EP4211994A1 - Wireless module and combination of wireless module and circuit board - Google Patents

Wireless module and combination of wireless module and circuit board

Info

Publication number
EP4211994A1
EP4211994A1 EP21801859.6A EP21801859A EP4211994A1 EP 4211994 A1 EP4211994 A1 EP 4211994A1 EP 21801859 A EP21801859 A EP 21801859A EP 4211994 A1 EP4211994 A1 EP 4211994A1
Authority
EP
European Patent Office
Prior art keywords
wireless module
terminals
bottom side
periphery
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21801859.6A
Other languages
German (de)
French (fr)
Inventor
Frank Lochmann
Markus SCHERTLER
Markus Mayrhofer
Lukas Simma
Thomas Zengerle
Patrick Schnell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tridonic GmbH and Co KG
Original Assignee
Tridonic GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic GmbH and Co KG filed Critical Tridonic GmbH and Co KG
Publication of EP4211994A1 publication Critical patent/EP4211994A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/045—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor receiving a signal from a remote controller
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/327—Multiple die-attach connectors having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H10W72/348—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to wireless modules for lighting applications, and in particular to such wireless modules in combination with various types of circuit boards.
  • Terminals of known wireless modules are typically arranged at side edges of the wireless modules. Since overall dimensions of wireless modules and thus dimensions of the side edges are constantly shrinking, there is no longer sufficient base available for arrangement of all required terminals. This issue is worsening if one wireless module shall be used in different applications requiring different terminal counts.
  • the object of the present application is to provide wireless modules which may be deployed in combination with various types of circuit boards.
  • a wireless module for a lighting technology device comprises terminals being arranged on a bottom side opposing a component side of the wireless module.
  • the terminals have a plurality of footprints.
  • the respective footprint is a surface area requirement on the bottom side of the wireless module.
  • a footprint of each of the terminals off a periphery of the bottom side is less than or equal to a footprint of each of the terminals in the periphery of the bottom side.
  • the terminals in the periphery are configured for connectivity to one or more outer conductor layers of a circuit board connectable to the wireless module.
  • the terminals off the periphery are configured for connectivity to one or more inner conductor layers of the circuit board connectable to the wireless module.
  • the terminals in the periphery are configured for use in combination with the terminals off the periphery.
  • the periphery comprises an all-around circumferential portion of the bottom side within a predetermined clearance to side edges thereof.
  • the lighting technology device comprises a driver of a luminaire, or a sensor.
  • the wireless module comprises a wireless chip, a wireless integrated circuit or a wireless system-on-chip.
  • the wireless module comprises a circuit board forming the bottom side.
  • the terminals comprise pads or pins.
  • a combination of a wireless module according to the first aspect and a single-layer circuit board is provided.
  • a combination of a wireless module according to the first aspect and a multi-layer circuit board is provided.
  • a lighting technology device comprises a combination according to the second or third aspects.
  • the present disclosure provides a wireless module which, by virtue of its terminal arrangement, avoids a lack of sufficient base available for arrangement of all required terminals of a particular application. More specifically, the terminal arrangement extensively occupies the bottom side of the wireless module by arranging terminals having a specific footprint for single-layer circuit board applications at the side edges of the bottom side, i.e., in a periphery of the bottom side, and arranging terminals having smaller or equal footprints for multi-layer circuit board applications off the periphery of the bottom side. Terminals of same or different footprint may be used in various combinations to enable different applications requiring different terminal counts. Further aspects, advantages and objects of the invention will become evident for the skilled reader by means of the following detailed description of the embodiments of the invention, when taking into conjunction with the figures of the enclosed drawings.
  • Fig. i illustrates a bottom side of a wireless module according to an embodiment of the present disclosure
  • Fig. 2 illustrates an exploded view of a combination according to an embodiment of the present disclosure of a wireless module and a single-layer circuit board;
  • Fig. 3 illustrates an exploded view of a combination according to an embodiment of the present disclosure of a wireless module and a dual-layer circuit board;
  • Fig. 4 illustrates an exploded view of a combination according to an embodiment of the present disclosure of a wireless module and a multi-layer circuit board
  • Fig. 5 illustrates a schematic view of a lighting technology device according to an embodiment of the present disclosure comprising a combination according to an embodiment of the present disclosure.
  • Fig. i illustrates a bottom side too of a wireless module i according to an embodiment of the present disclosure.
  • the bottom side too opposes a component side of the wireless module i.
  • the wireless module i may comprise a circuit board forming the bottom side too.
  • component side and “bottom side” may refer to a respective one of two flat faces of a same circuit board facing away from each other.
  • Circuit components of the wireless module i are arranged on the component side, and terminals are arranged on the bottom side 100 opposing the component side.
  • the wireless module 1 may comprise a wireless chip, a wireless integrated circuit or a wireless system-on-chip.
  • chip or “die” may refer to a flat piece of processed single crystal semiconductor material comprising electronic circuits. Some of its die area may be dedicated for connecting terminals.
  • integrated circuit may refer to the electronic circuits being integrated/processed into the aforementioned chip.
  • a monolithic integrated circuit comprises the electronic circuits on a single chip.
  • a hybrid integrated circuit combines multiple chips each comprising a portion of the electronic circuits. Integrated circuits may be enclosed in a package with connecting terminals.
  • system-on-chip may refer to an integrated circuit comprising all or most components of an electronic system, such as a wireless module i.
  • the wireless module 1 is suitable for a lighting technology device 5.
  • the lighting technology device 5 may comprise a driver of a luminaire, or a sensor.
  • the wireless module 1 comprises terminals 102, 104, 106, 108 being arranged on the bottom side too.
  • the terminals 102, 104, 106, 108 may comprise pads or pins.
  • the terminals 102, 104, 106, 108 comprise pads, i.e., solderable pads.
  • the terminals 102, 104, 106, 108 have a plurality of footprints.
  • the term “footprint” may refer to a surface area requirement on a flat face, and in particular to such a requirement of a terminal 102, 104, 106, 108 on the bottom side too of the wireless module 1.
  • the embodiment of Fig. 1 shows terminals 102, 104 having a first footprint, and terminals 106, 108 having a second footprint different from the first footprint.
  • the terminals 102, 104, 106, 108 may have more than two different footprints.
  • a triplet of terminals designated as 102 (indicated by light dot pattern) are arranged at first to third side edges of the bottom side 100, and a triplet of terminals designated as 104 (indicated by dark dot pattern) is arranged at a fourth side edge thereof.
  • the terminals 102, 104 having the first footprint are arranged in a periphery of the bottom side 100.
  • the periphery may comprise an all-around circumferential portion of the bottom side 100 within a predetermined clearance to side edges thereof.
  • the predetermined clearance to the side edges of the bottom side 100 may be dimensioned such that the periphery accommodates the terminals 102, 104 only.
  • the terminals 102, 104 in the periphery may be configured for connectivity to one or more outer conductor layers of a circuit board 200; 300; 400 connectable to the wireless module 1.
  • the terminals designated as 102 may be used for programming, communication (e.g., Digital Addressable Lighting Interface / DALI, serial) and/or powering purposes, for example.
  • the terminals designated as 104 may be used for connecting to an optional external antenna.
  • a pair of terminals 106 (indicated by closely striped pattern) having the first footprint and two sextets of terminals 108 (indicated by loosely striped pattern) having the second footprint are arranged on the bottom side too in between the terminals 102, 104. That is to say, the terminals 106, 108 having the first and second footprints are arranged off the periphery of the bottom side too.
  • the terminals 106, 108 off the periphery may be configured for connectivity to one or more inner conductor layers of the circuit board 400 connectable to the wireless module 1.
  • the terminals designated as 106 may be used e.g. for additional switching in combination with multi-layer circuit board 300, and the terminals designated as 108 may be used e.g. for wireless sensors in combination with multi-layer circuit boards 400, as will be explained in more detail in connection with Figs. 3 and 4.
  • the footprint of each of the terminals 106, 108 off the periphery of the bottom side 100 is less than or equal to the footprint of each of the terminals 102, 104 in the periphery of the bottom side 100.
  • the terminals 102, 104 in the periphery may be configured for use in combination with the terminals 106, 108 off the periphery, as will become more apparent in connection with Figs. 3 and 4-
  • Fig. 2 illustrates an exploded view of a combination 2 according to an embodiment of the present disclosure of a wireless module 1 and a single-layer circuit board 200.
  • FIG. 2 An upper part of Fig. 2 shows the wireless module 1 comprising the bottom side too and the terminals 102, 104, 106, 108, as previously described.
  • FIG. 2 A lower part of Fig. 2 represents the single-layer circuit board 200.
  • the terminals 106, 108 off the periphery of the bottom side too are not used, and the terminals 102, 104 in the periphery may be configured for connectivity to one or more outer conductor layers of a circuit board 200; 300; 400 connectable to the wireless module 1.
  • the circuit board 200 may as well be substituted by a dual-layer circuit board 300 or a multilayer circuit board 400 having more than two conductor layers, as each of these circuit boards 200; 300; 400 comprises one or more outer conductor layers.
  • a central part of Fig. 2 indicates solder material 202, 204 used to electrically interconnect the terminals 102, 104 in the periphery of the bottom side too of the wireless module 1 and corresponding contact areas of the single-layer circuit board 200. Dotted lines indicate these contact areas as projections of respective pairs of terminals 102, 104 and solder material 202, 204 onto a flat side of the single-layer circuit board 200.
  • This embodiment enables using the wireless module 1 in a low-cost application requiring only 9 (or 12) terminals, depending on a deployment of the optional external antenna.
  • Fig. 3 illustrates an exploded view of a combination 3 according to an embodiment of the present disclosure of a wireless module 1 and a dual-layer circuit board 300.
  • FIG. 3 shows the wireless module 1 comprising the bottom side too and the terminals 102, 104, 106, 108, as previously described.
  • FIG. 3 A lower part of Fig. 3 represents the dual-layer circuit board 300.
  • the terminals 102, 104 in the periphery may be configured for use in combination with the terminals 106 off the periphery, while the terminals 108 off the periphery of the bottom side too are not used.
  • a central part of Fig. 3 indicates additional solder material 206 used to electrically interconnect the terminals 106 off the periphery of the bottom side too of the wireless module 1 and corresponding contact areas of the dual-layer circuit board 300. Dotted lines indicate these contact areas as projections of respective pairs of terminals 106 and solder material 206 onto a flat side of the dual -layer circuit board 300.
  • This embodiment enables re-using the wireless module 1 described in Figs. 1 - 2 in a further low- cost application requiring only 11 (or 14) terminals, depending on a deployment of the optional external antenna.
  • this may be an application involving a wireless-enabled driver of a luminaire.
  • Fig. 4 illustrates an exploded view of a combination 4 according to an embodiment of the present disclosure of a wireless module 1 and a multi-layer circuit board 400.
  • An upper part of Fig. 4 shows the wireless module 1 comprising the bottom side 100 and the terminals 102, 104, 106, 108, as previously described.
  • a lower part of Fig. 4 represents the multi-layer circuit board 400 having more than two conductor layers (i.e. , having one or more inner conductor layers).
  • the terminals 102, 104 in the periphery may be configured for use in combination with the terminals 106, 108 off the periphery. More specifically, all terminals 102, 104, 106, 108 are used, and the terminals 108 off the periphery may be configured for connectivity to the one or more inner conductor layers of the multi-layer circuit board 400 connectable to the wireless module 1.
  • a central part of Fig. 4 indicates additional solder material 208 used to electrically interconnect the terminals 108 off the periphery of the bottom side 100 of the wireless module 1 and corresponding contact areas of the multi-layer circuit board 400. Dotted lines indicate these contact areas as projections of respective pairs of terminals 108 and solder material 208 onto a flat side of the multi-layer circuit board 400.
  • This embodiment enables re-using the wireless module 1 described in Figs. 1 - 3 in a further application requiring 23 (or 26) terminals, depending on a deployment of the optional external antenna.
  • this may be an application involving a wireless sensor in combination with the multi-layer circuit board 400.
  • Fig. 5 illustrates a schematic view of a lighting technology device 5 according to an embodiment of the present disclosure comprising a combination 2; 3; 4 according to an embodiment of the present disclosure.
  • the lighting technology device 5 may comprise a driver of a luminaire, or a sensor.
  • the combination 2; 3; 4 is explained in connection with Figs. 2 - 4 above.
  • the combination 2; 3; 4 comprises a wireless module 1 as explained in connection with Fig, 1 and a corresponding circuit board 200; 300; 400.
  • the technical effects and advantages mentioned in connection with the wireless module i and the combination 2; 3; 4 also apply for the lighting technology device 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

A wireless module (1) for a lighting technology device is provided. The module comprises terminals (102, 104, 106, 108) being arranged on a bottom side (100) opposing a component side of the wireless module (1). The terminals (102, 104, 106, 108) have a plurality of footprints. The respective footprint is a surface area requirement on the bottom side (100) of the wireless module (1). A footprint of each of the terminals (106, 108) off a periphery of the bottom side (100) is less than or equal to a footprint of each of the terminals (102, 104) in the periphery of the bottom side (100). Further, combinations of a wireless module (1) and a circuit board are provided, as well as a lighting technology device comprising such a combination.

Description

Wireless module and combination of wireless module and circuit board
The present disclosure relates to wireless modules for lighting applications, and in particular to such wireless modules in combination with various types of circuit boards.
Terminals of known wireless modules are typically arranged at side edges of the wireless modules. Since overall dimensions of wireless modules and thus dimensions of the side edges are constantly shrinking, there is no longer sufficient base available for arrangement of all required terminals. This issue is worsening if one wireless module shall be used in different applications requiring different terminal counts.
Accordingly, the object of the present application is to provide wireless modules which may be deployed in combination with various types of circuit boards.
The invention is defined by the appended independent claims. Preferred embodiments are set forth in the dependent claims and in the following description and drawings.
According to a first aspect, a wireless module for a lighting technology device comprises terminals being arranged on a bottom side opposing a component side of the wireless module. The terminals have a plurality of footprints. The respective footprint is a surface area requirement on the bottom side of the wireless module. A footprint of each of the terminals off a periphery of the bottom side is less than or equal to a footprint of each of the terminals in the periphery of the bottom side.
Preferably, the terminals in the periphery are configured for connectivity to one or more outer conductor layers of a circuit board connectable to the wireless module.
Preferably, the terminals off the periphery are configured for connectivity to one or more inner conductor layers of the circuit board connectable to the wireless module.
Preferably, the terminals in the periphery are configured for use in combination with the terminals off the periphery. Preferably, the periphery comprises an all-around circumferential portion of the bottom side within a predetermined clearance to side edges thereof.
Preferably, the lighting technology device comprises a driver of a luminaire, or a sensor.
Preferably, the wireless module comprises a wireless chip, a wireless integrated circuit or a wireless system-on-chip.
Preferably, the wireless module comprises a circuit board forming the bottom side.
Preferably, the terminals comprise pads or pins.
According to a second aspect, a combination of a wireless module according to the first aspect and a single-layer circuit board is provided.
According to a third aspect, a combination of a wireless module according to the first aspect and a multi-layer circuit board is provided.
According to a fourth aspect, a lighting technology device comprises a combination according to the second or third aspects.
The present disclosure provides a wireless module which, by virtue of its terminal arrangement, avoids a lack of sufficient base available for arrangement of all required terminals of a particular application. More specifically, the terminal arrangement extensively occupies the bottom side of the wireless module by arranging terminals having a specific footprint for single-layer circuit board applications at the side edges of the bottom side, i.e., in a periphery of the bottom side, and arranging terminals having smaller or equal footprints for multi-layer circuit board applications off the periphery of the bottom side. Terminals of same or different footprint may be used in various combinations to enable different applications requiring different terminal counts. Further aspects, advantages and objects of the invention will become evident for the skilled reader by means of the following detailed description of the embodiments of the invention, when taking into conjunction with the figures of the enclosed drawings.
Fig. i illustrates a bottom side of a wireless module according to an embodiment of the present disclosure;
Fig. 2 illustrates an exploded view of a combination according to an embodiment of the present disclosure of a wireless module and a single-layer circuit board;
Fig. 3 illustrates an exploded view of a combination according to an embodiment of the present disclosure of a wireless module and a dual-layer circuit board;
Fig. 4 illustrates an exploded view of a combination according to an embodiment of the present disclosure of a wireless module and a multi-layer circuit board;
Fig. 5 illustrates a schematic view of a lighting technology device according to an embodiment of the present disclosure comprising a combination according to an embodiment of the present disclosure.
The invention will now be described with respect to various embodiments. The features of these embodiments may be combined with each other unless specified otherwise. The same or similar reference numerals designate the same or similar elements throughout the drawings.
Fig. i illustrates a bottom side too of a wireless module i according to an embodiment of the present disclosure.
The bottom side too opposes a component side of the wireless module i. The wireless module i may comprise a circuit board forming the bottom side too.
As used herein, the terms “component side” and “bottom side” may refer to a respective one of two flat faces of a same circuit board facing away from each other. Circuit components of the wireless module i are arranged on the component side, and terminals are arranged on the bottom side 100 opposing the component side.
The wireless module 1 may comprise a wireless chip, a wireless integrated circuit or a wireless system-on-chip.
As used herein, the term “chip” or “die” may refer to a flat piece of processed single crystal semiconductor material comprising electronic circuits. Some of its die area may be dedicated for connecting terminals.
As used herein, the term “integrated circuit” may refer to the electronic circuits being integrated/processed into the aforementioned chip. A monolithic integrated circuit comprises the electronic circuits on a single chip. A hybrid integrated circuit combines multiple chips each comprising a portion of the electronic circuits. Integrated circuits may be enclosed in a package with connecting terminals.
As used herein, the term “system-on-chip” may refer to an integrated circuit comprising all or most components of an electronic system, such as a wireless module i.
The wireless module 1 is suitable for a lighting technology device 5. The lighting technology device 5 may comprise a driver of a luminaire, or a sensor.
The wireless module 1 comprises terminals 102, 104, 106, 108 being arranged on the bottom side too. The terminals 102, 104, 106, 108 may comprise pads or pins. In Fig. 1, the terminals 102, 104, 106, 108 comprise pads, i.e., solderable pads.
As maybe taken from Fig. 1, the terminals 102, 104, 106, 108 have a plurality of footprints.
As used herein, the term “footprint” may refer to a surface area requirement on a flat face, and in particular to such a requirement of a terminal 102, 104, 106, 108 on the bottom side too of the wireless module 1. The embodiment of Fig. 1 shows terminals 102, 104 having a first footprint, and terminals 106, 108 having a second footprint different from the first footprint. In other examples, the terminals 102, 104, 106, 108 may have more than two different footprints.
In the example of Fig. 1, three triplets of terminals designated as 102 (indicated by light dot pattern) are arranged at first to third side edges of the bottom side 100, and a triplet of terminals designated as 104 (indicated by dark dot pattern) is arranged at a fourth side edge thereof. In other words, the terminals 102, 104 having the first footprint are arranged in a periphery of the bottom side 100.
The periphery may comprise an all-around circumferential portion of the bottom side 100 within a predetermined clearance to side edges thereof. For example, the predetermined clearance to the side edges of the bottom side 100 may be dimensioned such that the periphery accommodates the terminals 102, 104 only.
The terminals 102, 104 in the periphery may be configured for connectivity to one or more outer conductor layers of a circuit board 200; 300; 400 connectable to the wireless module 1.
The terminals designated as 102 may be used for programming, communication (e.g., Digital Addressable Lighting Interface / DALI, serial) and/or powering purposes, for example.
The terminals designated as 104 may be used for connecting to an optional external antenna.
With continuing reference to the example of Fig. 1, a pair of terminals 106 (indicated by closely striped pattern) having the first footprint and two sextets of terminals 108 (indicated by loosely striped pattern) having the second footprint are arranged on the bottom side too in between the terminals 102, 104. That is to say, the terminals 106, 108 having the first and second footprints are arranged off the periphery of the bottom side too.
The terminals 106, 108 off the periphery may be configured for connectivity to one or more inner conductor layers of the circuit board 400 connectable to the wireless module 1.
More specifically, the terminals designated as 106 may be used e.g. for additional switching in combination with multi-layer circuit board 300, and the terminals designated as 108 may be used e.g. for wireless sensors in combination with multi-layer circuit boards 400, as will be explained in more detail in connection with Figs. 3 and 4.
Still referencing Fig. 1, it is shown that the footprint of each of the terminals 106, 108 off the periphery of the bottom side 100 is less than or equal to the footprint of each of the terminals 102, 104 in the periphery of the bottom side 100.
This enables having more terminals on the bottom side 100 of the wireless module 1, by arranging additional terminals 106, 108 off the periphery of the bottom side 100, and by providing terminals 108 having a footprint that is less than the footprint of each of the terminals 102, 104 in the periphery of the bottom side 100.
The terminals 102, 104 in the periphery may be configured for use in combination with the terminals 106, 108 off the periphery, as will become more apparent in connection with Figs. 3 and 4-
Fig. 2 illustrates an exploded view of a combination 2 according to an embodiment of the present disclosure of a wireless module 1 and a single-layer circuit board 200.
An upper part of Fig. 2 shows the wireless module 1 comprising the bottom side too and the terminals 102, 104, 106, 108, as previously described.
A lower part of Fig. 2 represents the single-layer circuit board 200.
In this embodiment, the terminals 106, 108 off the periphery of the bottom side too are not used, and the terminals 102, 104 in the periphery may be configured for connectivity to one or more outer conductor layers of a circuit board 200; 300; 400 connectable to the wireless module 1. As such, the circuit board 200 may as well be substituted by a dual-layer circuit board 300 or a multilayer circuit board 400 having more than two conductor layers, as each of these circuit boards 200; 300; 400 comprises one or more outer conductor layers.
A central part of Fig. 2 indicates solder material 202, 204 used to electrically interconnect the terminals 102, 104 in the periphery of the bottom side too of the wireless module 1 and corresponding contact areas of the single-layer circuit board 200. Dotted lines indicate these contact areas as projections of respective pairs of terminals 102, 104 and solder material 202, 204 onto a flat side of the single-layer circuit board 200.
This embodiment enables using the wireless module 1 in a low-cost application requiring only 9 (or 12) terminals, depending on a deployment of the optional external antenna.
Fig. 3 illustrates an exploded view of a combination 3 according to an embodiment of the present disclosure of a wireless module 1 and a dual-layer circuit board 300.
An upper part of Fig. 3 shows the wireless module 1 comprising the bottom side too and the terminals 102, 104, 106, 108, as previously described.
A lower part of Fig. 3 represents the dual-layer circuit board 300.
In this embodiment, the terminals 102, 104 in the periphery may be configured for use in combination with the terminals 106 off the periphery, while the terminals 108 off the periphery of the bottom side too are not used.
With respect to Fig. 2, a central part of Fig. 3 indicates additional solder material 206 used to electrically interconnect the terminals 106 off the periphery of the bottom side too of the wireless module 1 and corresponding contact areas of the dual-layer circuit board 300. Dotted lines indicate these contact areas as projections of respective pairs of terminals 106 and solder material 206 onto a flat side of the dual -layer circuit board 300.
This embodiment enables re-using the wireless module 1 described in Figs. 1 - 2 in a further low- cost application requiring only 11 (or 14) terminals, depending on a deployment of the optional external antenna. For example, this may be an application involving a wireless-enabled driver of a luminaire.
Fig. 4 illustrates an exploded view of a combination 4 according to an embodiment of the present disclosure of a wireless module 1 and a multi-layer circuit board 400. An upper part of Fig. 4 shows the wireless module 1 comprising the bottom side 100 and the terminals 102, 104, 106, 108, as previously described.
A lower part of Fig. 4 represents the multi-layer circuit board 400 having more than two conductor layers (i.e. , having one or more inner conductor layers).
In this embodiment, the terminals 102, 104 in the periphery may be configured for use in combination with the terminals 106, 108 off the periphery. More specifically, all terminals 102, 104, 106, 108 are used, and the terminals 108 off the periphery may be configured for connectivity to the one or more inner conductor layers of the multi-layer circuit board 400 connectable to the wireless module 1.
With respect to Fig. 3, a central part of Fig. 4 indicates additional solder material 208 used to electrically interconnect the terminals 108 off the periphery of the bottom side 100 of the wireless module 1 and corresponding contact areas of the multi-layer circuit board 400. Dotted lines indicate these contact areas as projections of respective pairs of terminals 108 and solder material 208 onto a flat side of the multi-layer circuit board 400.
This embodiment enables re-using the wireless module 1 described in Figs. 1 - 3 in a further application requiring 23 (or 26) terminals, depending on a deployment of the optional external antenna. For example, this may be an application involving a wireless sensor in combination with the multi-layer circuit board 400.
Fig. 5 illustrates a schematic view of a lighting technology device 5 according to an embodiment of the present disclosure comprising a combination 2; 3; 4 according to an embodiment of the present disclosure.
The lighting technology device 5 may comprise a driver of a luminaire, or a sensor.
The combination 2; 3; 4 is explained in connection with Figs. 2 - 4 above. In turn, the combination 2; 3; 4 comprises a wireless module 1 as explained in connection with Fig, 1 and a corresponding circuit board 200; 300; 400. As such, the technical effects and advantages mentioned in connection with the wireless module i and the combination 2; 3; 4 also apply for the lighting technology device 5.

Claims

Claims
1. A wireless module (1) for a lighting technology device (5), comprising terminals (102, 104, 106, 108) being arranged on a bottom side (100) opposing a component side of the wireless module (1); the terminals (102, 104, 106, 108) having a plurality of footprints, the respective footprint being a surface area requirement on the bottom side (100) of the wireless module (1); a footprint of each of the terminals (106, 108) off a periphery of the bottom side (100) is less than or equal to a footprint of each of the terminals (102, 104) in the periphery of the bottom side (100).
2. The wireless module (1) of claim 1, wherein the terminals (102, 104) in the periphery are configured for connectivity to one or more outer conductor layers of a circuit board (200; 300; 400) connectable to the wireless module (1).
3. The wireless module (1) of claim 2, wherein the terminals (106, 108) off the periphery are configured for connectivity to one or more inner conductor layers of the circuit board (400) connectable to the wireless module (1).
4. The wireless module (1) of any of the preceding claims, wherein the terminals (102, 104) in the periphery are configured for use in combination with the terminals (106, 108) off the periphery.
5. The wireless module (1) of any of the preceding claims, wherein the periphery comprises an all-around circumferential portion of the bottom side (too) within a predetermined clearance to side edges thereof.
6. The wireless module (1) of any of the preceding claims, wherein the lighting technology device (5) comprises a driver of a luminaire, or a sensor.
7. The wireless module (1) of any of the preceding claims, wherein the wireless module (1) comprises a wireless chip, a wireless integrated circuit or a wireless system-on-chip.
8. The wireless module (1) of any of the preceding claims, wherein the wireless module (i) comprises a circuit board forming the bottom side (100).
9. The wireless module (1) of any of the preceding claims, wherein the terminals (102, 104, 106, 108) comprise pads or pins.
10. A combination (2) of a wireless module (1) according to any of claims 1 to 9 and a singlelayer circuit board (200).
11. A combination (3; 4) of a wireless module (1) according to any of claims 1 to 9 and a multi- layer circuit board (300; 400).
12. A lighting technology device (5) comprising a combination (2; 3; 4) according to claim 10 or claim 11.
EP21801859.6A 2020-10-28 2021-10-26 Wireless module and combination of wireless module and circuit board Pending EP4211994A1 (en)

Applications Claiming Priority (2)

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EP20204233.9A EP3993572A1 (en) 2020-10-28 2020-10-28 Wireless module and combination of wireless module and circuit board
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JP3846611B2 (en) * 1998-09-25 2006-11-15 ソニー株式会社 Mounting semiconductor component, mounting structure and mounting method
JP2005101031A (en) * 2003-09-22 2005-04-14 Rohm Co Ltd Semiconductor integrated circuit device and electronic apparatus
WO2011013508A1 (en) * 2009-07-28 2011-02-03 株式会社 村田製作所 Electronic component
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