EP4143876B1 - Semiconductor module with a recess - Google Patents
Semiconductor module with a recess Download PDFInfo
- Publication number
- EP4143876B1 EP4143876B1 EP21739576.3A EP21739576A EP4143876B1 EP 4143876 B1 EP4143876 B1 EP 4143876B1 EP 21739576 A EP21739576 A EP 21739576A EP 4143876 B1 EP4143876 B1 EP 4143876B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor module
- semiconductor
- circuit board
- heat sink
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 156
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Definitions
- the invention relates to a semiconductor arrangement comprising a semiconductor module and an electronic circuit, wherein the semiconductor module is designed for connection to a heat sink.
- the invention further relates to a power converter with such a semiconductor arrangement.
- a power converter is an example of a power module in which a current and/or a voltage is converted using semiconductors.
- the reduction in the size of power converters can also be achieved by using SiC power semiconductors.
- higher clock frequencies of the power semiconductors Parts of the input filter can be significantly reduced in volume.
- Another option for reducing the size is to install an interior fan in the power converter. However, this is usually not desired due to the risk of contamination inside the device.
- semiconductor module refers to the structural unit that includes the function of one or more semiconductor switches. These are then housed in a housing, for example, to form the structural unit.
- US 9 041 196 B2 shows a semiconductor module that can be easily mounted on a heat sink and enables efficient dissipation of the waste heat emitted by the module.
- the invention is based on the object of improving a semiconductor device, in particular with regard to use in a power converter.
- a semiconductor arrangement comprising a semiconductor module and an electronic circuit, wherein the semiconductor module is designed for connection to a heat sink, wherein the electronic circuit is arranged on a circuit board, wherein the circuit board with the electronic circuit is attached to the semiconductor module on a surface of the semiconductor module facing away from the heat sink, wherein the surface of the semiconductor module facing away from the heat sink has a recess, wherein electronic components of the electronic circuit arranged on the circuit board protrude into the recess of the semiconductor module. Furthermore, this object is achieved by a power converter with at least one such semiconductor arrangement.
- the invention is based, among other things, on the finding that the semiconductor arrangement can be improved by arranging the electronic circuit at least on the side of the circuit board that faces the semiconductor module. This is generally only possible for particularly small Components such as resistors and capacitors in small SMD designs are possible.
- the recess in the semiconductor module on the side facing the circuit board also allows the arrangement of larger components such as pulse capacitors, ceramic capacitors or film capacitors on the side of the circuit board facing the semiconductor module. These components then protrude into the recess in the semiconductor module. This means that they do not have to be arranged on the side of the circuit board facing away from the semiconductor module. Such a condition would otherwise make it impossible to route the individual connections on a populated circuit board.
- Installation space and circuit board area can then be saved by providing larger components that protrude into the recess at the location of the recess and arranging smaller components, particularly components using SMD technology, in places without a recess.
- This degree of freedom makes it possible to route the individual signals. Routing in the area of the semiconductor module is possible in particular through freely positioned connections. It is therefore advantageous to arrange the connections depending on the components of the electronic circuit.
- the recess in the semiconductor module makes it possible to equip the board on both sides. In other words, it is advantageous if the board is equipped on both sides. This means that two areas on both sides of the board are available for accommodating electronic components.
- the degree of freedom of arranging large components on both sides of the board in the immediate vicinity of the semiconductor module makes it possible to implement an electronic circuit on a board with small dimensions and equipment on both sides. This means that the circuit board area on which the electronic circuit is arranged can be used twice and thus be put to good use.
- the semiconductor module is a structural unit.
- This semiconductor module can comprise a single switch or a phase module with two switches. Additional switches can also be arranged in the semiconductor module so that the semiconductor module forms a bridge circuit with four, six or even more switches.
- the recess in the semiconductor module and the circuit board whose electronic components partially protrude into the recess, allows a clever nesting of the semiconductor arrangement and, in particular, when mounting on both sides, circuit board area on the circuit board can be saved.
- the area of the housing of the semiconductor module also known as the semiconductor cover, is advantageously given Places where there is unused volume inside the semiconductor module and in the area where larger components must be placed on the board, one or more recesses, also known as indentations or pockets, to make the space usable for components on the board. This allows unused volume in the semiconductor module to be used for the components of the electronic circuit. In some cases, the height of the semiconductor module can also be reduced.
- the design of the semiconductor module can also be used to provide one or more recesses at certain points on the cover.
- This advantage can be used particularly well when the connections of the semiconductor module are distributed over the surface of the semiconductor module facing away from the heat sink.
- This degree of freedom can be used to arrange the connections directly above the chip underneath and also to arrange the associated circuit parts of the electronic circuit in close proximity to the connections.
- EMC electromagnetic compatibility
- commutation circuits are reduced, so that the switching behavior of the semiconductor module is improved, especially when power electronics are used, and losses are reduced.
- the proposed semiconductor arrangement results in a more compact structure, even in devices such as power converters that are made up of such semiconductor arrangements and other power modules. Alternatively, it is possible to switch a higher power with a given design and size. Both result in an increase in the power density of the semiconductor arrangement. or a power converter with such semiconductor arrangements. At the same time, the semiconductor arrangement can be manufactured cost-effectively. Due to the reduction in circuit board area, production is even more cost-effective than with previously known solutions. In addition, the operating behavior and/or the application possibilities of the semiconductor arrangements or the power converters are also improved, since circuit parts of the electronic circuit can be arranged spatially closer to the semiconductor module and thus to the power chips of the semiconductor module.
- the circuit board is connected to the electrical connections of the semiconductor module for fastening via electrical connections, in particular exclusively via electrical connections. Due to the small dimensions and the resulting low forces acting on the holder, it is possible to fasten the circuit board of the electronic circuit to the semiconductor module using only the electrical connections.
- the distance between the circuit board and the semiconductor module is so small due to the recess, even when the circuit board is equipped on both sides, that the forces on the connections are so small that the connections can take on the task of the mechanical connection in addition to the electrical connection.
- the electrical connection is dimensioned with regard to the electrical requirements, in particular the cross-section of the connection, the short length of the connection also results in sufficient mechanical strength of the connection.
- the design of the pins in the area outside the recess is suitable for simplifying assembly, since the pins can find the holes in the circuit board more easily and accurately due to their length. This means that no further devices need to be provided for the mechanical connection.
- the circuit board is connected to the semiconductor module without screw connections.
- no mechanical A resilient connection between the semiconductor module and the circuit board is no longer required, as the forces that arise can be sufficiently mechanically loaded using simple connections such as plug connections or electrical connections due to the small dimensions of the circuit board and the small distance between the circuit board and the semiconductor module. These are also easy and inexpensive to manufacture.
- the connections of the semiconductor module are arranged on the surface of the semiconductor module facing away from the heat sink, outside the recess.
- the high structure in the area of the connections gives the connections a special strength.
- the design of the pins in the area outside the recess is suitable for simplifying assembly, since the pins can find the holes in the circuit board more easily and accurately due to their length. This makes it possible, among other things, to attach the circuit board to the connections using the connections.
- the required connection to the connections is particularly short, since the connections are located outside the area of the recess. In some cases it is even possible to attach the circuit board directly to the connection of the semiconductor module.
- the corresponding connection is correspondingly short, so that only small forces have to be absorbed during attachment.
- the housing of the semiconductor module with a standard height.
- the height is the distance between the surface on which the heat sink is located and the surface of the semiconductor module facing the circuit board. Since the connections are located in the area outside the recess, the semiconductor modules with recess can also be used universally in existing applications. Due to the volume effect, the semiconductor device can then be manufactured cost-effectively.
- the semiconductor module comprises the material silicon carbide and/or gallium nitride.
- This semiconductor material allows the construction of semiconductor modules with a particularly high Switching frequency. This is in the two or three-digit kHz range.
- the fast switching also requires a particularly low-inductive control and connection to the intermediate circuit. This can be achieved particularly easily and cost-effectively with the proposed arrangement of the semiconductor arrangement.
- the intermediate circuit capacitors can be arranged a short distance from the semiconductor module and the associated semiconductor chips.
- the electronic circuit components required for the control can also be arranged near the control connections of the semiconductor module. Both enable the safe and reliable operation of the semiconductor module with a particularly high switching frequency.
- the semiconductor arrangement comprises at least two semiconductor modules.
- This arrangement can be used to easily create a bridge branch or an entire half-bridge. Since there are dependencies between the elements of a bridge branch or a half-bridge, such as locking and locking times, it has proven advantageous to arrange these semiconductor modules so that they are connected to exactly one circuit board of the electronic circuit. Particularly when several semiconductor modules are connected in parallel, it is particularly advantageous to connect these semiconductor modules to just one electronic circuit due to the same control signals, since this circuit is particularly simple due to the same control signals for the semiconductor modules.
- One circuit board can therefore be used for controlling or supplying several semiconductor modules. This enables a particularly compact design of a power converter.
- the semiconductor arrangement has the heat sink and a substrate of the semiconductor module is directly connected to the heat sink in a non-detachable manner.
- the substrate for example by soldering, sintering, gluing and/or printing, and a combination of these manufacturing options, and thus of the semiconductor material on the heat sink, a particularly good heat transfer can be generated.
- the heat sink and semiconductor module are force-fitted to one another.
- the electronic circuit can then also be mechanically connected to the semiconductor module by means of the connection to the electrical connections of the semiconductor module. This is particularly the case when several semiconductor modules are connected to a circuit board of the electronic circuit.
- the heat sink then also takes on the functionality of aligning and positioning the at least two semiconductor modules relative to one another, so that a circuit board with the electronic circuit can be connected to several semiconductor modules without having to absorb unacceptably high forces.
- the FIG 1 shows part of a semiconductor arrangement 1.
- a semiconductor module 2 is connected to a heat sink 3.
- the connection can be designed to be non-detachable, for example. This can be achieved by applying the substrate of the semiconductor module 2 directly to the heat sink 3 and thus connecting the substrate of the semiconductor module 2 directly to the heat sink 3.
- the semiconductor module 2 is designed in two parts.
- the housing has a base body and a cover, the cover being formed by the surface 21 of the semiconductor module 2 facing away from the heat sink.
- the connections 22 of the semiconductor module 2 are also arranged on this surface 21, to which a circuit board 5 (not shown here) with an electronic circuit 4 can be attached. So that the connections 22 for attaching the circuit board 5 can be made short, i.e.
- FIG 2 shows in a sectional view that electronic components 41 of the electrical circuit 4 on the circuit board 5 can protrude into the recess 6 of the semiconductor module 2. This ensures that the distance between the semiconductor module 2 and the circuit board 5 can be chosen to be so small, even when arranging larger components such as pulse capacitors, ceramic capacitors or electrolytic capacitors, that the circuit board 5 can be attached to the terminals 22 of the semiconductor module 2, which form an electrical connection 8 between the circuit board 5 and the semiconductor module 2. To avoid repetition, reference is made to the description of the FIG 1 and to the reference symbols introduced therein.
- the FIG 3 shows a power converter 10 having a plurality of semiconductor devices 1.
- the invention relates to a semiconductor arrangement comprising a semiconductor module and an electronic circuit, wherein the semiconductor module is designed for connection to a heat sink.
- the electronic circuit is arranged on a circuit board, wherein the circuit board with the electronic circuit is attached to the semiconductor module on a surface of the semiconductor module facing away from the heat sink, wherein the surface of the semiconductor module facing away from the heat sink has a recess, wherein electronic components of the electronic circuit arranged on the circuit board can be inserted into the recess of the semiconductor module.
- the invention relates to a power converter with at least one such semiconductor arrangement.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Description
Die Erfindung betrifft eine Halbleiteranordnung, umfassend ein Halbleitermodul und eine elektronische Schaltung, wobei das Halbleitermodul für die Verbindung mit einem Kühlkörper eingerichtet ist. Ferner betrifft die Erfindung einen Stromrichter mit einer derartigen Halbleiteranordnung.The invention relates to a semiconductor arrangement comprising a semiconductor module and an electronic circuit, wherein the semiconductor module is designed for connection to a heat sink. The invention further relates to a power converter with such a semiconductor arrangement.
Der aktuelle Trend der Halbleiterentwicklung geht derzeit hauptsächlich in Richtung Baugrößenreduzierung bestehender Systeme oder/und Leistungserhöhung bei fixer Baugröße. Diese können dann für leistungsfähigere Stromrichter eingesetzt werden. Ein Stromrichter ist ein Beispiel für einen Leistungsmodul, bei dem mit Hilfe von Halbleitern ein Strom und/oder eine Spannung umgewandelt wird.The current trend in semiconductor development is mainly towards reducing the size of existing systems and/or increasing performance with a fixed size. These can then be used for more powerful power converters. A power converter is an example of a power module in which a current and/or a voltage is converted using semiconductors.
Bei der Baugrößenreduzierung stand bisher eine verbesserte Entwärmung bzw. Kühlung durch effektivere Kühlkörper oder leistungsfähigere Lüfter im Vordergrund. Hier ist man jedoch an die Grenzen gestoßen, da höhere Preise beispielsweise eines Kupferkühlkörpers oder die Lautstärke eines hochdrehenden Lüfters vom Markt nicht akzeptiert werden. Weiterhin ist bestehendes, nicht benötigtes Gerätevolumen über verschiedene Optimierungsmaßnahmen bereits ausgeschöpft, wodurch eine weitere Reduzierung nicht oder nur mit hohem Aufwand mehr möglich ist.When reducing the size, the focus has so far been on improved heat dissipation or cooling through more effective heat sinks or more powerful fans. However, this has reached its limits, as the market does not accept higher prices for a copper heat sink, for example, or the noise level of a high-speed fan. Furthermore, existing, unnecessary device volume has already been exhausted through various optimization measures, meaning that further reduction is no longer possible or only possible with great effort.
Dies betrifft insbesondere Halbleiter der Leistungselektronik. Diese sogenannten Leistungshalbleiter weisen eine Stromtragfähigkeit von mehr als 1 Ampere und Spannungen von mehr als 24 Volt auf. Die Obergrenze dieser Größen betragen jeweils mehrere Tausend Ampere oder Volt.This particularly applies to semiconductors in power electronics. These so-called power semiconductors have a current carrying capacity of more than 1 ampere and voltages of more than 24 volts. The upper limit of these sizes is several thousand amperes or volts.
Die Reduzierung der Baugröße von Stromrichtern kann auch durch Einsatz auch SiC-Leistungshalbleiter erreicht werden. Hier können durch höhere Taktfrequenzen der Leistungshalbleiter Teile des Eingangsfilters im Volumen zum Teil deutlich reduziert werden. Eine weitere Option der Baugrößenreduzierung ist, einen Innenraumlüfter im Stromrichter anzuordnen. Dies ist meist aber aus Gründen der Verschmutzung im Inneren der Geräte nicht gewünscht.The reduction in the size of power converters can also be achieved by using SiC power semiconductors. Here, higher clock frequencies of the power semiconductors Parts of the input filter can be significantly reduced in volume. Another option for reducing the size is to install an interior fan in the power converter. However, this is usually not desired due to the risk of contamination inside the device.
Mit dem Begriff Halbleitermodul ist die bauliche Einheit gemeint, der die Funktion eines oder mehrerer Halbleiterschalter umfasst. Diese sind dann beispielsweise in einem Gehäuse untergebracht, um die bauliche Einheit zu bilden.The term semiconductor module refers to the structural unit that includes the function of one or more semiconductor switches. These are then housed in a housing, for example, to form the structural unit.
Der Erfindung liegt die Aufgabe zugrunde, eine Halbleiteranordnung insbesondere im Hinblick auf die Verwendung in einem Stromrichter zu verbessern.The invention is based on the object of improving a semiconductor device, in particular with regard to use in a power converter.
Diese Aufgabe wird durch eine Halbleiteranordnung, umfassend ein Halbleitermodul und eine elektronische Schaltung, gelöst, wobei das Halbleitermodul für die Verbindung mit einem Kühlkörper eingerichtet ist, wobei die elektronische Schaltung auf einer Platine angeordnet ist, wobei die Platine mit der elektronischen Schaltung auf einer vom Kühlkörper abgewandten Fläche des Halbleitermoduls an dem Halbleitermodul befestigt ist, wobei die vom Kühlkörper abgewandten Fläche des Halbleitermoduls eine Vertiefung aufweist, wobei auf der Platine angeordnete elektronische Bauelemente der elektronischen Schaltung in die Vertiefung des Halbleitermoduls hineinragen. Ferner wird diese Aufgabe durch einen Stromrichter mit mindestens einer derartigen Halbleiteranordnung gelöst.This object is achieved by a semiconductor arrangement comprising a semiconductor module and an electronic circuit, wherein the semiconductor module is designed for connection to a heat sink, wherein the electronic circuit is arranged on a circuit board, wherein the circuit board with the electronic circuit is attached to the semiconductor module on a surface of the semiconductor module facing away from the heat sink, wherein the surface of the semiconductor module facing away from the heat sink has a recess, wherein electronic components of the electronic circuit arranged on the circuit board protrude into the recess of the semiconductor module. Furthermore, this object is achieved by a power converter with at least one such semiconductor arrangement.
Weitere vorteilhafte Ausgestaltungen der Erfindung sind in den abhängigen Ansprüchen angegeben.Further advantageous embodiments of the invention are specified in the dependent claims.
Der Erfindung liegt unter anderem die Erkenntnis zugrunde, dass sich die Halbleiteranordnung dadurch verbessern lässt, dass die elektronische Schaltung zumindest auf der Seite der Platine angeordnet ist, die dem Halbleitermodul zugewandt ist. Dies ist im Allgemeinen aufgrund des geringen Abstandes zwischen Platine und Halbleitermodul nur für besonders kleine Bauteile wie Widerstände, Kondensatoren in kleinen SMD-Bauformen möglich. Die Vertiefung des Halbleitermoduls an der der Platine zugewandten Seite erlaubt darüber hinaus auch die Anordnung größerer Bauteile wie beispielsweise Impulskondensatoren, Keramikkondensatoren oder Folienkondensatoren auf der Seite der Platine, die dem Halbleitermodul zugewandt ist. Diese Bauteile ragen dann in die Vertiefung des Halbleitermoduls. Somit müssen diese nicht auf der dem Halbleitermodul abgewandten Seite der Platine angeordnet werden. Eine solche Bedingung macht ansonsten das Routen der einzelnen Verbindungen auf einer bestückten Platine unmöglich. Bauraum und Leiterplattenfläche lassen sich dann dadurch einsparen, dass man an der Stelle der Vertiefung größere Bauelemente vorsehen kann, die in die Vertiefung hineinragen und an Stelle ohne Vertiefung kleinere Bauteile, insbesondere Bauteile in SMD Technik, anordnet. Durch diesen Freiheitsgrad ist ein Routen der einzelnen Signale möglich. Dabei ist das Routen im Bereich des Halbleitermoduls insbesondere durch frei positioniere Anschlüsse möglich. Somit ist es vorteilhaft, die Anschlüsse in Abhängigkeit von den Bauelementen der elektronischen Schaltung anzuordnen.The invention is based, among other things, on the finding that the semiconductor arrangement can be improved by arranging the electronic circuit at least on the side of the circuit board that faces the semiconductor module. This is generally only possible for particularly small Components such as resistors and capacitors in small SMD designs are possible. The recess in the semiconductor module on the side facing the circuit board also allows the arrangement of larger components such as pulse capacitors, ceramic capacitors or film capacitors on the side of the circuit board facing the semiconductor module. These components then protrude into the recess in the semiconductor module. This means that they do not have to be arranged on the side of the circuit board facing away from the semiconductor module. Such a condition would otherwise make it impossible to route the individual connections on a populated circuit board. Installation space and circuit board area can then be saved by providing larger components that protrude into the recess at the location of the recess and arranging smaller components, particularly components using SMD technology, in places without a recess. This degree of freedom makes it possible to route the individual signals. Routing in the area of the semiconductor module is possible in particular through freely positioned connections. It is therefore advantageous to arrange the connections depending on the components of the electronic circuit.
Durch die Vertiefung des Halbleitermoduls ergibt sich die Möglichkeit, die Platine beidseitig zu bestücken. Mit anderen Worten ist es vorteilhaft, wenn die Platine beidseitig bestückt ist. Damit stehen zwei Flächen auf den beiden Seiten der Platine für die Aufnahme von elektronischen Bauelementen zur Verfügung. Durch den Freiheitsgrad der Anordnung von gro-ßen Bauelementen auf beiden Seiten der Platine in unmittelbarer Nähe des Halbleitermoduls ist die Realisierung einer elektronischen Schaltung auf einer beidseitig bestückten Platine mit geringen Abmessungen möglich. Dadurch kann die Leiterplattenfläche, auf der die elektronische Schaltung angeordnet ist, zum Teil doppelt genutzt und damit gut ausgenutzt werden.The recess in the semiconductor module makes it possible to equip the board on both sides. In other words, it is advantageous if the board is equipped on both sides. This means that two areas on both sides of the board are available for accommodating electronic components. The degree of freedom of arranging large components on both sides of the board in the immediate vicinity of the semiconductor module makes it possible to implement an electronic circuit on a board with small dimensions and equipment on both sides. This means that the circuit board area on which the electronic circuit is arranged can be used twice and thus be put to good use.
Durch den aufgrund der Vertiefung am Halbleitermodul neu hinzugewonnen Freiheitsgrad der Platzierung der Bauelemente auf der dem Halbleitermodul zugewandten Seite der Platine ist es nun möglich, schaltungstechnisch nahe am Halbleitermodul anzuordnende Bauelement auch mit kurzen Verbindungswegen zur Halbleiteranordnung anzuordnen. Dies betrifft beispielsweise unter anderem die Ansteuerschaltung eines IGBTs oder die niederinduktive Anbindung von Kondensatoren an den Zwischenkreis über kurze Leitungs- bzw. Verbindungswege.Due to the newly gained degree of freedom in the placement of the components on the semiconductor module due to the recess On the side of the board facing the semiconductor module, it is now possible to arrange components that are to be arranged close to the semiconductor module in terms of circuitry, even with short connection paths to the semiconductor arrangement. This applies, for example, to the control circuit of an IGBT or the low-inductance connection of capacitors to the intermediate circuit via short lines or connection paths.
Bei dem Halbleitermodul handelt es sich um eine bauliche Einheit. Dieses Halbleitermodul kann dabei einen einzelnen Schalter oder auch ein Phasenmodul mit zwei Schaltern umfassen. Ebenso können weitere Schalter in dem Halbleitermodul angeordnet sein, so dass das Halbleitermodul eine Brückenschaltung mit vier, sechs oder noch mehr Schaltern bildet.The semiconductor module is a structural unit. This semiconductor module can comprise a single switch or a phase module with two switches. Additional switches can also be arranged in the semiconductor module so that the semiconductor module forms a bridge circuit with four, six or even more switches.
Darüber hinaus lassen sich mit heute etablierten Standardhöhen von Gehäusen bei Halbleitermodulen eine Vielzahl der Marktanforderungen erfüllen. Somit hat es sich als vorteilhaft erwiesen, auch für das Halbleitermodul der vorgeschlagenen Halbleiteranordnung eine derartige Standardhöhe als Höhe vorzusehen.In addition, the standard heights of semiconductor module housings established today can meet a large number of market requirements. It has therefore proven advantageous to also provide such a standard height for the semiconductor module of the proposed semiconductor arrangement.
Des Weiteren hat es sich als vorteilhaft erwiesen, die Anschlüsse über die der Platine zugewandten Fläche des Halbleitermoduls zu verteilen. Dadurch ist es einfacher möglich, im Layout der elektronischen Schaltung, beispielsweise aufgrund von Luft-/Kriechstrecken und großen Leiterbahnbreiten für Lastanschlüsse, auch Bauteile auf der dem Halbleitermodul zugewandten Seite der Platine anzuordnen und die zugehörigen Signale dorthin zu routen.Furthermore, it has proven to be advantageous to distribute the connections over the surface of the semiconductor module facing the circuit board. This makes it easier to arrange components on the side of the circuit board facing the semiconductor module and to route the associated signals there in the layout of the electronic circuit, for example due to air/creepage distances and large conductor track widths for load connections.
Somit lassen sich durch die Vertiefung im Halbleitermodul und der Platine deren elektronische Bauelemente zum Teil in die Vertiefung ragen eine geschickte Verschachtelung der Halbleiteranordnung erreichen und insbesondere bei einer beidseitigen Bestückung Leiterplattenfläche auf der Platine einsparen. Die Fläche des Gehäuses des Halbleitermoduls, auch als Halbleiterdeckel bezeichnet, erhält vorteilhafterweise an den Stellen, an denen im Innern des Halbleitermoduls ungenutztes Volumen vorhanden ist und in dem Bereich, in dem auf der Platine größere Bauteile platziert werden müssen, eine oder mehrere Vertiefungen, auch als Einbuchtungen oder Taschen bezeichnet, um den Raum für Komponenten auf der Platine nutzbar zu machen. Dadurch kann nicht genutztes Volumen im Halbleitermodul für die Komponenten der elektronischen Schaltung genutzt werden. In einigen Fällen kann darüber hinaus auch die Höhe des Halbleitermoduls verringert werden.Thus, the recess in the semiconductor module and the circuit board, whose electronic components partially protrude into the recess, allows a clever nesting of the semiconductor arrangement and, in particular, when mounting on both sides, circuit board area on the circuit board can be saved. The area of the housing of the semiconductor module, also known as the semiconductor cover, is advantageously given Places where there is unused volume inside the semiconductor module and in the area where larger components must be placed on the board, one or more recesses, also known as indentations or pockets, to make the space usable for components on the board. This allows unused volume in the semiconductor module to be used for the components of the electronic circuit. In some cases, the height of the semiconductor module can also be reduced.
Auch das Design des Halbleitermoduls kann dazu genutzt werden, eine oder mehrere Vertiefungen an bestimmten Stellen des Deckels vorzusehen. Dieser Vorteil lässt sich insbesondere dann besonders gut nutzen, wenn die Anschlüsse des Halbleitermoduls sich über die dem Kühlkörper abgewandten Fläche des Halbleitermoduls verteilen. Dieser Freiheitsgrad kann dazu genutzt werden, die Anschlüsse direkt oberhalb des darunterliegenden Chips anzuordnen und auch die dazugehörigen Schaltungsteile der elektronischen Schaltung in unmittelbarer Nähe zu den Anschlüssen anzuordnen. Dadurch kann die elektromagnetische Verträglichkeit (EMV) der Halbleiteranordnung oder eines Stromrichters mit einer derartigen Halbleiteranordnung zum Teil deutlich verbessert werden. Weiterhin reduzieren sich Kommutierungskreise, so dass sich das Schaltverhalten des Halbleitermoduls, insbesondere bei Einsatz von Leistungselektronik, verbessert und Verluste reduziert werden.The design of the semiconductor module can also be used to provide one or more recesses at certain points on the cover. This advantage can be used particularly well when the connections of the semiconductor module are distributed over the surface of the semiconductor module facing away from the heat sink. This degree of freedom can be used to arrange the connections directly above the chip underneath and also to arrange the associated circuit parts of the electronic circuit in close proximity to the connections. This can significantly improve the electromagnetic compatibility (EMC) of the semiconductor arrangement or of a power converter with such a semiconductor arrangement. Furthermore, commutation circuits are reduced, so that the switching behavior of the semiconductor module is improved, especially when power electronics are used, and losses are reduced.
Besonders vorteilhaft ist es, bei einer zweiteiligen Ausführung des Gehäuses des Halbleitermoduls die Anschlüsse im Deckel anzuordnen. Dies vereinfacht die Fertigung des entsprechenden Halbleitermoduls sowie der Halbleiteranordnung.It is particularly advantageous to arrange the connections in the cover when the housing of the semiconductor module is made up of two parts. This simplifies the manufacture of the corresponding semiconductor module and the semiconductor arrangement.
Durch die vorgeschlagene Halbleiteranordnung ergibt sich ein kompakterer Aufbau, auch bei Geräten wie Stromrichtern, die aus derartigen Halbleiteranordnungen aufgebaut sind und anderen Leistungsmodulen. Alternativ ist es möglich, bei gegebener Bauform und -größe, eine höhere Leistung zu schalten. Beides ergibt eine Vergrößerung der Leistungsdichte der Halbleiteranordnung bzw. eines Stromrichters mit derartigen Halbleiteranordnungen. Gleichzeitig ist die Halbleiteranordnung kostengünstig herstellbar. Durch die Reduktion an Leiterplattenfläche wird die Herstellung sogar noch kostengünstiger als bei bisher bekannten Lösungen. Darüber hinaus verbessert sich auch das Betriebsverhalten und/oder die Einsatzmöglichkeiten der Halbleiteranordnungen bzw. der Stromrichter, da Schaltungsteile der elektronischen Schaltung räumlich näher an dem Halbleitermodul und damit an den Leistungs-Chips des Halbleitermoduls angeordnet werden können.The proposed semiconductor arrangement results in a more compact structure, even in devices such as power converters that are made up of such semiconductor arrangements and other power modules. Alternatively, it is possible to switch a higher power with a given design and size. Both result in an increase in the power density of the semiconductor arrangement. or a power converter with such semiconductor arrangements. At the same time, the semiconductor arrangement can be manufactured cost-effectively. Due to the reduction in circuit board area, production is even more cost-effective than with previously known solutions. In addition, the operating behavior and/or the application possibilities of the semiconductor arrangements or the power converters are also improved, since circuit parts of the electronic circuit can be arranged spatially closer to the semiconductor module and thus to the power chips of the semiconductor module.
Bei einer vorteilhaften Ausgestaltung der Erfindung ist die Platine zur Befestigung über elektrische Verbindungen mit elektrischen Anschlüssen des Halbleitermoduls, insbesondere ausschließlich über elektrische Verbindungen, verbunden. Aufgrund der geringen Abmessungen und der damit geringen Kräfte, die auf die Halterung wirken, ist es möglich, die Platine der elektronischen Schaltung allein über die elektrischen Anschlüsse am Halbleitermodul zu befestigen. Der Abstand zwischen der Platine und dem Halbleitermodul ist durch die Vertiefung auch bei beidseitiger Bestückung der Platine derart gering, dass die Kräfte auf die Anschlüsse so gering sind, dass die Anschlüsse neben der Aufgabe der elektrischen Verbindung auch die Aufgabe der mechanischen Verbindung übernehmen können. Dimensioniert man die elektrische Verbindung im Hinblick auf die elektrischen Anforderungen, insbesondere den Querschnitt der Verbindung, so ergibt sich gleichzeitig aufgrund der kurzen Länge der Verbindung auch eine hinreichende mechanische Festigkeit der Verbindung. Darüber hinaus eignet sich die Ausgestaltung der Pins im Bereich außerhalb der Vertiefung, die Montage zu vereinfachen, da die Pins aufgrund ihrer Länge die Löcher der Platine leichter und zielsicher finden können. Somit brauchen zur mechanischen Verbindung keine weiteren Vorrichtungen vorgesehen zu werden.In an advantageous embodiment of the invention, the circuit board is connected to the electrical connections of the semiconductor module for fastening via electrical connections, in particular exclusively via electrical connections. Due to the small dimensions and the resulting low forces acting on the holder, it is possible to fasten the circuit board of the electronic circuit to the semiconductor module using only the electrical connections. The distance between the circuit board and the semiconductor module is so small due to the recess, even when the circuit board is equipped on both sides, that the forces on the connections are so small that the connections can take on the task of the mechanical connection in addition to the electrical connection. If the electrical connection is dimensioned with regard to the electrical requirements, in particular the cross-section of the connection, the short length of the connection also results in sufficient mechanical strength of the connection. In addition, the design of the pins in the area outside the recess is suitable for simplifying assembly, since the pins can find the holes in the circuit board more easily and accurately due to their length. This means that no further devices need to be provided for the mechanical connection.
Bei einer weiteren vorteilhaften Ausgestaltung der Erfindung ist die Platine schraubverbindungsfrei mit dem Halbleitermodul verbunden. Wie zuvor beschrieben wird keine mechanisch belastbare Verbindung zwischen Halbleitermodul und Platine mehr benötigt, da die auftretenden Kräfte aufgrund der geringen Abmessung der Platine und des geringen Abstandes zwischen Platine und Halbleitermodul auch über einfache Verbindungen, wie beispielsweise Steckverbindungen oder über die elektrischen Anschlüsse hinreichend mechanisch belastbar sind. Diese sind darüber hinaus einfach und kostengünstig herstellbar.In a further advantageous embodiment of the invention, the circuit board is connected to the semiconductor module without screw connections. As previously described, no mechanical A resilient connection between the semiconductor module and the circuit board is no longer required, as the forces that arise can be sufficiently mechanically loaded using simple connections such as plug connections or electrical connections due to the small dimensions of the circuit board and the small distance between the circuit board and the semiconductor module. These are also easy and inexpensive to manufacture.
Bei einer weiteren vorteilhaften Ausgestaltung der Erfindung sind die Anschlüsse des Halbleitermoduls auf der vom Kühlkörper abgewandten Fläche des Halbleitermoduls außerhalb der Vertiefung angeordnet. Der hohe Aufbau im Bereich der Anschlüsse gibt den Anschlüssen eine besondere Festigkeit. Darüber hinaus eignet sich die Ausgestaltung der Pins im Bereich außerhalb der Vertiefung, die Montage zu vereinfachen, da die Pins aufgrund ihrer Länge die Löcher der Platine leichter und zielsicher finden können. Diese ermöglicht es unter anderem, die Platine mittels der Verbindungen an den Anschlüssen zu befestigen. Die benötigte Verbindung an den Anschlüssen ist besonders kurz, da sich die Anschlüsse außerhalb des Bereichs der Vertiefung befinden. Teilweise ist es sogar möglich, die Platine direkt an dem Anschluss des Halbleitermoduls zu befestigen. Die entsprechende Verbindung ist entsprechend kurz, so dass nur geringe Kräfte bei der Befestigung aufgenommen werden müssen. Darüber hinaus ist es auch möglich, das Gehäuse des Halbleitermoduls in einer Standardhöhe auszuführen. Die Höhe ist der Abstand zwischen der Fläche, an dem sich der Kühlkörper befindet zu der der Platine zugewandten Fläche des Halbleitermoduls. Da sich die Anschlüsse in dem Bereich außerhalb der Vertiefung befinden, können die Halbleitermodule mit Vertiefung universell auch in bestehende Anwendungen eingesetzt werden. Durch den Stückzahleffekt ist die Halbleiteranordnung dann kostengünstig herstellbar.In a further advantageous embodiment of the invention, the connections of the semiconductor module are arranged on the surface of the semiconductor module facing away from the heat sink, outside the recess. The high structure in the area of the connections gives the connections a special strength. In addition, the design of the pins in the area outside the recess is suitable for simplifying assembly, since the pins can find the holes in the circuit board more easily and accurately due to their length. This makes it possible, among other things, to attach the circuit board to the connections using the connections. The required connection to the connections is particularly short, since the connections are located outside the area of the recess. In some cases it is even possible to attach the circuit board directly to the connection of the semiconductor module. The corresponding connection is correspondingly short, so that only small forces have to be absorbed during attachment. In addition, it is also possible to design the housing of the semiconductor module with a standard height. The height is the distance between the surface on which the heat sink is located and the surface of the semiconductor module facing the circuit board. Since the connections are located in the area outside the recess, the semiconductor modules with recess can also be used universally in existing applications. Due to the volume effect, the semiconductor device can then be manufactured cost-effectively.
Bei einer weiteren vorteilhaften Ausgestaltung der Erfindung weist das Halbleitermodul das Material Siliziumcarbid und/ oder Galliumnitrit auf. Dieses Halbleitermaterial erlaubt den Aufbau von Halbleitermodulen mit einer besonders hohen Schaltfrequenz. Diese liegt im zwei- bzw. dreistelligen kHz-Bereich. Durch das schnelle Schalten wird auch eine besonders niederinduktive Ansteuerung und Verbindung zum Zwischenkreis benötigt. Dies kann mit der vorgeschlagenen Anordnung der Halbleiteranordnung besonders einfach und kostengünstig realisiert werden. Zum einen können die Zwischenkreiskondensatoren mit geringem Abstand zum Halbleitermodul und den dazugehörigen Halbleiterchips angeordnet werden. Darüber hinaus können auch die für die Ansteuerung erforderlichen Baugruppen der elektronischen Schaltung in der Nähe der Ansteueranschlüsse des Halbleitermoduls angeordnet werden. Beides ermöglicht den sicheren und zuverlässigen Betrieb des Halbleitermoduls mit einer besonders hohen Schaltfrequenz.In a further advantageous embodiment of the invention, the semiconductor module comprises the material silicon carbide and/or gallium nitride. This semiconductor material allows the construction of semiconductor modules with a particularly high Switching frequency. This is in the two or three-digit kHz range. The fast switching also requires a particularly low-inductive control and connection to the intermediate circuit. This can be achieved particularly easily and cost-effectively with the proposed arrangement of the semiconductor arrangement. On the one hand, the intermediate circuit capacitors can be arranged a short distance from the semiconductor module and the associated semiconductor chips. In addition, the electronic circuit components required for the control can also be arranged near the control connections of the semiconductor module. Both enable the safe and reliable operation of the semiconductor module with a particularly high switching frequency.
Bei einer weiteren vorteilhaften Ausgestaltung der Erfindung umfasst die Halbleiteranordnung mindestens zwei Halbleitermodule. Mit dieser Anordnung lässt sich auf einfache Weise ein Brückenzweig oder auch eine gesamte Halbbrücke realisieren. Da es zwischen den Elementen eines Brückenzweigs bzw. einer Halbbrücke Abhängigkeiten wie beispielsweise Verriegelungen und Verriegelungszeiten gibt, hat es sich als vorteilhaft erwiesen, diese Halbleitermodule so anzuordnen, dass sie mit genau einer Platine der elektronischen Schaltung verbunden sind. Ganz besonders bei einer Parallelschaltung mehrerer Halbleitermodule ist es aufgrund gleicher Ansteuersignale im Besonderen vorteilhaft, diese Halbleitermodule mit nur einer elektronischen Schaltung zu verbinden, da diese Schaltung aufgrund gleicher Ansteuersignale für die Halbleitermodule besonders einfach aufgebaut ist. Somit kann zur Ansteuerung oder Versorgung eine Platine für mehrere Halbleitermodule zum Einsatz kommen. Dadurch ist ein besonders kompakter Aufbau eines Stromrichters möglich.In a further advantageous embodiment of the invention, the semiconductor arrangement comprises at least two semiconductor modules. This arrangement can be used to easily create a bridge branch or an entire half-bridge. Since there are dependencies between the elements of a bridge branch or a half-bridge, such as locking and locking times, it has proven advantageous to arrange these semiconductor modules so that they are connected to exactly one circuit board of the electronic circuit. Particularly when several semiconductor modules are connected in parallel, it is particularly advantageous to connect these semiconductor modules to just one electronic circuit due to the same control signals, since this circuit is particularly simple due to the same control signals for the semiconductor modules. One circuit board can therefore be used for controlling or supplying several semiconductor modules. This enables a particularly compact design of a power converter.
Bei einer weiteren vorteilhaften Ausgestaltung der Erfindung weist die Halbleiteranordnung den Kühlkörper auf und ist ein Substrat des Halbleitermoduls direkt mit dem Kühlkörper nichtlösbar verbunden. Durch das Aufbringen des Substrates, beispielsweise durch Löten, Sintern, Kleben und/oder Drucken, sowie einer Kombination aus diesen Fertigungsmöglichkeiten, und damit des Halbleitermaterials auf den Kühlkörper kann ein besonders guter Wärmeübergang erzeugt werden. Darüber hinaus sind Kühlkörper und Halbleitermodul kraftschlüssig miteinander verbunden. Unabhängig davon, wie die Halbleiteranordnung in einem Stromrichter befestigt ist, kann dann auch die elektronische Schaltung mittels der Verbindung zu den elektrischen Anschlüssen des Halbleitermoduls mechanisch mit dem Halbleitermodul verbunden werden. Dies ist insbesondere dann der Fall, wenn mehrere Halbleitermodule mit einer Platine der elektronischen Schaltung verbunden sind. Somit ist es besonders vorteilhaft, wenn mindestens zwei Halbleitermodule auf einem Kühlkörper angeordnet sind. Damit übernimmt dann der Kühlkörper auch die Funktionalität, die mindestens zwei Halbleitermodule zueinander auszurichten und zu positionieren, so dass dann eine Platine mit der elektronischen Schaltung mit mehreren Halbleitermodulen verbunden werden kann, ohne unzulässig hohe Kräfte aufnehmen zu müssen.In a further advantageous embodiment of the invention, the semiconductor arrangement has the heat sink and a substrate of the semiconductor module is directly connected to the heat sink in a non-detachable manner. By applying the substrate, for example by soldering, sintering, gluing and/or printing, and a combination of these manufacturing options, and thus of the semiconductor material on the heat sink, a particularly good heat transfer can be generated. In addition, the heat sink and semiconductor module are force-fitted to one another. Regardless of how the semiconductor arrangement is fastened in a power converter, the electronic circuit can then also be mechanically connected to the semiconductor module by means of the connection to the electrical connections of the semiconductor module. This is particularly the case when several semiconductor modules are connected to a circuit board of the electronic circuit. It is therefore particularly advantageous if at least two semiconductor modules are arranged on a heat sink. The heat sink then also takes on the functionality of aligning and positioning the at least two semiconductor modules relative to one another, so that a circuit board with the electronic circuit can be connected to several semiconductor modules without having to absorb unacceptably high forces.
Im Folgenden wird die Erfindung anhand der in den Figuren dargestellten Ausführungsbeispiele näher beschrieben und erläutert. Es zeigen:
- FIG 1
- ein Teil einer Halbleiteranordnung,
- FIG 2
- ein Schnitt durch eine Halbleiteranordnung und
- FIG 3
- einen Stromrichter.
- FIG 1
- a part of a semiconductor device,
- FIG 2
- a section through a semiconductor device and
- FIG 3
- a power converter.
Die
Die
Zusammenfassend betrifft die Erfindung eine Halbleiteranordnung, umfassend ein Halbleitermodul und eine elektronische Schaltung, wobei das Halbleitermodul für die Verbindung mit einem Kühlkörper eingerichtet ist. Zur Verbesserung der Halbleiteranordnung insbesondere im Hinblick auf die Anwendung der Halbleiteranordnung in einem Stromrichter wird vorgeschlagen, dass die elektronische Schaltung auf einer Platine angeordnet ist, wobei die Platine mit der elektronischen Schaltung auf einer vom Kühlkörper abgewandten Fläche des Halbleitermoduls an dem Halbleitermodul befestigt ist, wobei die vom Kühlkörper abgewandten Fläche des Halbleitermoduls eine Vertiefung aufweist, wobei auf der Platine angeordnete elektronische Bauelemente der elektronischen Schaltung in die Vertiefung des Halbleitermoduls hineinragen. Ferner betrifft die Erfindung einen Stromrichter mit mindestens einer derartigen Halbleiteranordnung.In summary, the invention relates to a semiconductor arrangement comprising a semiconductor module and an electronic circuit, wherein the semiconductor module is designed for connection to a heat sink. To improve the semiconductor arrangement, in particular with regard to the use of the semiconductor arrangement in a power converter, it is proposed that the electronic circuit is arranged on a circuit board, wherein the circuit board with the electronic circuit is attached to the semiconductor module on a surface of the semiconductor module facing away from the heat sink, wherein the surface of the semiconductor module facing away from the heat sink has a recess, wherein electronic components of the electronic circuit arranged on the circuit board can be inserted into the recess of the semiconductor module. Furthermore, the invention relates to a power converter with at least one such semiconductor arrangement.
Claims (8)
- Semiconductor assembly (1), comprising a semiconductor module (2) and an electronic circuit (4), wherein the semiconductor module (2) is designed to connect to a heat sink (3), wherein the electronic circuit (4) is arranged on a printed circuit board (5), wherein the printed circuit board (5) together with the electronic circuit (4) is secured to the semiconductor module (2) on a semiconductor module (2) surface (21) facing away from the heat sink (3), characterised in that the semiconductor module (2) surface (21) facing away from the heat sink (3) has a depression (6), wherein electronic components (41) of the electronic circuit (4) arranged on the printed circuit board (5) protrude into the depression (6) of the semiconductor module (2).
- Semiconductor assembly (1) according to claim 1, wherein the printed circuit board (5) is connected to electrical terminals (22) of the semiconductor module (2), in particular exclusively via electrical connections (8), for fastening via electrical connections (8).
- Semiconductor assembly (1) according to one of claims 1 or 2, the printed circuit board (5) is connected to the semiconductor module (2) without a screw connection.
- Semiconductor assembly (1) according to one of claims 1 to 3, wherein the terminals (22) of the semiconductor module (2) are arranged outside the depression (6) on the surface (21) of the semiconductor module (2) facing away from the heat sink (3) .
- Semiconductor assembly (1) according to one of claims 1 to 4, wherein the semiconductor module (2) comprises the material silicon carbide and/or gallium nitrite.
- Semiconductor assembly (1) according to one of claims 1 to 5, wherein the semiconductor assembly (1) comprises at least two semiconductor modules (2) on precisely one heat sink (3).
- Semiconductor assembly (1) according to one of claims 1 to 6, wherein the semiconductor assembly (1) comprises the heat sink (3) and a substrate of the semiconductor module (2) is directly connected to the heat sink (3) in a non-detachable manner.
- Power converter (10) with at least one semiconductor assembly (1) according to one of claims 1 to 7.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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EP20192526.0A EP3961697A1 (en) | 2020-08-25 | 2020-08-25 | Semiconductor module with a recess |
PCT/EP2021/066971 WO2022042896A1 (en) | 2020-08-25 | 2021-06-22 | Semiconductor module with a depression |
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Publication Number | Publication Date |
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EP4143876A1 EP4143876A1 (en) | 2023-03-08 |
EP4143876B1 true EP4143876B1 (en) | 2024-05-01 |
EP4143876C0 EP4143876C0 (en) | 2024-05-01 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20192526.0A Withdrawn EP3961697A1 (en) | 2020-08-25 | 2020-08-25 | Semiconductor module with a recess |
EP21739576.3A Active EP4143876B1 (en) | 2020-08-25 | 2021-06-22 | Semiconductor module with a recess |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20192526.0A Withdrawn EP3961697A1 (en) | 2020-08-25 | 2020-08-25 | Semiconductor module with a recess |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230246563A1 (en) |
EP (2) | EP3961697A1 (en) |
CN (1) | CN115885382A (en) |
WO (1) | WO2022042896A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6362964B1 (en) * | 1999-11-17 | 2002-03-26 | International Rectifier Corp. | Flexible power assembly |
JP2004063604A (en) * | 2002-07-26 | 2004-02-26 | Hitachi Home & Life Solutions Inc | Power module and refrigerator employing the power module |
JP2006121861A (en) * | 2004-10-25 | 2006-05-11 | Fuji Electric Fa Components & Systems Co Ltd | Power converter |
DE102012213573B3 (en) * | 2012-08-01 | 2013-09-26 | Infineon Technologies Ag | Semiconductor module arrangement, has module connected and mechanically held at terminals with circuit board in electrical conductive manner, where form-fit connection is indirectly formed between module and body over circuit board |
CN105706229A (en) * | 2013-11-07 | 2016-06-22 | 大赛璐赢创株式会社 | Sealing member, sealed substrate sealed by sealing member, and method for manufacturing same |
US10062621B2 (en) * | 2016-04-30 | 2018-08-28 | Ixys, Llc | Power semiconductor device module having mechanical corner press-fit anchors |
US10347549B2 (en) * | 2016-04-30 | 2019-07-09 | Littelfuse, Inc. | Power semiconductor device module having mechanical corner press-fit anchors |
JP6806024B2 (en) * | 2017-10-03 | 2020-12-23 | 三菱電機株式会社 | Semiconductor device |
-
2020
- 2020-08-25 EP EP20192526.0A patent/EP3961697A1/en not_active Withdrawn
-
2021
- 2021-06-22 US US18/023,024 patent/US20230246563A1/en not_active Abandoned
- 2021-06-22 EP EP21739576.3A patent/EP4143876B1/en active Active
- 2021-06-22 WO PCT/EP2021/066971 patent/WO2022042896A1/en unknown
- 2021-06-22 CN CN202180052385.4A patent/CN115885382A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3961697A1 (en) | 2022-03-02 |
EP4143876A1 (en) | 2023-03-08 |
WO2022042896A1 (en) | 2022-03-03 |
US20230246563A1 (en) | 2023-08-03 |
CN115885382A (en) | 2023-03-31 |
EP4143876C0 (en) | 2024-05-01 |
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