EP4283376A1 - Electronic device - Google Patents
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- Publication number
- EP4283376A1 EP4283376A1 EP23174030.9A EP23174030A EP4283376A1 EP 4283376 A1 EP4283376 A1 EP 4283376A1 EP 23174030 A EP23174030 A EP 23174030A EP 4283376 A1 EP4283376 A1 EP 4283376A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic device
- transparent element
- light
- optical component
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 claims abstract description 124
- 239000002086 nanomaterial Substances 0.000 claims description 44
- 238000003384 imaging method Methods 0.000 claims description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 230000000903 blocking effect Effects 0.000 claims description 23
- 238000002310 reflectometry Methods 0.000 claims description 22
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 109
- 230000000875 corresponding effect Effects 0.000 description 45
- 239000010408 film Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 7
- 238000001000 micrograph Methods 0.000 description 6
- 230000001066 destructive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0018—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for preventing ghost images
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
- G02B2207/101—Nanooptics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B27/0172—Head mounted characterised by optical features
Definitions
- the present disclosure relates to an electronic device. More particularly, the present disclosure relates to a portable electronic device.
- Fig. 7 is a schematic view of a light L traveling through the optical component 720 according to the prior art.
- the light L easily reflects between a transparent element 710 and the optical component 720, and hence the stray light is easily formed on the imaging surface of the electronic device according to the prior art so as to influence the functional performance of the optical component. Therefore, an electronic device, which can reduce the reflection of the light between transparent element and the optical component, needs to be developed.
- an electronic device includes a transparent element, an optical component and an anti-reflecting layer.
- the transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface.
- the inner side surface faces towards the inner side, and the outer side surface faces towards the outer side.
- the optical component is corresponding to the inner side surface of the transparent element.
- the anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.
- the anti-reflecting layer includes a nanostructure layer
- the nanostructure layer includes a plurality of ridge-like protrusions
- the ridge-like protrusions extend non-directionally from a disposing surface
- a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface
- each of the ridge-like protrusions is tapered from the bottom towards the top.
- the anti-reflecting layer further includes a structure connection film
- the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer.
- an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R 4070 , and the following condition is satisfied: R 4070 ⁇ 0.5%.
- an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 750 nm and 900 nm is R 7590 , and the following condition is satisfied: R 7590 ⁇ 0.65%.
- an average structural height of the nanostructure layer is larger than or equal to 70 nm and less than or equal to 350 nm.
- the outer side surface includes an anti-scratch layer.
- the optical component is an imaging camera.
- a spacing distance between the inner side surface and the optical component is D, and the following condition is satisfied: D ⁇ 5 mm.
- the anti-reflecting layer is further disposed on the optical component.
- the transparent element further includes a light blocking structure.
- a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component.
- a number of the transparent element is at least two
- a number of the optical component is at least two
- each of the transparent elements is corresponding to each of the optical components.
- the inner side surface of one of the transparent elements is non-planar.
- a number of the optical component is at least two, and the optical components are corresponding to the inner side surface of the transparent element.
- one of the optical components is an imaging camera, and the other one of the optical components is a light-emitting element.
- the optical components are at least two imaging cameras, and a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras.
- a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components.
- the electronic device is a portable electronic device.
- the present disclosure provides an electronic device, which includes a transparent element, an optical component and an anti-reflecting layer.
- the transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface, wherein the inner side surface faces towards the inner side, and the outer side surface faces towards the outer side.
- the optical component is corresponding to the inner side surface of the transparent element.
- the anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element. Hence, the reflection of the stray light between the transparent element and the optical component can be avoided by disposing the anti-reflecting layer on the inner side surface of the transparent element so as to enhance the image quality.
- the anti-reflecting layer can include a nanostructure layer, wherein the nanostructure layer includes a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
- the nanostructure layer can include an aluminum oxide.
- the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer from the bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light.
- the anti-reflecting layer can further include a structure connection film, wherein the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer. Therefore, the connecting stability of the nanostructure layer can be enhanced, so that the nanostructure layer can be stably attached on different materials.
- a partial area of the top of the silicon dioxide layer can be contacted with an air.
- the nanostructure layer has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer.
- the outer side surface can include an anti-scratch layer. Therefore, the scratch can be avoided forming on the outer side surface of the transparent element so as to avoid influencing the operation of the optical component.
- the optical component can be an imaging camera, and the anti-reflecting layer can be further disposed on the optical component, so that the reflection of the light between the elements on the inner side of the electronic device can be further reduced to enhance the image quality.
- the elements disposed on the imaging camera can be a lens barrel or a lens element, but the present disclosure is not limited thereto.
- the transparent element can further include a light blocking structure, wherein a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component.
- the light blocking structure is configured to avoid the light passing through, and the light blocking structure can be the black ink spraying layer formed via the quick drying ink based on the epoxy resin, the blackened coating layer via the chemical vaper deposition, the photoresistive coating layer or the light blocking sheet composed of the black polyethylene terephthalate (PET) material, but the present disclosure is not limited thereto.
- a number of the transparent element can be at least two, a number of the optical component can be at least two, and each of the transparent elements is corresponding to each of the optical components.
- the anti-reflecting layer can be adjusted according to the requirement of the optical components.
- the inner side surface of one of the transparent elements can be non-planar. Therefore, the reflecting path of the light can be changed, or the transparent element can have the refractive power.
- a number of the optical component can be at least two, and the optical components are corresponding to the inner side surface of the transparent element.
- the transparent element is only required to be coated once for corresponding to the optical components with different working wavelengths so as to simplify the manufacturing process.
- One of the optical components can be an imaging camera, and the other one of the optical components can be a light-emitting element, wherein the light-emitting element can be an infrared light-emitting element for the purpose such as the space recognition and the distance measurement.
- the light-emitting element can be a flash element for the purpose such as the light-filling and the illumination, and the working wavelength of the flash module is between 400 nm and 700 nm corresponding to the wavelength range of the visible light.
- the optical components can be at least two imaging cameras, wherein a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras, and a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components.
- the imaging cameras can be an ultra-long-focal telephoto imaging camera, a long-focal portrait imaging camera, a wide-angle imaging camera, a ultra-wide-angle imaging camera or a TOF (Time-Of-Flight) camera module, wherein a field of view of the ultra-long-focal telephoto imaging camera is between about 20 degrees and 30 degrees, a working wavelength of the ultra-long-focal telephoto imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the long-focal portrait imaging camera is about 50 degrees, a working wavelength of the long-focal portrait imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the wide-angle imaging camera is about 90 degrees, a working wavelength of the wide-angle imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the ultra-wide-angle
- the electronic device can be a portable electronic device.
- R 4070 When an average reflectivity of at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R 4070 , the following condition can be satisfied: R 4070 ⁇ 0.5%.
- the following condition can be satisfied: R 7590 ⁇ 0.65%.
- the low reflectivity can be simultaneously maintained during the wavelength range of the visible light and the wavelength range of the infrared light by the anti-reflecting layer based on the graded refractive index in contrast to the anti-reflecting layer based on the interference principle of the thin film.
- the reflection of the stray light can be reduced by maintaining the low reflectivity during the wavelength range of the visible light and the wavelength range of the infrared light to enhance the image quality of the imaging camera, and the infrared light component (such as the TOF camera) with the sufficient penetration of the infrared light can be provided so as to avoid influencing the function of the infrared light component.
- the infrared light component such as the TOF camera
- An average structural height of the nanostructure layer can be larger than or equal to 70 nm and less than or equal to 350 nm. It should be mentioned that the average height is calculated by the structural heights of at least three or more ridge-like protrusions from the nanostructure layer, wherein the destructive measurement is to measure the vertical height from the absolute bottom (that is, the foot of the mountain) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the cross section.
- the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the outer surface.
- Fig. 1A is a three dimensional view of an electronic device 10 according to the 1st example of the present disclosure.
- Fig. 1B is a partial exploded view of the electronic device 10 according to the 1st example in Fig. 1A .
- Fig. 1C is a partial perspective view of the electronic device 10 according to the 1st example in Fig. 1A .
- Fig. 1D is a schematic view of a light L traveling through the optical component 121 according to the 1st example in Fig. 1A .
- Fig. 1E is a schematic view of the transparent element 110 and the optical component 121 according to the 1st example in Fig. 1A .
- Figs. 1A is a three dimensional view of an electronic device 10 according to the 1st example of the present disclosure.
- Fig. 1B is a partial exploded view of the electronic device 10 according to the 1st example in Fig. 1A .
- Fig. 1C is a partial perspective view of the
- the electronic device 10 can be a smart electronic device, and the electronic device 10 includes a transparent element 110, a plurality of optical components 121, 122, 123, 124, 125, 126 and an anti-reflecting layer 130, wherein the transparent element 110 is configured to separate an inner side and an outer side of the electronic device 10, so that the light L passes through the transparent element 110 to enter or leave the electronic device 10.
- the traveling path of the light L in Fig. 1D is only configured to be the schematic view rather than limiting the traveling path of the light L.
- the optical components 121, 123, 124, 125, 126 are imaging cameras, respectively, and the optical component 122 is a light-emitting element, wherein a field of view of one of the imaging cameras is different from a field of view of another one of the imaging cameras.
- the optical component 121 is a wide-angle imaging camera
- the optical component 122 is a flash module
- the optical component 123 is a long-focal portrait imaging camera
- the optical component 124 is an ultra-long-focal telephoto imaging camera
- the optical component 125 is a TOF camera module
- the optical component 126 is a ultra-wide-angle imaging camera, wherein the TOF camera module can include a transmitting end and a receiving end.
- a field of view of the optical component 121 is about 90 degrees, a working wavelength of the optical component 121 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the optical component 122 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the optical component 123 is about 50 degrees, a working wavelength of the optical component 123 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the optical component 124 is between about 20 degrees and 30 degrees, a working wavelength of the optical component 124 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the optical component 125 is between 800 nm and 1100 nm corresponding to the wavelength range of the infrared light; a field of view of the optical component 126 is about 130 degrees, a working wavelength of the optical component 126 is between 400 nm and 700 n
- the transparent element 110 includes an inner side surface 111 (labeled in Fig. 1E ) and an outer side surface 112, wherein the inner side surface 111 faces towards the inner side, and the outer side surface 112 faces towards the outer side. Furthermore, the optical components 121, 122, 123, 124, 125, 126 are corresponding to the inner side surface 111 of the transparent element 110, and the anti-reflecting layer 130 is disposed on at least one portion of the inner side surface 111 of the transparent element 110. In particular, the light L is easily reflected between the transparent element 110 and the optical components 121, 122, 123, 124, 125, 126 to influence the functional performance of the optical components 121, 122, 123, 124, 125, 126.
- the reflection of the stray light between the transparent element 110 and the optical components 121, 122, 123, 124, 125, 126 can be avoided by disposing the anti-reflecting layer 130 on the inner side surface 111 of the transparent element 110 so as to enhance the image quality.
- the transparent element 110 is only required to be coated once for corresponding to the optical components 121, 122, 123, 124, 125, 126 with different working wavelengths so as to simplify the manufacturing process.
- the anti-reflecting layer 130 can be further disposed on the optical components 121, 122, 123, 124, 125, 126, wherein the anti-reflecting layer 130 can be disposed on the optical components such as a lens barrel and a lens element, so that the reflection of the light between the elements inside the electronic device 10 can be further reduced for enhancing the image quality.
- a spacing distance between the inner side surface 111 and the optical component 121 is D, and the spacing distance D is 1.7 mm.
- Fig. 1F is a partial enlarged view of the transparent element 110 according to the 1st example in Fig. 1E .
- Fig. 1G is a partial enlarged view of the inner side surface 111 of the transparent element 110 according to the 1st example in Fig. 1F .
- Fig. 1H is an enlarged view of the light blocking structure 113 and the anti-reflecting layer 130 according to the 1st example in Fig. 1G .
- Fig. 1I is an enlarged view of the transparent element 110 and the anti-reflecting layer 130 according to the 1st example in Fig. 1G .
- Fig. 1J is a scanning electron microscope image of the transparent element 110 and the anti-reflecting layer 130 according to the 1st example in Fig. 1I .
- Fig. 1K is a scanning electron microscope image of the nanostructure layer 131 according to the 1st example in Fig. 1I .
- Fig. 1L is a partial enlarged view of the outer side surface 112 of the transparent element 110 according to the 1st example in Fig. 1F .
- Fig. 1M is a schematic view of the transparent element 110 according to the 1st example in Fig. 1A .
- Fig. 1N is a partial scanning electron microscope image of the transparent element 110 according to the 1st example in Fig. 1M .
- Figs. 1K is a scanning electron microscope image of the nanostructure layer 131 according to the 1st example in Fig. 1I .
- Fig. 1L is a partial enlarged view of the outer side surface 112 of the transparent element 110 according to the 1st example in Fig. 1F .
- Fig. 1M is a schematic view of the transparent element 110 according to the 1st example in Fig. 1A .
- the anti-reflecting layer 130 can include a nanostructure layer 131 and a structure connection film 132
- the outer side surface 112 can include an anti-scratch layer 140
- the transparent element 110 can further include a light blocking structure 113, wherein the light blocking structure 113 is configured to avoid the light L passing through, a light-transmitting area 150 is remained on the transparent element 110 via the light blocking structure 113, and the light-transmitting area 150 is corresponding to the optical components 121, 122, 123, 124, 125, 126, so that the light L can pass through the transparent element 110 to enter or leave the electronic device 10.
- the portion except the light-transmitting area 150 can be blocked by disposing the light blocking structure 113 on the transparent element 110 so as to reduce the stray light.
- the nanostructure layer 131 can include a plurality of ridge-like protrusions (their reference numerals are omitted), wherein the ridge-like protrusions extend non-directionally from a disposing surface (its reference numeral is omitted), a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
- the nanostructure layer 131 can include an aluminum oxide.
- the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer 131 from the absolute bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light L reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light L.
- the destructive measurement is to measure the vertical height from the absolute bottom of the ridge-like protrusions to the top of the ridge-like protrusions during the observation of the structural height of the nanostructure layer 131 from the cross section, wherein the vertical height H1 of the nanostructure layer 131 is 248.7 nm, the vertical height H1' of the nanostructure layer 131 is 247.4 nm, and the vertical height H1" of the nanostructure layer 131 is 203 nm.
- the average structural height of the nanostructure layer 131 is 233 nm.
- the vertical height H3 of the structure connection film 132 is 75.15 nm.
- the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer 131 from the outer surface, wherein the vertical height H2 of the nanostructure layer 131 is 143.6 nm, the vertical height H2' of the nanostructure layer 131 is 143.1 nm, the vertical height H2" of the nanostructure layer 131 is 131.5 nm.
- the average structural height of the nanostructure layer 131 is 139.4 nm.
- the structure connection film 132 includes at least one silicon dioxide layer (its reference numeral is omitted), wherein a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer 131, and a partial area of the top of the silicon dioxide layer is contacted with an air. Therefore, the connecting stability of the nanostructure layer 131 can be enhanced, so that the nanostructure layer 131 can be stably attached on different materials. Further, the nanostructure layer 131 has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer 131.
- the anti-scratch layer 140 can be further disposed on the anti-reflecting layer 130, and a number of the anti-reflecting layer 130 disposed on the outer side surface 112 is a plurality. Therefore, the scratch can be avoided forming on the outer side surface 112 of the transparent element 110 via the anti-scratch layer 140 so as to avoid influencing the operation of the optical components 121, 122, 123, 124, 125, 126.
- the layer number and the thickness of the anti-reflecting layer 130 are only configured to be the schematic view, so that the layer number and the thickness thereof can be adjusted according to the actual condition, but the present disclosure is not limited thereto.
- Fig. 1O is a measurement result of the reflectivity according to the 1st example in Fig. 1A .
- Table 1 lists the result of the reflectivity according to the 1st example.
- Table 2 lists an average reflectivity R 7590 and an average reflectivity R 4070 according to the 1st example.
- the average reflectivity of at least one portion of the inner side surface 111 of the transparent element 110 corresponding to a light with a wavelength range between 750 nm and 900 nm is R 7590
- the average reflectivity of at least one portion of the inner side surface 111 of the transparent element 110 corresponding to a light with a wavelength range between 400 nm and 700 nm is R 4070
- each of a first reference sheet and a second reference sheet is a plastic substrate (that is corresponding to the transparent element 110)
- the nanostructure layer 131 is disposed on the surface of each of the plastic substrates so as to be the reference of the reflectivity of the surface of each of the optical components 121, 122, 123, 124, 125, 126 which the nanostructure layer 131 is disposed on.
- the dot pattern and the inclined-striped pattern in Figs. 1A , 1B , 1F to 1I and 1M are configured to indicate the range of the anti-reflecting layer 130 and the range of the light blocking structure 113, respectively, the thickness of the anti-reflecting layer 130, the thickness of anti-scratch layer 140 and the thickness of the light blocking structure 113 are only configured to be the schematic view, and the thicknesses thereof are not shown according to the actual ratio.
- Fig. 2A is a partial exploded view of an electronic device 20 according to the 2nd example of the present disclosure.
- the electronic device 20 can be a smart electronic device, and the electronic device 20 includes a plurality of transparent elements 210, a plurality of optical components 221, 222, 223, 224, 225, 226 and an anti-reflecting layer 230, wherein the transparent elements 210 are configured to separate an inner side and an outer side of the electronic device 20, so that the light (not shown) passes through the transparent elements 210 to enter or leave the electronic device 20.
- each of the transparent elements 210 is corresponding to each of the optical components 221, 222, 223, 224, 225, 226. Therefore, the anti-reflecting layer 230 can be adjusted according to the requirement of the optical component 221.
- Fig. 2B is a schematic view of the transparent element 210 and the optical component 221 according to the 2nd example in Fig. 2A .
- each of the transparent elements 210 includes an inner side surface 211 and an outer side surface 212, wherein the inner side surface 211 faces towards the inner side, and the outer side surface 212 faces towards the outer side.
- the inner side surface 211 of each of the transparent elements 210 is non-planar. Therefore, the reflecting path of the light can be changed so as to avoid influencing the operation of the optical component 221 by the reflecting light.
- the transparent elements 210 can have the refractive power.
- the dot pattern in Fig. 2A is configured to indicate the range of the anti-reflecting layer 230, the optical system and the structural dispositions according to the 2nd example are the same as the optical system and the structural dispositions according to the 1st example, and hence will not be described again herein.
- Fig. 3A is a three dimensional view of an electronic device 30 according to the 3rd example of the present disclosure.
- Fig. 3B is a partial exploded view of the electronic device 30 according to the 3rd example in Fig. 3A .
- the electronic device 30 can be a smart electronic device, and the electronic device 30 includes a transparent element 310, an optical component 320 and an anti-reflecting layer 330.
- the optical component 320 is a telescopic imaging camera.
- the optical component 320 is disposed inside the electronic device 30; when the optical component 320 is started, the optical component 320 is lifted from inside of the electronic device 30 so as to keep the consistency of a display area 31 of the electronic device 30 to enhance the displaying effect.
- the transparent element 310 is configured to separate an inner side and an outer side of the electronic device 30, so that the light (not shown) passes through the transparent element 310 to enter or leave the electronic device 30.
- the transparent element 310 includes an inner side surface 311 (labeled in Fig. 3D ) and an outer side surface 312, wherein the inner side surface 311 faces towards the inner side, and the outer side surface 312 faces towards the outer side.
- the optical component 320 is corresponding to the inner side surface 311 of the transparent element 310, and the anti-reflecting layer 330 is disposed on at least one portion of the inner side surface 311 of the transparent element 310.
- Fig. 3C is a schematic view of the transparent element 310 according to the 3rd example in Fig. 3A .
- the transparent element 310 can further include a light blocking structure 313, wherein the light blocking structure 313 is configured to avoid the light passing through, a light-transmitting area 350 is remained on the transparent element 310 via the light blocking structure 313, and the light-transmitting area 350 is corresponding to the optical component 320, so that the light can pass through the transparent element 310 to enter or leave the electronic device 30.
- the portion except the light-transmitting area 350 can be blocked by disposing the light blocking structure 313 on the transparent element 310 so as to reduce the stray light.
- Fig. 3D is a cross-sectional view of the transparent element 310 along a 3D-3D line in Fig. 3C .
- Fig. 3E is a partial enlarged view of the transparent element 310 according to the 3rd example in Fig. 3D .
- a number of the anti-reflecting layer 330 is a plurality, wherein the anti-reflecting layer 330 can include a plurality of high refractive index films and a plurality of low refractive index films, which are alternately stacked, so that the anti-reflecting effect can be achieved based on the interference principle of the thin film.
- the dot pattern and the inclined-striped pattern in Figs. 3A to 3C are configured to indicate the range of the anti-reflecting layer 330 and the range of the light blocking structure 313, respectively.
- Fig. 4 is a three dimensional view of an electronic device 40 according to the 4th example of the present disclosure.
- the electronic device 40 can be an AR (Augmented Reality) head-mounted device, and the electronic device 40 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and an anti-reflecting layer 430, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 40, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 40.
- the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 430 is disposed on at least one portion of the inner side surface of the transparent element.
- the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 4th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
- Fig. 5 is a three dimensional view of an electronic device 50 according to the 5th example of the present disclosure.
- the electronic device 50 can be an VR (Virtual Reality) head-mounted device, and the electronic device 50 includes a transparent element (its reference numeral is omitted), a plurality of optical components (their reference numerals are omitted) and an anti-reflecting layer 530, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 50, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 50.
- VR Virtual Reality
- the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical components are corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 530 is disposed on at least one portion of the inner side surface of the transparent element.
- the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to the 5th example can be referred to the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
- Fig. 6 is a three dimensional view of an electronic device 60 according to the 6th example of the present disclosure.
- the electronic device 60 can be a video capturing device, and the electronic device 60 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and an anti-reflecting layer 630, wherein the transparent element is configured to separate an inner side and an outer side of the electronic device 60, so that the light (not shown) passes through the transparent element to enter or leave the electronic device 60.
- the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the anti-reflecting layer 630 is disposed on at least one portion of the inner side surface of the transparent element.
- the electronic device 60 can further include a fill light module 61 and a focusing assisting module 62, and the electronic device 60 can be disposed on a computer monitor (its reference numeral is omitted).
- the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 6th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
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Abstract
An electronic device includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface. The inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.
Description
- The present disclosure relates to an electronic device. More particularly, the present disclosure relates to a portable electronic device.
- In recent years, portable electronic devices have developed rapidly. For example, intelligent electronic devices, head-mounted devices and video capturing devices have been filled in the lives of modern people. However, as technology advances, the quality requirements of the electronic device are becoming higher and higher.
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Fig. 7 is a schematic view of a light L traveling through theoptical component 720 according to the prior art. InFig. 7 , the light L easily reflects between atransparent element 710 and theoptical component 720, and hence the stray light is easily formed on the imaging surface of the electronic device according to the prior art so as to influence the functional performance of the optical component. Therefore, an electronic device, which can reduce the reflection of the light between transparent element and the optical component, needs to be developed. - According to one aspect of the present disclosure, an electronic device includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface. The inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.
- According to the electronic device of the aforementioned aspect, wherein the anti-reflecting layer includes a nanostructure layer, the nanostructure layer includes a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
- According to the electronic device of the aforementioned aspect, wherein the anti-reflecting layer further includes a structure connection film, the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer.
- According to the electronic device of the aforementioned aspect, wherein a partial area of the top of the silicon dioxide layer is contacted with an air.
- According to the electronic device of the aforementioned aspect, wherein an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, and the following condition is satisfied: R4070 ≤ 0.5%.
- According to the electronic device of the aforementioned aspect, wherein an average reflectivity of the at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, and the following condition is satisfied: R7590 ≤ 0.65%.
- According to the electronic device of the aforementioned aspect, wherein an average structural height of the nanostructure layer is larger than or equal to 70 nm and less than or equal to 350 nm.
- According to the electronic device of the aforementioned aspect, wherein the outer side surface includes an anti-scratch layer.
- According to the electronic device of the aforementioned aspect, wherein the optical component is an imaging camera.
- According to the electronic device of the aforementioned aspect, wherein a spacing distance between the inner side surface and the optical component is D, and the following condition is satisfied: D ≤ 5 mm.
- According to the electronic device of the aforementioned aspect, wherein the anti-reflecting layer is further disposed on the optical component.
- According to the electronic device of the aforementioned aspect, wherein the transparent element further includes a light blocking structure.
- According to the electronic device of the aforementioned aspect, wherein a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component.
- According to the electronic device of the aforementioned aspect, wherein a number of the transparent element is at least two, a number of the optical component is at least two, and each of the transparent elements is corresponding to each of the optical components.
- According to the electronic device of the aforementioned aspect, wherein the inner side surface of one of the transparent elements is non-planar.
- According to the electronic device of the aforementioned aspect, wherein a number of the optical component is at least two, and the optical components are corresponding to the inner side surface of the transparent element.
- According to the electronic device of the aforementioned aspect, wherein one of the optical components is an imaging camera, and the other one of the optical components is a light-emitting element.
- According to the electronic device of the aforementioned aspect, wherein the optical components are at least two imaging cameras, and a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras.
- According to the electronic device of the aforementioned aspect, wherein a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components.
- According to the electronic device of the aforementioned aspect, wherein the electronic device is a portable electronic device.
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Fig. 1A is a three dimensional view of an electronic device according to the 1st example of the present disclosure. -
Fig. 1B is a partial exploded view of the electronic device according to the 1st example inFig. 1A . -
Fig. 1C is a partial perspective view of the electronic device according to the 1st example inFig. 1A . -
Fig. 1D is a schematic view of a light traveling through the optical component according to the 1st example inFig. 1A . -
Fig. 1E is a schematic view of the transparent element and the optical component according to the 1st example inFig. 1A . -
Fig. 1F is a partial enlarged view of the transparent element according to the 1st example inFig. 1E . -
Fig. 1G is a partial enlarged view of the inner side surface of the transparent element according to the 1st example inFig. 1F . -
Fig. 1H is an enlarged view of the light blocking structure and the anti-reflecting layer according to the 1st example inFig. 1G . -
Fig. 1I is an enlarged view of the transparent element and the anti-reflecting layer according to the 1st example inFig. 1G . -
Fig. 1J is a scanning electron microscope image of the transparent element and the anti-reflecting layer according to the 1st example inFig. 1I . -
Fig. 1K is a scanning electron microscope image of the nanostructure layer according to the 1st example inFig. 1I . -
Fig. 1L is a partial enlarged view of the outer side surface of the transparent element according to the 1st example inFig. 1F . -
Fig. 1M is a schematic view of the transparent element according to the 1st example inFig. 1A . -
Fig. 1N is a partial scanning electron microscope image of the transparent element according to the 1st example inFig. 1M . -
Fig. 1O is a measurement result of the reflectivity according to the 1st example inFig. 1A . -
Fig. 2A is a partial exploded view of an electronic device according to the 2nd example of the present disclosure. -
Fig. 2B is a schematic view of the transparent element and the optical component according to the 2nd example inFig. 2A . -
Fig. 3A is a three dimensional view of an electronic device according to the 3rd example of the present disclosure. -
Fig. 3B is a partial exploded view of the electronic device according to the 3rd example inFig. 3A . -
Fig. 3C is a schematic view of the transparent element according to the 3rd example inFig. 3A . -
Fig. 3D is a cross-sectional view of the transparent element along a 3D-3D line inFig. 3C . -
Fig. 3E is a partial enlarged view of the transparent element according to the 3rd example inFig. 3D . -
Fig. 4 is a three dimensional view of an electronic device according to the 4th example of the present disclosure. -
Fig. 5 is a three dimensional view of an electronic device according to the 5th example of the present disclosure. -
Fig. 6 is a three dimensional view of an electronic device according to the 6th example of the present disclosure. -
Fig. 7 is a schematic view of a light traveling through the optical component according to the prior art. - The present disclosure provides an electronic device, which includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface, wherein the inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element. Hence, the reflection of the stray light between the transparent element and the optical component can be avoided by disposing the anti-reflecting layer on the inner side surface of the transparent element so as to enhance the image quality.
- The anti-reflecting layer can include a nanostructure layer, wherein the nanostructure layer includes a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top. Moreover, the nanostructure layer can include an aluminum oxide. Further, when the cross section of the light blocking element is observed, the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of the nanostructure layer from the bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light.
- The anti-reflecting layer can further include a structure connection film, wherein the structure connection film includes at least one silicon dioxide layer, and a top of the silicon dioxide layer is directly contacted with a bottom of the nanostructure layer. Therefore, the connecting stability of the nanostructure layer can be enhanced, so that the nanostructure layer can be stably attached on different materials.
- A partial area of the top of the silicon dioxide layer can be contacted with an air. In particular, the nanostructure layer has a plurality of tiny pores so as to modulate the equivalent refractive index of the nanostructure layer.
- The outer side surface can include an anti-scratch layer. Therefore, the scratch can be avoided forming on the outer side surface of the transparent element so as to avoid influencing the operation of the optical component.
- The optical component can be an imaging camera, and the anti-reflecting layer can be further disposed on the optical component, so that the reflection of the light between the elements on the inner side of the electronic device can be further reduced to enhance the image quality. Moreover, the elements disposed on the imaging camera can be a lens barrel or a lens element, but the present disclosure is not limited thereto.
- The transparent element can further include a light blocking structure, wherein a light-transmitting area is remained on the transparent element via the light blocking structure, and the light-transmitting area is corresponding to the optical component. In particular, the light blocking structure is configured to avoid the light passing through, and the light blocking structure can be the black ink spraying layer formed via the quick drying ink based on the epoxy resin, the blackened coating layer via the chemical vaper deposition, the photoresistive coating layer or the light blocking sheet composed of the black polyethylene terephthalate (PET) material, but the present disclosure is not limited thereto.
- A number of the transparent element can be at least two, a number of the optical component can be at least two, and each of the transparent elements is corresponding to each of the optical components. By each of the transparent elements corresponding to each of the optical components, the anti-reflecting layer can be adjusted according to the requirement of the optical components.
- The inner side surface of one of the transparent elements can be non-planar. Therefore, the reflecting path of the light can be changed, or the transparent element can have the refractive power.
- A number of the optical component can be at least two, and the optical components are corresponding to the inner side surface of the transparent element. By the single transparent element corresponding to a plurality of optical components, the transparent element is only required to be coated once for corresponding to the optical components with different working wavelengths so as to simplify the manufacturing process.
- One of the optical components can be an imaging camera, and the other one of the optical components can be a light-emitting element, wherein the light-emitting element can be an infrared light-emitting element for the purpose such as the space recognition and the distance measurement. Or, the light-emitting element can be a flash element for the purpose such as the light-filling and the illumination, and the working wavelength of the flash module is between 400 nm and 700 nm corresponding to the wavelength range of the visible light.
- The optical components can be at least two imaging cameras, wherein a field of view of one of the imaging cameras is different from a field of view of the other one of the imaging cameras, and a corresponding working wavelength of one of the optical components is different from a corresponding working wavelength of the other one of the optical components. In particular, the imaging cameras can be an ultra-long-focal telephoto imaging camera, a long-focal portrait imaging camera, a wide-angle imaging camera, a ultra-wide-angle imaging camera or a TOF (Time-Of-Flight) camera module, wherein a field of view of the ultra-long-focal telephoto imaging camera is between about 20 degrees and 30 degrees, a working wavelength of the ultra-long-focal telephoto imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the long-focal portrait imaging camera is about 50 degrees, a working wavelength of the long-focal portrait imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the wide-angle imaging camera is about 90 degrees, a working wavelength of the wide-angle imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of the ultra-wide-angle imaging camera is about 130 degrees, a working wavelength of the ultra-wide-angle imaging camera is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of the TOF camera module is between 800 nm and 1100 nm corresponding to the wavelength range of the infrared light.
- The electronic device can be a portable electronic device.
- When an average reflectivity of at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, the following condition can be satisfied: R4070 ≤ 0.5%.
- When an average reflectivity of at least one portion of the inner side surface of the transparent element corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, the following condition can be satisfied: R7590 ≤ 0.65%. In particular, the low reflectivity can be simultaneously maintained during the wavelength range of the visible light and the wavelength range of the infrared light by the anti-reflecting layer based on the graded refractive index in contrast to the anti-reflecting layer based on the interference principle of the thin film. Therefore, the reflection of the stray light can be reduced by maintaining the low reflectivity during the wavelength range of the visible light and the wavelength range of the infrared light to enhance the image quality of the imaging camera, and the infrared light component (such as the TOF camera) with the sufficient penetration of the infrared light can be provided so as to avoid influencing the function of the infrared light component.
- An average structural height of the nanostructure layer can be larger than or equal to 70 nm and less than or equal to 350 nm. It should be mentioned that the average height is calculated by the structural heights of at least three or more ridge-like protrusions from the nanostructure layer, wherein the destructive measurement is to measure the vertical height from the absolute bottom (that is, the foot of the mountain) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the cross section. Or, the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of the nanostructure layer from the outer surface.
- When a spacing distance between the inner side surface and the optical component is D, the following condition can be satisfied: D ≤ 5 mm. When the spacing distance satisfied the aforementioned condition, the light is not easily reflected between the transparent element and the optical component, and the light cannot enter into the optical component again so as to avoid influencing the image quality.
- Each of the aforementioned features of the electronic device can be utilized in various combinations for achieving the corresponding effects.
- According to the aforementioned embodiment, specific examples are provided, and illustrated via figures.
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Fig. 1A is a three dimensional view of anelectronic device 10 according to the 1st example of the present disclosure.Fig. 1B is a partial exploded view of theelectronic device 10 according to the 1st example inFig. 1A .Fig. 1C is a partial perspective view of theelectronic device 10 according to the 1st example inFig. 1A .Fig. 1D is a schematic view of a light L traveling through theoptical component 121 according to the 1st example inFig. 1A .Fig. 1E is a schematic view of thetransparent element 110 and theoptical component 121 according to the 1st example inFig. 1A . InFigs. 1A to 1E , theelectronic device 10 can be a smart electronic device, and theelectronic device 10 includes atransparent element 110, a plurality ofoptical components anti-reflecting layer 130, wherein thetransparent element 110 is configured to separate an inner side and an outer side of theelectronic device 10, so that the light L passes through thetransparent element 110 to enter or leave theelectronic device 10. It should be mentioned that the traveling path of the light L inFig. 1D is only configured to be the schematic view rather than limiting the traveling path of the light L. - The
optical components optical component 122 is a light-emitting element, wherein a field of view of one of the imaging cameras is different from a field of view of another one of the imaging cameras. Moreover, theoptical component 121 is a wide-angle imaging camera, theoptical component 122 is a flash module, theoptical component 123 is a long-focal portrait imaging camera, theoptical component 124 is an ultra-long-focal telephoto imaging camera, theoptical component 125 is a TOF camera module, and theoptical component 126 is a ultra-wide-angle imaging camera, wherein the TOF camera module can include a transmitting end and a receiving end. In detail, a field of view of theoptical component 121 is about 90 degrees, a working wavelength of theoptical component 121 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of theoptical component 122 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of theoptical component 123 is about 50 degrees, a working wavelength of theoptical component 123 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a field of view of theoptical component 124 is between about 20 degrees and 30 degrees, a working wavelength of theoptical component 124 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light; a working wavelength of theoptical component 125 is between 800 nm and 1100 nm corresponding to the wavelength range of the infrared light; a field of view of theoptical component 126 is about 130 degrees, a working wavelength of theoptical component 126 is between 400 nm and 700 nm corresponding to the wavelength range of the visible light. - The
transparent element 110 includes an inner side surface 111 (labeled inFig. 1E ) and anouter side surface 112, wherein theinner side surface 111 faces towards the inner side, and theouter side surface 112 faces towards the outer side. Furthermore, theoptical components inner side surface 111 of thetransparent element 110, and theanti-reflecting layer 130 is disposed on at least one portion of theinner side surface 111 of thetransparent element 110. In particular, the light L is easily reflected between thetransparent element 110 and theoptical components optical components transparent element 110 and theoptical components anti-reflecting layer 130 on theinner side surface 111 of thetransparent element 110 so as to enhance the image quality. By the singletransparent element 110 corresponding to theoptical components transparent element 110 is only required to be coated once for corresponding to theoptical components anti-reflecting layer 130 can be further disposed on theoptical components anti-reflecting layer 130 can be disposed on the optical components such as a lens barrel and a lens element, so that the reflection of the light between the elements inside theelectronic device 10 can be further reduced for enhancing the image quality. - In
Fig. 1E , taking theoptical component 121 as the example, a spacing distance between theinner side surface 111 and theoptical component 121 is D, and the spacing distance D is 1.7 mm. -
Fig. 1F is a partial enlarged view of thetransparent element 110 according to the 1st example inFig. 1E .Fig. 1G is a partial enlarged view of theinner side surface 111 of thetransparent element 110 according to the 1st example inFig. 1F .Fig. 1H is an enlarged view of thelight blocking structure 113 and theanti-reflecting layer 130 according to the 1st example inFig. 1G .Fig. 1I is an enlarged view of thetransparent element 110 and theanti-reflecting layer 130 according to the 1st example inFig. 1G .Fig. 1J is a scanning electron microscope image of thetransparent element 110 and theanti-reflecting layer 130 according to the 1st example inFig. 1I .Fig. 1K is a scanning electron microscope image of thenanostructure layer 131 according to the 1st example inFig. 1I .Fig. 1L is a partial enlarged view of theouter side surface 112 of thetransparent element 110 according to the 1st example inFig. 1F .Fig. 1M is a schematic view of thetransparent element 110 according to the 1st example inFig. 1A .Fig. 1N is a partial scanning electron microscope image of thetransparent element 110 according to the 1st example inFig. 1M . InFigs. 1F to 1N , theanti-reflecting layer 130 can include ananostructure layer 131 and astructure connection film 132, theouter side surface 112 can include ananti-scratch layer 140, and thetransparent element 110 can further include alight blocking structure 113, wherein thelight blocking structure 113 is configured to avoid the light L passing through, a light-transmittingarea 150 is remained on thetransparent element 110 via thelight blocking structure 113, and the light-transmittingarea 150 is corresponding to theoptical components transparent element 110 to enter or leave theelectronic device 10. Moreover, the portion except the light-transmittingarea 150 can be blocked by disposing thelight blocking structure 113 on thetransparent element 110 so as to reduce the stray light. - In
Figs. 1H to 1K , thenanostructure layer 131 can include a plurality of ridge-like protrusions (their reference numerals are omitted), wherein the ridge-like protrusions extend non-directionally from a disposing surface (its reference numeral is omitted), a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top. Moreover, thenanostructure layer 131 can include an aluminum oxide. Further, when the cross section of thetransparent element 110 is observed, the nano-ridged protrusions have the shape of wide bottom and narrow top like a mountain ridge so as to gradually decrease the equivalent refractive index of thenanostructure layer 131 from the absolute bottom (that is, the foot of the mountain) to the top (that is, the top of the mountain) for avoiding the light L reflecting totally on the interface, and the rough surface can be formed so as to reduce the reflection of the light L. - In
Fig. 1J , the destructive measurement is to measure the vertical height from the absolute bottom of the ridge-like protrusions to the top of the ridge-like protrusions during the observation of the structural height of thenanostructure layer 131 from the cross section, wherein the vertical height H1 of thenanostructure layer 131 is 248.7 nm, the vertical height H1' of thenanostructure layer 131 is 247.4 nm, and the vertical height H1" of thenanostructure layer 131 is 203 nm. By the average of the sum of the vertical heights H1, H1', H1", the average structural height of thenanostructure layer 131 is 233 nm. Further, the vertical height H3 of thestructure connection film 132 is 75.15 nm. - In
Fig. 1K , the non-destructive measurement is to measure the vertical height from the relative bottom (that is, the portion of the valley between two mountains) of the ridge-like protrusions to the top (that is, the top of the mountain) of the ridge-like protrusions during the observation of the structural height of thenanostructure layer 131 from the outer surface, wherein the vertical height H2 of thenanostructure layer 131 is 143.6 nm, the vertical height H2' of thenanostructure layer 131 is 143.1 nm, the vertical height H2" of thenanostructure layer 131 is 131.5 nm. By the average of the sum of the vertical heights H2, H2', H2", the average structural height of thenanostructure layer 131 is 139.4 nm. - Moreover, the
structure connection film 132 includes at least one silicon dioxide layer (its reference numeral is omitted), wherein a top of the silicon dioxide layer is directly contacted with a bottom of thenanostructure layer 131, and a partial area of the top of the silicon dioxide layer is contacted with an air. Therefore, the connecting stability of thenanostructure layer 131 can be enhanced, so that thenanostructure layer 131 can be stably attached on different materials. Further, thenanostructure layer 131 has a plurality of tiny pores so as to modulate the equivalent refractive index of thenanostructure layer 131. - In
Fig. 1L , theanti-scratch layer 140 can be further disposed on theanti-reflecting layer 130, and a number of theanti-reflecting layer 130 disposed on theouter side surface 112 is a plurality. Therefore, the scratch can be avoided forming on theouter side surface 112 of thetransparent element 110 via theanti-scratch layer 140 so as to avoid influencing the operation of theoptical components anti-reflecting layer 130 are only configured to be the schematic view, so that the layer number and the thickness thereof can be adjusted according to the actual condition, but the present disclosure is not limited thereto. -
Fig. 1O is a measurement result of the reflectivity according to the 1st example inFig. 1A . Table 1 lists the result of the reflectivity according to the 1st example. Table 2 lists an average reflectivity R7590 and an average reflectivity R4070 according to the 1st example. It should be mentioned that the average reflectivity of at least one portion of theinner side surface 111 of thetransparent element 110 corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, the average reflectivity of at least one portion of theinner side surface 111 of thetransparent element 110 corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, each of a first reference sheet and a second reference sheet is a plastic substrate (that is corresponding to the transparent element 110), thenanostructure layer 131 is disposed on the surface of each of the plastic substrates so as to be the reference of the reflectivity of the surface of each of theoptical components nanostructure layer 131 is disposed on.Table 1 wavelength (nm) the reflectivity of the first reference sheet (%) the reflectivity of the second reference sheet (%) wavelength (nm) the reflectivity of the first reference sheet (%) the reflectivity of the second reference sheet (%) 380 0.0472 0.0472 716 0.0322 0.0335 381 0.0585 0.1074 717 0.0319 0.0346 382 0.0998 0.0998 718 0.0316 0.0343 383 0.1204 0.1204 719 0.0334 0.0341 384 0.0918 0.0918 720 0.0325 0.0338 385 0.0403 0.0357 721 0.0336 0.0325 386 0.052 0.0141 722 0.0325 0.0332 387 0.0708 0.0577 723 0.0335 0.0349 388 0.0663 0.0957 724 0.0327 0.0366 389 0.0938 0.0983 725 0.0354 0.0368 390 0.0995 0.117 726 0.036 0.0374 391 0.0931 0.0931 727 0.0368 0.0373 392 0.079 0.055 728 0.0356 0.0344 393 0.0716 0.0296 729 0.0367 0.0369 394 0.0584 0.0584 730 0.0356 0.0375 395 0.084 0.0995 731 0.0365 0.0392 396 0.1073 0.0882 732 0.0382 0.0398 397 0.0665 0.0832 733 0.0386 0.0384 398 0.071 0.0619 734 0.0392 0.0388 399 0.058 0.0387 735 0.0393 0.0398 400 0.0559 0.0373 736 0.0376 0.0388 401 0.0716 0.0716 737 0.0387 0.0413 402 0.0693 0.0693 738 0.0391 0.0405 403 0.0791 0.0791 739 0.0409 0.0423 404 0.0806 0.0646 740 0.0438 0.0429 405 0.0626 0.0587 741 0.0429 0.043 406 0.0529 0.0377 742 0.0417 0.0427 407 0.0329 0.0294 743 0.0418 0.0425 408 0.0428 0.0428 744 0.043 0.0444 409 0.0586 0.0586 745 0.0434 0.0448 410 0.0591 0.0662 746 0.0477 0.047 411 0.0616 0.0439 747 0.0471 0.0457 412 0.049 0.0366 748 0.0455 0.0455 413 0.0362 0.0241 749 0.0466 0.0466 414 0.0285 0.0234 750 0.0467 0.0471 415 0.041 0.041 751 0.0476 0.0483 416 0.0338 0.0448 752 0.0494 0.0504 417 0.0459 0.053 753 0.05 0.0514 418 0.0515 0.0394 754 0.0504 0.0489 419 0.0417 0.0301 755 0.0504 0.049 420 0.039 0.0293 756 0.0499 0.0494 421 0.0347 0.0251 757 0.0505 0.0531 422 0.0336 0.0358 758 0.0511 0.0525 423 0.0442 0.0454 759 0.0542 0.0556 424 0.0444 0.0433 760 0.0561 0.0557 425 0.0435 0.0315 761 0.0554 0.0553 426 0.0317 0.0201 762 0.0564 0.0564 427 0.0252 0.0168 763 0.0545 0.0545 428 0.0179 0.0192 764 0.0564 0.0564 429 0.0279 0.0327 765 0.057 0.0582 430 0.0377 0.0377 766 0.06 0.06 431 0.0326 0.0252 767 0.0614 0.0614 432 0.0252 0.0173 768 0.0614 0.0607 433 0.0245 0.0201 769 0.0625 0.0611 434 0.021 0.0156 770 0.0601 0.0601 435 0.0159 0.0155 771 0.0597 0.0609 436 0.0231 0.0231 772 0.0637 0.0644 437 0.0266 0.023 773 0.0648 0.0653 438 0.0251 0.0229 774 0.0671 0.0671 439 0.0227 0.0081 775 0.0671 0.0669 440 0.0226 0.0135 776 0.0664 0.0649 441 0.0155 0.0111 777 0.0682 0.0667 442 0.0129 0.0096 778 0.0676 0.0685 443 0.015 0.022 779 0.0717 0.0717 444 0.0223 0.0223 780 0.0721 0.0717 445 0.0222 0.0222 781 0.0732 0.0725 446 0.0167 0.0167 782 0.0743 0.0722 447 0.0218 0.0146 783 0.0747 0.0746 448 0.0112 0.0056 784 0.0736 0.0724 449 0.007 0.0105 785 0.076 0.0755 450 0.0197 0.0269 786 0.0788 0.0773 451 0.0215 0.0286 787 0.0795 0.0793 452 0.025 0.0196 788 0.0799 0.0784 453 0.0176 0.0141 789 0.0822 0.0808 454 0.0106 0.0036 790 0.0807 0.08 455 0.0069 0.0069 791 0.0814 0.0802 456 0.0069 0.0086 792 0.0819 0.0819 457 0.0136 0.017 793 0.0846 0.0846 458 0.0201 0.0201 794 0.0889 0.0875 459 0.0199 0.0132 795 0.0899 0.0869 460 0.0114 0.0065 796 0.0901 0.0885 461 0.0032 0.0032 797 0.089 0.0874 462 0.0096 0.0096 798 0.0893 0.0884 463 0.0063 0.0064 799 0.0915 0.0906 464 0.0138 0.0184 800 0.0931 0.0942 465 0.018 0.015 801 0.0967 0.0966 466 0.0132 0.0118 802 0.0972 0.0957 467 0.0172 0.0115 803 0.0986 0.0962 468 0.0098 0.0098 804 0.0976 0.0968 469 0.0055 0.0084 805 0.0989 0.0989 470 0.0096 0.015 806 0.0999 0.0999 471 0.0108 0.0106 807 0.1024 0.1024 472 0.0205 0.0168 808 0.1049 0.1038 473 0.0173 0.0147 809 0.1074 0.1044 474 0.0108 0.0059 810 0.1067 0.1051 475 0.0095 0.005 811 0.1073 0.1051 476 0.0092 0.0138 812 0.107 0.1056 477 0.0113 0.0134 813 0.1095 0.1082 478 0.013 0.0164 814 0.1109 0.1109 479 0.0167 0.0126 815 0.115 0.1129 480 0.0123 0.0123 816 0.1161 0.1135 481 0.0119 0.0098 817 0.117 0.1141 482 0.0116 0.0078 818 0.1164 0.1147 483 0.0116 0.0151 819 0.1159 0.1146 484 0.0183 0.0147 820 0.1192 0.1192 485 0.0198 0.0182 821 0.1221 0.1221 486 0.0209 0.0153 822 0.1253 0.1223 487 0.0136 0.01 823 0.1276 0.1243 488 0.0133 0.0077 824 0.1258 0.1235 489 0.0094 0.0098 825 0.1267 0.1242 490 0.0166 0.0147 826 0.128 0.1277 491 0.0157 0.0186 827 0.1292 0.1291 492 0.0192 0.0182 828 0.1326 0.1303 493 0.0208 0.0178 829 0.1351 0.1333 494 0.0203 0.0174 830 0.1376 0.1363 495 0.0169 0.0115 831 0.136 0.1342 496 0.0139 0.0139 832 0.1381 0.1351 497 0.0152 0.0167 833 0.1382 0.1374 498 0.0203 0.0208 834 0.1411 0.1393 499 0.0232 0.0208 835 0.1442 0.1424 500 0.0204 0.0204 836 0.1469 0.1436 501 0.0185 0.0185 837 0.1476 0.147 502 0.0171 0.0171 838 0.1494 0.1475 503 0.0169 0.0191 839 0.1494 0.1475 504 0.0187 0.0195 840 0.1483 0.1482 505 0.0223 0.0246 841 0.1558 0.1525 506 0.0266 0.025 842 0.1561 0.1542 507 0.0222 0.022 843 0.1591 0.1572 508 0.0231 0.0209 844 0.1603 0.1584 509 0.0212 0.0203 845 0.1611 0.1576 510 0.0208 0.0208 846 0.1617 0.159 511 0.0208 0.0229 847 0.1612 0.1598 512 0.0248 0.0261 848 0.168 0.1645 513 0.0245 0.0233 849 0.1665 0.1625 514 0.0249 0.023 850 0.1723 0.1683 515 0.0244 0.0227 851 0.173 0.169 516 0.0207 0.0207 852 0.172 0.168 517 0.0237 0.0237 853 0.174 0.1721 518 0.0255 0.0271 854 0.174 0.1735 519 0.0286 0.0268 855 0.1795 0.1755 520 0.0272 0.0255 856 0.1835 0.1774 521 0.0269 0.0263 857 0.1846 0.1824 522 0.0259 0.0259 858 0.1864 0.1827 523 0.0256 0.0273 859 0.1844 0.1816 524 0.0266 0.0277 860 0.1862 0.1834 525 0.0294 0.0305 861 0.1867 0.1846 526 0.0298 0.03 862 0.1932 0.1891 527 0.028 0.028 863 0.1943 0.1909 528 0.0291 0.0285 864 0.1983 0.1939 529 0.0289 0.0283 865 0.1987 0.1941 530 0.0258 0.0272 866 0.1988 0.1966 531 0.0288 0.0301 867 0.201 0.1974 532 0.0318 0.0324 868 0.2025 0.2004 533 0.0315 0.0331 869 0.2055 0.2034 534 0.0321 0.0309 870 0.2084 0.2043 535 0.029 0.029 871 0.211 0.2086 536 0.0294 0.0294 872 0.213 0.2089 537 0.0311 0.032 873 0.2134 0.2092 538 0.0327 0.0356 874 0.2137 0.2113 539 0.0317 0.0331 875 0.2147 0.2143 540 0.0346 0.0349 876 0.2205 0.2163 541 0.0334 0.0329 877 0.2221 0.2191 542 0.0323 0.0323 878 0.2265 0.2211 543 0.0319 0.0324 879 0.2274 0.2231 544 0.0318 0.0341 880 0.2273 0.222 545 0.0345 0.035 881 0.2271 0.224 546 0.035 0.0363 882 0.2298 0.2271 547 0.0338 0.0353 883 0.2346 0.2325 548 0.0351 0.0354 884 0.2392 0.2336 549 0.0334 0.0338 885 0.241 0.238 550 0.0337 0.0339 886 0.2437 0.2395 551 0.0341 0.0357 887 0.246 0.2399 552 0.0348 0.0367 888 0.2426 0.2403 553 0.0359 0.0368 889 0.2464 0.2422 554 0.0373 0.0376 890 0.2497 0.2466 555 0.0363 0.0363 891 0.2533 0.2494 556 0.0355 0.036 892 0.2566 0.2522 557 0.0337 0.0352 893 0.2572 0.2513 558 0.0351 0.0379 894 0.2567 0.2524 559 0.0357 0.0387 895 0.2594 0.2551 560 0.0374 0.039 896 0.2632 0.2589 561 0.0368 0.0383 897 0.2664 0.2621 562 0.0374 0.0378 898 0.2703 0.266 563 0.0364 0.0364 899 0.2746 0.2689 564 0.0362 0.0366 900 0.2726 0.2679 565 0.0368 0.0384 901 0.2751 0.2705 566 0.0361 0.0389 902 0.2771 0.2712 567 0.037 0.0403 903 0.2788 0.2744 568 0.0397 0.04 904 0.2834 0.279 569 0.0373 0.0389 905 0.2868 0.2824 570 0.0363 0.0367 906 0.2897 0.2853 571 0.0359 0.0374 907 0.2897 0.2842 572 0.036 0.0376 908 0.2897 0.2862 573 0.0376 0.0392 909 0.2931 0.2887 574 0.0385 0.0401 910 0.295 0.2905 575 0.0394 0.0395 911 0.2991 0.2955 576 0.0376 0.0376 912 0.3017 0.298 577 0.0363 0.0376 913 0.3082 0.3017 578 0.0364 0.0397 914 0.3057 0.3032 579 0.0379 0.0397 915 0.3071 0.3018 580 0.0366 0.0412 916 0.3087 0.3031 581 0.0392 0.0414 917 0.3138 0.3091 582 0.0393 0.0405 918 0.3163 0.3116 583 0.0393 0.0393 919 0.3206 0.316 584 0.0369 0.0385 920 0.3229 0.3182 585 0.0369 0.0385 921 0.3236 0.3188 586 0.0375 0.0393 922 0.3256 0.3208 587 0.0378 0.0408 923 0.3277 0.321 588 0.0397 0.0413 924 0.3312 0.3264 589 0.0401 0.0406 925 0.3346 0.3298 590 0.0376 0.0393 926 0.3391 0.3343 591 0.0362 0.0391 927 0.3411 0.3362 592 0.0356 0.0388 928 0.3419 0.3354 593 0.0375 0.0391 929 0.3442 0.3343 594 0.0392 0.0408 930 0.3438 0.3397 595 0.0397 0.0401 931 0.3498 0.3449 596 0.0395 0.0395 932 0.3531 0.3475 597 0.0361 0.0377 933 0.3577 0.3526 598 0.036 0.0383 934 0.3586 0.3543 599 0.0358 0.0378 935 0.3601 0.3502 600 0.0357 0.0388 936 0.3639 0.3561 601 0.0386 0.039 937 0.3629 0.3571 602 0.0392 0.0407 938 0.3693 0.3634 603 0.0377 0.0393 939 0.3709 0.3652 604 0.0366 0.0381 940 0.3741 0.3688 605 0.0349 0.0379 941 0.3763 0.371 606 0.0353 0.0377 942 0.3763 0.371 607 0.036 0.0385 943 0.3799 0.3724 608 0.037 0.0387 944 0.3834 0.378 609 0.0381 0.0396 945 0.3858 0.3783 610 0.037 0.0385 946 0.3905 0.3837 611 0.0358 0.0381 947 0.3942 0.3878 612 0.0344 0.0372 948 0.3956 0.3901 613 0.0341 0.037 949 0.3969 0.3885 614 0.0355 0.0383 950 0.4005 0.392 615 0.0361 0.0381 951 0.4022 0.3936 616 0.0369 0.0371 952 0.4055 0.3969 617 0.0341 0.0368 953 0.4089 0.4058 618 0.0347 0.036 954 0.4143 0.4085 619 0.0335 0.0348 955 0.4178 0.4103 620 0.0342 0.0366 956 0.417 0.4081 621 0.0343 0.037 957 0.4191 0.4101 622 0.0353 0.0388 958 0.4199 0.4116 623 0.0357 0.037 959 0.4253 0.4178 624 0.0352 0.0362 960 0.4296 0.4225 625 0.0334 0.0347 961 0.4352 0.4261 626 0.032 0.0346 962 0.4381 0.4266 627 0.0325 0.0351 963 0.4368 0.4292 628 0.034 0.0357 964 0.439 0.4294 629 0.0343 0.0368 965 0.4366 0.4325 630 0.035 0.0355 966 0.4462 0.4397 631 0.033 0.0349 967 0.449 0.4424 632 0.0321 0.0333 968 0.4537 0.447 633 0.0317 0.0341 969 0.4565 0.4472 634 0.0319 0.0342 970 0.4581 0.448 635 0.033 0.0348 971 0.4557 0.448 636 0.033 0.0347 972 0.4609 0.4521 637 0.0342 0.0354 973 0.466 0.4589 638 0.0316 0.0331 974 0.4713 0.4642 639 0.0306 0.0331 975 0.4757 0.4655 640 0.0298 0.0332 976 0.4764 0.4677 641 0.0305 0.0344 977 0.4799 0.4689 642 0.0322 0.0346 978 0.4768 0.4689 643 0.0334 0.0347 979 0.4812 0.4737 644 0.032 0.034 980 0.4862 0.4786 645 0.0311 0.0326 981 0.49 0.4823 646 0.0286 0.03 982 0.4903 0.4825 647 0.0291 0.0317 983 0.5008 0.489 648 0.0301 0.0327 984 0.4956 0.4867 649 0.0312 0.0339 985 0.4979 0.4895 650 0.0315 0.0329 986 0.5002 0.4903 651 0.0304 0.0317 987 0.505 0.5041 652 0.0304 0.0318 988 0.5083 0.5034 653 0.0285 0.0298 989 0.5169 0.5067 654 0.0292 0.0319 990 0.5186 0.5055 655 0.0292 0.0329 991 0.5173 0.5079 656 0.0299 0.0326 992 0.5197 0.5066 657 0.0306 0.0332 993 0.5186 0.5095 658 0.0292 0.0306 994 0.5264 0.5196 659 0.0289 0.0305 995 0.5333 0.5249 660 0.0285 0.0305 996 0.5359 0.5264 661 0.0282 0.0305 997 0.5411 0.5277 662 0.0278 0.0305 998 0.5363 0.5264 663 0.0302 0.0328 999 0.541 0.5309 664 0.0291 0.0312 1000 0.5375 0.532 665 0.0282 0.0295 1001 0.55 0.5404 666 0.0277 0.0291 1002 0.5532 0.5479 667 0.0275 0.0302 1003 0.5617 0.5497 668 0.0269 0.029 1004 0.5523 0.5452 669 0.0277 0.0307 1005 0.5607 0.5501 670 0.0289 0.0305 1006 0.5559 0.5503 671 0.0289 0.0302 1007 0.5595 0.5505 672 0.0277 0.0286 1008 0.5709 0.5637 673 0.0261 0.0269 1009 0.5713 0.5652 674 0.0262 0.0276 1010 0.5807 0.5732 675 0.0266 0.0292 1011 0.5806 0.5681 676 0.0282 0.0309 1012 0.5794 0.5623 677 0.0291 0.031 1013 0.5779 0.5644 678 0.0281 0.0294 1014 0.5769 0.5759 679 0.0278 0.0292 1015 0.5861 0.5793 680 0.0266 0.0293 1016 0.5976 0.5907 681 0.0267 0.0286 1017 0.6057 0.5927 682 0.0278 0.0291 1018 0.6021 0.5878 683 0.0268 0.0307 1019 0.598 0.5856 684 0.0294 0.0308 1020 0.5969 0.5894 685 0.0274 0.0294 1021 0.6017 0.5941 686 0.0265 0.0281 1022 0.604 0.604 687 0.0255 0.0281 1023 0.6226 0.6127 688 0.0261 0.0285 1024 0.6276 0.6112 689 0.0282 0.0302 1025 0.6242 0.6075 690 0.0282 0.0299 1026 0.6129 0.6036 691 0.0282 0.0308 1027 0.6228 0.6065 692 0.0279 0.0292 1028 0.6181 0.6125 693 0.0274 0.0293 1029 0.6222 0.6222 694 0.0272 0.0289 1030 0.632 0.632 695 0.0267 0.0293 1031 0.6519 0.6327 696 0.0291 0.0307 1032 0.6475 0.6277 697 0.0285 0.0306 1033 0.6383 0.618 698 0.0292 0.0314 1034 0.6366 0.6238 699 0.0292 0.0306 1035 0.6309 0.6308 700 0.0289 0.0289 1036 0.6549 0.65 701 0.0278 0.0283 1037 0.6658 0.6485 702 0.0269 0.0291 1038 0.668 0.6487 703 0.0276 0.0314 1039 0.6616 0.6489 704 0.0304 0.0317 1040 0.651 0.6389 705 0.0304 0.0317 1041 0.6544 0.6467 706 0.0296 0.031 1042 0.6563 0.6485 707 0.0302 0.0304 1043 0.6583 0.6562 708 0.029 0.0304 1044 0.6848 0.6839 709 0.0286 0.0313 1045 0.6876 0.6738 710 0.0305 0.0331 1046 0.693 0.6789 711 0.0305 0.0332 1047 0.6784 0.6527 712 0.0293 0.0306 1048 0.6629 0.6477 713 0.031 0.0324 1049 0.6661 0.6781 714 0.032 0.0327 1050 0.6954 0.6882 715 0.0301 0.0321 Table 2 the average reflectivity of the first reference sheet (%) the average reflectivity of the second reference sheet (%) R7590 0.14 0.14 R4070 0.03 0.03 - It should be mentioned that the dot pattern and the inclined-striped pattern in
Figs. 1A ,1B ,1F to 1I and1M are configured to indicate the range of theanti-reflecting layer 130 and the range of thelight blocking structure 113, respectively, the thickness of theanti-reflecting layer 130, the thickness ofanti-scratch layer 140 and the thickness of thelight blocking structure 113 are only configured to be the schematic view, and the thicknesses thereof are not shown according to the actual ratio. -
Fig. 2A is a partial exploded view of anelectronic device 20 according to the 2nd example of the present disclosure. InFig. 2A , theelectronic device 20 can be a smart electronic device, and theelectronic device 20 includes a plurality oftransparent elements 210, a plurality ofoptical components anti-reflecting layer 230, wherein thetransparent elements 210 are configured to separate an inner side and an outer side of theelectronic device 20, so that the light (not shown) passes through thetransparent elements 210 to enter or leave theelectronic device 20. - In detail, each of the
transparent elements 210 is corresponding to each of theoptical components anti-reflecting layer 230 can be adjusted according to the requirement of theoptical component 221. -
Fig. 2B is a schematic view of thetransparent element 210 and theoptical component 221 according to the 2nd example inFig. 2A . InFig. 2B , each of thetransparent elements 210 includes aninner side surface 211 and anouter side surface 212, wherein theinner side surface 211 faces towards the inner side, and theouter side surface 212 faces towards the outer side. Moreover, theinner side surface 211 of each of thetransparent elements 210 is non-planar. Therefore, the reflecting path of the light can be changed so as to avoid influencing the operation of theoptical component 221 by the reflecting light. Or, thetransparent elements 210 can have the refractive power. - It should be mentioned that the dot pattern in
Fig. 2A is configured to indicate the range of theanti-reflecting layer 230, the optical system and the structural dispositions according to the 2nd example are the same as the optical system and the structural dispositions according to the 1st example, and hence will not be described again herein. -
Fig. 3A is a three dimensional view of anelectronic device 30 according to the 3rd example of the present disclosure.Fig. 3B is a partial exploded view of theelectronic device 30 according to the 3rd example inFig. 3A . InFigs. 3A and3B , theelectronic device 30 can be a smart electronic device, and theelectronic device 30 includes atransparent element 310, anoptical component 320 and ananti-reflecting layer 330. - According to the 3rd example, the
optical component 320 is a telescopic imaging camera. When theoptical component 320 is idled, theoptical component 320 is disposed inside theelectronic device 30; when theoptical component 320 is started, theoptical component 320 is lifted from inside of theelectronic device 30 so as to keep the consistency of adisplay area 31 of theelectronic device 30 to enhance the displaying effect. Further, when theoptical component 320 is lifted, thetransparent element 310 is configured to separate an inner side and an outer side of theelectronic device 30, so that the light (not shown) passes through thetransparent element 310 to enter or leave theelectronic device 30. - The
transparent element 310 includes an inner side surface 311 (labeled inFig. 3D ) and anouter side surface 312, wherein theinner side surface 311 faces towards the inner side, and theouter side surface 312 faces towards the outer side. Moreover, theoptical component 320 is corresponding to theinner side surface 311 of thetransparent element 310, and theanti-reflecting layer 330 is disposed on at least one portion of theinner side surface 311 of thetransparent element 310. -
Fig. 3C is a schematic view of thetransparent element 310 according to the 3rd example inFig. 3A . InFigs. 3B and3C , thetransparent element 310 can further include alight blocking structure 313, wherein thelight blocking structure 313 is configured to avoid the light passing through, a light-transmittingarea 350 is remained on thetransparent element 310 via thelight blocking structure 313, and the light-transmittingarea 350 is corresponding to theoptical component 320, so that the light can pass through thetransparent element 310 to enter or leave theelectronic device 30. Moreover, the portion except the light-transmittingarea 350 can be blocked by disposing thelight blocking structure 313 on thetransparent element 310 so as to reduce the stray light. -
Fig. 3D is a cross-sectional view of thetransparent element 310 along a 3D-3D line inFig. 3C .Fig. 3E is a partial enlarged view of thetransparent element 310 according to the 3rd example inFig. 3D . InFigs. 3D and 3E , a number of theanti-reflecting layer 330 is a plurality, wherein theanti-reflecting layer 330 can include a plurality of high refractive index films and a plurality of low refractive index films, which are alternately stacked, so that the anti-reflecting effect can be achieved based on the interference principle of the thin film. - It should be mentioned that the dot pattern and the inclined-striped pattern in
Figs. 3A to 3C are configured to indicate the range of theanti-reflecting layer 330 and the range of thelight blocking structure 313, respectively. -
Fig. 4 is a three dimensional view of anelectronic device 40 according to the 4th example of the present disclosure. InFig. 4 , theelectronic device 40 can be an AR (Augmented Reality) head-mounted device, and theelectronic device 40 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and ananti-reflecting layer 430, wherein the transparent element is configured to separate an inner side and an outer side of theelectronic device 40, so that the light (not shown) passes through the transparent element to enter or leave theelectronic device 40. - Moreover, the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the
anti-reflecting layer 430 is disposed on at least one portion of the inner side surface of the transparent element. - Further, the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 4th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
-
Fig. 5 is a three dimensional view of anelectronic device 50 according to the 5th example of the present disclosure. InFig. 5 , theelectronic device 50 can be an VR (Virtual Reality) head-mounted device, and theelectronic device 50 includes a transparent element (its reference numeral is omitted), a plurality of optical components (their reference numerals are omitted) and ananti-reflecting layer 530, wherein the transparent element is configured to separate an inner side and an outer side of theelectronic device 50, so that the light (not shown) passes through the transparent element to enter or leave theelectronic device 50. - Moreover, the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical components are corresponding to the inner side surface of the transparent element, and the
anti-reflecting layer 530 is disposed on at least one portion of the inner side surface of the transparent element. - Further, the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to the 5th example can be referred to the disposition and the structural details of the transparent element, the optical components and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
-
Fig. 6 is a three dimensional view of anelectronic device 60 according to the 6th example of the present disclosure. InFig. 6 , theelectronic device 60 can be a video capturing device, and theelectronic device 60 includes a transparent element (its reference numeral is omitted), an optical component (its reference numeral is omitted) and ananti-reflecting layer 630, wherein the transparent element is configured to separate an inner side and an outer side of theelectronic device 60, so that the light (not shown) passes through the transparent element to enter or leave theelectronic device 60. - Moreover, the transparent element includes an inner side surface (its reference numeral is omitted) and an outer side surface (its reference numeral is omitted), wherein the inner side surface faces towards the inner side, the outer side surface faces towards the outer side, the optical component is corresponding to the inner side surface of the transparent element, and the
anti-reflecting layer 630 is disposed on at least one portion of the inner side surface of the transparent element. - Furthermore, the
electronic device 60 can further include afill light module 61 and a focusing assistingmodule 62, and theelectronic device 60 can be disposed on a computer monitor (its reference numeral is omitted). - Further, the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to the 6th example can be referred to the disposition and the structural details of the transparent element, the optical component and the anti-reflecting layer according to any one of the 1st example to the 3rd example, and hence will not be described again herein.
Claims (20)
- An electronic device (10), characterized in comprising:a transparent element (110) configured to separate an inner side and an outer side of the electronic device (10), so that a light (L) passing through the transparent element (110) to enter or leave the electronic device (10), and the transparent element (110) comprising:an inner side surface (111); andan outer side surface (112), wherein the inner side surface (111) faces towards the inner side, and the outer side surface (112) faces towards the outer side;an optical component (121) corresponding to the inner side surface (111) of the transparent element (110); andan anti-reflecting layer (130) disposed on at least one portion of the inner side surface (111) of the transparent element (110).
- The electronic device (10) of claim 1, wherein the anti-reflecting layer (130) comprises a nanostructure layer (131), the nanostructure layer (131) comprises a plurality of ridge-like protrusions, the ridge-like protrusions extend non-directionally from a disposing surface, a bottom of each of the ridge-like protrusions is closer to the disposing surface than a top of each of the ridge-like protrusions to the disposing surface, and each of the ridge-like protrusions is tapered from the bottom towards the top.
- The electronic device (10) of any of claims 1-2, wherein the anti-reflecting layer (130) further comprises a structure connection film (132), the structure connection film (132) comprises at least one silicon dioxide layer, and a top of the at least one silicon dioxide layer is directly contacted with a bottom of the nanostructure layer (131).
- The electronic device (10) of any of claims 1-3, wherein a partial area of the top of the at least one silicon dioxide layer is contacted with an air.
- The electronic device (10) of any of claims 1-4, wherein an average reflectivity of the at least one portion of the inner side surface (111) of the transparent element (110) corresponding to a light with a wavelength range between 400 nm and 700 nm is R4070, and the following condition is satisfied:
- The electronic device (10) of any of claims 1-5, wherein an average reflectivity of the at least one portion of the inner side surface (111) of the transparent element (110) corresponding to a light with a wavelength range between 750 nm and 900 nm is R7590, and the following condition is satisfied:
- The electronic device (10) of any of claims 1-6, wherein an average structural height of the nanostructure layer (131) is larger than or equal to 70 nm and less than or equal to 350 nm.
- The electronic device (10) of any of claims 1-7, wherein the outer side surface (112) comprises an anti-scratch layer (140).
- The electronic device (10) of any of claims 1-8, wherein the optical component (121) is an imaging camera.
- The electronic device (10) of any of claims 1-10, wherein the anti-reflecting layer (130) is further disposed on the optical component (121).
- The electronic device (10) of any of claims 1-11, wherein the transparent element (110) further comprises a light blocking structure (113).
- The electronic device (10) of any of claims 1-12, wherein a light-transmitting area (150) is remained on the transparent element (110) via the light blocking structure (113), and the light-transmitting area (150) is corresponding to the optical component (121).
- The electronic device (20) of any of claims 1-13, wherein a number of the transparent element (210) is at least two, a number of the optical component (221, 222, 223, 224, 225, 226) is at least two, and each of the transparent elements (210) is corresponding to each of the optical components (221, 222, 223, 224, 225, 226).
- The electronic device (20) of any of claims 1-14, wherein the inner side surface (211) of one of the at least two transparent elements (210) is non-planar.
- The electronic device (10) of any of claims 1-15, wherein a number of the optical component (121, 122, 123, 124, 125, 126) is at least two, and the at least two optical components (121, 122, 123, 124, 125, 126) are corresponding to the inner side surface (111) of the transparent element (110).
- The electronic device (10) of any of claims 1-16, wherein one of the at least two optical components (121, 122, 123, 124, 125, 126) is an imaging camera, and the other one of the at least two optical components (121, 122, 123, 124, 125, 126) is a light-emitting element.
- The electronic device (10) of any of claims 1-17, wherein the at least two optical components (121, 122, 123, 124, 125, 126) are at least two imaging cameras, and a field of view of one of the at least two imaging cameras is different from a field of view of the other one of the at least two imaging cameras.
- The electronic device (10) of any of claims 1-18, wherein a corresponding working wavelength of one of the at least two optical components (121, 122, 123, 124, 125, 126) is different from a corresponding working wavelength of the other one of the at least two optical components (121, 122, 123, 124, 125, 126).
- The electronic device (10) of any of claims 1-19, wherein the electronic device (10) is a portable electronic device.
Applications Claiming Priority (1)
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US202263345984P | 2022-05-26 | 2022-05-26 |
Publications (1)
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EP4283376A1 true EP4283376A1 (en) | 2023-11-29 |
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EP23174030.9A Pending EP4283376A1 (en) | 2022-05-26 | 2023-05-17 | Electronic device |
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US (1) | US20230384486A1 (en) |
EP (1) | EP4283376A1 (en) |
CN (2) | CN117130073A (en) |
BR (1) | BR102023009908A2 (en) |
Citations (6)
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US20160061998A1 (en) * | 2011-02-15 | 2016-03-03 | Canon Kabushiki Kaisha | Optical member, method of manufacturing the same, and optical system using the same |
KR20170000679A (en) * | 2015-06-24 | 2017-01-03 | 삼성전자주식회사 | Camera module for mobile device |
WO2017146210A1 (en) * | 2016-02-24 | 2017-08-31 | 株式会社オプトラン | Cover glass laminated structure, camera structure and imaging device |
US20170315269A1 (en) * | 2016-05-02 | 2017-11-02 | Canon Kabushiki Kaisha | Antireflection film, and optical member and optical apparatus each using the antireflection film |
US20180100957A1 (en) * | 2015-07-24 | 2018-04-12 | Huawei Technologies Co., Ltd. | Camera Module and Terminal |
CN216210188U (en) * | 2021-07-16 | 2022-04-05 | 大立光电股份有限公司 | Lens set, optical device and electronic device |
-
2023
- 2023-04-25 CN CN202310449683.8A patent/CN117130073A/en active Pending
- 2023-04-25 CN CN202320950906.4U patent/CN220121016U/en active Active
- 2023-05-12 US US18/316,663 patent/US20230384486A1/en active Pending
- 2023-05-17 EP EP23174030.9A patent/EP4283376A1/en active Pending
- 2023-05-22 BR BR102023009908-4A patent/BR102023009908A2/en unknown
Patent Citations (6)
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US20160061998A1 (en) * | 2011-02-15 | 2016-03-03 | Canon Kabushiki Kaisha | Optical member, method of manufacturing the same, and optical system using the same |
KR20170000679A (en) * | 2015-06-24 | 2017-01-03 | 삼성전자주식회사 | Camera module for mobile device |
US20180100957A1 (en) * | 2015-07-24 | 2018-04-12 | Huawei Technologies Co., Ltd. | Camera Module and Terminal |
WO2017146210A1 (en) * | 2016-02-24 | 2017-08-31 | 株式会社オプトラン | Cover glass laminated structure, camera structure and imaging device |
US20170315269A1 (en) * | 2016-05-02 | 2017-11-02 | Canon Kabushiki Kaisha | Antireflection film, and optical member and optical apparatus each using the antireflection film |
CN216210188U (en) * | 2021-07-16 | 2022-04-05 | 大立光电股份有限公司 | Lens set, optical device and electronic device |
Also Published As
Publication number | Publication date |
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TW202347003A (en) | 2023-12-01 |
US20230384486A1 (en) | 2023-11-30 |
BR102023009908A2 (en) | 2024-03-05 |
CN220121016U (en) | 2023-12-01 |
CN117130073A (en) | 2023-11-28 |
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