EP4172290A1 - Phosphor particle coating - Google Patents
Phosphor particle coatingInfo
- Publication number
- EP4172290A1 EP4172290A1 EP21742657.6A EP21742657A EP4172290A1 EP 4172290 A1 EP4172290 A1 EP 4172290A1 EP 21742657 A EP21742657 A EP 21742657A EP 4172290 A1 EP4172290 A1 EP 4172290A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- ald
- main
- sol
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 163
- 238000000576 coating method Methods 0.000 title claims abstract description 156
- 239000011248 coating agent Substances 0.000 title claims abstract description 109
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 52
- 239000010410 layer Substances 0.000 claims abstract description 514
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 337
- 239000011247 coating layer Substances 0.000 claims abstract description 290
- 238000000034 method Methods 0.000 claims abstract description 155
- 239000000203 mixture Substances 0.000 claims abstract description 101
- 230000008569 process Effects 0.000 claims abstract description 95
- 239000012702 metal oxide precursor Substances 0.000 claims abstract description 85
- 239000000126 substance Substances 0.000 claims abstract description 74
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 50
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 47
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 47
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 46
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 46
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 36
- 229910052718 tin Inorganic materials 0.000 claims abstract description 32
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 29
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 27
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 26
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims description 176
- 238000005406 washing Methods 0.000 claims description 109
- 239000002243 precursor Substances 0.000 claims description 66
- 239000010936 titanium Substances 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- -1 silicon alkoxide Chemical class 0.000 claims description 45
- 239000002904 solvent Substances 0.000 claims description 44
- 229910044991 metal oxide Inorganic materials 0.000 claims description 41
- 150000004706 metal oxides Chemical class 0.000 claims description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 41
- 229910001868 water Inorganic materials 0.000 claims description 41
- 229910052791 calcium Inorganic materials 0.000 claims description 39
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 38
- 229910052712 strontium Inorganic materials 0.000 claims description 34
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 32
- 229910052710 silicon Inorganic materials 0.000 claims description 32
- 239000010703 silicon Substances 0.000 claims description 29
- 229910052788 barium Inorganic materials 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 22
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 19
- 150000004703 alkoxides Chemical class 0.000 claims description 18
- 229910052760 oxygen Inorganic materials 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
- 239000001301 oxygen Substances 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 10
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 9
- 229910021529 ammonia Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 150000004645 aluminates Chemical class 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 4
- 101150063042 NR0B1 gene Proteins 0.000 claims description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 192
- 239000002987 primer (paints) Substances 0.000 description 104
- 239000011575 calcium Substances 0.000 description 41
- 239000002096 quantum dot Substances 0.000 description 41
- 239000011701 zinc Substances 0.000 description 32
- 239000002105 nanoparticle Substances 0.000 description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 27
- 235000019441 ethanol Nutrition 0.000 description 26
- 239000011135 tin Substances 0.000 description 26
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 21
- 238000000151 deposition Methods 0.000 description 21
- 239000000843 powder Substances 0.000 description 21
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 20
- 239000010955 niobium Substances 0.000 description 20
- 150000002739 metals Chemical class 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 17
- 239000011257 shell material Substances 0.000 description 17
- 229910052693 Europium Inorganic materials 0.000 description 16
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 14
- 230000008021 deposition Effects 0.000 description 14
- 239000011777 magnesium Substances 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 13
- 239000011258 core-shell material Substances 0.000 description 12
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 239000000725 suspension Substances 0.000 description 12
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 11
- 229910052732 germanium Inorganic materials 0.000 description 11
- 239000011572 manganese Substances 0.000 description 11
- 230000003044 adaptive effect Effects 0.000 description 10
- 230000007062 hydrolysis Effects 0.000 description 10
- 238000006460 hydrolysis reaction Methods 0.000 description 10
- 229910052749 magnesium Inorganic materials 0.000 description 10
- 239000004054 semiconductor nanocrystal Substances 0.000 description 10
- 229910052772 Samarium Inorganic materials 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000001276 controlling effect Effects 0.000 description 9
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 9
- 238000003980 solgel method Methods 0.000 description 9
- 239000011787 zinc oxide Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 235000011054 acetic acid Nutrition 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 8
- 150000007513 acids Chemical class 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 229910004613 CdTe Inorganic materials 0.000 description 6
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000003491 array Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 229910052681 coesite Inorganic materials 0.000 description 6
- 229910052906 cristobalite Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 229960004592 isopropanol Drugs 0.000 description 6
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 6
- 229910052682 stishovite Inorganic materials 0.000 description 6
- 229910052905 tridymite Inorganic materials 0.000 description 6
- 229910052771 Terbium Inorganic materials 0.000 description 5
- 239000003125 aqueous solvent Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 229910052744 lithium Inorganic materials 0.000 description 5
- 238000010899 nucleation Methods 0.000 description 5
- 230000006911 nucleation Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 238000004062 sedimentation Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 238000000527 sonication Methods 0.000 description 5
- 241000894007 species Species 0.000 description 5
- 229910001936 tantalum oxide Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910004262 HgTe Inorganic materials 0.000 description 4
- 229910000673 Indium arsenide Inorganic materials 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 229910052769 Ytterbium Inorganic materials 0.000 description 4
- 229910007709 ZnTe Inorganic materials 0.000 description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 4
- 239000011236 particulate material Substances 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910052701 rubidium Inorganic materials 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- JHFCTJHPQRVPAJ-UHFFFAOYSA-N C(C)C1(C=CC=C1)[Y](C1(C=CC=C1)CC)C1(C=CC=C1)CC Chemical compound C(C)C1(C=CC=C1)[Y](C1(C=CC=C1)CC)C1(C=CC=C1)CC JHFCTJHPQRVPAJ-UHFFFAOYSA-N 0.000 description 3
- HHUFRABLYYUEMP-UHFFFAOYSA-N C(C)N(CC)[Nb] Chemical compound C(C)N(CC)[Nb] HHUFRABLYYUEMP-UHFFFAOYSA-N 0.000 description 3
- 229910052692 Dysprosium Inorganic materials 0.000 description 3
- 229910052691 Erbium Inorganic materials 0.000 description 3
- 229910052688 Gadolinium Inorganic materials 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 229910052689 Holmium Inorganic materials 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 229910052777 Praseodymium Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- 238000003917 TEM image Methods 0.000 description 3
- 229910004448 Ta2C Inorganic materials 0.000 description 3
- 229910052775 Thulium Inorganic materials 0.000 description 3
- 229910010165 TiCu Inorganic materials 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 238000010908 decantation Methods 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910052909 inorganic silicate Inorganic materials 0.000 description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000007873 sieving Methods 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 2
- 229910003373 AgInS2 Inorganic materials 0.000 description 2
- 229910017115 AlSb Inorganic materials 0.000 description 2
- 229910004611 CdZnTe Inorganic materials 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 2
- 229910005542 GaSb Inorganic materials 0.000 description 2
- 229910005543 GaSe Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 2
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 2
- 229910002665 PbTe Inorganic materials 0.000 description 2
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 235000004279 alanine Nutrition 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052956 cinnabar Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 2
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- UKWHYYKOEPRTIC-UHFFFAOYSA-N mercury(II) oxide Inorganic materials [Hg]=O UKWHYYKOEPRTIC-UHFFFAOYSA-N 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- JRPGMCRJPQJYPE-UHFFFAOYSA-N zinc;carbanide Chemical compound [CH3-].[CH3-].[Zn+2] JRPGMCRJPQJYPE-UHFFFAOYSA-N 0.000 description 2
- IPSRAFUHLHIWAR-UHFFFAOYSA-N zinc;ethane Chemical compound [Zn+2].[CH2-]C.[CH2-]C IPSRAFUHLHIWAR-UHFFFAOYSA-N 0.000 description 2
- 229910018873 (CdSe)ZnS Inorganic materials 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000764773 Inna Species 0.000 description 1
- 229910015811 MSi2 Inorganic materials 0.000 description 1
- 229910017623 MgSi2 Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920005439 Perspex® Polymers 0.000 description 1
- 229920005372 Plexiglas® Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910018321 SbTe Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910007991 Si-N Inorganic materials 0.000 description 1
- 229910004072 SiFe Inorganic materials 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000001243 acetic acids Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- JLATXDOZXBEBJX-UHFFFAOYSA-N cadmium(2+);selenium(2-);sulfide Chemical compound [S-2].[Se-2].[Cd+2].[Cd+2] JLATXDOZXBEBJX-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- KIZFHUJKFSNWKO-UHFFFAOYSA-M calcium monohydroxide Chemical compound [Ca]O KIZFHUJKFSNWKO-UHFFFAOYSA-M 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 238000003898 horticulture Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- WTKKCYNZRWIVKL-UHFFFAOYSA-N tantalum Chemical compound [Ta+5] WTKKCYNZRWIVKL-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- WUOSVSDQERJZBI-UHFFFAOYSA-N tert-butyliminotantalum;ethyl(methyl)azanide Chemical compound CC[N-]C.CC[N-]C.CC[N-]C.CC(C)(C)N=[Ta] WUOSVSDQERJZBI-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77346—Aluminium Nitrides or Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4417—Methods specially adapted for coating powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
Definitions
- the invention relates to a method for providing a coated luminescent material, to such luminescent material, as well as to a lighting device comprising such luminescent material for wavelength conversion.
- the coating of luminescent materials is known in the art.
- WO2014128676 describes a coated luminescent particle, a luminescent converter element, a light source, a luminaire and a method of manufacturing coating luminescent particles.
- the coated luminescent particle comprises a luminescent particle, a first coating layer and a second coating layer.
- the luminescent particle comprises luminescent material for absorbing light in a first spectral range and for converting the absorbed light towards light of a second spectral range.
- the luminescent material is sensitive for water.
- the first coating layer forms a first barrier for water and comprises a metal oxide or a nitride, phosphide, sulfide based coating.
- the second coating layer forms a second barrier for water and comprises a silicon based polymer or comprises a continuous layer of one of the materials AIPCri, SiCh, AI2O3, and LaPCri.
- the first coating layer and the second coating layer are light transmitting.
- the first coating layer encapsulates the luminescent particle and the second coating layer encapsulates the luminescent particle with the first coating layer.
- Moisture sensitive luminescent powder materials can be coated with a layer of an amorphous or glassy material to reduce decomposition rates by moisture attack.
- the coating may be applied by depositing a material at the particle surfaces by reacting a dissolved inorganic precursor in a suspension (e.g. by a sol-gel process) or by deposition from the gas phase (e.g. a chemical vapor deposition or an atomic layer deposition (ALD) process).
- Atomic layer deposition could be a suitable method to deposit thin, conformal coatings of various inorganic materials on powder particles.
- ALD layers may be very dense and conformal and may be substantially impermeable to gases like water vapor and oxygen.
- the ALD process further allows the deposition of multiple thin layers (nanolaminate) of different inorganic materials that each may provide physical properties to the layer (like moisture resistance, light transmissivity, stress resistance, elasticity, etc.) that may be different for the different (nano)layers.
- Sol-gel process may be suitable for providing (relatively) thicker layers that may provide mechanical protection to the material coated with the layer.
- Known coated luminescent particles may show one or more disadvantages, such as decomposition of the luminescent material due to moisture or e.g. solvents, degradation as a result of high temperatures, mechanical instability during processing the luminescent particles. Further, also many of the known coating processes have one or more disadvantages such as agglomeration, decrease in quantum efficiency of the coated luminescent material (relative to the uncoated material), non-conformal coatings.
- moisture sensitive luminescent particles comprising only an ALD coating may also not be durable when being exposed to mechanical stress. It further appears that moisture sensitive luminescent particles with a sol- gel coating in combination with an ALD coating configured on top of the sol-gel coating may provide luminescent particles with a reduced decomposition rate due to moisture attack at relatively hard conditions such as at temperatures up to 60°C and a 90% relative humidity. Yet, for higher temperatures, such as that may be generated in high-power LED applications, e.g. in flash and automotive applications alternative coating structures may be desirable. Further, ALD layers appear to show an intrinsic (tensile) stress, that may increase with increasing layer thickness.
- ALD coatings may preferably be provided as thin layers. Yet, it appears that deposition of especially a thin ALD layer may be sensitive to surface contamination. Possible contamination at the surface of the particle to be coated may result in pinholes or other irregularities in the (thin) ALD layer.
- the invention provides an alternative coating process, which preferably further at least partly obviates one or more of above-described drawbacks. It is a further aspect of the invention to provide an alternative luminescent material that preferably further at least partly obviates one or more of above-described drawbacks. In yet a further aspect, the invention provides a lighting device comprising the luminescent material that preferably further at least partly obviates one or more of above- described drawbacks.
- the present invention may have as object to overcome or ameliorate at least one of the disadvantages of the prior art, or to provide a useful alternative.
- the invention proposes in embodiments a coating structure comprising at least two layers, especially at least three layers configured around a luminescent core.
- the different layers may be selected from having different functions.
- the coating structure may especially comprise a primer layer, a coating layer provided by atomic layer deposition (an “ALD coating layer”), and a coating layer provided by a sol-gel (deposition) process (a “sol-gel coating layer”).
- ALD coating layer atomic layer deposition
- sol-gel coating layer a coating layer provided by a sol-gel (deposition) process
- the primer layer may facilitate good adherence between the surface and facilitate deposition of a thin ALD coating layer.
- the ALD coating layer may shield the luminescent core from undesired gases like water vapor and oxygen or further chemicals.
- the sol-gel coating may provide mechanical protection to the luminescent core and the ALD coating layer.
- a hybrid coating method for a luminescent powder material that consist of depositing a coating layer at a primer layer (at a surface of a luminescent core) by application of an ALD process and successively depositing a sol-gel layer by application of a sol-gel type process to obtain a uniformly coated luminescent particle.
- a luminescent particle with a hybrid coating may be provided.
- the invention provides a method for providing a luminescent particle with a hybrid coating.
- the method especially comprises (the stages of) (i) providing a luminescent core (“core”) comprising a primer layer (“primer coating” or “primer coating layer”) on the luminescent core (or a “primer layer comprising luminescent core”).
- the method further comprising: (ii) providing a(n) (main) atomic layer deposition coating layer (“(main) ALD coating layer” or “(main) ALD coating” or “(main) ALD layer”) onto the primer layer.
- the (main) ALD-coating layer is in embodiments, especially provided onto the primer layer comprising luminescent core.
- the method further comprising: (iii) providing a (main) sol-gel coating layer (“(main) sol-gel coating” or “(main) sol-gel layer”) onto the (main) ALD coating layer.
- the (main) ALD coating layer may be provided onto the primer layer by application of an (main) atomic layer deposition process (“(main) ALD process”).
- the (main) ALD coating layer may comprise a multilayer (or “laminate”) with two or more layers having different chemical compositions.
- a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si).
- the (main) sol-gel coating layer is especially provided onto the (main) ALD coating layer by application of a (main) sol-gel coating process.
- the main sol-gel coating layer may have a chemical composition different from one or more of the layers of the multilayer.
- the invention also provides a luminescent material comprising the luminescent particles obtained by such method.
- the invention provides in yet a further aspect, a luminescent material comprising luminescent particles, wherein the luminescent particles comprise a luminescent core comprising a primer layer on the luminescent core, especially wherein the primer layer has a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm, and wherein the primer layer has a chemical composition differing from the chemical composition of the core; a(n) (main) ALD (i.e., atomic layer deposition) coating layer, especially comprising a multilayer with two or more layers having different chemical compositions, wherein, in embodiments, the (main) ALD coating has a(n) (main) ALD coating layer thickness (d2) in the range of 5-250 nm, such as 5-100 nm, especially 5-50 nm, such as especially
- d2 primer layer
- the (main) sol-gel coating layer has a chemical composition differing from the (main) ALD coating layer, especially from one or more of the two or more layers of the multilayer. Further, especially, the (main) ALD coating layer is arranged between the primer layer and the (main) sol-gel layer.
- the invention may provide luminescent particles and luminescent material, i.e. luminescent material comprising these (hybrid coated) particles, showing a significantly reduced decomposition rate as a result of moisture attack.
- the coating of the luminescent particles may demonstrate improved moisture barrier properties.
- the coating may further provide an improved chemical and mechanical stability allowing the integration of luminescent particle (phosphors), especially of moisture sensitive luminescent particles (phosphors) in high-power products e.g. for flash and automotive applications imposing high stress conditions (like working temperatures up to 85°C, at a high relative humidity (over 80% relative humidity).
- a relative stable luminescent material is provided with quantum efficiencies close to or identical to the virgin (non-coated) luminescent material and having stabilities against water and/or (humid) air which are very high and superior to non-coated or non-hybrid coated luminescent particles.
- the invention may especially provide in embodiments a method for providing a luminescent particle with a hybrid coating, the method comprising: (i) providing a luminescent core comprising a primer layer on the luminescent core; (ii) providing a main ALD coating layer onto the primer layer by application of a main atomic layer deposition process, the main ALD coating layer comprising a multilayer with two or more layers having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si); (iii) providing a main sol-gel coating layer onto the main ALD-coating layer by application of a main sol-gel coating process, the main sol-gel coating layer having a chemical composition different from one or more of the layers of the multilayer.
- the metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si).
- the starting material is a particulate luminescent material or a luminescent material that is made particulate.
- the luminescent core is a particulate core or luminescent (core) material that is made particulate.
- the core may essentially be a (virgin) luminescent parti cl e/core, i.e. a non-coated / non-treated luminescent particle.
- the luminescent particles of the particulate luminescent material (especially the core(s)) are coated as described herein.
- the terms “luminescent particles”, “luminescent core” and similar terms indicate that the particles and/or cores luminesce under excitation with especially UV and/or blue radiation (light source radiation, see below).
- the term “luminescent particle” may be used to refer to the “luminescent core”.
- the coated luminescent particles may be referred to as “luminescent particles”. It will be clear from the context whether the term “luminescent particle” refers to a core that is not coated or e.g. that it refers to the luminescent particle comprising the hybrid coating, or to a luminescent particle comprising only one or more layers of the hybrid coating.
- the luminescent core (before applying the ALD coating process) especially comprises a primer layer on (a surface of) the luminescent core.
- the luminescent core comprising the primer layer (on the luminescent core) is also referred to as a “primer layer comprising luminescent core”.
- the virgin (core) material (already) comprises the primer layer.
- the core may comprise an oxide-containing surface.
- the primer layer may be provided to the virgin (core) material, especially with the method of the invention.
- the method may comprise providing a primer layer onto a core(, to provide the luminescent core comprising the primer layer on the luminescent core) (see further below).
- the primer layer not necessarily is entirely conformal with the core.
- the primer layer may especially be evenly distributed over (the surface of) the luminescent core.
- the primer layer may in embodiments not entirely cover the surface of the core.
- the primer layer may in embodiments cover the core for at least 50%, especially at least 75%, such as at least 90%, or especially at least 95% or even more especially at least 99%, of the surface of the core (see further below).
- the primer layer may especially be configured to facilitate the deposition of the main ALD coating layer.
- the primer layer may function as a nucleation layer or a seed layer for the main ALD coating layer.
- the main ALD coating layer is provided onto the primer layer.
- the ALD coating layer may contact the surface of the luminescent core at first locations of the luminescent core comprising the primer layer, and the ALD coating layer may contact the primer layer at further locations.
- the main ALD coating layer may optionally include a multilayer.
- the multilayers of the main ALD coating layer are all ALD layers. Therefore, this layer is indicated as (main) ALD (coating) layer (thus optionally including an ALD multilayer).
- the main ALD coating layer comprises a multilayer with two or more layers (having different chemical compositions), see also below.
- the main ALD coating layer especially at least includes one or more aluminum oxide (especially AI2O3) coating layers.
- the main sol-gel coating layer may optionally include a multilayer.
- the (multi-)layers of the main sol-gel coating layer are all sol-gel layers. Therefore, this coating layer is herein also indicated as a (main) sol-gel (coating) layer (thus optionally including a sol-gel multilayer).
- the main sol-gel coating layer is provided on the main ALD coating layer, without an intermediate layer.
- the main sol-gel coating layer especially comprises silicon oxide (especially SiCh).
- An example of a multilayer may e.g.
- a Si02-Ah03-x(0H)2x (sol-gel) multilayer (wherein 0 ⁇ x ⁇ 3), such as a stack of three or more (sol-gel) layers wherein SiC and Al203-x(0H)2x (with 0 ⁇ x ⁇ 3) alternate.
- a further coating layer may be provided (see further below).
- both the main ALD coating layer and the main sol-gel coating layer independently comprise metal oxides, though optionally also hydroxides may be included in the one or more of these layers.
- independently the main ALD coating layer and the main sol-gel coating layer may include mixed oxide layers.
- the coating layers need not necessarily to be fully stoichiometric oxides, as is known in the art.
- the primer layer (also) comprises a sol-gel coating layer (provided by application of a sol-gel process).
- sol-gel coating layer may be indicated as a primary sol-gel coating layer, especially to distinguish from the main sol-gel coating layer.
- the primary sol-gel coating layer may in embodiments comprise metal oxides, and optionally hydroxides, as described herein in relation to the main sol-gel coating layer.
- the primary sol-gel coating layer may be provided as described in relation to the main sol-gel coating layer, see also below, further describing the sol-gel process.
- the primary sol-gel coating layer may especially be provided (and comprise a composition) as described in relation with the main sol-gel coating.
- the primer layer may in further embodiments (also) (further) comprise an oxide-containing layer.
- the oxide-containing layer is provided by application of a chemical washing process onto the luminescent core (see further below).
- the chemical washing process may especially provide a washing result layer onto the luminescent core.
- the washing result layer comprises the oxide-containing layer.
- the primer layer may especially function as a nucleation layer or a seed layer for the main ALD coating layer.
- the primer layer may be structurally different for various embodiments.
- the primer layer comprises, especially consist of an oxide-containing layer (or oxide-rich layer) (at the surface of the luminescent core).
- the primer layer comprises, especially consist of the washing result layer.
- the primer layer comprises, especially consists of the primary sol-gel coating layer.
- the primer layer comprises the washing result layer and the primary sol-layer.
- the primary sol-gel coating layer is provided after the chemical washing process, and especially the primary sol-gel coating may be provided on the washing result layer (especially the oxide-containing layer). Yet, in such embodiments, the primary sol-gel coating layer may contact the washing result layer at a first location of the luminescent core. The primary sol- gel coating may contact the surface of the luminescent core at other locations of the luminescent core.
- the primer layer comprises an oxide-containing layer and a primary sol-gel layer , especially wherein the oxide-containing layer is arranged at a surface of the core (and at least part of the primary sol-gel coating layer is arranged at the oxide-containing layer).
- locations of the core may not be covered by the primary layer (especially the one or more of the oxide-containing layer and the primary sol-gel coating layer).
- the main ALD coating layer may (be provided to) contact the primary sol-gel coating layer at some locations of the luminescent core and the main ALD coating layer may (be provided to) contact the surface of the core at some other locations of the luminescent particle.
- the main ALD coating may (also) (be provided to) contact the washing result layer at some further locations of the luminescent particle.
- the thickness of the primer layer is smaller than the thickness of the main sol-gel layer, and especially also smaller than the thickness of the main ALD coating layer. Further, especially the main sol-gel coating layer thickness is generally larger than the ALD coating layer thickness.
- the primer layer thickness is especially equal to or smaller than 10 nm, such as equal to or smaller than 7 nm, especially equal to or smaller than 5 nm, even more especially equal to or smaller than 4 nm.
- the primer layer thickness may in embodiments be at least 0.1 nm, such as at least 0.2 nm, especially at least 0.5 nm, such as especially at least 1 nm.
- the primary layer thickness may especially be the result of the thickness of the primary sol-gel coating layer.
- the primary sol-gel coating layer may be equal to or smaller than 10 nm, such as equal to or smaller than 7 nm, especially equal to or smaller than 5 nm, such as equal to or smaller than 4 nm.
- the oxide-containing layer may in embodiments be less than 1 nm thick.
- the primer layer has a primer layer thickness (dl) in the range of 0.1-5 nm.
- the primer layer comprises a primary sol-gel layer provided by application of a primary sol-gel coating process.
- the thickness of main sol-gel coating layer may be at least 10 times, such as at least 50 times, especially at least 100 times thicker than the thickness of the primary layer.
- main sol-gel coating layer thickness is generally larger than the main ALD coating layer thickness, such as at least 1.2, like at least 1.5, like at least 2 times larger, or even at least 4 times or at least 5 times or at least 10 times larger (than the main ALD coating layer thickness).
- the method of the invention comprises (i) providing the primer layer, especially having a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm, onto the core (to provide the primer layer comprising luminescent core); (ii) providing the main ALD coating layer having a main ALD coating layer thickness (d2) in the range of 3-250 nm, such as 5-250 nm, especially 5-100 nm, even more especially 5-50 nm, such as especially 10-50 nm, even more especially 20-50 nm, onto the primer layer (especially onto the primer layer comprising luminescent core) by application of the main atomic layer deposition process; and especially (iii) providing the main sol-gel coating layer having a main sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm onto the main ALD coating
- the primer layer has a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm,.
- the main ALD coating layer has a main ALD coating layer thickness (d2) in the range of 3-250 nm, such as 5-250 nm, especially 5-100 nm, even more especially 5-50 nm, such as especially 10- 50 nm, even more especially 20-50 nm.
- the main sol-gel coating layer has a main sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm.
- the luminescent particle comprises in embodiments a luminescent core, a primer layer having a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm, a main ALD coating layer having a main ALD coating layer thickness (d2) in the range of 3-250 nm, such as 5-250 nm, especially 5-100 nm, even more especially 5-50 nm, such as especially 10-50 nm, even more especially 20-50 nm, and a main sol-gel coating layer having a main sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm.
- the primer layer at least partly encapsulates the surface of the luminescent core.
- the main ALD coating encapsulates the primer layer.
- the main sol-gel coating encapsulates the main ALD coating layer.
- a further ALD coating layer encapsulates the main sol-gel coating layer (see below).
- the hybrid coating may comprise a main ALD coating layer and a main sol-gel coating layer, especially a primer layer, a main ALD coating layer, and a main sol-gel coating layer.
- the primer layer is especially arranged between the surface of the luminescent core and the main ALD coating layer.
- the main ALD coating layer is especially arranged between the main sol-gel coating layer and the primer layer.
- the luminescent particle may comprise a further coating layer arranged on the main sol-gel coating layer.
- the hybrid coating further comprises the further coating layer arranged at the main-sol-gel coating layer.
- the further coating layer may especially comprise a further ALD coating layer, especially encapsulating the main sol-gel coating.
- the luminescent particle (further) comprises a further ALD coating layer arranged onto the main sol-gel coating layer.
- the further ALD coating layer especially has a further ALD coating layer thickness (d4) in the range of 1-100 nm, such as 5-75 nm, especially 10-75 nm, such as especially 10-50 nm.
- especially the further ALD coating layer has a chemical composition differing from the chemical composition of the main sol-gel coating layer.
- the method further comprises (iv) providing a further ALD coating layer onto the main sol-gel coating by application of a further atomic layer deposition process (especially thereby providing a further ALD coated luminescent particle), especially wherein the further ALD coating layer has a further ALD coating layer thickness (d4) in the range of 1-100 nm, such as 5-75 nm, especially 10-75 nm, such as especially 10-50 nm, and especially wherein the further ALD coating layer has a chemical composition differing from the chemical composition of the main sol-gel coating layer.
- the further ALD coating layer may be provided by an ALD process described herein, especially in relation to the main ALD layer.
- the further ALD layer may (also) comprise a multilayer.
- the further ALD layer may further especially comprise a composition (and/or the (metal) oxides) described in relation to the main ALD layer.
- the further ALD coating layer comprises one or more oxides of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V, and optionally Si.
- the term “thickness” is used in relation to the coatings and layers.
- the term especially relates to the average thickness of the coating over the entire surface being coated by the respective layer.
- the primary layer may not completely cover the surface of the core and the (local) thickness of primer layer may be substantially zero at locations of the surface core.
- the maximum (local) thickness of the primer layer may be 3 nm.
- the primer layer thickness may be in the range of larger than 0 and smaller than 3 nm.
- the sol-gel process may provide coating layers having a somewhat pocked shape or e.g.
- the layer thicknesses described herein are especially average layer thicknesses. However especially, at least for the primer layer, the main sol gel coating layer, the main ALD coating layer and the further ALD coating layer (when present), at least 50%, even more especially at least 80%, of the area of the respective layers have such indicated layer thickness. Especially, this indicates that under at least 50% of the area of such layer, such thickness will be found.
- the luminescent core of interest may in principle include each type of (virgin) luminescent particle or particulate material.
- luminescent particulate materials particles
- oxo luminescent particulate materials
- the luminescent core (and the luminescent particle comprising the luminescent core) comprises one or more of a nitride luminescent material, an oxonitride luminescent material, a halogenide luminescent material, an oxohalogenide luminescent material, a sulfide luminescent material, and an oxosulfide luminescent material.
- the luminescent core may comprise a selenide luminescent material.
- the term “luminescent core” (and also “luminescent particle”) may also refer to a combination of particulate materials of different types of luminescent materials.
- the luminescent core may in embodiments especially comprise a plurality of particulate luminescent materials/luminescent particles.
- other systems may also be of interested to protect by the hybrid coating.
- combinations of particles/particulate materials of two or more different luminescent materials may be applied, such as e.g. a green or a yellow luminescent material in combination with a red luminescent material.
- M Sr, Ba, Ca, Mg
- M Sr, Ba, Ca, Mg
- Ml, M2, et cetera may refer to one or more of the (respective) elements.
- Ml may in embodiments be Sr, or Ba, or Ca.
- Ml may be combination of Sr and Ba, or e.g. Sr and Ca, or Sr, Ba, and Ca, etc..
- the elements may especially be present in any ratio, e.g. 20% Sr, 20% Ca and 50%. Ba, or 10% Ba and 90% Sr, etc.. Likewise this applies to the other herein indicated formulas of inorganic luminescent materials.
- a, b, c, d, e, n, x, y, z are always equal to or larger than zero.
- b, c, d, and e do not need to be defined anymore.
- 0 ⁇ b ⁇ 4;0 ⁇ c ⁇ 4;0 ⁇ d ⁇ 4; 0 ⁇ e ⁇ 4 are defined.
- the phosphor comprises at least lithium.
- M is Ca and/or Sr.
- substantially samarium and or europium containing phosphors are described.
- the ratio y/x may be larger than 0.1.
- the condition 0 ⁇ x+y ⁇ 0.4 indicates that M may be substituted with in total up to 40% of ES and/or RE.
- the condition “0 ⁇ x+y ⁇ 0.4” in combination with x and y being between 0 and 0.2 indicates that at least one of ES and RE are present. Not necessarily both types are present.
- both ES and RE may each individually refer to one or more subspecies, such as ES referring to one or more of Sm and Eu, and RE referring to one or more of Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, and Tm.
- the molar ratio between samarium and europium is ⁇ 0.1, especially ⁇ 0.01, especially ⁇ 0.001.
- the molar ratio between ytterbium and europium is ⁇ 0.1, especially ⁇ 0.01, especially ⁇ 0.001.
- the same molar ratios might apply, i.e. ((Sm+Yb)/Eu) is ⁇ 0.1, especially ⁇ 0.01, especially ⁇ 0.001.
- x is in the range of 0.001-0.2 (i.e. 0.001 ⁇ x ⁇ 0.2), like 0.002-0.2, such as 0.005-0.1, especially 0.005-0.08.
- the molar percentage may be in the range of 0.1-5 % (0.001 ⁇ x ⁇ 0.05), such as 0.2-5%, like 0.5-2%.
- x may (but is not necessarily) in embodiments be equal to or larger than 1% (x equal to or larger than 0.01).
- the phosphor is selected from a group consisting of (Sr,Ca)Mg3SiN4:Eu, (Sr,Ca)Mg2AhN4:Eu, (Sr,Ca)LiAbN4:Eu and (Sr,Ca)LidMg a AlbN4:Eu, with a, b, d as defined above.
- the phosphor is selected from a group consisting of Ba.95Sr.05Mg2Ga2N4:Eu, BaMg2Ga2N4:Eu, SrMg3SiN4:Eu, SrMg2AhN4:Eu, SrMg2Ga2N4:Eu, BaMg3SiN4:Eu, CaLiAbN4:Eu, SrLiAl3N4:Eu, CaLio.sMgAhriYiiEu, and SrLio.5MgAl2.5N4:Eu.
- Further (non-limiting) examples for such phosphors are e.g.
- the phosphor is selected from a group consisting of (Sr,Ca)Mg3SiN4:Eu and (Sr,Ca)Mg2Al2N4:Eu.
- the phosphor is selected from a group consisting of Bao.95Sro.o5Mg2Ga2N4:Eu, BaMg2Ga2N4:Eu, SrMg3SiN4:Eu, SrMg2Al2N4:Eu, SrMg2Ga2N4:Eu, and BaMg3SiN4:Eu.
- these phosphors and even more especially (Sr,Ca)Mg3SiN4:Eu and (Sr,Ca)Mg2AhN4:Eu may be phosphors having good luminescent properties, amongst others in terms of spectral position and distribution of the luminescence.
- the phosphor is selected from a class of (Sr,Ba)Li2Al2-zSiz02-zN2+ z :Eu with 0 ⁇ z ⁇ 0.1.
- the luminescent material is in embodiments selected from a group SrLiAhNvEu.
- the luminescent material may e.g. comprise SrLiAbN4:Eu with an Eu doping concentration in the range 0.1-5%, especially 0.1-2%, such as 0.2-1.2% relative to Sr.
- the phosphor/luminescent core (the luminescent material) comprises SrLi2Ali.995Sio.oo50i.995N2.oo5:Eu 2+ , especially with an Eu doping concentration in the range 0.1-5%, especially 0.1-2%, 0.2-1.5% relative to Sr.
- phosphors wherein the phosphor complies with 0 ⁇ x ⁇ 0.2, y/x ⁇ 0.1, M comprises at least Sr, z ⁇ 0.1, a ⁇ 0.4, 2.5 ⁇ b ⁇ 3.5, B comprises at least Al, c ⁇ 0.4, 0.5 ⁇ d ⁇ 1.5, D comprises at least Li, e ⁇ 0.4, n ⁇ 0.1, and wherein ES at least comprises Eu.
- x+y+z ⁇ 0.2 is close to 0 or zero.
- b is about 3.
- especially c is close to 0 or zero.
- especially d is about 1.
- especially e is close to 0 or zero.
- especially n is close to 0 or zero.
- especially y is close to 0 or zero.
- Especially good systems in terms of quantum efficiency and hydrolysis stability are those with z + d > 0, i.e. one or more of Na, K, Rb, Li and Cu(I) are available, especially at least Li, such as e.g.
- the phosphor is selected from a group consisting of CaLiAbN4:Eu, SrLiAbN4:Eu, CaLio.5MgAh.5N4:Eu, and SrLio.5MgAh.5N4:Eu.
- phosphors of special interest are (Sr,Ca,Ba)(Li,Cu)(Al,B,Ga)3N4:Eu, which comprises as M ion at least Sr, as B ion at least Al, and as D ion at least Li.
- the luminescent particles comprise a luminescent material selected from (the) SrLiAhN-rEu 21 (class).
- class herein especially refers to a group of materials that have the same crystallographic structure(s). Further, the term “class” may also include partial substitutions of cations and/or anions. For instance, in some of the above-mentioned classes Al-0 may partially be replaced by Si-N (or the other way around).
- the class of SrLiAbN4:Eu 2+ may especially relate to a group of materials that have the same crystallographic structure, especially wherein Sr is partially replaced by divalent Eu, e.g. by 0.1% or 2%.
- Sro.995LiAbN4:Euo.oo5 and Sro.98LiAbN4:Euo.o2 are elements of such class.
- SrLi2Ali.995Sio.oo50i.995N2.oo5:Eu 2+ class may e.g. comprise Sr0.999Li2All.995Si0.005Ol.995N2.005:EU0.001 and Sr0.985Li2All.995Si0.005Ol.995N2.005:EU0.015.
- Sr may be replaced by another alkaline earth metal (group 2 elements of the periodic table).
- Examples of the SrLiAbN4:Eu 2+ class are provided above. However, other luminescent materials may thus also be possible.
- the luminescent core may thus especially comprise a phosphor.
- the luminescent core especially comprises a luminescent material described herein, especially in relation to the phosphor.
- the method may be applied for providing more than one, especially a plurality of luminescent particles with a hybrid coating (and especially coating more than one luminescent core).
- the luminescent core comprises a (phosphor) material selected from a group consisting of (i) (the) SrLiAbN4:Eu 2+ (class), especially wherein an (Eu) doping concentration is in the range of 0.1-5%, especially 0.1-2%, even more especially 0.2-1.2%, relative to Sr, and (ii) (the)
- the third coating layer comprises SiC
- one or more layers of the multilayer comprise one or more of Ta20s, HfC , TiC and ZrCh and wherein one or more (other) layers of the multilayer comprise AI2O3, especially herein the layer contacting the main sol-gel coating layer consist of one or more metal oxides selected from a group of FlfCh, ZrCh, TiCh,Ta2C)5.
- Such luminescent particles may have a number averaged particle size in the range of 0.1-50 pm, such as in the range of 0.5-40 pm, such as especially in the range of 0.5- 20 pm.
- the luminescent core may have dimensions such as at maximum about 500 pm, such as at maximum 100 pm, like at maximum about 50 pm. especially with the larger particle sizes, substantially only individual particles may be coated, leading thus to luminescent core dimensions in the order of 50 pm or smaller.
- the invention is directed to the coating of particles.
- the dimensions of the luminescent core may substantially be smaller when nanoparticles or quantum dots are used as basis for the particulate luminescent material. In such instance, the cores may be smaller than about 1 pm or substantially smaller (see also below for the dimensions of the QDs).
- the luminescent particle(s), especially the luminescent core(s), include luminescent quantum dots.
- quantum dot or “luminescent quantum dot” may in embodiments also refer to a combination of different type of quantum dots, i.e. quantum dots that have different spectral properties.
- the QDs are herein also indicated as “wavelength converter nanoparticles” or “luminescent nanoparticles”.
- quantum dots especially refer to quantum dots that luminesce in one or more of the UV, visible and IR (upon excitation with suitable radiation, such as UV radiation).
- the quantum dots or luminescent nanoparticles may for instance comprise group II-VI compound semiconductor quantum dots selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting ol) CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdCdTe, CdZnSTe,
- the luminescent nanoparticles may for instance be group III-V compound semiconductor quantum dots selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting ol) GaN, GaP, GaAs, AIN, A1P, AlAs, InN, InP, InGaP, InAs, GaNP, GaNAs, GaP As, A1NP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GalnNP, GalnNAs, GalnPAs, InAlNP, In AIN As, and InAlPAs.
- core-shell quantum dots with the core selected from a group consisting ol) GaN, GaP, GaAs, AIN, A1P, AlAs, InN, InP, InGaP, InAs, GaNP, GaNAs, GaP As, A1NP, AlNAs, AlPAs, InNP, InNAs,
- the luminescent nanoparticles may for instance be I- III-VI2 chalcopyrite-type semiconductor quantum dots selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) CuInS2, CuInSe2, CuGaS2, CuGaSe2, AgInS2, AgInSe2, AgGaS2, and AgGaSe2.
- the luminescent nanoparticles may for instance be (core-shell quantum dots, with the core selected from a group consisting of) I-V-VI2 semiconductor quantum dots, such as selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) LiAsSe2, NaAsSe2 and KAsSe2.
- the luminescent nanoparticles may for instance be core-shell quantum dots, with the core selected from a group consisting of) group (IV -VI compound semiconductor nano crystals such as SbTe.
- the luminescent nanoparticles are selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) InP, CuInS2, CuInSe2, CdTe, CdSe, CdSeTe, AgInS2 and AgInSe2.
- the luminescent nanoparticles may for instance be one of the group (of core-shell quantum dots, with the core selected from a group consisting of) II-VI, III-V, I-III-V and IV-VI compound semiconductor nano crystals selected from the materials described above with inside dopants such as ZnSe:Mn, ZnS:Mn.
- the dopant elements could be selected from Mn, Ag, Zn, Eu, S,
- the luminescent nanoparticles based luminescent material may also comprise different types of QDs, such as CdSe and ZnSe:Mn.
- the luminescent core may comprise one or more, especially more, (of the same or different) (types of) luminescent nanoparticles.
- the semiconductor based luminescent quantum dots comprise II-VI quantum dots, especially selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdH
- the wavelength converter nanoparticles have an average particle size in a range of about 1 to about 1000 nanometers (nm), and preferably in a range of about 1 to about 100 nm. In embodiments, nanoparticles have an average particle size in a range of about 1 to about 20 nm. In embodiments, nanoparticles have an average particle size in a range of about 1 to about 10 nm.
- the luminescent nanoparticles (without coating) may have dimensions in the range of about 2-50 nm, such as 2-20 nm, especially 2-10 nm, even more especially 2-5 nm; especially at least 90 % of the nanoparticles have dimension in the indicated ranges, respectively, (i.e. e.g.
- Typical dots are made of binary alloys such as cadmium selenide, cadmium sulfide, indium arsenide, and indium phosphide. However, dots may also be made from ternary alloys such as cadmium selenide sulfide.
- quantum dots can contain as few as 100 to 100,000 atoms within the quantum dot volume, with a diameter of 10 to 50 atoms. This corresponds to about 2 to 10 nanometers.
- spherical particles such as CdSe, InP, or CuInSe2, with a diameter of about 3 nm may be provided.
- the luminescent nanoparticles (without coating) may have the shape of spherical, cube, rods, wires, disk, multi-pods, etc., with the size in one dimension of less than 10 nm.
- nanorods of CdSe with the length of 20 nm and a diameter of 4 nm may be provided.
- the semiconductor based luminescent quantum dots comprise core-shell quantum dots.
- the semiconductor based luminescent quantum dots comprise dots-in-rods nanoparticles.
- a combination of different types of particles may also be applied.
- the term “different types” may relate to different geometries as well as to different types of semiconductor luminescent material.
- a combination of two or more of (the above indicated) quantum dots or luminescent nano particles may also be applied.
- nanoparticles can comprise semiconductor nanocrystals including a core comprising a first semiconductor material and a shell comprising a second semiconductor material, wherein the shell is disposed over at least a portion of a surface of the core.
- a semiconductor nanocrystal including a core and shell is also referred to as a "core/shell” semiconductor nanocrystal. Any of the materials indicated above may especially be used as core. Therefore, the phrase “core-shell quantum dots, with the core selected from a group consisting of’ is applied in some of the above lists of quantum dot materials.
- the term “core-shell” may also refer to “core-shell-shell”, etc.., including gradient alloy shell, or dots in rods, etc.
- the semiconductor nanocrystal can include a core having the formula MX, where M can be cadmium, zinc, magnesium, mercury, aluminum, gallium, indium, thallium, or mixtures thereof, and X can be oxygen, sulfur, selenium, tellurium, nitrogen, phosphorus, arsenic, antimony, or mixtures thereof.
- Examples of materials suitable for use as semiconductor nanocrystal cores include, but are not limited to, ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InAs, InN, InP, InGaP, InSb, AlAs, AIN, A1P, AlSb, TIN, TIP, TIAs, TISb, PbO, PbS, PbSe, PbTe, Ge, Si, an alloy including any of the foregoing, and/or a mixture including any of the foregoing, including ternary and quaternary mixtures or alloys.
- the shell can be a semiconductor material having a composition that is the same as or different from the composition of the core.
- the shell comprises an overcoat of a semiconductor material on a surface of the core semiconductor nanocrystal can include a Group IV element, a Group II-VI compound, a Group II- V compound, a Group III- VI compound, a Group III-V compound, a Group IV -VI compound, a Group I-III-VI compound, a Group II-IV-VI compound, a Group II-IV-V compound, alloys including any of the foregoing, and/or mixtures including any of the foregoing, including ternary and quaternary mixtures or alloys.
- Examples include, but are not limited to, ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InAs, InN, InP, InGaP, InSb, AlAs, AIN, A1P, AlSb, TIN, TIP, TIAs, TISb, PbO, PbS, PbSe, PbTe, Ge, Si, an alloy including any of the foregoing, and/or a mixture including any of the foregoing.
- ZnS, ZnSe or CdS overcoatings can be grown on CdSe or CdTe semiconductor nanocrystals.
- An overcoating process is described, for example, in U.S. Patent 6,322,901.
- the overcoating comprises at least one semiconductor material which is the same as or different from the composition of the core.
- the overcoating has a thickness from about one to about ten monolayers.
- An overcoating can also have a thickness greater than ten monolayers.
- more than one overcoating can be included on a core.
- the surrounding "shell” material can have a band gap greater than the band gap of the core material. In certain other embodiments, the surrounding shell material can have a band gap less than the band gap of the core material. In embodiments, the shell can be chosen so as to have an atomic spacing close to that of the "core" substrate. In certain other embodiments, the shell and core materials can have the same crystal structure.
- semiconductor nanocrystal (core)shell materials include, without limitation: red (e.g., (CdSe)ZnS (core)shell), green (e.g., (CdZnSe)CdZnS (core)shell, etc.), and blue (e.g., (CdS)CdZnS (core)shell (see further also above for examples of specific wavelength converter nanoparticles, based on semiconductors.
- the luminescent particle or the luminescent core comprises a luminescent material selected from a group consisting of luminescent quantum dots comprising one or more core materials selected from a group consisting of CdS, CdSe, ZnS, and ZnSe.
- Such particles may have a number averaged particle size (i.e. especially length/width/height, diameter), in the range of 1-50 nm.
- the luminescent particle especially comprises a main ALD coating layer configured at the primer layer.
- the luminescent particle may further comprise a further ALD coating layer configured at (onto) the main sol-gel coating layers.
- the main ALD coating layer may be deposited by application of the main atomic layer deposition process (“main ALD process”).
- the further ALD coating layer may be deposited by application of the further atomic layer deposition process (“further ALD process”).
- the main atomic layer deposition process as well as the (optional) further atomic layer deposition process both are an atomic layer deposition process (“ALD process”). It will be understood that these processes may comprise the same ALD process.
- the conditions of the main ALD process may differ from the conditions of the further ALD process.
- the metal oxide precursor(s) used in the main ALD process may differ from the one(s) used in the further ALD process.
- the duration of the deposition may differ, the temperature may differ, etc..
- the metal oxide precursor(s) that may be applied in the further ALD process may be the metal oxide precursor(s) described in relation to the (main) ALD process (and vice versa).
- the main ALD coating layer and the optional further ALD coating layer may be formed by an atomic layer deposition type process.
- a polymeric network is formed by reaction of a metal oxide precursor with an oxygen source such as water and/or ozone in the gas phase.
- the ALD reaction is “brushed” in (at least) two parts.
- the metal (oxide) precursor is fed into a(n ALD) reactor and adsorbs and/or reacts with reactive groups on the particle surfaces and substantially all non-reacted or non- adsorbed precursor molecules are removed by reactor purging.
- the oxygen source is fed into the reactor and reacts with the metal source on the particle surfaces followed by purging of the reactor to remove substantially all remaining oxygen source molecules and hydrolysis products formed by condensation reactions.
- the two steps lead to formation of an atomic layer (or monolayer) because of the self-limiting nature of the surface reaction. These atomic layer reaction steps may be repeated multiple times to form the final ALD coating.
- the ALD process further allows it to deposit layers of different composition by consecutively feeding different metal oxide precursor into the reactor to form multicomponent layers or nanolaminates with tailored chemical, mechanical, and optical properties (see further below).
- metal oxide precursor especially indicates a precursor of the metal oxide.
- the precursor itself may not be a metal oxide but may e.g. include metal organic molecule.
- the metal (oxide) precursors for ALD may typically include metal halides, alkoxides, amides, and other metal (organic) compounds.
- the term metal oxide precursor may relate to more than one different metal oxide precursor, especially for more than one different metal oxides
- the step by step nature of the ALD process allows to easily deposit defined layer thicknesses.
- the ALD process further allows it to deposit layers of different composition by consecutively feeding different metal oxide precursors into the reactor to form multicomponent layers or nanolaminates.
- the main ALD coating layer (and/or the further ALD coating layer) comprises a multilayer (or a nanolaminate) (see also below).
- a fluidized bed reactor may be applied.
- the main ALD coating layer is provided by application of the (main) atomic layer deposition process.
- the further ALD coating layer (also) is provided by application of the (further) ALD process.
- a static powder bed is used for ALD coating of the primer layer and/or for ALD coating of the main sol-gel coating.
- a fluidized bed may be applied (for one or more of the ALD processes).
- Other type of reactors may also be applied.
- the primer layer may facilitate deposition of the main ALD coating layer especially by functioning as a nucleation layer or a seed layer for the main ALD coating layer.
- reactive groups on the particle surface may be provided by the primer layer (and also by the main sol-gel coating layer).
- silanol groups (assuming a primary and/or main silica sol-gel coating layer) at the surface of the sol-gel coating layer act as reactive sites during ALD of the initial layers.
- alumina is deposited by using A1(CH3)3 (TMA) as metal oxide precursor and (subsequently exposure to) water as the oxygen source.
- TMA reacts with surface silanol groups of the silica sol-gel coating layer according to: oSi-OH + A1(CH 3 ) 3 oSi-0-Al(CH 3 ) 2 + CH
- particle agglomeration may substantially be prevented by applying the primer sol-gel layer (and the main sol-gel coating layer) with a structured, nano-porous surface, such as of the silica sol-gel coating layer (see below).
- ALD process can easily be scaled up and nearly no powder or particle loss during ALD coating is observed.
- Commercially available ALD reactors for powder coating are e.g. sold by Picosun Oy with e.g. a cartridge sample holder (POCATM).
- a system that may be used for the ALD process is e.g. described in WO 2013171360 Al, though other systems may also be applied.
- a (non-limited) number of suitable materials for the ALD coating layer are listed in the following table:
- niobium oxide especially Nb20s
- yttrium oxide Y2O3
- Metal precursors thereof are e.g., (tert-butylimido)-tris (diethylamino)-niobium, NbFv or NbCb. and Tris(ethylcyclopentadienyl) Yttrium, respectively.
- zinc oxide ZnO
- Metal precursors thereof that e.g. may be applied are diethylzinc (DEZ), Zn(C2H5)2 and dimethylzinc (DMZ) Zh(03 ⁇ 4)2.
- DEZ diethylzinc
- DMZ dimethylzinc
- a metal oxide precursor may especially be selected from a group of metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn (and optionally Si).
- metal precursors of one or more metals comprising Ga, Ge, V and Nb may be applied.
- alternating layers of two or more of these precursors are applied, wherein at least one precursor is an Al metal oxide precursor, and another precursor is selected from a group consisting of a Hf metal oxide precursor, a Zn metal oxide precursor, a Ta metal oxide precursor, a Zr metal oxide precursor, a Ti metal oxide precursor, and a Sn metal oxide precursor, especially selected from a group consisting of a Hf metal oxide precursor, a Ta metal oxide precursor, a Ti metal oxide precursor, and a Zr metal oxide precursor, such as selected from a group consisting of a Hf metal oxide precursor, a Ta metal oxide precursor, and a Zr metal oxide precursor, even more especially a Ta metal oxide precursor.
- Hf, Zr, and Ta appear to provide relatively light transmissive layers, whereas Ti, for instance, may provide relatively less light transmissive layers.
- TiCU as the metal oxide precursor (for a TiCh layer) may provide a cost efficient layer. Processing with Ta, Hf and Zr seems to be relatively easier than Si, for instance.
- the terms “oxide precursor” or “metal oxide precursor” or “metal (oxide) precursor” may also refer to a combination of two or more chemically different precursors. These precursors especially form an oxide upon reaction with the oxygen source (and are therefore indicated as metal oxide precursor).
- the metal oxide precursors may in embodiments be selected independently from each other for successive ALD cycles.
- a ZnO layer and an AI2O3 layer are deposited alternately to obtain an AZO layer (Ak03:Zn0, or “aluminum-doped zinc oxide layer”
- the AZO layer may he a conductive layer and may be deposited using, e.g., triraethylaluminum, diethylzinc, and water as an oxygen source.
- a (another) metal oxide is (also) deposited in multiple consecutive cycles (and optionally successively a further metal oxide is deposited (optionally also in multiple consecutive cycles).
- metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn and comparable terms in phrases like “in the atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn” especially refers to metal oxide precursors of metals selected from a group consisting of the given metals (in this respect Al, Zn, Hf, Ta, Zr, Ti, Sn). Furthermore, in embodiments one or more metal oxides precursors are selected.
- the metal oxide precursor “that is selected from the group of metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn” may comprise any combination of metal oxide precursors of two or more metals selected from the group consisting of Al, Zn, Hf, Ta, Zr, Ti, and Sn.
- the metal oxide precursor comprises a combination of TaCh and HA1(CH3)2.
- the metal oxide precursor comprises only A1(CH3)3.
- a metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si).
- the metal oxide precursor is selected from a group of metal oxide precursors of metals comprising Al, Hf, Ta, Zr, and Ti (especially metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti).
- a metal oxide precursor is selected from a group consisting of Zn(C2tT)2 and Zn(CH3)2.
- the metal precursor is selected from a group consisting of (tert-butylimido)-tris (diethylamino)- niobium, NbFv NbCb, and Tris(ethylcyclopentadienyl)Yttrium.
- the metal oxide precursor(s) in the further atomic layer deposition process is especially independently selected from the metal oxide precursor(s) in the main atomic layer deposition process and may especially (also) be selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y,
- the metal oxide precursor(s) in the further atomic layer deposition process is a Si metal oxide precursor.
- the metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti.
- a metal oxide precursor is (also independently from the main ALD process) selected from a group consisting of A1(CH3)3, HA1(CH3)2, Hf(N(CH3)2)4, Hf(N(CH2CH3)2)4, Hf[N(CH 3 )(CH 2 CH 3 )] , TaCls, Ta(N(CH 3 ) 2 ) 5 , Ta ⁇ [N(CH 3 )(CH 2 CH 3 )] 3 N(C(CH 3 ) 3 ) ⁇ , ZrCU, Zr(N(CH 3 ) 2 )4, TiCU.
- a metal oxide precursor is selected from a group consisting of Zn(C 2 H5) 2 and Zn(CH 3 ) 2 .
- the metal precursor is selected from a group consisting of (tert-butylimido)-tris (diethylamino)-niobium, NbFs, NbCb, and Tris(ethylcyclopentadienyl)Yttrium.
- a metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Si, Sn, Nb, Y, Ga, and V.
- deposition temperatures in the 200 - 350°C range are most suitable for alumina ALD on the primer layer (and the main sol-gel coating layer), preferably the temperature is in the 250-300°C range. Similar temperatures may be applied for ALD of other metal oxide precursors for the ALD layer(s).
- the main ALD coating layer comprises a multilayer with at least three layers having different chemical compositions and one or more of the layers comprise an oxide of Si (Si0 2 ). Especially, such Si0 2 layer is sandwiched between other layers of the multilayer. Hence, especially the (ALD) layer (of the multilayer of the main ALD coating layer) contacting the main sol-gel layer and the respective (ALD) layer contacting the primer layer does not consist of Si0 2 . Yet, in embodiments a further ALD coating layer contacting the main sol-gel coating layer may comprise Si0 2 . Hence, in embodiments, in the (main and/or further) atomic layer deposition process a metal oxide precursor of Si is selected.
- the main ALD alumina (or other metal oxide) layer has a thickness of 3-250 nm, especially a thickness of as 5-250 nm, such as 5-100 nm, even more especially a thickness of 5-50 nm, such as especially 10-50 nm, even more especially a thickness of 20-50 nm.
- Water gas penetration barrier properties of alumina ALD layers can be further improved by depositing at least one additional layer of a different oxide material such as Zr0 2 , Ti0 2 , Y 2 0 3 , Nb 2 05, HfCh, Ta 2 Os.
- the thickness of the additional material layer is in the range 1-40 nm, more preferably in the range 1-10 nm.
- nanolaminate stacks of alternating layers of AhCh and a second oxide material from the group of ZrCh, TiCh, Y2O3, Nb2Ch, HfCh, S11O2 Ta205 A suitable nanolaminate stack may be e.g.
- the invention especially provides in embodiments a method wherein the main ALD coating layer comprises a multilayer with layers having different chemical compositions, and wherein in the atomic layer deposition process a metal oxide precursor is - amongst others - selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V and Nb (and optionally Si), especially the metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti. Also combinations of two or more of such precursors may be used, e.g.
- the metal oxide precursor for the two or more layers is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti.
- the main ALD coating layer may comprise a multilayer with (n) layers having different chemical compositions, and wherein the multilayer comprises one or more layers comprising an oxide of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V, and Nb (and optionally Si), especially wherein the multilayer comprises one or more layers comprising an oxide of one or more of Al, Hf, Ta, Zr, and Ti.
- One or more layers of such multilayers may also include mixed oxides, such as indicated above.
- the method of the invention comprises successively providing n layers (onto the primer layer by application of the main atomic layer deposition process), especially wherein each layer has a layer coating layer thickness (d21) in the range of 1- 50 nm, especially 1-20 nm, such as 1-15 nm.
- the layer coating thickness may in embodiments be at least 2 nm, such as at least 5 nm and e.g. be in the range of 5-40 nm, especially 5-25 nm.
- the number n of layers is especially at least 2, such as at least 3, or at least 4.
- n may be larger than 10.
- n is especially equal to or smaller than 10, such as equal to or smaller than 5.
- an individual layer may be provided by one or more ALD cycles.
- adjacent (contacting) layers comprise different chemical compositions.
- one or more layers comprise one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta2Ch, especially wherein one or more (other) layers comprise AI2O3. It further appeared to be advantageous when the layer contacting the main sol-gel coating layer consist of HfCh and/or ZrCh and/or TiCh and/or Ta205.
- a layer contacting the main sol-gel coating layer consist of one or more metal oxides selected from the group of HfCh, ZrCh, Ti02,Ta205.
- the method comprises successively providing n (ALD) layers onto the primer layer by application of the main atomic layer deposition process (to provide the multilayer), wherein each layer has a layer coating layer thickness (d21) in the range of 1- 50 nm, especially 1-20 nm, such as 1-15 nm, and wherein 2 ⁇ n ⁇ 50, especially 2 ⁇ n ⁇ 20, such as 2 ⁇ n ⁇ 10, especially 2 ⁇ n ⁇ 5, wherein one or more layers comprise one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta2C , and wherein one or more layers comprise AI2O3, wherein a layer contacting the main sol-gel coating layer consist of one or more metal oxides selected from the group of HfCh, ZrCh, TiCh, Ta2C .
- ALD n
- a (n ALD) multilayer coating (especially for the main ALD coating layer) is obtained including at least two (ALD) layers (“AB”), even more especially at least three layers (e.g. “ABA”), yet even more at least four layers. Yet more especially, at least a stack comprising two or more stack of subsets of two (ALD) layers (“AB”) is applied, such as (AB) n , wherein n is 2 or more, such as 2-20, like 2- 10
- At least one of the layers of the multilayer comprises an oxide of Al(optionally in combination with a further oxide of e.g. Si, or another metal oxide described herein), and at least one of the layers of the multilayer comprises one or more of an oxide of Hf, Zn, Ta, Zr, Ti, Y, Ga, Ge, V, Sn, and Nb.
- Such layer may optionally also include Al, Zn, Hf, Ta, Zr, Ti, Sn,( Si,) Y, Ga, Ge, V, and Nb, wherein Al is in a layer together with one or more of the other indicated elements, when the other layer(s) of the multilayer comprise an oxide of alumina, respectively.
- ALD multilayer or “multilayer” as indicated above especially refers to layers having different chemical compositions.
- layers having different chemical compositions indicates that there are at least two layers having different chemical compositions, such as in the case of “ABC”, or in the case of (AB) n (with n > 1).
- (AB) n include multilayers wherein A is an oxide of Al and wherein B is selected from one or more of an oxide of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V, and Nb, wherein Al (and/or optionally Si) is in a layer together with one or more of the other indicated elements, when the other layer(s) of the multilayer comprise an oxide of alumina, respectively, especially wherein B is selected from one or more of an oxide of Hf, Zn, Ta, Zr, Ti, Y, Ga, Ge, V, and Nb, yet even more especially wherein B is selected from one or more of an oxide of Hf, Ta, Zr, and Ti, more especially wherein B is selected from one or more of an oxide of Hf, Ta, and Zr.
- B may further comprise an oxide of Si (optionally in combination with one or more of the oxides of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V, and Nb).
- the SiCh (ALD) layer is deposited such that it not directly contacts the main sol-gel layer.
- the A layer (or B layer) of a multilayer may be an SiCh layer and the B layer (or A layer) contacting the main sol-gel layer may be an (ALD) layer having another chemical composition.
- the main ALD multilayer is thus especially provided on the primer layer.
- the main sol-gel layer is especially provided on the main ALD multilayer.
- one or more further layers may be applied, especially a further ALD layer may be provided on top of the main sol-gel layer.
- the further ALD layer may comprise an ALD multilayer, for instance an ALD multilayer as described herein in relation to the main ALD multilayer.
- the method further comprises (iv) providing a further ALD coating layer onto the luminescent core with the main sol-gel coating by application of a further atomic layer deposition process. Especially, thereby a further ALD coated luminescent particle is provided.
- a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si), especially comprising Al, Hf, Ta, Zr, Ti.
- the further ALD coating layer has a further ALD coating layer thickness (d4) in the range of 2-50 nm, especially 10-50 nm, such as 10- 20 nm.
- the further ALD coating layer especially has a chemical composition differing from the chemical composition of the main sol-gel coating layer.
- the further ALD coating layer (optionally) comprises (is provided comprising) a further multilayer with two or more (further sub) layers having different chemical compositions, wherein one or more of the layers comprise metal oxides selected from a group of AI2O3, TiCh, ZrCh, HfCh, SnCh, ZnO and Ta205, and wherein the two or more layers have a chemical composition differing from the chemical composition of the main sol-gel coating layer.
- the metal oxide precursor for the two or more (further sub) layers (of the further multilayer) is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti.
- the metal oxide precursor for the two or more (further sub) layers (of the further multilayer) is especially selected from a group of metal oxide precursors comprising Al, Hf, Ta, Zr, Ti.
- the main ALD coating layer comprises a multilayer with a stack of layers, with adjacent layers having different chemical compositions.
- the layers of the multilayer have each independently thicknesses in the range of 1-40 nm, especially 1-10 nm.
- the multilayer comprises one or more alumina layers and one or more metal oxide layers, with the metal selected from a group of Hf, Ta, Zr and Ti.
- an oxygen source selected from a group consisting of H 2 0 and O3 are applied.
- an oxygen source selected from a group consisting of H 2 0 and O3 are applied.
- two or more different metal oxide precursors and/or two or more different oxygen sources may be applied.
- a multilayer is provided, with layers having different chemical compositions, wherein one or more layers comprise tantalum oxide (especially Ta 2 05).
- the invention also provides in embodiments luminescent material, wherein the main ALD coating layer comprises a multilayer with layers having different chemical compositions, wherein one or more layers may especially comprise Ta 2 05.
- the main ALD coating layer comprises a multilayer with layers having different chemical compositions, wherein one or more layers may especially comprise Ta 2 05.
- a multilayer is provided, with layers having different chemical compositions, wherein one or more layers comprise one or more of tantalum oxide (especially Ta 2 05), hafnium oxide, titanium oxide, and zirconium oxide.
- the invention also provides in embodiments luminescent material, especially luminescent particles, wherein the main ALD coating layer comprises a multilayer with layers having different chemical compositions, wherein one or more layers may especially comprise one or more of tantalum oxide, hafnium oxide, titanium oxide and zirconium oxide.
- the multilayer stack may also include a stack with alternating layers wherein e.g. alumina alternates with one or more of tantalum oxide (especially Ta 2 05), hafnium oxide, titanium oxide, and zirconium oxide, such as a stack comprising e.g. alumina- tantalum oxide-alumina-Hafnia-alumina-tantalum oxide, or alumina-titanium oxide-alumina, etc..
- the ALD layer thickness may in such embodiments have to be increased more than in principle would be necessary, which may lead to an unnecessary reduction in transmission (even though in some cases small). Further, it appeared that after providing the primer layer at the core (even when not being completely conformal), an ALD coating coats more easily to the core.
- the main sol-gel layer that typically has an average thickness in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm, and is formed by a sol-gel type process.
- an inorganic network is formed from a homogeneous solution of precursors by subsequent hydrolysis to form a sol (colloidal suspension) and condensation to then form a gel (cross-linked solid network) that is chemically bonded to the powder surfaces.
- the (main) sol-gel coating layer material is silica and the sol-gel deposition method corresponds to the so-called Stober reaction as described in Stober, W., A. Fink, et ak.
- the (coated or uncoated) luminescent particle is dispersed in an alcohol such as an aliphatic alcohol R-OH such as methanol CFLOFl, ethanol C2H5OH or iso-propanol C3H7OH followed by addition of ammonia (NFL solution in water) and a silicon alkoxide precursor.
- R-OH such as methanol CFLOFl, ethanol C2H5OH or iso-propanol C3H7OH
- ammonia NNL solution in water
- silicon alkoxide precursor dissolves in the alcohol + ammonia mixture and starts to hydrolyze.
- a conformal silica coating is formed on top of the (coated or uncoated) particle surfaces by reaction of the hydrolyzed, yet dissolved sol species with reactive groups of the particle surfaces (e.g. amine or silanol groups) followed by a seeded growth process that consists of hydrolysis, nucleation and condensation reactions steps.
- reactive groups of the particle surfaces e.g. amine or silanol groups
- (coated or uncoated) particle surface” in relation to the sol-gel coating process may especially relate to the surface of the particle (luminescent core) and/or the surface of the washing result layer (especially the oxide-containing layer) on the particle (luminescent core), especially in relation to the primary sol-gel coating process.
- the term may further relate to the surface of the main ALD coating, especially in relation to the main sol-gel coating process.
- the silicon alkoxide precursor is especially selected from a group of compounds that is formed wherein a) Rl, R2, R3 are hydrolysable alkoxy groups and R4 is selected from a group of C1-C6 linear alkyl groups, hydrolysable alkoxy groups and a phenyl group, or b) Rl, R2, R3 are individually selected from -OCH3 and -OC2H5 and R4 is selected from -CH3, -C2H5, -OCH3, -OC2H5 and a phenyl group.
- the silicon based polymer is obtained from a material from the group of:
- a silicon alkoxide precursor is used, wherein the silicon alkoxide precursor is especially selected from a group of compounds consisting wherein a) Rl, R2, R3 are hydrolysable alkoxy groups and R4 is selected from a group of C1-C6 linear alkyl groups, hydrolysable alkoxy groups and a phenyl group, or b) Rl, R2, R3 are individually selected from -OCH3 and -OC2H5 and R4 is selected from -CH3, -C2H5, -OCH3, -OC2H5 and a phenyl group.
- a silicon alkoxide precursor in the main sol-gel coating process, is used, and the silicon alkoxide precursor is selected from a group consisting of
- a silicon alkoxide precursor in the primary sol-gel coating process, is used, and especially the silicon alkoxide precursors may be a silicon alkoxide precursor as described herein in relation to the main sol-gel coating process.
- the silicon alkoxide precursor in the primary sol-gel coating process may be independently selected from the silicon alkoxide precursor in the main sol-gel coating process.
- the silicon alkoxide precursor (in the main and/or primary sol-gel coating process) is selected from a group of Si(OCH3)4 or Si(OC2H5)4, more especially Si(OC2H5)4 is used as silicon alkoxide precursor. Similar precursors but based on another metal such as e.g. A1 may also be used.
- a typical sol-gel coating process may comprise the following stages: (a) particles or powder, especially luminescent cores) (optionally with the oxide-containing layer and/or the main ALD coating layer) are suspended in an alcohol - aqueous ammonia solution mixture while stirring or sonication. To improve particle dispersion, the particles (cores / powder) can also first be mixed with alcohol and a small amount of a silicon (or other metal) alkoxide before the ammonia solution is added (b) A silicon (or other metal) alkoxide precursor is added under agitation of the suspension.
- Typical concentrations of silicon (or other metal) alkoxide, ammonia and water in the alcohol solvent are 0.02-0.7, 0.3-1.5, and 1- 16 mole/1, respectively (c) The suspension is stirred or sonicated until the coating has formed (d) The coated powder is washed with alcohol and dried followed by calcination in air or vacuum at 200 - 300°C.
- the main sol-gel coating process comprises: (iiia) providing a mixture of an alcohol, ammonia, water, the luminescent core(s) with the (primer layer and) the main ALD coating layer and a metal alkoxide precursor while agitating the mixture, and allowing a main sol-gel coating layer to be formed on the main ALD coating layer , wherein the metal alkoxide precursor is especially titanium alkoxide, silicon alkoxide, or aluminum alkoxide; and (iiib) retrieving the luminescent core(s) with (the primer layer,) the main ALD coating layer and the main sol-gel coating layer from the mixture and optionally subjecting the retrieved luminescent core(s) with the primer layer, the main ALD coating layer and the main sol-gel coating layer to a heat treatment to provide the luminescent particle(s) with hybrid coating.
- the primary sol-gel coating process comprises: (ibl) providing a mixture of an alcohol, ammonia, water, the luminescent core(s) optionally with the washing result layer, especially the luminescent core(s) and the washing result layer (or the luminescent core(s) comprising the washing result layer) and a metal alkoxide precursor while agitating the mixture, and allowing the primary sol-gel coating layer to be formed on the washing result layer and/or on the luminescent core(s) without a washing result layer, especially on the washing result layer, wherein the metal alkoxide precursor is especially selected from titanium alkoxide, silicon alkoxide, or aluminum alkoxide; and (ib2) retrieving the luminescent core(s) with the (washing result layer and the) primary sol-gel coating layer from the mixture and optionally subjecting the retrieved luminescent core(s) with (the washing result layer and) the primary sol-gel coating layer to a heat treatment to provide the luminescent core(s) compris
- the process of retrieving the core(s) (with the respective (coating) layers) from the mixture may e.g. include one or more of filtration, centrifuging, decanting (the liquid over a precipitate), etc..
- the heat treatment may include one or more of drying and calcination, especially both, i.e. e.g. a drying stage at a temperature in the range of 70-130 °C followed by a calcination stage (in air; or vacuum or an (other) inert atmosphere).
- the (coated) luminescent may be in an inert environment, such as vacuum, or one or more of N2 and a noble gas, etc.
- a silicon (or other metal; though the formula below refers to Si) alkoxide especially a precursor may be used selected from a group of compounds consisting of: , wherein Rl, R2, R3 are selected from a group consisting of hydrolysable alkoxy moieties and R4 is selected from a group consisting of C1-C6 linear alkyl moieties, hydrolysable alkoxy moieties, and a phenyl moiety.
- Rl, R2, R3 are selected from a group consisting of hydrolysable alkoxy moieties
- R4 is selected from a group consisting of C1-C6 linear alkyl moieties, hydrolysable alkoxy moieties, and a phenyl moiety.
- other ligands than alkoxides may be applied in precursor for the sol-gel process.
- the particles obtained with a sol-gel coating process may optionally include more than one nucleus.
- agglomerates with a (primary and/or main) sol-gel coating may be obtained.
- the silica precursor or other metal oxide precursor
- the precursors for the sol-gel coating are especially described in relation to a silicon alkoxide precursor.
- aluminum (or another metal) alkoxide precursor(s) may be applied.
- a combination of two or more chemically different precursors may be applied for providing the sol-gel coating layer or first coating layer.
- sol-gel coating process may also relate to a plurality of sol-gel coating processes.
- a plurality of sol-gel coating processes especially a plurality of main sol-gel coating processes, one may provide a (multi)layer substantially comprising the same composition through the entire layer thickness (when e.g. in the (main) sol-gel coating process each coating stage or step includes depositing substantially the same material), or may provide a multilayer with two or more layers having different compositions, such as a stack of two or more (sol-gel) layers with two or more different compositions, respectively.
- An example may e.g. be a S1O2-AI2O3 (sol-gel) multilayer, such as a stack of three or more (sol-gel) layers wherein S1O2 and AI2O3 alternate (see also above).
- the luminescent core may comprise the primer layer.
- the primer layer comprises the primary sol-gel coating layer (optionally including a multilayer), especially provided by the (primary) sol-gel coating process.
- the primary sol-gel coating layer may facilitate the deposition of a (thin) conformal main ALD coating layer.
- the surface of the core is in embodiments cleaned before providing the primary sol-gel layer and/or the main ALD coating layer.
- any chemically reactive contamination also known as “second phases” that may be present in the powder (raw product, especially comprising a plurality of luminescent cores) may be removed.
- small particles typically having a sub-micron dimension, and that may stick to the surface of the phosphor particle (luminescent core) are removed as well before depositing the main ALD coating process.
- the cleaning of the surface of the core may especially comprise a (chemical) washing process.
- the core may be washed by applying a washing process, by applying an aqueous liquid.
- Such aqueous liquid may comprise an acid or a base or may e.g. consist of water (with a neutral pH). Water may e.g. be applied for removing small unwanted particles and part of the second phases. Yet, for removing additional impurities the pH of the aqueous liquid may be changed, e.g. to pH- values of at least 8, especially at least 9, or to pH values below 6, especially below 5. This way, e.g. impurities may be dissolved.
- a non-aqueous solvent may be applied, especially for particles (cores) that may be sensitive to water.
- an aqueous liquid comprising additives e.g.
- the cleaning/washing process may be indicated as a “chemical washing process”, especially by applying a washing solvent (including an aqueous liquid).
- washing procedures with very mild conditions may be applied to remove 2 nd phases without dissolving (part of) the phosphor particles. This can be achieved by choosing weak instead of strong acids with pKa values that may be selected depending on the stability of the phosphor and impurity phases (see below). Additionally or alternatively degradation of the phosphor in the washing process may be avoided by first applying a non- aqueous solvent to the luminescent core(s) (phosphors) to provide a suspension (of the luminescent particles/cores) and successively add a weak acid (or base) in such a way that the total amount of water and the acid concentration are sufficient to only dissolve the impurity phases.
- a washing solvent having a pH less than 7 is useful for hydrolysis sensitive luminescent materials, as such luminescent materials as disclosed herein react as a base in aqueous media.
- the acidity of such washing solvent may be low.
- organic acids such as acetic acids diluted in a polar solvent with a low proton concentration, such as aliphatic alcohols, e.g. ethanol or isopropanol, as disclosed above, may be used as the washing solvent.
- the washing solvent should be, as the goal of the washing process is to remove basic impurity phases and create a surface at the particulate luminescent material that aids adhesion of the subsequent primer layer without degrading the luminescent material.
- a washing solvent of if a person having ordinary skill in the art observes that too much of the luminescent particle material is degrading or dissolving in the washing process, a reduction of the acid concentration, a replacement of the solvent by another solvent with a lower dielectric contant and/or a cooling of the washing suspension may reduce the amount of degradation.
- the number of fine particles in the phosphor powder may be further reduced by sedimentation in non-reactive liquids (typically polar organic solvents, like e.g. water-free ethanol, or other alcohols).
- non-reactive liquids typically polar organic solvents, like e.g. water-free ethanol, or other alcohols.
- ultrasound is applied to the suspension before sedimentation to better detach and disperse fine particles from larger phosphor grains.
- a thin layer may be formed at the particle (core) surface with a different composition compared to the nominal composition of the luminescent particle (luminescent core). That is, the surface composition of the particulate luminescent particle may differ somewhat from the overall composition of the particulate luminescent material.
- the thin layer i.e., surface
- Applying the chemical washing may in embodiments provide a washing result layer onto the luminescent core.
- the washing process may provide a surface (washing result layer) that aids in the adhesion of the subsequent primer layer.
- the thin layer/surface may contain, for example, alkaline earth elements (e.g., strontium), aluminum, and oxide when, for example alkaline earth aluminate type hydrolysis sensitive luminescent materials such as those disclosed herein are to be coated.
- the surface layer may contain elements such as lithium, silicon, europium, carbon and/or hydrogen, depending on the luminescent material.
- the washing result layer especially comprises an oxide-containing layer.
- the washing result layer not necessarily is conformally and/or entirely covering the surface of the luminescent core (see also above in relation to the primer layer).
- the washing result layer may not be a continuous layer and may e.g. comprise a plurality of layer section, each covering only a section of the surface of the luminescent core.
- the washing result layer may in embodiments be evenly distributed over (the surface of) the luminescent core.
- the washing result layer may in embodiments cover the core for at least 30%, such as at least 50%, especially at least 75%, such as at least 90%, or especially at least 95% or even more especially at least 99%, of the surface of the core.
- the luminescent core especially comprises nitride or oxonitride compounds.
- the luminescent material, especially of the luminescent core comprises a nitride luminescent material (core).
- the luminescent material, especially of the luminescent core (also) comprises an oxonitride luminescent material (core).
- the method further comprises (ia) providing a washing result layer onto the luminescent core by application of a chemical washing process, especially wherein the washing result layer comprises an oxide-containing layer.
- the application of the chemical washing process includes drying the luminescent core(s) after removing the washing solvent.
- the washing result layer may be provided during the washing of the luminescent core with the washing solvent and/or during drying of the luminescent core.
- the primary sol-gel coating is provided after application of the chemical washing process (optionally including the drying of the luminescent core).
- Application of the chemical washing process may provide a washed luminescent particle comprising the washing result layer onto the luminescent core.
- the method further comprises providing a primary sol-gel coating layer onto luminescent core and the washing result layer (or onto the luminescent core comprising the washing result layer) by application of a primary sol-gel coating process, thereby providing the primer layer comprising the washing result layer and the primary sol-gel layer , and especially wherein the primer layer has a primer layer thickness (dl) in the range of 0.1-5 nm.
- the washing solvent may in embodiments comprise an aqueous solvent.
- this washing with a solvent comprising an aqueous solvent
- the washing solvent comprises a strong acid or a strong base.
- strong acids are HC1, HBr, HCIO4, HI, HNO3.
- strong bases are e g. NaOH, KOH, CaOH.
- the washing solvent comprises a weak acid or a weak base. Examples of weak acids that may be used are e.g.
- acetic acid formic acid, hydrofluoric acid, trichloroacetic acid, citric acid, oxalic acid etc.
- weak bases are e.g. ammonia, sodium bicarbonate, alanine, and methylamine.
- the weak acid or the weak base may especially be selected having a pK a value or a pKb value respectively higher than 3, especially equal to or higher than 4 (in water at room temperature).
- the washing solvent comprises one or more weak acids selected from a group of acetic acid, formic acid, hydrofluoric acid, trichloroacetic acid, citric acid, oxalic acid.
- the washing solvent may especially comprise formic acid or acetic acid.
- the washing solvent comprises one or more weak based ammonia, sodium bicarbonate, alanine, and methylamine.
- the washing solvent may especially comprise a combination of a non-aqueous fluid and a weak acid or a weak base.
- the washing solvent may in embodiments comprise an alcohol (e.g. propanol, isopropyl alcohol, ethanol, (cyclo) hexanol or any other alcohol with one or more hydroxy groups) and a weak acid, e.g. formic acid and/or acetic acid.
- the washing solvent may in embodiments comprise mixtures of an alcohol and a polyol.
- the washing solvent comprises a mixture of ethanol and as triethylene glycol and especially traces as water acting as a dissolution catalyst. Such combination may advantageously be applied for washing luminescent particles (cores) that may easily degrade under the influence of water.
- the washing solvent may in embodiments comprise less than 50 wt% water (relative to the weight of the washing solvent).
- the washing solvent may e.g. comprise equal to or less than 40 wt% water, such as equal to or less than 35 wt% water.
- the washing solvent may comprise no more than 25 wt% water.
- the washing solvent (comprising a (weak) base or (weak) acid) comprises at least 5 wt% water, such as at least 10 wt% water.
- the washing solvent is a non-aqueous washing solvent.
- the application of weak acids (and weak bases) may have a further benefit in that they may provide a pH buffering function.
- the pH of the washing solvent may not substantially change if an extra amount of the weak acid (or base) is added to the washing solvent (e.g. if not all impurities are removed by the washing solvent yet).
- Using weak acids or weak bases may increase the robustness of the wet washing process.
- the chemical washing process may especially comprise a wet chemical washing process comprising (i) washing the luminescent core by applying a washing solvent (process), wherein the washing solvent comprises an (weak) acid or a (weak) base, especially a (weak) acid, and wherein the washing solvent comprises equal to or less than 50 % wt/wt water, especially in the range of 10-35% wt/wt water and optionally (ii) successively subjecting the luminescent core to a drying treatment, thereby providing the luminescent core comprising the washing result layer on(to) the luminescent core.
- a washing solvent process
- the washing solvent comprises an (weak) acid or a (weak) base, especially a (weak) acid
- the washing solvent comprises equal to or less than 50 % wt/wt water, especially in the range of 10-35% wt/wt water and optionally (ii) successively subjecting the luminescent core to a drying treatment, thereby providing the luminescent core comprising the
- the oxygen-containing layer may be provided on the luminescent particle.
- the different (coating) layers that may be configured at the luminescent core are especially light transmitting. This means that at least a portion of the light, which impinges on the respective layers, is transmitted through the respective layer.
- the different (coating) layers may be fully or partially transparent or may be translucent. In an embodiment, more than 90% of the (visible) light which impinges on the (coating) layers is transmitted through the (coating) layers.
- the (coating) layers may be light transmitting because of characteristics of the materials of which the coating layers are made. For example, the coating layer may be made from a material which is transparent, even if the layer is relatively thick.
- one or more of the (coating) layers are thin enough such that the respective layer becomes light transmitting while the material of which the layer is manufactured is not transparent or translucent when manufactured in relatively thick layers.
- the materials described herein are all transmissive for (visible) light or can be made in suitable layer thicknesses that are transmissive for (visible) light.
- the invention also provides a lighting device comprising a light source configured to generate light source radiation, especially one or more of blue and UV, and a wavelength converter comprising the luminescent material as described herein, wherein the wavelength converter is configured to convert at least part of the light source radiation into wavelength converter light (such as one or more of green, yellow, orange and red light).
- the wavelength converter is especially radiationally coupled to the light source.
- radiationally coupled especially means that the light source and the luminescent material are associated with each other so that at least part of the radiation emitted by the light source is received by the luminescent material (and at least partly converted into luminescence).
- the wavelength converter comprises a matrix (material) comprising the luminescent material (particles).
- the matrix (material) may comprise one or more materials selected from a group consisting of a transmissive organic material support, such as selected from a group consisting of PE (polyethylene), PP (polypropylene), PEN (polyethylene napthalate), PC (polycarbonate), polymethylacrylate (PMA), polymethylmethacrylate (PMMA) (Plexiglas or Perspex), cellulose acetate butyrate (CAB), silicone, polyvinylchloride (PVC), polyethylene terephthalate (PET), (PETG) (glycol modified polyethylene terephthalate), PDMS (polydimethylsiloxane), and COC (cyclo olefin copolymer).
- the matrix (material) may comprise one or more materials selected from a group consisting of a transmissive organic material support, such as selected from a group consisting of PE (polyethylene),
- luminescent material that would likely degrade under the conditions used to form the matrix in which the luminescent particles are embedded to form the wavelength converter may be used in lighting devices (as shown in Fig. 3 below).
- Such hydrolysis sensitive luminescent materials include, for example, luminescent particles disclosed above that include a luminescent material selected from (the) SrLiAbN4:Eu 2+ (class), in which, optionally also part of Sr may be replaced by another alkaline earth metal (group 2 elements of the periodic table). And also, for example, luminescent material (or phosphor) selected from a group consisting of (Sr,Ca)LiAbN4:Eu,
- the coating disclosed herein allows such hydrolysis sensitive luminescent materials to be used in processes for forming wavelength converters, for example, processes for forming wavelength converters in which luminescent particles are embedded within a matrix, such as silicone resins, which otherwise may degrade the uncoated luminescent materials.
- the lighting device may be part of or may be applied in e.g. office lighting systems, household application systems, shop lighting systems, home lighting systems, accent lighting systems, spot lighting systems, theater lighting systems, fiber-optics application systems, projection systems, self-lit display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, green house lighting systems, horticulture lighting, or LCD backlighting.
- the lighting unit may be used as backlighting unit in an LCD display device.
- the invention also provides an LCD display device comprising the lighting unit as defined herein, configured as backlighting unit.
- the invention also provides in a further aspect a liquid crystal display device comprising a back lighting unit, wherein the back lighting unit comprises one or more lighting devices as defined herein.
- the light source is a light source that during operation emits (light source radiation) at least light at a wavelength in the range of 200-490 nm, especially a light source that during operation emits at least light at wavelength in the range of 400-490 nm, even more especially in the range of 440-490 nm.
- This light may partially be used by the wavelength converter nanoparticles (see further also below).
- the light source is configured to generate blue light.
- the light source comprises a solid state LED light source (such as a LED or laser diode).
- the term “light source” may also relate to a plurality of light sources, such as 2-20 (solid state) LED light sources.
- the term LED may also refer to a plurality of LEDs.
- white light herein, is known to the person skilled in the art. It especially relates to light having a correlated color temperature (CCT) between about 2000 and 20000 K, especially 2700-20000 K, for general lighting especially in the range of about 2700 K and 6500 K, and for backlighting purposes especially in the range of about 7000 K and 20000 K, and especially within about 15 SDCM (standard deviation of color matching) from the BBL (black body locus), especially within about 10 SDCM from the BBL, even more especially within about 5 SDCM from the BBL.
- the light source may also provide light source radiation having a correlated color temperature (CCT) between about 5000 and 20000 K, e.g.
- the light source is configured to provide light source radiation with a correlated color temperature in the range of 5000-20000 K, even more especially from the range of 6000-20000 K, such as 8000- 20000 K.
- An advantage of the relative high color temperature may be that there may be a relatively high blue component in the light source radiation.
- controlling and similar terms especially refer at least to determining the behavior or supervising the running of an element.
- controlling and similar terms may e.g. refer to imposing behavior to the element (determining the behavior or supervising the running of an element), etc., such as e.g. measuring, displaying, actuating, opening, shifting, changing temperature, etc..
- controlling and similar terms may additionally include monitoring.
- controlling and similar terms may include imposing behavior on an element and also imposing behavior on an element and monitoring the element.
- the controlling of the element can be done with a control system, which may also be indicated as “controller”.
- the control system and the element may thus at least temporarily, or permanently, functionally be coupled.
- the element may comprise the control system.
- the control system and element may not be physically coupled. Control can be done via wired and/or wireless control.
- the term “control system” may also refer to a plurality of different control systems, which especially are functionally coupled, and of which e.g. one control system may be a master control system and one or more others may be slave control systems.
- a control system may comprise or may be functionally coupled to a user interface.
- the control system may also be configured to receive and execute instructions form a remote control.
- the control system may be controlled via an App on a device, such as a portable device, like a Smartphone or I-phone, a tablet, etc..
- the device is thus not necessarily coupled to the lighting system but may be (temporarily) functionally coupled to the lighting system.
- control system may (also) be configured to be controlled by an App on a remote device.
- the control system of the lighting system may be a slave control system or control in a slave mode.
- the lighting system may be identifiable with a code, especially a unique code for the respective lighting system.
- the control system of the lighting system may be configured to be controlled by an external control system which has access to the lighting system on the basis of knowledge (input by a user interface of with an optical sensor (e.g. QR code reader) of the (unique) code.
- the lighting system may also comprise means for communicating with other systems or devices, such as on the basis of Bluetooth, WIFI, LiFi, ZigBee, BLE or WiMAX, or another wireless technology.
- the system, or apparatus, or device may execute an action in a “mode” or “operation mode” or “mode of operation”. Likewise, in a method an action or stage, or step may be executed in a “mode” or “operation mode” or “mode of operation” or “operational mode”.
- mode may also be indicated as “controlling mode”. This does not exclude that the system, or apparatus, or device may also be adapted for providing another controlling mode, or a plurality of other controlling modes. Likewise, this may not exclude that before executing the mode and/or after executing the mode one or more other modes may be executed.
- a control system may be available, that is adapted to provide at least the controlling mode.
- the choice of such modes may especially be executed via a user interface, though other options, like executing a mode in dependence of a sensor signal or a (time) scheme, may also be possible.
- the operation mode may in embodiments also refer to a system, or apparatus, or device, that can only operate in a single operation mode (i.e. “on”, without further tunability).
- control system may control in dependence of one or more of an input signal of a user interface, a sensor signal (of a sensor), and a timer.
- timer may refer to a clock and/or a predetermined time scheme.
- Fig. 1 schematically depicts aspects of a luminescent particle
- Fig. 2a-2b schematically depict some further aspects of a luminescent particle
- Fig. 3 schematically depicts a lighting device
- Fig. 4a-4b show a SEM and a TEM image of a luminescent particle
- Figs. 5a-5b show some experimental results wherein embodiments of the invention are compared to prior art luminescent materials.
- Figs. 6a -6b show, respectively, cross-sectional and top schematic views of an array of pcLEDs.
- Fig. 7a shows a schematic top view of an electronics board on which an array of pcLEDs may be mounted
- Fig. 7b similarly shows an array of pcLEDs mounted on the electronic board of Fig. 7a.
- Fig. 8a shows a schematic cross-sectional view of an array of pcLEDs arranged with respect to waveguides and a projection lens.
- Fig.8b shows an arrangement similar to that of Figure 8a, without the waveguides.
- Fig. 9 schematically illustrates an example camera flash system comprising an adaptive illumination system.
- Fig. 10 schematically illustrates an example display (e.g., AR/VR/MR) system that includes an adaptive illumination system.
- an example display e.g., AR/VR/MR
- AR/VR/MR adaptive illumination system
- Fig. 1 schematically depicts an embodiment of the luminescent particles 100.
- the luminescent particle 100 comprises a luminescent core 102 comprising a primer layer 105 on the luminescent core 102.
- the luminescent core 102 with the primer layer 105 is also referred to as a primer layer 105 comprising luminescent particle 100.
- the primer layer 105 has a chemical composition differing from the chemical composition of the core 102.
- the luminescent core 102 may include e.g. micrometer dimensional particles of a luminescent nitride or sulfide phosphor but may also include other (smaller) material such as luminescent nanoparticles (see further Fig. 2b).
- the luminescent particle 100 further comprises a main ALD coating layer 120.
- the main ALD coating layer 120 comprises a multilayer 1120 with three layers 1121, layer 1121a, layer 1121b, and layer 1121c.
- the three layers 1121a, 1121b, 1121c especially have (at least two) different chemical compositions. Especially adjacently (and contacting) arranged layers 1121 have different compositions.
- one or more of the layers 1121 of the multilayer 1120 may have chemical compositions (also) differing from the chemical composition of the primer layer 105.
- the layers 1121 may in embodiments e.g. comprise different oxides of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V. Additionally or alternatively, the layers 1121 may comprise Si and/or Ge. Especially one of the layers 1121 may be an alumina layer.
- the luminescent particle 100 further comprises a main sol-gel coating layer 130, especially having a chemical composition differing from one or more of the layers 1121 of the multilayer 1120.
- the figure further shows that main ALD coating layer 120 is arranged between the primer layer 105 and the main sol-gel layer 130. Especially, adjacently arranged /contacting coating layers may have different compositions.
- layer 1121a especially has a composition that differs from the composition of the main sol-gel layer 130.
- Layer 1121c especially has a composition that differs from the composition of the primer layer 105.
- the hybrid coating of the embodiment in Fig. 1 thus comprises a primer layer 105, a main ALD layer 120 and a main sol-gel coating layer 130.
- the hybrid coating further comprises a further ALD coating layer 140.
- the embodiment of Fig. 2a also comprises a further ALD coating layer 140 arranged on the main sol-gel coating layer 130.
- the further ALD coating layer 140 (also) comprises a further multilayer 1140 comprising two (further sub) layers 1141, 1141a, 1141b (of the further multilayer 1140).
- the further ALD coating layer 140 is (deposited as) a single layer.
- the thicknesses of the layers are indicated. It is noted that the thicknesses are not to scale and only are depicted to explain the meaning of the terms and show the location.
- the primer layer thickness is indicated by the reference dl.
- the primer layer thickness dl may be in the range of 0.1-5 nm.
- the ALD coating layer thickness is indicated with the reference d2.
- the ALD coating layer thickness d2 may especially be in the range of 5-250 nm.
- the thickness of the main sol-gel coating 130 is indicated with reference d3.
- the main sol-gel coating layer thickness d3 is generally larger than the ALD coating layer thickness d2.
- the main sol-gel coating layer thickness d3 is especially in the range of 50-700 nm.
- the depicted embodiment comprises a multilayer 1120 with three layers 1121, each layer 1121 having a layer coating layer thickness d21 in the range of 1-20 nm. In the depicted embodiment, the layer coating thickness d21 of the three layers 1121 is about the same.
- the layer coating thickness d21 may though vary between the different layers 1121, see e.g.
- the three layers 1121a, 1121b and 1121c may e.g. depict alternating AI2O3 layers (by way of example 1121b) and Ta20s layers (by way of example 1121a, 1121c).
- the (further sub) layer coating layer thickness (not indicated with a reference) of the (further sub) layers 1141 of the further multilayer 1140 may especially be in the ranges as described in relation to the layer coating layer thickness d21 of the layers 1121 of the multilayer 1120.
- Fig. 2a further schematically depicts that the primer layer 105 comprises an oxide-containing layer 101 and a primary sol-gel layer 110.
- the oxide-containing layer 101 is arranged at a surface 67 of the core 102.
- the oxide-containing layer 101 and the primary sol-gel layer 110 are continuous and conformal. Yet, in further embodiments, this may not be the case, and e.g. the main ALD coating layer 120 may contact the oxide- containing layer 101 at some locations and may even contact the surface 67 of the core at some further location (while contacting the primary sol-gel layer 110 at other locations.
- Fig. 2a further indicates with references 17, 27, 37, 47, 57 the surfaces of respective layers, and with reference 67 the surface of the core 102.
- the layer thicknesses described herein are especially average layer thicknesses. Especially at least 50%, even more especially at least 80%, of the area of the respective layers have such indicated layer thickness.
- a layer thickness in the range of e.g. 5-250 nm may be found, with the other less than at least 50% of the surface area 37 e.g. smaller or larger thicknesses may be found, but in average d2 of the main ALD coating (multi-)layer 120 is in the indicated range of 5-250 nm.
- this thickness may over at least 50% of the area of 27 be in the range of 50-700 nm, with the other less than at least 50% of the surface area 27 e.g. smaller or larger thicknesses may be found, but in average dl of the first layer main sol-gel layer 130 is in the indicated range of 50-700 nm, such as especially 100-500 nm.
- Fig. 2b schematically depicts an embodiment wherein the luminescent core 102 includes a luminescent nanoparticle, here by way of example a quantum dot 160.
- the quantum dot in this example comprises a quantum rod with a (semiconductor) core material 161, such as ZnSe, and a shell 162, such as ZnS.
- a quantum rod with a (semiconductor) core material 161, such as ZnSe
- a shell 162 such as ZnS.
- luminescent quantum dot 160 can also be provided with the hybrid coating.
- Figs 1-2 schematically depict luminescent particles 100 having a single nucleus. However, optionally also aggregates encapsulated with the hybrid coating may be formed. This may especially apply for quantum dots as luminescent particles defining the luminescent core 102.
- the figures especially depict embodiments of the coating architecture on phosphor particles or luminescent cores 102 (after applying the respective (ALD and sol-gel) coating processes).
- the phosphor particles 102 may be covered by an oxide layer 101 formed by a washing and baking process.
- the primary sol-gel coating 110 comprises in embodiments silicon oxide (SiCh) provided by a (primary) sol-gel coating process.
- the first SiCh layer 110 especially acts as nucleation or seed layer for the main ALD coating layer 120, provided by a main atomic layer deposition process. Therefore, (the primary layer 105 as well as) the primary sol-gel coating layer 110 does not need to form a conformal or fully closed coating around each core 102.
- the primary sol-gel coating layer 110, e.g. the primary SiCh layer 110 can also be seen as a surface treatment to provide OH-groups on the phosphor particles 102. Such OH-groups may assist the ALD precursors to bond on the surface and consequently initiate film growth.
- the main ALD coating layer 120 especially comprises a multilayer 1120 also called “nanolaminate” 1120 of metal oxides (sub-)layers 1121.
- a nanolaminate 1120 may form an extremely dense and nearly pinhole free conformal coating on phosphor particles that is almost impermeable to gases like water vapor and oxygen.
- the nanolaminate protection layer 1120 may in embodiments have a thickness d2 of 20-50 nm consisting of more than two sub-layers of AhCh, TiCh, ZrCh, HfCh, SnCh, ZnO or Ta2Cb.
- Each layer 1121 may have a thickness d21 in the range of 1 nm-15 nm.
- the outer layer 1121 i.e.
- the layer (1121a in Figs 1 and 2a) contacting the main sol gel coating layer 130 is in embodiments a chemical stable layer such as HfCh, ZrCh or Ta2Ch that does not corrode when exposed to water or other solvents such as cyclohexanone.
- the main sol-gel coating layer 130 may also comprise silicon oxide (SiCh) provided by the (main) sol-gel coating process, analog to the primary sol-gel coating layer 110.
- the main sol-gel coating 130 may especially function as mechanical protection to prevent damage of the underlying barrier coating 120.
- phosphor particles undergo various process steps, such as mixing, sieving, pressing, and molding. These process steps may induce mechanical stress in the coating. As a results the coating might be damaged.
- the main sol-gel coating layer 130 provides a high robustness against post-processing and fabrication steps.
- a further ALD coating layer 140 is added to the layer architecture, as depicted in Fig. 2a.
- the further ALD coating layer 140 in the embodiment comprises a nanolaminate 1140.
- the layer 140 or multilayer 1140 may comprise metal oxides such as AI2O3, T1O2, ZrCh, HfCh, SnCh, ZnO or Ta205.
- the total thickness d4 of the layer 140 is especially in the range of 10-50 nm.
- the further ALD coating layer 140 may further stabilize the overall coating structure by filling pores and pin-holes in the main sol-gel coating layer 130.
- the further ALD coating layer 140 can suppress the surface reactivity of the main sol-gel layer 130.
- This surface reactivity may be in embodiments of LED manufacturing processes be advantageous for maintaining the rheology or other properties of certain silicone phosphor slurries.
- Fig. 3 schematically depicts a lighting device 20 comprising a light source 10 configured to generate light source radiation 11, especially one or more of blue and UV, as well as a wavelength converter 30 comprising the luminescent material 1 with particles 100 as defined herein.
- the wavelength converter 30 may e.g. comprise a matrix, such as a silicone or organic polymer matrix as described above, with the coated particles 100 embedded therein.
- the wavelength converter 30 is configured to (wavelength) convert at least part of the light source radiation 11 into wavelength converter light 31.
- light source radiation 11 may pass the wavelength converter 30 (without being converted).
- the wavelength converter light 31 at least includes luminescence from the herein described coated particles 100.
- the wavelength converter 30 may optionally include also one or more other luminescent materials.
- the wavelength converter 30, or more especially the luminescent material 1 may be arranged at anon-zero distance d30, such as at a distance of 0.1-100 mm.
- the distance d30 may be zero, such as e.g. when the luminescent material is embedded in a dome on a LED die.
- the distance d30 is the shortest distance between a light emitting surface of the light source 10, such as a LED die, and the wavelength converter 30, more especially the luminescent material 1.
- the light source 10 may be an LED, such that lighting device 20 is a phosphor- converter LED (“pcLED”).
- light source 10 may be a Ill-Nitride LED that emits ultraviolet, blue, green, or red light. LEDs formed from any other suitable material system and that emit any other suitable wavelength of light may also be used.
- Other suitable material systems may include, for example, Ill-Phosphide materials, Ill-Arsenide materials, and II-VI materials.
- Fig. 4a shows a SEM image of luminescent material 1 comprising some coated luminescent particles 100.
- a TEM image of a coated luminescent particle 100 is given, clearly showing or core 102 with an oxide-containing layer 101, a primary (SiC ) sol- gel coating layer 110, a main ALD coating layer 120, comprising a multilayer 1120 consisting of two AI2O3 layers 1121b, and two Ta20s layers 1121a, and a (S1O2) main sol-gel coating 130.
- coated luminescent particles 100 of the invention are compared to corresponding prior art luminescent particles.
- the prior art luminescent particles also comprise an ALD coating layer and a sol-gel coating layer.
- the sol-gel coating layer is configured directly at the surface of the luminescent core 102, and the ALD coating layer is configured onto the sol-gel coating.
- Fig 5a the (normalized) light output (Y-axis) over time, especially hours (X-axis) of the respective luminescent particles in silicone is given.
- the particles were kept at 130°C and 100% relative humidity.
- the circular markers indicate the luminescent particle 100 of the invention; the square markers indicate the prior art luminescent particle.
- Fig 5b the failure probability of white LEDs with the respective luminescent particles is given after maintaining the respective LEDs over 500 hours at 85°C and 85% relative humidity.
- the square markers indicate the luminescent particle 100 of the invention; the circular markers indicate the prior art luminescent particle. Note that the probability is given in percentages at the Y-axis in a logarithmical scale.
- the color point shift in Au'v' (sometimes also indicated as “(duV )”or “duv”) is given at the X-axis.
- the (LEDs comprising the) luminescent particles 100 of the invention clearly show less color shift (AuV is calculated as the Euclidian distance between a pair of chromaticity coordinates in the (u 1 , v') CIE 1976 color space).
- this invention concerns methods to improve the barrier properties of phosphor particle coatings. While the invention is generally applicable to various phosphor particles, it is particularly suitable for nitride based narrow-band, red-emitting phosphors like nitride aluminates or oxo nitride aluminates due to their high sensitivity against moisture.
- Figures 6A-6B show, respectively, cross-sectional and top views of an array 600 of pcLEDs 610, which pcLEDs 610 may be structured as lighting device 20, as shown in Fig. 3, that include a wavelength converter 30 comprising the coated luminescent particles 100 as defined herein included in phosphor pixels 606 with semiconductor diode 612 disposed on a substrate 602.
- Such an array may include any suitable number of pcLEDs arranged in any suitable manner. In the illustrated example the array is depicted as formed monolithically on a shared substrate, but alternatively an array of pcLEDs may be formed from separate individual pcLEDs.
- Substrate 602 may optionally comprise CMOS circuitry for driving the LED and may be formed from any suitable materials.
- Figures 6A-6B show a three-by-three array of nine pcLEDs, such arrays may include for example tens, hundreds, or thousands of LEDs. Individual LEDs (pixels) may have widths (e.g., side lengths) in the plane of the array, for example, less than or equal to 1 millimeter (mm), less than or equal to 500 microns, less than or equal to 100 microns, or less than or equal to 50 microns.
- mm millimeter
- LEDs in such an array may be spaced apart from each other by streets or lanes having a width in the plane of the array of, for example, hundreds of microns, less than or equal to 100 microns, less than or equal to 50 microns, less than or equal to 10 microns, or less than or equal to 5 microns.
- streets or lanes having a width in the plane of the array of, for example, hundreds of microns, less than or equal to 100 microns, less than or equal to 50 microns, less than or equal to 10 microns, or less than or equal to 5 microns.
- the illustrated examples show rectangular pixels arranged in a symmetric matrix, the pixels and the array may have any suitable shape or arrangement.
- microLEDs having dimensions in the plane of the array (e.g., side lengths) of less than or equal to about 50 microns are typically referred to as microLEDs, and an array of such microLEDs may be referred to as a microLED array.
- An array of LEDs may be formed as a segmented monolithic structure in which individual LED pixels are electrically isolated from each other by trenches and/or insulating material, but the electrically isolated segments remain physically connected to each other by portions of the semiconductor structure.
- the individual LEDs in an LED array may be individually addressable, may be addressable as part of a group or subset of the pixels in the array, or may not be addressable.
- light emitting pixel arrays are useful for any application requiring or benefiting from fine-grained intensity, spatial, and temporal control of light distribution. These applications may include, but are not limited to, precise special patterning of emitted light from pixel blocks or individual pixels. Depending on the application, emitted light may be spectrally distinct, adaptive over time, and/or environmentally responsive. Such light emitting pixel arrays may provide pre-programmed light distribution in various intensity, spatial, or temporal patterns. The emitted light may be based at least in part on received sensor data and may be used for optical wireless communications. Associated electronics and optics may be distinct at a pixel, pixel block, or device level.
- a pcLED array 600 may be mounted on an electronics board 700 comprising a power and control module 702, a sensor module 704, and an LED attach region 706.
- Power and control module 702 may receive power and control signals from external sources and signals from sensor module 704, based on which power and control module 702 controls operation of the LEDs.
- Sensor module 704 may receive signals from any suitable sensors, for example from temperature or light sensors.
- pcLED array 600 may be mounted on a separate board (not shown) from the power and control module and the sensor module.
- Individual pcLEDs may optionally incorporate or be arranged in combination with a lens or other optical element located adjacent to or disposed on the phosphor layer. Such an optical element, not shown in the figures, may be referred to as a “primary optical element”.
- a pcLED array 600 (for example, mounted on an electronics board 700) may be arranged in combination with secondary optical elements such as waveguides, lenses, or both for use in an intended application.
- light emitted by pcLEDs 610 is collected by waveguides 802 and directed to projection lens 804.
- Projection lens 804 may be a Fresnel lens, for example. This arrangement may be suitable for use, for example, in automobile headlights.
- FIG 8B light emitted by pcLEDs 610 is collected directly by projection lens 804 without use of intervening waveguides.
- This arrangement may be particularly suitable when pcLEDs can be spaced sufficiently close to each other and may also be used in automobile headlights as well as in camera flash applications.
- a microLED display application may use similar optical arrangements to those depicted in Figures 8A-8B, for example. Generally, any suitable arrangement of optical elements may be used in combination with the LED arrays described herein, depending on the desired application.
- An array of independently operable LEDs may be used in combination with a lens, lens system, or other optical system (e.g., as described above) to provide illumination that is adaptable for a particular purpose.
- an adaptive lighting system may provide illumination that varies by color and/or intensity across an illuminated scene or object and/or is aimed in a desired direction.
- a controller can be configured to receive data indicating locations and color characteristics of objects or persons in a scene and based on that information control LEDs in an LED array to provide illumination adapted to the scene.
- Such data can be provided for example by an image sensor, or optical (e.g. laser scanning) or non-optical (e.g. millimeter radar) sensors.
- Such adaptive illumination is increasingly important for automotive, mobile device camera, VR, and AR applications.
- FIG. 9 schematically illustrates an example camera flash system 900 comprising an LED array and lens system 902, which may be similar or identical to the systems described above.
- Flash system 900 also comprises an LED driver 906 that is controlled by a controller 904, such as a microprocessor.
- Controller 904 may also be coupled to a camera 907 and to sensors 908, and operate in accordance with instructions and profiles stored in memory 910.
- Camera 907 and adaptive illumination system 902 may be controlled by controller 904 to match their fields of view.
- Sensors 908 may include, for example, positional sensors (e.g., a gyroscope and/or accelerometer) and/or other sensors that may be used to determine the position, speed, and orientation of system 900.
- the signals from the sensors 908 may be supplied to the controller 904 to be used to determine the appropriate course of action of the controller 904 (e.g., which LEDs are currently illuminating a target and which LEDs will be illuminating the target a predetermined amount of time later).
- illumination from some or all pixels of the LED array in 902 may be adjusted - deactivated, operated at full intensity, or operated at an intermediate intensity.
- Beam focus or steering of light emitted by the LED array in 902 can be performed electronically by activating one or more subsets of the pixels, to permit dynamic adjustment of the beam shape without moving optics or changing the focus of the lens in the lighting apparatus.
- Fig. 10 schematically illustrates an example display (e.g., AR/VR/MR) system 1000 that includes an adaptive light emitting array 1010, display 1020, a light emitting array controller 1030, sensor system 1040, and system controller 1050. Control input is provided to the sensor system 1040, while power and user data input is provided to the system controller 1050.
- modules included in system 1000 can be compactly arranged in a single structure, or one or more elements can be separately mounted and connected via wireless or wired communication.
- the light emitting array 1010, display 1020, and sensor system 1040 can be mounted on a headset or glasses, with the light emitting controller and/or system controller 1050 separately mounted.
- the light emitting array 1010 may include one or more adaptive light emitting arrays, as described above, for example, that can be used to project light in graphical or object patterns that can support AR/VR/MR systems.
- arrays of microLEDs can be used.
- System 1000 can incorporate a wide range of optics in adaptive light emitting array 1010 and/or display 1020, for example to couple light emitted by adaptive light emitting array 1010 into display 1020.
- Sensor system 1040 can include, for example, external sensors such as cameras, depth sensors, or audio sensors that monitor the environment, and internal sensors such as accelerometers or two or three axis gyroscopes that monitor an AR/VR/MR headset position.
- Other sensors can include but are not limited to air pressure, stress sensors, temperature sensors, or any other suitable sensors needed for local or remote environmental monitoring.
- control input can include detected touch or taps, gestural input, or control based on headset or display position.
- system controller 1050 can send images or instructions to the light emitting array controller 1030. Changes or modification to the images or instructions can also be made by user data input, or automated data input as needed.
- User data input can include but is not limited to that provided by audio instructions, haptic feedback, eye or pupil positioning, or connected keyboard, mouse, or game controller.
- the invention provides a wet chemical washing (including drying) process of the powder phosphor (the luminescent core(s)) to form an oxide outer particle layer.
- a primary (SiC ) sol-gel layer may be deposited by a (primary) sol-gel process to provide the primary sol-gel layer with a thickness in the range of 0.5-5 nm.
- a multilayer may be deposited by ALD with a total ALD coating layer thickness d2 in embodiments of 20-50 nm and a (sub)layer thickness d21 of the layers 1121 of the multilayer 1120 in the range of 1-20 nm.
- the multilayer 1120 is especially comprised of two or more metal oxides such as AI2O3, T1O2, ZrCh, Hf02, SnCh, ZnO, Ta205.
- a third layer, especially a main sol-gel coating layer 130, e.g. of SiCh may be deposited by a (main) sol-gel process with a thickness in the range of 100-500 nm.
- a fourth layer 140 may be deposited by a further ALD process.
- the further ALD coating layer 140 may in embodiments have a total thickness d4 of 5-50 nm and especially may comprise a multilayer with sub-layer thickness in the range of 1 -20 nm.
- the multilayer is in embodiments comprised of one or more metal oxides, such as AI2O3, TiCh, ZrCh, HfCh,
- Sro.995Li2Ali.995Sio.oo50i.995N2.oo5:Euo.oo5 was mixed 30.0g ethanol and 30. Og triethylene glycol with the suspension showing a total water content in the 0.05-0.1% range in an ultrasonic bath followed by a 16hr treatment at 80°C in a closed pressure vessel. After cooling down to room temperature, the phosphor powder was washed with ethanol and dried at 100°C under ambient atmosphere.
- a primary sol-gel coating layer was provided.
- 200 g phosphor powder (typically after washing) were stirred in 960 g ethanol.
- 3.5 g tetraethyl orthosilicate were added and stirred for 10 min under sonication.
- 90g 25wt% aqueous ammonia solution were added and stirring under sonication is continued for another 20 min.
- Fine particles including nanosized silica particles formed as by-product were removed by threefold sedimentation in ethanol and decantation.
- the coated powder was dried at 50°C in vacuum overnight. After dry-sieving (mesh size lOOpm) the coating was cured by heating the powder to 300°C for 10 hr. under vacuum.
- ALD nanolaminate ( ⁇ 25nm)
- a main ALD coating layer comprising an ALD nanolaminate was applied on primer layer comprising phosphor particles (comprising SrLiAbN4:Eu) in a Picosun Oy ALD R200 reactor.
- Precursor materials were trimethylaluminum and FLO to form an AI2O3 film and (tert-Butylimido)tris(ethylmethylamino) tantalum (V) and H2O to form a Ta2Cri film.
- the deposition temperature was set to 250° C.
- the purge time of nitrogen gas in between precursor pulses was 60 seconds.
- the nanolaminate consists of 2x Al203/Ta205 sublayers with a total thickness of around 25nm.
- Thick amorphous silica layer ( ⁇ 170nm)
- Fine particles including sub-micron sized silica particles formed as by-product were removed by threefold sedimentation in ethanol and decantation.
- the coated powder was dried at 50°C in vacuum overnight. After dry-sieving (mesh size 63pm) the coating was cured by heating the powder to 300°C for 10 hr. under vacuum.
- FIG. 4a A SEM image of some of the particles is given in Fig. 4a.
- FIG. 4b A TEM image of the particles is given in Fig. 4b.
- the prepared particles in silicone were subjected to a stress test and compared with a control particles i.e. particles comprising a prior art coating architecture.
- a control particles i.e. particles comprising a prior art coating architecture.
- the luminescent particle is initially coated with a relatively thick sol- gel coating and successively with a thin ALD coating.
- the stress test the light output was measured over time while keeping the particles at a temperature of 130°C and 100% relative humidity.
- the prepared particles were further applied in a white LED and stressed over 500 hours at 85°C and 85% relative humidity.
- the failure probability of the white LEDs with the luminescent particles according to the invention was compared to the failure probability of white LEDs comprising the prior art coating architecture subjected to the same stress test (the control LED).
- Figs 5a-5b show a significantly improved reduction in light output after 60 hours stress test, i.e. less than 5% compared to a reduction of more than 50% for the control particles. Also the color shift (AuV) is substantially minimized compared to the control LED.
- a phrase “item 1 and/or item 2” and similar phrases may relate to one or more of item 1 and item 2.
- the term “comprising” may in an embodiment refer to "consisting of but may in another embodiment also refer to "containing at least the defined species and optionally one or more other species”.
- the invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer.
- a device claim, or an apparatus claim, or a system claim enumerating several means, several of these means may be embodied by one and the same item of hardware.
- the mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
- the invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process.
- the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.
- the invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.
- the invention further pertains to a method or process comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Optical Filters (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a method for providing a luminescent particle (100) with a hybrid coating, the method comprising: (i) providing a luminescent core (102) comprising a primer layer (105) on the luminescent core (102); (ii) providing a main ALD coating layer (120) onto the primer layer (105) by application of a main atomic layer deposition process, the main ALD coating layer (120) comprising a multilayer (1120) with two or more layers (1121) having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer (130) onto the main ALD-coating layer (120) by application of a main sol-gel coating process, the main sol-gel coating layer (130) having a chemical composition different from one or more of the layers (1121) of the multilayer (1120).
Description
PHOSPHOR PARTICLE COATING
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority of U.S. Application no. 16/915,422 titled “Phosphor Particle Coating” filed 29 June 2020 and, EP application no. 20189538.0 filed 05 August 2020 titled “Phosphor Particle Coating,” said applications being incorporated herein by reference in their entireties.
FIELD OF THE INVENTION
The invention relates to a method for providing a coated luminescent material, to such luminescent material, as well as to a lighting device comprising such luminescent material for wavelength conversion.
BACKGROUND OF THE INVENTION
The coating of luminescent materials is known in the art. WO2014128676, for instance, describes a coated luminescent particle, a luminescent converter element, a light source, a luminaire and a method of manufacturing coating luminescent particles. The coated luminescent particle comprises a luminescent particle, a first coating layer and a second coating layer. The luminescent particle comprises luminescent material for absorbing light in a first spectral range and for converting the absorbed light towards light of a second spectral range. The luminescent material is sensitive for water. The first coating layer forms a first barrier for water and comprises a metal oxide or a nitride, phosphide, sulfide based coating. The second coating layer forms a second barrier for water and comprises a silicon based polymer or comprises a continuous layer of one of the materials AIPCri, SiCh, AI2O3, and LaPCri. The first coating layer and the second coating layer are light transmitting. The first coating layer encapsulates the luminescent particle and the second coating layer encapsulates the luminescent particle with the first coating layer.
SUMMARY OF THE INVENTION
Moisture sensitive luminescent powder materials can be coated with a layer of an amorphous or glassy material to reduce decomposition rates by moisture attack. The coating may be applied by depositing a material at the particle surfaces by reacting a
dissolved inorganic precursor in a suspension (e.g. by a sol-gel process) or by deposition from the gas phase (e.g. a chemical vapor deposition or an atomic layer deposition (ALD) process).
Atomic layer deposition could be a suitable method to deposit thin, conformal coatings of various inorganic materials on powder particles. ALD layers may be very dense and conformal and may be substantially impermeable to gases like water vapor and oxygen.
The ALD process further allows the deposition of multiple thin layers (nanolaminate) of different inorganic materials that each may provide physical properties to the layer (like moisture resistance, light transmissivity, stress resistance, elasticity, etc.) that may be different for the different (nano)layers.
Sol-gel process may be suitable for providing (relatively) thicker layers that may provide mechanical protection to the material coated with the layer.
Known coated luminescent particles may show one or more disadvantages, such as decomposition of the luminescent material due to moisture or e.g. solvents, degradation as a result of high temperatures, mechanical instability during processing the luminescent particles. Further, also many of the known coating processes have one or more disadvantages such as agglomeration, decrease in quantum efficiency of the coated luminescent material (relative to the uncoated material), non-conformal coatings.
It appears that with a sol-gel coating process only the properties of the luminescent materials may not be sufficient. Furthermore, moisture sensitive luminescent particles comprising only an ALD coating may also not be durable when being exposed to mechanical stress. It further appears that moisture sensitive luminescent particles with a sol- gel coating in combination with an ALD coating configured on top of the sol-gel coating may provide luminescent particles with a reduced decomposition rate due to moisture attack at relatively hard conditions such as at temperatures up to 60°C and a 90% relative humidity. Yet, for higher temperatures, such as that may be generated in high-power LED applications, e.g. in flash and automotive applications alternative coating structures may be desirable. Further, ALD layers appear to show an intrinsic (tensile) stress, that may increase with increasing layer thickness. ALD coatings may preferably be provided as thin layers. Yet, it appears that deposition of especially a thin ALD layer may be sensitive to surface contamination. Possible contamination at the surface of the particle to be coated may result in pinholes or other irregularities in the (thin) ALD layer.
Hence, it is an aspect of the invention to provide an alternative coating process, which preferably further at least partly obviates one or more of above-described
drawbacks. It is a further aspect of the invention to provide an alternative luminescent material that preferably further at least partly obviates one or more of above-described drawbacks. In yet a further aspect, the invention provides a lighting device comprising the luminescent material that preferably further at least partly obviates one or more of above- described drawbacks.
The present invention may have as object to overcome or ameliorate at least one of the disadvantages of the prior art, or to provide a useful alternative.
Amongst others, the invention proposes in embodiments a coating structure comprising at least two layers, especially at least three layers configured around a luminescent core. The different layers may be selected from having different functions. The coating structure may especially comprise a primer layer, a coating layer provided by atomic layer deposition (an “ALD coating layer”), and a coating layer provided by a sol-gel (deposition) process (a “sol-gel coating layer”). The primer layer may facilitate good adherence between the surface and facilitate deposition of a thin ALD coating layer. The ALD coating layer may shield the luminescent core from undesired gases like water vapor and oxygen or further chemicals. The sol-gel coating may provide mechanical protection to the luminescent core and the ALD coating layer.
Hence, herein a hybrid coating method is provided for a luminescent powder material that consist of depositing a coating layer at a primer layer (at a surface of a luminescent core) by application of an ALD process and successively depositing a sol-gel layer by application of a sol-gel type process to obtain a uniformly coated luminescent particle. With the method a luminescent particle with a hybrid coating may be provided.
Hence in a first aspect, the invention provides a method for providing a luminescent particle with a hybrid coating. In embodiments, the method especially comprises (the stages of) (i) providing a luminescent core (“core”) comprising a primer layer (“primer coating” or “primer coating layer”) on the luminescent core (or a “primer layer comprising luminescent core”). The method further comprising: (ii) providing a(n) (main) atomic layer deposition coating layer (“(main) ALD coating layer” or “(main) ALD coating” or “(main) ALD layer”) onto the primer layer. The (main) ALD-coating layer is in embodiments, especially provided onto the primer layer comprising luminescent core. The method further comprising: (iii) providing a (main) sol-gel coating layer (“(main) sol-gel coating” or “(main) sol-gel layer”) onto the (main) ALD coating layer. Further, the (main) ALD coating layer may be provided onto the primer layer by application of an (main) atomic layer deposition process (“(main) ALD process”). Further, in specific embodiments, the (main) ALD coating
layer may comprise a multilayer (or “laminate”) with two or more layers having different chemical compositions. In further specific embodiments, in the (main) atomic layer deposition process, a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si). The (main) sol-gel coating layer is especially provided onto the (main) ALD coating layer by application of a (main) sol-gel coating process. In further embodiments, the main sol-gel coating layer may have a chemical composition different from one or more of the layers of the multilayer.
In yet a further aspect, the invention also provides a luminescent material comprising the luminescent particles obtained by such method. Especially, the invention provides in yet a further aspect, a luminescent material comprising luminescent particles, wherein the luminescent particles comprise a luminescent core comprising a primer layer on the luminescent core, especially wherein the primer layer has a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm, and wherein the primer layer has a chemical composition differing from the chemical composition of the core; a(n) (main) ALD (i.e., atomic layer deposition) coating layer, especially comprising a multilayer with two or more layers having different chemical compositions, wherein, in embodiments, the (main) ALD coating has a(n) (main) ALD coating layer thickness (d2) in the range of 5-250 nm, such as 5-100 nm, especially 5-50 nm, such as especially 10-50 nm, even more especially 20-50 nm, and especially wherein the multilayer comprises one or more layers comprising an oxide of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si), wherein one or more of the two or more layers of the multilayer have chemical compositions differing from the chemical composition of the primer layer, and further, in embodiments, especially comprising a (main) sol-gel coating layer, wherein, in embodiments, the (main) sol-gel coating has a (main) sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100- 500 nm. In further embodiments, the (main) sol-gel coating layer has a chemical composition differing from the (main) ALD coating layer, especially from one or more of the two or more layers of the multilayer. Further, especially, the (main) ALD coating layer is arranged between the primer layer and the (main) sol-gel layer.
The invention may provide luminescent particles and luminescent material, i.e. luminescent material comprising these (hybrid coated) particles, showing a significantly reduced decomposition rate as a result of moisture attack. The coating of the luminescent particles may demonstrate improved moisture barrier properties. The coating may further
provide an improved chemical and mechanical stability allowing the integration of luminescent particle (phosphors), especially of moisture sensitive luminescent particles (phosphors) in high-power products e.g. for flash and automotive applications imposing high stress conditions (like working temperatures up to 85°C, at a high relative humidity (over 80% relative humidity). With such luminescent material, a relative stable luminescent material is provided with quantum efficiencies close to or identical to the virgin (non-coated) luminescent material and having stabilities against water and/or (humid) air which are very high and superior to non-coated or non-hybrid coated luminescent particles.
The invention may especially provide in embodiments a method for providing a luminescent particle with a hybrid coating, the method comprising: (i) providing a luminescent core comprising a primer layer on the luminescent core; (ii) providing a main ALD coating layer onto the primer layer by application of a main atomic layer deposition process, the main ALD coating layer comprising a multilayer with two or more layers having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si); (iii) providing a main sol-gel coating layer onto the main ALD-coating layer by application of a main sol-gel coating process, the main sol-gel coating layer having a chemical composition different from one or more of the layers of the multilayer. Especially, in the main atomic layer deposition process, the metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si).
Hence, the starting material is a particulate luminescent material or a luminescent material that is made particulate. Further, especially the luminescent core is a particulate core or luminescent (core) material that is made particulate. The core may essentially be a (virgin) luminescent parti cl e/core, i.e. a non-coated / non-treated luminescent particle. The luminescent particles of the particulate luminescent material (especially the core(s)) are coated as described herein. The terms “luminescent particles”, “luminescent core” and similar terms indicate that the particles and/or cores luminesce under excitation with especially UV and/or blue radiation (light source radiation, see below). Herein, also the term “luminescent particle” may be used to refer to the “luminescent core”. Moreover, herein also the coated luminescent particles may be referred to as “luminescent particles”. It will be clear from the context whether the term “luminescent particle” refers to a core that is not coated or e.g. that it refers to the luminescent particle comprising the hybrid coating, or to a luminescent particle comprising only one or more layers of the hybrid coating.
The luminescent core (before applying the ALD coating process) especially comprises a primer layer on (a surface of) the luminescent core. Herein, the luminescent core comprising the primer layer (on the luminescent core) is also referred to as a “primer layer comprising luminescent core”. In embodiments, the virgin (core) material (already) comprises the primer layer. In embodiments, e.g., the core may comprise an oxide-containing surface. In further embodiments, the primer layer may be provided to the virgin (core) material, especially with the method of the invention. Hence, in further embodiments, the method may comprise providing a primer layer onto a core(, to provide the luminescent core comprising the primer layer on the luminescent core) (see further below).
The primer layer not necessarily is entirely conformal with the core. The primer layer may especially be evenly distributed over (the surface of) the luminescent core. However, the primer layer, may in embodiments not entirely cover the surface of the core. The primer layer may in embodiments cover the core for at least 50%, especially at least 75%, such as at least 90%, or especially at least 95% or even more especially at least 99%, of the surface of the core (see further below). The primer layer may especially be configured to facilitate the deposition of the main ALD coating layer. The primer layer may function as a nucleation layer or a seed layer for the main ALD coating layer.
The main ALD coating layer is provided onto the primer layer. Hence, in embodiments the ALD coating layer may contact the surface of the luminescent core at first locations of the luminescent core comprising the primer layer, and the ALD coating layer may contact the primer layer at further locations. The main ALD coating layer may optionally include a multilayer. However, the multilayers of the main ALD coating layer are all ALD layers. Therefore, this layer is indicated as (main) ALD (coating) layer (thus optionally including an ALD multilayer). Especially the main ALD coating layer comprises a multilayer with two or more layers (having different chemical compositions), see also below. The main ALD coating layer especially at least includes one or more aluminum oxide (especially AI2O3) coating layers.
Likewise, the main sol-gel coating layer may optionally include a multilayer. However, the (multi-)layers of the main sol-gel coating layer are all sol-gel layers. Therefore, this coating layer is herein also indicated as a (main) sol-gel (coating) layer (thus optionally including a sol-gel multilayer). Further, especially the main sol-gel coating layer is provided on the main ALD coating layer, without an intermediate layer. The main sol-gel coating layer especially comprises silicon oxide (especially SiCh). An example of a multilayer may e.g. include a Si02-Ah03-x(0H)2x (sol-gel) multilayer (wherein 0<x<3), such as a stack of three
or more (sol-gel) layers wherein SiC and Al203-x(0H)2x (with 0<x<3) alternate. Optionally on the main sol-gel coating layer a further coating layer may be provided (see further below).
Especially, both the main ALD coating layer and the main sol-gel coating layer independently comprise metal oxides, though optionally also hydroxides may be included in the one or more of these layers. Further, independently the main ALD coating layer and the main sol-gel coating layer may include mixed oxide layers. Further, the coating layers need not necessarily to be fully stoichiometric oxides, as is known in the art.
In embodiments, the primer layer (also) comprises a sol-gel coating layer (provided by application of a sol-gel process). Herein, such sol-gel coating layer may be indicated as a primary sol-gel coating layer, especially to distinguish from the main sol-gel coating layer. The primary sol-gel coating layer may in embodiments comprise metal oxides, and optionally hydroxides, as described herein in relation to the main sol-gel coating layer. Further, especially, the primary sol-gel coating layer may be provided as described in relation to the main sol-gel coating layer, see also below, further describing the sol-gel process. The primary sol-gel coating layer may especially be provided (and comprise a composition) as described in relation with the main sol-gel coating.
The primer layer may in further embodiments (also) (further) comprise an oxide-containing layer. In specific embodiments, the oxide-containing layer is provided by application of a chemical washing process onto the luminescent core (see further below). The chemical washing process may especially provide a washing result layer onto the luminescent core. Hence, in embodiments, the washing result layer comprises the oxide-containing layer. The primer layer may especially function as a nucleation layer or a seed layer for the main ALD coating layer. Yet, the primer layer may be structurally different for various embodiments. As described above, in embodiments, the primer layer comprises, especially consist of an oxide-containing layer (or oxide-rich layer) (at the surface of the luminescent core). In further embodiments, the primer layer comprises, especially consist of the washing result layer. In further embodiments, the primer layer comprises, especially consists of the primary sol-gel coating layer. In further specific embodiments, the primer layer comprises the washing result layer and the primary sol-layer.
Especially (if the core is subjected to the chemical washing process), the primary sol-gel coating layer is provided after the chemical washing process, and especially the primary sol-gel coating may be provided on the washing result layer (especially the oxide-containing layer). Yet, in such embodiments, the primary sol-gel coating layer may contact the washing result layer at a first location of the luminescent core. The primary sol-
gel coating may contact the surface of the luminescent core at other locations of the luminescent core. Hence, in embodiments, the primer layer comprises an oxide-containing layer and a primary sol-gel layer , especially wherein the oxide-containing layer is arranged at a surface of the core (and at least part of the primary sol-gel coating layer is arranged at the oxide-containing layer).
As is described above, in embodiments, locations of the core may not be covered by the primary layer (especially the one or more of the oxide-containing layer and the primary sol-gel coating layer). Hence, in embodiments, the main ALD coating layer may (be provided to) contact the primary sol-gel coating layer at some locations of the luminescent core and the main ALD coating layer may (be provided to) contact the surface of the core at some other locations of the luminescent particle. In yet further embodiments, the main ALD coating may (also) (be provided to) contact the washing result layer at some further locations of the luminescent particle.
In general, the thickness of the primer layer is smaller than the thickness of the main sol-gel layer, and especially also smaller than the thickness of the main ALD coating layer. Further, especially the main sol-gel coating layer thickness is generally larger than the ALD coating layer thickness. The primer layer thickness is especially equal to or smaller than 10 nm, such as equal to or smaller than 7 nm, especially equal to or smaller than 5 nm, even more especially equal to or smaller than 4 nm. The primer layer thickness may in embodiments be at least 0.1 nm, such as at least 0.2 nm, especially at least 0.5 nm, such as especially at least 1 nm. The primary layer thickness may especially be the result of the thickness of the primary sol-gel coating layer. Hence, especially the primary sol-gel coating layer may be equal to or smaller than 10 nm, such as equal to or smaller than 7 nm, especially equal to or smaller than 5 nm, such as equal to or smaller than 4 nm. The oxide-containing layer may in embodiments be less than 1 nm thick. In embodiments the primer layer has a primer layer thickness (dl) in the range of 0.1-5 nm. In further embodiments, the primer layer comprises a primary sol-gel layer provided by application of a primary sol-gel coating process. The thickness of main sol-gel coating layer may be at least 10 times, such as at least 50 times, especially at least 100 times thicker than the thickness of the primary layer.
Further, especially the main sol-gel coating layer thickness is generally larger than the main ALD coating layer thickness, such as at least 1.2, like at least 1.5, like at least 2 times larger, or even at least 4 times or at least 5 times or at least 10 times larger (than the main ALD coating layer thickness).
In specific embodiments, the method of the invention comprises (i) providing the primer layer, especially having a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm, onto the core (to provide the primer layer comprising luminescent core); (ii) providing the main ALD coating layer having a main ALD coating layer thickness (d2) in the range of 3-250 nm, such as 5-250 nm, especially 5-100 nm, even more especially 5-50 nm, such as especially 10-50 nm, even more especially 20-50 nm, onto the primer layer (especially onto the primer layer comprising luminescent core) by application of the main atomic layer deposition process; and especially (iii) providing the main sol-gel coating layer having a main sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm onto the main ALD coating layer, by application of the main sol-gel process.
Especially, the primer layer has a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm,. Further, especially the main ALD coating layer has a main ALD coating layer thickness (d2) in the range of 3-250 nm, such as 5-250 nm, especially 5-100 nm, even more especially 5-50 nm, such as especially 10- 50 nm, even more especially 20-50 nm. Especially, the main sol-gel coating layer has a main sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm.
Hence, as indicated above, the luminescent particle comprises in embodiments a luminescent core, a primer layer having a primer layer thickness (dl) in the range of 0.1-10 nm, especially 0.1-7 nm, such as 0.1-5 nm or 0.1-4 nm, a main ALD coating layer having a main ALD coating layer thickness (d2) in the range of 3-250 nm, such as 5-250 nm, especially 5-100 nm, even more especially 5-50 nm, such as especially 10-50 nm, even more especially 20-50 nm, and a main sol-gel coating layer having a main sol-gel coating layer thickness (d3) in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm.
In embodiments, the primer layer at least partly encapsulates the surface of the luminescent core. In further embodiments, the main ALD coating encapsulates the primer layer. In further embodiments the main sol-gel coating encapsulates the main ALD coating layer. In yet further embodiments, a further ALD coating layer encapsulates the main sol-gel coating layer (see below). Hence, the hybrid coating may comprise a main ALD coating layer and a main sol-gel coating layer, especially a primer layer, a main ALD coating layer, and a main sol-gel coating layer. The primer layer is especially arranged between the surface of the
luminescent core and the main ALD coating layer. The main ALD coating layer is especially arranged between the main sol-gel coating layer and the primer layer.
In yet further embodiments, the luminescent particle may comprise a further coating layer arranged on the main sol-gel coating layer. In further embodiments, the hybrid coating further comprises the further coating layer arranged at the main-sol-gel coating layer. The further coating layer may especially comprise a further ALD coating layer, especially encapsulating the main sol-gel coating. Hence, in embodiments, the luminescent particle (further) comprises a further ALD coating layer arranged onto the main sol-gel coating layer. The further ALD coating layer especially has a further ALD coating layer thickness (d4) in the range of 1-100 nm, such as 5-75 nm, especially 10-75 nm, such as especially 10-50 nm. Further, especially the further ALD coating layer has a chemical composition differing from the chemical composition of the main sol-gel coating layer.
Hence, in specific embodiments, the method further comprises (iv) providing a further ALD coating layer onto the main sol-gel coating by application of a further atomic layer deposition process (especially thereby providing a further ALD coated luminescent particle), especially wherein the further ALD coating layer has a further ALD coating layer thickness (d4) in the range of 1-100 nm, such as 5-75 nm, especially 10-75 nm, such as especially 10-50 nm, and especially wherein the further ALD coating layer has a chemical composition differing from the chemical composition of the main sol-gel coating layer. The further ALD coating layer may be provided by an ALD process described herein, especially in relation to the main ALD layer. The further ALD layer may (also) comprise a multilayer. The further ALD layer may further especially comprise a composition (and/or the (metal) oxides) described in relation to the main ALD layer. In embodiments, the further ALD coating layer comprises one or more oxides of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V, and optionally Si.
Herein the term “thickness” is used in relation to the coatings and layers. The term especially relates to the average thickness of the coating over the entire surface being coated by the respective layer. For instance, the primary layer may not completely cover the surface of the core and the (local) thickness of primer layer may be substantially zero at locations of the surface core. At other locations of the surface, the maximum (local) thickness of the primer layer may be 3 nm. Then, e.g., the primer layer thickness may be in the range of larger than 0 and smaller than 3 nm. Moreover, also if the (coating) layer completely covers the core or another coating layer, locally the thickness may vary. Especially, e.g., the sol-gel process may provide coating layers having a somewhat pocked shape or e.g. may comprise
one or more little pinholes. Hence, the layer thicknesses described herein are especially average layer thicknesses. However especially, at least for the primer layer, the main sol gel coating layer, the main ALD coating layer and the further ALD coating layer (when present), at least 50%, even more especially at least 80%, of the area of the respective layers have such indicated layer thickness. Especially, this indicates that under at least 50% of the area of such layer, such thickness will be found.
The luminescent core of interest may in principle include each type of (virgin) luminescent particle or particulate material. However, especially of interest are those type of luminescent particulate materials (particles) that may be less stable in air or water or a humid environment, such as e.g. (oxo)sulfides, (oxo)nitrides, etc.. Hence, in embodiments the luminescent core (and the luminescent particle comprising the luminescent core) comprises one or more of a nitride luminescent material, an oxonitride luminescent material, a halogenide luminescent material, an oxohalogenide luminescent material, a sulfide luminescent material, and an oxosulfide luminescent material. Additionally or alternatively, the luminescent core (luminescent particle) may comprise a selenide luminescent material. Hence, the term “luminescent core” (and also “luminescent particle”) may also refer to a combination of particulate materials of different types of luminescent materials. The luminescent core may in embodiments especially comprise a plurality of particulate luminescent materials/luminescent particles.
In a specific embodiment, the luminescent core (or the material of the luminescent core) may be selected from the following group of luminescent material systems: MLiAl3N4:Eu (M = Sr, Ba, Ca, Mg), MLi2Al202N2:Eu (M = Ba, Sr, Ca), M2Si04:Eu (M =
Ba, Sr, Ca), MSei-xSx:Eu (M = Sr, Ca, Mg), MA2S4:Eu (M = Sr, Ca, A = Al, Ga)),
M2SiFe:Mn (M = Na, K, Rb), MSiAlN3:Eu (M = Ca, Sr), M8Mg(Si04)4Cl2:Eu (M = Ca, Sr), M3MgSi20s:Eu (M = Sr, Ba, Ca), MSi202N2:Eu (M = Ba, Sr, Ca), MLi3Si04:Eu (M = Li, Na, K, Rb, Cs), M2Si5-x A1XOXN8-X:EU (M = Sr, Ca, Ba). However, other systems may also be of interested to protect by the hybrid coating. Also combinations of particles/particulate materials of two or more different luminescent materials may be applied, such as e.g. a green or a yellow luminescent material in combination with a red luminescent material.
Terms like “M = Sr, Ba, Ca, Mg” indicate, as known in the art, that M includes one or more of Sr, Ba, Ca, and Mg. For instance, referring to MSiAlN3:Eu (M = Ca, Sr), this may refer by way of examples to CaSiAlN3:Eu, or to SrSiAlN3:Eu, or to Cao.8Sro.2SiAlN3:Eu, etc. etc.. Further, the formula “MLiAl3N4:Eu (M = Sr, Ba, Ca, Mg),” is equal to the formula (Sr,Ba,Ca,Mg)LiAl3N4:Eu. Further, for clarity reasons also the formula “(Ml)LiAl3N4:Eu,
with Ml=Sr, Ba, Ca” and the like may be used, e.g., when more than one group is indicated with different elements, for instance in a sentence like “ wherein the luminescent material is selected from a group consisting of (Ml)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4, and Ml comprising one or more of the group consisting of Ca, Sr, and Ba; and (M2)Li2Ah- zSiz02-zN2+z:Eu, wherein 0<z<0.1, and M2 comprising one or more of the group consisting of Sr and Ba”. Further, also Ml, M2, et cetera may refer to one or more of the (respective) elements. In the above given example, e.g. Ml may in embodiments be Sr, or Ba, or Ca. In further embodiments Ml may be combination of Sr and Ba, or e.g. Sr and Ca, or Sr, Ba, and Ca, etc.. Moreover, the elements may especially be present in any ratio, e.g. 20% Sr, 20% Ca and 50%. Ba, or 10% Ba and 90% Sr, etc.. Likewise this applies to the other herein indicated formulas of inorganic luminescent materials.
In further specific embodiments, the luminescent core may be selected from the following group of luminescent material systems: Mi-x-y-zZzAaBbCcDdEeN4-nOn:ESx,REy, with M = selected from a group consisting of Ca (calcium), Sr (strontium), and Ba (barium); Z selected from a group consisting of monovalent Na (sodium), K (potassium), and Rb (rubidium); A = selected from a group consisting of divalent Mg (magnesium), Mn (manganese), Zn (zinc), and Cd (cadmium) (especially, A = selected from a group consisting of divalent Mg (magnesium), Mn (manganese), and Zn (zinc), even more especially selected from a group consisting of divalent Mg (magnesium), Mn (manganese); B = selected from a group consisting of trivalent B (boron), A1 (aluminum) and Ga (gallium); C = selected from a group consisting of tetravalent Si (silicon), Ge (germanium), Ti (titanium) and Hf (hafnium); D selected from a group consisting of monovalent Li (lithium), and Cu (copper); E selected for the group consisting of P (the element phosphor), V (vanadium), Nb (niobium), and Ta (tantalum); ES = selected from a group consisting of divalent Eu (europium), Sm (samarium) and ytterbium, especially selected from a group consisting of divalent Eu and Sm; RE = selected from a group consisting of trivalent Ce (cerium), Pr (praseodymium), Nd (neodymium), Sm (samarium), Eu (europium), Gd (gadolinium), Tb (terbium), Dy (dysprosium), Ho (holmium), Er (erbium), and Tm (thulium); with 0 < x < 0.2; 0 < y < 0.2; 0 < x+y £ 0.4; 0 < z < l; 0 < n < 0.5; 0 < a < 4 (such as 2 < a < 3); 0 < b < 4;0 < c < 4;0 < d < 4; 0 < e £ 4; a + b + c +d + e = 4; and 2a + 3b + 4c +d + 5e = 10 - y - n + z. Especially, z < 0.9, such as z < 0.5. Further, especially x+y+z < 0.2.
The equations a + b + c +d + e = 4; and 2a + 3b + 4c +d + 5e = 10 - y - n + z, respectively, especially determine the Z, A, B, C, D and E cations and O and N anions in the lattice and thereby define (also) the charge neutrality of the system. For instance, the charge
compensation is covered by the formula 2a + 3b + 4c +d + 5e = 10 - y - n + z. It covers e.g. charge compensation by decreasing O content or charge compensation by substituting a C cation by a B cation or a B cation by an A cation, etc. For example: x = 0.01, y = 0.02, n = 0, a = 3; then 6 + 3b + 4c = 10 - 0.02; with a+b+c = 4: b = 0.02, c = 0.98.
As will be clear to a person skilled in the art, a, b, c, d, e, n, x, y, z are always equal to or larger than zero. When a is defined in combination with the equations a + b + c +d + e = 4; and 2a + 3b + 4c +d + 5e = 10 - y - n + z, then in principle, b, c, d, and e do not need to be defined anymore. However, for the sake of completeness, herein also 0 < b < 4;0 < c < 4;0 < d < 4; 0 < e < 4 are defined.
Assume a system like SrMg2Ga2N4:Eu. Here, a=2, b=2, c=d=e=y=z=n=0. In such system, 2 + 2 + 0 + 0 + 0 = 4 and 2*2+3*2+0+0+0=10-0-0+0=10. Hence, both equations are complied with. Assume that 0.5 O is introduced. A system with 0.5 O can e.g. be obtained when 0.5 Ga-N is replaced by 0.5 Mg-0 (which is a charge neutral replacement). This would result in SrMg2.5Gai.5N3.50o.5:Eu. Here, in such system 2.5 + 1.5 + 0 + 0 + 0 = 4 and 2*2.5 + 3*1.5 + 0 +0+0= 10 -0 - 0.5 +0 = 9.5. Hence, also here both equations are complied with.
As indicated above, in advantageous embodiments d>0 and/or z>0, especially at least d>0. Especially, the phosphor comprises at least lithium. In yet another embodiment,
2 < a < 3, and especially also d=0, e=0 and z=0. In such instances, the phosphor is amongst others characterized by a + b + c = 4; and 2a + 3b + 4c = 10 - y - n.
In a further specific embodiment, which may be combined with the former embodiments e=0. In yet a further specific embodiment, which may be combined with the former embodiments, M is Ca and/or Sr.
Hence, in a specific embodiment, the phosphor has the formula M(Ca and/or Sr)i-x-yMgaAlbSicN4-nOn:ESx,REy (I), with ES = selected from a group consisting of divalent Eu (europium) or Sm (samarium) or Yb (ytterbium); RE = selected from a group consisting of trivalent Ce (cerium), Pr (praseodymium), Nd (neodymium), Sm (samarium), Eu (europium), Gd (gadolinium), Tb (terbium), Dy (dysprosium), Ho (holmium), Er (erbium), and Tm (thulium), wherein y/x < 0.1, especially <0.01, and n < 0.1, especially <0.01, even more especially <0.001, yet even more especially <0.0001. Hence, in this embodiment, substantially samarium and or europium containing phosphors are described. For instance, when divalent Eu is present, with x=0.05, and for instance yl for Pr may be 0.001, and y2 for Tb may be 0.001, leading to an y=yl+y2=0.002. In such instance, y/x = 0.04. Even more
especially, y=0. However, as indicated elsewhere when Eu and Ce are applied, the ratio y/x may be larger than 0.1.
The condition 0 < x+y < 0.4 indicates that M may be substituted with in total up to 40% of ES and/or RE. The condition “0 < x+y < 0.4” in combination with x and y being between 0 and 0.2 indicates that at least one of ES and RE are present. Not necessarily both types are present. As indicated above, both ES and RE may each individually refer to one or more subspecies, such as ES referring to one or more of Sm and Eu, and RE referring to one or more of Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, and Tm.
Especially, when europium is applied as divalent luminescent species or dopant (i.e. Eu2+), the molar ratio between samarium and europium (Sm/Eu) is <0.1, especially < 0.01, especially <0.001. The same applies when europium in combination with ytterbium would be applied. When europium is applied as divalent luminescent species or dopant, the molar ratio between ytterbium and europium (Yb/Eu) is <0.1, especially < 0.01, especially <0.001. Would all three together be applied, then the same molar ratios might apply, i.e. ((Sm+Yb)/Eu) is <0.1, especially < 0.01, especially <0.001.
Especially, x is in the range of 0.001-0.2 (i.e. 0.001 < x < 0.2), like 0.002-0.2, such as 0.005-0.1, especially 0.005-0.08. Especially in the case of divalent Europium in the herein described systems, the molar percentage may be in the range of 0.1-5 % (0.001 < x < 0.05), such as 0.2-5%, like 0.5-2%. For other luminescent ions, x may (but is not necessarily) in embodiments be equal to or larger than 1% (x equal to or larger than 0.01).
In a specific embodiment, the phosphor is selected from a group consisting of (Sr,Ca)Mg3SiN4:Eu, (Sr,Ca)Mg2AhN4:Eu, (Sr,Ca)LiAbN4:Eu and (Sr,Ca)LidMgaAlbN4:Eu, with a, b, d as defined above.
As also indicated herein, the notation “(Sr,Ca)”, and similar notations with other elements, indicates that the M-positions are occupied with Sr and/or Ca cations (or other elements, respectively).
In a further specific embodiments the phosphor is selected from a group consisting of Ba.95Sr.05Mg2Ga2N4:Eu, BaMg2Ga2N4:Eu, SrMg3SiN4:Eu, SrMg2AhN4:Eu, SrMg2Ga2N4:Eu, BaMg3SiN4:Eu, CaLiAbN4:Eu, SrLiAl3N4:Eu, CaLio.sMgAhriYiiEu, and SrLio.5MgAl2.5N4:Eu. Further (non-limiting) examples for such phosphors are e.g.
(Sro.8Cao.2)o.995LiAl2.9iMgo.o9N3.9iOo.o9:Euo.oo5; (Sro.9Cao.i)o.905Nao.o9LiAl3N3.9iOo.o9:Euo.oo5; (Sro.8Cao.o3Bao.i7)o.989LiAl2.99Mgo.oiN4:Ceo.oi,Euo.ooi; Cao.995LiAl2.995Mgo.oo5N3.9950o.oo5:Ybo.oo5 (YB(II)); Nao.995MgAl3N4:Euo.oo5; Nao.895Cao.iMgo.9Lio.iAl3N4:Euo.oo5;
Sro.99LiMgAlSiN4:Euo.oi; Cao.995LiAh.955Mgo.o45N3.960o.o4:Ceo.oo5; (Sro.9Cao.i)o.998Ali.99Mg2.oiN3.990o.oi:Euo.oo2; (Sro.9Bao.i)o.998Ali.99Mg2.oiN3.990o.oi:Euo.oo2.
In a further specific embodiment, the phosphor is selected from a group consisting of (Sr,Ca)Mg3SiN4:Eu and (Sr,Ca)Mg2Al2N4:Eu. In yet another specific embodiment, the phosphor is selected from a group consisting of Bao.95Sro.o5Mg2Ga2N4:Eu, BaMg2Ga2N4:Eu, SrMg3SiN4:Eu, SrMg2Al2N4:Eu, SrMg2Ga2N4:Eu, and BaMg3SiN4:Eu. Especially, these phosphors, and even more especially (Sr,Ca)Mg3SiN4:Eu and (Sr,Ca)Mg2AhN4:Eu may be phosphors having good luminescent properties, amongst others in terms of spectral position and distribution of the luminescence.
In further specific embodiments the phosphor, especially the luminescent material, is selected from a group consisting of (Sr,Ca)LiAbN4:Eu and (Sr,Ca,Ba)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4; and a+b+d=4 and 2a+3b+d=10. In yet another specific embodiment, the phosphor is selected from a class of (Sr,Ba)Li2Al2-zSiz02-zN2+z:Eu with 0<z<0.1.
The luminescent material is in embodiments selected from a group SrLiAhNvEu. The luminescent material may e.g. comprise SrLiAbN4:Eu with an Eu doping concentration in the range 0.1-5%, especially 0.1-2%, such as 0.2-1.2% relative to Sr.
In further specific embodiments, the phosphor/luminescent core (the luminescent material) comprises SrLi2Ali.995Sio.oo50i.995N2.oo5:Eu2+, especially with an Eu doping concentration in the range 0.1-5%, especially 0.1-2%, 0.2-1.5% relative to Sr.
Of especial interest are phosphors wherein the phosphor complies with 0 < x < 0.2, y/x < 0.1, M comprises at least Sr, z < 0.1, a< 0.4, 2.5 < b < 3.5, B comprises at least Al, c < 0.4, 0.5 < d < 1.5, D comprises at least Li, e < 0.4, n < 0.1, and wherein ES at least comprises Eu. Especially, y+z < 0.1. Further, especially x+y+z < 0.2. Further, especially a is close to 0 or zero. Further, especially b is about 3. Further, especially c is close to 0 or zero. Further, especially d is about 1. Further, especially e is close to 0 or zero. Further, especially n is close to 0 or zero. Further, especially y is close to 0 or zero. Especially good systems, in terms of quantum efficiency and hydrolysis stability are those with z + d > 0, i.e. one or more of Na, K, Rb, Li and Cu(I) are available, especially at least Li, such as e.g.
(Sr,Ca)LiAbN4:Eu and (Sr,Ca)LidMgaAlbN4:Eu, with a, b, d as defined above. In further specific embodiments the phosphor is selected from a group consisting of CaLiAbN4:Eu, SrLiAbN4:Eu, CaLio.5MgAh.5N4:Eu, and SrLio.5MgAh.5N4:Eu. Further phosphors of special interest are (Sr,Ca,Ba)(Li,Cu)(Al,B,Ga)3N4:Eu, which comprises as M ion at least Sr, as B ion at least Al, and as D ion at least Li.
In embodiments, the phosphor (the luminescent core) is selected from a group consisting of (Ml)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4, and Ml comprising one or more (elements selected) from a group consisting of Ca, Sr, and Ba; and a+b+d=4 and 2a+3b+d=10; and (M2)Li2Al2-zSiz02-zN2+z:Eu, wherein 0<z<0.1, and M2 comprising one or more (elements selected) from the group consisting of Sr and Ba.
Hence, in a specific embodiment, the luminescent particles comprise a luminescent material selected from (the) SrLiAhN-rEu21 (class). The term “class” herein especially refers to a group of materials that have the same crystallographic structure(s). Further, the term “class” may also include partial substitutions of cations and/or anions. For instance, in some of the above-mentioned classes Al-0 may partially be replaced by Si-N (or the other way around). The class of SrLiAbN4:Eu2+ may especially relate to a group of materials that have the same crystallographic structure, especially wherein Sr is partially replaced by divalent Eu, e.g. by 0.1% or 2%. For instance Sro.995LiAbN4:Euo.oo5 and Sro.98LiAbN4:Euo.o2 are elements of such class. Likewise the SrLi2Ali.995Sio.oo50i.995N2.oo5:Eu2+ class (see also below) may e.g. comprise Sr0.999Li2All.995Si0.005Ol.995N2.005:EU0.001 and Sr0.985Li2All.995Si0.005Ol.995N2.005:EU0.015. Optionally also part of Sr may be replaced by another alkaline earth metal (group 2 elements of the periodic table). Examples of the SrLiAbN4:Eu2+ class are provided above. However, other luminescent materials may thus also be possible.
In further embodiments, the luminescent material (or phosphor) is selected from a group consisting of (Sr,Ca)LiAbN4:Eu, (Sr,Ca,Ba)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4; and a+b+d=4 and 2a+3b+d=10, and (Sr,Ba)Li2Al2-zSiz02-zN2+z:Eu, wherein 0<z£0.1.
The luminescent core may thus especially comprise a phosphor. Moreover, the luminescent core especially comprises a luminescent material described herein, especially in relation to the phosphor. The method may be applied for providing more than one, especially a plurality of luminescent particles with a hybrid coating (and especially coating more than one luminescent core).
In further embodiments of the luminescent material, the luminescent core, comprises a (phosphor) material selected from a group consisting of (i) (the) SrLiAbN4:Eu2+ (class), especially wherein an (Eu) doping concentration is in the range of 0.1-5%, especially 0.1-2%, even more especially 0.2-1.2%, relative to Sr, and (ii) (the)
SrLi2Ali.995Sio.oo50i.995N2.oo5:Eu2+ (class), especially wherein the Eu doping concentration is in the range of 0.1-5%, especially 0.1-2%, even more especially 0.2-1.5 at.% relative to Sr.
Further, especially, the third coating layer comprises SiC , and one or more layers of the multilayer comprise one or more of Ta20s, HfC , TiC and ZrCh and wherein one or more (other) layers of the multilayer comprise AI2O3, especially herein the layer contacting the main sol-gel coating layer consist of one or more metal oxides selected from a group of FlfCh, ZrCh, TiCh,Ta2C)5.
Such luminescent particles may have a number averaged particle size in the range of 0.1-50 pm, such as in the range of 0.5-40 pm, such as especially in the range of 0.5- 20 pm. Hence, the luminescent core may have dimensions such as at maximum about 500 pm, such as at maximum 100 pm, like at maximum about 50 pm. especially with the larger particle sizes, substantially only individual particles may be coated, leading thus to luminescent core dimensions in the order of 50 pm or smaller. Hence, the invention is directed to the coating of particles. The dimensions of the luminescent core may substantially be smaller when nanoparticles or quantum dots are used as basis for the particulate luminescent material. In such instance, the cores may be smaller than about 1 pm or substantially smaller (see also below for the dimensions of the QDs).
Alternatively or additionally, the luminescent particle(s), especially the luminescent core(s), include luminescent quantum dots. The term "quantum dot" or "luminescent quantum dot" may in embodiments also refer to a combination of different type of quantum dots, i.e. quantum dots that have different spectral properties. The QDs are herein also indicated as "wavelength converter nanoparticles" or “luminescent nanoparticles”. The term “quantum dots” especially refer to quantum dots that luminesce in one or more of the UV, visible and IR (upon excitation with suitable radiation, such as UV radiation). The quantum dots or luminescent nanoparticles, which are herein indicated as wavelength converter nanoparticles, may for instance comprise group II-VI compound semiconductor quantum dots selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting ol) CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe and HgZnSTe. In another embodiment, the luminescent nanoparticles may for instance be group III-V compound semiconductor quantum dots selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting ol) GaN, GaP, GaAs, AIN, A1P, AlAs, InN, InP, InGaP, InAs, GaNP, GaNAs, GaP As, A1NP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GalnNP, GalnNAs, GalnPAs, InAlNP, In AIN As, and
InAlPAs. In yet a further embodiment, the luminescent nanoparticles may for instance be I- III-VI2 chalcopyrite-type semiconductor quantum dots selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) CuInS2, CuInSe2, CuGaS2, CuGaSe2, AgInS2, AgInSe2, AgGaS2, and AgGaSe2. In yet a further embodiment, the luminescent nanoparticles may for instance be (core-shell quantum dots, with the core selected from a group consisting of) I-V-VI2 semiconductor quantum dots, such as selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) LiAsSe2, NaAsSe2 and KAsSe2. In yet a further embodiment, the luminescent nanoparticles may for instance be core-shell quantum dots, with the core selected from a group consisting of) group (IV -VI compound semiconductor nano crystals such as SbTe. In a specific embodiment, the luminescent nanoparticles are selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) InP, CuInS2, CuInSe2, CdTe, CdSe, CdSeTe, AgInS2 and AgInSe2. In yet a further embodiment, the luminescent nanoparticles may for instance be one of the group (of core-shell quantum dots, with the core selected from a group consisting of) II-VI, III-V, I-III-V and IV-VI compound semiconductor nano crystals selected from the materials described above with inside dopants such as ZnSe:Mn, ZnS:Mn. The dopant elements could be selected from Mn, Ag, Zn, Eu, S,
P, Cu, Ce, Tb, Au, Pb, Tb, Sb, Sn and Tl. Herein, the luminescent nanoparticles based luminescent material may also comprise different types of QDs, such as CdSe and ZnSe:Mn. The luminescent core may comprise one or more, especially more, (of the same or different) (types of) luminescent nanoparticles.
It appears to be especially advantageous to use II-VI quantum dots. Hence, in embodiments the semiconductor based luminescent quantum dots comprise II-VI quantum dots, especially selected from a group consisting of (core-shell quantum dots, with the core selected from a group consisting of) CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe and HgZnSTe, even more especially selected from a group consisting of CdS, CdSe, CdSe/CdS and CdSe/CdS/ZnS.
In embodiments, the wavelength converter nanoparticles have an average particle size in a range of about 1 to about 1000 nanometers (nm), and preferably in a range of about 1 to about 100 nm. In embodiments, nanoparticles have an average particle size in a range of about 1 to about 20 nm. In embodiments, nanoparticles have an average particle size
in a range of about 1 to about 10 nm. The luminescent nanoparticles (without coating) may have dimensions in the range of about 2-50 nm, such as 2-20 nm, especially 2-10 nm, even more especially 2-5 nm; especially at least 90 % of the nanoparticles have dimension in the indicated ranges, respectively, (i.e. e.g. at least 90% of the nanoparticles have dimensions in the range of 2-50 nm, or especially at least 90% of the nanoparticles have dimensions in the range of 2-5 nm). The term “dimensions” especially relate to one or more of length, width, and diameter, dependent upon the shape of the nanoparticle. Typical dots are made of binary alloys such as cadmium selenide, cadmium sulfide, indium arsenide, and indium phosphide. However, dots may also be made from ternary alloys such as cadmium selenide sulfide.
These quantum dots can contain as few as 100 to 100,000 atoms within the quantum dot volume, with a diameter of 10 to 50 atoms. This corresponds to about 2 to 10 nanometers.
For instance, spherical particles such as CdSe, InP, or CuInSe2, with a diameter of about 3 nm may be provided. The luminescent nanoparticles (without coating) may have the shape of spherical, cube, rods, wires, disk, multi-pods, etc., with the size in one dimension of less than 10 nm. For instance, nanorods of CdSe with the length of 20 nm and a diameter of 4 nm may be provided. Hence, in embodiments the semiconductor based luminescent quantum dots comprise core-shell quantum dots. In yet further embodiments, the semiconductor based luminescent quantum dots comprise dots-in-rods nanoparticles. A combination of different types of particles may also be applied. Here, the term “different types” may relate to different geometries as well as to different types of semiconductor luminescent material. Hence, a combination of two or more of (the above indicated) quantum dots or luminescent nano particles may also be applied.
In embodiments, nanoparticles can comprise semiconductor nanocrystals including a core comprising a first semiconductor material and a shell comprising a second semiconductor material, wherein the shell is disposed over at least a portion of a surface of the core. A semiconductor nanocrystal including a core and shell is also referred to as a "core/shell" semiconductor nanocrystal. Any of the materials indicated above may especially be used as core. Therefore, the phrase “core-shell quantum dots, with the core selected from a group consisting of’ is applied in some of the above lists of quantum dot materials. The term “core-shell” may also refer to “core-shell-shell”, etc.., including gradient alloy shell, or dots in rods, etc.
For example, the semiconductor nanocrystal can include a core having the formula MX, where M can be cadmium, zinc, magnesium, mercury, aluminum, gallium, indium, thallium, or mixtures thereof, and X can be oxygen, sulfur, selenium, tellurium,
nitrogen, phosphorus, arsenic, antimony, or mixtures thereof. Examples of materials suitable for use as semiconductor nanocrystal cores include, but are not limited to, ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InAs, InN, InP, InGaP, InSb, AlAs, AIN, A1P, AlSb, TIN, TIP, TIAs, TISb, PbO, PbS, PbSe, PbTe, Ge, Si, an alloy including any of the foregoing, and/or a mixture including any of the foregoing, including ternary and quaternary mixtures or alloys.
The shell can be a semiconductor material having a composition that is the same as or different from the composition of the core. The shell comprises an overcoat of a semiconductor material on a surface of the core semiconductor nanocrystal can include a Group IV element, a Group II-VI compound, a Group II- V compound, a Group III- VI compound, a Group III-V compound, a Group IV -VI compound, a Group I-III-VI compound, a Group II-IV-VI compound, a Group II-IV-V compound, alloys including any of the foregoing, and/or mixtures including any of the foregoing, including ternary and quaternary mixtures or alloys. Examples include, but are not limited to, ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InAs, InN, InP, InGaP, InSb, AlAs, AIN, A1P, AlSb, TIN, TIP, TIAs, TISb, PbO, PbS, PbSe, PbTe, Ge, Si, an alloy including any of the foregoing, and/or a mixture including any of the foregoing. For example, ZnS, ZnSe or CdS overcoatings can be grown on CdSe or CdTe semiconductor nanocrystals. An overcoating process is described, for example, in U.S. Patent 6,322,901. By adjusting the temperature of the reaction mixture during overcoating and monitoring the absorption spectrum of the core, over coated materials having high emission quantum efficiencies and narrow size distributions can be obtained. The overcoating may comprise one or more layers. The overcoating comprises at least one semiconductor material which is the same as or different from the composition of the core. Preferably, the overcoating has a thickness from about one to about ten monolayers. An overcoating can also have a thickness greater than ten monolayers. In embodiments, more than one overcoating can be included on a core.
In embodiments, the surrounding "shell" material can have a band gap greater than the band gap of the core material. In certain other embodiments, the surrounding shell material can have a band gap less than the band gap of the core material. In embodiments, the shell can be chosen so as to have an atomic spacing close to that of the "core" substrate. In certain other embodiments, the shell and core materials can have the same crystal structure.
Examples of semiconductor nanocrystal (core)shell materials include, without limitation: red (e.g., (CdSe)ZnS (core)shell), green (e.g., (CdZnSe)CdZnS (core)shell, etc.),
and blue (e.g., (CdS)CdZnS (core)shell (see further also above for examples of specific wavelength converter nanoparticles, based on semiconductors.
Therefore, in embodiments the luminescent particle or the luminescent core comprises a luminescent material selected from a group consisting of luminescent quantum dots comprising one or more core materials selected from a group consisting of CdS, CdSe, ZnS, and ZnSe. Hence, in embodiments the luminescent particle or luminescent core may also be selected from a group of luminescent nanoparticles such as quantum dots or quantum rods of composition MX (M = Cd, Zn, X = Se, S). Such particles may have a number averaged particle size (i.e. especially length/width/height, diameter), in the range of 1-50 nm.
As discussed above, the luminescent particle especially comprises a main ALD coating layer configured at the primer layer. In embodiments, the luminescent particle may further comprise a further ALD coating layer configured at (onto) the main sol-gel coating layers. The main ALD coating layer may be deposited by application of the main atomic layer deposition process (“main ALD process”). The further ALD coating layer may be deposited by application of the further atomic layer deposition process (“further ALD process”). The main atomic layer deposition process as well as the (optional) further atomic layer deposition process both are an atomic layer deposition process (“ALD process”). It will be understood that these processes may comprise the same ALD process. Yet, e.g., the conditions of the main ALD process may differ from the conditions of the further ALD process. For instance, the metal oxide precursor(s) used in the main ALD process may differ from the one(s) used in the further ALD process. The duration of the deposition may differ, the temperature may differ, etc.. Yet especially the metal oxide precursor(s) that may be applied in the further ALD process may be the metal oxide precursor(s) described in relation to the (main) ALD process (and vice versa).
Hence, the main ALD coating layer and the optional further ALD coating layer may be formed by an atomic layer deposition type process. In such process a polymeric network is formed by reaction of a metal oxide precursor with an oxygen source such as water and/or ozone in the gas phase. The ALD reaction is “spirited” in (at least) two parts. In a first step the metal (oxide) precursor is fed into a(n ALD) reactor and adsorbs and/or reacts with reactive groups on the particle surfaces and substantially all non-reacted or non- adsorbed precursor molecules are removed by reactor purging. In a second step the oxygen source is fed into the reactor and reacts with the metal source on the particle surfaces followed by purging of the reactor to remove substantially all remaining oxygen source molecules and hydrolysis products formed by condensation reactions. The two steps lead to
formation of an atomic layer (or monolayer) because of the self-limiting nature of the surface reaction. These atomic layer reaction steps may be repeated multiple times to form the final ALD coating. The ALD process further allows it to deposit layers of different composition by consecutively feeding different metal oxide precursor into the reactor to form multicomponent layers or nanolaminates with tailored chemical, mechanical, and optical properties (see further below).
The term “metal oxide precursor” especially indicates a precursor of the metal oxide. The precursor itself may not be a metal oxide but may e.g. include metal organic molecule. Hence, especially the metal (oxide) precursors for ALD may typically include metal halides, alkoxides, amides, and other metal (organic) compounds. The term metal oxide precursor may relate to more than one different metal oxide precursor, especially for more than one different metal oxides
The step by step nature of the ALD process allows to easily deposit defined layer thicknesses. The ALD process further allows it to deposit layers of different composition by consecutively feeding different metal oxide precursors into the reactor to form multicomponent layers or nanolaminates. Hence, in a specific embodiment the main ALD coating layer (and/or the further ALD coating layer) comprises a multilayer (or a nanolaminate) (see also below).
For the ALD process, amongst others a fluidized bed reactor may be applied.
Hence, in a specific embodiment the main ALD coating layer is provided by application of the (main) atomic layer deposition process. Further, in embodiments, the further ALD coating layer (also) is provided by application of the (further) ALD process. In embodiments, a static powder bed is used for ALD coating of the primer layer and/or for ALD coating of the main sol-gel coating. However, also a fluidized bed may be applied (for one or more of the ALD processes). Other type of reactors may also be applied. As is described above, the primer layer may facilitate deposition of the main ALD coating layer especially by functioning as a nucleation layer or a seed layer for the main ALD coating layer. Especially, reactive groups on the particle surface may be provided by the primer layer (and also by the main sol-gel coating layer).
For instance, silanol groups (assuming a primary and/or main silica sol-gel coating layer) at the surface of the sol-gel coating layer act as reactive sites during ALD of the initial layers. In an embodiment, alumina is deposited by using A1(CH3)3 (TMA) as metal oxide precursor and (subsequently exposure to) water as the oxygen source. In the first
reaction step, TMA reacts with surface silanol groups of the silica sol-gel coating layer according to: ºSi-OH + A1(CH3)3 ºSi-0-Al(CH3)2 + CH
Water then reacts in the second reaction step with the metal oxide precursor by hydrolysis followed by condensation reactions: ºSi-0-Al(CH3)2 + 2 H2O ºSi-0-Al(OH)2 + 2 CH4 2 ºSi-0-Al(OH)2 ºSi-0-Al(0H)-0-Al(0H)-0-Siº + H2O
Further, particle agglomeration may substantially be prevented by applying the primer sol-gel layer (and the main sol-gel coating layer) with a structured, nano-porous surface, such as of the silica sol-gel coating layer (see below).
The ALD process can easily be scaled up and nearly no powder or particle loss during ALD coating is observed. Commercially available ALD reactors for powder coating are e.g. sold by Picosun Oy with e.g. a cartridge sample holder (POCA™). A system that may be used for the ALD process is e.g. described in WO 2013171360 Al, though other systems may also be applied.
A (non-limited) number of suitable materials for the ALD coating layer are listed in the following table:
Alternatively or additionally, niobium oxide (especially Nb20s) or yttrium oxide (Y2O3) may be applied. Metal precursors thereof are e.g., (tert-butylimido)-tris (diethylamino)-niobium, NbFv or NbCb. and Tris(ethylcyclopentadienyl) Yttrium,
respectively. In further embodiments zinc oxide (ZnO) may be applied. Metal precursors thereof that e.g. may be applied are diethylzinc (DEZ), Zn(C2H5)2 and dimethylzinc (DMZ) Zh(0¾)2. However, other materials may also be applied. Hence, in the atomic layer deposition process a metal oxide precursor may especially be selected from a group of metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn (and optionally Si). Alternatively or additionally, metal precursors of one or more metals comprising Ga, Ge, V and Nb may be applied. Even more especially, alternating layers of two or more of these precursors are applied, wherein at least one precursor is an Al metal oxide precursor, and another precursor is selected from a group consisting of a Hf metal oxide precursor, a Zn metal oxide precursor, a Ta metal oxide precursor, a Zr metal oxide precursor, a Ti metal oxide precursor, and a Sn metal oxide precursor, especially selected from a group consisting of a Hf metal oxide precursor, a Ta metal oxide precursor, a Ti metal oxide precursor, and a Zr metal oxide precursor, such as selected from a group consisting of a Hf metal oxide precursor, a Ta metal oxide precursor, and a Zr metal oxide precursor, even more especially a Ta metal oxide precursor. Especially Hf, Zr, and Ta appear to provide relatively light transmissive layers, whereas Ti, for instance, may provide relatively less light transmissive layers. Using TiCU as the metal oxide precursor (for a TiCh layer) may provide a cost efficient layer. Processing with Ta, Hf and Zr seems to be relatively easier than Si, for instance. The terms “oxide precursor” or “metal oxide precursor” or “metal (oxide) precursor” may also refer to a combination of two or more chemically different precursors. These precursors especially form an oxide upon reaction with the oxygen source (and are therefore indicated as metal oxide precursor).The metal oxide precursors may in embodiments be selected independently from each other for successive ALD cycles. For instance, in embodiments, a ZnO layer and an AI2O3 layer are deposited alternately to obtain an AZO layer (Ak03:Zn0, or “aluminum-doped zinc oxide layer” The AZO layer may he a conductive layer and may be deposited using, e.g., triraethylaluminum, diethylzinc, and water as an oxygen source. In further embodiments, a (another) metal oxide is (also) deposited in multiple consecutive cycles (and optionally successively a further metal oxide is deposited (optionally also in multiple consecutive cycles).
Further, the term “metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn” and comparable terms in phrases like “in the atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn” especially refers to metal oxide precursors of metals selected from a group consisting of the given metals (in this respect Al, Zn, Hf, Ta, Zr,
Ti, Sn). Furthermore, in embodiments one or more metal oxides precursors are selected. For instance, with reference to the list given above, the metal oxide precursor “that is selected from the group of metal oxide precursors of metals comprising Al, Zn, Hf, Ta, Zr, Ti, and Sn” may comprise any combination of metal oxide precursors of two or more metals selected from the group consisting of Al, Zn, Hf, Ta, Zr, Ti, and Sn. In embodiments, e.g. the metal oxide precursor comprises a combination of TaCh and HA1(CH3)2. In further embodiments, the metal oxide precursor comprises only A1(CH3)3.
Hence, in embodiments, in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si). Especially, in further embodiments, in the main atomic layer deposition process the metal oxide precursor is selected from a group of metal oxide precursors of metals comprising Al, Hf, Ta, Zr, and Ti (especially metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti). In further embodiments, in the main atomic layer deposition process a metal oxide precursor selected from a group consisting of A1(CH3)3, HA1(CH3)2, Hf(N(CH3)2)4, Hf(N(CH2CH3)2)4, Hf[N(CH3)(CH2CH3)]4, TaCb, Ta(N(CH3)2)5, Ta{[N(CH3)(CH2CH3)]3N(C(CH3)3)}, ZrCU, Zr(N(CH3)2)4, TiCU, Ti(OCH3)4, and Ti(OCH2CH3)4 and an oxygen source selected from a group consisting of H2O and O3 are applied. Additionally or alternatively, in the (main) atomic layer deposition process a metal oxide precursor is selected from a group consisting of Zn(C2tT)2 and Zn(CH3)2. In yet further embodiments, additionally or alternatively, in the (main) atomic layer deposition process, the metal precursor is selected from a group consisting of (tert-butylimido)-tris (diethylamino)- niobium, NbFv NbCb, and Tris(ethylcyclopentadienyl)Yttrium.
The metal oxide precursor(s) in the further atomic layer deposition process is especially independently selected from the metal oxide precursor(s) in the main atomic layer deposition process and may especially (also) be selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y,
Ga, and V (and optionally Si). In embodiments, (at least one of) the metal oxide precursor(s) in the further atomic layer deposition process is a Si metal oxide precursor. Especially, in further embodiments, in the further atomic layer deposition process the metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti. In embodiments, in the further atomic layer deposition process a metal oxide precursor is (also independently from the main ALD process) selected from a group consisting of A1(CH3)3, HA1(CH3)2, Hf(N(CH3)2)4, Hf(N(CH2CH3)2)4,
Hf[N(CH3)(CH2CH3)] , TaCls, Ta(N(CH3)2)5, Ta{[N(CH3)(CH2CH3)]3N(C(CH3)3)}, ZrCU, Zr(N(CH3)2)4, TiCU. Ti(OCH3)4, and Ti(OCH2CH3)4, and an oxygen source selected from a group consisting of H20 and 03 are applied. Additionally or alternatively, in the further atomic layer deposition process, a metal oxide precursor is selected from a group consisting of Zn(C2H5)2 and Zn(CH3)2. In yet further embodiments, additionally or alternatively, in the further atomic layer deposition process the metal precursor is selected from a group consisting of (tert-butylimido)-tris (diethylamino)-niobium, NbFs, NbCb, and Tris(ethylcyclopentadienyl)Yttrium.
Especially, in embodiments, in the main atomic layer deposition process and/or in the further atomic layer deposition process, a metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Si, Sn, Nb, Y, Ga, and V.
It turned out that deposition temperatures in the 200 - 350°C range are most suitable for alumina ALD on the primer layer (and the main sol-gel coating layer), preferably the temperature is in the 250-300°C range. Similar temperatures may be applied for ALD of other metal oxide precursors for the ALD layer(s).
In specific embodiments, the main ALD coating layer comprises a multilayer with at least three layers having different chemical compositions and one or more of the layers comprise an oxide of Si (Si02). Especially, such Si02 layer is sandwiched between other layers of the multilayer. Hence, especially the (ALD) layer (of the multilayer of the main ALD coating layer) contacting the main sol-gel layer and the respective (ALD) layer contacting the primer layer does not consist of Si02. Yet, in embodiments a further ALD coating layer contacting the main sol-gel coating layer may comprise Si02. Hence, in embodiments, in the (main and/or further) atomic layer deposition process a metal oxide precursor of Si is selected.
Especially, the main ALD alumina (or other metal oxide) layer has a thickness of 3-250 nm, especially a thickness of as 5-250 nm, such as 5-100 nm, even more especially a thickness of 5-50 nm, such as especially 10-50 nm, even more especially a thickness of 20-50 nm.
Water gas penetration barrier properties of alumina ALD layers can be further improved by depositing at least one additional layer of a different oxide material such as Zr02, Ti02, Y203, Nb205, HfCh, Ta2Os. Especially, the thickness of the additional material layer is in the range 1-40 nm, more preferably in the range 1-10 nm. Even more especially are nanolaminate stacks of alternating layers of AhCh and a second oxide material from the
group of ZrCh, TiCh, Y2O3, Nb2Ch, HfCh, S11O2 Ta205. A suitable nanolaminate stack may be e.g. 20 x (1 nm AI2O3 (10 ALD cycles) + 1 nm ZrCh (11 ALD cycles)) deposited at 250°C to form a 40 nm thick nanolaminated 2nd coating on the primer layer (and/or the main sol-gel coating layer).
The invention especially provides in embodiments a method wherein the main ALD coating layer comprises a multilayer with layers having different chemical compositions, and wherein in the atomic layer deposition process a metal oxide precursor is - amongst others - selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V and Nb (and optionally Si), especially the metal oxide precursor is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti. Also combinations of two or more of such precursors may be used, e.g. a multilayer comprising alumina - a mixed oxide of zirconium and hafnium - alumina, etc. In specific embodiments, in the main atomic layer deposition process, the metal oxide precursor for the two or more layers is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti.
Hence, in embodiments the main ALD coating layer may comprise a multilayer with (n) layers having different chemical compositions, and wherein the multilayer comprises one or more layers comprising an oxide of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V, and Nb (and optionally Si), especially wherein the multilayer comprises one or more layers comprising an oxide of one or more of Al, Hf, Ta, Zr, and Ti. One or more layers of such multilayers may also include mixed oxides, such as indicated above.
In further specific embodiments, the method of the invention comprises successively providing n layers (onto the primer layer by application of the main atomic layer deposition process), especially wherein each layer has a layer coating layer thickness (d21) in the range of 1- 50 nm, especially 1-20 nm, such as 1-15 nm. The layer coating thickness may in embodiments be at least 2 nm, such as at least 5 nm and e.g. be in the range of 5-40 nm, especially 5-25 nm. The number n of layers is especially at least 2, such as at least 3, or at least 4. In embodiments, n may be larger than 10. Yet, n is especially equal to or smaller than 10, such as equal to or smaller than 5. In embodiments, 2<n<10, or especially 2<n<5. It will be understood that an individual layer may be provided by one or more ALD cycles. Further, especially adjacent (contacting) layers comprise different chemical compositions. In further embodiments, one or more layers comprise one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta2Ch, especially wherein one or more (other) layers comprise AI2O3. It
further appeared to be advantageous when the layer contacting the main sol-gel coating layer consist of HfCh and/or ZrCh and/or TiCh and/or Ta205. Hence, in further embodiments, a layer contacting the main sol-gel coating layer consist of one or more metal oxides selected from the group of HfCh, ZrCh, Ti02,Ta205.
Hence, in specific embodiments, the method comprises successively providing n (ALD) layers onto the primer layer by application of the main atomic layer deposition process (to provide the multilayer), wherein each layer has a layer coating layer thickness (d21) in the range of 1- 50 nm, especially 1-20 nm, such as 1-15 nm, and wherein 2<n<50, especially 2<n<20, such as 2<n<10, especially 2<n<5, wherein one or more layers comprise one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta2C , and wherein one or more layers comprise AI2O3, wherein a layer contacting the main sol-gel coating layer consist of one or more metal oxides selected from the group of HfCh, ZrCh, TiCh, Ta2C .
Especially the method is applied such that a (n ALD) multilayer coating (especially for the main ALD coating layer) is obtained including at least two (ALD) layers (“AB”), even more especially at least three layers (e.g. “ABA”), yet even more at least four layers. Yet more especially, at least a stack comprising two or more stack of subsets of two (ALD) layers (“AB”) is applied, such as (AB)n, wherein n is 2 or more, such as 2-20, like 2- 10
Especially, at least one of the layers of the multilayer comprises an oxide of Al(optionally in combination with a further oxide of e.g. Si, or another metal oxide described herein), and at least one of the layers of the multilayer comprises one or more of an oxide of Hf, Zn, Ta, Zr, Ti, Y, Ga, Ge, V, Sn, and Nb. Such layer may optionally also include Al, Zn, Hf, Ta, Zr, Ti, Sn,( Si,) Y, Ga, Ge, V, and Nb, wherein Al is in a layer together with one or more of the other indicated elements, when the other layer(s) of the multilayer comprise an oxide of alumina, respectively. The term “ALD multilayer” or “multilayer” as indicated above especially refers to layers having different chemical compositions. The phrase “layers having different chemical compositions” indicates that there are at least two layers having different chemical compositions, such as in the case of “ABC”, or in the case of (AB)n (with n > 1).
Specific examples of (AB)n include multilayers wherein A is an oxide of Al and wherein B is selected from one or more of an oxide of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V, and Nb, wherein Al (and/or optionally Si) is in a layer together with one or more of the other indicated elements, when the other layer(s) of the multilayer comprise an oxide of alumina, respectively, especially wherein B is selected from one or more of an oxide of Hf,
Zn, Ta, Zr, Ti, Y, Ga, Ge, V, and Nb, yet even more especially wherein B is selected from one or more of an oxide of Hf, Ta, Zr, and Ti, more especially wherein B is selected from one or more of an oxide of Hf, Ta, and Zr. In embodiments, B may further comprise an oxide of Si (optionally in combination with one or more of the oxides of Al, Zn, Hf, Ta, Zr, Ti, Sn, Y, Ga, Ge, V, and Nb). Especially, if (also) a SiCh layer is deposited with ALD, the SiCh (ALD) layer is deposited such that it not directly contacts the main sol-gel layer. For instance, the A layer (or B layer) of a multilayer may be an SiCh layer and the B layer (or A layer) contacting the main sol-gel layer may be an (ALD) layer having another chemical composition.
This main ALD multilayer is thus especially provided on the primer layer. The main sol-gel layer is especially provided on the main ALD multilayer. Further, as indicated above, on top of the main sol-gel layer, optionally one or more further layers may be applied, especially a further ALD layer may be provided on top of the main sol-gel layer. The further ALD layer may comprise an ALD multilayer, for instance an ALD multilayer as described herein in relation to the main ALD multilayer.
In further specific embodiments, the method further comprises (iv) providing a further ALD coating layer onto the luminescent core with the main sol-gel coating by application of a further atomic layer deposition process. Especially, thereby a further ALD coated luminescent particle is provided. In the further atomic layer deposition process especially a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V (and optionally Si), especially comprising Al, Hf, Ta, Zr, Ti. In embodiments, the further ALD coating layer has a further ALD coating layer thickness (d4) in the range of 2-50 nm, especially 10-50 nm, such as 10- 20 nm. The further ALD coating layer especially has a chemical composition differing from the chemical composition of the main sol-gel coating layer.
In further embodiments, the further ALD coating layer (optionally) comprises (is provided comprising) a further multilayer with two or more (further sub) layers having different chemical compositions, wherein one or more of the layers comprise metal oxides selected from a group of AI2O3, TiCh, ZrCh, HfCh, SnCh, ZnO and Ta205, and wherein the two or more layers have a chemical composition differing from the chemical composition of the main sol-gel coating layer. In specific embodiments, in the further atomic layer deposition process, the metal oxide precursor for the two or more (further sub) layers (of the further multilayer) is selected from a group of metal oxide precursors of metals selected from a group consisting of Al, Hf, Ta, Zr, and Ti. The metal oxide precursor for the two or more
(further sub) layers (of the further multilayer) is especially selected from a group of metal oxide precursors comprising Al, Hf, Ta, Zr, Ti.
Hence, in specific embodiments the main ALD coating layer comprises a multilayer with a stack of layers, with adjacent layers having different chemical compositions. Especially, the layers of the multilayer have each independently thicknesses in the range of 1-40 nm, especially 1-10 nm. Further, especially, the multilayer comprises one or more alumina layers and one or more metal oxide layers, with the metal selected from a group of Hf, Ta, Zr and Ti.
Therefore, in specific embodiments in the atomic layer deposition process a metal oxide precursor selected from a group consisting of A1(CH3)3, HA1(CH3)2, Hf(N(CH3)2)4, Hf(N(CH2CH3)2)4, Hf[N(CH3)(CH2CH3)]4, TaCb, Ta(N(CH3)2)5, Ta{[N(CH3)(CH2CH3)]3N(C(CH3)3)}, ZrCk, Zr(N(CH3)2)4, TiCk, Ti(OCH3)4, and Ti(OCH2CH3)4, and an oxygen source selected from a group consisting of H20 and O3 are applied. As indicated above, also two or more different metal oxide precursors and/or two or more different oxygen sources may be applied.
Further, in embodiments of the method in the main atomic layer deposition process and/or the further atomic layer deposition process, especially in the main atomic layer deposition process, a multilayer is provided, with layers having different chemical compositions, wherein one or more layers comprise tantalum oxide (especially Ta205).
Hence, the invention also provides in embodiments luminescent material, wherein the main ALD coating layer comprises a multilayer with layers having different chemical compositions, wherein one or more layers may especially comprise Ta205. Further, in embodiments of the method in the (main) atomic layer deposition process, a multilayer is provided, with layers having different chemical compositions, wherein one or more layers comprise one or more of tantalum oxide (especially Ta205), hafnium oxide, titanium oxide, and zirconium oxide. Hence, the invention also provides in embodiments luminescent material, especially luminescent particles, wherein the main ALD coating layer comprises a multilayer with layers having different chemical compositions, wherein one or more layers may especially comprise one or more of tantalum oxide, hafnium oxide, titanium oxide and zirconium oxide. For instance, the multilayer stack may also include a stack with alternating layers wherein e.g. alumina alternates with one or more of tantalum oxide (especially Ta205), hafnium oxide, titanium oxide, and zirconium oxide, such as a stack comprising e.g. alumina- tantalum oxide-alumina-Hafnia-alumina-tantalum oxide, or alumina-titanium oxide-alumina, etc..
Further, it appeared that when first an ALD coating was provided on core without a primer layer the ALD layer was less uniform than desirable. To obtain a good ALD layer directly on the core surface, the ALD layer thickness may in such embodiments have to be increased more than in principle would be necessary, which may lead to an unnecessary reduction in transmission (even though in some cases small). Further, it appeared that after providing the primer layer at the core (even when not being completely conformal), an ALD coating coats more easily to the core.
As indicated above, the main sol-gel layer that typically has an average thickness in the range of 50-700 nm, such as 50-600 nm, especially 75-500 nm, such as especially 100-500 nm, and is formed by a sol-gel type process. In such process, an inorganic network is formed from a homogeneous solution of precursors by subsequent hydrolysis to form a sol (colloidal suspension) and condensation to then form a gel (cross-linked solid network) that is chemically bonded to the powder surfaces. Preferably, the (main) sol-gel coating layer material is silica and the sol-gel deposition method corresponds to the so-called Stober reaction as described in Stober, W., A. Fink, et ak. "Controlled growth of monodisperse silica spheres in the micron size range." Journal of Colloid and Interface Science 26(1): 62-69. To this end the (coated or uncoated) luminescent particle is dispersed in an alcohol such as an aliphatic alcohol R-OH such as methanol CFLOFl, ethanol C2H5OH or iso-propanol C3H7OH followed by addition of ammonia (NFL solution in water) and a silicon alkoxide precursor. The silicon alkoxide precursor dissolves in the alcohol + ammonia mixture and starts to hydrolyze. A conformal silica coating is formed on top of the (coated or uncoated) particle surfaces by reaction of the hydrolyzed, yet dissolved sol species with reactive groups of the particle surfaces (e.g. amine or silanol groups) followed by a seeded growth process that consists of hydrolysis, nucleation and condensation reactions steps.
The term “(coated or uncoated) particle surface” in relation to the sol-gel coating process may especially relate to the surface of the particle (luminescent core) and/or the surface of the washing result layer (especially the oxide-containing layer) on the particle (luminescent core), especially in relation to the primary sol-gel coating process. The term may further relate to the surface of the main ALD coating, especially in relation to the main sol-gel coating process.
The silicon alkoxide precursor is especially selected from a group of compounds that is formed
wherein a) Rl, R2, R3 are hydrolysable alkoxy groups and R4 is selected from a group of C1-C6 linear alkyl groups, hydrolysable alkoxy groups and a phenyl group, or b) Rl, R2, R3 are individually selected from -OCH3 and -OC2H5 and R4 is selected from -CH3, -C2H5, -OCH3, -OC2H5 and a phenyl group. Optionally, the silicon based polymer is obtained from a material from the group of:
Hence, in embodiments of the method, in the main sol-gel coating process, a silicon alkoxide precursor is used, wherein the silicon alkoxide precursor is especially selected from a group of compounds consisting
wherein a) Rl, R2, R3 are hydrolysable alkoxy groups and R4 is selected from a group of C1-C6 linear alkyl groups, hydrolysable alkoxy groups and a phenyl group, or b) Rl, R2, R3 are individually selected from -OCH3 and -OC2H5 and R4 is selected from -CH3, -C2H5, -OCH3, -OC2H5 and a phenyl group.
In further embodiments of the method, in the main sol-gel coating process, a silicon alkoxide precursor is used, and the silicon alkoxide precursor is selected from a group consisting of
In further embodiments of the method, in the primary sol-gel coating process, a silicon alkoxide precursor is used, and especially the silicon alkoxide precursors may be a silicon alkoxide precursor as described herein in relation to the main sol-gel coating process. The silicon alkoxide precursor in the primary sol-gel coating process may be independently selected from the silicon alkoxide precursor in the main sol-gel coating process.
Especially, the silicon alkoxide precursor (in the main and/or primary sol-gel coating process) is selected from a group of Si(OCH3)4 or Si(OC2H5)4, more especially Si(OC2H5)4 is used as silicon alkoxide precursor. Similar precursors but based on another metal such as e.g. A1 may also be used.
A typical sol-gel coating process may comprise the following stages: (a) particles or powder, especially luminescent cores) (optionally with the oxide-containing layer and/or the main ALD coating layer) are suspended in an alcohol - aqueous ammonia solution mixture while stirring or sonication. To improve particle dispersion, the particles (cores / powder) can also first be mixed with alcohol and a small amount of a silicon (or other metal) alkoxide before the ammonia solution is added (b) A silicon (or other metal) alkoxide precursor is added under agitation of the suspension. Typical concentrations of silicon (or other metal) alkoxide, ammonia and water in the alcohol solvent are 0.02-0.7, 0.3-1.5, and 1- 16 mole/1, respectively (c) The suspension is stirred or sonicated until the coating has formed (d) The coated powder is washed with alcohol and dried followed by calcination in air or vacuum at 200 - 300°C.
Hence, in embodiments the main sol-gel coating process comprises: (iiia) providing a mixture of an alcohol, ammonia, water, the luminescent core(s) with the (primer layer and) the main ALD coating layer and a metal alkoxide precursor while agitating the mixture, and allowing a main sol-gel coating layer to be formed on the main ALD coating layer , wherein the metal alkoxide precursor is especially titanium alkoxide, silicon alkoxide, or aluminum alkoxide; and (iiib) retrieving the luminescent core(s) with (the primer layer,)
the main ALD coating layer and the main sol-gel coating layer from the mixture and optionally subjecting the retrieved luminescent core(s) with the primer layer, the main ALD coating layer and the main sol-gel coating layer to a heat treatment to provide the luminescent particle(s) with hybrid coating.
Hence, in further embodiments, the primary sol-gel coating process comprises: (ibl) providing a mixture of an alcohol, ammonia, water, the luminescent core(s) optionally with the washing result layer, especially the luminescent core(s) and the washing result layer (or the luminescent core(s) comprising the washing result layer) and a metal alkoxide precursor while agitating the mixture, and allowing the primary sol-gel coating layer to be formed on the washing result layer and/or on the luminescent core(s) without a washing result layer, especially on the washing result layer, wherein the metal alkoxide precursor is especially selected from titanium alkoxide, silicon alkoxide, or aluminum alkoxide; and (ib2) retrieving the luminescent core(s) with the (washing result layer and the) primary sol-gel coating layer from the mixture and optionally subjecting the retrieved luminescent core(s) with (the washing result layer and) the primary sol-gel coating layer to a heat treatment to provide the luminescent core(s) comprising (with) the primer layer on the luminescent core.
The process of retrieving the core(s) (with the respective (coating) layers) from the mixture may e.g. include one or more of filtration, centrifuging, decanting (the liquid over a precipitate), etc.. The heat treatment may include one or more of drying and calcination, especially both, i.e. e.g. a drying stage at a temperature in the range of 70-130 °C followed by a calcination stage (in air; or vacuum or an (other) inert atmosphere). Hence, during part of the time of the heat treatment, the (coated) luminescent may be in an inert environment, such as vacuum, or one or more of N2 and a noble gas, etc. The heat treatment seems to improve the stability of the luminescent material. Further, as indicated above, in the (main and/or primary) sol-gel coating process a silicon (or other metal; though the formula below refers to Si) alkoxide especially a precursor may be used selected from a group of compounds consisting of:
, wherein Rl, R2, R3 are selected from a group consisting of hydrolysable alkoxy moieties and R4 is selected from a group consisting of C1-C6 linear alkyl moieties, hydrolysable alkoxy moieties, and a phenyl moiety. Optionally other ligands than alkoxides may be applied in precursor for the sol-gel process.
The particles obtained with a sol-gel coating process may optionally include more than one nucleus. For instance in the case of quantum dots, agglomerates with a (primary and/or main) sol-gel coating may be obtained. Hence, the silica precursor (or other metal oxide precursor) can also coat multiple QDs (especially comprising the main ALD coating layer) with thin single shells to form a coated agglomerate. This may amongst others depend upon the concentration of the quantum dots, etc.
Above, the precursors for the sol-gel coating are especially described in relation to a silicon alkoxide precursor. However, also aluminum (or another metal) alkoxide precursor(s) may be applied. Further, also a combination of two or more chemically different precursors may be applied for providing the sol-gel coating layer or first coating layer.
The term “sol-gel coating process” may also relate to a plurality of sol-gel coating processes. With a plurality of sol-gel coating processes, especially a plurality of main sol-gel coating processes, one may provide a (multi)layer substantially comprising the same composition through the entire layer thickness (when e.g. in the (main) sol-gel coating process each coating stage or step includes depositing substantially the same material), or may provide a multilayer with two or more layers having different compositions, such as a stack of two or more (sol-gel) layers with two or more different compositions, respectively. An example may e.g. be a S1O2-AI2O3 (sol-gel) multilayer, such as a stack of three or more (sol-gel) layers wherein S1O2 and AI2O3 alternate (see also above).
To facilitate the deposition of the main ALD coating layer, the luminescent core may comprise the primer layer.. In embodiments, the primer layer comprises the primary sol-gel coating layer (optionally including a multilayer), especially provided by the (primary) sol-gel coating process. The primary sol-gel coating layer may facilitate the deposition of a (thin) conformal main ALD coating layer. To further support the deposition of the main ALD coating layer, the surface of the core is in embodiments cleaned before providing the primary sol-gel layer and/or the main ALD coating layer.
To facilitate the main ALD deposition process, and especially to enable the deposition of a single ALD layer or multiple layers with as few defects as possible, any chemically reactive contamination (also known as “second phases”) that may be present in the powder (raw product, especially comprising a plurality of luminescent cores) may be removed. Preferably, small particles, typically having a sub-micron dimension, and that may stick to the surface of the phosphor particle (luminescent core) are removed as well before depositing the main ALD coating process. The cleaning of the surface of the core may especially comprise a (chemical) washing process. In embodiments, the core may be washed
by applying a washing process, by applying an aqueous liquid. Such aqueous liquid may comprise an acid or a base or may e.g. consist of water (with a neutral pH). Water may e.g. be applied for removing small unwanted particles and part of the second phases. Yet, for removing additional impurities the pH of the aqueous liquid may be changed, e.g. to pH- values of at least 8, especially at least 9, or to pH values below 6, especially below 5. This way, e.g. impurities may be dissolved. In further embodiments, a non-aqueous solvent may be applied, especially for particles (cores) that may be sensitive to water. Hence, especially an aqueous liquid comprising additives (e.g. to change the pH), a non-aqueous solvent, or a combination of these liquids/solvents may be applied. Therefore, the cleaning/washing process may be indicated as a “chemical washing process”, especially by applying a washing solvent (including an aqueous liquid).
If the chemical stability of the phosphor (luminescent core) in water, bases, and/or acids is limited, washing procedures with very mild conditions may be applied to remove 2nd phases without dissolving (part of) the phosphor particles. This can be achieved by choosing weak instead of strong acids with pKa values that may be selected depending on the stability of the phosphor and impurity phases (see below). Additionally or alternatively degradation of the phosphor in the washing process may be avoided by first applying a non- aqueous solvent to the luminescent core(s) (phosphors) to provide a suspension (of the luminescent particles/cores) and successively add a weak acid (or base) in such a way that the total amount of water and the acid concentration are sufficient to only dissolve the impurity phases.
A washing solvent having a pH less than 7 is useful for hydrolysis sensitive luminescent materials, as such luminescent materials as disclosed herein react as a base in aqueous media. The acidity of such washing solvent may be low. Specifically, organic acids such as acetic acids diluted in a polar solvent with a low proton concentration, such as aliphatic alcohols, e.g. ethanol or isopropanol, as disclosed above, may be used as the washing solvent. The more sensitive the luminescent material is, the more diluted (i.e., the lower the proton concentration) the washing solvent should be, as the goal of the washing process is to remove basic impurity phases and create a surface at the particulate luminescent material that aids adhesion of the subsequent primer layer without degrading the luminescent material. In general, a washing solvent of Thus, if a person having ordinary skill in the art observes that too much of the luminescent particle material is degrading or dissolving in the washing process, a reduction of the acid concentration, a replacement of the solvent by
another solvent with a lower dielectric contant and/or a cooling of the washing suspension may reduce the amount of degradation.
After washing, the number of fine particles in the phosphor powder may be further reduced by sedimentation in non-reactive liquids (typically polar organic solvents, like e.g. water-free ethanol, or other alcohols). In embodiments, ultrasound is applied to the suspension before sedimentation to better detach and disperse fine particles from larger phosphor grains.
As a result of the chemical washing process a thin layer may be formed at the particle (core) surface with a different composition compared to the nominal composition of the luminescent particle (luminescent core). That is, the surface composition of the particulate luminescent particle may differ somewhat from the overall composition of the particulate luminescent material. Especially the thin layer (i.e., surface)may comprise a higher oxygen concentration (content) than the (nominal composition of) the luminescent core. Applying the chemical washing may in embodiments provide a washing result layer onto the luminescent core. The washing process may provide a surface (washing result layer) that aids in the adhesion of the subsequent primer layer. The thin layer/surface may contain, for example, alkaline earth elements (e.g., strontium), aluminum, and oxide when, for example alkaline earth aluminate type hydrolysis sensitive luminescent materials such as those disclosed herein are to be coated. The surface layer may contain elements such as lithium, silicon, europium, carbon and/or hydrogen, depending on the luminescent material. The washing result layer especially comprises an oxide-containing layer. The washing result layer not necessarily is conformally and/or entirely covering the surface of the luminescent core (see also above in relation to the primer layer). The washing result layer may not be a continuous layer and may e.g. comprise a plurality of layer section, each covering only a section of the surface of the luminescent core. The washing result layer may in embodiments be evenly distributed over (the surface of) the luminescent core. The washing result layer may in embodiments cover the core for at least 30%, such as at least 50%, especially at least 75%, such as at least 90%, or especially at least 95% or even more especially at least 99%, of the surface of the core.
Experimentally it was noticed that even by applying a mild washing solvent the washing result layer is observable. Especially, in the case of nitride or oxonitride compounds, the 0:N ratio may be higher in the washing result layer. The luminescent core especially comprises nitride or oxonitride compounds. In embodiments, the luminescent material, especially of the luminescent core, comprises a nitride luminescent material (core).
In further embodiments, the luminescent material, especially of the luminescent core, (also) comprises an oxonitride luminescent material (core).
Hence, in further embodiments, the method further comprises (ia) providing a washing result layer onto the luminescent core by application of a chemical washing process, especially wherein the washing result layer comprises an oxide-containing layer. In further embodiments, the application of the chemical washing process includes drying the luminescent core(s) after removing the washing solvent. The washing result layer may be provided during the washing of the luminescent core with the washing solvent and/or during drying of the luminescent core. In further embodiments, the primary sol-gel coating is provided after application of the chemical washing process (optionally including the drying of the luminescent core). Application of the chemical washing process may provide a washed luminescent particle comprising the washing result layer onto the luminescent core.
Hence, in further embodiments, the method further comprises providing a primary sol-gel coating layer onto luminescent core and the washing result layer (or onto the luminescent core comprising the washing result layer) by application of a primary sol-gel coating process, thereby providing the primer layer comprising the washing result layer and the primary sol-gel layer , and especially wherein the primer layer has a primer layer thickness (dl) in the range of 0.1-5 nm.
The washing solvent may in embodiments comprise an aqueous solvent. Herein, this (washing with a solvent comprising an aqueous solvent) may also be indicated as a “wet chemical washing process”. In embodiments, e.g. the washing solvent comprises a strong acid or a strong base. These terms are known in the art. Examples of strong acids are HC1, HBr, HCIO4, HI, HNO3. Examples of strong bases are e g. NaOH, KOH, CaOH. Yet, in further embodiments, the washing solvent comprises a weak acid or a weak base. Examples of weak acids that may be used are e.g. acetic acid, formic acid, hydrofluoric acid, trichloroacetic acid, citric acid, oxalic acid etc.. Examples of weak bases are e.g. ammonia, sodium bicarbonate, alanine, and methylamine.
The weak acid or the weak base may especially be selected having a pKa value or a pKb value respectively higher than 3, especially equal to or higher than 4 (in water at room temperature). In embodiments, the washing solvent comprises one or more weak acids selected from a group of acetic acid, formic acid, hydrofluoric acid, trichloroacetic acid, citric acid, oxalic acid. The washing solvent may especially comprise formic acid or acetic acid. In further embodiments, the washing solvent comprises one or more weak based ammonia, sodium bicarbonate, alanine, and methylamine. The washing solvent may especially
comprise a combination of a non-aqueous fluid and a weak acid or a weak base. For instance, the washing solvent may in embodiments comprise an alcohol (e.g. propanol, isopropyl alcohol, ethanol, (cyclo) hexanol or any other alcohol with one or more hydroxy groups) and a weak acid, e.g. formic acid and/or acetic acid. Alternatively the washing solvent may in embodiments comprise mixtures of an alcohol and a polyol. In embodiments, e.g. the washing solvent comprises a mixture of ethanol and as triethylene glycol and especially traces as water acting as a dissolution catalyst. Such combination may advantageously be applied for washing luminescent particles (cores) that may easily degrade under the influence of water. The washing solvent may in embodiments comprise less than 50 wt% water (relative to the weight of the washing solvent). The washing solvent may e.g. comprise equal to or less than 40 wt% water, such as equal to or less than 35 wt% water. In embodiments, the washing solvent may comprise no more than 25 wt% water. Especially, the washing solvent (comprising a (weak) base or (weak) acid) comprises at least 5 wt% water, such as at least 10 wt% water. Yet in embodiments, the washing solvent is a non-aqueous washing solvent. Further, the application of weak acids (and weak bases) may have a further benefit in that they may provide a pH buffering function. As such, the pH of the washing solvent may not substantially change if an extra amount of the weak acid (or base) is added to the washing solvent (e.g. if not all impurities are removed by the washing solvent yet). Using weak acids or weak bases may increase the robustness of the wet washing process.
Hence, in further embodiments, the chemical washing process may especially comprise a wet chemical washing process comprising (i) washing the luminescent core by applying a washing solvent (process), wherein the washing solvent comprises an (weak) acid or a (weak) base, especially a (weak) acid, and wherein the washing solvent comprises equal to or less than 50 % wt/wt water, especially in the range of 10-35% wt/wt water and optionally (ii) successively subjecting the luminescent core to a drying treatment, thereby providing the luminescent core comprising the washing result layer on(to) the luminescent core.
Especially based on the washing process (optionally including the drying treatment), the oxygen-containing layer may be provided on the luminescent particle.
The different (coating) layers that may be configured at the luminescent core (the primary layer, the main ALD-layer, the main sol-gel coating layer and the further ALD coating layer) are especially light transmitting. This means that at least a portion of the light, which impinges on the respective layers, is transmitted through the respective layer. Thus, the different (coating) layers may be fully or partially transparent or may be translucent. In an
embodiment, more than 90% of the (visible) light which impinges on the (coating) layers is transmitted through the (coating) layers. The (coating) layers may be light transmitting because of characteristics of the materials of which the coating layers are made. For example, the coating layer may be made from a material which is transparent, even if the layer is relatively thick. In another embodiment, one or more of the (coating) layers are thin enough such that the respective layer becomes light transmitting while the material of which the layer is manufactured is not transparent or translucent when manufactured in relatively thick layers. The materials described herein are all transmissive for (visible) light or can be made in suitable layer thicknesses that are transmissive for (visible) light.
In a further aspect, the invention also provides a lighting device comprising a light source configured to generate light source radiation, especially one or more of blue and UV, and a wavelength converter comprising the luminescent material as described herein, wherein the wavelength converter is configured to convert at least part of the light source radiation into wavelength converter light (such as one or more of green, yellow, orange and red light). The wavelength converter is especially radiationally coupled to the light source. The term "radiationally coupled" especially means that the light source and the luminescent material are associated with each other so that at least part of the radiation emitted by the light source is received by the luminescent material (and at least partly converted into luminescence). Hence, the luminescent cores of the particles can be excited by the light source radiation providing luminescence of the luminescent material in the core. In embodiments, the wavelength converter comprises a matrix (material) comprising the luminescent material (particles). For instance, the matrix (material) may comprise one or more materials selected from a group consisting of a transmissive organic material support, such as selected from a group consisting of PE (polyethylene), PP (polypropylene), PEN (polyethylene napthalate), PC (polycarbonate), polymethylacrylate (PMA), polymethylmethacrylate (PMMA) (Plexiglas or Perspex), cellulose acetate butyrate (CAB), silicone, polyvinylchloride (PVC), polyethylene terephthalate (PET), (PETG) (glycol modified polyethylene terephthalate), PDMS (polydimethylsiloxane), and COC (cyclo olefin copolymer). Alternatively or additionally, the matrix (material) may comprise an epoxy resin.
When forming such a lighting device, use of the coating disclosed herein allows hydrolysis sensitive phosphors to be used as the luminescent material in the wavelength converter. In particular, luminescent material that would likely degrade under the conditions used to form the matrix in which the luminescent particles are embedded to form the wavelength converter may be used in lighting devices (as shown in Fig. 3 below). For
example, alkaline earth aluminate luminescent materials, or luminescent materials that have alkaline earth aluminate type surface layers after the washing process disclosed herein. Such hydrolysis sensitive luminescent materials include, for example, luminescent particles disclosed above that include a luminescent material selected from (the) SrLiAbN4:Eu2+ (class), in which, optionally also part of Sr may be replaced by another alkaline earth metal (group 2 elements of the periodic table). And also, for example, luminescent material (or phosphor) selected from a group consisting of (Sr,Ca)LiAbN4:Eu,
(Sr,Ca,Ba)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4; and a+b+d=4 and 2a+3b+d=10, and (Sr,Ba)Li2Al2-zSiz02-zN2+z:Eu, wherein 0<z<0.1 disclosed above. And also, for example SrLi2Al2-xSi02-xN2+x:Eu or (Sr,Ca)SiAl]Sb:Eu disclosed above. Use of the coating disclosed herein allows such hydrolysis sensitive luminescent materials to be used in processes for forming wavelength converters, for example, processes for forming wavelength converters in which luminescent particles are embedded within a matrix, such as silicone resins, which otherwise may degrade the uncoated luminescent materials.
The lighting device may be part of or may be applied in e.g. office lighting systems, household application systems, shop lighting systems, home lighting systems, accent lighting systems, spot lighting systems, theater lighting systems, fiber-optics application systems, projection systems, self-lit display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, green house lighting systems, horticulture lighting, or LCD backlighting.
As indicated above, the lighting unit may be used as backlighting unit in an LCD display device. Hence, the invention also provides an LCD display device comprising the lighting unit as defined herein, configured as backlighting unit. The invention also provides in a further aspect a liquid crystal display device comprising a back lighting unit, wherein the back lighting unit comprises one or more lighting devices as defined herein.
Especially, the light source is a light source that during operation emits (light source radiation) at least light at a wavelength in the range of 200-490 nm, especially a light source that during operation emits at least light at wavelength in the range of 400-490 nm, even more especially in the range of 440-490 nm. This light may partially be used by the wavelength converter nanoparticles (see further also below). Hence, in a specific embodiment, the light source is configured to generate blue light. In a specific embodiment, the light source comprises a solid state LED light source (such as a LED or laser diode). The term “light source” may also relate to a plurality of light sources, such as 2-20 (solid state)
LED light sources. Hence, the term LED may also refer to a plurality of LEDs. The term white light herein, is known to the person skilled in the art. It especially relates to light having a correlated color temperature (CCT) between about 2000 and 20000 K, especially 2700-20000 K, for general lighting especially in the range of about 2700 K and 6500 K, and for backlighting purposes especially in the range of about 7000 K and 20000 K, and especially within about 15 SDCM (standard deviation of color matching) from the BBL (black body locus), especially within about 10 SDCM from the BBL, even more especially within about 5 SDCM from the BBL. In an embodiment, the light source may also provide light source radiation having a correlated color temperature (CCT) between about 5000 and 20000 K, e.g. direct phosphor converted LEDs (blue light emitting diode with thin layer of phosphor for e.g. obtaining of 10000 K). Hence, in a specific embodiment the light source is configured to provide light source radiation with a correlated color temperature in the range of 5000-20000 K, even more especially from the range of 6000-20000 K, such as 8000- 20000 K. An advantage of the relative high color temperature may be that there may be a relatively high blue component in the light source radiation.
The term “controlling” and similar terms especially refer at least to determining the behavior or supervising the running of an element. Hence, herein “controlling” and similar terms may e.g. refer to imposing behavior to the element (determining the behavior or supervising the running of an element), etc., such as e.g. measuring, displaying, actuating, opening, shifting, changing temperature, etc.. Beyond that, the term “controlling” and similar terms may additionally include monitoring. Hence, the term “controlling” and similar terms may include imposing behavior on an element and also imposing behavior on an element and monitoring the element. The controlling of the element can be done with a control system, which may also be indicated as “controller”. The control system and the element may thus at least temporarily, or permanently, functionally be coupled. The element may comprise the control system. In embodiments, the control system and element may not be physically coupled. Control can be done via wired and/or wireless control. The term “control system” may also refer to a plurality of different control systems, which especially are functionally coupled, and of which e.g. one control system may be a master control system and one or more others may be slave control systems. A control system may comprise or may be functionally coupled to a user interface.
The control system may also be configured to receive and execute instructions form a remote control. In embodiments, the control system may be controlled via an App on a device, such as a portable device, like a Smartphone or I-phone, a tablet, etc.. The device is
thus not necessarily coupled to the lighting system but may be (temporarily) functionally coupled to the lighting system.
Hence, in embodiments the control system may (also) be configured to be controlled by an App on a remote device. In such embodiments the control system of the lighting system may be a slave control system or control in a slave mode. For instance, the lighting system may be identifiable with a code, especially a unique code for the respective lighting system. The control system of the lighting system may be configured to be controlled by an external control system which has access to the lighting system on the basis of knowledge (input by a user interface of with an optical sensor (e.g. QR code reader) of the (unique) code. The lighting system may also comprise means for communicating with other systems or devices, such as on the basis of Bluetooth, WIFI, LiFi, ZigBee, BLE or WiMAX, or another wireless technology.
The system, or apparatus, or device may execute an action in a “mode” or “operation mode” or “mode of operation”. Likewise, in a method an action or stage, or step may be executed in a “mode” or “operation mode” or “mode of operation” or “operational mode”. The term “mode” may also be indicated as “controlling mode”. This does not exclude that the system, or apparatus, or device may also be adapted for providing another controlling mode, or a plurality of other controlling modes. Likewise, this may not exclude that before executing the mode and/or after executing the mode one or more other modes may be executed.
However, in embodiments a control system may be available, that is adapted to provide at least the controlling mode. Would other modes be available, the choice of such modes may especially be executed via a user interface, though other options, like executing a mode in dependence of a sensor signal or a (time) scheme, may also be possible. The operation mode may in embodiments also refer to a system, or apparatus, or device, that can only operate in a single operation mode (i.e. “on”, without further tunability).
Hence, in embodiments, the control system may control in dependence of one or more of an input signal of a user interface, a sensor signal (of a sensor), and a timer. The term “timer” may refer to a clock and/or a predetermined time scheme.
BRIEF DESCRIPTION OF THE DRAWINGS
Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:
Fig. 1 schematically depicts aspects of a luminescent particle;
Fig. 2a-2b schematically depict some further aspects of a luminescent particle;
Fig. 3 schematically depicts a lighting device;
Fig. 4a-4b show a SEM and a TEM image of a luminescent particle;
Figs. 5a-5b show some experimental results wherein embodiments of the invention are compared to prior art luminescent materials.
Figs. 6a -6b show, respectively, cross-sectional and top schematic views of an array of pcLEDs.
Fig. 7a shows a schematic top view of an electronics board on which an array of pcLEDs may be mounted, and Fig. 7b similarly shows an array of pcLEDs mounted on the electronic board of Fig. 7a.
Fig. 8a shows a schematic cross-sectional view of an array of pcLEDs arranged with respect to waveguides and a projection lens. Fig.8b shows an arrangement similar to that of Figure 8a, without the waveguides.
Fig. 9 schematically illustrates an example camera flash system comprising an adaptive illumination system.
Fig. 10 schematically illustrates an example display (e.g., AR/VR/MR) system that includes an adaptive illumination system.
The schematic drawings are not necessarily to scale.
DETAILED DESCRIPTION OF THE EMBODIMENTS
Fig. 1 schematically depicts an embodiment of the luminescent particles 100. The luminescent particle 100 comprises a luminescent core 102 comprising a primer layer 105 on the luminescent core 102. Herein the luminescent core 102 with the primer layer 105 is also referred to as a primer layer 105 comprising luminescent particle 100. The primer layer 105 has a chemical composition differing from the chemical composition of the core 102. The luminescent core 102 may include e.g. micrometer dimensional particles of a luminescent nitride or sulfide phosphor but may also include other (smaller) material such as luminescent nanoparticles (see further Fig. 2b).
The luminescent particle 100 further comprises a main ALD coating layer 120. In the depicted embodiment the main ALD coating layer 120 comprises a multilayer 1120 with three layers 1121, layer 1121a, layer 1121b, and layer 1121c. The three layers 1121a, 1121b, 1121c especially have (at least two) different chemical compositions. Especially adjacently (and contacting) arranged layers 1121 have different compositions. Moreover, one
or more of the layers 1121 of the multilayer 1120 may have chemical compositions (also) differing from the chemical composition of the primer layer 105. The layers 1121 may in embodiments e.g. comprise different oxides of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V. Additionally or alternatively, the layers 1121 may comprise Si and/or Ge. Especially one of the layers 1121 may be an alumina layer.
The luminescent particle 100 further comprises a main sol-gel coating layer 130, especially having a chemical composition differing from one or more of the layers 1121 of the multilayer 1120. The figure further shows that main ALD coating layer 120 is arranged between the primer layer 105 and the main sol-gel layer 130. Especially, adjacently arranged /contacting coating layers may have different compositions. In the depicted figure, layer 1121a especially has a composition that differs from the composition of the main sol-gel layer 130. Layer 1121c especially has a composition that differs from the composition of the primer layer 105. The hybrid coating of the embodiment in Fig. 1 thus comprises a primer layer 105, a main ALD layer 120 and a main sol-gel coating layer 130. In further embodiments, see e.g. Fig. 2a, the hybrid coating further comprises a further ALD coating layer 140.
The embodiment of Fig. 2a also comprises a further ALD coating layer 140 arranged on the main sol-gel coating layer 130. In the depicted embodiment, the further ALD coating layer 140 (also) comprises a further multilayer 1140 comprising two (further sub) layers 1141, 1141a, 1141b (of the further multilayer 1140). Yet, in other embodiments the further ALD coating layer 140 is (deposited as) a single layer. In Fig. 2a also the thicknesses of the layers are indicated. It is noted that the thicknesses are not to scale and only are depicted to explain the meaning of the terms and show the location. The primer layer thickness is indicated by the reference dl. The primer layer thickness dl may be in the range of 0.1-5 nm. The ALD coating layer thickness is indicated with the reference d2. The ALD coating layer thickness d2 may especially be in the range of 5-250 nm. The thickness of the main sol-gel coating 130 is indicated with reference d3. The main sol-gel coating layer thickness d3 is generally larger than the ALD coating layer thickness d2. The main sol-gel coating layer thickness d3 is especially in the range of 50-700 nm. The depicted embodiment comprises a multilayer 1120 with three layers 1121, each layer 1121 having a layer coating layer thickness d21 in the range of 1-20 nm. In the depicted embodiment, the layer coating thickness d21 of the three layers 1121 is about the same. The layer coating thickness d21 may though vary between the different layers 1121, see e.g. Fig 4b. The three layers 1121a, 1121b and 1121c may e.g. depict alternating AI2O3 layers (by way of example 1121b) and Ta20s
layers (by way of example 1121a, 1121c). The (further sub) layer coating layer thickness (not indicated with a reference) of the (further sub) layers 1141 of the further multilayer 1140 may especially be in the ranges as described in relation to the layer coating layer thickness d21 of the layers 1121 of the multilayer 1120.
Fig. 2a further schematically depicts that the primer layer 105 comprises an oxide-containing layer 101 and a primary sol-gel layer 110. The oxide-containing layer 101 is arranged at a surface 67 of the core 102. In the embodiment, the oxide-containing layer 101 and the primary sol-gel layer 110 are continuous and conformal. Yet, in further embodiments, this may not be the case, and e.g. the main ALD coating layer 120 may contact the oxide- containing layer 101 at some locations and may even contact the surface 67 of the core at some further location (while contacting the primary sol-gel layer 110 at other locations.
Fig. 2a further indicates with references 17, 27, 37, 47, 57 the surfaces of respective layers, and with reference 67 the surface of the core 102. As indicated above, the layer thicknesses described herein are especially average layer thicknesses. Especially at least 50%, even more especially at least 80%, of the area of the respective layers have such indicated layer thickness. Hence, referring to the thickness d2 between surface 47 and surface 37, below at least 50% of surface 37, a layer thickness in the range of e.g. 5-250 nm may be found, with the other less than at least 50% of the surface area 37 e.g. smaller or larger thicknesses may be found, but in average d2 of the main ALD coating (multi-)layer 120 is in the indicated range of 5-250 nm. Likewise, this may apply to the other herein indicated thicknesses. For instance, referring to the thickness d3 between surface 37 and surface 27, this thickness may over at least 50% of the area of 27 be in the range of 50-700 nm, with the other less than at least 50% of the surface area 27 e.g. smaller or larger thicknesses may be found, but in average dl of the first layer main sol-gel layer 130 is in the indicated range of 50-700 nm, such as especially 100-500 nm.
Fig. 2b schematically depicts an embodiment wherein the luminescent core 102 includes a luminescent nanoparticle, here by way of example a quantum dot 160. The quantum dot in this example comprises a quantum rod with a (semiconductor) core material 161, such as ZnSe, and a shell 162, such as ZnS. Of course, other luminescent nanoparticles may also be used. Such luminescent quantum dot 160 can also be provided with the hybrid coating.
Figs 1-2 schematically depict luminescent particles 100 having a single nucleus. However, optionally also aggregates encapsulated with the hybrid coating may be
formed. This may especially apply for quantum dots as luminescent particles defining the luminescent core 102.
The figures especially depict embodiments of the coating architecture on phosphor particles or luminescent cores 102 (after applying the respective (ALD and sol-gel) coating processes). The phosphor particles 102 may be covered by an oxide layer 101 formed by a washing and baking process. The primary sol-gel coating 110 comprises in embodiments silicon oxide (SiCh) provided by a (primary) sol-gel coating process. The first SiCh layer 110 especially acts as nucleation or seed layer for the main ALD coating layer 120, provided by a main atomic layer deposition process. Therefore, (the primary layer 105 as well as) the primary sol-gel coating layer 110 does not need to form a conformal or fully closed coating around each core 102. The primary sol-gel coating layer 110, e.g. the primary SiCh layer 110 can also be seen as a surface treatment to provide OH-groups on the phosphor particles 102. Such OH-groups may assist the ALD precursors to bond on the surface and consequently initiate film growth.
The main ALD coating layer 120 especially comprises a multilayer 1120 also called “nanolaminate” 1120 of metal oxides (sub-)layers 1121. A nanolaminate 1120 may form an extremely dense and nearly pinhole free conformal coating on phosphor particles that is almost impermeable to gases like water vapor and oxygen. The nanolaminate protection layer 1120 may in embodiments have a thickness d2 of 20-50 nm consisting of more than two sub-layers of AhCh, TiCh, ZrCh, HfCh, SnCh, ZnO or Ta2Cb. Each layer 1121 may have a thickness d21 in the range of 1 nm-15 nm. The outer layer 1121, i.e. the layer (1121a in Figs 1 and 2a) contacting the main sol gel coating layer 130 is in embodiments a chemical stable layer such as HfCh, ZrCh or Ta2Ch that does not corrode when exposed to water or other solvents such as cyclohexanone.
The main sol-gel coating layer 130 may also comprise silicon oxide (SiCh) provided by the (main) sol-gel coating process, analog to the primary sol-gel coating layer 110. The main sol-gel coating 130 may especially function as mechanical protection to prevent damage of the underlying barrier coating 120. In an LED fabrication process phosphor particles undergo various process steps, such as mixing, sieving, pressing, and molding. These process steps may induce mechanical stress in the coating. As a results the coating might be damaged. The main sol-gel coating layer 130 provides a high robustness against post-processing and fabrication steps. In embodiments a high reliability can be guaranteed by applying the main sol-gel coating layer 130 layer on the luminescent particles 100
In embodiments of the invention, a further ALD coating layer 140 is added to the layer architecture, as depicted in Fig. 2a. The further ALD coating layer 140 in the embodiment comprises a nanolaminate 1140. The layer 140 or multilayer 1140 may comprise metal oxides such as AI2O3, T1O2, ZrCh, HfCh, SnCh, ZnO or Ta205. The total thickness d4 of the layer 140 is especially in the range of 10-50 nm. The further ALD coating layer 140 may further stabilize the overall coating structure by filling pores and pin-holes in the main sol-gel coating layer 130. In addition, the further ALD coating layer 140 can suppress the surface reactivity of the main sol-gel layer 130. This surface reactivity may be in embodiments of LED manufacturing processes be advantageous for maintaining the rheology or other properties of certain silicone phosphor slurries.
Fig. 3 schematically depicts a lighting device 20 comprising a light source 10 configured to generate light source radiation 11, especially one or more of blue and UV, as well as a wavelength converter 30 comprising the luminescent material 1 with particles 100 as defined herein. The wavelength converter 30 may e.g. comprise a matrix, such as a silicone or organic polymer matrix as described above, with the coated particles 100 embedded therein. The wavelength converter 30 is configured to (wavelength) convert at least part of the light source radiation 11 into wavelength converter light 31. Optionally also light source radiation 11 may pass the wavelength converter 30 (without being converted).
The wavelength converter light 31 at least includes luminescence from the herein described coated particles 100. However, the wavelength converter 30 may optionally include also one or more other luminescent materials. The wavelength converter 30, or more especially the luminescent material 1, may be arranged at anon-zero distance d30, such as at a distance of 0.1-100 mm. However, optionally the distance d30 may be zero, such as e.g. when the luminescent material is embedded in a dome on a LED die. The distance d30 is the shortest distance between a light emitting surface of the light source 10, such as a LED die, and the wavelength converter 30, more especially the luminescent material 1.
The light source 10 may be an LED, such that lighting device 20 is a phosphor- converter LED (“pcLED”). For example, light source 10 may be a Ill-Nitride LED that emits ultraviolet, blue, green, or red light. LEDs formed from any other suitable material system and that emit any other suitable wavelength of light may also be used. Other suitable material systems may include, for example, Ill-Phosphide materials, Ill-Arsenide materials, and II-VI materials.
Fig. 4a shows a SEM image of luminescent material 1 comprising some coated luminescent particles 100. In Fig. 4b a TEM image of a coated luminescent particle 100 is
given, clearly showing or core 102 with an oxide-containing layer 101, a primary (SiC ) sol- gel coating layer 110, a main ALD coating layer 120, comprising a multilayer 1120 consisting of two AI2O3 layers 1121b, and two Ta20s layers 1121a, and a (S1O2) main sol-gel coating 130.
Figs 5a-5b show some experimental results. In the figures, coated luminescent particles 100 of the invention (here comprising SrLiAbN4:Eu) are compared to corresponding prior art luminescent particles. The prior art luminescent particles also comprise an ALD coating layer and a sol-gel coating layer. However, the sol-gel coating layer is configured directly at the surface of the luminescent core 102, and the ALD coating layer is configured onto the sol-gel coating.
In Fig 5a. the (normalized) light output (Y-axis) over time, especially hours (X-axis) of the respective luminescent particles in silicone is given. During the experiment, the particles were kept at 130°C and 100% relative humidity. The circular markers indicate the luminescent particle 100 of the invention; the square markers indicate the prior art luminescent particle.
In Fig 5b. the failure probability of white LEDs with the respective luminescent particles is given after maintaining the respective LEDs over 500 hours at 85°C and 85% relative humidity. The square markers indicate the luminescent particle 100 of the invention; the circular markers indicate the prior art luminescent particle. Note that the probability is given in percentages at the Y-axis in a logarithmical scale. The color point shift in Au'v' (sometimes also indicated as “(duV )”or “duv”) is given at the X-axis. The (LEDs comprising the) luminescent particles 100 of the invention clearly show less color shift (AuV is calculated as the Euclidian distance between a pair of chromaticity coordinates in the (u1, v') CIE 1976 color space).
Hence, this invention concerns methods to improve the barrier properties of phosphor particle coatings. While the invention is generally applicable to various phosphor particles, it is particularly suitable for nitride based narrow-band, red-emitting phosphors like nitride aluminates or oxo nitride aluminates due to their high sensitivity against moisture.
Figures 6A-6B show, respectively, cross-sectional and top views of an array 600 of pcLEDs 610, which pcLEDs 610 may be structured as lighting device 20, as shown in Fig. 3, that include a wavelength converter 30 comprising the coated luminescent particles 100 as defined herein included in phosphor pixels 606 with semiconductor diode 612 disposed on a substrate 602. Such an array may include any suitable number of pcLEDs arranged in any suitable manner. In the illustrated example the array is depicted as formed monolithically on
a shared substrate, but alternatively an array of pcLEDs may be formed from separate individual pcLEDs. Substrate 602 may optionally comprise CMOS circuitry for driving the LED and may be formed from any suitable materials.
Although Figures 6A-6B, show a three-by-three array of nine pcLEDs, such arrays may include for example tens, hundreds, or thousands of LEDs. Individual LEDs (pixels) may have widths (e.g., side lengths) in the plane of the array, for example, less than or equal to 1 millimeter (mm), less than or equal to 500 microns, less than or equal to 100 microns, or less than or equal to 50 microns. LEDs in such an array may be spaced apart from each other by streets or lanes having a width in the plane of the array of, for example, hundreds of microns, less than or equal to 100 microns, less than or equal to 50 microns, less than or equal to 10 microns, or less than or equal to 5 microns. Although the illustrated examples show rectangular pixels arranged in a symmetric matrix, the pixels and the array may have any suitable shape or arrangement.
LEDs having dimensions in the plane of the array (e.g., side lengths) of less than or equal to about 50 microns are typically referred to as microLEDs, and an array of such microLEDs may be referred to as a microLED array.
An array of LEDs, or portions of such an array, may be formed as a segmented monolithic structure in which individual LED pixels are electrically isolated from each other by trenches and/or insulating material, but the electrically isolated segments remain physically connected to each other by portions of the semiconductor structure.
The individual LEDs in an LED array may be individually addressable, may be addressable as part of a group or subset of the pixels in the array, or may not be addressable. Thus, light emitting pixel arrays are useful for any application requiring or benefiting from fine-grained intensity, spatial, and temporal control of light distribution. These applications may include, but are not limited to, precise special patterning of emitted light from pixel blocks or individual pixels. Depending on the application, emitted light may be spectrally distinct, adaptive over time, and/or environmentally responsive. Such light emitting pixel arrays may provide pre-programmed light distribution in various intensity, spatial, or temporal patterns. The emitted light may be based at least in part on received sensor data and may be used for optical wireless communications. Associated electronics and optics may be distinct at a pixel, pixel block, or device level.
As shown in Figures 7A-7B, a pcLED array 600 may be mounted on an electronics board 700 comprising a power and control module 702, a sensor module 704, and an LED attach region 706. Power and control module 702 may receive power and control signals
from external sources and signals from sensor module 704, based on which power and control module 702 controls operation of the LEDs. Sensor module 704 may receive signals from any suitable sensors, for example from temperature or light sensors. Alternatively, pcLED array 600 may be mounted on a separate board (not shown) from the power and control module and the sensor module.
Individual pcLEDs may optionally incorporate or be arranged in combination with a lens or other optical element located adjacent to or disposed on the phosphor layer. Such an optical element, not shown in the figures, may be referred to as a “primary optical element”. In addition, as shown in Figures 8A-8B a pcLED array 600 (for example, mounted on an electronics board 700) may be arranged in combination with secondary optical elements such as waveguides, lenses, or both for use in an intended application. In Figure 8A, light emitted by pcLEDs 610 is collected by waveguides 802 and directed to projection lens 804. Projection lens 804 may be a Fresnel lens, for example. This arrangement may be suitable for use, for example, in automobile headlights. In Figure 8B, light emitted by pcLEDs 610 is collected directly by projection lens 804 without use of intervening waveguides. This arrangement may be particularly suitable when pcLEDs can be spaced sufficiently close to each other and may also be used in automobile headlights as well as in camera flash applications. A microLED display application may use similar optical arrangements to those depicted in Figures 8A-8B, for example. Generally, any suitable arrangement of optical elements may be used in combination with the LED arrays described herein, depending on the desired application.
An array of independently operable LEDs may be used in combination with a lens, lens system, or other optical system (e.g., as described above) to provide illumination that is adaptable for a particular purpose. For example, in operation such an adaptive lighting system may provide illumination that varies by color and/or intensity across an illuminated scene or object and/or is aimed in a desired direction. A controller can be configured to receive data indicating locations and color characteristics of objects or persons in a scene and based on that information control LEDs in an LED array to provide illumination adapted to the scene. Such data can be provided for example by an image sensor, or optical (e.g. laser scanning) or non-optical (e.g. millimeter radar) sensors. Such adaptive illumination is increasingly important for automotive, mobile device camera, VR, and AR applications.
Fig. 9 schematically illustrates an example camera flash system 900 comprising an LED array and lens system 902, which may be similar or identical to the systems described above. Flash system 900 also comprises an LED driver 906 that is controlled by a controller
904, such as a microprocessor. Controller 904 may also be coupled to a camera 907 and to sensors 908, and operate in accordance with instructions and profiles stored in memory 910. Camera 907 and adaptive illumination system 902 may be controlled by controller 904 to match their fields of view.
Sensors 908 may include, for example, positional sensors (e.g., a gyroscope and/or accelerometer) and/or other sensors that may be used to determine the position, speed, and orientation of system 900. The signals from the sensors 908 may be supplied to the controller 904 to be used to determine the appropriate course of action of the controller 904 (e.g., which LEDs are currently illuminating a target and which LEDs will be illuminating the target a predetermined amount of time later).
In operation, illumination from some or all pixels of the LED array in 902 may be adjusted - deactivated, operated at full intensity, or operated at an intermediate intensity. Beam focus or steering of light emitted by the LED array in 902 can be performed electronically by activating one or more subsets of the pixels, to permit dynamic adjustment of the beam shape without moving optics or changing the focus of the lens in the lighting apparatus.
Fig. 10 schematically illustrates an example display (e.g., AR/VR/MR) system 1000 that includes an adaptive light emitting array 1010, display 1020, a light emitting array controller 1030, sensor system 1040, and system controller 1050. Control input is provided to the sensor system 1040, while power and user data input is provided to the system controller 1050. In some embodiments modules included in system 1000 can be compactly arranged in a single structure, or one or more elements can be separately mounted and connected via wireless or wired communication. For example, the light emitting array 1010, display 1020, and sensor system 1040 can be mounted on a headset or glasses, with the light emitting controller and/or system controller 1050 separately mounted.
The light emitting array 1010 may include one or more adaptive light emitting arrays, as described above, for example, that can be used to project light in graphical or object patterns that can support AR/VR/MR systems. In some embodiments, arrays of microLEDs can be used.
System 1000 can incorporate a wide range of optics in adaptive light emitting array 1010 and/or display 1020, for example to couple light emitted by adaptive light emitting array 1010 into display 1020.
Sensor system 1040 can include, for example, external sensors such as cameras, depth sensors, or audio sensors that monitor the environment, and internal sensors such as
accelerometers or two or three axis gyroscopes that monitor an AR/VR/MR headset position. Other sensors can include but are not limited to air pressure, stress sensors, temperature sensors, or any other suitable sensors needed for local or remote environmental monitoring.
In some embodiments, control input can include detected touch or taps, gestural input, or control based on headset or display position.
In response to data from sensor system 1040, system controller 1050 can send images or instructions to the light emitting array controller 1030. Changes or modification to the images or instructions can also be made by user data input, or automated data input as needed. User data input can include but is not limited to that provided by audio instructions, haptic feedback, eye or pupil positioning, or connected keyboard, mouse, or game controller.
In an embodiment, the invention provides a wet chemical washing (including drying) process of the powder phosphor (the luminescent core(s)) to form an oxide outer particle layer. Further a primary (SiC ) sol-gel layer may be deposited by a (primary) sol-gel process to provide the primary sol-gel layer with a thickness in the range of 0.5-5 nm. Next, a multilayer may be deposited by ALD with a total ALD coating layer thickness d2 in embodiments of 20-50 nm and a (sub)layer thickness d21 of the layers 1121 of the multilayer 1120 in the range of 1-20 nm. The multilayer 1120 is especially comprised of two or more metal oxides such as AI2O3, T1O2, ZrCh, Hf02, SnCh, ZnO, Ta205. Next, a third layer, especially a main sol-gel coating layer 130, e.g. of SiCh may be deposited by a (main) sol-gel process with a thickness in the range of 100-500 nm. In yet further embodiments, a fourth layer 140 may be deposited by a further ALD process. The further ALD coating layer 140 may in embodiments have a total thickness d4 of 5-50 nm and especially may comprise a multilayer with sub-layer thickness in the range of 1 -20 nm. The multilayer is in embodiments comprised of one or more metal oxides, such as AI2O3, TiCh, ZrCh, HfCh,
SnCh, ZnO, Ta2Ch
EXPERIMENTAL
The effect of the new coating architecture of the invention was tested by forming a luminescent particle with a hybrid coating as disclosed herein:
Polyol washing process:
10.3g of a raw phosphor powder sample of composition
Sro.995Li2Ali.995Sio.oo50i.995N2.oo5:Euo.oo5 was mixed 30.0g ethanol and 30. Og triethylene glycol with the suspension showing a total water content in the 0.05-0.1% range in an ultrasonic
bath followed by a 16hr treatment at 80°C in a closed pressure vessel. After cooling down to room temperature, the phosphor powder was washed with ethanol and dried at 100°C under ambient atmosphere.
Mixed solvent acetic acid washing process:
200-250g of SrLiAbN4:Euo.oo7 were stirred in 837g isopropanol. 560g of 18.5wt% acetic acid were slowly added under stirring. The suspension was further stirred until a total time of 40 min (including acid addition) passed. After 30 min sedimentation the supernatant was largely removed by decantation followed by filtration and rinsing with acetic acid/isopropanol mixture and isopropanol. The washed phosphor is finally dried at 50°C in vacuum overnight.
Thin amorphous silica layer (<5nm)
In this experiment a primary sol-gel coating layer was provided. 200 g phosphor powder (typically after washing) were stirred in 960 g ethanol. To this suspension 3.5 g tetraethyl orthosilicate were added and stirred for 10 min under sonication. 90g 25wt% aqueous ammonia solution were added and stirring under sonication is continued for another 20 min. Fine particles including nanosized silica particles formed as by-product were removed by threefold sedimentation in ethanol and decantation. The coated powder was dried at 50°C in vacuum overnight. After dry-sieving (mesh size lOOpm) the coating was cured by heating the powder to 300°C for 10 hr. under vacuum.
ALD nanolaminate (~25nm)
Next, a main ALD coating layer comprising an ALD nanolaminate was applied on primer layer comprising phosphor particles (comprising SrLiAbN4:Eu) in a Picosun Oy ALD R200 reactor. Precursor materials were trimethylaluminum and FLO to form an AI2O3 film and (tert-Butylimido)tris(ethylmethylamino) tantalum (V) and H2O to form a Ta2Cri film. The deposition temperature was set to 250° C. The purge time of nitrogen gas in between precursor pulses was 60 seconds. The nanolaminate consists of 2x Al203/Ta205 sublayers with a total thickness of around 25nm.
Thick amorphous silica layer (~170nm)
In this experiment a main sol-gel coating layer was provided on the luminescent particle. 85 g powder (typically after ALD coating) were stirred in 672 g ethanol for 15 min under sonication. To this suspension 1) 116 g 25wt% aqueous ammonia solution
were added fast (<30s) and 2) a solution of 68 g tetraethyl orthosilicate in 408 g ethanol is added drop-wise (~45min). After the addition of alkoxide precursor was finished, the suspension was stirred for another 30 min without sonication.
Fine particles including sub-micron sized silica particles formed as by-product were removed by threefold sedimentation in ethanol and decantation. The coated powder was dried at 50°C in vacuum overnight. After dry-sieving (mesh size 63pm) the coating was cured by heating the powder to 300°C for 10 hr. under vacuum.
A SEM image of some of the particles is given in Fig. 4a. A TEM image of the particles is given in Fig. 4b.
Comparison test
The prepared particles in silicone were subjected to a stress test and compared with a control particles i.e. particles comprising a prior art coating architecture. In the prior art coating architecture the luminescent particle is initially coated with a relatively thick sol- gel coating and successively with a thin ALD coating. In the stress test, the light output was measured over time while keeping the particles at a temperature of 130°C and 100% relative humidity.
The prepared particles were further applied in a white LED and stressed over 500 hours at 85°C and 85% relative humidity. The failure probability of the white LEDs with the luminescent particles according to the invention was compared to the failure probability of white LEDs comprising the prior art coating architecture subjected to the same stress test (the control LED).
The results are depicted in Figs 5a-5b showing a significantly improved reduction in light output after 60 hours stress test, i.e. less than 5% compared to a reduction of more than 50% for the control particles. Also the color shift (AuV) is substantially minimized compared to the control LED.
The term “plurality” refers to two or more.
The terms “substantially” or “essentially” herein, and similar terms, will be understood by the person skilled in the art. The terms “substantially” or “essentially” may also include embodiments with “entirely”, “completely”, “all”, etc. Hence, in embodiments the adjective substantially or essentially may also be removed. Where applicable, the term “substantially” or the term “essentially” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%.
The term “comprise” also includes embodiments wherein the term “comprises” means “consists of’.
The term “and/or” especially relates to one or more of the items mentioned before and after “and/or”. For instance, a phrase “item 1 and/or item 2” and similar phrases may relate to one or more of item 1 and item 2. The term "comprising" may in an embodiment refer to "consisting of but may in another embodiment also refer to "containing at least the defined species and optionally one or more other species".
Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.
The devices, apparatus, or systems may herein amongst others be described during operation. As will be clear to the person skilled in the art, the invention is not limited to methods of operation, or devices, apparatus, or systems in operation.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.
In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
Use of the verb "to comprise" and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise”, “comprising”, and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to”.
The article "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.
The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim, or an apparatus claim, or a system claim, enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
The invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process. Yet further, the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.
The invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and/or shown in the attached drawings. The invention further pertains to a method or process comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.
The various aspects discussed in this patent can be combined in order to provide additional advantages. Further, the person skilled in the art will understand that embodiments can be combined, and that also more than two embodiments can be combined. Furthermore, some of the features can form the basis for one or more divisional applications.
Claims
1. A method for providing a luminescent particle with a hybrid coating, the method comprising:
(i) providing a particulate luminescent material having a surface;
(ii) forming a primer layer directly on at least a portion of the surface;
(iii) performing a first atomic layer deposition process on the particulate luminescent material having the primer layer to deposit a first ALD layer, the first atomic layer deposition process using a metal oxide first precursor selected from a group of metal oxides comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V;
(iv) performing a second atomic layer deposition process to deposit a second ALD layer onto the first ALD layer, the second atomic layer deposition process using a metal oxide second precursor different from the first precursor and selected from a group of metal oxides comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; and
(iv) performing a main sol-gel coating process to form a main sol-gel coating layer directly onto the second ALD layer, the main sol-gel coating layer having a chemical composition different from the first ALD layer and the second ALD layer.
2. The method according to claim 1, wherein forming the primer layer directly onto at least a portion of the surface of the particulate luminescent material comprises performing a primer sol-gel coating process on the particulate luminescent material, the primer sol-gel coating process using a metal alkoxide precursor.
3. The method according to claim 2, wherein the primer sol-gel coating process comprises: suspending the particulate luminescent material in an alcohol-aqueous ammonia solution mixture; adding the metal alkoxide precursor to the mixture; stirring the mixture containing the metal alkoxide until the primer layer is formed; washing the particulate luminescent material having the primer layer with alcohol; and drying the particulate luminescent material having the primer layer.
4. The method according to claim 2, wherein the metal alkoxide precursor is a silicon alkoxide.
5. The method according to claim 1, further comprising washing the particulate luminescent material in a washing solvent before forming the primer layer, the washing solvent having a pH < 7.
6. The method according to claim 5, wherein the washing solvent includes an organic acid.
7. The method according to claim 5, wherein the washing solvent includes an aliphatic alcohol.
8. The method according to claim 5, wherein the washing solvent comprises a weak acid and equal to or less than 50 % wt/wt water, and washing the particulate luminescent material further comprises: successively subjecting the particulate luminescent material to a drying treatment.
9. The method according to claim 1, wherein the primer layer has a primer layer thickness in the range of 0.1-5 nm, and wherein the primer layer comprises a primary sol- gel layer provided by application of a primary sol-gel coating process.
10. The method according to claim 1, wherein:
(i) the primer layer has a primer layer thickness (dl) in the range of 0.1-5 nm,
(ii) the first ALD layer and second ALD layer form a main ALD coating layer, and the main ALD coating layer has a main ALD coating layer thickness (d2) in the range of 5-250 nm; and
(iii) the main sol-gel coating layer has a main sol-gel coating layer thickness (d3) in the range of 50-700 nm.
11. The method according to claim 1, wherein the metal oxide first precursor is
Al, and the metal oxide second precursor is selected from metal oxides comprising Al, Hf, Ta, Zr, and Ti.
12. The method according to claim 1, wherein the main sol-gel coating process comprises: providing a mixture of an alcohol, ammonia, water, the particulate luminescent material having the primer layer and the first ALD layer and the second ALD layer, and a metal alkoxide precursor while agitating the mixture, and allowing a main sol-gel coating layer to be formed directly onto the second ALD layer, the metal alkoxide precursor is titanium alkoxide, silicon alkoxide, and or aluminum alkoxide; and retrieving the particulate luminescent material having the primer layer, the first ALD layer and the second ALD layer and the main sol-gel coating layer from the mixture and subjecting the retrieved particulate luminescent material having the primer layer, the first ALD layer and the second ALD layer and the main sol-gel coating layer to a heat treatment.
13. The method according to claim 1, wherein in the main sol-gel coating process a silicon alkoxide precursor is used and the silicon alkoxide precursor is selected from a group consisting of
the first and second atomic layer deposition processes the metal oxide first precursor and metal oxide second precursor selected from a group consisting of A1(CH3)3, HA1(CH3)2, Hf(N(CH3)2)4, Hf(N(CH2CH3)2)4,
Hf[N(CH3)(CH2CH3)]4, TaCls, Ta(N(CH3)2)5, Ta{[N(CH3)(CH2CH3)]3N(C(CH3)3)}, ZrCL,
Zr(N(CH3)2)4, TiCL, Ti(OCH3)4, Ti(OCH2CH3)4, and an oxygen source selected from a group consisting of H20 and 03 are applied.
14. The method according to claim 1, comprising:
successively providing n additional ALD layers, wherein 2<n<10, between the first ALD layer and the second ALD layer, each additional ALD layer has an additional ALD layer coating layer thickness (d21) in the range of 1-20 nm, one or more additional ALD layers comprise one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta205, one or more additional ALD layers comprise AhCh, and the second ALD consist of one or more metal oxides selected from the group of HfCh, ZrCh, Ti02,Ta205.
15. The method according to claim 1, further comprising: providing a further ALD coating layer onto the main sol-gel coating by application of a further atomic layer deposition process, in the further atomic layer deposition process a further metal oxide precursor is selected from a group of metal oxides comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V, the further ALD coating layer has a further ALD coating layer thickness (d4) in the range of 10-50 nm, and the further ALD coating layer has a chemical composition differing from the chemical composition of the main sol- gel coating layer .
16. The method according to claim 15, wherein the further ALD coating layer comprises two or more layers having different chemical compositions, one or more of the layers comprise metal oxides selected from a group of AI2O3, TiCh, ZrCh, HfCh, SnCh, ZnO and Ta2Cb, and the two or more layers have a chemical composition differing from the chemical composition of the main sol-gel coating layer.
17. The method according to claim 1, wherein the surface of the particulate luminescent material comprises an alkaline earth element, aluminum, and oxide.
18. The method according to claim 17, wherein the alkaline earth element comprises strontium.
19. The method according to claim 1, wherein the particulate luminescent material is selected from a group consisting of (Ml)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4, and Ml comprising one or more from the group consisting of Ca, Sr, and Ba, and a+b+d=4 and 2a+3b+d=10; and
(M2)Li2Al2-zSizCh-zN2+z:Eu, wherein 0<z<0.1, and M2 comprising one or more of the group consisting of Sr and Ba.
20. The method according to claim 1, wherein the particulate luminescent material is selected from a group consisting of (i) the SrLiAbN4:Eu2+ class, and (ii) the
SrLi2Ah.995Sio.oo50i.995N2.oo5:Eu2+ class.
21. The method according to claim 1 , wherein the particulate luminescent material has a number averaged particle size in the range of 01. - 50 pm.
22. A luminescent material comprising luminescent particles obtained by the method according to claim 1.
23. A luminescent material comprising: a particulate luminescent material having a surface; a primer layer disposed on and in contact with the surface of the particulate luminescent material, the primer layer comprising a primer layer metal oxide and having a thickness in the range of 0.1-5 nm; a first ALD layer disposed on and in contact with the primer layer and any portion of the surface of the particulate luminescent material not covered with the primer layer, the first ALD layer comprising a first oxide of one or more of Al, Zn, Hf, Ta, Zr, Ti,
Sn, Nb, Y, Ga, and V, and different from the primer layer metal oxide; a second ALD layer disposed on and in contact with the first ALD layer, the second ALD layer comprising a second oxide of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V, and different from the first oxide, the first ALD layer and second ALD layer forming a main ALD layer having a thickness in the range of 5-250 nm; and a main sol-gel coating layer disposed on the second ALD layer, wherein the main sol -gel coating has a main sol -gel coating layer thickness (d3) in the range of 50-700 nm, wherein the main sol-gel coating layer has a chemical composition differing from the first ALD layer and the second ALD layer.
24. The luminescent material according to claim 23, wherein at least a portion of the surface of the particulate luminescent material comprises an oxide.
25. The luminescent material according to claim 24, wherein at least a portion of the surface of the particulate luminescent material comprises an alkaline earth element and aluminum.
26. The luminescent material according to claim 25, wherein the alkaline earth element comprises strontium.
27. The luminescent material according to claim 23, wherein the particulate luminescent material is selected from a group consisting of (Ml)LidMgaAlbN4:Eu, with 0<a<4; 0<b<4; 0<d<4, and Ml comprising one or more from the group consisting of Ca, Sr, and Ba, and a+b+d=4 and 2a+3b+d=10; and
(M2)Li2Ah-zSiz02-zN2+z:Eu, wherein 0<z<0.1, and M2 comprising one or more of the group consisting of Sr and Ba.
28. The luminescent material according to claim 23, wherein the particulate luminescent material is selected from a group consisting of (i) the SrLiALNvEu21 class, and (ii) the SrLi2Ali.995Sio.oo50i.995N2.oo5:Eu2+ class.
29. The luminescent material according to claim 23, further comprising a further ALD coating layer arranged onto the main sol-gel coating layer, the further ALD coating layer having a further ALD coating layer thickness (d4) in the range of 10-50 nm, the further ALD coating layer having a chemical composition differing from the chemical composition of the main sol-gel coating layer, and the further ALD coating layer comprising one or more oxides of one or more of Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V.
30. The luminescent material (1) according to claim 29, wherein the further ALD coating layer comprises a further multilayer with two or more layers having different chemical compositions, one or more of the layers comprising metal oxides selected from a group of AI2O3, T1O2, ZrCh, HfCh, SnCh, ZnO and Ta205, and the two or more layers having a chemical composition differing from the chemical composition of the main sol-gel coating layer.
31. The luminescent material according to claim 23, wherein the first ALD layer comprises AI2O3 and the second ALD layer comprises one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta205.
32. The luminescent material according to claim 23, further comprising n additional ALD layers, wherein 2<n<10, between the first ALD layer and the second ALD layer, each additional ALD layer having an additional ALD layer coating layer thickness (d21) in the range of 1-20 nm, and one or more of the additional ALD layers comprise one or more metal oxides selected from a group of HfCh, ZrCh, TiCh, Ta205.
33. The luminescent material according to claim 23, wherein the primer layer metal oxide comprises SiCh.
34. A lighting device comprising a light source configured to generate light source radiation and a wavelength converter comprising the luminescent material according to claim 23, the wavelength converter being configured to convert at least part of the light source radiation into wavelength converter light.
35. The lighting device according to claim 34, wherein the particulate luminescent material comprises an alkaline earth aluminate and the wavelength converter comprises a silicone resin.
36. A display system comprising: a light emitting diode array, the light emitting diode array including a plurality of phosphor converted light emitting diodes, each phosphor converted light emitting diode including a wavelength converter comprising the luminescent material of claim 23; a display; and a lens or lens system spaced apart from the light emitting diode array and arranged to couple light from the light emitting diode array into the display.
37. A mobile device comprising; a camera; and a flash illumination system comprising:
a light emitting diode array including a plurality of light emitting diodes, each light emitting diode including a wavelength converter comprising the luminescent material of claim 23.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/915,422 US11912914B2 (en) | 2020-06-29 | 2020-06-29 | Phosphor particle coating |
EP20189538.0A EP3950879A1 (en) | 2020-08-05 | 2020-08-05 | Phosphor particle coating |
PCT/US2021/039514 WO2022006048A1 (en) | 2020-06-29 | 2021-06-29 | Phosphor particle coating |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4172290A1 true EP4172290A1 (en) | 2023-05-03 |
Family
ID=76943174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21742657.6A Pending EP4172290A1 (en) | 2020-06-29 | 2021-06-29 | Phosphor particle coating |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP4172290A1 (en) |
JP (1) | JP2023534142A (en) |
KR (1) | KR20230027288A (en) |
CN (1) | CN115698225A (en) |
WO (1) | WO2022006048A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102599819B1 (en) * | 2022-01-20 | 2023-11-08 | 미쯔비시 케미컬 주식회사 | Phosphor, light-emitting device, illumination device, image display device, and indicator lamp for vehicle |
KR20240133405A (en) | 2023-02-28 | 2024-09-04 | 엘지디스플레이 주식회사 | Display device and display panel |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6322901B1 (en) | 1997-11-13 | 2001-11-27 | Massachusetts Institute Of Technology | Highly luminescent color-selective nano-crystalline materials |
US7341676B2 (en) * | 2004-03-10 | 2008-03-11 | Konica Minolta Holdings, Inc. | Manufacturing method of silicate-containing phosphor and silicate-containing phosphor precursor |
WO2006095285A1 (en) * | 2005-03-09 | 2006-09-14 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a fluorescent material |
US9006966B2 (en) * | 2011-11-08 | 2015-04-14 | Intematix Corporation | Coatings for photoluminescent materials |
US20150125599A1 (en) | 2012-05-14 | 2015-05-07 | Picocun Oy | Powder particle coating using atomic layer deposition cartridge |
CN105073946A (en) * | 2013-02-25 | 2015-11-18 | 皇家飞利浦有限公司 | A coated luminescent particle, a luminescent converter element, a light source, a luminaire and a method of manufacturing a coated luminescent particle |
JP2016518468A (en) * | 2013-03-14 | 2016-06-23 | ナノコ テクノロジーズ リミテッド | Multilayer coated quantum dot beads |
WO2015062697A1 (en) * | 2013-11-01 | 2015-05-07 | Merck Patent Gmbh | Silicate phosphors |
EP3778829A1 (en) * | 2014-09-17 | 2021-02-17 | Lumileds LLC | Phosphor with hybrid coating and method of production |
US20170306221A1 (en) * | 2014-09-23 | 2017-10-26 | Philips Lighting Holding B.V. | Encapsulated materials in porous particles |
WO2017036997A1 (en) * | 2015-09-03 | 2017-03-09 | Basf Se | Process for formulating quantum dots |
US10886437B2 (en) * | 2016-11-03 | 2021-01-05 | Lumileds Llc | Devices and structures bonded by inorganic coating |
-
2021
- 2021-06-29 WO PCT/US2021/039514 patent/WO2022006048A1/en unknown
- 2021-06-29 KR KR1020237002853A patent/KR20230027288A/en unknown
- 2021-06-29 EP EP21742657.6A patent/EP4172290A1/en active Pending
- 2021-06-29 JP JP2022579733A patent/JP2023534142A/en active Pending
- 2021-06-29 CN CN202180046384.9A patent/CN115698225A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022006048A1 (en) | 2022-01-06 |
JP2023534142A (en) | 2023-08-08 |
KR20230027288A (en) | 2023-02-27 |
CN115698225A (en) | 2023-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11984540B2 (en) | Inorganic bonded devices and structures | |
US11142683B2 (en) | Phosphor with hybrid coating and method of production | |
CN103059393B (en) | Semiconductor nanocrystal-polymer composite, method of preparing the same, and composite film and optoelectronic device including the same | |
KR20190085884A (en) | Quantum dot, production method thereof, and electronic device including the same | |
TWI763742B (en) | Process for coating phosphors, population of particles and lighting apparatus comprising coated red line emitting phosphors | |
JP2009272612A (en) | Light-emitting element and its production method | |
EP4172290A1 (en) | Phosphor particle coating | |
WO2017166106A1 (en) | Composite comprising semiconductor nanocrystals and preparing method therefor | |
EP3950879A1 (en) | Phosphor particle coating | |
JP2019519100A (en) | Manganese-doped phosphor materials for high power density applications | |
US11912918B2 (en) | Phosphor particle coating | |
US11912914B2 (en) | Phosphor particle coating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: UNKNOWN |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20221228 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230530 |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) |