EP4146607A1 - Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice - Google Patents

Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice

Info

Publication number
EP4146607A1
EP4146607A1 EP20934816.8A EP20934816A EP4146607A1 EP 4146607 A1 EP4146607 A1 EP 4146607A1 EP 20934816 A EP20934816 A EP 20934816A EP 4146607 A1 EP4146607 A1 EP 4146607A1
Authority
EP
European Patent Office
Prior art keywords
glass
electrically
thermally conductive
glass matrix
conductive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20934816.8A
Other languages
German (de)
English (en)
Inventor
Shou PENG
Xinjian Yin
Daniele MENOSSI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Triumph International Engineering Co Ltd
CTF Solar GmbH
Original Assignee
China Triumph International Engineering Co Ltd
CTF Solar GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Triumph International Engineering Co Ltd, CTF Solar GmbH filed Critical China Triumph International Engineering Co Ltd
Publication of EP4146607A1 publication Critical patent/EP4146607A1/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Definitions

  • the present invention describes a method for manufacture a glass with at least one electrically and/or thermally conductive feed through connection and a glass with at least one electrically and/or thermally conductive feed through connection.
  • Glasses are used as back glasses for solar cells or flat panel displays to hermetically seal and protect electronic components and/or layers. Electrically conductive feed through connections within the back glasses are typically achieved by openings within the back glass, which are used to feed through the electrical connection and are for example mechanically manufactured by drilling or by laser cutting.
  • glass substrates with conductive layers are well known. These coated glass substrates show only electrical conductivity within the glass substrate plane but not perpendicular to the glass substrate plane and are therefore not suitable for electrically conductive feed through connections.
  • DE 1 928 005 C discloses a method for manufacture a float glass with wire reinforcement.
  • a molten glass mixture is cast on a liquid bath of tin to form a glass layer.
  • a wire reinforcement is inserted into the glass layer without contact between the device of inserting and the surface of the glass layer.
  • the wire reinforced float glass is used as safety glass and does not provide any electrical conductivity perpendicular to the glass plane.
  • the glassware comprises a surface, particles of a first type and particles of a second type.
  • the particles have optically functional properties, like non-scattering high-index particles, scattering particles, radiation-absorbing particles and/or wavelength-converting particles, for example the particles can be or include for example TiO 2 , ZnO, ITO, AZO, Al 2 O 3 , IZO.
  • the glassware is manufactured such, that the particles of a first type are distributed in a molten glass matrix through the first surface so that the particles are completely surrounded by the molten glass matrix.
  • the glassware can be formed and arranged as an extraction structure and/or coupling-in structure with regard to the electromagnetic radiation and act as carrier and/or cover of an optoelectronic component, like a light emitting diode.
  • An electrically conductive feed through connection is not provided by the particles within the glassware.
  • the method for manufacturing a glass with at least one electrically and/or thermally conductive feed through connection comprises the following steps:
  • step b) the at least one molten area of the glass matrix has a dynamic viscosity of 10 5 to 10 12 Pa ⁇ s and a temperature of 400 to 800°C.
  • An electrically and/or thermally conductive feed through connection means a hermetically sealed path within a glass formed by the electrically and/or thermally conductive element, which transports current and/or heat from a first surface to a second surface of the glass.
  • the first and the second surface of the glass mean planes, which may be flat or curved and which are perpendicular to the thickness of the glass. For example, if the glass is a flat glass in form of a glass sheet, the first and the second surface of the glass are parallel flat planes perpendicular to the thickness and spaced from one another by the thickness of the glass sheet.
  • such an electrically and/or thermally conductive feed through connection in a glass provides the possibility of an electrically and/or thermally hermetically sealed conductive connection or path throughout the glass in devices like solar modules, flat panel displays without the manufacture of openings within the glass.
  • a hermetically sealed path within the glass means that the at least one electrically and/or thermally conductive feed through connection formed by the electrically and/or thermally conductive element is sealed against gaseous, liquid and/or solid extrinsic agents, which do not pass through the surrounding glass matrix.
  • the at least one electrically and/or thermally conductive feed through connection is vacuum proof.
  • the glass matrix is a nonconductive, non-metallic inorganic glass matrix.
  • a nonconductive, non-metallic inorganic glass matrix can be for example a non-oxide-based glass matrix, for example a halide glass or chalcogenide glass, or an oxide-based glass matrix.
  • An oxide-based glass matrix can be for example a phosphate glass, a silicate glass or a borate glass, for example an alkali metal borate glass.
  • a silicate glass can be for example an aluminosilicate glass, a lead silicate glass, an alkali metal silicate glass, an alkali metal-alkaline earth metal silicate glass or a borosilicate glass; for example a soda-lime silicate glass.
  • the glass matrix is an oxide-based glass matrix, preferably a soda lime glass matrix.
  • the at least one molten area of the glass matrix comprises an electrical conductivity of 10 1 to 10 7 S ⁇ m -1 in the range of 200°C to 700 °C.
  • the glass matrix is obtained by mixing and melting raw materials.
  • the mixing and melting can be carried out as a batch or a continuous process, meaning that a defined amount of raw material is mixed and melted to form a glass melt or the raw materials are continuously mixed and melted to continuously provide a glass melt.
  • the melting temperature of the raw materials depends on the type of glass and type of raw materials and is known by an expert, usually more than 1200°C.
  • the glass melt is usually refined, to remove gas bubbles, which are usually contained within a glass melt and constitute glass defects in the glass matrix.
  • refining methods e.g. based on chemical reactions with refining agents, high temperature and stirring treatment, ultrasonic treatment or direct blowing of gas into the glass melt. After refining, the glass melt may be formed and/or shaped and subsequently cooled to form a glass matrix.
  • Forming and/or shaping of a refined glass melt is done by known methods, like casting, rolling, drawing, bending, wherein forming and/or shaping of the glass melt may be performed before or during cooling of the glass melt.
  • the glass matrix manufactured in this way comprises for example a flat glass matrix or a bended glass matrix.
  • the glass matrix After forming and/or shaping, the glass matrix is cooled to room temperature.
  • a glass matrix with at least one molten area may be a flat, bended or laminated glass, obtained by mixing and melting, refining, forming and/or shaping, cooling and locally heating at least one area of the glass matrix.
  • the glass matrix with at least one molten area provided in step a) is selected out of a flat glass matrix, a bended glass matrix, a flat laminated glass matrix or combinations thereof, each with at least one molten area.
  • the glass matrix with at least one molten area in step a) is provided by locally heating at least one area of the glass matrix.
  • step b) at least one electrically and/or thermally conductive element is inserted in the at least one molten area of the glass matrix, wherein the at least one molten area of the glass matrix has a dynamic viscosity of 10 5 to 10 12 Pa ⁇ s and a temperature of 400 to 800°C.
  • the dynamic viscosity of the at least one molten area of the glass matrix allows inserting of at least one electrically and/or thermally conductive element at a defined position into the glass matrix without risk of flowing of the at least on electrically and/or thermally conductive element into the molten glass matrix.
  • the inserted at least one electrically and/or thermally conductive element forms at least one electrically and/or thermally conductive feed through connection. Therefore, the at least one electrically and/or thermally conductive element is inserted into the at least one molten area of the glass matrix such that a first and a second surface of the conductive element are integrated in the first and the second surface of the glass matrix. In the result, the first and the second surface of the conductive element are a part of the first respectively the second surface of the glass matrix.
  • the first and the second surface of the conductive element mean planes, which may be flat or curved and which are perpendicular to the thickness of the conductive element and in case of flat planes spaced apart from each other by the thickness of the conductive element.
  • the conductive element comprises a thickness higher than the thickness of the glass matrix.
  • the conductive element after inserting the conductive element in the at least one molten area of the glass matrix, the conductive element extends over the surface of the glass matrix on at least one surface of the glass matrix, meaning that the conductive element penetrates at least one surface of the glass matrix.
  • the electrically and/or thermally conductive element is inserted in step b) such, that one of the surfaces of the electrically and/or thermally conductive element is integrated in one surface of the glass matrix while the other surface of the conductive element extends out of the other surface of the glass matrix.
  • step c) the glass matrix with the inserted at least one electrically and/or thermally conductive element is further processed to form a glass with at least one electrically and/or thermally conductive feed through connection. Further processing means, that the glass matrix with the inserted at least one electrically and/or thermally conductive element is at least cooled to room temperature.
  • step c) further processing in step c) includes thermal treatment of the glass matrix.
  • the thermal treatment may be performed before, during or after cooling the glass matrix in step c) .
  • Advantageously mechanical stresses between the inserted conductive element and the glass matrix will be reduced.
  • the thermal treatment is performed locally in an area around the inserted at least one electrically and/or thermally conductive element.
  • step c) includes a laminating and/or bending process to form a laminated and/or a bended glass with at least one electrically and/or thermally conductive feed through connection.
  • the laminating and/or bending process may be performed after cooling the glass matrix in step c) .
  • the laminating foil used for laminating comprises at least one aperture or at least one conductive area at the position of the at least one conductive element.
  • this avoids non-conductive laminating foil at an interface of inserted electrically and/or thermally conductive elements inbetween the at least two laminated glasses.
  • a solid or fluid electrically and/or thermally conductive medium is added inside the at least one aperture of the laminating foil. During the lamination process, the electrically and/thermally conductive medium will fill the at least one aperture to provide a conductive connection at an interface of inserted electrically and/or thermally conductive elements.
  • a glass comprising at least one electrically and/or thermally conductive element, which extends from a first surface to a second surface of the glass matrix
  • a glass comprising at least one electrically and/or thermally conductive element, which extends from a first surface to out of a second surface of the glass matrix
  • the inserted conductive elements get in contact with each other to form a conductive feed through connection within the laminated glass.
  • the inserted conductive elements, getting in contact during laminating may be additionally welded together by means of, but not limited to, ultrasound technique, laser welding, high-current welding.
  • step c) may also include depositing of layers onto the glass with at least one electrically and/or thermally conductive feed through connection or depositing of at least one contact material onto the at least one surface of the at least one inserted electrically and/or thermally conductive element.
  • the contact material increases the contact area and can be used as contact point for further external electrical connectors.
  • a completely molten glass matrix is provided.
  • the completely molten glass matrix has a dynamic viscosity of 10 5 to 10 12 Pa ⁇ s and a temperature of 400 to 800°C.
  • a completely molten glass matrix may be obtained by mixing and melting and refining before forming and/or shaping the glass melt, e.g. by manufacturing of a flat glass.
  • the dynamic viscosity of the molten glass matrix or the at least one molten area of the glass matrix depends on the temperature of the molten glass matrix or molten area of the glass matrix. In general, dynamic viscosity decreases with increasing temperature.
  • the dynamic viscosity of the molten glass matrix or molten area of the glass matrix is determined by means of several techniques, such as but not limited to parallel plate viscosimetry, ball penetration viscosimetry, rotating concentric cylinder viscosimetry and fiber elongation viscosimetry, preferably by rotating concentric cylinder viscosimetry.
  • dynamic viscosity of a completely molten glass matrix or a molten area of the glass matrix suitable for inserting the at least one electrically and/or thermally conductive element depends on the type of glass matrix and the molten raw materials.
  • the completely molten glass matrix in step a) is provided with a temperature less than the melting point of the raw substances and above the shaping temperature of the glass melt.
  • the shaping temperature is known to be dependent on the type of glass and the type of raw material.
  • a completely molten glass matrix of a SiO 2 -NaCO 3 type is provided in step a) . Inserting of at least one electrically and/or thermally conductive element into the completely molten SiO 2 -NaCO 3 glass matrix in step b) takes places at a temperature of 700°C to 800°C and a dynamic viscosity of 10 5 to 10 7 Pa ⁇ s of the completely molten glass SiO 2 -NaCO 3 matrix.
  • the at least one electrically and/or thermally conductive element in step b) is inserted by a positioning device.
  • the positioning device comprises a feeding device for the at least one electrically and/or thermally conductive element and a punching device.
  • the feeding device and the punching device are arranged opposite to each other, for example the feeding device close to the first surface and the punching device close to the second surface of the glass matrix. “Close to the first or second surface” means thereby that the feeding or punching devices are arranged under an angle of 90° to the first or second surface of the glass matrix.
  • the feeding device allows a linear movement of the conductive element in a direction perpendicular to a surface of the glass matrix to insert the conductive element into the at least one molten area of the glass matrix.
  • the punching device comprises an aperture with sharp edges, wherein the aperture having the same dimensions as the electrically and/or thermally conductive element to be inserted in the at least one molten area of the glass matrix.
  • the punching device may be exchangeable to adjust the punching device to any dimensions of the conductive element.
  • the punching device allows no linear movement in a direction perpendicular to a surface of the glass matrix.
  • the feeding device is moved towards the glass matrix, to insert the conductive element into the at least one molten area of the glass matrix.
  • the inserted conductive element thereby removes the molten area of the glass matrix or a region of the completely molten glass matrix, which is pushed inside the aperture of the punching device.
  • the punching device may also comprise at least one cutting blade on a side of the punching device facing to one of the surfaces of the glass matrix for removing any thin layers of the glass matrix still present on a surface of the conductive element and for opening and closing the aperture of the punching device.
  • thin layers of the glass matrix still present on a surface of the conductive element after inserting the conductive element may be removed by an additional treatment, e.g. by polishing and/or laser ablation. This additional treatment may be performed before, during or after cooling of the glass matrix in step c) .
  • the positioning device comprises a feeding device and at least two manipulator devices.
  • the feeding device and the manipulator devices may be arranged close to the same surface of a completely molten glass matrix.
  • the manipulator devices are suitable to temporarily open an aperture at a defined position within the completely molten glass matrix for inserting the at least one electrically and/or thermally conductive element.
  • the at least one electrically and/or thermally conductive element inserted in step b) comprises at least one of a wire, a ribbon, a rod and a preformed powder element.
  • wires, ribbons and rods are commercially available in a variety of dimensions and materials and easily inserted in the molten glass matrix.
  • a pre-formed powder element means a pressed and/or sintered element made of at least one powder material.
  • a pressed and/or sintered powder element provides a good electrical and/or thermal conductivity.
  • the at least one electrically and/or thermally conductive element is made of a material with a melting point higher than 550°C.
  • the melting point of the material of the at least one electrically and/or thermally conductive element is higher than the softening point of the glass, so that no melting of the at least one electrically and/or thermally conductive element occurs during manufacture of the glass with at least one electrically and/or thermally conductive element.
  • the at least one electrically and/or thermally conductive element is made of a material with a melting point less than 2000°C.
  • the at least one electrically and/or thermally conductive element is made of a material comprising at least one of a metal, a metal alloy, a metal compound and a conductive semiconductor.
  • Metals, metal alloys and metal compounds are for example, transition metals like, but not limited to Cu, Mo, Cr, Ag, basic metals like, but not limited to Al, or alloys of the foregoing and compounds constituted of foregoing.
  • Conductive semiconductors are doped semiconductors, for example, elemental semiconductors, like Si, Ge, C-based semiconductors, or compound semiconductors, like GaAs, In 2 O 3 -, SnO 2 , ZnO.
  • the electrically and/or thermally conductive element provides a good electrical and/or thermal conductivity.
  • the at least one electrically and/or thermally conductive element comprises an electrical conductivity of > 10 3 S ⁇ m -1 .
  • the at least one electrically and/or thermally conductive element comprises a thermal conductivity of > 50 W ⁇ m -1 ⁇ K -1 .
  • the present invention also provides a glass with at least one electrically and/or thermally conductive feed through connection, comprising at least one electrically and/or thermally nonconductive glass matrix and at least one electrically and/or thermally conductive element.
  • the at least one electrically and/or thermally conductive element is arranged within the at least one electrically and/or thermally nonconductive glass matrix such that it extends from a first surface of the at least one electrically and/or thermally nonconductive glass matrix to a second surface of the at least one electrically and/or thermally nonconductive glass matrix and forms an electrically and/or thermally conductive feed through connection.
  • An electrically and/or thermally nonconductive glass matrix may be any type of nonconductive, inorganic non-metallic glass matrix, like e.g. quartz glass, soda-lime-glass, solar glass or display glass.
  • An inorganic non-metallic glass matrix can be for example a non-oxide-based glass, for example a halide glass or chalcogenide glass, or an oxide-based glass.
  • An oxide-based glass can be for example a phosphate glass, a silicate glass or a borate glass, for example an alkali metal borate glass.
  • a silicate glass can be for example an aluminosilicate glass, a lead silicate glass, an alkali metal silicate glass, an alkali metal-alkaline earth metal silicate glass or a borosilicate glass; for example a soda-lime silicate glass.
  • the electrically and/or thermally nonconductive glass matrix is a solar glass or a display glass.
  • Solar glass or display glass means nonconductive, inorganic non-metallic glasses with reduced content of iron and/or alkali elements, like a soda lime.
  • At least one electrically and/or thermally conductive element is an element, which is electrically and/or thermally conductive and forms an electrically and/or thermally conductive feed through connection within the glass.
  • An electrically and/or thermally conductive feed through connection means a hermetically sealed path within the glass formed by the electrically and/or thermally conductive element, which transports current and/or heat from a first surface to a second surface of the glass.
  • the first and the second surface of the at least one electrically and/or thermally nonconductive glass matrix mean planes, which may be flat or curved and which are perpendicular to the thickness of the glass matrix.
  • the thickness of the glass matrix is the extension of the glass perpendicular to the glass plane.
  • the glass with at least one electrically and/or thermally conductive feed trough connection is in the form of a flat glass, a bended glass, a laminated glass or combinations thereof.
  • a flat glass means a glass with a first surface and second surface, which are parallel to each other and spaced from one another by the thickness of the glass, wherein the thickness is perpendicular to the first and second surface of the glass.
  • a bended glass means a glass with a first and second surface, which are each curved planes and spaced apart from each other by the thickness of the glass.
  • a laminated glass means a glass comprising at least two electrically and/or thermally nonconductive glass matrices laminated together by a polymeric foil such that one surface of a first electrically and/or thermally nonconductive glass matrix is bonded to one surface of a second electrically and/or thermally nonconductive glass matrix by the polymeric foil.
  • the laminated glass may be a flat laminated glass or a bended laminated glass.
  • the glass with at least one electrically and/or thermally conductive feed through connections comprises a coating at least on one surface of the at least one electrically and/or thermally nonconductive glass matrix.
  • a coating comprises for example an anti-reflecting coating or a conductive coating.
  • such an electrically and/or thermally conductive feed through connection in a glass provides the possibility of an electrically and/or thermally hermetically sealed conductive connection throughout the glass in devices like solar modules, flat panel displays without the manufacture of openings within the glass.
  • a hermetically sealed path within the glass means that the at least one electrically and/or thermally conductive feed through connection, formed by the electrically and/or thermally conductive element is sealed against gaseous, liquid and/or solid extrinsic agents, which do not pass through the surrounding glass matrix.
  • the at least one electrically and/or thermally conductive feed through connection is vacuum proof.
  • the at least one electrically and/or thermally conductive element comprises at least one of a wire, a ribbon, a rod and a preformed powder element.
  • wires, ribbons and rods are commercially available in a variety of dimensions and materials. Furthermore, advantageously pre-formed powder elements are available in customized form and provide a good electrical and/or thermal conductivity.
  • the at least one electrically and/or thermally conductive element comprises at least one of a metal, a metal alloy, a metal compound and a conductive semiconductor.
  • Metals, metal alloys and metal compounds are for example, transition metals like, but not limited to Cu, Mo, Cr, Ag, basic metals like, but not limited to Al, or alloys of the foregoing and compounds constituted of foregoing.
  • Conductive semiconductors are doped semiconductors, for example, elemental semiconductors, like Si, Ge, C-based semiconductors, or compound semiconductors, like GaAs, In 2 O 3 -, SnO 2 , ZnO.
  • the electrically and/or thermally conductive element provides a good electrical and/or thermal conductivity.
  • the at least one electrically and/or thermally conductive element comprises an electrical conductivity of > 10 3 S ⁇ m -1 .
  • the at least one electrically and/or thermally conductive element comprises a thermal conductivity of > 50 W ⁇ m -1 ⁇ K -1 .
  • a glass with at least one electrically and/or thermally conductive feed through connection according to the invention is used as back glass for solar modules or as glass substrate for flat panel displays or light emitting devices.
  • the glass with at least one electrically and/or thermally conductive feed through connection provides hermetical sealing of the electronic components of a solar module, a flat panel display or a light emitting device against the outer atmosphere, because no openings within the glass are needed, which can transport gaseous, liquid and/or solid extrinsic agents to the electronic components.
  • the glass with at least one electrically and/or thermally conductive feed through connection provides a proper electrical interconnection of the electronic components of a solar module, a flat panel display or a light emitting device with external electrical connectors, like e.g. junction boxes.
  • Fig. 1 shows a specific embodiment of a method for manufacturing a glass with at least one electrically and/or thermally conductive feed through connection.
  • Fig. 2 shows a specific embodiment of a glass with at least one electrically and/or thermally conductive feed through connection.
  • a glass with at least one electrically and/or thermally conductive feed through connection is manufactured by providing a completely glass matrix in step S1.
  • the completely molten glass matrix provided in step S1 is a soda-lime glass matrix, obtained by mixing and melting raw materials with a composition of 70%SiO 2 , 15%Na 2 O, 9%CaO and 6% others.
  • the soda lime glass melt is refined so that gas bubbles are removed.
  • the soda lime glass melt is shaped by rolling to a flat glass matrix and cooled to a temperature of 700°C.
  • one electrically and/or thermally conductive element is inserted into the completely molten soda lime glass matrix having a dynamic viscosity of 10 7 Pa ⁇ s at 700°C, measured by rotating concentric cylinder viscosimetry.
  • the one electrically and/or thermally conductive element is inserted such that it forms at least one electrically and/or thermally conductive feed through connection.
  • the electrically and/or thermally conductive element is a Cu/Cr-wire with a diameter of 3 mm to 5 mm and a length of 3.2 mm to 3.5 mm.
  • step S3 the molten glass matrix with the inserted electrically and/or thermally conductive wire element is further processed to form a flat glass with an electrically and/or thermally conductive feed through connection by cooling to room temperature.
  • Fig. 2 shows a flat glass with at least one electrically and/or thermally conductive feed through connection 1 comprising an electrically and/or thermally nonconductive glass matrix 10 and an electrically and/or thermally conductive element 2.
  • the flat glass with at least one electrically and/or thermally conductive feed through connection 1 has a thickness of 3.2 mm and a width and length of 1200 cm, respectively 1600 cm.
  • the electrically and/or thermally nonconductive glass matrix 10 is a soda-lime glass matrix.
  • the electrically and/or thermally conductive element 2 is a pre-formed powder element, made by pressing and sintering of SnO 2 powder.
  • the pre-formed powder element 2 has a diameter of 5 mm to 10 mm and a length of 3.2 mm to 3.5 mm.
  • the electrically and/or thermally conductive SnO 2 powder element 2 is arranged such within the soda lime glass matrix 10, that it extends from a first surface 11 of the soda lime glass matrix 10 to a second surface 12 of the

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  • General Physics & Mathematics (AREA)
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  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un procédé pour la fabrication d'un verre ayant au moins une liaison de traversée électriquement et/ou thermiquement conductrice et un verre ayant au moins une liaison de traversée électriquement et/ou thermiquement conductrice pour la fourniture d'un chemin hermétiquement scellé pour le transport de courant et/ou de chaleur à travers un verre sans la fabrication d'ouvertures à l'intérieur du verre.
EP20934816.8A 2020-05-06 2020-05-06 Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice Pending EP4146607A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/088633 WO2021223070A1 (fr) 2020-05-06 2020-05-06 Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice

Publications (1)

Publication Number Publication Date
EP4146607A1 true EP4146607A1 (fr) 2023-03-15

Family

ID=78467758

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20934816.8A Pending EP4146607A1 (fr) 2020-05-06 2020-05-06 Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice

Country Status (3)

Country Link
EP (1) EP4146607A1 (fr)
CN (1) CN115776975A (fr)
WO (1) WO2021223070A1 (fr)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2167482A (en) * 1936-05-15 1939-07-25 Gen Electric Glass-to-metal seal
US3445211A (en) * 1966-05-10 1969-05-20 Sylvania Electric Prod Process for sealing connectors in a planar structure
US3515530A (en) * 1966-06-01 1970-06-02 Tokyo Shibaura Electric Co Process for sealing metal body to glass body
AT306274B (de) * 1968-06-14 1973-04-10 Floatglas Gmbh Verfahren und Anlage zum Herstellen eines Drahtglasbandes nach dem Floatverfahren
JPS51100112A (en) * 1975-02-28 1976-09-03 Asahi Glass Co Ltd Hokyosareta furootogarasuno seizohoho
JPS5393140A (en) * 1977-01-26 1978-08-15 Central Glass Co Ltd Anticorrosive method of glass plate holding metallic wire and anticorrosive structure
JP2002124845A (ja) * 2000-08-07 2002-04-26 Nippon Sheet Glass Co Ltd 水晶振動子パッケージ及びその製造方法
JP2010235356A (ja) * 2009-03-30 2010-10-21 Central Glass Co Ltd 金属線入り板ガラスの製造方法
CN102070120B (zh) * 2010-12-31 2012-09-05 东南大学 用于微电子系统级封装的高密度转接板的制备方法
DE102015109764A1 (de) * 2015-06-18 2016-12-22 Infineon Technologies Ag Eine Laminarstruktur, ein Halbleiterbauelementund Verfahren zum Bilden von Halbleiterbauelementen

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Publication number Publication date
WO2021223070A1 (fr) 2021-11-11
CN115776975A (zh) 2023-03-10

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