EP4202296A1 - Cooling device for a heat source and heat source assembly - Google Patents

Abstract

Cooling device (3) for a heat source (2), having a heat sink (4), a heat-conducting support body (5), at least one heat pipe (6) extending along a longitudinal axis (L), a first section (8) of the heat pipe ( 6) is thermally conductively connected to the carrier body (5) and a second section (9) of the heat pipe (6) spaced apart from the first section (8) is connected to the heat sink (4), and at least one between the carrier body (5) and at least one of the heat pipes (6), which is area-wise connected to the at least one heat pipe (6) so that it cannot rotate, and which is area-wise connected area-wise to the carrier body (5), so that the carrier body (5) relative to the at least one heat transfer plate (11) is rotatable about at least one axis of rotation (R₁, R₂, R₃).

Description

The invention relates to a cooling device for a heat source, having a heat sink, a carrier body for the heat source and at least one heat pipe, according to the preamble of claim 1.

The invention also relates to a heat source arrangement made up of the cooling device and the heat source.

A large number of different heat or heat sources are known from which useful heat and/or waste heat is emitted to the environment, such as heating sources, light sources, energy converters, voltage and/or current converters or aggregates, to name just a few examples. There is often a need to dissipate the heat from the heat source in a defined manner in order to cool the heat source and thus in particular to prevent the heat source or adjacent components from overheating.

For example, in the case of a light source or an illuminant/lighting fixture, sufficient cooling is often necessary to ensure high light output over a long period of time. The waste heat generated during the operation of the light sources must be effectively dissipated from the point of origin and finally released into the environment in a controlled manner.

For effective and controlled dissipation of heat from a heat source, it is known to fasten the heat source to a thermally conductive carrier body in a thermally conductive manner and to arrange a so-called heat pipe, i.e. a heat pipe, between the carrier body and a heat sink serving as a heat sink. A heat pipe is known to be a heat exchanger that enables a high heat flow density using the enthalpy of vaporization of a medium, whereby large amounts of heat can be transported extremely flexibly between at least two locations on a small cross-sectional area and due to the tubular, elongated shape. A corresponding arrangement is, for example, in DE 20 2008 010 175 U1 described for a signal lamp and its circuit arrangement.

However, there is a problem with heat dissipation if the heat source is to be able to move relative to its surroundings, ie it is to be able to be twisted or tilted, for example. Such a requirement regularly exists for light sources or illuminants. In order to maintain good heat dissipation, the light sources are usually rigid with the Heat conductors / heat sinks connected, which is why the entire arrangement, which is usually heavy and bulky due to the heat sink, has to be moved. The technical requirements, in particular for fixing such an arrangement in a tilted state, are extremely high.

To solve this problem, in the US 2006 / 044 804 A1 proposed to movably connect the carrier body of a light source to a heat pipe by forming a joint between the carrier body and the heat pipe. Depending on the configuration of the joint, rotation of the carrier body with the light source attached to it is possible by up to three orthogonal axes of rotation or rotational degrees of freedom, with the remaining arrangement, in particular the heat pipe and the heat sink, remaining immobile.

However, it has been shown that the formation of an articulated connection between the carrier body and the heat pipe is demanding and expensive to manufacture and, in particular, can result in a high susceptibility to wear and thus generally a short service life of the cooling device. When aligning the illuminant or the carrier body, there is sometimes also the risk with this solution of plastically deforming the sensitive heat pipe and damaging it mechanically in the process. Fixing the support body in the aligned position is sometimes difficult: if the joint is designed to be too stiff, the mechanical load on the heat pipe increases when the joint is actuated; If the joint is designed to be too easy to move, the fixation in the intended position is sometimes not sufficient.

There is therefore a need to further improve the known cooling devices.

In view of the known state of the art, the object of the present invention is to provide a cooling device for a heat source, in particular a cooling device for a light source, which allows good heat dissipation of the heat generated by the heat source and at the same time flexible rotatability of the heat source, preferably with low susceptibility to wear.

The present invention is also based on the object of providing a heat source arrangement with a heat source and a cooling device for the heat source, in which good heat dissipation of the heat generated by the heat source and at the same time flexible rotatability of the heat source are made possible, preferably with low susceptibility to wear.

The object is achieved for the cooling device with the features listed in claim 1. With regard to the heat source arrangement, the object is achieved by the features of the claim 15 solved. The dependent claims and the features described below relate to advantageous embodiments and variants of the invention.

A cooling device for a heat source is proposed.

The cooling device is preferably a passive cooling device, i. H. it dissipates the heat from the heat source without active components such as fans, pumps or other components to be supplied with electrical energy. In principle, however, active components can also be provided in order to further optimize the heat dissipation.

According to the invention, the cooling device has a heat sink.

The heat sink can give off the heat from the heat source to the environment, for example to a fluid surrounding the heat sink (including room air and/or a coolant) in a defined manner by thermal radiation and convection. With the heat sink, the functionally available surface for heat dissipation can be specified or increased in a defined manner.

At this point it should be mentioned that within the scope of the invention, a “heat sink” can basically be understood to mean any desired heat sink within the cooling device, which also goes beyond the conventional definition of a heat sink. It is essential that the heat sink is able to adequately dissipate the heat supplied to it via the heat pipes mentioned below or to release it in some other way.

The heat sink is preferably formed from a material with a thermal conductivity suitable for functional heat conduction.

Insofar as the present description speaks of a "material with a thermal conductivity suitable for functional heat conduction" (e.g. in connection with the heat sink, the carrier body mentioned below, the heat transfer plate mentioned below or another component), this includes in particular a To understand material that the professional would use for heat conduction as opposed to a material that the professional would use for thermal insulation.

A material suitable for functional heat conduction can have the thermal conductivity of a metal, for example.

A material suitable for functional heat conduction can preferably have a thermal conductivity of at least 10 watts per meter and Kelvin, more preferably a thermal conductivity of at least 100 watts per meter and Kelvin, very particularly preferably a thermal conductivity of at least 200 watts per meter and Kelvin, more preferably a thermal conductivity of at least 400 watts per meter and Kelvin.

The material suitable for the functional heat conduction is preferably copper, aluminum or steel or structural steel, although other materials can also be provided, but in particular metals and metal alloys.

According to the invention, the cooling device has a carrier body made of a material with a thermal conductivity suitable for functional heat conduction, it being possible for the heat source to be thermally conductively connected to the carrier body.

The carrier body can preferably be connected or is connected directly to the heat source. In principle, but less preferably, only an indirect connection can be provided, in particular if the components further involved in the connection between the carrier body and the heat source also have a high thermal conductivity.

The carrier body advantageously serves to hold the heat source. The heat source can be detachably fastened to the carrier body, for example by means of mechanical connecting means (such as screws or locking elements). The carrier body can be or can be connected to the heat source in a force-fitting, form-fitting and/or cohesive manner.

The carrier body and the heat source are preferably connected to one another over a large area, so that heat can be conducted particularly well and directly from the heat source to the carrier body.

The carrier body preferably has significantly smaller dimensions or a smaller spatial extent than the heat sink. The carrier body preferably extends in its main plane of extension over a length which is less than 1/4 of the length of the heat sink in its main plane of extension. Particularly preferably, the carrier body occupies an area in its main plane of extension that is less than 1/8 of the area of the heat sink in its main plane of extension. In principle, however, the carrier body can have any dimensions, for example also dimensions which essentially correspond to those of the heat sink or which are even larger or much larger than the dimensions or the extent of the heat sink.

According to the invention, it is provided that the cooling device has at least one heat pipe extending along a longitudinal axis. A first axial section of the heat pipe is thermally conductively connected to the carrier body and a second axial section of the heat pipe, spaced apart from the first axial section along the longitudinal axis, is connected to the heat sink.

For reasons of simplification, the “first axial section” is sometimes referred to below as just the “first section” and the “second axial section” as just the “second section”.

Heat pipes are usually metallic vessels with an elongated shape (thus tubular heat conductors), which contain a hermetically encapsulated working medium (e.g. distilled water or ammonia), which fills the inner volume of the heat pipe partly in liquid and partly in fills larger part in gaseous state. The section of the heat pipe that serves to absorb energy is also called the "evaporator" (in this case the first axial section). The portion of the heat pipe that is used to dissipate energy is also called the "condenser" (here, the second axial portion). Heat pipes are able to transport large amounts of heat on a small cross-sectional area and with great flexibility. Since heat pipes are known in principle, no further details are given.

The longitudinal extent of the heat pipe can be adapted to the specific place of use of the cooling device and can bridge the required distance between the carrier body and the heat sink. The heat pipe can preferably be bendable. For example, the axial length of the heat pipe can be about 4 times to 10 times the largest edge length of the carrier body.

Any number of heat pipes can be provided within the scope of the invention, but for example only one heat pipe. A plurality of heat pipes are preferably provided, for example at least two heat pipes, at least three heat pipes, at least four heat pipes, at least five heat pipes, at least six heat pipes or even more heat pipes.

In particular, several groups of heat pipes can also be provided, in particular two groups of heat pipes, each group of heat pipes preferably being assigned to its own side or side face of the carrier body. A "group" within the meaning of the present invention can optionally also have only a single heat pipe. However, each group preferably has at least two heat pipes, but optionally also more than two heat pipes in each case, with the number of heat pipes in the groups not having to be identical, but preferably being identical for reasons of symmetry.

Insofar as a “side surface” of the carrier body is mentioned within the scope of the present invention, this side surface is preferably an outer lateral surface of the carrier body.

According to the invention, the cooling device has at least one heat transfer plate arranged between the carrier body and at least one of the heat pipes. The heat transfer plate is formed from a material having a thermal conductivity suitable for functional heat conduction. At least along the first axial section of the at least one heat pipe, the heat transfer plate is connected directly to the at least one heat pipe in areas that are flat and secured against rotation. The heat transfer plate is also partially connected directly to the carrier body so that the carrier body can be rotated relative to the at least one heat transfer plate about at least one axis of rotation or along at least one degree of freedom of rotation.

Exactly one heat transfer plate can be provided. However, at least two heat transfer plates or even more heat transfer plates are preferably provided, for example three heat transfer plates, four heat transfer plates or five heat transfer plates. In particular, it can be provided that when using a plurality of heat transfer plates, each heat transfer plate is assigned to its own side or side face of the carrier body.

The carrier body and the heat pipe are preferably made of a metal, in particular copper. The heat sink is preferably also made of a metal, in particular aluminum. In addition, the heat transfer plate and/or the guide plate mentioned below are also preferably made of a metal, in particular of copper, aluminum or mild steel.

A "rotation-proof" connection between the heat transfer plate and the heat pipe is preferably understood to mean a rigid, mechanically firmly coupled connection between the heat transfer plate and the heat pipe, so that the heat transfer plate cannot be rotated relative to the at least one heat pipe without plastic deformation of one of the components. If necessary, however, a certain amount of play can also be provided between the heat transfer plate and the heat pipe, particularly within the scope of tolerances and/or to compensate for tolerances. In particular, it can therefore be understood within the scope of the invention with regard to said torsion-proof connection that the essential twistability takes place between the carrier body and the heat transfer plate and not between the heat transfer plate and the heat pipe.

The non-rotatable connection between the heat transfer plate and the heat pipe also does not rule out the heat transfer plate being displaceable along the at least one heat pipe. In an advantageous embodiment of the invention, displaceability between the heat transfer plate and the heat pipe along the longitudinal axis of the heat pipe can even be explicitly provided. Depending on the position of the heat transfer plate in relation to the heat pipe, the first axial section for absorbing heat or the axial position of the heat source can be fixed or changed.

The carrier body can be rotatable relative to the at least one heat transfer plate about exactly one axis of rotation, about exactly two axes of rotation or about three axes of rotation. The rotation axes mentioned are preferably each oriented orthogonally to one another, as a result of which the rotation is possible along exactly one rotational degree of freedom, along exactly two rotational degrees of freedom or along all three rotational degrees of freedom.

The carrier body can preferably be fixed in its respective rotational position. The fixability can also consist in the fact that the joints and/or hinges involved are designed to be correspondingly stiff, so that the fixation is provided by the frictional connection or the static friction between the connection partners. However, very specific fixing means, such as screws or locking elements, can also be provided.

The carrier body can be rotatable relative to the at least one cooling body about exactly one axis of rotation, about exactly two axes of rotation, or about three axes of rotation.

An essential advantage of the cooling device according to the invention is that the cooling device, in addition to good heat transfer, also allows flexible rotation of the carrier body and thus also of the heat source connected to the carrier body. The heat source can thus be aligned in different angular positions with little effort and adapted to the respective requirements. The alignment can advantageously take place by positioning the carrier body, without the heat pipes having to be subjected to any significant mechanical stress. As a result, the susceptibility to wear and the service life of the cooling device are significantly increased compared to the known prior art.

As a rule, no changes in position relative to the carrier body are required at the heat source itself, although this is possible in modified designs.

The at least one heat transfer plate ensures a planar and therefore particularly effective heat transfer between the carrier body and the heat pipe. In this way, the heat generated from the heat source during the operation of the heat source can be quickly dissipated to the heat sink via the supporting body, the heat transfer plate and the heat pipe. Overheating of the heat source is thus effectively avoided, so that the heat source can be operated under optimal conditions.

In an advantageous development of the invention, it can be provided that a side face of the carrier body is directly connected to the heat transfer plate (in particular to a side face of the heat transfer plate facing the carrier body) over a large area, but rotatably about the at least one axis of rotation or about at least one degree of freedom of rotation.

The side surface of the carrier body can thus be rotatable relative to the heat transfer plate or the side surface of the heat transfer plate in order to allow the carrier body to be rotated along the at least one axis of rotation or along the at least one degree of freedom of rotation. At the same time, the planar connection enables high heat dissipation.

The side surface, ie preferably the outer lateral surface, is preferably aligned perpendicularly to the axis of rotation about which the carrier body can be pivoted.

The at least one heat pipe preferably extends (at least along the first section) laterally along the side surface of the carrier body, preferably parallel to the side surface of the carrier body that faces the heat pipe.

Preferably, the at least one heat pipe extends (at least along the first portion) laterally along the side surface of the heat transfer plate, preferably parallel to the side surface of the heat transfer plate facing the heat pipe.

According to a development of the invention, it can be provided that the heat transfer plate has a guide groove or some other recess or a receiving section for receiving the first section of the heat pipe.

The guide groove, the recess or the receiving section can be designed to receive the heat pipe at least in sections along its surface in a planar manner. Preferably, the guide groove, the recess or the receiving section for this purpose have at least essentially the outer geometry of the heat pipe complementary inner geometry.

The guide groove is preferably concave in shape or has an inwardly curved geometry.

The cross section of the recess or of the receiving section is preferably adapted to the cross section of the heat pipe in its first section in order to accommodate the heat pipe as precisely and flatly as possible.

Advantageously, the guide groove, the recess or the receiving section can on the one hand enable the surface connection between the at least one heat pipe and the heat transfer plate and on the other hand at least partially guide, stabilize and/or fix the heat pipe.

According to a particularly preferred development of the invention, it can be provided that the cooling device has two of the aforementioned heat transfer plates, which are connected to different side surfaces of the carrier body, preferably with side surfaces of the carrier body that face away from one another and in particular run parallel to one another.

It can be provided that a first of the heat transfer plates with a first group of the aforementioned heat pipes (possibly also only a single heat pipe, but preferably has exactly two heat pipes or more heat pipes) and a second of the heat transfer plates with a second group of the aforementioned heat pipes ( which may also have only a single heat pipe, but preferably has exactly two heat pipes or more heat pipes) is connected.

The use of two heat transfer plates has proven to be particularly advantageous, especially when the carrier body is arranged between the two heat transfer plates. In this way, on the one hand, good guidance and fixation of the carrier body and, moreover, in particular, a bilateral and thus significantly increased heat dissipation can be made possible.

The invention is essentially described below with two heat transfer plates. However, this is not to be understood as restrictive—in principle, only a single heat transfer plate or more than two heat transfer plates can also be used for each of the mentioned developments, variants, configurations and embodiments be provided. This also applies to the guide plate(s) mentioned below.

According to a development of the invention, it can be provided that the side surfaces of the carrier body, to which the heat transfer plates are connected, each run parallel to the longitudinal axis of the heat pipe in the first section.

Preferably, the side surface of the support body that is connected to the heat transfer plate or the side surfaces of the support body to which the heat transfer plates are connected are each formed as flat surfaces.

In this way, the carrier body can be rotatable relative to the heat transfer plate along precisely one axis of rotation and advantageously fixed in the other two rotational degrees of freedom. A rotation about exactly one axis of rotation is advantageous and sufficient for many applications, for example when the heat source is a light source.

According to a further developed embodiment, the carrier body has a rectangular cross section, for example a cube-shaped geometry.

The carrier body (regardless of the geometric design) can be designed as a solid, ie filled body. However, the carrier body can also be designed as a hollow body. In particular, the carrier body can have bores, recesses, grooves, etc., for example for attachment to the heat transfer plate or for attachment and/or accommodation of the heat source.

The carrier body can optionally have bushings for connecting lines (for example, but not exclusively, electrical lines). The connecting lines can in particular supply the heat source with energy, data and/or fluids in order to be able to carry out its intended function. Optional fastening elements for holding the connecting line can be arranged on the heat pipes and/or on the optional carrier bodies.

In a further development of the invention it can be provided that the side faces of the carrier body to which the heat transfer plates are connected have a convex profile or that the side face of the carrier body to which the heat transfer plate is connected has a convex profile.

The convex progression can be designed as a delimited elevation or curvature on the side surface, for example a spherical curvature. In particular, however, it can also be provided that the entire side face is curved or spherical. The carrier body is preferably designed to be essentially or completely spherical, in particular in the area of the side surfaces to be connected to the heat transfer plates. At this point it should be mentioned that the term "side surface" within the scope of the invention can also be understood as a "side" in the case of side surfaces that merge into one another, such as with a completely round or approximately round body, which of the respective component (e.g. the Heat transfer plate) each facing, even if the term different "side surfaces" is used below and above for simplification.

In this way, a connection between the carrier body and the at least one heat transfer plate in the manner of a ball joint can be made possible. For example, in this configuration, the carrier body can be rotated relative to the at least one heat transfer plate by up to three rotational degrees of freedom.

In particular, it can be provided that the heat transfer plates each have a concave depression for the planar connection with the respective side surface of the carrier body, preferably a depression complementary to the convex course, in order to accommodate the carrier body at least partially in the depression.

In this way, on the one hand, a flat connection for good heat dissipation and, on the other hand, a particularly advantageous articulated connection can be provided.

In a development of the invention, it can be provided that the first group of heat pipes and the second group of heat pipes each have at least two heat pipes (in particular exactly two heat pipes each), which run parallel to one another at least along their first sections, and each with the assigned Heat transfer plate are connected.

The use of more than one heat pipe per side surface of the carrier body or per heat transfer plate can be advantageous in order to further increase the mechanical stability of the cooling device and at the same time to improve the cooling performance. In particular, it has been shown that a significantly more stable cooling device can be provided if, instead of a single heat pipe with a large diameter, several heat pipes with a smaller diameter are provided per side surface of the carrier body or heat transfer plate.

In a development of the invention, it can also be provided that the cooling device has at least one guide plate extending laterally or longitudinally to the at least one heat pipe for guiding and stabilizing the at least one heat pipe in sections along its longitudinal axis.

The at least one heat pipe is preferably arranged with its first axial section between the guide plate and the heat transfer plate.

In turn, two guide plates are preferably provided, in particular one guide plate per side surface of the carrier body or per heat transfer plate.

The mechanical stability of the cooling device can again be significantly increased by the guide plates. In particular, the heat pipes can be securely arranged between a respective guide plate and an associated heat transfer plate - at least in the first axial section.

The guide plate can have a greater longitudinal extent (along the heat pipes) than the heat transfer plate, preferably be longer by a factor of at least 2, for example also be longer by a factor of at least 3 or longer by a factor of at least 4.

The guide plate preferably runs essentially or completely along the entire length of the at least one heat pipe, starting from the first section (including or excluding the first section) to the heat sink or up to the second section (including or excluding the second section).

Optionally, the guide plate can be attached to the heat sink, in particular to an underside of the heat sink that faces the carrier body. The heat pipes preferably also open out into the heat sink on this underside or are fastened to the heat sink in a thermally conductive manner in some other way.

If necessary, the heat pipes can also merge into the heat sink in one piece or form the heat sink on their second sections.

The guide plate can optionally contribute to heat dissipation from the carrier body.

In a preferred development, it can be provided that the cooling device has at least one connecting element, in particular a rotationally symmetrical one

Connecting element, for example a screw element, which extends through respective coaxially positioned bores in the carrier body, the heat transfer plate and/or the guide plate, in particular in order to fasten the at least one heat pipe in a force-fitting manner between the heat transfer plate and the guide plate and in order to force-fit the heat transfer plate to the carrier body connect.

In particular, it can be provided that each guide plate is connected to one of the heat transfer plates via two first screw elements in order to clamp the heat pipes between the guide plate and the heat transfer plate.

In particular, it can also be provided that the carrier body is connected to the two heat transfer plates and the two guide plates via a second screw element in each case. The second screw elements preferably define the axis of rotation about which the carrier body can be rotated.

Two screw elements can also be provided, which connect the carrier body on the corresponding side together with a heat transfer plate and a guide plate. Even a single screw element can be provided, which in this case protrudes completely through the carrier body.

By tightening the screw element or the screw elements, the surface contact between the carrier body and the heat transfer plate and the at least one heat pipe located between the heat transfer plate and the guide plate can advantageously be established. The heat pipes can thus be firmly clamped or pressed in between the carrier body and the heat transfer plate.

By loosening the screw element, the support body and thus also the heat source can be rotated to a different position, after which the screw elements can be tightened again to fix the support body in the new position, for example in a different axial position along the heat pipe.

The non-positive connection can preferably be selected in such a way that the desired rotation between the carrier body and the heat transfer plate(s) is still possible. At the same time, a particularly high level of heat dissipation can take place due to the adhesion, cumulatively with the respective planar connection of the respective connection partners.

In an advantageous development of the invention, it can be provided that the at least one heat pipe is connected to the carrier body and/or to the guide plate via a snap-in connection.

The guide plate preferably has at least one recess (e.g. in the form of a longitudinal groove) for at least partial accommodation of the heat conductor, preferably for latching accommodation.

The guidance, stabilization and fixation of the heat pipes, which are generally sensitive, can be further improved as a result.

In a development of the invention, it can be provided in particular that the second section of the heat pipe is an end section of the heat pipe.

The heat pipe can thus preferably be connected to the heat sink with one of its end sections. Optionally, the first section can also be an end section or the other end section of the heat pipe. However, the first section can also be a middle section of the heat pipe.

The heat pipe preferably has at least one bending point, so that the second section (e.g. the end section connected to the heat sink) of the heat pipe runs at an angle to the first section of the heat pipe (e.g. at an angle of approximately 90° or exactly 90 degrees).

In an advantageous development of the invention, it can be provided that the heat sink is designed as a passive heat sink and has a plurality of cooling ribs or cooling structures designed in a different way.

Corresponding heat sinks for increasing the surface area that can be functionally used for dissipating heat are widely known, which is why no further details are given.

The heat sink acts as a heat sink in the cooling device and is preferably passive. In modified versions, the heat sink can optionally also be actively cooled, for example via a fluid flow generated by a turbomachine of the cooling device (or an external device).

In an advantageous development of the invention, it can be provided that the heat source is designed as a light source and has at least one light source.

The lighting means is preferably designed as a single light-emitting diode or as a light-emitting diode arrangement with a plurality of light-emitting diodes.

The heat generated during operation of the light source can be continuously dissipated by the cooling device. The light source can be equipped with several light sources and optionally optical systems for deflecting the beams emitted by the light source or light sources. The optical systems can have, for example, lenses, prisms, diffusers or other optical elements. For example, optical systems (e.g. one or more lenses) to create a narrow beam pattern (with beam angles of e.g. up to 20° or less) or lenses to create a medium beam pattern (with beam angles of e.g. up to to 30° or less). In principle, however, the emission characteristics can be arbitrary.

However, the invention is not to be understood as being limited to use with a light source or an illuminant as the heat source. In principle, the heat source can be any heat source, for example a heat source, an energy converter, a voltage and/or current converter or even a unit. Combinations of different heat sources are also possible.

In a preferred development of the invention it can be provided that the heat pipe is a heat pipe. In principle, however, the heat pipe can also be a two-phase thermosiphon or some other heat pipe.

The invention also relates to a heat source arrangement, having a cooling device according to the above and following statements and the heat source, the heat source being thermally conductively connected to the carrier body, in particular being directly connected.

By means of the proposed heat source arrangement, it is possible to dissipate large amounts of heat from the heat source to a location remote from the heat source, where a heat sink acts as a heat sink.

For example, a light source and the optionally associated optics can advantageously be decoupled from the heat sink and can therefore be flexibly aligned and positioned, with excellent heat dissipation to the heat sink still being possible.

The cooling device and the heat source arrangement are particularly suitable for installation in a false ceiling or a cavity wall or drywall, with no restriction to a specific installation solution. The heat source and the carrier body are preferably located in the space in which the heat source is to act (ie, for example, in the space that is to be illuminated by a light source) and are therefore visible. The heat pipes preferably extend through a wall or ceiling panel, so that the heat sink can be placed invisibly behind them. In the case of suspended ceilings in particular, there is usually enough space above the visible ceiling panel to accommodate a correspondingly large-format heat sink. In special applications, the heat sink can also be positioned in a ventilation duct.

The heat source can be aligned according to the respective application by appropriate positioning and/or alignment of the carrier body. For example, the distance between the heat sink and the carrier body can preferably be adjustable. This is possible, for example, by designing the carrier body to be displaceable axially along the heat pipes, as already mentioned above.

Features that have been described in connection with one of the objects of the invention, specifically given by the cooling device according to the invention and the heat source arrangement according to the invention, can also be advantageously implemented for the other objects of the invention. Likewise, advantages that were mentioned in connection with one of the objects of the invention can also be understood in relation to the other objects of the invention.

In addition, it should be pointed out that terms such as "comprising", "having" or "with" do not exclude any other features or steps. Furthermore, terms such as "a" or "that" which indicate a singular number of steps or features do not exclude a plurality of features or steps - and vice versa.

In a puristic embodiment of the invention, however, it can also be provided that the features introduced in the invention with the terms “comprising”, “having” or “with” are listed exhaustively. Accordingly, one or more listings of features may be considered complete within the scope of the invention, e.g. considered for each claim. The invention can consist exclusively of the features mentioned in claim 1, for example.

It should be mentioned that designations such as "first" or "second" etc. are primarily used for reasons of distinguishing between the respective device or method features and are not necessarily intended to imply that characteristics are interdependent or related.

Furthermore, it should be emphasized that the values and parameters described here are deviations or fluctuations of ±10% or less, preferably ±5% or less, more preferably ±1% or less, and very particularly preferably ±0.1% or less of the respectively named Include value or parameter, provided that these deviations are not excluded in the implementation of the invention in practice. The specification of ranges by means of initial and final values also includes all those values and fractions that are enclosed by the range specified in each case, in particular the initial and final values and a respective mean value.

The invention also relates to a cooling device for a heat source independent of claim 1. This further cooling device, which is also claimed in the present case, has at least one elongate heat conductor extending along a longitudinal axis (e.g. the heat pipe mentioned above, but possibly also a sheet metal or profile part or another elongate component that can be suitable for heat conduction). The heat source can be thermally conductively fastened to a first axial section of the heat conductor, and a heat sink (of any type) is thermally conductively connected to a second axial section of the heat conductor. The further features of claim 1 and the dependent claims as well as the features described in the present description relate to advantageous embodiments and variants of this cooling device. This applies in particular to the heat sink, the carrier body, the heat transfer plate(s) and the guide plate(s).

Exemplary embodiments of the invention are described in more detail below with reference to the drawings.

The figures each show preferred exemplary embodiments in which individual features of the present invention are shown in combination with one another. Features of an exemplary embodiment can also be implemented separately from the other features of the same exemplary embodiment and can accordingly easily be combined with features of other exemplary embodiments by a person skilled in the art to form further meaningful combinations and sub-combinations.

Elements with the same function are provided with the same reference symbols in the figures.

Figur 1

eine Wärmequellenanordnung aus einer Kühlvorrichtung und einer Wärmequelle gemäß einem ersten Ausführungsbeispiel der Erfindung, in einer perspektivischen Darstellung;

Figur 2

die Wärmequellenanordnung der Figur 1 in einer perspektivischen Explosivdarstellung;

Figur 3

die Wärmequellenanordnung der Figur 1 in einer weiteren perspektivischen Explosivdarstellung;

Figur 4

die Wärmequellenanordnung der Figur 1 in einer Seitenansicht;

Figur 5

eine Wärmequellenanordnung aus einer Kühlvorrichtung und einer Wärmequelle gemäß einem zweiten Ausführungsbeispiel der Erfindung, in einer perspektivischen Darstellung;

Figur 6

die Wärmequellenanordnung der Figur 5 in einer perspektivischen Explosivdarstellung;

Figur 7

die Wärmequellenanordnung der Figur 5 in einer weiteren perspektivischen Explosivdarstellung;

Figur 8

die Wärmequellenanordnung der Figur 5 in einer Seitenansicht; und

Figur 9

den vergrößerten Ausschnitt IX der Figur 8.

They show schematically:

figure 1

a heat source arrangement from a cooling device and a heat source according to a first embodiment of the invention, in a perspective view;

figure 2

the heat source arrangement of the figure 1 in a perspective exploded view;

figure 3

the heat source arrangement of the figure 1 in a further perspective exploded view;

figure 4

the heat source arrangement of the figure 1 in a side view;

figure 5

a heat source arrangement of a cooling device and a heat source according to a second embodiment of the invention, in a perspective view;

figure 6

the heat source arrangement of the figure 5 in a perspective exploded view;

figure 7

the heat source arrangement of the figure 5 in a further perspective exploded view;

figure 8

the heat source arrangement of the figure 5 in a side view; and

figure 9

the enlarged section IX of figure 8 .

A first exemplary embodiment of a heat source arrangement 1 according to the invention is described below with reference to FIG Figures 1 to 4 explained in more detail. figure 1 shows a perspective view of the first embodiment, while the figures 2 and 3 explosive representations and figure 4 show a side view.

The heat source arrangement 1 has a heat source 2 (see, inter alia, figures 2 and 6 ) and a cooling device 3 for the heat source 2. In principle, the invention can be suitable for use with any heat source 2 that generates waste heat to be dissipated, but possibly also useful heat. In the exemplary embodiments, the heat source 2 is a light source by way of example, but this is not to be understood as limiting.

The cooling device 3 has a heat sink 4 and a carrier body 5 .

The carrier body 5 is used to hold the heat source 2. The heat source 2 can be fastened in a suitable manner, in particular on the end face of the carrier body 5 facing away from the heat sink 4, as shown, preferably by means of detachable mechanical fastening means (not shown).

The carrier body 5 is thermally conductively connected to the heat sink 4 via a plurality of heat pipes 6, for example heat pipes. The heat pipes 6 are designed as elongated bodies and extend along a respective longitudinal axis L (cf. figure 2 ). In the exemplary embodiments, a total of four heat pipes 6 are provided by way of example, with two groups of two heat pipes 6 running parallel to one another being formed, each of which is attached to a side surface 7 of the carrier body 5 (or “sides” of the carrier body 5 in the exemplary embodiment of Figures 5 to 9 ), In the exemplary embodiments, outer lateral surfaces are assigned.

A first axial section 8 (cf. figure 2 and figure 6 ) of the heat pipes 6 is connected to the carrier body 5 and a second axial section 9 (cf. figure 2 and figure 6 ) connected to the heat sink 4 in a thermally conductive manner. The second section 9 is angled in relation to the first section 8 and is formed on an end section of the respective heat pipe 6 which is inserted into the heat sink 4 starting from an underside of the heat sink 4 . In the exemplary embodiments, the first section 8 is formed on the other end section of the respective heat pipe 6 facing away from the second section 9; however, this is not necessarily the case. The first section 8 can also be a middle section of the heat pipe 6 . In particular, provision can also be made for the first section 8 to be variably adjustable in that the carrier body 5 can be displaced along the longitudinal axis L of the heat pipes 6 .

The heat sink 4 is preferably made of aluminum or another suitable material and has a plurality of cooling ribs 10 . A passive heat sink 4 is provided in the exemplary embodiments. In order to increase the heat dissipation, however, a turbomachine can optionally also be provided, which guides a fluid past the heat sink 4 . Furthermore, the heat sink 4 can in turn be connected to a higher-level cooling system.

The cooling device 3 also has two heat transfer plates 11, each arranged between the carrier body 5 and the corresponding heat pipes 6 and made of a material with good heat conduction, which are connected directly to the respective heat pipe 6 at least in areas over a large area and in a torsion-proof manner along the respective first sections 8 of the heat pipes 6 are. The heat transfer plates 11 are also directly connected to the carrier body 5 over a large area in some areas.

In this case, however, the carrier body 5 remains rotatable relative to the heat transfer plates 11 by at least one rotational degree of freedom or by at least one rotational axis R ₁ , R ₂ , R ₃ . In the embodiment of Figures 1 to 4 the carrier body 5 can be rotated about exactly one first axis of rotation R ₁ (cf. figure 1 ), Whereas the carrier body 5 of the second embodiment described below, the figures 5 to 10 can be rotated about all three axes of rotation R ₁ , R ₂ , R ₃ (cf. figure 5 ).

The heat transfer plates 11 have guide grooves 12 (particularly well in the figures 2 and 6 recognizable) for receiving the first sections 8 of the heat pipes 6, which are preferably formed concavely and at least essentially complementary to the outer geometry of the heat pipes 6 in order to enable a particularly full-surface connection.

In both exemplary embodiments, the cooling device 3 has exactly two heat transfer plates 11—this is not to be understood as limiting, however. In principle, just a single heat transfer plate 11 can be sufficient, for example for a one-sided connection of the carrier body 5 . Preferably, these are side surfaces 7 of the carrier body 5 facing away from one another, as shown. Thus, a first of the heat transfer plates 11 can be connected to the first group of heat pipes 6 and the second of the heat transfer plates 11 can be connected to the second group of heat pipes 6 . The axis of rotation R ₁ , about which the carrier body 5 can be rotated, is aligned orthogonally to the side faces 7 which are connected to the heat transfer plates 11 . This results in very good guidance and stabilization along the rotational axes R ₂ , R ₃ orthogonal to the first rotational axis R ₁ .

The side surfaces 7 of the carrier body 5, to which the heat transfer plates 11 are connected, each run parallel to the longitudinal axis L of the heat pipe 6 in the first section 8, and are also each formed as flat surfaces. In the first exemplary embodiment, the carrier body 5 specifically has a rectangular cross section and is designed, for example, as a solid cube.

The carrier body 5 preferably has a passage 13 (see. For example figure 1 ) for passing through a connecting line 14. The connecting line 14 can in particular be an electrical line for the electrical supply of a light source. The connecting line 14 is in figure 4 implied.

In figure 4 the course of a ceiling panel 15 of a suspended ceiling is also indicated. It can be seen that the heat sink 4 can be positioned above the cover plate 15, while the carrier body 5 is located below the cover plate 15. The cooling device 3 can be fastened to the cover plate 15 by means of fastening profiles 16, for example.

It can optionally be provided that the rigid or immovable part of the cooling device 3 is accommodated in a first housing part 17 , preferably starting from the carrier body 5 up to the cooling body 4 - or at least up to the cover plate 15 . The movable part of the cooling device 3, i.e. in particular the carrier body 5 with the heat source 2, can be accommodated in a second housing part 18, so that the second housing part 18 is mechanically coupled to the carrier body 5 and therefore relative to the first housing part 17 together with the carrier body 5 is movable. The housing parts 17, 18 can preferably be designed as hollow cylinders, preferably made of a metal, in order to protect the heat source arrangement 1 mechanically on the one hand and, if necessary, also to shield it electrically. The housing parts 17, 18 can also further limit the uncontrolled release of heat to the environment below the cover plate 15 and focus the heat conduction in the direction of the heat sink 4. Furthermore, the housing parts 17, 18 can have a positive effect on the appearance of the heat source arrangement 1.

In addition to the components already mentioned, the cooling device 3 also has optional guide plates 19 which extend laterally to the heat pipes 6 . A guide plate 19 is assigned to each group of heat pipes 6 . The guide plates 19 serve to guide and stabilize the heat pipes 6 in sections along the longitudinal axis L. In the respective first section 8 the heat pipes 6 are mechanically clamped or fastened between the guide plate 19 and the associated heat transfer plate 11 .

For attachment, the cooling device 3 has a plurality of connecting elements 20, 21 per side surface 7 of the carrier body 5, which are designed as screw elements in the exemplary embodiments. In the first exemplary embodiment, two first screw elements 20 are provided which connect the respective guide plate 19 to the associated heat transfer plate 11 in order to clamp the corresponding heat pipes 6 between the guide plate 19 and the heat transfer plate 11 . Furthermore, a second screw element 21 is provided, which extends from the guide plate 19 through the heat transfer plate 11 into the carrier body 5 in order to connect the combination of guide plate 19 and heat transfer plate 11 to the carrier body 5 in such a way that the second screw element 21 is the axis of rotation R ₁ forms or runs coaxially to the axis of rotation R ₁ . In this way, the orientation of the carrier body 5 by loosening the second Allows screw elements 21 and are fixed again by tightening the second screw elements 21 .

Finally, the screw elements 20, 21 also make it possible to connect the heat transfer plate 11 to the carrier body 5 in a non-positive manner, which can result in particularly good heat dissipation.

The heat pipes 6 can be connected to the carrier body 5 and/or to the guide plate 19 via latching connections (not shown) in order to further improve the stability of the heat source arrangement 1 .

The Figures 5 to 9 show a second exemplary embodiment of the heat source arrangement 1 according to the invention. figure 5 shows a perspective view of the second embodiment, while the figures 6 and 7 explosive displays, figure 8 a front view and figure 9 an enlarged section of the figure 8 show.

In contrast to the exemplary embodiment described above, the carrier body 5 in the second exemplary embodiment is of spherical design and is clamped between the heat transfer plates 11 . In order to fix the heat transfer plates 11 to the heat pipes 6 , each of the two guide plates 19 is connected to one of the two heat transfer plates 11 via one of the first screw elements 20 .

The spherical support body 5 is in concave depressions 22 (see. For example figure 6 ) of the heat transfer plates 11 to form a ball joint so that the support body 5 can be easily rotated to the desired position. This can result in a further improved possibility of adjustment along all three axes of rotation R ₁ , R ₂ , R ₃ for the carrier body 5, as is shown in figure 5 is indicated. The ball joint is in detail in figure 9 shown.

It is preferably possible to fix the carrier body 5 after its alignment in order to prevent the carrier body 5 from deflecting unintentionally.

Claims (15)

Cooling device (3) for a heat source (2), having - a heat sink (4); - A carrier body (5) made of a material with a thermal conductivity suitable for functional heat conduction, wherein the heat source (2) can be thermally conductively connected to the carrier body (5); and - at least one heat pipe (6) extending along a longitudinal axis (L), wherein a first axial section (8) of the heat pipe (6) is connected to the carrier body (5) and one of the first section (8) along the longitudinal axis (L) spaced, second axial section (9) of the heat pipe (6) is thermally conductively connected to the heat sink (4),
marked by
at least one heat transfer plate (11) arranged between the carrier body (5) and at least one of the heat pipes (6) and made of a material with a thermal conductivity suitable for functional heat conduction, which at least along the first section (8) of the at least one heat pipe (6) in some areas is connected directly to the at least one heat pipe (6) over a large area and secured against rotation, and which is directly connected to the carrier body (5) over a large area in some areas, so that the carrier body (5) can rotate about at least one axis of rotation ( R ₁ , R ₂ , R ₃ ) is rotatable. Cooling device (3) according to claim 1,
characterized in that
a side surface (7) of the carrier body (5) is directly connected to the heat transfer plate (11) in areas that are flat but rotatable about the at least one axis of rotation (R ₁ , R ₂ , R ₃ ), with the at least one heat pipe (6) being lateral along the side surface (7) of the carrier body (5). Cooling device (3) according to claim 1 or 2,
characterized in that
the heat transfer plate (11) has a guide groove (12) for receiving the first section (8) of the heat pipe (6), preferably a concave guide groove (12). Cooling device (3) according to claim 2 or 3,
marked by
two of the aforesaid heat transfer plates (11) which are connected to different side faces (7) of the support body (5), preferably to side faces (7) of the support body (5) facing away from one another, a first of the heat transfer plates (11) being connected to a first group of aforesaid heat pipes (6) and a second one of the heat transfer plates (11) is connected to a second group of the aforesaid heat pipes (6). Cooling device (3) according to claim 4,
characterized in that
the side surfaces (7) of the supporting body (5) to which the heat transfer plates (11) are connected are each parallel to the longitudinal axis (L) of the heat pipe (6) in the first section (8), and also each formed as flat surfaces are. Cooling device (3) according to claim 4,
characterized in that
the side surfaces (7) of the carrier body (5), to which the heat transfer plates (11) are connected, have a convex shape, the heat transfer plates (11) each having a concave shape for the surface connection with the respective side surface (7) of the carrier body (5). Have recess (22). Cooling device (3) according to one of claims 4 to 6,
characterized in that
the first group of heat pipes (6) and the second group of heat pipes (6) each comprise at least two heat pipes (6) which run parallel to one another at least along their first sections (8) and which are each connected to the associated heat transfer plate (11). are. Cooling device (3) according to one of claims 1 to 7,
marked by
at least one guide plate (19) extending laterally to the at least one heat pipe (6) for guiding and stabilizing the at least one heat pipe (6) in sections along its longitudinal axis (L), the at least one heat pipe (6) in the first section (8 ) is arranged between the guide plate (19) and the heat transfer plate (11). Cooling device (3) according to claim 8,
marked by
at least one connecting element, in particular a screw element (20, 21), which extends through respective bores, positioned coaxially to one another, in the carrier body (5), the heat transfer plate (11) and/or the guide plate (19) in order to connect the at least one heat pipe (6) to be frictionally fixed between the heat transfer plate (11) and the guide plate (19) and to frictionally connect the heat transfer plate (11) to the support body (5). Cooling device (3) according to claim 8 or 9,
characterized in that
the at least one heat pipe (6) is connected to the carrier body (5) and/or to the guide plate (19) via a snap-in connection. Cooling device (3) according to any one of claims 1 to 10,
characterized in that
the second section of the heat pipe (6) is an end section (9) of the heat pipe (6), the heat pipe (6) preferably having a bending point so that the end section (9) of the heat pipe (6) is opposite to the first section (8) of the heat pipe (6) is angled. Cooling device (3) according to any one of claims 1 to 11,
characterized in that
the heat sink (4) is designed as a passive heat sink (4) and has a plurality of cooling fins (10). Cooling device (3) according to any one of claims 1 to 12,
characterized in that
the heat source (2) has at least one light source, preferably at least one light-emitting diode or a light-emitting diode arrangement. Cooling device (3) according to any one of claims 1 to 13,
characterized in that
the heat pipe (6) is a heat pipe. Heat source arrangement (1), comprising a cooling device (3) according to one of Claims 1 to 14 and the heat source (2), the heat source (2) being thermally conductively connected to the carrier body (5).

Images