633 0.0317 0.0341 969 0.4565 0.4472
    634 0.0319 0.0342 970 0.4581 0.448
    635 0.033 0.0348 971 0.4557 0.448
    636 0.033 0.0347 972 0.4609 0.4521
    637 0.0342 0.0354 973 0.466 0.4589
    638 0.0316 0.0331 974 0.4713 0.4642
    639 0.0306 0.0331 975 0.4757 0.4655
    640 0.0298 0.0332 976 0.4764 0.4677
    641 0.0305 0.0344 977 0.4799 0.4689
    642 0.0322 0.0346 978 0.4768 0.4689
    643 0.0334 0.0347 979 0.4812 0.4737
    644 0.032 0.034 980 0.4862 0.4786
    645 0.0311 0.0326 981 0.49 0.4823
    646 0.0286 0.03 982 0.4903 0.4825
    647 0.0291 0.0317 983 0.5008 0.489
    648 0.0301 0.0327 984 0.4956 0.4867
    649 0.0312 0.0339 985 0.4979 0.4895
    650 0.0315 0.0329 986 0.5002 0.4903
    651 0.0304 0.0317 987 0.505 0.5041
    652 0.0304 0.0318 988 0.5083 0.5034
    653 0.0285 0.0298 989 0.5169 0.5067
    654 0.0292 0.0319 990 0.5186 0.5055
    655 0.0292 0.0329 991 0.5173 0.5079
    656 0.0299 0.0326 992 0.5197 0.5066
    657 0.0306 0.0332 993 0.5186 0.5095
    658 0.0292 0.0306 994 0.5264 0.5196
    659 0.0289 0.0305 995 0.5333 0.5249
    660 0.0285 0.0305 996 0.5359 0.5264
    661 0.0282 0.0305 997 0.5411 0.5277
    662 0.0278 0.0305 998 0.5363 0.5264
    663 0.0302 0.0328 999 0.541 0.5309
    664 0.0291 0.0312 1000 0.5375 0.532
    665 0.0282 0.0295 1001 0.55 0.5404
    666 0.0277 0.0291 1002 0.5532 0.5479
    667 0.0275 0.0302 1003 0.5617 0.5497
    668 0.0269 0.029 1004 0.5523 0.5452
    669 0.0277 0.0307 1005 0.5607 0.5501
    670 0.0289 0.0305 1006 0.5559 0.5503
    671 0.0289 0.0302 1007 0.5595 0.5505
    672 0.0277 0.0286 1008 0.5709 0.5637
    673 0.0261 0.0269 1009 0.5713 0.5652
    674 0.0262 0.0276 1010 0.5807 0.5732
    675 0.0266 0.0292 1011 0.5806 0.5681
    676 0.0282 0.0309 1012 0.5794 0.5623
    677 0.0291 0.031 1013 0.5779 0.5644
    678 0.0281 0.0294 1014 0.5769 0.5759
    679 0.0278 0.0292 1015 0.5861 0.5793
    680 0.0266 0.0293 1016 0.5976 0.5907
    681 0.0267 0.0286 1017 0.6057 0.5927
    682 0.0278 0.0291 1018 0.6021 0.5878
    683 0.0268 0.0307 1019 0.598 0.5856
    684 0.0294 0.0308 1020 0.5969 0.5894
    685 0.0274 0.0294 1021 0.6017 0.5941
    686 0.0265 0.0281 1022 0.604 0.604
    687 0.0255 0.0281 1023 0.6226 0.6127
    688 0.0261 0.0285 1024 0.6276 0.6112
    689 0.0282 0.0302 1025 0.6242 0.6075
    690 0.0282 0.0299 1026 0.6129 0.6036
    691 0.0282 0.0308 1027 0.6228 0.6065
    692 0.0279 0.0292 1028 0.6181 0.6125
    693 0.0274 0.0293 1029 0.6222 0.6222
    694 0.0272 0.0289 1030 0.632 0.632
    695 0.0267 0.0293 1031 0.6519 0.6327
    696 0.0291 0.0307 1032 0.6475 0.6277
    697 0.0285 0.0306 1033 0.6383 0.618
    698 0.0292 0.0314 1034 0.6366 0.6238
    699 0.0292 0.0306 1035 0.6309 0.6308
    700 0.0289 0.0289 1036 0.6549 0.65
    701 0.0278 0.0283 1037 0.6658 0.6485
    702 0.0269 0.0291 1038 0.668 0.6487
    703 0.0276 0.0314 1039 0.6616 0.6489
    704 0.0304 0.0317 1040 0.651 0.6389
    705 0.0304 0.0317 1041 0.6544 0.6467
    706 0.0296 0.031 1042 0.6563 0.6485
    707 0.0302 0.0304 1043 0.6583 0.6562
    708 0.029 0.0304 1044 0.6848 0.6839
    709 0.0286 0.0313 1045 0.6876 0.6738
    710 0.0305 0.0331 1046 0.693 0.6789
    711 0.0305 0.0332 1047 0.6784 0.6527
    712 0.0293 0.0306 1048 0.6629 0.6477
    713 0.031 0.0324 1049 0.6661 0.6781
    714 0.032 0.0327 1050 0.6954 0.6882
    715 0.0301 0.0321
    Table 2
    the average reflectivity of the first reference sheet (%) the average reflectivity of the second reference sheet (%)
    R7590 0.14 0.14
    R4070 0.03 0.03
  • It should be mentioned that the dot pattern and the inclined-striped pattern in Figs. 1A, 1B, 1F to 1I and 1M are configured to indicate the range of the anti-reflecting layer 130 and the range of the light blocking structure 113, respectively, the thickness of the anti-reflecting layer 130, the thickness of anti-scratch layer 140 and the thickness of the light blocking structure 113 are only configured to be the schematic view, and the thicknesses thereof are not shown according to the actual ratio.
  • <2nd example>
  • Fig. 2A is a partial exploded view of an electronic device 20 according to the 2nd example of the present disclosure. In Fig. 2A, the electronic device 20 can be a smart electronic device, and the electronic device 20 includes a plurality of transparent elements 210, a plurality of optical components 221, 222, 223, 224, 225, 226 and an anti-reflecting layer 230, wherein the transparent elements 210 are configured to separate an inner side and an outer side of the electronic device 20, so that the light (not shown) passes through the transparent elements 210 to enter or leave the electronic device 20.
  • In detail, each of the transparent elements 210 is corresponding to each of the optical components 221, 222, 223, 224, 225, 226. Therefore, the anti-reflecting layer 230 can be adjusted according to the requirement of the optical component 221.
  • Fig. 2B is a schematic view of the transparent element 210 and the optical component 221 according to the 2nd example in Fig. 2A. In Fig. 2B, each of the transparent elements 210 includes an inner side surface 211 and an outer side surface 212, wherein the inner side surface 211 faces towards the inner side, and the outer side surface 212 faces towards the outer side. Moreover, the inner side surface 211 of each of the transparent elements 210 is non-planar. Therefore, the reflecting path of the light can be changed so as to avoid influencing the operation of the optical component 221 by the reflecting light. Or, the transparent elements 210 can have the refractive power.
  • It should be mentioned that the dot pattern in Fig. 2A is configured to indicate the range of the anti-reflecting layer 230, the optical system and the structural dispositions according to the 2nd example are the same as the optical system and the structural dispositions according to the 1st example, and hence will not be described again herein.
  • <3rd example>
  • Fig. 3A is a three dimensional view of an electronic device 30 according to the 3rd example of the present disclosure. Fig. 3B is a partial exploded view of the electronic device 30 according to the 3rd example in Fig. 3A. In Figs. 3A and 3B, the electronic device 30 can be a smart electronic device, and the electronic device 30 includes a transparent element 310, an optical component 320 and an anti-reflecting layer 330.
  • According to the 3rd example, the optical component 320 is a telescopic imaging camera. When the optical component 320 is idled, the optical component 320 is disposed inside the electronic device 30; when the optical component 320 is started, the optical component 320 is lifted from inside of the electronic device 30 so as to keep the consistency of a display area 31 of the electronic device 30 to enhance the displaying effect. Further, when the optical component 320 is lifted, the transparent element 310 is configured to separate an inner side and an outer side of the electronic device 30, so that the light (not shown) passes through the transparent element 310 to enter or leave the electronic device 30.
  • The transparent element 310 includes an inner side surface 311 (labeled in Fig. 3D) and an outer side surface 312, wherein the inner side surface 311 faces towards the inner side, and the outer side surface 312 faces towards the outer side. Moreover, the optical component 320 is corresponding to the inner side surface 311 of the transparent element 310, and the anti-reflecting layer 330 is disposed on at least one portion of the inner side surface 311 of the transparent element 310.
  • Fig. 3C is a schematic view of the transparent element 310 according to the 3rd example in Fig. 3A. In Figs. 3B and 3C, the transparent element 310 can further include a light blocking structure 313, wherein the light blocking structure 313 is configured to avoid the light passing through, a light-transmitting area 350 is remained on the transparent element 310 via the light blocking structure 313, and the light-transmitting area 350 is corresponding to the optical component 320, so that the light can pass through the transparent element 310 to enter or leave the electronic device 30. Moreover, the portion except the light-transmitting area 350 can be blocked by disposing the light blocking structure 313 on the transparent element 310 so as to reduce the stray light.
  • Fig. 3D is a cross-sectional view of the transparent element 310 along a 3D-3D line in Fig. 3C. Fig. 3E is a partial enlarged view of the transparent element 310 according to the 3rd example in Fig. 3D. In Figs. 3D and 3E, a number of the anti-reflecting layer 330 is a plurality, wherein the anti-reflecting layer 330 can include a plurality of high refractive index films and a plurality of low refractive index films, which are alternately stacked, so that the anti-reflecting effect can be achieved based on the interference principle of the thin film.
  • It should be mentioned that the dot pattern and the inclined-striped pattern in Figs. 3A to 3C are configured to indicate the range of the anti-reflecting layer 330 and the range of the light blocking structure 313, respectively.
  • <4th example>
  • Fig. 4 is a three dimensional view of an electronic device 40 according to the 4th example of the present disclosure. In Fig. 4, the electronic device 40 can be an AR (Augmented Reality) head-mounted device, and the electronic device 40 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and an anti-reflecting layer 430, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 40, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 40.
  • Moreover, the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 430 is disposed on at least one portion of the inner side surface of the transparent element.
  • Further, the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 4th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
  • <5th example>
  • Fig. 5 is a three dimensional view of an electronic device 50 according to the 5th example of the present disclosure. In Fig. 5, the electronic device 50 can be an VR (Virtual Reality) head-mounted device, and the electronic device 50 includes a transparent element (its reference numeral is omitted), a plurality of optical components (their reference numerals are omitted) and an anti-reflecting layer 530, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 50, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 50.
  • Moreover, the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical components are corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 530 is disposed on at least one portion of the inner side surface of the transparent element.
  • Further, the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to the 5th example can be referred to the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
  • <6th example>
  • Fig. 6 is a three dimensional view of an electronic device 60 according to the 6th example of the present disclosure. In Fig. 6, the electronic device 60 can be a video capturing device, and the electronic device 60 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and an anti-reflecting layer 630, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 60, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 60.
  • Moreover, the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 630 is disposed on at least one portion of the inner side surface of the transparent element.
  • Furthermore, the electronic device 60 can further include a fill light module 61 and a focusing assisting module 62, and the electronic device 60 can be disposed on a computer monitor (its reference numeral is omitted).
  • Further, the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 6th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.

Claims (20)

  1. An electronic device (10), characterized in comprising:
    a transparent element (110) configured to separate an inner side and an outer side of the electronic device (10), so that a light (L) passing through the transparent element (110) to enter or leave the electronic device (10), and the transparent element (110) comprising:
    an inner side surface (111); and
    an outer side surface (112), wherein the inner side surface (111) faces towards the inner side, and the outer side surface (112) faces towards the outer side;
    an optical component (121) corresponding to the inner side surface (111) of the transparent element (110); and
    an anti-reflecting layer (130) disposed on at least one portion of the inner side surface (111) of the transparent element (110).
  2. The electronic device (10) of claim 1, wherein the anti-reflecting layer (130) comprises a nanostructure layer (131), the nanostructure layer (131) comprises a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
  3. The electronic device (10) of any of claims 1-2, wherein the anti-reflecting layer (130) further comprises a structure connection film (132), the structure connection film (132) comprises at least one silicon dioxide layer, and a top of the at least one silicon dioxide layer is directly contacted with a bottom of the nanostructure layer (131).
  4. The electronic device (10) of any of claims 1-3, wherein a partial area of the top of the at least one silicon dioxide layer is contacted with an air.
  5. The electronic device (10) of any of claims 1-4, wherein an average reflectivity of the at least one portion of the inner side surface (111) of the transparent element (110) corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, and the following condition is satisfied: R 4070 0.5 % .
    Figure imgb0001
  6. The electronic device (10) of any of claims 1-5, wherein an average reflectivity of the at least one portion of the inner side surface (111) of the transparent element (110) corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, and the following condition is satisfied: R 7590 0.65 % .
    Figure imgb0002
  7. The electronic device (10) of any of claims 1-6, wherein an average structural height of the nanostructure layer (131) is larger than or equal to 70 nm and less than or equal to 350 nm.
  8. The electronic device (10) of any of claims 1-7, wherein the outer side surface (112) comprises an anti-scratch layer (140).
  9. The electronic device (10) of any of claims 1-8, wherein the optical component (121) is an imaging camera.
  10. The electronic device (10) of any of claims 1-9, wherein a spacing distance between the inner side surface (111) and the optical component (121) is D, and the following condition is satisfied: D 5 mm .
    Figure imgb0003
  11. The electronic device (10) of any of claims 1-10, wherein the anti-reflecting layer (130) is further disposed on the optical component (121).
  12. The electronic device (10) of any of claims 1-11, wherein the transparent element (110) further comprises a light blocking structure (113).
  13. The electronic device (10) of any of claims 1-12, wherein a light-transmitting area (150) is remained on the transparent element (110) via the light blocking structure (113), and the light-transmitting area (150) is corresponding to the optical component (121).
  14. The electronic device (20) of any of claims 1-13, wherein a number of the transparent element (210) is at least two, a number of the optical component (221, 222, 223, 224, 225, 226) is at least two, and each of the transparent elements (210) is corresponding to each of the optical components (221, 222, 223, 224, 225, 226).
  15. The electronic device (20) of any of claims 1-14, wherein the inner side surface (211) of one of the at least two transparent elements (210) is non-planar.
  16. The electronic device (10) of any of claims 1-15, wherein a number of the optical component (121, 122, 123, 124, 125, 126) is at least two, and the at least two optical components (121, 122, 123, 124, 125, 126) are corresponding to the inner side surface (111) of the transparent element (110).
  17. The electronic device (10) of any of claims 1-16, wherein one of the at least two optical components (121, 122, 123, 124, 125, 126) is an imaging camera, and the other one of the at least two optical components (121, 122, 123, 124, 125, 126) is a light-emitting element.
  18. The electronic device (10) of any of claims 1-17, wherein the at least two optical components (121, 122, 123, 124, 125, 126) are at least two imaging cameras, and a field of view of one of the at least two imaging cameras is different from a field of view of the other one of the at least two imaging cameras.
  19. The electronic device (10) of any of claims 1-18, wherein a corresponding working wavelength of one of the at least two optical components (121, 122, 123, 124, 125, 126) is different from a corresponding working wavelength of the other one of the at least two optical components (121, 122, 123, 124, 125, 126).
  20. The electronic device (10) of any of claims 1-19, wherein the electronic device (10) is a portable electronic device.
EP23174030.9A 2022-05-26 2023-05-17 Electronic device Pending EP4283376A1 (en)

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CN216210188U (en) * 2021-07-16 2022-04-05 大立光电股份有限公司 Lens set, optical device and electronic device

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KR20170000679A (en) * 2015-06-24 2017-01-03 삼성전자주식회사 Camera module for mobile device
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CN117130073A (en) 2023-11-28

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