EP4241302A1 - Appareil de nettoyage de corps creux en forme de pot, en particulier des récipients de transport pour tranches semi-conductrices ou pour masques de lithographie euv - Google Patents

Appareil de nettoyage de corps creux en forme de pot, en particulier des récipients de transport pour tranches semi-conductrices ou pour masques de lithographie euv

Info

Publication number
EP4241302A1
EP4241302A1 EP21807048.0A EP21807048A EP4241302A1 EP 4241302 A1 EP4241302 A1 EP 4241302A1 EP 21807048 A EP21807048 A EP 21807048A EP 4241302 A1 EP4241302 A1 EP 4241302A1
Authority
EP
European Patent Office
Prior art keywords
cleaning
hollow body
fluid
cover
cleaning fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21807048.0A
Other languages
German (de)
English (en)
Inventor
Gunter Haas
Jürgen Gutekunst
Frank Schienle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gsec German Semiconductor Equipment Co GmbH
Original Assignee
Gsec German Semiconductor Equipment Co GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gsec German Semiconductor Equipment Co GmbH filed Critical Gsec German Semiconductor Equipment Co GmbH
Publication of EP4241302A1 publication Critical patent/EP4241302A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/0861—Cleaning crates, boxes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24—Reflection masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/007—Heating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Definitions

  • Device for cleaning pot-shaped hollow bodies in particular transport containers for semiconductor wafers or for EUV lithography masks
  • the present invention relates to a device for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks.
  • FOUPs Front Opening Unified Pods
  • FOUPs Front Opening Unified Pods
  • the FOUPs are usually closed with a removable lid. Without the lid, the FOUPs have a pot-shaped basic shape with a rectangular base.
  • the FOUPs are sealed with their lids the inserted semiconductor wafers can be transported from one clean room to another, protected from the environment.
  • the FOUPs have reached a processing station, they are opened, the semiconductor wafers are removed and processed accordingly. After processing, the semiconductor wafers are transported back into the FOUPs and then transported to the next processing station.
  • the FOUPs are contaminated in particular by abrasion from the semiconductor wafers when they are introduced into and removed from the FOUPs.
  • EUV lithography masks Extreme ultra-violet radiation
  • the EUV lithography masks are used to produce very small integrated circuits.
  • the EUV too -Lithography masks like semiconductors, have to be transported, whereby a similar situation sets in. If FOUPs are mentioned below, the relevant statements apply equally to transport containers for EUV lithography masks.
  • the FOUPs are cleaned on both their inner surface and their outer surface.
  • the FOUPs are usually much more contaminated on their outer surface than on their inner surface.
  • the cleaning fluid accumulates during the cleaning process both with particles originating from the outer surface and with particles originating from the inner surface. The particles can therefore be transported from the outer surface to the inner surface.
  • a satisfactory cleaning result is only achieved if the number of particles has fallen below a certain value. Due to the particles originating from the outer surface, the cleaning process must be carried out for a correspondingly long period of time in order to be able to remove a sufficient proportion of the particles.
  • the object of one embodiment of the present invention is to propose a device for cleaning pot-shaped hollow bodies, with which these can be cleaned within a short time using simple and inexpensive means.
  • One embodiment of the invention relates to a device for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks, the hollow body - a bottom wall and one or more side walls forming a hollow body inner surface, and
  • the device comprising
  • first discharge channel with a first end, wherein the first discharge channel is in fluid communication with the first end exclusively with the through-opening and with which the first cleaning fluid discharged from the cleaning device can be discharged.
  • the edge of the hollow body is placed on the support wall, with the opening of the hollow body and the through-opening of the support wall directly adjoining one another. It is therefore possible to introduce the first cleaning fluid into the hollow body and thus to clean the inner surface of the hollow body. Due to the fact that the locking device is designed in such a way that the hollow body is not only fixed with the edge surface relative to the support wall, but is also sealed off, the first cleaning fluid do not leave the interior of the hollow body. Consequently, the first cleaning fluid cannot be contaminated by particles that are outside the hollow body. The first cleaning fluid consequently serves exclusively to clean the inner surface of the hollow body, which, as mentioned at the outset, is usually significantly less contaminated than the outer surface of the hollow body.
  • the first cleaning fluid is not contaminated with the particles originating from the outer surface of the hollow body, as a result of which the inner surface of the hollow body is effectively cleaned.
  • the edge surface represents the separating section between the inner surface of the hollow body and the outer surface of the hollow body when the hollow body is placed on the support wall.
  • the sealing of the hollow body with respect to the supporting wall also takes place at the edge surface.
  • the time required to clean the inner surface of the hollow body can be significantly reduced in comparison to devices known from the prior art.
  • the quantity of the first cleaning fluid that is necessary for cleaning the inner surface of the hollow body is also reduced.
  • the first discharge channel is connected to the support wall at the first end and encloses the through-opening.
  • the design effort required to provide the device can be kept low.
  • the first discharge channel can either be manufactured integrally with the support wall or connected to it, for example by welding.
  • the first discharge channel can widen in the shape of a funnel towards the first end. Because of the funnel-shaped widening of the first discharge channel towards the first end, diameter differences between the passage opening and the first discharge channel can be compensated for in a simple manner. As a result, the design effort is kept low. In addition, there are no sudden jumps in diameter, which can lead to disturbances in the flow, for example in the form of turbulence. These disturbances can lead to particle accumulation, as a result of which the removal of the particles is slowed down or completely interrupted and the cleaning of the inner surface of the hollow body can be adversely affected.
  • the first discharge channel can terminate flush with the through-opening at the first end. There are no dead spaces in which particles can accumulate, as a result of which the cleaning of the inner surface of the hollow body can be adversely affected.
  • the cleaning device can have a first cleaning head which protrudes beyond the through-opening.
  • the first cleaning head can be introduced into the interior of the hollow body.
  • the pressure with which the cleaning fluid leaves the first cleaning head also acts on the inner surface of the hollow body with only a small loss, as a result of which the particles located on the inner surface of the hollow body can be removed particularly effectively.
  • a further developed embodiment is characterized in that the first cleaning head can be moved in rotation and/or in translation. Due to the mobility of the first cleaning head, special geometric features of the hollow body inner surface to be reacted. In particular, it is possible to apply the first cleaning fluid at least approximately perpendicularly to the inner surface of the hollow body, as a result of which the kinetic energy of the first cleaning fluid can be used particularly effectively for cleaning the inner surface of the hollow body.
  • the first cleaning head has a number of first cleaning nozzles via which the first cleaning fluid can be delivered at a spray angle, the first cleaning head having an adjustment device with which the spray angle can be adjusted.
  • the spray angle at which the first cleaning fluid is released also determines the angle at which the cleaning fluid strikes the inner surface of the hollow body.
  • An angle of 90° or approximately 90° is ideal. Due to the fact that the spray angle is adjustable, the geometry of the inner surface of the hollow body can be simulated such that the first cleaning fluid can be applied at an angle of 90° or approximately 90° to almost the entire inner surface of the hollow body.
  • the inner surface of the hollow body usually has angled points, so that shadowing can occur with non-adjustable cleaning nozzles, in which no or only a limited amount of the first cleaning fluid can be applied to the inner surface of the hollow body with sufficient kinetic energy. Such shadowing can be avoided in this embodiment, so that the cleaning result is improved overall.
  • a further developed embodiment can stipulate that the first cleaning nozzles can be opened and closed independently of one another. If one of the first cleaning nozzles is open, the first cleaning fluid can be released, what not possible when closed. It is thus possible to clean the inner surface of the hollow body in such a way that the sections that are expected to be cleaner are cleaned first and only then the more heavily soiled sections. As a result, the loading of the first cleaning fluid with particles detached from the inner surface of the hollow body can be kept low for as long as possible. In particular, this prevents comparatively clean sections from being cleaned with the first cleaning fluid, which already has a high loading. In many cases, the ability of the first cleaning fluid to absorb particles decreases as the load increases. In extreme cases, deposits of particles from the first cleaning fluid can even occur on a comparatively clean section of the inner surface of the hollow body. This can be prevented by appropriately controlling the first cleaning nozzles.
  • the device has at least one coupling unit for coupling sound waves into the first cleaning fluid.
  • the sound waves can be used in particular as ultrasonic waves or be designed as megasonic waves.
  • ultrasonic waves have a frequency range of approx. 20 kHz to 500 kHz
  • megasonic waves have a frequency range of approx. 500 kHz to 3 MHz. It makes sense here to completely wet the inner surface of the hollow body with the first cleaning fluid or to flood the entire space enclosed by the inner surface of the hollow body and couple the sound waves into the first cleaning fluid.
  • the first cleaning fluid then serves as a transmitter of the sound waves.
  • the energy input increases with the frequency of the coupled sound.
  • the use of megasound has the advantage that the energy can be brought in a very targeted manner close to the inner surface of the hollow body to be cleaned, so that good cleaning results can be achieved.
  • the coupling units can be integrated into at least some of the first cleaning nozzles or interact with them.
  • the cleaning nozzles can be designed as so-called “megasonic nozzles", which make it possible to couple the sound waves into the first cleaning fluid emitted by the first cleaning nozzles. It is then not necessary to cover the entire inner surface of the hollow body with the first cleaning fluid wet, whereby the amount of the required first cleaning fluid can be kept low.
  • the cleaning device has a feed channel for feeding the first cleaning fluid to the first cleaning head, the first discharge channel and the feed channel being combined at least in sections to form a fluid guide unit. In this case, however, the feed channel and the discharge channel remain fluidically separate.
  • the supply channel and the discharge channel can be designed as tubing and/or as hoses. Due to the combination of the first discharge channel and the supply channel to form a fluid guiding unit, installation space can be saved and the device can therefore be designed to be compact. In addition, the manufacturing effort can be kept low since the number of components of the device can be reduced.
  • a first channel is arranged in the support wall, with which a flushing fluid can be guided to the edge surface.
  • a flushing fluid In particular, nitrogen or compressed air and particularly preferably extremely clean, dried air, also referred to as XCDA, are used as flushing fluid. This prevents the first cleaning fluid from reaching the outer surface of the hollow body via the edge surface, where it can mix with a second cleaning fluid.
  • the second cleaning fluid is prevented from reaching the inner surface of the hollow body via the edge surface, where it can mix with the first cleaning fluid. Contamination is thus prevented.
  • a further embodiment is characterized in that a particle measuring device for determining the particles contained in the first cleaning fluid is arranged in the first discharge channel.
  • the particle measuring device can, for example, be designed in such a way that the number of particles that pass through at a given volume flow of the first cleaning fluid pass the particle measuring device through the first discharge channel. If the number of counted particles falls below a certain value, it can be assumed that the inner surface of the hollow body has been sufficiently cleaned.
  • the particle measuring device ensures, on the one hand, that the inner surface of the hollow body has actually been cleaned to a sufficient extent, and on the other hand, the cleaning process can be interrupted in this case. In the devices known from the prior art, the cleaning process is carried out until it can be assumed with sufficient probability that the hollow bodies have been sufficiently cleaned.
  • the cleaning process is carried out much longer than necessary for safety reasons. Because it is possible according to the present embodiment to interrupt the cleaning process as described, both the duration and the quantity of the first cleaning fluid are reduced, so that the cleaning process is carried out significantly more effectively overall than in the prior art can. In addition, the particle measuring device also enables documentation that a specific FOUP has actually been cleaned to a sufficient extent.
  • the hollow body has a cover with a cover inner surface and a cover outer surface, with which the opening can be closed.
  • a cleaning opening is arranged in the support wall or in a further wall section, which can be at least partially closed with a closure body, the closure body having a receiving unit for receiving the cover of the hollow body, and the cleaning device having a further first cleaning head, with which the first cleaning fluid can be applied to the inner surface of the lid for cleaning when the cleaning opening is closed by the closure body or by the lid.
  • the embodiments of the device described so far relate to the cleaning of the inner surface of the hollow body.
  • the FOUPs are sealed with a removable lid.
  • the device comprises a further first cleaning head, with which the inner surface of the lid can be cleaned.
  • the same first cleaning fluid is used that is also used for cleaning the inner surface of the hollow body.
  • another cleaning fluid can also be used if this appears necessary.
  • the particles on the inner surface of the lid can thus also be removed. In order to prevent the first cleaning fluid from escaping uncontrolled from the cleaning opening, the cleaning opening must be sealed during the cleaning process.
  • either the cover or the closure body interact with the support wall or the further wall section in such a way that the cleaning opening is closed in a sealing manner.
  • the cleaning opening can be arranged in such a way that no particles from the environment of the hollow body can get into the first cleaning fluid during the cleaning process. It makes sense here to discharge the first cleaning fluid via the first discharge channel.
  • the receiving unit of the closure body interacts with the outer surface of the cover, so that the inner surface of the cover is accessible without obstacles, in particular for the first cleaning fluid.
  • a further embodiment specifies that the closure body is movable on the support wall or the other between an open position in which the closure body releases the cleaning opening and a closed position in which the closure body closes the cleaning opening Wall section is attached.
  • the closure body can be integrated particularly well into the handling of the lid.
  • a gripping robot or the like can insert the cover into the receiving unit of the closure body.
  • the receiving unit is equipped with fixing means with which the cover can be detachably attached to the closure body.
  • the closure body is moved into the closed position.
  • the cleaning opening is closed in a sealing manner, so that the cleaning process with regard to the inner surface of the cover can be started.
  • the closure body is moved back into the open position and the connection between the closure body and the cover is released, so that the gripping robot can remove the cover from the receiving unit. In this case, it makes sense to rotatably fasten the closure body to the support wall or to the further wall section.
  • a further embodiment provides that the device can have a second channel with which a flushing fluid can be guided to the cover.
  • the lid of a transport container usually has a lid seal with which the lid can be sealed off from the rest of the transport container.
  • nitrogen or compressed air and particularly preferably extremely clean dried air, also referred to as XCDA are used as flushing fluid.
  • the flushing fluid can be used to precisely delimit the effective area of the first cleaning fluid, with which the inside surface of the cover is cleaned.
  • the limitation can be chosen so that the first cleaning fluid cannot reach the cover seal. This prevents particles in the first cleaning fluid from adhering to the seal, detaching from the seal during operation of the transport container and damaging a semiconductor wafer.
  • a turbulent flow is created, which promotes active blow-off or cleaning of the seal.
  • the cleaning device has a second cleaning head with which a second cleaning fluid can be released for cleaning the outer surface of the hollow body.
  • the device has a second discharge channel, with which the second cleaning fluid discharged from the second cleaning head can be discharged.
  • the particle concentration on the inner surface of the hollow body is usually lower than on the outer surface of the hollow body.
  • the separate removal of the first cleaning fluid and the second cleaning fluid allows the first cleaning fluid to be reused for cleaning the outer surface of the hollow body.
  • the loading (or particle concentration) in the first cleaning fluid can first be determined in order to decide whether the loading of the first cleaning fluid is low enough to be able to clean the outer surface of the hollow body to the necessary extent. If this is possible, the amount of cleaning fluid and consequently the cleaning costs can be kept low.
  • the device can have a housing which, together with the support wall, encloses a process space, the process space being accessible via a housing opening that can be closed with a cover.
  • the hollow body can be introduced into the process space through the housing opening and removed again. In this embodiment it is possible to guide the second cleaning fluid in a defined manner and to avoid its uncontrolled distribution in the device.
  • the support wall can have a number of through-holes, the through-holes being arranged radially outside of the locking device and with which the second discharge channel is fluidically connected to the process space.
  • the through-holes can also be designed as through-slots.
  • the second cleaning fluid can be removed from the process space in a controlled manner via the second discharge channel without the second cleaning fluid mixing with the first cleaning fluid.
  • a further developed embodiment is characterized in that the second cleaning head is U-shaped and can be moved in rotation and/or translation in the process space. Due to the U-shaped design of the second cleaning head, the second cleaning fluid can be guided both to the bottom wall and to the side walls. Due to the mobility of the second cleaning head, it is possible to react flexibly to special geometrical features of the outer surface of the hollow body to be cleaned.
  • the first cleaning head, the further first cleaning head and/or the second cleaning head have at least one drying nozzle and/or an infrared diode.
  • the proposed device can be used not only for cleaning but also for subsequent drying of the hollow body.
  • a drying gas for example air or nitrogen
  • the hollow body has a correspondingly designed connection, in particular a negative pressure connection, via which a negative pressure can be generated inside the hollow body in order to suck the drying gas into the hollow body and then to be removed from it again.
  • a tube is connected to this connection, also referred to as a snorkel, which can be connected to a vacuum pump, for example.
  • a snorkel which can be connected to a vacuum pump, for example.
  • the position of the hollow body in the device remains unchanged.
  • both the inner surface of the hollow body and the outer surface of the hollow body can be dried. In this case, there is no mixing of the drying gas, which is used for the inner surface of the hollow body, with the drying gas, which is used for the outer surface of the hollow body.
  • infrared diodes can be used, which have the advantage that the radiation emitted by infrared diodes is in a narrowly limited frequency range, which is optimized for the cleaning fluid used.
  • the residues of the cleaning fluid still remaining on the inner surface of the hollow body or the outer surface of the hollow body are very effectively heated and thus removed.
  • One embodiment of the invention relates to the use of a device according to one of the previous embodiments for cleaning transport containers for semiconductor wafers.
  • the technical effects and advantages that can be achieved with the proposed use correspond to those that have been discussed for the present device.
  • the time required to clean the inner surface of the hollow body is
  • One embodiment of the present invention relates to a method for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks using a device according to one of the previous embodiments, comprising the following steps:
  • the proposed method it is also possible to clean either only the outer surface of the hollow body or only the inner surface of the hollow body, if this is desired. Furthermore, the outer surface of the hollow body can be cleaned for a shorter time than the inner surface of the hollow body. In addition, it is also possible to clean both the outer surface of the hollow body and the inner surface of the hollow body at the same time.
  • the method can include the following steps:
  • the cover can be placed on the receiving unit, for example by means of a gripping robot.
  • the receiving unit In the open position, the receiving unit is easily accessible, so that the lid can be put down and removed quickly and easily without the gripping robot having to perform complicated movements.
  • the closed position In the closed position, the guidance of the first cleaning fluid is ensured, so that mixing with the second cleaning fluid is avoided for the reasons mentioned above.
  • the proposed device can also be operated in such a way that only the cover and not the hollow body is cleaned. In this case can the passage opening can be closed with a closure element.
  • the sound waves can be coupled in, for example, in the form of ultrasound or megasonic. This improves the cleaning result, since energy is introduced into the first cleaning fluid, which energy is used to loosen the particles on the inner surface of the hollow body.
  • the inner surface of the cover and the outer surface of the hollow body can be treated accordingly.
  • the procedure includes the following steps:
  • the sound waves can be coupled in as ultrasound or megasonic.
  • the cleaning result is also improved in this embodiment.
  • the required quantity of the first cleaning fluid can be kept correspondingly low.
  • the inner surface of the cover and the outer surface of the hollow body can be treated accordingly.
  • FIG. 1 shows a basic sectional view through an exemplary embodiment of a device for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks,
  • FIG. 2 shows an enlarged representation of detail A defined in FIG. 1, not to scale, and
  • FIG. 3 shows an enlarged representation of section B defined in FIG. 1, not to scale.
  • FIG. 1 shows an exemplary embodiment of a proposed device 10 for cleaning pot-shaped hollow bodies 12 using a basic sectional view.
  • the device 10 has a housing 14 which forms a housing opening 16 which can be closed with a cover 18 which can be removed from the housing 14 .
  • a support wall 20 is arranged in the housing 14 so that a closed process space 22 is created in the housing 14 .
  • the process space 22 is delimited by the support wall 20 , by the housing 14 itself and by the cover 18 .
  • the support wall 20 forms a Through-opening 24, a locking device 26 being arranged radially outside of through-opening 24.
  • two through bores 28 are provided in the support wall 20 radially outside the locking device 26 .
  • a hollow body 12 in particular a transport container 30 for semiconductor wafers, also referred to as FOUPs, or a transport container 30 for EUV lithography masks, can be introduced into the processing space 22.
  • the hollow body 12 has a bottom wall 32 and in this case four side walls 34, so that the pot-shaped hollow body 12 is essentially cuboid.
  • the bottom wall 32 and the four side walls 34 form a hollow body inner surface 33 and a hollow body outer surface 35.
  • the hollow body 12 has an opening 36 which is arranged opposite the bottom wall 32 and which is enclosed by an edge surface 38 which is formed by the side walls. In the region of the edge surface 38, the hollow body 12 is designed in the manner of a flange in the exemplary embodiment shown.
  • the hollow body 12 can be placed on the support wall 20 with this edge surface 38 .
  • the passage opening 24 of the support wall 20 and the opening 36 of the hollow body 12 are at least approximately of the same size and of the same geometric shape in the exemplary embodiment shown.
  • the locking device 26 is designed such that the through-opening 24 is at least approximately aligned with the section of the inner surface 33 of the hollow body adjoining the through-opening 24 .
  • the area A marked in FIG. 1 is not shown enlarged to scale, with no exact match being present.
  • the locking device 26 is not shown for reasons of clarity.
  • the support wall 20 includes a support wall section 37 which forms a contact surface 39 which is in contact with the edge surface 38 of the transport container 30 .
  • the contact surface 39 of the support wall section 37 is completely covered by the edge surface 38 .
  • a first channel 41 is arranged in the support wall section 37 , which opens into the contact surface 39 and with which a flushing fluid, for example air or nitrogen, can be guided to the edge surface 38 .
  • the device 10 is equipped with a cleaning device 40 which has a first cleaning head 42 which protrudes beyond the through-opening 24 and is therefore arranged inside the process space 22 .
  • the first cleaning head 42 is enclosed by the hollow body 12.
  • the housing 14 also includes a wall section 44 in which a cleaning opening 46 is arranged.
  • the wall section 44 is located on the side of the support wall 20 facing away from the locking device 26.
  • the cleaning opening 46 can be closed at least partially with a closure body 48, which can be rotated about a first axis of rotation D1 with a drive unit (not shown). Wall section 44 is attached.
  • the closure body 48 can be moved between an open position, in which the closure body 48 uncovers the cleaning opening 46, and a closed position, in which the closure body 48 at least partially closes the cleaning opening 46. In Figure 1 the closure body 48 is in the closed position.
  • the closure body 48 has a receiving unit 50 with which a cover 52, with which the hollow body 12 can be closed, can be detachably attached to the closure body 48.
  • the cover 52 forms a cover inner surface 54 and a cover outer surface 56.
  • the cover inner surface 54 is the side of the cover 52 which directly adjoins the hollow body inner surface 33 when the hollow body 12 is closed with the cover 52. In other words, in this case the inner surface 54 of the cover points towards the bottom wall 32 of the hollow body 12 .
  • the receiving unit 50 is designed in such a way that it interacts with the cover 52 only by means of the outer surface 56 of the cover.
  • FIG. 3 the area B identified in FIG. 1 is not shown enlarged to scale, with no exact match being present.
  • a housing seal 51 is arranged in the housing 14 adjacent to the cleaning opening 46 and enclosing it. If the closure body 48 is in the closed position, the cover 52 interacts with the housing seal 51 . To this extent, the cleaning opening 46 is closed and sealed by means of the cover 52 .
  • the statement that the closure body 48 at least partially closes the cleaning opening 46 should be understood against this background. However, it is also conceivable that the closure body 48 interacts with the housing seal 51 and completely seals the cleaning opening 46 . In addition, it can be seen from FIG.
  • the cover 52 has a cover seal 53 with which the transport container 30 can be sealed when the cover 52 is connected to the transport container 30 .
  • a channel element 55 is arranged on the housing 14 which, together with the housing 14, forms a second channel 57 with which a flushing fluid, for example air or nitrogen, can be guided to the cover 52.
  • the channel member 55 is constructed to form a gap 60 with the lid gasket 53 .
  • the cleaning device 40 is also equipped with a further first cleaning head 58 which is arranged in the vicinity of the closure body 48 when the latter is in the closed position.
  • the cleaning device 40 also includes a second cleaning head 64 which is essentially U-shaped and is at least partially arranged in the process space 22 .
  • the second cleaning head 64 is arranged outside of the hollow body 12 when the hollow body 12 is connected to the support wall 20 as shown in FIG.
  • the second cleaning head 64 can be rotated about a second axis of rotation D2, the drive device used for this purpose not being shown.
  • the second cleaning head 64 can be moved not only in rotation but also in translation or only in translation.
  • the first cleaning head 42 cannot be moved, although it can also be designed to be movable in a rotary and/or translatory manner.
  • the device 10 is further provided with a fluid guiding unit
  • the fluid guiding unit 66 provided with which a first cleaning fluid for the first Cleaning head 42 and the other first cleaning head 58 and a second cleaning fluid to the second cleaning head 64 can be performed.
  • the fluid guiding unit 66 has a first feed channel 68 with which the first cleaning fluid can be guided to the first cleaning head 42 .
  • the fluid guide unit 66 includes a first discharge channel 70, with which the first cleaning fluid discharged from the first cleaning head 42 and from further first cleaning heads 58 can be discharged from the process space 22 again.
  • the first bleed channel 70 has a first end 72 in fluid communication with the through-opening 24 .
  • the first discharge channel 70 widens in a funnel shape towards the first end 72 and is connected to the support wall 20 in such a way that the first end 72 of the discharge channel ends flush with the passage opening 24 .
  • a first particle measuring device 741 is arranged in the first discharge channel 70, with which the particles which are in the first cleaning fluid and originate from the inner surface 33 of the hollow body can be determined and in particular counted.
  • a second particle measuring device 742 is arranged in the secondary channel 742, with which the particles that are in the first cleaning fluid and originate from the inner surface 54 of the cover can be determined and, in particular, counted.
  • the fluid guiding unit 66 has a second discharge channel 76 which is constructed essentially in the same way as the first discharge channel 70 but is in fluid communication with the two through bores 28 .
  • the first discharge channel 70 forms the radially inner wall of the second discharge channel 76, so that the fluid guiding unit 66 can be made very compact.
  • the device 10 is operated in the following manner: In the initial state, not shown here, the cover 18 is open and the second cleaning head 64 is rotated by 90° in relation to Figure 1, so that the U-shaped section of the second cleaning head 64s 64 is perpendicular to Level of Figure 1 is.
  • the closure body 48 is in the open position, in which the closure body 48 is aligned approximately horizontally in relation to FIG.
  • the cover 52 is separated from the hollow body 12 and placed on the receiving unit 50 with a handling device that is not shown, for example with a gripping robot.
  • the opened hollow body 12 is introduced into the process space 22 in such a way that the hollow body 12 with its edge surface 38 on rests on the support wall 20, as shown in FIG.
  • the hollow body 12 is locked with the locking device 26 so that it is connected to the support wall 20 and thus fixed in the processing space 22 .
  • the locking device 26 is equipped with sealing means, not shown here, so that the hollow body 12 is sealed off from the support wall 20 .
  • the cover 18 is closed.
  • the receiving unit 50 of the closure body 48 is activated, so that the cover 52 is fixed to the closure body 48 .
  • the closure body 48 is rotated through 90° into the closed position, as shown in FIG. In this case, the cover 52 seals the cleaning opening 46 .
  • a first cleaning fluid is now fed via the first supply channel 68 to the first cleaning head 42 and is discharged through first cleaning nozzles 78 in such a way that the inner surface 33 of the hollow body is cleaned with the first cleaning fluid.
  • the further first cleaning head 58 has further first cleaning nozzles 80, with which the first cleaning fluid is applied to the cover inner surface 54, which is consequently cleaned.
  • a second cleaning fluid which can correspond to the first cleaning fluid, is fed via the second supply channel (not shown here) to the second cleaning head 64, where the second cleaning fluid is discharged through second cleaning nozzles 82 in order to clean the outer surface 35 of the hollow body.
  • the second cleaning head 64 can be rotated about the second axis of rotation D2.
  • the first cleaning nozzles 78, the further first cleaning nozzles 80 and the second cleaning nozzles 82 can be designed in such a way that the spray angle ⁇ at which the first cleaning fluid and the second cleaning fluid are delivered can be adjusted.
  • the first cleaning nozzles 78, the other first cleaning nozzles 80 and the second cleaning nozzles 82 can be mounted in the shape of a spherical head.
  • the first cleaning nozzles 78 can be arranged on a tubular body 83 which can be rotated about a third axis of rotation D3, with which the spray angle ⁇ can be set.
  • the first cleaning head 58 includes an adjustment device 85 with which the spray angle ⁇ can be adjusted.
  • the additional first cleaning nozzles 80 and the second cleaning nozzles 80 can be designed accordingly, with the spray angle ⁇ at which the first cleaning fluid is emitted from the additional first cleaning nozzles 80 also being set by the adjusting device 85 .
  • the adjustment device 85 can also be designed in such a way that the spray angle ⁇ of the second cleaning nozzles 80, which are located on the second cleaning head 64, can also be adjusted. In this way, it can be achieved that the first cleaning fluid and the second cleaning fluid impinge perpendicularly or almost perpendicularly on the inner surface 33 of the hollow body and the inner surface of the cover or the outer surface 35 of the hollow body.
  • the device 10 has at least one coupling unit 87 for coupling sound waves into the first cleaning fluid.
  • the coupling unit 87 can also be designed in such a way that the sound waves also enter the second
  • Cleaning fluid can be coupled.
  • some of the coupling units 87 are integrated into at least some of the first cleaning nozzles 78 and designed as so-called "megasonic nozzles".
  • a megasound can be coupled into the first cleaning fluid emitted by the first cleaning nozzles 78. The same can be provided for the further first cleaning nozzles 80 and the second cleaning nozzles 82.
  • the first cleaning nozzles 78 can be opened and closed independently of one another. Consequently, it is possible to clean different sections of the hollow body inner surface 33 first and other sections later. For example, sections which experience has shown are less heavily soiled can be cleaned first and then sections which experience has shown are more heavily soiled.
  • the other first cleaning nozzles 80 and the second cleaning nozzles 82 can be configured accordingly, so that the first inner surface 54 of the cover and the outer surface 35 of the hollow body can be cleaned accordingly.
  • a flushing fluid is fed through the first channel 41 to the edge surface 38 and/or through the second channel 57 to the cover 52 .
  • This can be the same flushing fluid, but it is also possible to conduct a first flushing fluid through the first channel 41 and a second flushing fluid, which differs from the first flushing fluid, through the second channel 57 .
  • the flushing fluid which is conducted through the first channel 41 to the edge surface 38, ensures that neither the first cleaning fluid nor the second cleaning fluid can cross the edge surface.
  • the flushing fluid therefore creates a fluidic seal between the first cleaning fluid and the second cleaning fluid. Consequently, it is ensured that the first cleaning fluid and the second cleaning fluid cannot mix. Contamination of the first cleaning fluid with the second cleaning fluid and vice versa is prevented.
  • the first cleaning fluid which has been discharged from the first cleaning head 42 and applied to the inner surface 33 of the hollow body, is discharged via the first discharge channel 70 .
  • the same also applies to the first cleaning fluid, which is discharged from the further first cleaning head 58 and applied to the inner surface 54 of the cover.
  • the first discharge channel 70 has a secondary channel 84 which opens into the first discharge channel 70 .
  • the flushing fluid which is conducted to the cover 52, flows back through the gap 60 into the secondary channel 84.
  • the housing seal 51 prevents the flushing fluid from getting into the environment.
  • the rinsing fluid prevents the first cleaning fluid, which is discharged from the other first cleaning head 58 and applied to the inner surface 54 of the cover, from reaching the cover seal 53, to which particles in the first cleaning fluid could adhere.
  • the flushing fluid which is conducted to the edge surface 38 and/or to the cover 52, can be put under a sufficiently high pressure.
  • the first cleaning fluid particles which have been located on the inner surface 33 of the hollow body and the inner surface 54 of the cover are removed.
  • the particles that come from the hollow body inner surface 33 are from the first particle measuring device 741 and the particles, which originate from the inner surface 54 of the cover, are recorded by the second particle measuring device.
  • the first particle measuring device 741 and the second particle measuring device 742 can be designed in such a way that the number of particles that pass through the particle measuring device 74 at a given volume flow within a specific time is determined. From this it can be determined whether the inner surface 33 of the hollow body and the inner surface 54 of the cover have been cleaned to the desired extent or not.
  • the cleaning process for the hollow body 12 can be interrupted while the cleaning process for the inner surface 54 of the cover is continued. Meanwhile, the hollow body 12 can be removed from the device by the gripper robot, which saves time.
  • a further particle measuring device 74 can be arranged in the second discharge channel 76 .
  • the particles originating from the outer surface 35 of the hollow body can be detected with this further particle measuring device.
  • This information can also be included in the decision as to whether or not the cleaning process for the hollow body 12 can be terminated. If the loading of the first cleaning fluid with particles originating from the inner surface 33 of the hollow body does not exceed a specific value, this can also be used for cleaning the outer surface 35 of the hollow body.
  • the particle measuring device 74 is arranged downstream of where the secondary channel 84 opens into the first discharge channel 70 .
  • the cleaning process can be aborted when the number of particles falls below a certain level.
  • the second cleaning fluid which has been discharged from the second cleaning head 64 and has been applied to the outer surface 35 of the hollow body, is discharged via the second discharge channel 76 . Consequently, the first cleaning fluid and the second cleaning fluid are discharged separately from one another, as a result of which particles originating from the outer surface 35 of the hollow body cannot get into the first cleaning fluid and thus onto the inner surface 33 of the hollow body or the inner surface 54 of the cover.
  • cleaning the inner surface 33 of the hollow body and the inner surface 54 of the cover is more important than cleaning the outer surface 35 of the hollow body. with which the outer surface 35 of the hollow body has been prepared, can be broken off.
  • a first drying gas and a second drying gas can now be supplied to the first cleaning head 42, to the further first cleaning head 58 via the first supply channel 68 or the second supply channel in largely the same way as the first and the second cleaning fluid and to the second cleaning head 64.
  • a negative pressure is generated in the hollow body 12 in that a pipeline (not shown) is connected to a negative pressure connection 94 and can be connected to a vacuum pump (also not shown).
  • a vacuum pump also not shown
  • the first cleaning head 42 has first drying nozzles 86, the other first cleaning head 58 has other first drying nozzles 88 and the second cleaning head has second drying nozzles 90, with which the first drying gas or the second drying gas is emitted and applied to the hollow body inner surface 33, the cover inner surface 54 and the outer surface 35 of the hollow body can be applied.
  • the first drying gas and the second drying gas displace the first cleaning fluid and the second cleaning fluid from the device 10. Residues of the first and the second cleaning fluid can also be blown away.
  • first cleaning head 42, the further first cleaning head 58 and the second cleaning head each have infrared diodes 92, with which residues of the first and second cleaning fluid can be heated and evaporated, as a result of which they can be separated from the first and second Drying gas can be discharged from the device 10.
  • the cover 18 is opened and the closure body 48 is moved into the open position.
  • the cleaned hollow body 12 is removed from the process space.
  • the receiving unit 50 is deactivated, as a result of which the cover 52 can be removed from the closure body 48 and fed to the hollow body 12 in order to close it.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

La présente invention concerne un appareil (10) pour le nettoyage de corps creux en forme de pot (12), en particulier des récipients de transport (30) pour des tranches semi-conductrices ou pour des masques de lithographie EUV, l'appareil (10) comprenant : une paroi de support (20) sur laquelle le corps creux (12) peut être placé à l'aide de sa surface de bord (38) ; un dispositif de verrouillage (26) au moyen duquel le corps creux (12) peut être relié de manière étanche et amovible à la paroi de support (20) ; au moins une ouverture de passage (24) qui est formée par la paroi de support (20) et est disposée radialement à l'intérieur du dispositif de verrouillage (26) ; un dispositif de nettoyage (40) au moyen duquel un premier fluide de nettoyage peut être distribué pour nettoyer la surface interne du corps creux (33) lorsque le corps creux (12) est relié à la paroi de support (20) ; et un premier canal d'évacuation (70) avec une première extrémité (72), le premier canal d'évacuation (70) avec la première extrémité (72) étant en communication fluidique uniquement avec l'ouverture de passage (24) et avec lequel le premier fluide de nettoyage distribué par le dispositif de nettoyage (40) peut être évacué.
EP21807048.0A 2020-11-09 2021-11-05 Appareil de nettoyage de corps creux en forme de pot, en particulier des récipients de transport pour tranches semi-conductrices ou pour masques de lithographie euv Pending EP4241302A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020129469.7A DE102020129469B4 (de) 2020-11-09 2020-11-09 Vorrichtung zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken
PCT/EP2021/080793 WO2022096657A1 (fr) 2020-11-09 2021-11-05 Appareil de nettoyage de corps creux en forme de pot, en particulier des récipients de transport pour tranches semi-conductrices ou pour masques de lithographie euv

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EP4241302A1 true EP4241302A1 (fr) 2023-09-13

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US (1) US20230402298A1 (fr)
EP (1) EP4241302A1 (fr)
JP (1) JP2023551600A (fr)
KR (1) KR20230118073A (fr)
CN (1) CN116569108A (fr)
DE (1) DE102020129469B4 (fr)
IL (1) IL302760A (fr)
WO (1) WO2022096657A1 (fr)

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DE102022116177A1 (de) * 2022-06-29 2024-01-04 Gsec German Semiconductor Equipment Company Gmbh Vorrichtung zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken
DE102022124334A1 (de) 2022-09-22 2024-03-28 Gsec German Semiconductor Equipment Company Gmbh Vorrichtung und Verfahren zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken
DE102022130420A1 (de) 2022-11-17 2024-05-23 Gsec German Semiconductor Equipment Company Gmbh Reinigungsvorrichtung, Behandlungsvorrichtung sowie Verfahren zum Reinigen bzw. Behandeln von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken
DE102023100730B4 (de) 2023-01-13 2024-09-19 Gsec German Semiconductor Equipment Company Gmbh Verfahren zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken mit einer entsprechenden Vorrichtung

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US5238503A (en) 1991-04-09 1993-08-24 International Business Machines Corporation Device for decontaminating a semiconductor wafer container
US7216655B2 (en) 1998-01-09 2007-05-15 Entegris, Inc. Wafer container washing apparatus
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US6322633B1 (en) * 1999-07-28 2001-11-27 Semitool, Inc. Wafer container cleaning system
DE502004004812D1 (de) 2003-04-11 2007-10-11 Dynamic Microsystems Semicondu Vorrichtung und verfahren zum reinigen und trocknen von bei der herstellung von halbleitern verwendeten gegenständen, insbesondere von transport- und reinigungsbehältern für wafer
DE102005030275A1 (de) 2005-06-21 2006-12-28 Dynamic Microsystems Semiconductor Equipment Gmbh Verfahren und Vorrichtung zum Reinigen oder Trocknen von topfartigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer
KR101265182B1 (ko) * 2012-07-20 2013-05-27 (주) 디바이스이엔지 웨이퍼 보관용기 세정장치
US20160303622A1 (en) * 2013-10-23 2016-10-20 Brooks Ccs Gmbh Cleaning Systems and Methods for Semiconductor Substrate Storage Articles
JP6779440B2 (ja) * 2016-12-26 2020-11-04 ヒューグル開発株式会社 ケース洗浄装置及びケース洗浄方法
KR102067752B1 (ko) * 2018-02-09 2020-01-17 (주)에스티아이 풉 세정 장치 및 풉 세정 방법

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DE102020129469A1 (de) 2022-05-12
JP2023551600A (ja) 2023-12-08
DE102020129469B4 (de) 2024-05-29
CN116569108A (zh) 2023-08-08
KR20230118073A (ko) 2023-08-10
WO2022096657A1 (fr) 2022-05-12
IL302760A (en) 2023-07-01
US20230402298A1 (en) 2023-12-14

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