EP4264662A1

EP4264662A1 - Method and device for changing test substrates in a continuous-flow vacuum system, treatment method, and continuous-flow vacuum system

Info

Publication number: EP4264662A1
Application number: EP21843588.1A
Authority: EP
Inventors: Jens HERGENRÖTHER; Andreas Rack; Florian Schwarz; Peter RETTENBACHER; Thomas Merz
Original assignee: Solayer GmbH
Current assignee: Solayer GmbH
Priority date: 2020-12-17
Filing date: 2021-12-16
Publication date: 2023-10-25
Also published as: DE112021006491A5; TW202240726A; US20240102155A1; WO2022128026A1; CN117203750A

Abstract

The invention relates to a method for changing test substrates in a continuous-flow vacuum system in the course of a multiple-treatment-step process cycle for treating a substrate. For at least two treatment steps, at least two test substrates (66) are transferred to the vacuum treatment system at the beginning of the process cycle and are transferred back out of it once the process cycle is concluded. After the first treatment step, the first test substrate (66) concurrently treated in this step is removed from the measurement position (70) it occupied during the treatment and is deposited in an empty position (71) without a test substrate (66). Subsequently, the second test substrate (66) which has not been treated yet is deposited in the resulting free measurement position (70) for the purpose of supplying the second test substrate to the subsequent treatment step of the substrates (61). The invention likewise relates to a treatment method which uses the method and to systems for treating a plurality of substrates (61) and for changing test substrates.

Description

Process and device for changing test substrates in a vacuum treatment system, treatment process and treatment device

The invention relates to a method for changing test substrates, also referred to below as test glasses, in a vacuum treatment system and a device for carrying out the method.

A wide variety of substrates, for example substrates for optical or photovoltaic applications; Semiconductor substrates or others are subjected to various treatments. Treatment should be understood here as the well-known modifying, additive and subtractive treatments, i. H . Processes in which the substrate or layers present on the substrate are structurally or energetically modified, material is deposited on the substrate or material is removed from the substrate. In most cases, very complex process sequences are required, which include several of the treatment processes mentioned. The entire treatment takes place in one pass and regularly without breaking the vacuum.

The vacuum continuous systems used for this include a sequence of treatment stations in their vacuum chamber, which are run through one after the other in order to achieve the desired treatment result of the substrate at the end of the run. Both the vacuum chamber and the treatment stations have the necessary and known equipment for the respective treatment, such as a vacuum system, treatment sources, Process gas devices, coolants, screens, measuring devices, control units and much more.

Continuous systems can transport the substrates linearly or circularly through the sequence of treatment stations.

In the following, the method according to the invention and the devices that can be used for it will be described by way of example using a turntable system. In an analogous manner, the invention can also be used for linear continuous systems, provided that the substrate transport is suitable and designed for the process described below for the invention.

Those parts of the substrate holder and transport device that hold the substrates during a process sequence with the associated movement sequences should be referred to here generally as carriers. They are adapted to the respective requirements according to the configuration of the treatment plant and the type and geometry of the substrates and are generally known.

A so-called turntable system has in a treatment chamber a plurality of process sections which are arranged circumferentially and are spatially and process-technically separate from one another. The process sections serve the treatment itself as well as any necessary pre- and post-treatments and/or operational sequences of the substrates. The treatment chamber is hermetically sealed by means of a chamber cover. The chamber wall and the chamber cover are fixed, non-rotating components of the system. A treatment run of a substrate through such a system takes place by means of Activation of the required process sections one after the other, while the substrate in question rotates with all the others by means of a suitable substrate holding device at the required, often high, speeds.

The term treatment should be understood to mean different additive, subtractive or modifying treatments of the surface of a substrate, which can also include a treatment of the substrate itself, for example a heat treatment, pre-treatments such as cleaning or activation processes and others, within the system . Additive treatments include a wide variety of coatings. Subtractive treatments include the total or partial removal of surface layers, whether parasitic or previously applied, particularly with physical or chemical processes, and also mechanical treatments. Changes in the structure or composition of a surface layer are known as modifications, for example by means of heat or plasma effects or chemical treatments. A frequent application of turntable systems is the production of optical glasses, on which layer stacks are deposited, which have the desired optical properties.

To adjust and monitor the treatments, several test substrates, referred to as test glasses based on optical applications, are treated with the substrates under the desired treatment conditions of the actual substrates and analyzed using suitable monitoring systems, preferably in situ. It is to verify individual treatment steps necessary to treat test substrates together with the substrates only during this treatment step and to replace them with new test substrates before the subsequent step. D. H . Test substrates must be changed periodically, which includes removing them from the treatment facility and introducing a new test substrate into the facility.

The test substrate change is very labour-, energy- and time-consuming in the known treatment systems such as turntable systems. First, each test substrate and, if applicable, the associated carrier, for example a carrier of the existing substrate holder and/or substrate transport device, must be transported and loaded into the magazine lock. There it has to be moved to a position where a test substrate changer can be positioned and the test substrate change can be carried out. The carrier equipped with a new test substrate is then returned to the treatment plant. This procedure must be repeated several times in the course of a process run.

Since the process is very complex and time-consuming, the carrier cools down significantly during each change and then has to be adjusted again in terms of temperature to the directly and indirectly adjacent components remaining in the treatment system, for example other carriers and/or their holders. In addition, it is very time-consuming to load the test substrate changer on the magazine lock with new test substrates, or to discharge spent test substrates. Holding several test substrates in the carrier magazine is only conditionally suitable for ef ectively changing the test substrate, since in this case no substrate to be treated can be arranged on the carrier of the test substrate.

The object of the invention is to overcome the disadvantages of the prior art. The method and device should be used for coating, alternatively also for the other treatment methods mentioned above.

The concept of the invention is to be described in such a way that all test substrates required for a process run are introduced together with the substrates and carriers of this process run, for example turntable segments. The test substrates are held in suitable holders on one or more or on all carriers. In this way, a change of test substrates is only necessary when the process run is completed and the system is therefore opened.

According to the invention, the several test substrates of the process run to be carried out are arranged in three different types of positions. In a first position type, the measurement position, a test substrate is treated and can be analyzed in situ. In this position, the test substrate is "visible" for the treatment device and the test substrate is also treated in the same way as or together with the substrates. The analysis of the test substrate relates to relevant layer properties, such as optical or electrical properties or others. There are also positions , only carry the test substrates , treated and untreated . In these holding positions, the test substrates are protected from the effects of the treatment . And there is at least one test substrate on the carrier empty position . The latter can serve as an intermediate storage space in the handling sequence of the test substrates in the course of a process run.

The use of multiple test substrates in a process run is as follows:

- A first test substrate, namely that in a measuring position, is treated and analyzed in a first process phase with the substrates. If the completion of the treatment step is determined by means of a suitable monitoring system, the test substrate in the measurement position must be replaced with a new one.

- To do this, the first test substrate is removed from the measuring position and placed in an empty position. To pick up and set down a test substrate, the rotating turntable is stopped and the used test substrate is lifted or lowered using a suitable loading station of the treatment system described below. filed . By means of said charging station, in conjunction with the clocking (rotation) of the turntable, each test substrate position on the turntable and on a carrier can be reached. Now the previously used test substrate is exchanged for one of the other traveling and still untreated test substrates by indexing the turntable and using the clipboard.

- A second, unused test substrate is then removed from a holding position and placed in the measuring position for monitoring the next treatment step.

- This alternation of used and unused Test substrates and use of the newly created empty position is repeated until all treatment steps to be verified have been completed.

- After completion of the treatment, the treated substrates and with them the treated test substrates can be ejected from the system.

The substrate position or test substrate position refers here to positions realized on a carrier, which are formed by a suitable holder for receiving an individual substrate or an individual test substrate. In this case, the brackets themselves depend on the type and shape of the respective substrate or Test substrate dependent.

It is evident that more than one measurement or blank position can also be used. However, there is a general desire for high efficiency, so that the area on the substrate holder that cannot be used for the substrate treatment is always kept as small as possible. The number of test substrates required for a process run can be precisely determined and optimized through tests or simulations.

It is usually not necessary for the geometry of the test substrates to correspond to that of the substrates, so that the treatable substrate areas can also be optimized in this way.

The position of the various test substrate positions can also be adjusted for an effective and optimal treatment result. In a first variant of the method according to the invention, all test substrates that are required for a process run are distributed in the corresponding positions on several carriers of the substrate holder, so that each carrier preferably has only one test substrate in one of the three possible position types. In this variant, a test substrate change involves at least three carriers. Such carriers, which predominantly have substrates to be treated, are also referred to below as substrate carriers for differentiation.

In an alternative variant of the method, all positions and test substrates required for a process run are arranged on a carrier, also referred to below as a test substrate carrier. If appropriate, more than one test substrate carrier may also be required. A test substrate carrier can only be used with test substrates, i . H . without substrates to be treated, or alternatively be equipped predominantly with test substrates. The used and new test substrates are then exchanged between the individual positions on this test substrate carrier. This variant can be selected if the arrangement of the substrates on the substrate carriers does not allow an additional placement of a test substrate for various reasons, such as the geometry of the substrates or the circumstances of the treatment. In this variant, the test substrates of a process run are only changed within the test substrate carrier.

In both variants, the method described offers the advantage that all required for a process run Test substrates are introduced into the system together with the substrates to be treated and also unloaded again with them. In this way, the carriers can remain in the substrate holder under process conditions while the test substrate is being changed. The carriers do not cool down unevenly when changing the test substrate. Furthermore, the traveling test substrates are at the process temperature and thus have more reproducible properties. In addition, the duration of the test substrate change is significantly reduced. In addition, with the second variant, a solution is also made available for such substrate arrangements in which no test substrate can also be arranged on the carrier to be processed.

A treatment system with which the method according to the invention for changing test substrates can be carried out comprises at least one carrier, for example, but not restrictively, a turntable or a plurality of turntable segments on which substrates to be treated are held and arranged opposite to the relevant treatment source for treatment.

The one or more carriers used to carry out the method described above also have positions for a number n of test substrate positions in addition to the substrate positions. The total minimum number of test substrate positions n required depends, among other things, on the number _NB of the treatment steps to be analyzed using a respective test substrate: n> _NB +m. Obviously n, N _B and m are elements of the natural numbers. In addition, m > 1 .

If the treatment method according to the invention has exactly one test substrate position (m=1) on the carriers involved in the method that goes beyond N _B , in addition to the untreated, already treated and currently to be treated test substrates, there is always an empty position available for interim storage of a test substrate during the Exchange of the test substrates between measuring and holding position. The determination of a constant measurement position in the substrate holder for all test substrates means that its treatment and subsequent monitoring of the treatment for each treatment step can take place in the same system position, viewed relative to the substrate transport path. This results in less effort and/or less space requirement for the monitoring and a higher reproducibility of the monitoring.

In principle, more test substrate positions are also possible (m>1), for example in order to have more than one measurement position available. This can be the case if more than one monitoring device is desired at the treatment facility or if various monitoring methods are to be available at optimized facility positions. The exchange of more than one test substrate between the measuring and holding position at the same time can also be advantageous, so that more than one empty position is desired. However, the primary interest is often to use the available substrate holder for the maximum possible number of substrates to be treated to make the treatment process as effective as possible.

The number of test substrate positions that can be arranged on the individual carriers depends on the number of carriers used for a process run and on the number _NB of the treatment steps to be analyzed using a respective test substrate. In various versions, as stated above, the test substrate positions can be combined on one or optionally also several test substrate carriers or distributed over some or all of the substrate carriers. As a result, n>1, preferably n>2, more preferably n>3, more preferably n>5, more preferably n>7, more preferably n>10 test substrates and any intermediate value thereof can be arranged on a carrier.

As described for the method, of the n test substrate positions, only one is regularly open to the treatment source, so that the surface of a test substrate arranged there that faces the treatment source can be treated there. The remaining test substrate positions are closed to the treatment source. This can be implemented by a suitable screen acting as a shield on the treatment side, a closure in the carrier, or in some other suitable way. Optionally, the empty position can also remain open, as long as this does not have a significant negative impact on the functionality of the treatment section concerned. The shield can be fixed, detachable or pivotable. In the two last-mentioned versions, the test substrate positions can be used variably. The treatment system also includes at least one loading station for the test substrates, which is suitable at least for depositing and removing a test substrate relative to a test substrate position. The loading station may be partially or fully constructed and located within the treatment chamber.

The charging station includes a suitable gripper to grasp a test substrate, hold it and place it again at a test substrate position. The gripper can pick up a test substrate per se or a test substrate held in a fixture by the gripper gripping the fixture. For this purpose and depending on the type of test substrate and, if applicable, its holder, the gripper can be equipped with different gripping means which use at least one of the mechanisms of action from the following list for picking up and setting down the test substrate: mechanical, electrical, pneumatic or magnetic Keep . In the following, gripping, holding or moving is referred to the test substrate in summary only for better understanding. However, it should include both variants, the handling of a test substrate per se and one with a holder.

Using the charging station, different movements of at least the gripper are required for the purpose of changing the test substrate in order to grip the test substrate, lift it from the relevant test substrate position or place it in a test substrate position. This relates to a translational movement, mostly essentially perpendicular to the carrier surface and/or to the surface of the treated substrates and test substrates. This movement is understood here as a movement in the Z-direction, which should not be understood to mean exclusively an exactly vertical movement.

Depending on the position and shape of the carrier, deviations of a few degrees from the vertical can also be included. The Z-direction is to be used here as a reference direction for the X-Y plane lying at right angles to it and as the axis of a possible rotational movement. Accordingly, the charging station is designed to carry out movements of a test substrate at least in the Z direction, optionally also in the X and/or Y direction and/or rotational movements about the Z axis. The components of the charging station, which are used to carry out the named movements, are to be summarized here as a movement unit for the purpose of description.

The charging station can have a heat shield with which at least the gripper, optionally also other components of the charging station, are thermally concealed from the carrier. Optionally, the heat shield can be actively or passively cooled. In the first case, the heat shield is adjusted to a desired temperature using a suitable coolant. In the second case, the heat shield is in thermal contact with a cooler component of the treatment plant in such a way that heat can be transferred from the heat shield to this component.

The charging station can be arranged on that side of the carrier which is remote from the treatment source, so that the carrier protects the charging station from an unwanted influence of the treatment on the charging station. At a In the treatment direction from bottom to top, the charging station can be mounted, for example, on the chamber cover of the system. Mounting on the chamber wall can also be suitable.

The charging station can have distance, proximity and/or position sensors for detecting the location and mounting of the test substrate.

The gripper can have a magnet that can be activated and deactivated again for receiving, holding and depositing the test substrate by means of a magnetizable component thereof, for example a frame or another holder. For example, a permanent magnet can be combined with a coil for deactivating the permanent magnet.

The gripper of the charging station can have a spring acting in the lifting direction in such a way that the end position of the gripper can be compressed at the test substrate position. In this way, reproducible treatments and handling of the test substrate used in each case can be achieved. For example, damage to the carrier or existing holders of the test substrate or adverse effects on the treatment result due to even small deviations in the position of the test substrate can be prevented.

The holder of the gripper can be adjustable with a variable angle of +90° to adapt to different test substrate positions.

A suitable component of the treatment device can have a reference position, in particular around the To calibrate the charging station relative to the occupied and unoccupied test substrate positions and to ensure a reproducible positioning of each test substrate of the process run.

The invention will be explained in more detail below using exemplary embodiments. The accompanying drawing shows in

Fig. 1 a turntable system in a perspective view,

Fig. 2a and fig. 2b a turntable, the alternative test substrate positions or. represents test substrates.

Fig. 3 a charging station mounted on the cover of the turntable system and

Fig. 4 a gripper of the charging station, which is positioned over a test substrate.

The drawings show the device only schematically to the extent necessary to explain the invention. They do not claim to be complete or to scale.

The exemplary embodiment is only intended to illustrate the invention by way of example and not in a restrictive manner. The person skilled in the art would combine the features realized previously in the various configurations of the invention and subsequently in the exemplary embodiment in further exemplary embodiments insofar as this appears to be expedient and meaningful to him.

Fig. 1 shows an open treatment facility 60 which uses a holding device in the form of a segmented turntable 1 within its vacuum chamber 2 . The treatment installation 60 has a circular structure and has several stations 60'...60''''' distributed over its circumference, which are used directly or indirectly for the treatment of substrates 61. In the exemplary embodiment, optical glasses are coated. Glasses are also used as test substrates.

The turntable 1 is equipped with the segments 20 which function as carriers and accommodate two substrates to be treated merely by way of example but not by way of limitation. Magazines (not shown) are arranged in a magazine station 62 , in which substrates 61 are held in substrate positions 64 of the segments 20 . By rotating the turntable 1 by means of a suitable substrate transport device, which carries out the rotation, the substrates 61 pass through the stations 60'...60'''' including the treatment station(s) at high frequency. Depending on the process step, the relevant station is activated and the process step is carried out in this station on the rotating substrates. A process run includes the sequential activation of all stations required for substrate treatment. After completion of the process run, the segments 20 with the treated substrates 61 can be removed at the magazine station 62 . It is evident that the treatment station 60 is closed by means of its cover 63 during the treatment.

In the exemplary embodiment shown, the turntable 1 has a test substrate segment 65 on which, instead of substrates 61, several, for example, but not restrictively five test substrates 66 are arranged in the various six test substrate positions 67 described above. One of the test substrate positions 67 remains free and

A charging station 80 is arranged on the cover 63 of the turntable system 60 and reaches through it into the turntable system 60 . This serves to exchange the treated and untreated test substrates 66 within the test substrate positions 67 . The loading station 80 is arranged opposite the magazine station 62 purely by way of example and not by way of limitation.

Fig. 2a shows a section of the turntable 1 with the test substrate segment 65 according to FIG. 1 . One of the exemplary six test substrate positions 67 shown there is the measuring position 70 and is equipped with a test substrate 66 in the application of the treatment method in order to be subjected to a treatment currently to be carried out. For the treatment, the turntable is rotated so far that the test substrate segment 65 is in the relevant Station 60 ' ... 60 '' '' is located .

A further test substrate position 67 is the empty position 71 , which temporarily contains no test substrate and is used to change the four test substrates arranged in the remaining test substrate positions 67 one after the other to the measurement position 70 . Said four remaining test substrate positions 67 serve as holding positions 72 . Treated or as yet untreated test substrates 66 are held in these and protected from being influenced by the treatments in the course of the process.

An alternative arrangement of the test substrate positions 67 is shown in Figure 2b. There, for example, a test substrate position 67 is arranged on each of the segments 20 next to the substrates 61 to be treated. These segments 20 are referred to as substrate segments 69 to distinguish them from the test substrate segments 65 which, as described with reference to FIG. 2a, only accommodate test substrates 66 and no substrates 61. As described for FIG. 2 a , two of these are the measurement position 70 and the empty position 71 . These are in adjacent substrate segments 69 , merely by way of example. The holding positions 72 are distributed over the remaining segments 20 .

In FIGS. 2a and 2b the measurement position 70 and the empty position 71 are marked with hatching (measurement position 70) or with a cross (empty position 71) for better differentiation.

3 shows a charging station 80 which protrudes through the cover 63 into the turntable system 60 . It is arranged on the cover 63 in such a way that it lies over the segments 20 . For the sake of better clarity and to generalize the description of the charging station 80, substrates 61 of the segment 20 are not shown.

The loading station 80 comprises a gripper 81 which is arranged in the turntable system 60 and a moving device 82. The latter is mounted on the cover 63 and is connected to the gripper 81 via a shaft 83, by way of example but not by way of limitation.

The gripper 81 can be moved axially by means of the moving device 82 . Optionally, a movement of the gripper 81 relative to the central axis (not shown) of the turntable 1 and/or a radial movement of the gripping means 85, which is part of the gripper 81, relative to the shaft 83, can also be executable.

The gripper 81 includes a suitable gripping means 85 which picks up the test substrate 66 . It can be mounted on the gripper 81 in the manner of a cantilever, for example.

The gripper and/or the gripping means 85 can rotate about the axis 84 defined by the shaft 83 and running parallel to the Z-direction (represented by a coordinate system).

Due to the feasible movements of the gripping means 85 and in connection with an optimized position of the loading station 80 relative to the turntable 1 and the test substrate positions 67 there, the gripping means 85 can reach each of the test substrate positions 67 of the turntable 1.

The gripper in the embodiment of FIG. 3 further comprises a heat shield 92, which is arranged between the gripper 81 and the segment 20, so that it protects at least the gripper 81 or also the gripping means 85 from a damaging temperature load caused by the segment 20 during the process run protects. The design and operation of the heat shield 92 can vary, for example depending on the presence and/or type and extent of cooling. In the exemplary embodiment, the heat shield 92 is fixedly mounted on the chamber cover 63 and the gripping means 85 can be pivoted behind the heat shield 92. Others too Configurations are possible. For example, the heat shield 92 can also be pivotable about its own axis, which can run parallel to the axis 84 . Or a combination of movements of both components is possible.

The interaction of the gripping means 85 with the test substrate 66 is shown in FIG. 4 shown .

The test substrate 66 is or includes the actual test substrate 86 which is held by a frame 87 . Other designs of the test substrate 66 are also possible, for example depending on the mechanism of action of the gripping means 85 or on the substrate material or on other conditions.

The gripping means 85 has a cantilever 88 which extends radially from the shaft 83 . The free end piece 89 of the cantilever 88 has one or more magnet holders 90 with flat receiving surfaces 91 arranged on the underside, which are designed and arranged in order to receive, hold and set down the test substrate 66 on its metallic frame 87 . For this purpose, the magnet holders 90 comprise permanent magnets (not shown) and coils (not shown), which interact in such a way that the magnetic field of the permanent magnets can be activated to pick up the test substrate 66 and deactivated to put down the test substrate 66 .

The gripping means 85 and/or the gripper 82 have suitable sensors (not shown) for determining the relative positions and the approach of gripping means 85 and test substrate 66 relative to one another. Sensors can measure the height of the gripper, for example based on a suitable reference point or the position of the test substrate.

The magnet holders 90 are connected directly or indirectly via a spring 91 to the free end piece 89, so that the spring is loaded as a result of the contact between the magnet holder 90 and the frame 87 of the test substrate 66 and so a hard impact on the test substrate 66 when making contact prevented d . H . the receptacle of the test substrate 66 deflects. In this way, different height positions of the individual test substrates can also be compensated.

Claims

Method and device for changing test substrates in a vacuum treatment system, treatment method and treatment device claims

1. Method for changing test substrates in the course of a process run comprising several successive treatment steps in a continuous vacuum system which has several treatment stations (60 '... 60'''') and a transport device (1) comprising at least one carrier (20) for joint holding of substrates (61) to be treated and the test substrates (66) by means of the at least one carrier (20) and for its transport through the plurality of treatment stations (60'...60''''), for at least two of the treatment steps in each case an untreated test substrate (66) is supplied to the treatment together with the substrates (61) to be treated, characterized in that

- the at least two test substrates (66) are introduced into the vacuum treatment system at the beginning of the process run and discharged again after the end of the process run,

- After the first treatment step, the treated first test substrate (66) is removed from its measuring position (70) on the carrier (20) occupied during the treatment and placed in an empty position (71) on the carrier (20) that has no test substrate (66). will, and - subsequently the second, still untreated test substrate (66) is removed from its holding position (72) on the carrier (20) and placed in the previously free measuring position (70) for the purpose of feeding it to the subsequent treatment step of the substrates (61 ) .

2. Method for changing test substrates according to claim

1, characterized in that the previously treated test substrate (66) is removed from the empty position (71) and placed on the carrier (20) in the holding position (72) that has previously become free or in another holding position that has no test substrate (66).

3. Method for changing test substrates according to claim

2, characterized in that more than two test substrates (66) are introduced and the change of test substrates (66) between measuring position (70), empty position (71) and holding position (72) is repeated after each treatment step until all test substrates (66) are treated.

4. Method for changing test substrates according to one of the preceding claims, characterized in that the test substrates (66) are changed between said test substrate positions (67) by means of a loading station (80) of the vacuum continuous system and the test substrate positions (67) by means of the transport device ( 1) are moved relative to the charging station (80) for their access.

5. Procedure for changing test substrates according to one of preceding claims, characterized in that the

The charging station (80) accesses the test substrate (66) or a holder for the test substrate (66) using at least one of the mechanisms of action from the following list: mechanical, electrical, pneumatic or magnetic holding.

6. Method for changing test substrates according to one of the preceding claims, characterized in that the transport device (1) comprises a plurality of carriers (20) and a change of test substrates (66) between measuring position (70) and/or empty position (71) and/or or holding position (72) takes place on the same carrier (20) or on different carriers (20).

7. Method for the modifying, additive or subtractive treatment of a plurality of substrates (61) in the course of a process run to be carried out under vacuum in a vacuum continuous system which has several treatment stations (60 '... 60''') and one Transport device (1) comprising at least one carrier (20) for holding the substrates (61) and the test substrates (66) together by means of the carrier (20) and transporting them through the plurality of treatment stations (60' ... 60'''') , wherein for at least two of the treatment steps an untreated test substrate (66) located in a measuring position (70) on the at least one carrier (20) is treated together with the substrates (61) and the treatment result on the test substrate (66) is analyzed, characterized in that for a subsequent treatment step, the test substrate (66) previously treated in the measuring position (70) is exchanged for an untreated test substrate (66) according to a method according to one of the preceding claims.

8. Treatment method according to Claim 7, characterized in that for each treatment step of the process run to be monitored, a test substrate (66) is introduced together with the substrates (61) and treated and analyzed in the measuring position (70), the untreated test substrates (66) held in holding positions (72) and protected from treatment.

9. Treatment method according to one of claims 7 or 8, characterized in that the substrates (61) and test substrates (66) transported during the treatment on a circular path through the treatment stations (60 '... 60'''') and during a treatment steps in the relevant treatment station (60'...60'''') are repeatedly exposed to the treatment and that, in order to change the positions of the test substrates (66), the substrate transport is stopped in positions in which a loading station ( 80) of the treatment device can access the test substrate position (67) currently to be used.

10. Charging station, designed to carry out a method according to claim 1 to 6 with a gripper (81) which has a receiving surface (91) which is planar at least in sections and which is designed for placing on a test substrate (66) and for holding the test substrate (66). is and with a movement unit (82) which is designed to move the gripper (81) at least in the direction perpendicular to the receiving surface, also referred to below as the Z-direction, characterized in that the gripper (81) _gripping means (85) comprises which are designed for the activatable and deactivatable mounting of a test substrate (66) on the receiving surface (91).

11. Charging station according to claim 10, characterized in that the movement unit (82) is designed for rotation about an axis running in the Z direction and/or for movement in an X-Y plane perpendicular to the Z direction.

12. Charging station according to Claim 10 or 11, characterized in that the charging station (80) further comprises at least one of the following components: an optionally coolable heat shield (92), which is designed to thermally protect the gripper (81) from the carrier (20 ) ; distance, proximity and/or position sensors for detecting the location and mounting of the test substrate (66); a spring that can be deflected or compressed in the Z direction for compressing a Z movement of the gripper (81).

13. Continuous vacuum system, which is designed to carry out a treatment method according to one of claims 7 to 9, comprising the following components:

- A vacuum chamber (2) in which a plurality of treatment stations (60'...60'''') to be passed through one after the other for the treatment of substrates (61) are arranged; - a transport device (1) comprising at least one carrier (20) for holding substrates (61) and test substrates (66) together by means of the at least one carrier (20) and transporting it through the plurality of treatment stations (60'...60'') '') ; characterized in that the at least one carrier (20) in a first alternative has at least one substrate position (64) for receiving a substrate (61) to be treated and at least one test substrate position (67) for receiving a test substrate (66), as an empty position (71) or as a measuring position (70) or as a holding position (72), or in a second alternative at least three test substrate positions (67), one as an empty position (71) and one as a measuring position (70) and one as a holding position (72), and none

Having substrate position (64).

14. Continuous vacuum systems according to claim 13, characterized in that one carrier (20) or several carriers (20) together has or have the n test substrate positions (67) used for a process run, with n being derived from the number N _B of the one Test substrate (66) results in treatment steps to be analyzed plus m and m is an element of the natural numbers and is equal to or greater than 1.

15. Continuous vacuum system according to one of claims 13 or 14, characterized in that each holding position (72) has a fixed or pivotable or detachable shield has its side facing the treatment sources.

16. Continuous vacuum system according to one of claims 13 to

15, characterized in that the treatment system has a charging station (80) according to any one of claims 10 to 12.