EP4265660A1 - Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber - Google Patents
Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber Download PDFInfo
- Publication number
- EP4265660A1 EP4265660A1 EP21906219.7A EP21906219A EP4265660A1 EP 4265660 A1 EP4265660 A1 EP 4265660A1 EP 21906219 A EP21906219 A EP 21906219A EP 4265660 A1 EP4265660 A1 EP 4265660A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- meth
- resin composition
- acrylate
- resin layer
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 title claims abstract description 64
- 239000013307 optical fiber Substances 0.000 title claims description 42
- 239000011248 coating agent Substances 0.000 title claims description 23
- 238000000576 coating method Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000463 material Substances 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims abstract description 109
- 229920005989 resin Polymers 0.000 claims abstract description 109
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 52
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- 239000003999 initiator Substances 0.000 claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 8
- -1 methacryloyl group Chemical group 0.000 claims description 38
- 239000003365 glass fiber Substances 0.000 claims description 24
- 239000011164 primary particle Substances 0.000 claims description 12
- 238000005253 cladding Methods 0.000 claims description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 108
- 239000010410 layer Substances 0.000 description 85
- 239000000178 monomer Substances 0.000 description 21
- 239000004593 Epoxy Substances 0.000 description 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000002612 dispersion medium Substances 0.000 description 14
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 9
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229910000077 silane Inorganic materials 0.000 description 8
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 6
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229960002317 succinimide Drugs 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- MJSNUBOCVAKFIJ-LNTINUHCSA-N chromium;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Cr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O MJSNUBOCVAKFIJ-LNTINUHCSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- COTNUBDHGSIOTA-UHFFFAOYSA-N meoh methanol Chemical compound OC.OC COTNUBDHGSIOTA-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- PGMMMHFNKZSYEP-UHFFFAOYSA-N 1,20-Eicosanediol Chemical compound OCCCCCCCCCCCCCCCCCCCCO PGMMMHFNKZSYEP-UHFFFAOYSA-N 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- GJBXIPOYHVMPQJ-UHFFFAOYSA-N hexadecane-1,16-diol Chemical compound OCCCCCCCCCCCCCCCCO GJBXIPOYHVMPQJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- BXSPZNVFEYWSLZ-UHFFFAOYSA-N (3-phenoxyphenyl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 BXSPZNVFEYWSLZ-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- LAIJAUHBAWLPCO-UHFFFAOYSA-N (4-tert-butylcyclohexyl) prop-2-enoate Chemical compound CC(C)(C)C1CCC(OC(=O)C=C)CC1 LAIJAUHBAWLPCO-UHFFFAOYSA-N 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- PRIUALOJYOZZOJ-UHFFFAOYSA-L 2-ethylhexyl 2-[dibutyl-[2-(2-ethylhexoxy)-2-oxoethyl]sulfanylstannyl]sulfanylacetate Chemical compound CCCCC(CC)COC(=O)CS[Sn](CCCC)(CCCC)SCC(=O)OCC(CC)CCCC PRIUALOJYOZZOJ-UHFFFAOYSA-L 0.000 description 1
- HHKAGFTWEFVXET-UHFFFAOYSA-N 2-heptyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCCCCCC(CO)(CO)CO HHKAGFTWEFVXET-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SEGKJLWPIPSYSC-UHFFFAOYSA-N 3-ethyloctane-1,8-diol Chemical compound OCCC(CC)CCCCCO SEGKJLWPIPSYSC-UHFFFAOYSA-N 0.000 description 1
- XPFCZYUVICHKDS-UHFFFAOYSA-N 3-methylbutane-1,3-diol Chemical compound CC(C)(O)CCO XPFCZYUVICHKDS-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 1
- JOVCTEPPTIOAPX-UHFFFAOYSA-N 8-trimethoxysilyloctyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C=C JOVCTEPPTIOAPX-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- MBXULDRFQBQSSK-UHFFFAOYSA-N N'-[3-[methoxy-[(2-methylpropan-2-yl)oxy]silyl]propyl]ethane-1,2-diamine Chemical compound NCCNCCC[SiH](OC(C)(C)C)OC MBXULDRFQBQSSK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- ZXZSYHLGFSXNNU-UHFFFAOYSA-N [[methyl(4-trimethoxysilylbutyl)carbamothioyl]trisulfanyl] N-methyl-N-(4-trimethoxysilylbutyl)carbamodithioate Chemical compound CO[Si](CCCCN(C(=S)SSSSC(N(C)CCCC[Si](OC)(OC)OC)=S)C)(OC)OC ZXZSYHLGFSXNNU-UHFFFAOYSA-N 0.000 description 1
- YSCDKUPSJMMGGT-UHFFFAOYSA-L [dibutyl-[2-(6-methylheptylsulfanyl)acetyl]oxystannyl] 2-(6-methylheptylsulfanyl)acetate Chemical compound CC(C)CCCCCSCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CSCCCCCC(C)C YSCDKUPSJMMGGT-UHFFFAOYSA-L 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- XLKZJJVNBQCVIX-UHFFFAOYSA-N tetradecane-1,14-diol Chemical compound OCCCCCCCCCCCCCCO XLKZJJVNBQCVIX-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
Images
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/16—Chemical modification with polymerisable compounds
- C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2499/00—Characterised by the use of natural macromolecular compounds or of derivatives thereof not provided for in groups C08J2401/00 - C08J2407/00 or C08J2489/00 - C08J2497/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/12—Applications used for fibers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02395—Glass optical fibre with a protective coating, e.g. two layer polymer coating deposited directly on a silica cladding surface during fibre manufacture
Definitions
- the present disclosure relates to a resin composition, a secondary coating material for an optical fiber, an optical fiber, and a method for manufacturing an optical fiber.
- An optical fiber has generally a coating resin layer for protecting a glass fiber that is an optical transmission medium.
- the coating resin layer comprises, for example, a primary resin layer and a secondary resin layer.
- a colored layer may be formed on the outermost layer of the optical fiber. It is known that the colored layer is formed on the outer periphery of the secondary resin layer by temporarily winding the optical fiber coated with the primary resin layer and the secondary resin layer and then feeding out the optical fiber again (for example, refer to Patent Literature 1).
- Patent Literature 1 WO 2016/080195 A1
- a resin composition according to an aspect of the present disclosure comprises a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles, wherein the surface-modified silica particles have, as a silicone structural unit, a T unit in which three oxygen atoms are bonded to a silicon atom, and the proportion of a T1 unit contained in the T unit is 29 mol% or less.
- FIG. 1 is a schematic cross-section diagram showing an example of the optical fiber according to the present embodiment.
- a rewinding work may be performed from a large bobbin to a small bobbin.
- scratch resistance of the surface of the secondary resin layer is low, scratches may be generated on the surface of the secondary resin layer in winding, and the resin layer may be broken to significantly deteriorate the optical characteristics. Therefore, the secondary resin layer is required to have excellent scratch resistance (abrasion resistance).
- An object of the present disclosure is to provide: a resin composition capable of forming a resin layer having excellent scratch resistance; and an optical fiber comprising a secondary resin layer formed from the resin composition and capable of preventing scratches in a rewinding work.
- the present disclosure can provide: a resin composition capable of forming a resin layer having excellent scratch resistance; and an optical fiber comprising a secondary resin layer formed from the resin composition and capable of preventing scratches in a rewinding work.
- a resin composition according to an aspect of the present disclosure comprises a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles, wherein the surface-modified silica particles have, as a silicone structural unit, a T unit in which three oxygen atoms are bonded to a silicon atom, and the proportion of T1 units contained in the T unit is 29 mol% or less.
- Curing a resin composition containing surface-modified silica particles having a specific silicone structural unit can form a resin layer having excellent scratch resistance.
- the surface-modified silica particles may have at least one ultraviolet curable group selected from the group consisting of an acryloyl group, a methacryloyl group, and a vinyl group. This makes it easier to form a resin layer with a high Young's modulus.
- the content of the surface-modified silica particles may be 1% by mass or more and 60% by mass or less based on the total amount of the resin composition.
- the average primary particle size of the surface-modified silica particles may be 100 nm or less.
- the secondary coating material for the optical fiber according to an aspect of the present disclosure comprises the above resin composition.
- a coating resin layer having excellent scratch resistance can be formed by using the resin composition according to the present embodiment in the secondary resin layer.
- the optical fiber according to an aspect of the present disclosure comprises: a glass fiber comprising a core and a cladding; a primary resin layer being in contact with the glass fiber and coating the glass fiber; and a secondary resin layer coating the primary resin layer, wherein the secondary resin layer comprises a cured product of the above resin composition.
- a method for manufacturing the optical fiber according to an aspect of the present disclosure comprises: an application step of applying the above resin composition to the outer periphery of a glass fiber composed of a core and a cladding; and a curing step of curing the resin composition by irradiating with ultraviolet rays after the application step. This can produce an optical fiber capable of preventing scratches in the rewinding work.
- the resin composition according to the present embodiment is an ultraviolet curable resin composition comprising a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles.
- the constituent units of silicone possessed by silicone compounds are generally classified into a M unit (unit in which one oxygen atom is bonded to a silicon atom), a D unit (unit in which two oxygen atoms are bonded to a silicon atom), a T unit (unit in which three oxygen atoms are bonded to a silicon atom), and a Q unit (unit in which four oxygen atoms are bonded to a silicon atom).
- M unit unit in which one oxygen atom is bonded to a silicon atom
- D unit unit in which two oxygen atoms are bonded to a silicon atom
- T unit unit in which three oxygen atoms are bonded to a silicon atom
- Q unit unit in which four oxygen atoms are bonded to a silicon atom.
- R represents a monovalent organic group.
- the T unit is a structure derived from a silane compound represented by R-Si-(OR') 3 .
- R represents a monovalent organic group. Examples of the monovalent organic group include an alkyl group, a phenyl group, a (meth)acryloxyalkyl group, an alkenyl group, a styryl group, and a vinyl group.
- R' represents an alkyl group such as a methyl group or an ethyl group.
- a T unit comprises: a T1 unit in which one oxygen atom is bonded to another silicon atom; a T2 unit in which two oxygen atoms are bonded to another silicon atom; and a T3 unit in which three oxygen atoms are bonded to another silicon atom.
- the structures of the T1 unit, T2 unit, and T3 unit can be represented by the following formula.
- the proportion of each structural unit can be calculated by measuring the solid 29 Si-NMR spectrum of the silicone compound (for example, refer to " Structural Analysis of Silicon Containing Materials by 29Si NMR", Research Report of Asahi Glass Co., Ltd. 66 (2016), pp. 32-36 ).
- Silica particles that are not surface-modified are mainly composed of the Q unit.
- the surface-modified silica particles according to the present embodiment have the Q unit based on the siloxane structure of the silica particles before surface modification and the T unit based on the siloxane structure introduced by surface modification.
- the chemical shift of the Q unit is observed in the range of -90 ppm to -120 ppm
- the chemical shift of the T unit is observed in the range of -35 ppm to -75 ppm, respectively.
- the T1 unit has a peak top around 50 ppm
- the T2 unit has a peak top around 60 ppm
- the T3 unit has a peak top around 70 ppm. Therefore, integrating the signal of the T unit possessed by the surface-modified silica particles can calculate the proportion of each unit of T1, T2, and T3 from the signal area.
- the T unit is introduced into the surface-modified silica particles according to the present embodiment by treating the surface of the silica particles with a silane compound.
- the proportion of the T1 unit contained in the T unit possessed by the surface-modified silica particles is 29 mol % or less, preferably 28 mol % or less, and more preferably 26 mol % or less, from the viewpoint of forming a resin layer having excellent scratch resistance.
- the lower limit of the proportion of the T1 unit may be 1 mol % or more, 5 mol % or more, or 8 mol % or more.
- the proportions of the T2 unit and T3 unit contained in the T unit are not particularly limited.
- the proportion of the T2 unit may be, for example, 10 mol % or more, 15 mol % or more, or 20 mol % or more, and may be 70 mol % or less, 68 mol % or less, or 66 mol % or less.
- the proportion of the T3 unit may be, for example, 1 mol % or more, 4 mol % or more, or 6 mol % or more, and may be 70 mol % or less, 64 mol % or less, or 62 mol % or less.
- the silane compound may be a silane compound having an ultraviolet-curable group.
- examples of R in the T unit and T1 unit include a (meth)acryloxyalkyl group, an alkenyl group, a styryl group, and a vinyl group
- examples of R' include a methyl group and an ethyl group.
- the surface-modified silica particles having an acryloyl group, a methacryloyl group, or a vinyl group allow formation of a resin layer having superior scratch resistance.
- silane compound having an ultraviolet-curable group examples include 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltriethoxysilane, 8-methacryloxyoctyltrimethoxysilane, 8-acryloxyoctyltrimethoxysilane, 7-octenyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane.
- the surface-modified silica particles according to the present embodiment are dispersed in a dispersion medium.
- Using the surface-modified silica particles dispersed in the dispersion medium can uniformly disperse the surface-modified silica particles in the resin composition, and can improve the storage stability of the resin composition.
- the dispersion medium is not particularly limited as long as curing of the resin composition is not obstructed.
- the dispersion medium may be reactive or non-reactive.
- a monomer such as a (meth)acryloyl compound and an epoxy compound can be used as the reactive dispersion medium.
- the (meth)acryloyl compound include 1,6-hexanediol di(meth)acrylate, EO-modified bisphenol A di(meth)acrylate, polyethylene glycol di(meth)acrylate, PO-modified bisphenol A di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, 2-hydroxy-3-phenoxypropyl(meth)acrylate, (meth)acrylic acid adduct of propylene glycol diglycidyl ether, (meta)acrylic acid adduct of tripropylene glycol diglycidyl ether, and (meth)acrylic acid adduct of glycerin diglycidyl ether.
- the (meth)acryloyl compound the compounds exemplified in the monomers described later
- a ketone solvent such as methyl ethyl ketone (MEK), an alcohol solvent such as methanol (MeOH) and propylene glycol monomethyl ether (PGME), or an ester solvent such as propylene glycol monomethyl ether acetate (PGMEA) may be used.
- the resin composition may be prepared by mixing the base resin and the surface-modified silica particles dispersed in the dispersion medium, and then removing a part of the dispersion medium.
- the surface-modified silica particles are preferably dispersed in the alcohol solvent, more preferably in MeOH.
- the average primary particle size of the surface-modified silica particles is preferably 100 nm or less, and may be 90 nm or less or 80 nm or less. From the viewpoint of increasing the strength of the secondary resin layer, the average primary particle size of the surface-modified silica particles may be 1 nm or more, 2 nm or more, or 5 nm or more.
- the average primary particle size can be measured, for example, by image analysis of electron micrographs, the light scattering method, and the BET method. The average primary particle size can be measured according to the method described in any of JIS Z 8827-1, JIS Z 8827-2, JIS Z 8828, or JIS Z 8830.
- a dispersion medium in which primary particles of silica particles are dispersed appears transparent to the naked eye when the primary particles have a small particle size.
- the particle size of the primary particles is relatively large (40 nm or more)
- the dispersion medium in which the primary particles are dispersed appears cloudy, but no sediment is observed.
- the content of the surface-modified silica particles is preferably 1% by mass or more and 60% by mass or less, 3% by mass or more and 50% by mass or less, 5% by mass or more and 40% by mass or less, or 10% by mass or more and 35% by mass or less, based on the total amount of resin composition (total amount of the base resin and surface-modified silica particles).
- the content of the surface-modified silica particles of 1% by mass or more easily forms a resin layer with a high Young's modulus.
- the content of the surface-modified silica particles of 60% by mass or less can easily improve the application properties of the resin composition, and can form a resin layer having excellent toughness.
- the base resin according to the present embodiment contains a photopolymerizable compound and a photopolymerization initiator.
- the photopolymerizable compound according to the present embodiment can comprise urethane (meth)acrylate from the viewpoint of adjusting Young's modulus.
- the photopolymerizable compound according to the present embodiment does not comprise surface-modified silica particles having an ultraviolet-curable group.
- urethane (meth)acrylate a urethane oligomer obtained by reacting a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth)acrylate compound can be used.
- the urethane (meth)acrylate may be used in combination of two or more.
- polyol compound examples include polytetramethylene glycol, polypropylene glycol, and bisphenol A-ethylene oxide addition diol.
- polyisocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and dicyclohexylmethane 4,4'-diisocyanate.
- hydroxyl group-containing (meth)acrylate compound examples include 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 1,6-hexanediol mono(meth)acrylate, pentaerythritol tri(meth)acrylate, 2-hydroxypropyl (meth)acrylate, and tripropylene glycol mono(meth)acrylate.
- the number average molecular weight (Mn) of the polyol compound may be 300 or more and 3000 or less, 400 or more and 3000 or less, or 500 or more and 2500 or less.
- an organotin compound As a catalyst for synthesizing urethane (meth)acrylate, an organotin compound is generally used.
- the organotin compound include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin maleate, dibutyltin bis(2-ethylhexyl mercaptoacetate), dibutyltin bis(isooctyl mercaptoacetate), and dibutyltin oxide. From the viewpoint of easy availability or catalyst performance, it is preferable that dibutyltin dilaurate or dibutyltin diacetate be used as catalyst.
- a lower alcohol having 5 or less carbon atoms may be used when synthesizing the urethane (meth)acrylate.
- the lower alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, 3-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-2-butanol, and 2,2-dimethyl-1-propanol.
- the photopolymerizable compound according to the present embodiment may comprise epoxy (meth)acrylate from the viewpoint of adjusting Young's modulus.
- the epoxy (meth)acrylate include an aliphatic epoxy (meth)acrylate and an aromatic epoxy (meth)acrylate.
- the aliphatic epoxy (meth)acrylate means an epoxy (meth)acrylate having no aromatic ring
- the aromatic epoxy (meth)acrylate means an epoxy (meth)acrylate having the aromatic ring.
- aliphatic epoxy (meth)acrylate a reaction product of an aliphatic epoxy compound having two or more glycidyl groups and a compound having a (meth)acryloyl group such as (meth)acrylic acid can be used.
- the aliphatic epoxy (meth)acrylate preferably has an ethylene oxide group or a propylene oxide group.
- the aliphatic epoxy (meth)acrylates include a (meth)acrylic acid adduct of propylene glycol diglycidyl ether, a (meth)acrylic acid adduct of polypropylene glycol diglycidyl ether, a (meth)acrylic acid adduct of ethylene glycol diglycidyl ether, and a (meth)acrylic acid adduct of polyethylene glycol diglycidyl ether.
- Examples of commercially available aliphatic epoxy (meth)acrylates include trade names "Epoxyester 40EM”, “Epoxyester 70PA”, “Epoxyester 200PA”, and “Epoxyester 80MFA”, manufactured by Kyoeisha Chemical Co., Ltd.
- aromatic epoxy (meth)acrylate a reaction product of an aromatic epoxy compound having two or more glycidyl groups and a compound having a (meth)acryloyl group such as (meth)acrylic acid can be used.
- aromatic epoxy (meth)acrylate include a (meth)acrylic acid adduct of bisphenol A diglycidyl ether.
- the content of the epoxy (meth)acrylate may be 10% by mass or more and 70% by mass or less, 20% by mass or more and 60% by mass or less, or 30% by mass or more and 50% by mass or less, based on the total amount of the photopolymerizable compound.
- the photopolymerizable compound according to the present embodiment can comprise a photopolymerizable compound (hereinafter referred to as "monomer") other than the urethane (meth)acrylate and the epoxy (meth)acrylate.
- monomer a photopolymerizable compound other than the urethane (meth)acrylate and the epoxy (meth)acrylate.
- the monofunctional monomer having one polymerizable group and the multifunctional monomer having two or more polymerizable groups can be used as the monomer.
- a monomer may be used by mixing two or more monomers.
- Examples of the monofunctional monomer include (meth)acrylate monomers such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, isoamyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, 3-phenoxybenzyl acrylate,
- Examples of the multifunctional monomer include ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, di(meth)acrylate of alkylene oxide adduct of bisphenol A, tetraethylene glycol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, 1,14-tetradecanediol di(meth)acrylate, 1,16-hexadecanediol di(meth)acrylate, 1,
- the photopolymerization initiator can be appropriately selected from known radical photopolymerization initiators and used.
- the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone (Omnirad 184, manufactured by IGM Resins), 2,2-dimethoxy-2-phenylacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one (Omnirad 907 manufactured by IGM Resins), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO manufactured by IGM Resins), and bis(2,4,6-trimethylbenzoyl) phenylphosphine oxide (Omnirad 819, manufactured by IGM Res
- the content of the photopolymerization initiator may be 0.2% by mass or more and 6.0% by mass or less, 0.4% by mass or more and 3.0% by mass or less, or 0.6% by mass or more and 2.0% by mass or less, based on the total amount of the photopolymerizable compounds.
- the resin composition may further contain a silane coupling agent, a leveling agent, an antifoaming agent, an antioxidant, a sensitizer, or the like.
- the silane coupling agent is not particularly limited as long as it does not disturb curing of the resin composition.
- examples of the silane coupling agent include tetramethyl silicate, tetraethyl silicate, mercaptopropyl trimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(P-methoxy-ethoxy)silane, ⁇ -(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, dimethoxydimethylsilane, diethoxydimethylsilane, 3-acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, N-( ⁇ -aminoethyl)- ⁇ -aminopropyltrimethoxysilane,
- the resin composition according to the present embodiment is preferably used as the secondary coating material for the optical fiber.
- Using the resin composition according to the present embodiment for the secondary resin layer can form the coating resin layer having excellent scratch resistance.
- FIG. 1 is a schematic cross-section diagram showing an example of the optical fiber according to the present embodiment.
- the optical fiber 10 comprises the glass fiber 13 including the core 11 and the cladding 12, and the coating resin layer 16 including the primary resin layer 14 provided on the outer periphery of the glass fiber 13 and the secondary resin layer 15.
- the cladding 12 surrounds the core 11.
- the core 11 and the cladding 12 mainly include glass such as silica glass, germanium-added silica glass can be used, for example, in the core 11, and pure silica glass or fluorine-added silica glass can be used in the cladding 12.
- the outside diameter (D2) of the glass fiber 13 is about 100 ⁇ m to 125 ⁇ m, and the diameter (D1) of the core 11 constituting the glass fiber 13 is about 7 ⁇ m to 15 ⁇ m.
- the thickness of the coating resin layer 16 is typically about 22 ⁇ m to 70 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 5 ⁇ m to 50 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 ⁇ m to 50 ⁇ m, and for example, the thickness of the primary resin layer 14 may be 35 ⁇ m and the thickness of the secondary resin layer 15 may be 25 ⁇ m.
- the outside diameter of the optical fiber 10 may be about 245 ⁇ m to 265 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 ⁇ m to 38 ⁇ m, and for example, the thickness of the primary resin layer 14 may be 25 ⁇ m and the thickness of the secondary resin layer 15 may be 10 ⁇ m.
- the outside diameter of the optical fiber 10 may be about 179 ⁇ m to 221 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 5 ⁇ m to 32 ⁇ m, and for example, the thickness of the primary resin layer 14 may be 25 ⁇ m and the thickness of the secondary resin layer 15 may be 10 ⁇ m.
- the outside diameter of the optical fiber 10 may be about 144 ⁇ m to 174 ⁇ m.
- the resin composition according to the present embodiment can be applied to the secondary resin layer.
- the secondary resin layer can be formed by curing a resin composition comprising the surface-modified silica particles and the base resin.
- the secondary resin layer 15 comprises a cured product of the resin composition according to the present embodiment. This can prevent the surface of the secondary resin layer from being damaged and the resin layer from being broken when the rewinding work is performed from the large bobbin to the small bobbin.
- the anti-blocking effect prevents the fibers from sticking to each other, and the optical fiber can be wound around the small bobbin without winding abnormality such as winding skip.
- a method for manufacturing the optical fiber according to the present embodiment comprises: an application step of applying the above resin composition to the outer periphery of a glass fiber composed of a core and a cladding; and a curing step of curing the resin composition by irradiating with ultraviolet rays after the application step.
- Coating a glass fiber with the resin composition according to the present embodiment can manufacture an optical fiber that can prevent scratch during rewinding work.
- the resin composition according to the present embodiment is not directly applied to the glass fiber, but the resin composition for primary coating is directly applied to the glass fiber. That is, in the application step, the primary coating that is in contact with the glass fiber and the secondary coating that is not in contact with the glass fiber by the resin composition according to the present embodiment are formed.
- the Young's modulus of the secondary resin layer at 23°C is preferably 1300 MPa or more and 3600 MPa or less, more preferably 1400 MPa or more and 3000 MPa or less, and further preferably 1600 MPa or more and 2800 MPa or less.
- the Young's modulus of the secondary resin layer of 1300 MPa or more is easy to improve the lateral pressure characteristics, and the Young's modulus of 3500 MPa or less can provide proper toughness to the secondary resin layer, and thus can be hard to occur a crack or the like in the secondary resin layer.
- the primary resin layer 14 can be formed, for example, by curing a resin composition comprising a urethane (meth)acrylate, a monomer, a photopolymerization initiator, and a silane coupling agent.
- a resin composition for the primary resin layer Prior art techniques can be used for a resin composition for the primary resin layer.
- a urethane (meth)acrylate, a monomer, a photopolymerization initiator, and a silane coupling agent may be appropriately selected from compounds exemplified in the above base resin.
- the resin composition constituting the primary resin layer has composition different from the base resin forming the secondary resin layer.
- a plurality of optical fibers may be arranged in parallel and integrated with a resin for ribbon to form an optical fiber ribbon.
- the resin composition according to the present disclosure can also be used as a resin for ribbon. This can improve scratch resistance and lateral pressure characteristics of the optical fiber ribbon.
- urethane acrylate a urethane acrylate (UA-1) obtained by reacting polypropylene glycol having Mn of 600, 2,4-tolylene diisocyanate, and 2-hydroxyethyl acrylate, and a urethane acrylate (UA-2) obtained by reacting polypropylene glycol having Mn of 12000, 2,4-tolylene diisocyanate, and 2-hydroxyethyl acrylate were prepared.
- epoxy acrylate a (meth)acrylic acid adduct of bisphenol A diglycidyl ether (trade name "Viscoat 540", manufactured by Osaka Organic Chemical Industry Ltd.) was prepared.
- isobomyl acrylate (trade name "IBXA”, manufactured by Osaka Organic Chemical Industry Ltd.), 2-phenoxyethyl acrylate (trade name “Light Acrylate PO-A”, manufactured by Kyoeisha Chemical Co., Ltd.), and tripropylene glycol diacrylate (trade name "TPGDA”, manufactured by Daicel-Allnex Ltd.) were prepared.
- silica sol including silica particles surface-treated with 3-methacryloxypropyltrimethoxysilane shown in Table 1 was prepared.
- the proportion of each structural unit possessed by the surface-modified silica particles was calculated by measuring the solid 29 Si-NMR spectrum according to the procedure shown below.
- each silica sol Four mL of each silica sol was sampled, subjected to evaporation of a dispersion medium in the atmosphere, and then dried in a constant temperature bath at 80°C for 24 hours to isolate the surface-modified silica particles.
- Surface-treated silica particles of 200 mg were added to an acetone solution including 13.7 mg of chromium (III) acetylacetonate (Cr(acac) 3 ) as a relaxation reagent, and then ultrasonic treatment was performed for 30 minutes to obtain a mixed solution.
- Cr(acac) 3 was added in an amount of 1% by mass relative to Si in terms of Cr.
- the mixed solution was dried in a constant temperature bath at 90°C for 24 hours to prepare a sample for NMR measurement.
- the solid 29 Si-NMR spectrum of the sample was measured by the DD-MAS method under the following conditions, and the proportions of the T1 unit, T2 unit, and T3 unit to the T unit possessed by the surface-modified silica particles were calculated.
- a photopolymerizable compound and a photopolymerization initiator were mixed in the amount (parts by mass) shown in Table 2 with 1 part by mass of Omnirad TPO to prepare a base resin.
- the base resin and a silica sol were mixed, and then most of the dispersion medium was removed to prepare a resin composition for each test example so that the content of the surface-modified silica particles in the resin composition was 30% by mass.
- Test Examples 1 to 6 correspond to Examples, and Test Example 7 corresponds to Comparative Example.
- a resin composition was applied to a polyethylene terephthalate (PET) film using a spin coater, and cured using an electrodeless UV lamp system (D bulb) (manufactured by Heraeus K. K.) under the conditions of 1000 ⁇ 100 mJ/cm 2 to form a resin layer having a thickness of 200 ⁇ 20 ⁇ m on the PET film.
- the resin layer was peeled off from the PET film to obtain a resin film.
- the resin film was punched into a dumbbell shape of JIS K 7127 type 5, and pulled under the conditions of 23 ⁇ 2°C and 50 ⁇ 10 %RH using a tensile tester at a tensile speed of 1 mm/min and a gauge line distance of 25 mm to obtain a stress-strain curve.
- the Young's modulus of the resin film was obtained from the tangent line.
- a urethane acrylate (UA-3) obtained by reacting polypropylene glycol having a molecular weight of 4000, isophorone diisocyanate, hydroxyethyl acrylate, and methanol was prepared. 75 parts by mass of UA-3, 12 parts by mass of nonylphenol EO-modified acrylate, 6 parts by mass of N-vinylcaprolactam, 2 parts by mass of 1,6-hexanediol diacrylate, 1 part by mass of 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and 1 part by mass of 3-mercaptopropyltrimethoxysilane were mixed to prepare a resin composition for the primary resin layer.
- the resin composition for the primary resin layer and the resin composition of test examples for the secondary resin layer were applied to the outer periphery of a 125 ⁇ m diameter glass fiber composed of a core and a cladding, and then the resin composition was cured by irradiating with ultraviolet rays and a primary resin layer with a thickness of 35 ⁇ m and a secondary resin layer with a thickness of 25 ⁇ m around the outer periphery thereof were formed to produce an optical fiber.
- a linear speed was 1500 m/min.
- the transmission loss of light with a wavelength of 1550 nm was measured by the OTDR (Optical Time Domain Reflectometer) method when the optical fiber was wound in a single layer on a bobbin having a diameter of 280 mm with its surface covered with sandpaper.
- the transmission loss of light with a wavelength of 1550 nm was measured by the OTDR method when the optical fiber was wound in a single layer on a bobbin of 280 mm diameter without sandpaper.
- a difference in the measured transmission loss was obtained, and a case where the transmission loss difference was 0.6 dB/km or less was evaluated as "A", and a case where the transmission loss difference was more than 0.6 dB/km was evaluated as "B".
- the rate at which the transmission loss increased when the optical fiber was rewound from the large bobbin to the small bobbin was defined as the rewinding rate.
- the case where the rewinding rate was 0% was evaluated as "A”
- the case where the rewinding rate was more than 0% and less than 30% was evaluated as "B”
- the case where the rewinding rate was 30% or more was evaluated as "C”.
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Abstract
A resin composition contains a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles, wherein the surface-modified silica particles have, as a silicone structural unit, a T unit in which three oxygen atoms are bonded to a silicon atom, and the proportion of a T1 unit contained in the T unit is 29mol % or less.
Description
- The present disclosure relates to a resin composition, a secondary coating material for an optical fiber, an optical fiber, and a method for manufacturing an optical fiber.
- This application claims priority based on
Japanese Patent Application No. 2020-208202 filed on December 16, 2020 - An optical fiber has generally a coating resin layer for protecting a glass fiber that is an optical transmission medium. The coating resin layer comprises, for example, a primary resin layer and a secondary resin layer.
- In order to identify an optical fiber, a colored layer may be formed on the outermost layer of the optical fiber. It is known that the colored layer is formed on the outer periphery of the secondary resin layer by temporarily winding the optical fiber coated with the primary resin layer and the secondary resin layer and then feeding out the optical fiber again (for example, refer to Patent Literature 1).
- [Patent Literature 1]
WO 2016/080195 A1 - A resin composition according to an aspect of the present disclosure comprises a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles, wherein the surface-modified silica particles have, as a silicone structural unit, a T unit in which three oxygen atoms are bonded to a silicon atom, and the proportion of a T1 unit contained in the T unit is 29 mol% or less.
- [
FIG. 1] FIG. 1 is a schematic cross-section diagram showing an example of the optical fiber according to the present embodiment. - In the shipment of an optical fiber, a rewinding work may be performed from a large bobbin to a small bobbin. When the scratch resistance of the surface of the secondary resin layer is low, scratches may be generated on the surface of the secondary resin layer in winding, and the resin layer may be broken to significantly deteriorate the optical characteristics. Therefore, the secondary resin layer is required to have excellent scratch resistance (abrasion resistance).
- An object of the present disclosure is to provide: a resin composition capable of forming a resin layer having excellent scratch resistance; and an optical fiber comprising a secondary resin layer formed from the resin composition and capable of preventing scratches in a rewinding work.
- The present disclosure can provide: a resin composition capable of forming a resin layer having excellent scratch resistance; and an optical fiber comprising a secondary resin layer formed from the resin composition and capable of preventing scratches in a rewinding work.
- First, the contents of the embodiment of the present disclosure will be described by listing them. A resin composition according to an aspect of the present disclosure comprises a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles, wherein the surface-modified silica particles have, as a silicone structural unit, a T unit in which three oxygen atoms are bonded to a silicon atom, and the proportion of T1 units contained in the T unit is 29 mol% or less.
- Curing a resin composition containing surface-modified silica particles having a specific silicone structural unit can form a resin layer having excellent scratch resistance.
- The surface-modified silica particles may have at least one ultraviolet curable group selected from the group consisting of an acryloyl group, a methacryloyl group, and a vinyl group. This makes it easier to form a resin layer with a high Young's modulus.
- From the viewpoint of forming a resin layer having a high Young's modulus, the content of the surface-modified silica particles may be 1% by mass or more and 60% by mass or less based on the total amount of the resin composition.
- From the viewpoint of forming a resin layer having superior scratch resistance, the average primary particle size of the surface-modified silica particles may be 100 nm or less.
- The secondary coating material for the optical fiber according to an aspect of the present disclosure comprises the above resin composition. A coating resin layer having excellent scratch resistance can be formed by using the resin composition according to the present embodiment in the secondary resin layer.
- The optical fiber according to an aspect of the present disclosure comprises: a glass fiber comprising a core and a cladding; a primary resin layer being in contact with the glass fiber and coating the glass fiber; and a secondary resin layer coating the primary resin layer, wherein the secondary resin layer comprises a cured product of the above resin composition. This can prevent the surface of the secondary resin layer from being damaged and the resin layer from being broken when the rewinding work is performed from the large bobbin to the small bobbin.
- A method for manufacturing the optical fiber according to an aspect of the present disclosure comprises: an application step of applying the above resin composition to the outer periphery of a glass fiber composed of a core and a cladding; and a curing step of curing the resin composition by irradiating with ultraviolet rays after the application step. This can produce an optical fiber capable of preventing scratches in the rewinding work.
- Specific examples of a resin composition and an optical fiber according to the embodiments of the present disclosure will be described referring to the drawing as necessary. The present disclosure is not limited to these illustrations but is indicated by the claims and intended to include meanings equivalent to the claims and all modifications within the claims. In the following description, the same reference numerals are given to the same elements in the description of the drawing, and redundant explanations are omitted. (Meth)acrylate as used herein means an acrylate or its corresponding methacrylate. The same applies to other similar expressions such as (meth)acryloyl.
- The resin composition according to the present embodiment is an ultraviolet curable resin composition comprising a base resin containing a photopolymerizable compound and a photopolymerization initiator, and surface-modified silica particles.
- The constituent units of silicone possessed by silicone compounds are generally classified into a M unit (unit in which one oxygen atom is bonded to a silicon atom), a D unit (unit in which two oxygen atoms are bonded to a silicon atom), a T unit (unit in which three oxygen atoms are bonded to a silicon atom), and a Q unit (unit in which four oxygen atoms are bonded to a silicon atom). The structures of the M unit, the D unit, the T unit, and the Q unit can be represented by the following formula. In the formula, R represents a monovalent organic group.
- The T unit is a structure derived from a silane compound represented by R-Si-(OR')3. R represents a monovalent organic group. Examples of the monovalent organic group include an alkyl group, a phenyl group, a (meth)acryloxyalkyl group, an alkenyl group, a styryl group, and a vinyl group. R' represents an alkyl group such as a methyl group or an ethyl group.
- Depending on the degree of condensation of the silane compound, a T unit comprises: a T1 unit in which one oxygen atom is bonded to another silicon atom; a T2 unit in which two oxygen atoms are bonded to another silicon atom; and a T3 unit in which three oxygen atoms are bonded to another silicon atom. The structures of the T1 unit, T2 unit, and T3 unit can be represented by the following formula.
- The proportion of each structural unit can be calculated by measuring the solid 29Si-NMR spectrum of the silicone compound (for example, refer to "Structural Analysis of Silicon Containing Materials by 29Si NMR", Research Report of Asahi Glass Co., Ltd. 66 (2016), pp. 32-36).
- Silica particles that are not surface-modified are mainly composed of the Q unit. The surface-modified silica particles according to the present embodiment have the Q unit based on the siloxane structure of the silica particles before surface modification and the T unit based on the siloxane structure introduced by surface modification. In the solid 29Si-NMR spectrum, the chemical shift of the Q unit is observed in the range of -90 ppm to -120 ppm, and the chemical shift of the T unit is observed in the range of -35 ppm to -75 ppm, respectively. In the T unit, the T1 unit has a peak top around 50 ppm, the T2 unit has a peak top around 60 ppm, and the T3 unit has a peak top around 70 ppm. Therefore, integrating the signal of the T unit possessed by the surface-modified silica particles can calculate the proportion of each unit of T1, T2, and T3 from the signal area.
- The T unit is introduced into the surface-modified silica particles according to the present embodiment by treating the surface of the silica particles with a silane compound. The proportion of the T1 unit contained in the T unit possessed by the surface-modified silica particles is 29 mol % or less, preferably 28 mol % or less, and more preferably 26 mol % or less, from the viewpoint of forming a resin layer having excellent scratch resistance. The lower limit of the proportion of the T1 unit may be 1 mol % or more, 5 mol % or more, or 8 mol % or more.
- The proportions of the T2 unit and T3 unit contained in the T unit are not particularly limited. The proportion of the T2 unit may be, for example, 10 mol % or more, 15 mol % or more, or 20 mol % or more, and may be 70 mol % or less, 68 mol % or less, or 66 mol % or less. The proportion of the T3 unit may be, for example, 1 mol % or more, 4 mol % or more, or 6 mol % or more, and may be 70 mol % or less, 64 mol % or less, or 62 mol % or less.
- The silane compound may be a silane compound having an ultraviolet-curable group. When the silane compound having an ultraviolet-curable group is used, examples of R in the T unit and T1 unit include a (meth)acryloxyalkyl group, an alkenyl group, a styryl group, and a vinyl group, and examples of R' include a methyl group and an ethyl group. The surface-modified silica particles having an acryloyl group, a methacryloyl group, or a vinyl group allow formation of a resin layer having superior scratch resistance.
- Examples of the silane compound having an ultraviolet-curable group include 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltriethoxysilane, 8-methacryloxyoctyltrimethoxysilane, 8-acryloxyoctyltrimethoxysilane, 7-octenyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane.
- The surface-modified silica particles according to the present embodiment are dispersed in a dispersion medium. Using the surface-modified silica particles dispersed in the dispersion medium can uniformly disperse the surface-modified silica particles in the resin composition, and can improve the storage stability of the resin composition. The dispersion medium is not particularly limited as long as curing of the resin composition is not obstructed. The dispersion medium may be reactive or non-reactive.
- A monomer such as a (meth)acryloyl compound and an epoxy compound can be used as the reactive dispersion medium. Examples of the (meth)acryloyl compound include 1,6-hexanediol di(meth)acrylate, EO-modified bisphenol A di(meth)acrylate, polyethylene glycol di(meth)acrylate, PO-modified bisphenol A di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, 2-hydroxy-3-phenoxypropyl(meth)acrylate, (meth)acrylic acid adduct of propylene glycol diglycidyl ether, (meta)acrylic acid adduct of tripropylene glycol diglycidyl ether, and (meth)acrylic acid adduct of glycerin diglycidyl ether. As the (meth)acryloyl compound, the compounds exemplified in the monomers described later may be used.
- As a non-reactive dispersion medium, a ketone solvent such as methyl ethyl ketone (MEK), an alcohol solvent such as methanol (MeOH) and propylene glycol monomethyl ether (PGME), or an ester solvent such as propylene glycol monomethyl ether acetate (PGMEA) may be used. In the case of a non-reactive dispersion medium, the resin composition may be prepared by mixing the base resin and the surface-modified silica particles dispersed in the dispersion medium, and then removing a part of the dispersion medium.
- From the viewpoint of reducing the proportion of the T1 unit, the surface-modified silica particles are preferably dispersed in the alcohol solvent, more preferably in MeOH.
- From the viewpoint of further improving the scratch resistance of the resin layer, the average primary particle size of the surface-modified silica particles is preferably 100 nm or less, and may be 90 nm or less or 80 nm or less. From the viewpoint of increasing the strength of the secondary resin layer, the average primary particle size of the surface-modified silica particles may be 1 nm or more, 2 nm or more, or 5 nm or more. The average primary particle size can be measured, for example, by image analysis of electron micrographs, the light scattering method, and the BET method. The average primary particle size can be measured according to the method described in any of JIS Z 8827-1, JIS Z 8827-2, JIS Z 8828, or JIS Z 8830. A dispersion medium in which primary particles of silica particles are dispersed appears transparent to the naked eye when the primary particles have a small particle size. When the particle size of the primary particles is relatively large (40 nm or more), the dispersion medium in which the primary particles are dispersed appears cloudy, but no sediment is observed.
- The content of the surface-modified silica particles is preferably 1% by mass or more and 60% by mass or less, 3% by mass or more and 50% by mass or less, 5% by mass or more and 40% by mass or less, or 10% by mass or more and 35% by mass or less, based on the total amount of resin composition (total amount of the base resin and surface-modified silica particles). The content of the surface-modified silica particles of 1% by mass or more easily forms a resin layer with a high Young's modulus. The content of the surface-modified silica particles of 60% by mass or less can easily improve the application properties of the resin composition, and can form a resin layer having excellent toughness.
- The base resin according to the present embodiment contains a photopolymerizable compound and a photopolymerization initiator. The photopolymerizable compound according to the present embodiment can comprise urethane (meth)acrylate from the viewpoint of adjusting Young's modulus. The photopolymerizable compound according to the present embodiment does not comprise surface-modified silica particles having an ultraviolet-curable group.
- As the urethane (meth)acrylate, a urethane oligomer obtained by reacting a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth)acrylate compound can be used. The urethane (meth)acrylate may be used in combination of two or more.
- Examples of the polyol compound include polytetramethylene glycol, polypropylene glycol, and bisphenol A-ethylene oxide addition diol. Examples of the polyisocyanate compound includes 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and dicyclohexylmethane 4,4'-diisocyanate. Examples of the hydroxyl group-containing (meth)acrylate compound include 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 1,6-hexanediol mono(meth)acrylate, pentaerythritol tri(meth)acrylate, 2-hydroxypropyl (meth)acrylate, and tripropylene glycol mono(meth)acrylate.
- From the viewpoint of adjusting the Young's modulus of the resin layer, the number average molecular weight (Mn) of the polyol compound may be 300 or more and 3000 or less, 400 or more and 3000 or less, or 500 or more and 2500 or less.
- As a catalyst for synthesizing urethane (meth)acrylate, an organotin compound is generally used. Examples of the organotin compound include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin maleate, dibutyltin bis(2-ethylhexyl mercaptoacetate), dibutyltin bis(isooctyl mercaptoacetate), and dibutyltin oxide. From the viewpoint of easy availability or catalyst performance, it is preferable that dibutyltin dilaurate or dibutyltin diacetate be used as catalyst.
- A lower alcohol having 5 or less carbon atoms may be used when synthesizing the urethane (meth)acrylate. Examples of the lower alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, 3-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-2-butanol, and 2,2-dimethyl-1-propanol.
- The photopolymerizable compound according to the present embodiment may comprise epoxy (meth)acrylate from the viewpoint of adjusting Young's modulus. Examples of the epoxy (meth)acrylate include an aliphatic epoxy (meth)acrylate and an aromatic epoxy (meth)acrylate. The aliphatic epoxy (meth)acrylate means an epoxy (meth)acrylate having no aromatic ring, and the aromatic epoxy (meth)acrylate means an epoxy (meth)acrylate having the aromatic ring.
- As the aliphatic epoxy (meth)acrylate, a reaction product of an aliphatic epoxy compound having two or more glycidyl groups and a compound having a (meth)acryloyl group such as (meth)acrylic acid can be used.
- From the viewpoint of increasing the toughness of the resin layer, the aliphatic epoxy (meth)acrylate preferably has an ethylene oxide group or a propylene oxide group. Examples of the aliphatic epoxy (meth)acrylates include a (meth)acrylic acid adduct of propylene glycol diglycidyl ether, a (meth)acrylic acid adduct of polypropylene glycol diglycidyl ether, a (meth)acrylic acid adduct of ethylene glycol diglycidyl ether, and a (meth)acrylic acid adduct of polyethylene glycol diglycidyl ether.
- Examples of commercially available aliphatic epoxy (meth)acrylates include trade names "Epoxyester 40EM", "Epoxyester 70PA", "Epoxyester 200PA", and "Epoxyester 80MFA", manufactured by Kyoeisha Chemical Co., Ltd.
- As the aromatic epoxy (meth)acrylate, a reaction product of an aromatic epoxy compound having two or more glycidyl groups and a compound having a (meth)acryloyl group such as (meth)acrylic acid can be used. Examples of the aromatic epoxy (meth)acrylate include a (meth)acrylic acid adduct of bisphenol A diglycidyl ether.
- From the viewpoint of increasing the strength of the resin layer, the content of the epoxy (meth)acrylate may be 10% by mass or more and 70% by mass or less, 20% by mass or more and 60% by mass or less, or 30% by mass or more and 50% by mass or less, based on the total amount of the photopolymerizable compound.
- The photopolymerizable compound according to the present embodiment can comprise a photopolymerizable compound (hereinafter referred to as "monomer") other than the urethane (meth)acrylate and the epoxy (meth)acrylate.
- The monofunctional monomer having one polymerizable group and the multifunctional monomer having two or more polymerizable groups can be used as the monomer. A monomer may be used by mixing two or more monomers.
- Examples of the monofunctional monomer include (meth)acrylate monomers such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, isoamyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, 3-phenoxybenzyl acrylate, phenoxydiethylene glycol acrylate, phenoxypolyethylene glycol acrylate, 4-tert-butylcyclohexanol acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, nonylphenol polyethylene glycol (meth)acrylate, nonylphenoxypolyethylene glycol (meth)acrylate, and isobomyl (meth)acrylate; carboxyl group containing monomers such as (meth)acrylic acid, (meth)acrylic acid dimer, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, and ω-carboxy-polycaprolactone (meth)acrylate; heterocycle containing monomers such as N-(meta)acryloyl morpholine, N-vinyl pyrrolidone, N-vinyl caprolactam, N-(meta)acryloylpiperidine, N-(meta)acryloylpyrrolidine, 3-(3-pyridine) propyl (meth)acrylate, and cyclic trimethylolpropane formal acrylate; maleimide monomers such as maleimide, N-cyclohexyl maleimide, and N-phenyl maleimide; amide monomers such as (meth)acrylamide, N, N-dimethyl (meth)acrylamide, N, N-diethyl (meth)acrylamide, N-hexyl (meth)acrylamide, N-methyl (meth)acrylamide, N-ethyl (meth)acrylamide, N-butyl (meth)acrylamide, N-methylol (meth)acrylamide, and N-methylolpropane (meth)acrylamide; aminoalkyl (meth)acrylate monomers such as aminoethyl (meth)acrylate, aminopropyl (meth)acrylate, N, N-dimethylaminoethyl (meth)acrylate, and tert-butylaminoethyl (meth)acrylate; and succinimide monomers such as N-(meth)acryloyloxymethylene succinimide, N-(meth)acryloyl-6-oxyhexamethylene succinimide, and N- (meth)acryloyl-8-oxyoctamethylene succinimide.
- Examples of the multifunctional monomer include ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, di(meth)acrylate of alkylene oxide adduct of bisphenol A, tetraethylene glycol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, 1,14-tetradecanediol di(meth)acrylate, 1,16-hexadecanediol di(meth)acrylate, 1,20-eicosanediol di(meth)acrylate, isopentyldiol di(meth)acrylate, 3-ethyl-1,8-octanediol di(meth)acrylate, EO adduct of bisphenol A di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethyloloctane tri(meth)acrylate, trimethylolpropane polyethoxy tri(meth)acrylate, trimethylolpropane polypropoxy tri(meth)acrylate, trimethylolpropane polyethoxy polypropoxy tri(meth)acrylate, tris[(meth)acryloyloxyethyl] isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol polyethoxy tetra(meth)acrylate, pentaerythritol polypropoxy tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate and caprolactone-modified tris[(meth)acryloyloxyethyl] isocyanurate.
- The photopolymerization initiator can be appropriately selected from known radical photopolymerization initiators and used. Examples of the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone (Omnirad 184, manufactured by IGM Resins), 2,2-dimethoxy-2-phenylacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one (Omnirad 907 manufactured by IGM Resins), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO manufactured by IGM Resins), and bis(2,4,6-trimethylbenzoyl) phenylphosphine oxide (Omnirad 819, manufactured by IGM Resins).
- The content of the photopolymerization initiator may be 0.2% by mass or more and 6.0% by mass or less, 0.4% by mass or more and 3.0% by mass or less, or 0.6% by mass or more and 2.0% by mass or less, based on the total amount of the photopolymerizable compounds.
- The resin composition may further contain a silane coupling agent, a leveling agent, an antifoaming agent, an antioxidant, a sensitizer, or the like.
- The silane coupling agent is not particularly limited as long as it does not disturb curing of the resin composition. Examples of the silane coupling agent include tetramethyl silicate, tetraethyl silicate, mercaptopropyl trimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(P-methoxy-ethoxy)silane, β-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, dimethoxydimethylsilane, diethoxydimethylsilane, 3-acryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-methacryloxypropyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethyldimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, bis-[3-(triethoxysilyl)propyl]tetrasulfide, bis-[3-(triethoxysilyl)propyl] disulfide, γ-trimethoxysilylpropyldimethylthiocarbamyl tetrasulfide, and γ-trimethoxysilylpropyl benzothiazyl tetrasulfide.
- The resin composition according to the present embodiment is preferably used as the secondary coating material for the optical fiber. Using the resin composition according to the present embodiment for the secondary resin layer can form the coating resin layer having excellent scratch resistance.
-
FIG. 1 is a schematic cross-section diagram showing an example of the optical fiber according to the present embodiment. Theoptical fiber 10 comprises theglass fiber 13 including thecore 11 and thecladding 12, and thecoating resin layer 16 including theprimary resin layer 14 provided on the outer periphery of theglass fiber 13 and thesecondary resin layer 15. - The
cladding 12 surrounds thecore 11. Thecore 11 and thecladding 12 mainly include glass such as silica glass, germanium-added silica glass can be used, for example, in thecore 11, and pure silica glass or fluorine-added silica glass can be used in thecladding 12. - In
FIG. 1 , for example, the outside diameter (D2) of theglass fiber 13 is about 100 µm to 125 µm, and the diameter (D1) of the core 11 constituting theglass fiber 13 is about 7 µm to 15 µm. The thickness of thecoating resin layer 16 is typically about 22 µm to 70 µm. The thickness of each of theprimary resin layer 14 and thesecondary resin layer 15 may be about 5 µm to 50 µm. - When the outside diameter (D2) of the
glass fiber 13 is about 125 µm and the thickness of thecoating resin layer 16 is 60 µm or more and 70 µm or less, the thickness of each of theprimary resin layer 14 and thesecondary resin layer 15 may be about 10 µm to 50 µm, and for example, the thickness of theprimary resin layer 14 may be 35 µm and the thickness of thesecondary resin layer 15 may be 25 µm. The outside diameter of theoptical fiber 10 may be about 245 µm to 265 µm. - When the outside diameter (D2) of the
glass fiber 13 is about 125 µm and the thickness of thecoating resin layer 16 is 27 µm or more and 48 µm or less, the thickness of each of theprimary resin layer 14 and thesecondary resin layer 15 may be about 10 µm to 38 µm, and for example, the thickness of theprimary resin layer 14 may be 25 µm and the thickness of thesecondary resin layer 15 may be 10 µm. The outside diameter of theoptical fiber 10 may be about 179 µm to 221 µm. - When the outside diameter (D2) of the
glass fiber 13 is about 100 µm and the thickness of thecoating resin layer 16 is 22 µm or more and 37 µm or less, the thickness of each of theprimary resin layer 14 and thesecondary resin layer 15 may be about 5 µm to 32 µm, and for example, the thickness of theprimary resin layer 14 may be 25 µm and the thickness of thesecondary resin layer 15 may be 10 µm. The outside diameter of theoptical fiber 10 may be about 144 µm to 174 µm. - The resin composition according to the present embodiment can be applied to the secondary resin layer. The secondary resin layer can be formed by curing a resin composition comprising the surface-modified silica particles and the base resin. The
secondary resin layer 15 comprises a cured product of the resin composition according to the present embodiment. This can prevent the surface of the secondary resin layer from being damaged and the resin layer from being broken when the rewinding work is performed from the large bobbin to the small bobbin. In addition, the anti-blocking effect prevents the fibers from sticking to each other, and the optical fiber can be wound around the small bobbin without winding abnormality such as winding skip. - A method for manufacturing the optical fiber according to the present embodiment comprises: an application step of applying the above resin composition to the outer periphery of a glass fiber composed of a core and a cladding; and a curing step of curing the resin composition by irradiating with ultraviolet rays after the application step. Coating a glass fiber with the resin composition according to the present embodiment can manufacture an optical fiber that can prevent scratch during rewinding work. The resin composition according to the present embodiment is not directly applied to the glass fiber, but the resin composition for primary coating is directly applied to the glass fiber. That is, in the application step, the primary coating that is in contact with the glass fiber and the secondary coating that is not in contact with the glass fiber by the resin composition according to the present embodiment are formed.
- The Young's modulus of the secondary resin layer at 23°C is preferably 1300 MPa or more and 3600 MPa or less, more preferably 1400 MPa or more and 3000 MPa or less, and further preferably 1600 MPa or more and 2800 MPa or less. The Young's modulus of the secondary resin layer of 1300 MPa or more is easy to improve the lateral pressure characteristics, and the Young's modulus of 3500 MPa or less can provide proper toughness to the secondary resin layer, and thus can be hard to occur a crack or the like in the secondary resin layer.
- The
primary resin layer 14 can be formed, for example, by curing a resin composition comprising a urethane (meth)acrylate, a monomer, a photopolymerization initiator, and a silane coupling agent. Prior art techniques can be used for a resin composition for the primary resin layer. A urethane (meth)acrylate, a monomer, a photopolymerization initiator, and a silane coupling agent may be appropriately selected from compounds exemplified in the above base resin. The resin composition constituting the primary resin layer has composition different from the base resin forming the secondary resin layer. - A plurality of optical fibers may be arranged in parallel and integrated with a resin for ribbon to form an optical fiber ribbon. The resin composition according to the present disclosure can also be used as a resin for ribbon. This can improve scratch resistance and lateral pressure characteristics of the optical fiber ribbon.
- Hereinafter, the results of evaluation tests using test examples according to the present disclosure will be shown, and the present disclosure is described in more detail. The present invention is not limited to these test examples.
- As the urethane acrylate, a urethane acrylate (UA-1) obtained by reacting polypropylene glycol having Mn of 600, 2,4-tolylene diisocyanate, and 2-hydroxyethyl acrylate, and a urethane acrylate (UA-2) obtained by reacting polypropylene glycol having Mn of 12000, 2,4-tolylene diisocyanate, and 2-hydroxyethyl acrylate were prepared.
- As an epoxy acrylate (EA), a (meth)acrylic acid adduct of bisphenol A diglycidyl ether (trade name "Viscoat 540", manufactured by Osaka Organic Chemical Industry Ltd.) was prepared.
- As a monomer, isobomyl acrylate (trade name "IBXA", manufactured by Osaka Organic Chemical Industry Ltd.), 2-phenoxyethyl acrylate (trade name "Light Acrylate PO-A", manufactured by Kyoeisha Chemical Co., Ltd.), and tripropylene glycol diacrylate (trade name "TPGDA", manufactured by Daicel-Allnex Ltd.) were prepared.
- As a photopolymerization initiator, 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO) was prepared.
- As surface-modified silica particles, a silica sol including silica particles surface-treated with 3-methacryloxypropyltrimethoxysilane shown in Table 1 was prepared. The proportion of each structural unit possessed by the surface-modified silica particles was calculated by measuring the solid 29Si-NMR spectrum according to the procedure shown below.
- Four mL of each silica sol was sampled, subjected to evaporation of a dispersion medium in the atmosphere, and then dried in a constant temperature bath at 80°C for 24 hours to isolate the surface-modified silica particles. Surface-treated silica particles of 200 mg were added to an acetone solution including 13.7 mg of chromium (III) acetylacetonate (Cr(acac)3) as a relaxation reagent, and then ultrasonic treatment was performed for 30 minutes to obtain a mixed solution. Cr(acac)3 was added in an amount of 1% by mass relative to Si in terms of Cr. The mixed solution was dried in a constant temperature bath at 90°C for 24 hours to prepare a sample for NMR measurement.
- The solid 29Si-NMR spectrum of the sample was measured by the DD-MAS method under the following conditions, and the proportions of the T1 unit, T2 unit, and T3 unit to the T unit possessed by the surface-modified silica particles were calculated.
- Measuring device: Ascend500 + AVANCE III HD (Bruker Japan Ltd.) Probe: 4mmφ MAS VTN probe
- MAS rotation speed: 8 kHz
- Cumulative count: 2048
- A photopolymerizable compound and a photopolymerization initiator were mixed in the amount (parts by mass) shown in Table 2 with 1 part by mass of Omnirad TPO to prepare a base resin. The base resin and a silica sol were mixed, and then most of the dispersion medium was removed to prepare a resin composition for each test example so that the content of the surface-modified silica particles in the resin composition was 30% by mass. Test Examples 1 to 6 correspond to Examples, and Test Example 7 corresponds to Comparative Example.
- The following evaluations were performed using the resin compositions obtained in the test examples. The results are shown in Table 2.
- A resin composition was applied to a polyethylene terephthalate (PET) film using a spin coater, and cured using an electrodeless UV lamp system (D bulb) (manufactured by Heraeus K. K.) under the conditions of 1000 ± 100 mJ/cm2 to form a resin layer having a thickness of 200 ± 20 µm on the PET film. The resin layer was peeled off from the PET film to obtain a resin film.
- The resin film was punched into a dumbbell shape of JIS K 7127 type 5, and pulled under the conditions of 23 ± 2°C and 50 ± 10 %RH using a tensile tester at a tensile speed of 1 mm/min and a gauge line distance of 25 mm to obtain a stress-strain curve. The Young's modulus of the resin film was obtained from the tangent line.
- A urethane acrylate (UA-3) obtained by reacting polypropylene glycol having a molecular weight of 4000, isophorone diisocyanate, hydroxyethyl acrylate, and methanol was prepared. 75 parts by mass of UA-3, 12 parts by mass of nonylphenol EO-modified acrylate, 6 parts by mass of N-vinylcaprolactam, 2 parts by mass of 1,6-hexanediol diacrylate, 1 part by mass of 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and 1 part by mass of 3-mercaptopropyltrimethoxysilane were mixed to prepare a resin composition for the primary resin layer.
- The resin composition for the primary resin layer and the resin composition of test examples for the secondary resin layer were applied to the outer periphery of a 125 µm diameter glass fiber composed of a core and a cladding, and then the resin composition was cured by irradiating with ultraviolet rays and a primary resin layer with a thickness of 35 µm and a secondary resin layer with a thickness of 25 µm around the outer periphery thereof were formed to produce an optical fiber. A linear speed was 1500 m/min.
- The transmission loss of light with a wavelength of 1550 nm was measured by the OTDR (Optical Time Domain Reflectometer) method when the optical fiber was wound in a single layer on a bobbin having a diameter of 280 mm with its surface covered with sandpaper. In addition, the transmission loss of light with a wavelength of 1550 nm was measured by the OTDR method when the optical fiber was wound in a single layer on a bobbin of 280 mm diameter without sandpaper. A difference in the measured transmission loss was obtained, and a case where the transmission loss difference was 0.6 dB/km or less was evaluated as "A", and a case where the transmission loss difference was more than 0.6 dB/km was evaluated as "B".
- The rate at which the transmission loss increased when the optical fiber was rewound from the large bobbin to the small bobbin was defined as the rewinding rate. The case where the rewinding rate was 0% was evaluated as "A", the case where the rewinding rate was more than 0% and less than 30% was evaluated as "B", and the case where the rewinding rate was 30% or more was evaluated as "C".
[Table 2] Test Example 1 2 3 4 5 6 7 Silica sol Si-1 Si-2 Si-3 Si-4 Si-5 Si-6 Si-7 UA-1 20 20 20 20 20 20 20 UA-2 1 1 1 - 1 1 1 EA 40 40 40 40 40 40 40 IBXA 15 15 15 15 15 15 15 POA 20 20 20 20 20 20 20 TPGDA 4 4 4 5 4 4 4 Young's modulus (MPa) 2600 2500 2500 2400 2300 2200 2200 Lateral pressure characteristics A A A A A A A Rewinding rate A A A A A A B -
- 10:
- Optical fiber
- 11:
- Core,
- 12:
- Cladding
- 13:
- Glass fiber
- 14:
- Primary resin layer
- 15:
- Secondary resin layer
- 16:
- Coating resin layer.
Silica sol | Si-1 | Si-2 | Si-3 | Si-4 | Si-5 | Si-6 | Si-7 |
Dispersion medium | MeOH | MeOH | MeOH | MeOH | MeOH | MeOH | MEK |
Average primary particle size (nm) | 5-10 | 10-15 | 10-15 | 15-20 | 20-25 | 40-70 | 10-15 |
T1(%) | 25 | 20 | 10 | 10 | 10 | 10 | 30 |
T2(%) | 65 | 60 | 50 | 50 | 40 | 30 | 45 |
T3(%) | 10 | 20 | 40 | 40 | 50 | 60 | 25 |
Claims (9)
- A resin composition comprising:a base resin containing a photopolymerizable compound and a photopolymerization initiator; andsurface-modified silica particles,wherein the surface-modified silica particles have, as a silicone structural unit, a T unit in which three oxygen atoms are bonded to a silicon atom, and a proportion of a T1 unit contained in the T unit is 29 mol% or less.
- The resin composition according to claim 1, wherein the surface-modified silica particles have at least one ultraviolet-curable group selected from the group consisting of an acryloyl group, a methacryloyl group, and a vinyl group.
- The resin composition according to claim 1 or claim 2, wherein a content of the surface-modified silica particles is 1% by mass or more and 60% by mass or less, based on a total amount of the resin composition.
- The resin composition according to any one of claims 1 to 3, wherein an average primary particle size of the surface-modified silica particles is 100 nm or less.
- The resin composition according to claim 4, wherein the average primary particle size of the surface-modified silica particles is 1 nm or more.
- The resin composition according to any one of claims 1 to 5, wherein the proportion of the T1 unit contained in the T unit is 5 mol% or more.
- A secondary coating material for an optical fiber, comprising the resin composition according to any one of claims 1 to 6.
- An optical fiber comprising:a glass fiber comprising a core and a cladding;a primary resin layer being in contact with the glass fiber and coating the glass fiber; anda secondary resin layer coating the primary resin layer,wherein the secondary resin layer comprises a cured product of the resin composition according to any one of claims 1 to 6.
- A method for manufacturing an optical fiber, comprising:an application step of applying the resin composition according to any one of claims 1 to 6 to an outer periphery of a glass fiber composed of a core and a cladding; anda curing step of curing the resin composition by irradiating with ultraviolet rays after the application step.
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JP2020208202 | 2020-12-16 | ||
PCT/JP2021/041723 WO2022130855A1 (en) | 2020-12-16 | 2021-11-12 | Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber |
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US (1) | US20230416483A1 (en) |
EP (1) | EP4265660A1 (en) |
JP (1) | JPWO2022130855A1 (en) |
CN (1) | CN116529308A (en) |
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JP2004204206A (en) * | 2002-03-29 | 2004-07-22 | Mitsubishi Chemicals Corp | Photocurable composition and its manufacturing method, as well as cured product |
JP2006137795A (en) * | 2004-11-10 | 2006-06-01 | Mitsubishi Chemicals Corp | Radiation-curable composition and its cured product, and its laminate |
WO2010064535A1 (en) * | 2008-12-05 | 2010-06-10 | 昭和電工株式会社 | Shaping method |
WO2013115191A1 (en) * | 2012-01-31 | 2013-08-08 | 旭硝子株式会社 | Agent for preventing accumulation of fingerprints, method for producing same, composition for hard coats, base having hard coat layer, and touch panel |
JP2014089431A (en) * | 2012-10-04 | 2014-05-15 | Fujifilm Corp | Optical film, polarizing plate and image display device |
JP6412779B2 (en) | 2014-11-20 | 2018-10-24 | 株式会社フジクラ | Optical fiber ribbon, optical fiber cable, and optical fiber ribbon manufacturing method |
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- 2021-11-12 WO PCT/JP2021/041723 patent/WO2022130855A1/en active Application Filing
- 2021-11-12 US US18/039,334 patent/US20230416483A1/en active Pending
- 2021-11-12 EP EP21906219.7A patent/EP4265660A1/en active Pending
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CN116529308A (en) | 2023-08-01 |
JPWO2022130855A1 (en) | 2022-06-23 |
WO2022130855A1 (en) | 2022-06-23 |
US20230416483A1 (en) | 2023-12-28 |
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