EP4230006A1 - Élément de connexion pour la connexion électrique de deux supports de circuit - Google Patents

Élément de connexion pour la connexion électrique de deux supports de circuit

Info

Publication number
EP4230006A1
EP4230006A1 EP21777488.4A EP21777488A EP4230006A1 EP 4230006 A1 EP4230006 A1 EP 4230006A1 EP 21777488 A EP21777488 A EP 21777488A EP 4230006 A1 EP4230006 A1 EP 4230006A1
Authority
EP
European Patent Office
Prior art keywords
connecting element
contact
circuit carrier
designed
locking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21777488.4A
Other languages
German (de)
English (en)
Inventor
Joerg Offterdinger
Stefan Huehner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP4230006A1 publication Critical patent/EP4230006A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • the invention relates to a connecting element for electrically connecting a circuit carrier to another circuit carrier.
  • THT Thinough-Hole-Technology
  • DE 102014 109 220 A1 discloses a printed circuit board connecting element which is designed for the electrical and/or mechanical connection of two printed circuit boards and has solderable SMD connection surfaces and/or pluggable THT wire connections, the printed circuit board connecting element having a carrier body and one attached to the carrier body Has supporting body for support on the printed circuit board, so that a mechanical relief of the SMD pads or the THT wire connections can be effected during the press-in process.
  • the connecting element has a holding body, in particular a plastic body, and a resiliently constructed contact element connected to the holding body.
  • the contact element has an end section, the solder connection being formed on the end section.
  • the connector includes a latch member reciprocally connected to the connector between a latched position and a release position.
  • the locking element is designed to limit a spring deflection of the contact element in the locking position and to release the contact element for spring-loaded movement in the release position.
  • the connecting element can advantageously be placed in the locking position of the locking element on the circuit carrier designed for surface soldering and soldered to the circuit carrier.
  • the soldering connections can hit the contact surfaces of the circuit carrier designed for surface soldering precisely, insofar as these are held in a predetermined position by means of the locking element, in particular while maintaining predetermined distances from one another.
  • the locking element can be moved into the release position and the contact element can thus intercept movements, in particular heavy movements, caused by movement of the two circuit carriers in a spring-loaded manner.
  • the locking element is formed by a frame enclosing the holding body, the frame being designed to enclose and hold a longitudinal section of the contact element in the locking position.
  • the contact element which is formed, for example, by a longitudinally extending wire or a stamped grid, can be held relative to the holding body by means of the locking element in a predetermined position, in particular a predetermined distance, radially spaced from the holding element.
  • PPS poly propylene sulfide
  • LCP liquid crystal polymer
  • the connecting element is designed to be placed on the circuit carrier for surface soldering.
  • the contact element preferably has a solder foot forming the solder connection, which - in particular extending at an angle from the contact element - is formed on an end portion of the contact element.
  • the soldering foot can be formed on the contact element in a cost-effective manner, in particular molded onto the contact element.
  • the contact element is formed by an in particular stamped contact wire, which has the solder foot on an end section pointing towards the circuit carrier.
  • the contact element preferably has a THT connection, in particular a connection pin or press-in contact, on an end opposite to the soldering foot.
  • the press-in contact is designed to be pressed into an in particular metallized opening of a printed circuit board and to make electrical contact with the printed circuit board there mechanically in the opening.
  • the two circuit carriers can thus be connected to one another in a cost-effective manner by means of the connecting element.
  • the contact element has a projection area on the longitudinal section formed for locking, and the locking element has a recess for the projection area--corresponding in particular to the projection area.
  • the locking element is designed to hold the contact element on the projection area when engaging in the recess in the locking position.
  • the locking element is further preferably designed to release the contact element on the projection area in the release position for movement.
  • a locking of the contact element can advantageously be formed in this way in a cost-effective manner.
  • the contact element has a larger diameter on the longitudinal section formed for locking, in particular on the projection area, than on a section formed for releasing and adjacent thereto.
  • the longitudinal section designed to be locked can be produced in a cost-effective manner by appropriate shaping when the contact element is punched out of a piece of sheet metal.
  • the locking element is designed to encompass the contact element on a longitudinal section, the longitudinal section with the smaller diameter being arranged in the release position in the recess in which the projection area is arranged in the locking position.
  • the locking element can advantageously be designed in such a way that it can be moved back and forth along a longitudinal extension of the connecting element, in particular transversely to a flat extension of the circuit carrier designed for surface soldering.
  • the locking element is configured to be reciprocated in a plane parallel to the surface soldering.
  • the locking element which is formed, for example, by a U-shaped or O-shaped frame, which encloses the connecting element, in particular the holding body, can thus have an opening which is, for example, elongated and is designed to close the contact element at a narrow point grasp and hold on.
  • the contact element is L-shaped or T-shaped at the projection area.
  • the protruding area can thus be produced in a cost-effective manner by stamping a piece of sheet metal onto the contact element.
  • the THT connection is designed as a press-in contact.
  • the press-in contact is preferably designed to be held firmly in an opening in the further circuit carrier—in particular in a radially outwardly resilient manner.
  • the contact element preferably extends beyond an end section of the holding body pointing towards the circuit carrier, so that the connection element can yield resiliently when the further circuit carrier is pressed onto the connection element, so that the end section forms an end stop limiting the spring deflection of the yielding.
  • the end stop can advantageously be formed by the holding body itself. Further advantageously, the holding body does not need any further ones from the holding body radially deflecting arms or stop elements which limit the spring travel when pressed.
  • the locking element has at least one foot or leg formed onto the locking element, which is designed in such a way that, in the locking position, it extends up to a plane formed by the circuit carrier, in particular the circuit carrier designed for surface soldering extend so that the connecting element together with the solder foot and the at least one foot on the circuit board, in particular without being held - can stand.
  • the locking element can thus form a further support body which can secure the connecting element, in particular the soldered connection of the soldering foot to the circuit carrier, when the further circuit carrier is pressed on.
  • a connecting element can also advantageously be formed with only one or only a few contact elements, which can form a secure footing on the circuit carrier designed for surface soldering.
  • the connecting element is designed to hold the locking element in the release position in such a way that the locking element is connected to the holding body in a positively locking or additionally non-positive manner in a latching manner.
  • the locking element cannot cause any rattling noises in the release position.
  • the locking element is molded onto the connecting element and is connected by means of the connecting element by means of a predetermined separation point or predetermined breaking point.
  • the locking element can thus be detached from the connecting element at the predetermined separation point or predetermined breaking point by means of a pressing tool and moved into the locking position.
  • the locking element and the connecting element can be designed such that the locking element can latch in the release position in a detachable or non-detachable manner.
  • the locking element can be be held securely in the release position so that no rattling noises are caused.
  • the locking element is designed to be moved along a longitudinal extent of the connecting element running transversely to the contact plane, in particular the plane of the circuit carrier designed for surface soldering.
  • the locking element can thus be moved back and forth between the release position and/or the locking position by means of a pressing or punching tool.
  • the connecting element has an opening for engaging a joining aid, in particular a centering mandrel, which has an elongated opening shape, in particular an opening area.
  • the connecting element can be aligned in rotation around the longitudinal extent of the connecting element by means of the centering pin, so that the contact elements, in particular press-in contacts of the connecting element, are aligned with the openings in the circuit carrier to be connected.
  • the connecting element can thus easily be assembled with the further circuit carrier.
  • connection element can be rotated into the joining position in which the contact elements can be easily pressed in.
  • the connecting element has two spaced-apart, in particular circular or oval, openings for the engagement of two joining aids, in particular centering pins, which are arranged on the connecting element in such a way that the connecting element, when the further circuit carrier is joined, around a plane - in particular transversely to a circuit carrier plane running - longitudinal axis can be rotated.
  • the contact elements can be precisely aligned with corresponding openings in the further circuit carrier.
  • the invention also relates to a contact system with a locking element of the type described above.
  • the contact system comprises the connecting element and the two circuit carriers electrically and mechanically connected to one another by the connecting element, in particular a circuit carrier and a further circuit carrier.
  • the invention also relates to a control device for a motor vehicle, an inverter, a DC-DC converter or a charger with a contact system of the type described above.
  • the circuit carrier designed for surface soldering forms a power component, in particular an inverter, comprising semiconductor switch half bridges.
  • the further circuit carrier forms a control device for driving the inverter, in particular the semiconductor switch of the inverter.
  • Figure 1 shows a connecting element for electrically connecting a circuit carrier to a further circuit carrier, the connecting element having a holding body and contact elements held in this for electrically connecting the circuit carrier, and the contact elements are each designed for surface soldering with the circuit carrier and for press-in connection with the further circuit carrier ;
  • FIG. 2 shows the connecting element shown in FIG. 1 in a plan view
  • FIG. 3 shows a variant of a connecting element, in which a locking element encompassing a holding body of the connecting element can fix the contact elements and can support them against the circuit carrier.
  • FIG. 1 shows a connecting element for electrically connecting two circuit carriers.
  • the connecting element 1 has a holding body which is designed to hold at least one contact element, in this exemplary embodiment four contact elements, of which a contact element 3 and a contact element 4 are shown.
  • Each of the contact elements has a soldering foot for soldering to a circuit carrier 25 and a press-in contact for pressing into a further circuit carrier 20 .
  • the contact elements each have a connecting section which is designed to be resilient and which electrically connects the press-in section and the soldering foot to one another.
  • the contact element 3 has a press-in contact 5 and a soldering foot 7, the press-in contact 5 and the soldering foot 7 being electrically conductively connected to one another by means of the connecting section 9.
  • the press-in contact 4 has a press-in section 6 which is electrically connected to the soldering foot 8 by means of a connecting section 10 which is in particular designed to be resilient.
  • the press-in contacts 3 and 4 are designed, for example, as a stamped sheet metal part, in particular a stamped grid or leadframe.
  • the press-in contacts 5 and 6 are each designed to be pressed into an opening in the further circuit carrier, namely in the opening 21 or the opening 22 .
  • the additional circuit carrier 20 can thus be electrically connected to the circuit carrier 25 by means of the contact elements 3 and 4 .
  • the connecting element 1 is designed to be placed on the circuit carrier 25 .
  • the connecting element 1 is designed to be placed on the circuit carrier 25 with the soldering feet, in particular the soldering feet 7 and 8 .
  • An end area 39 of the holding body 2 is at a distance from the circuit carrier 25 .
  • the connecting element 1 has a locking element 13 which is designed to be moved from a locking position 13 ′ into a release position—indicated in particular by an arrow 41 .
  • the locking element 13 is formed in the locking position 13 'the To secure contact elements 3 and 4 in the area of the soldering foot, in particular the soldering foot 7 or the soldering foot 8, in a form-fitting manner, and to ensure that the press-in contacts 5 and 6 are caught in the respective opening in the additional circuit carrier 20.
  • the locking element 13 has at least one recess--in particular shown in FIG.
  • the locking element 13 has a separate recess for each projection area.
  • the locking element 13 is formed as a plate which runs all the way around the holding body 2, in particular in the form of a ring.
  • the locking element 13 is designed to be moved back and forth along a longitudinal extent 40 of the connecting element 1 , the longitudinal extent 40 running transversely to a flat extent, and thus corresponding to a surface normal, transversely to the circuit carrier 20 .
  • the connecting element 1 is designed to mechanically and electrically connect the circuit carriers, in particular the circuit carrier 25 and the further circuit carrier 20, to one another at a parallel distance from one another.
  • the circuit carrier 25 can, for example, be slightly bent, in particular bent convexly or concavely, or the press-in contacts have a lateral offset, caused for example by tolerances, with respect to the circuit carrier 20 .
  • the effect of this is that the connecting element 1 soldered to the circuit carrier 25 runs at a slight angle to the further circuit carrier 20, so that—as shown in FIG.
  • the further circuit carrier 20 has a joining aid opening 23 which is designed to accommodate a joining aid 18 .
  • the joining aid 18 is elongated and has a diameter and a cross-sectional shape which corresponds to the opening 23 in the further circuit carrier 20 .
  • the opening 23 is formed between the openings 21 and 22 for the press-in contacts 5 and 6, respectively.
  • the joining aid 18 has a tapered end section 19 which is tapered towards the end.
  • the tapered end section 19 which in this exemplary embodiment is designed in the shape of a pointed cone, can engage in a recess 17 formed in the holding body 2 with its cone tip.
  • the opening diameter of the recess 17 corresponds in particular to the diameter of the joining aid 18 on a longitudinal section of the joining aid 18 which adjoins the tapered end section 19 .
  • the joining aid 18 can pierce the recess 17 by pressing down the further circuit carrier 20, using a press-in shoulder 24 to support the further circuit carrier 20, and thus correct the holding body 2 of the connecting element 1 with regard to its orientation and position in relation to the further circuit carrier 20 that the press-in contacts 5 and 6 can enter the corresponding openings 21 and 22 in alignment when connecting the two circuit carriers.
  • the contact elements 3 and 4 can resiliently absorb the movement of the connecting element 1 generated in this way on the resiliently designed connecting sections 9 and 10, so that the soldered connection of the soldering feet 7 and 8 with the circuit carrier 25 cannot be detached in the process.
  • the connecting sections 9 and 10 are elongated and angled in this embodiment.
  • the connecting sections 9 and 10 can have at least one meandering loop, so that the contact elements 3 and 4 in the longitudinal extent 40 of the connecting element can resiliently compensate for the position correction carried out by means of the joining aid 18 .
  • the locking element 13 can be moved from the locking position 13' to the release position shown in Figure 1--as indicated by the arrow 41 be so that the connecting portions 9 and 10 can spring freely.
  • Figure 2 shows the connecting element 1 already shown in Figure 1 in a top view of the press-in contacts 5 and 6. Also visible is the opening 17 in the holding body 2, which is designed to have the joining aid 18 at least on a longitudinal section which is attached to the tapered end section 19 connects, form-fitting, especially form-fitting to record.
  • FIG. 2 also shows the T-shaped projection areas 11 and 12, which are each arranged in a corresponding recess 14 or 15 of the locking element 13 and are held there in a positive and/or non-positive manner.
  • the connecting element 1 has two further contact elements 16 and 26 which, like the contact elements 3 and 4, are held in the holding body 2 at least over a longitudinal section.
  • the contact elements can be embedded in the holding body 2, in particular injected, or inserted into the holding body 2 and latched there.
  • the contact elements 3, 4, 16 and 26 are arranged regularly in relation to one another, in particular in a rectangle, in a contact plane which extends transversely to the longitudinal extent 40 of the connecting element 1.
  • the connecting element 1 can thus be placed on the circuit carrier 25 with the soldering feet 7 and 8 of the contact elements 3 and 4, and with the soldering feet 28 and 29 of the contact elements 16 and 26, respectively, and stand securely there.
  • FIG. 2 also shows a variant of the connecting element 1 shown in FIG. a joining aid which is correspondingly oval, in particular elliptical, in the cross section of the oval opening 27 can engage in the oval, in particular elliptical opening 27 .
  • the position of the holding body 2 can also be corrected in the event of a rotational twist about the longitudinal extent 40 of the connecting element 1 by means of the joining aid with the elongated cross section such that the press-in contacts are exactly aligned with the corresponding openings in the further circuit carrier 20.
  • FIG. 3 shows an exemplary embodiment of a variant of the connecting element 1 shown in FIGS. 1 and 2.
  • FIG. 3 shows an exemplary embodiment of a variant of the connecting element 1 shown in FIGS. 1 and 2.
  • the connecting element 30 comprises a locking element 32 which encloses the holding body 31 at least along a peripheral section, in this exemplary embodiment in the form of a ring.
  • the connecting element 30 has only one contact element 34 , so that the connecting element 30 alone cannot stand on a circuit carrier 37 with a solder foot 35 molded onto the contact element 34 .
  • the locking element 32 can be held in a release position 32 'with a locking lug 38, which is formed on the holding body 31, positively and / or non-positively.
  • the locking element 32 can be moved from the release position 32' in the direction of the circuit carrier 37, so that a projection 36 formed on the contact element 34 can be held by the locking element 32 in a positive and/or non-positive manner in a corresponding recess of the locking element 32.
  • the locking element 32 has an additional supporting leg 33 which extends transversely to a flat extension of the locking element 32 and which can secure the connecting element 30 on the circuit carrier 37 .
  • the connecting element 30 has, for example, only one contact element, only two contact elements, or only three contact elements, so that with only one contact element or only two contact elements, the connecting element 30 does not stand alone the circuit carrier 37 can be secured.
  • the locking element 32 can remain on the circuit carrier 37 in order to secure mechanical relief of the soldered connection between the soldering foot 35 and the circuit carrier 37, or for the contact element 34 to spring completely freely again into the release position 32'. be moved back.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Metallurgy (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un élément de connexion (1) pour la connexion électrique d'un support de circuit (25) à un autre support de circuit (20). L'élément de connexion (1) présente au moins une connexion par brasure (7, 8, 28, 29) pour le brasage sur la surface du support de circuit (25) et une broche de connexion, qui est électriquement connectée à la connexion par brasure (7, 8, 28, 29), pour l'insertion dans l'autre support de circuit (20). Selon l'invention, l'élément de connexion (1) présente un corps de maintien (2), en particulier un corps en matière plastique (2), et un élément de contact (3, 4, 16, 26, 34) qui est connecté au corps de maintien (2) et qui est conçu pour être élastique. L'élément de contact (3, 4, 16, 26, 34) présente une section d'extrémité, ladite connexion par brasure étant formée sur la section d'extrémité. L'élément de connexion (1) présente un élément de verrouillage qui est connecté de manière mobile à l'élément de connexion (1) entre une position de verrouillage et une position de libération. L'élément de verrouillage est conçu pour limiter le déplacement de l'élément de contact (3, 4, 16, 26, 34) dans la position de verrouillage et libérer un mouvement élastique de l'élément de contact (3, 4, 16, 26, 34) dans la position de libération.
EP21777488.4A 2020-10-14 2021-09-13 Élément de connexion pour la connexion électrique de deux supports de circuit Pending EP4230006A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020212934.7A DE102020212934A1 (de) 2020-10-14 2020-10-14 Verbindungselement zum elektrischen Verbinden von zwei Schaltungsträgern
PCT/EP2021/075098 WO2022078683A1 (fr) 2020-10-14 2021-09-13 Élément de connexion pour la connexion électrique de deux supports de circuit

Publications (1)

Publication Number Publication Date
EP4230006A1 true EP4230006A1 (fr) 2023-08-23

Family

ID=77913108

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21777488.4A Pending EP4230006A1 (fr) 2020-10-14 2021-09-13 Élément de connexion pour la connexion électrique de deux supports de circuit

Country Status (7)

Country Link
US (1) US20230380064A1 (fr)
EP (1) EP4230006A1 (fr)
JP (1) JP2023545173A (fr)
KR (1) KR20230084558A (fr)
CN (1) CN116326222A (fr)
DE (1) DE102020212934A1 (fr)
WO (1) WO2022078683A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004041207A1 (de) * 2004-08-25 2006-03-30 Siemens Ag Vorrichtung zur Verbindung von Leiterplatten
DE112012002122B4 (de) * 2011-05-17 2020-11-26 Interplex Industries, Inc. Inter-Platten-Verbindungssystem mit Deformationsvermeidung nachgiebiger flexibler Pins
DE102014109220A1 (de) 2014-07-01 2016-01-07 Endress + Hauser Gmbh + Co. Kg Leiterplattenverbindungselement
EP3404774B1 (fr) * 2017-05-17 2021-10-06 Infineon Technologies AG Procédé de connexion électrique d'un module électronique et ensemble électronique

Also Published As

Publication number Publication date
KR20230084558A (ko) 2023-06-13
CN116326222A (zh) 2023-06-23
US20230380064A1 (en) 2023-11-23
WO2022078683A1 (fr) 2022-04-21
DE102020212934A1 (de) 2022-04-14
JP2023545173A (ja) 2023-10-26

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