EP4139943A1 - Stromzuführung und verfahren zu ihrer herstellung - Google Patents
Stromzuführung und verfahren zu ihrer herstellungInfo
- Publication number
- EP4139943A1 EP4139943A1 EP21721065.7A EP21721065A EP4139943A1 EP 4139943 A1 EP4139943 A1 EP 4139943A1 EP 21721065 A EP21721065 A EP 21721065A EP 4139943 A1 EP4139943 A1 EP 4139943A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- flow
- power supply
- foils
- stack
- flow channels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000003507 refrigerant Substances 0.000 claims abstract description 138
- 239000000203 mixture Substances 0.000 claims abstract description 121
- 239000012530 fluid Substances 0.000 claims abstract description 58
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 238000001816 cooling Methods 0.000 claims description 113
- 239000011888 foil Substances 0.000 claims description 106
- 238000009835 boiling Methods 0.000 claims description 43
- 239000002887 superconductor Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 30
- 238000009826 distribution Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000003801 milling Methods 0.000 claims description 5
- 239000012808 vapor phase Substances 0.000 claims description 4
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 239000000463 material Substances 0.000 description 20
- 238000012546 transfer Methods 0.000 description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 239000002826 coolant Substances 0.000 description 9
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910052754 neon Inorganic materials 0.000 description 6
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000007791 liquid phase Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/34—Cable fittings for cryogenic cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/16—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by cooling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Definitions
- the invention relates to a power supply and a method for its production. Furthermore, the present invention relates to at least one device comprising such a power supply for generating cryogenic temperatures and for transporting electrical energy as well as its use, in particular for cooling and operating high-temperature superconductors at a cryogenic temperature of 15 K to 90 K.
- a power supply for generating cryogenic temperatures and for transporting electrical energy as well as its use, in particular for cooling and operating high-temperature superconductors at a cryogenic temperature of 15 K to 90 K.
- other applications are possible. State of the art
- cryogenic mixed cooling circuits are preferred for this.
- the desired cooling is achieved here by the Joule-Thomson effect, which describes a temperature change during adiabatic, isenthalpic expansion of a real fluid.
- the Joule-Thomson coefficient defined according to equation (1) has where the term (-) denotes a partial derivative of the temperature T with respect to the pressure p at constant enthalpy H and thus the expansion, has a positive value. This condition is given over a wide range of states of many fluids or can be achieved by precooling fluids.
- cryogenic temperatures below 120 K are required the fluid is pre-cooled by means of an internal countercurrent heat exchanger (recuperator) prior to expansion.
- the Linde-Hampson cycle begins in a compressor in which a fluid refrigerant is compressed to a high pressure, with the resulting compression heat being released in an aftercooler to the surroundings of the compressor.
- the refrigerant is then cooled in a counterflow heat exchanger.
- an expansion device preferably selected from an expansion valve, a throttle capillary, an orifice and a sintered element, the refrigerant expands adiabatically to a low pressure level and, given positive Joule-Thomson coefficients ⁇ i JT, continues to cool by means of the Joule-Thomson effect away.
- a heat flow from an application to be cooled, in particular the high-temperature superconductor, can then be absorbed in an evaporator.
- the refrigerant is reheated to ambient temperature in the counterflow heat exchanger before it flows back to the compressor. If this cycle is used to cool power supplies or to liquefy low-boiling fluids such as hydrogen, a heat flow from the power supply or the fluid to be cooled is also absorbed by the refrigerant within the countercurrent heat exchanger.
- the entropy generated as a result can be reduced by changes in the cycle, for example the use of multi-stage compressions, several heat exchangers or turbines for expansion.
- the thermodynamic properties of the refrigerant can be changed by adding at least one further refrigerant which has a boiling point that differs from the refrigerant.
- the Linde-Hampson cycle is operated with a high-boiling multicomponent mixture as the refrigerant instead of a pure substance, the cycle mainly taking place in a two-phase region of the mixture.
- each cooling stage can preferably have its own high-boiling multicomponent mixture, so that the cycle in each cooling stage takes place predominantly in a two-phase region of the respective refrigerant mixture.
- the refrigerant mixture can reach its dew point at the warm end of its cooling stage, e.g. in the first cooling stage near the ambient temperature, whereby it is then successively condensed during the cooling process and further subcooled after passing the boiling point.
- the Joule-Thomson expansion thus takes place partly undercooled, partly with high proportions of liquid.
- the effective heat capacity of the Refrigerant flows of the relevant cooling stage in the countercurrent heat exchanger are controlled in such a way that the temperature difference between the refrigerant flows of the cooling stage, preferably to a refrigerant mixture of at least one further cooling stage or to a gas flow to be liquefied or cooled, preferably over the entire flow length of the countercurrent heat exchanger, reduced to a minimum.
- Another aspect can be the disintegration of the fluid into two liquid phases, which occurs with some refrigerant mixtures.
- the two liquid phases can differ in terms of polarity, degree of fluorination or chain length of their components.
- thermodynamic properties of the refrigerant mixture used can be adjusted accordingly for a cooling stage.
- An efficient refrigerant mixture has a dew point which, at high pressure level, is close to the recooling temperature of the relevant cooling stage. While the re-cooling temperature in the first cooling stage is usually in the range of the ambient temperature, in multi-stage processes the re-cooling temperature of a cooling stage is in the range of the cooling temperature generated by the isenthalpic expansion of the upstream cooling stage.
- the temperature of the dew point of a cooling stage can be influenced in particular by the choice and proportions of higher-boiling components for the cooling stage in question.
- the boiling temperature of the refrigerant mixture of a cooling stage should preferably be at the low pressure level just below the cooling temperature in order to keep the entropy generation as low as possible due to a high proportion of liquid during expansion in the expansion device.
- the selection and proportions of lower-boiling components have a considerable influence on the boiling temperature.
- the refrigerant mixture of a cooling stage thus comprises both higher-boiling components and lower-boiling components, whereby the refrigerant mixture of a cooling stage is high-boiling overall.
- the refrigerant mixture of the first stage can therefore preferably comprise about four to five refrigerants with higher boiling points and lower boiling points, preferably selected from hydrocarbons and fluorinated hydrocarbons, which are mixed in a ratio adapted for the intended application, and preferably proportions of low-boiling components, in particular selected from oxygen, nitrogen, argon, neon, hydrogen and helium.
- the refrigerant mixture that is used for a further cooling stage, which is precooled by a preceding cooling stage can in practice comprise about two to four refrigerants with higher and lower boiling points, preferably selected from oxygen, nitrogen, argon, neon, hydrogen and helium that are in a customized for the intended application Ratio are mixed, in each case no components are selected that can freeze out at temperatures in the cooling stage in question.
- the use of a high-boiling refrigerant mixture thus enables the refrigerant mixture to successively partially condense on the high-pressure side of a countercurrent heat exchanger, while it successively partially evaporates on the low-pressure side of the countercurrent heat exchanger.
- an advantageous adjustment of capacity flows on the high pressure side and on the low pressure side of the countercurrent heat exchanger can thus take place.
- the composition of the refrigerant mixture can be optimized to such an extent that the heat transfer can take place over the entire temperature range with a minimal temperature difference DT between the material flows, whereby a considerable increase in efficiency can be achieved.
- Peltier elements see, for example, S. Yamaguchi, M. Emoto, T. Kawahara, M. Hamabe, H. Watanabe, Y. Ivanov, Jian Sun, N. Yamamoto, A. Iiyoshi, A Proposal of Multi-stage current lead for reduction of heat leak, Physics Procedia 27 (2012) 448-451.
- each plate has four positioning holes for aligning the plates and four cut-out areas that form headers.
- DE 10 2016 011 311 A1 discloses a method for cooling a power supply of a consumer with cryogenic gas, the power supply being designed as a plate heat exchanger and the cryogenic gas being passed through the plate heat exchanger as a coolant.
- the structure of a gas-cooled power supply, which is designed as a plate heat exchanger, is also described.
- DE 102005 005 780 A1 discloses a current-carrying device for a low-temperature conductor with at least one electrical conductor which has a warm and a cold contact point connected to the low-temperature conductor and with at least one coolant channel which is delimited at least on one side by the conductor. It is proposed that the coolant channel has guide elements with which a directed convection of the coolant in the coolant channel from the cold contact point to the warm contact point can be enforced and the speed of the coolant can be adjusted locally.
- a cryogenic gas is conducted as the first refrigerant in a first circuit and that the power supply lines or the consumers with power supply lines are cooled directly with the aid of the cryogenic gas, with the cryogenic gas flowing in countercurrent to the inflowing Heat is passed along the Stromzu guides and wherein the first refrigerant is cooled with a second refrigerant, which second refrigerant is guided in a second, separate circuit.
- DE 21 63 270 C discloses a power supply for electrical devices with conductors cooled to low temperature, the end of which is connected to a normal conductor which is arranged in a gas flow of an evaporated cooling medium, the gas flow of the evaporated cooling medium being divided into individual flows, each one Flow through the flow channel, which is limited by at least two walls made of electrically insulating material, the distance between which is not more than 30 mm.
- US 4,992,623 A discloses an electronic system with low temperature components at different locations within the system, with cryogenic fluid and electrical power being distributed by means of the same conduit.
- the line consists of a feed section and a return section, each section comprising a channel for conveying the cryogenic fluid with superconducting walls for conveying the electrical power.
- the line can comprise a copper rod with channels formed therein for the transport of the cryogenic fluid and a channel for receiving a rod made of superconducting material.
- the superconducting rod conducts the electrical current to a subsystem while it is cooled by the cryogenic fluid where the cryogenic fluid continues to be used for cooling purposes at its destination.
- cryogenic fluid can be transported by a pair of concentric conduits, with the walls of each conduit comprising superconducting material for simultaneously providing electrical power to the subsystems using the cryogenic fluid.
- WO 2003/081104 A2 discloses a method for producing a sheath for a high-temperature multifilament superconductor cable.
- the jacket is produced by co-extrusion of a cylindrical blank with at least two concentric cylinders.
- a sheath for a high-temperature multifilament superconductor cable is proposed, which is produced according to the method mentioned.
- the jacket consists of a tube with a multilayer wall comprising: a pure silver inner layer and at least one second silver-based alloy layer.
- the object of the present invention is to provide a power supply and a method for its production as well as a device for generating cryogenic temperatures and for transporting electrical energy and its use, which at least partially overcome the listed disadvantages and limitations of the prior art .
- the term "A has B”, “A has B”, “A comprises B” or “A includes B” can refer to the situation in which, apart from B, no further element is present in A (ie on a situation in which A consists exclusively of B), as well as on the situation in which, in addition to B, one or more further elements are present in A, for example element C, elements C and D or even further elements .
- the terms “at least one” and “one or more” as well as grammatical modifications of these terms, if they are used in connection with one or more elements or features and are intended to express that the element or feature is provided once or several times can be used, as a rule, only once, for example when the feature or element is introduced for the first time. If the feature or element is subsequently mentioned again, the corresponding term “at least one” or “one or more” is generally no longer used, without this limiting the possibility that the feature or element can be provided once or several times.
- the present invention relates to a power supply for transporting electrical energy from an energy source to an application or from the application to the energy source, the energy source being arranged in a warm area and the application being arranged in a cold area,
- the power supply has a stack comprising at least two foils
- each film comprises an electrically conductive material which is set up to transport the electrical energy
- each film having an electrical connection which is set up to receive the electrical energy or to output the electrical energy
- each film comprises a plurality of flow channels for guiding a fluid flow.
- the term “power supply” denotes a device that is set up to transport electrical energy, in particular in the form of an electrical current, from at least one energy source to at least one application or from the at least one application to the at least one energy source.
- the power supply is set up in particular to transport an electric current from a normally conducting circuit that includes the at least one energy source into an electric circuit that includes at least one superconductor, in particular a high-temperature superconductor, preferably around one To enable loss-free further transport of the electrical current in the at least one superconductor, in particular in the at least one high-temperature superconductor.
- other types of applications are conceivable.
- the energy source is located in a warm area of a cooling stage of a device for generating cryogenic temperatures, which can also be referred to as a “refrigeration system”, while the application is arranged in a cold area.
- every device for generating cryogenic temperatures comprises at least one cooling stage, each of which has a cold area and a warm area.
- the “warm area” denotes a first sub-area of the device which has a higher temperature compared to the cold area.
- the device can be designed in such a way that at least part of the warm area of the respective subsequent cooling stage can correspond to the cold area of the respective preceding stage.
- the warm area of the first cooling stage is preferably set up for ambient temperature and is usually kept at least at ambient temperature, with higher temperatures, for example up to 150 ° C., also occurring in a compressor in particular.
- the term the “ambient temperature” here relates to a temperature of 273 K, preferably 288 K, particularly preferably 293 K, to 313 K, preferably up to 303 K, particularly preferably up to 298 K.
- cryogenic temperature includes a temperature of 10 K, preferably 15 K, to 120 K, preferably up to 90 K.
- the cold area is used to bring the cold area to a cryogenic temperature and to keep it at a cryogenic temperature Area in a cryostat, preferably a vacuum-insulated cryostat, introduced.
- a cryostat preferably a vacuum-insulated cryostat, introduced.
- other types of cryostat are possible.
- the power supply has a stack which comprises at least two foils.
- foil here refers to a thin, expanded body of an electrically conductive material that is designed to transport electrical energy.
- the film can preferably have a surface in the form of a lateral extension, comprising a film length and a film width, the film width being a film thickness formed perpendicular to the lateral extension by a factor of at least 10, preferably at least 25, particularly preferably at least 50, in particular at least 100 can exceed.
- the film can preferably have a surface in the form of a lateral extension, comprising a film length and a film width, the film width being a film thickness formed perpendicular to the lateral extension by a factor of at least 10, preferably at least 25, particularly preferably at least 50, in particular at least 100 can exceed.
- the film is preferably have a surface in the form of a lateral extension, comprising a film length and a film width, the film width being a film thickness formed perpendicular to the lateral extension by
- - have a film thickness of at least 200 ⁇ m, preferably of at least 250 ⁇ m, in particular from 400 ⁇ m to 500 ⁇ m, at most up to 2 mm, preferably at most up to 1 mm.
- these are connected to one another by means of diffusion welding and are therefore designed in such a way that they can withstand the associated energy input without damage or even destruction.
- other values for the film length, film width and film thickness are also conceivable; However, it is particularly advantageous if the film thickness does not exceed the specified value of 1 mm, from which it would more likely be referred to as “plate thickness”.
- the term “stack” relates to an arrangement which contains the at least two foils, each of which is placed on top of one another in the lateral extent parallel to their surfaces are preferably connected to one another by means of diffusion welding, comprises.
- all foils of the stack can preferably have the same foil length and the same foil width.
- all foils in the stack can also preferably have the same foil thickness.
- the stack can comprise at least two foils, preferably at least 10 foils, particularly preferably at least 25 foils, in particular 50 to 60 foils, up to 250 foils, preferably up to 200 foils, particularly preferably up to 100 foils.
- the number, film length, film width and film thickness of the films can be adapted to a level of electrical energy to be transported by means of the power supply, in particular an expected current strength.
- each film comprises an electrically conductive material that is designed to transport electrical energy.
- a material is “electrically conductive” if it enables the transport of electrical energy, in particular electrical charge carriers in the form of an electrical current, through the material.
- the electrically conductive material comprises a metal, in particular a highly conductive metal, which has an electrical conductivity s of at least 10 6 S / m, preferably of at least 10 7 S / m, preferably of at least 2 ⁇ 10 7 S / m , having.
- metals include in particular copper (s ⁇ 5.8 ⁇ 10 7 S / m), aluminum (s ⁇ 3.7 ⁇ 10 7 S / m) and brass (s ⁇ 2.4 ⁇ 10 7 S / m), copper and aluminum are particularly preferred. Due to its lower electrical conductivity s ⁇ 10 7 S / m, stainless steel is less preferred.
- copper is particularly preferred over aluminum, since a power supply made of copper foils has a specific surface area above 1000 m 2 / m 3 up to 10,000 m 2 / m 3 , while the specific surface area for aluminum plates is only 100 m 2 / m 3 up to 1000 m 2 / m 3 .
- each film has an electrical connection.
- the term “electrical connection” here relates to a device of a film which is set up to receive electrical energy into the film and / or to output electrical energy from the film.
- a separate electrical connection is attached to each transverse side of the film, so that the electrical energy from the energy source or the electrical energy can be received on a first transverse side of the film the delivery of the electrical energy to the energy source and the delivery of the electrical energy to the application or the absorption of the electrical energy from the application is possible on the other transverse side of the film.
- connection lug denotes an electrically conductive connection part set up on the relevant transverse side of the film, which is preferably in a movable shape, particularly preferably in a tapered and / or conically tapered shape, the connection part preferably being of the respective film is included.
- electrically conductive reference is made to the definition above.
- each film in the stack can be contacted individually in order to allow the most uniform possible distribution of the electrical current in accordance with Kirchhoff's laws to as many films as possible in the stack.
- other types of configuration of the electrical connection are conceivable.
- the electrical connection of the film facing the application in the cold area can have an electrically conductive connection to a high-temperature superconductor, the high-temperature superconductor being arranged between the electrical connection of the power supply and the application.
- the high-temperature superconductor can in particular be designed as a tape or a cable.
- the electrically conductive connection between the power supply and the application can be designed to be superconducting, in particular in the form of a high-temperature superconductor, in order to ensure that the electrical current is transported onward as loss-free as possible from the power supply to the application or from the application to the power supply enable.
- high-temperature superconductor tape here refers to an electrical conductor configured in the form of a tape, which at least partially comprises a high-temperature superconductor.
- high-temperature superconductor cable here refers to a cable-shaped electrical conductor which at least partially comprises a high-temperature superconductor.
- a high-temperature superconductor cable can comprise several filaments which can be connected in an electrically conductive manner individually or in groups to the foil or to several foils.
- each film furthermore comprises a multiplicity of flow channels for guiding a fluid flow.
- the fluid flow can preferably comprise a refrigerant mixture or a gas flow to be cooled or a gas flow to be liquefied.
- the gas flow can here comprise a gas or any mixture of at least two gases, wherein the gas can be selected in particular from oxygen, nitrogen, argon, neon, hydrogen and helium.
- the term des “Refrigerant mixture” means a mixture of at least two components of refrigerants, with at least two of the components having a different boiling point from one another.
- the term “refrigerant” relates to a preferably inert fluid that has a positive Joule-Thomson coefficient ⁇ i JT > 0 when it enters the cold area of the relevant cooling stage, and is therefore used as a means for Generation of the cryogenic temperature in a cooling stage of the Linde-Hampson cycle is suitable.
- the refrigerant mixture for the respective cooling stage comprises both higher-boiling components and lower-boiling components, which means that the refrigerant mixture as a whole is " far-boiling "can be designated.
- the refrigerant mixture for each cooling stage therefore preferably comprises at least two, preferably at least three, particularly preferably at least four, to eight, preferably up to six, preferably up to five refrigerants, with at least one of the refrigerants being a higher-boiling component and at least one other refrigerant being a lower-boiling component .
- the term “higher boiling” refers to fluids whose boiling point is at the temperature at the entry into the cold area of the respective cooling stage.
- cold area reference is made to the definition above.
- the term “lower-boiling” refers to fluids whose boiling point is below the temperature of the higher-boiling component of the respective cooling stage.
- the lowest-boiling component of the refrigerant mixture of the respective cooling stage has a boiling temperature which is below the temperature after the isenthalpic expansion of the respective cooling stage and can thus in particular be a cryogenic temperature.
- cryogenic temperature reference is made to the definition above.
- the at least one higher-boiling component can preferably be selected from a hydrocarbon and a fluorinated hydrocarbon, while the at least one lower-boiling component can preferably be selected from oxygen, nitrogen, argon, neon, hydrogen and helium.
- the refrigerant mixture for a further cooling stage which is precooled by a preceding pre-cooling stage, can preferably comprise a refrigerant selected from oxygen, nitrogen, argon, neon, hydrogen and helium, which are preferably mixed in a ratio adapted for the intended application, preferably In each case those components are avoided which can freeze out at the temperatures in the relevant cooling stage.
- a refrigerant selected from oxygen, nitrogen, argon, neon, hydrogen and helium, which are preferably mixed in a ratio adapted for the intended application, preferably In each case those components are avoided which can freeze out at the temperatures in the relevant cooling stage.
- Other types of refrigerants are possible.
- each film for guiding the fluid flow comprises a multiplicity of flow channels.
- the term “flow channel” here refers to an elongated depression made in the respective film, which extends over the entire length in particular Film length of the film in question, in particular minus at least one entry area and at least one exit area, and which is therefore for receiving the fluid flow from a first area, selected from the warm area or the cold area of a cooling stage, for guiding the fluid flow over the film and is set up to deliver the fluid flow to a second area selected from the respective other area of the relevant cooling stage.
- the number, shape and configuration of the flow channels can be selected in such a way that the fluid flow flows through the plurality of flow channels in the foils in a laminar flow as far as possible.
- the plurality of flow channels can preferably be incorporated into the respective film by means of a subtractive process, in particular selected from an etching process or from micro-milling, whereby the film in question can also be referred to as a “microstructured film”.
- each flow channel can in principle have any channel cross-section which has an opening towards the surface of the film.
- a semicircular channel cross-section is created due to the manufacturing process, while other types of channel cross-sections are also possible with micro-milling; however, production of the flow channels by means of micromilling requires a higher expenditure of time than the etching process.
- Each film can comprise at least 10 flow channels, preferably at least 20 flow channels, particularly preferably at least 25 flow channels, in particular 50 to 100 flow channels, up to 500 flow channels, preferably up to 250 flow channels, particularly preferably up to 200 flow channels.
- all flow channels in a film, preferably in each film can preferably have the same channel length, channel width, channel depth and web width and be arranged parallel to one another in periodic succession in the film, with
- the channel length can preferably correspond to the film length of the associated film, in particular less at least one entry area and at least one exit area;
- the channel width can be at least 100 ⁇ m, preferably at least 250 ⁇ m, in particular 400 ⁇ m to 500 ⁇ m, at most up to 2 mm, preferably at most up to 1 mm, a web width with which adjacent flow channels are spaced apart from one another, at least 0.5, preferably can be at least 1.0, in particular from 1.0 to 2.0, at most 5.0, preferably at most 2.5 of the channel width of the flow channels; and the channel depth at least 50 ⁇ m, preferably at least 100 gm, in particular from 200 gm to 250 gm, at most 1 mm, preferably at most 500 gm, but less than the film thickness, preferably less than 75% of the film thickness, particularly preferably less than 50% the film thickness, so that a sufficient bottom thickness of the film can remain, wherein a ratio of channel width to channel depth, in particular when using an etching process, can be preferably from 1.0 to 3.0, in particular from about 2.0, while other values are possible when using micro-milling. However, other values for
- Diffusion welding also has the advantage that as a result the stack of foils comprises only one uniform material; in particular, a solder can be dispensed with as a further material in the stack. In this way, a monolithic design can be provided with which thermal voltages, which can lead to leaks during the operation of the power supply lines, can be effectively prevented.
- the flow channels are each preferably introduced exclusively on a single side of the surface of each film.
- Adjacent foils in particular foils which are assigned to different flow paths, can thus be introduced into the stack in such a way that the openings of the flow channels on the surface of the foils are arranged facing away from one another. In this way, an offset, as described in Gomse et al., See above, between flow channels of adjacent foils arranged facing one another can be avoided.
- a different arrangement of the flow channels in individual or all foils is also conceivable, including an arrangement of the flow channels on both sides of a foil, which, however, is usually associated with disadvantages, in particular an offset or higher manufacturing costs.
- the foils included in the stack have
- a first flow path through the flow channels which is set up to receive the refrigerant mixture at high pressure level from the warm area of the cooling stage; and - A second flow path through the flow channels, which is set up to receive the refrigerant mixture at low pressure level from the cold area of the cooling stage, or to receive a liquid phase of the refrigerant mixture at low pressure level from the cold area of the cooling stage.
- it is a countercurrent heat exchanger with high pressure flow and low pressure flow of the cooling medium, the high pressure flow from the warm area into the cold area in the direction of flow of the electrical current, while the low pressure flow in the opposite direction from the cold Area flows into the warm area.
- the foils comprised by the stack can preferably have at least one further flow path selected from:
- a third flow path through the flow channels which is set up to receive a vapor phase of the refrigerant mixture at low pressure level from the cold region of the cooling stage;
- a fourth flow path through the flow channels which is set up to receive the gas flow to be cooled or the gas flow to be liquefied from the warm region of the cooling stage.
- a vapor phase and a liquid phase of the refrigerant mixture can preferably be recorded separately.
- the flow channels of each film can be used either as a first flow path for receiving the refrigerant mixture at high pressure level from the warm area, as a second or third flow path for receiving the refrigerant mixture at low pressure level from the cold area, or as a fourth flow path for Be set up to accommodate the gas flow to be cooled or liquefied from the warm area of the cooling stage.
- the flow channels of adjacent stacked foils in the stack can be set up alternately as a first flow path for receiving the refrigerant mixture at high pressure level and as a second flow path for receiving the refrigerant mixture at low pressure level.
- the flow channels at most two adjacent stacked foils in the stack can be set up as a first flow path for receiving the refrigerant mixture at high pressure level, while an adjoining further foil has second or third flow paths for receiving the refrigerant mixture at low pressure level.
- the flow channels at most two adjacent stacked foils in the stack can be set up as a second or third flow path for receiving the refrigerant mixture at low pressure level, while a further foil adjoining them flow channels in the first flow path for receiving the refrigerant mixture at high pressure level or in the fourth Has flow path for receiving the gas flow to be cooled or liquefied from the warm area of the cooling stage.
- the flow channels at most two adjacent stacked foils in the stack can be set up as a fourth flow path for receiving the gas flow to be cooled or liquefied from the warm area of the cooling stage, while an adjoining further foil flow channels in the first flow path for receiving the refrigerant mixture at high pressure Level, or in the second or third flow path for receiving the refrigerant mixture at low pressure level.
- Such a layered or intermittent alternating arrangement of the first and second flow paths, and optionally the third flow paths and / or the fourth flow paths, enables countercurrent flow through the stack to be achieved.
- Each foil has an entry area and exit area for the flow channels, the "entry area” denoting a first section of the foil which adjoins a first area of the flow channels that is set up for the fluid flow to enter the flow channels, while the "exit area” denotes a second section of the film which adjoins a second region of the flow channels which is set up for an exit of the fluid flow from the flow channels.
- the inlet area and / or the outlet area can have a distribution element which is set up to divide the fluid flow over the flow channels of the film, which are preferably arranged in parallel.
- the distribution element can preferably have a plurality of periodically arranged elevations and depressions located between them.
- the elevations can preferably assume the same level as the surface of the film, while the depressions can preferably have the same channel depth as the flow channels.
- the distribution elements can advantageously serve in particular to prevent a maldistribution of the flow during operation during the distribution of the fluid flow over several parallel flow channels.
- the distribution element can be introduced into the film together with the introduction of the flow channels.
- one side, preferably both sides, of the stack can be provided with a cover plate.
- at least one of the cover plates can have at least one feed line for feeding the fluid flow into the flow channels of the stack and one discharge line for discharging the fluid flow from the flow channels of the stack.
- the cover plate can initially only have corresponding nozzles, to which the supply line and / or the discharge line are fastened, before it is used in the power supply.
- a brazed connection to a pipe section and a subsequent pipe screw connection, in particular by means of cutting ring seals or clamping ring seals, or a welded connection can preferably be used here.
- the present invention relates to a device for generating cryogenic temperatures and for transporting electrical energy from an energy source to an application or from the application to the energy source, comprising at least one cooling stage which has a warm area and a cold area, wherein in the warm area is provided with a refrigerant mixture set up for the respective cooling stage and an energy source, the refrigerant mixture having at least two components with boiling temperatures that differ from one another, the cold region comprising at least one cooling stage:
- At least one power supply as described above or below, the power supply having at least one first flow path for receiving the refrigerant mixture at high pressure level from the warm area of the cooling stage and at least one second flow path for receiving the refrigerant mixture at low pressure level from the cold region of the cooling stage having, wherein the at least one power supply is set up as a first heat exchanger at the same time;
- At least one expansion device which is set up to expand and cool the refrigerant mixture to the low-pressure level
- the cold area of at least one cooling stage which is set up for a cryogenic temperature and is used as intended to generate the cryogenic temperature, can preferably be introduced into a cryostat, in particular into a vacuum-insulated cryostat.
- the cold area of the relevant cooling stage comprises at least one power supply, described in more detail above or below, which is simultaneously set up as a first heat exchanger, which is designed in particular as a countercurrent heat exchanger.
- heat exchanger refers to any device configured to bring about a transfer of thermal energy from at least one high-pressure substance flow to at least one low-pressure substance flow.
- thermal energy here relates to an energy of the respective material flow, which can essentially be described as a function of the temperature of the relevant material flow.
- both the at least one high-pressure substance flow and the at least one low-pressure substance flow comprise the refrigerant mixture used for the respective cooling stage, the substance flows differing from one another in a temperature of the refrigerant mixture or the refrigerant mixtures.
- the at least one high-pressure substance flow can comprise a gas flow to be cooled or a gas flow to be liquefied.
- the at least one low-pressure material flow of the lowest stage has a lowest temperature in each section of the heat exchanger, followed by the temperature of the at least one low-pressure material flow of an optional precooling stage.
- the at least one high-pressure material flow has a temperature in each section of the heat exchanger which is above the at least one low-pressure material flow.
- counterflow heat exchanger relates to a special type of heat exchanger in which the high-pressure substance flow adopts a direction that is opposite to the direction of the low-pressure substance flow.
- a particularly cold material flow can thus advantageously meet a particularly warm material flow, whereby a transfer of thermal energy from the at least one high-pressure material flow to the at least one low-pressure material flow can be configured as efficiently as possible.
- the first heat exchanger comprised according to the invention by the cold area of the relevant cooling stage accordingly has a first sub-area designated as the “high pressure side” and a second sub-area designated as the “low pressure side”, the high-pressure side for receiving the refrigerant mixture and optionally the gas flow from the warm area of the relevant Cooling stage and the low-pressure side set up for the delivery of the refrigerant mixture to the warm area of the relevant cooling stage are.
- the refrigerant mixture supplied on the high pressure side from the associated warm area has a higher temperature compared to the refrigerant mixture provided on the low pressure side for delivery to the associated warm area.
- the refrigerant mixture provided on the low-pressure side contributes significantly to cooling the refrigerant mixture supplied on the high-pressure side from the associated warm area and the optionally supplied gas flow, whereby the transfer of thermal energy can be made more efficient by the counterflow heat exchanger preferably used.
- the refrigerant mixture on the low pressure side of the relevant stage can absorb thermal energy from further material flows, for example from the high pressure side of a downstream cooling stage or from the cooling or liquefaction of a gas flow to be cooled or liquefied.
- the refrigerant mixture enters the first heat exchanger at the high pressure level on the high pressure side, while the refrigerant mixture is provided on the low pressure side at the low pressure level.
- high pressure level here denotes a pressure level that acts on the refrigerant mixture present there, the pressure of which has a value that exceeds the value of the pressure that acts on the refrigerant mixture provided on the low-pressure side.
- the high pressure level of the cooling stage can have an absolute pressure of 1 bar, preferably 10 bar, particularly preferably 25 bar, to 150 bar, preferably up to 25 bar, particularly preferably up to 20 bar, while the low pressure level of the cooling stage may have an absolute pressure of 100 mbar, preferably 1 bar, particularly preferably 2 bar, to 50 bar, preferably up to 10 bar, particularly preferably up to 5 bar.
- the high pressure level and for the low pressure level are possible, in particular depending on the refrigerant mixture used for the respective cooling stage.
- the cold area of the relevant cooling stage comprises at least one expansion device which is set up to expand and cool the refrigerant mixture to the low-pressure level.
- the desired cooling of the refrigerant mixture may preferably by the Joule-Thomson effect can be obtained, wherein the equation (1) defined Joule-Thomson coefficient ⁇ i JT of the refrigerant mixture becomes a positive value.
- the at least one expansion device thus causes, on the one hand, the reduction of the pressure acting on the refrigerant mixture from the high pressure level to the low pressure level and, on the other hand, the desired further cooling of the refrigerant mixture.
- the at least one expansion device can preferably be selected from an expansion valve, a throttle capillary, a Aperture and a sintered body. However, it is conceivable to use a different expansion device.
- the cold area of the at least one cooling stage can preferably comprise at least one second heat exchanger, which is set up to cool the application, preferably the superconducting application, which is arranged in the cold area.
- the present invention relates to a method for producing a power supply, in particular a power supply described above or below, which is set up to transport electrical energy from an energy source to an application or from the application to the energy source, the energy source being in a warm Area is arranged and wherein the application is arranged in a cold area
- the method comprises the following steps: a) Providing at least two foils, wherein each foil comprises an electrically conductive material which is set up to transport electrical energy, wherein each film has an electrical connection at each end which is set up to receive electrical energy from an energy source or to deliver electrical energy to an application; b) introducing a multiplicity of flow channels, which are set up to receive a fluid flow, into the at least two foils; c) Arranging the at least two foils in the form of a stack and diffusion welding the at least two foils, the electrical connection of each foil remaining unwelded in the cold area.
- the introduction of the multiplicity of flow channels into the at least two foils in accordance with step b) can here preferably take place by means of an etching process or by means of micro-milling.
- the fluid flow can preferably comprise a refrigerant mixture or a gas flow to be cooled or a gas flow to be liquefied.
- the electrical connections of the foils can be welded to one another in the warm area, the electrical connections of the foils in the cold area remain unwelded so that the high-temperature superconductors, as mentioned above, can advantageously be contacted individually.
- Arranging the at least two foils in the form of a stack in accordance with step c) can preferably include attaching at least one cover plate to at least one side of the stack, preferably one cover plate on both sides of the stack, wherein the diffusion welding of the at least two foils also includes the at least one cover plate, preferably the two cover plates, wherein the method can have the further step: d) introducing in each case at least one feed line, which is set up to feed the fluid flow, and at least one Discharge, which is set up to discharge the fluid flow, into at least one of the cover plates.
- the present method can preferably have the following further step: e) Attaching at least one high-temperature superconductor to the electrical connection of the foils at the cold end, which is set up to deliver the electrical energy to the application.
- the high-temperature superconductor can in particular be designed as a tape or a cable.
- the present invention relates to a use of a device for generating cryogenic temperatures and for transporting electrical energy for cooling and operating high-temperature superconductors at a temperature of 15 K to 90 K.
- the power supply according to the invention the method for its production and the device for generating cryogenic temperatures and for transporting electrical energy from an energy source and its use have a number of advantages over known power supplies, associated methods and corresponding devices.
- the power supply proposed here as a uniform component, performs a double function, which at the same time includes a power supply and a heat transfer.
- significantly more compact and efficient power supply lines can be provided, which allow power loss that occurs to be dissipated directly at the location where it can be converted into heat.
- the heat can be dissipated at the highest possible temperature level, so that there is an increase in efficiency an exclusive cooling at the cold end of the power supply, a step-by-step cooling or cooling by a gas flow occurs.
- FIG. 1 shows schematic representations of preferred exemplary embodiments of a power supply according to the invention
- FIG. 2 shows schematic representations of preferred exemplary embodiments of an arrangement of foils within a stack in the power supply according to the invention
- FIG. 3 shows schematic representations of a preferred exemplary embodiment of a distribution element in an inlet area or outlet area for dividing a refrigerant mixture into flow channels in one of the foils of the power supply according to the invention
- FIG. 4 shows schematic representations of preferred exemplary embodiments of a single-stage device for generating cryogenic temperatures and for transporting electrical energy, the device comprising power supply lines according to the invention.
- FIG. 5 shows schematic representations of preferred exemplary embodiments of a two-stage device for generating cryogenic temperatures and for transporting electrical energy, the device comprising power supply lines according to the invention. Description of the exemplary embodiments
- FIG. 1 a is a schematic representation of a preferred embodiment of a power supply 110 according to the invention shown in the form of an exploded drawing.
- a stack 118 the comprises a multiplicity of foils 120, as well as two individual foils 120 ′, 120 ′′ (FIG. 1 a) or three individual foils 120 ′, 120 ′′, 120 ′ ′′ drawn, which are also set up for inclusion in the stack 118.
- the foils 120 are each placed on top of one another in the lateral extent parallel to their surfaces and can preferably be connected to one another by means of diffusion welding.
- all foils 120 of the stack 118 can preferably have the same foil length and the same foil width in order to avoid a protrusion between adjacent foils 120 in the stack 118.
- all foils 120 of the stack 118 can also preferably have the same foil thickness.
- the number, film length, film width and film thickness of the films 120 can preferably be adapted to the level of the electrical energy to be transported by means of the power supply 110.
- the stack 118 can in particular comprise 10 to 100 foils 120; however, another value for the number of foils 120 in the stack 118 is possible.
- Each film 120, 120 ', 120 “, 120'” has an electrically conductive material that is designed to transport electrical energy.
- electrically conductive reference is made to the definition above.
- the electrically conductive material preferably comprises copper, other electrically conductive materials also being conceivable, as well as a separate electrical connection on each transverse side of each film 120, 120 ', 120 ", 120'”.
- a first transverse side of each film 120, 120 ', 120 “, 120'” can have a first electrical connection 122, 122 ', 122 “, 122”' for receiving electrical energy from an energy source and the other transverse side of the film 120, 120 ', 120 “, 120'” each have a second electrical connection 124, 124 ', 124 ", 124"' for delivering the electrical energy to an application to be cooled, which is used to receive the electrical energy provided in this way Energy is set up, have, wherein each first electrical connection 122, 122 ', 122 ", 122”' and every second electrical connection 124, 124 ', 124 ", 124"' is encompassed by the film in question.
- each film 120, 120 ', 120 “, 120'” has an electrically conductive connection part, which is preferably movable and in a position relative to the rest of the body of the film 120, 120 ', 120 “, 120' “Is at least partially tapered.
- electrically conductive connection part which is preferably movable and in a position relative to the rest of the body of the film 120, 120 ', 120 “, 120' “Is at least partially tapered.
- other types of arrangement and configuration of the electrical connections of the foils 120, 120 ', 120 ", 120'” are conceivable.
- each film 120, 120', 120", 120 '" is a plurality of preferably arranged in parallel Flow channels 128, which preferably have a plurality of periodically arranged depressions and elevations located between them for guiding a refrigerant mixture on the lateral extent of the surface along the length of the film 120, 120 ', 120 ", 120'".
- Flow channels 128, which preferably have a plurality of periodically arranged depressions and elevations located between them for guiding a refrigerant mixture on the lateral extent of the surface along the length of the film 120, 120 ', 120 ", 120'".
- FIGS. 1 a and 1 b there is an inlet area 130 and an outlet area 130 'for the flow channels between the passages 126' and 126 "'as well as between the passages 126 and 126" and the associated plurality of flow channels 128 128, the choice of the arrangement of the inlet area 130 and the outlet area 130 'in the foils 120, 120', 120 “, 120 '” depending on a flow direction of the refrigerant mixture through the plurality of flow channels 128 selected during operation of the power supply 110.
- FIGS ", 126 '" provided refrigerant mixture is set up on the flow channels 128 of the film 120, 120', 120 ", 120 '".
- FIGS. 2a and 2b show schematic representations of preferred exemplary embodiments of an arrangement of the foils 120, 120 ', 120 ", 120"' and that of the flow channels 128 within a stack 118 in the power supply 110 according to the invention
- the stack 118 comprised foils 120, 120 ', 120 ", 120'” preferably a first flow path 134 which is set up to receive the refrigerant mixture at high pressure level from a warm area of a cooling stage and a second flow path 134% which is used to receive the refrigerant mixture is set up at the low pressure level from a cold area of the cooling stage.
- FIG. 2a schematically shows a first preferred sequence of the arrangement of the foils 120, 120 ', 120 “, 120'” in the stack 118.
- the flow channels 128 are adjacent stacked foils 120, 120 “or 120 ', 120'” alternately set up in the stack 118 as a first flow path 134 and as a second flow path 134 '.
- FIG. 2b schematically shows a further preferred sequence of the arrangement of the foils 120, 120 ', 120 ", 120'” in the stack 118.
- the flow channels 128 are two adjacently stacked foils 120 ', 120' 'in the stack 118 as second flow path 134 'and set up as a third flow path 134 ′′ for the separate reception of a vapor phase and a liquid phase of the refrigerant mixture at low pressure level, while a further film 120, 120 ′′ adjoining each other has a first flow path 134 for receiving the refrigerant mixture at high pressure level Area.
- the stack 118 can then be correspondingly further configured or can be continued according to the exemplary embodiment from FIG. 2a.
- the flow channels 128 of two adjacent stacked foils 120 ′, 120 ′′ in the stack 118 can be used as the first flow path 134 be set up to receive the refrigerant mixture at the high pressure level, while a further film 120, 120 ′ ′′ adjoining it can have a second flow path 134 ′ for receiving the refrigerant mixture at the low pressure level.
- further configurations of the arrangement of the foils of foils 120, 120 ", 120", 120 "" in stack 118 are conceivable.
- Figures 3a to 3c show schematic representations of a preferred embodiment for the distribution element 132 in the inlet area 130 or in the outlet area 130 'for dividing a refrigerant mixture on the flow channels 128 in one of the foils 120 of the power supply 110 according to the invention
- the distribution element 132 can preferably have a plurality of periodically arranged elevations 136 and depressions 138 located between them.
- the elevations 136 can preferably assume the same level as the surface of the film 120, while the depressions 138 can preferably have the same channel depth as the flow channels 128.
- the distribution elements 132, 132 ′ can advantageously serve, in particular, to prevent a maldistribution of the flow during operation during the distribution of the flow over a plurality of parallel flow channels 128.
- FIGS. 4a to 4c each show a schematic representation of a preferred exemplary embodiment of a single-stage device 140 for generating cryogenic temperatures and for transporting electrical energy from an energy source 142 arranged in a warm area 142 of the device 140 to one introduced in a cold area 146 of the device 140
- Application 148 which in particular has at least one high-temperature superconductor 150 or a component which comprises at least one high-temperature superconductor 150.
- the warm area 142 is preferably set up for ambient temperature and usually maintained at ambient temperature
- the cold area 146 is typically at a cryogenic temperature during operation of the device 140.
- a cooler 152 provides a refrigerant mixture which comprises a mixture of at least two components of refrigerants set up for the device 140, at least two of the components having a boiling point that differs from one another.
- a high-boiling refrigerant mixture is used which comprises both at least one higher-boiling component and at least one lower-boiling component.
- the at least one higher-boiling component can preferably be selected from a hydrocarbon and a fluorinated hydrocarbon, while the at least one lower-boiling component can preferably be selected from oxygen, nitrogen, argon, neon, hydrogen and helium.
- the at least one lower-boiling component can preferably be selected from oxygen, nitrogen, argon, neon, hydrogen and helium.
- other substances are possible.
- the present device 140 comprises two power supply lines 110, 110% arranged in the cold region 146, as described in particular above with regard to FIGS. 1 to 3c.
- the introduction of the warm refrigerant mixture the warm area 142 into the cold area 146 takes place at high pressure level by means of a respective supply line 154, 154% each of which opens into a high pressure side 156, 156 'of the power supply lines 110, 110', which are set up as first heat exchangers 158, 158 'at the same time are designed as countercurrent heat exchangers in the exemplary illustration according to FIGS. 4a to 4c.
- each of the first heat exchangers 158, 158 ' has a low-pressure side 160, 160' which is designed to deliver the cold refrigerant mixture to the warm area 142 by means of a discharge line 162, 162 '.
- the warm refrigerant mixture supplied from the warm region 142 to each high-pressure side 156, 156 ′ thus has a higher temperature compared to the refrigerant mixture provided on each low-pressure side 160, 160 ′ for delivery to the warm region 142.
- the cold refrigerant mixture provided on each low-pressure side 160, 160 ' contributes significantly to the cooling of the warm refrigerant mixture supplied on each high-pressure side 156, 156' from the warm area 142, whereby a transfer of thermal energy through the countercurrent heat exchanger can be designed more efficiently, that the refrigerant mixture, which is warm on each high-pressure side 156, 156 ', flows out of the warm region 124 in a direction which is opposite to a direction of the cold refrigerant mixture provided on each low-pressure side 160, 160'.
- the refrigerant mixture which has already been partially cooled on each high-pressure side 156, 156 'in each first heat exchanger 158, 158' and originally supplied from the warm region 142, then passes via a further line 164, 164 'into a respective expansion device 166, 166', which is designed here as an expansion valve.
- a respective expansion device 166, 166' which is designed here as an expansion valve.
- an alternative embodiment of the expansion device 166, 166 'as a throttle capillary, diaphragm or sintered element is possible.
- the expansion device 166, 166 ' is also located in the cold area 146 and is set up to cool the refrigerant mixture to the low-pressure level.
- the expansion device 166, 166 'can preferably be set up to achieve the desired cooling of the refrigerant mixture by means of the Joule-Thomson effect, since the refrigerant mixture has been adapted in such a way that the Joule-Thomson coefficient ⁇ i defined according to equation (1) JT of the refrigerant mixture at the temperature of the cold side 146 of the device 146 has a positive value.
- the expansion device 166, 166 'thus causes, on the one hand, the reduction of the pressure acting on the refrigerant mixture from the high pressure level to the low pressure level and, on the other hand, the desired further cooling of the refrigerant mixture.
- the power supply 110 includes the first electrical connection 122 for receiving the electrical connection Energy in the form of a current 1+ from the energy source 144 and the second electrical connection 124 for delivering the electrical energy in the form of the current 1+ to the application 148, which is set up to receive the electrical energy provided in this way.
- the second electrical connection 124 of the power supply 110 facing the application 148 in the cold region 146 is connected in an electrically conductive manner to a high-temperature superconductor 168.
- the high-temperature superconductor 168 is advantageously arranged between the second electrical connection 124 of the power supply 110 and the application 148, so that in this way a further transport of the electrical energy from the power supply 110 to the application 148 is made possible with as little loss as possible.
- the high-temperature superconductor 168 can in particular be designed as a tape or a cable.
- the electrical energy is transported in the same way as loss-free as possible in the form of a current I- from the application 148 to the power supply 110 'via an associated high-temperature superconductor 168% that is electrically conductive with that of the application 148 is connected in the cold region 146 facing second electrical connection 124 'of the power supply 110'.
- the power supply 110 ‘comprises the first electrical connection 122‘, which is set up to output the electrical energy in the form of the current I- from the application 148 via the power supply 110 ‘to the energy source 144.
- the exemplary embodiment of the device 140 according to FIG. 4 b has two second heat exchangers 170, 170 ‘, which are each set up to cool the application 148 in the cold area 146.
- the refrigerant mixture which has already been partially cooled on each high pressure side 156, 156 'in each first heat exchanger 158, 158', reaches the respective second heat exchanger via the further line 164, 164 'and the respective expansion device 166, 166' 170, 170 '.
- the exemplary embodiment of the device 140 according to FIG. 4c has a single second heat exchanger 170, which is set up to cool the application 148, which is arranged in the cold region 146.
- the refrigerant mixtures already partially cooled on each high-pressure side 156, 156 'in each first heat exchanger 158, 158' are brought together via the partially common further line 164 and passed via the single expansion device 166 to the single second heat exchanger 170.
- the refrigerant is medium mixture from the single second heat exchanger 170 on both low-pressure sides 160, 160 'of the first heat exchangers 158, 158' and thus fed back to the warm area 142.
- Figures 5a and 5b each show a schematic representation of a preferred embodiment in which the respective device 140 for generating cryogenic temperatures and for transporting electrical energy from the energy source 142 arranged in the warm area 142 of the device 140 to that in the cold area 146 of the device 140 introduced application 148 is designed in two stages.
- the exemplary embodiment of the device 140 according to FIG. 5a has a precooler 172 in the warm area 142, which provides a further high-boiling refrigerant mixture which comprises a mixture of at least two components of refrigerants set up for precooling, with at least two here too of the components have a different boiling point from one another.
- the introduction of the further refrigerant mixture from the warm area 142 into the cold area 146 takes place at high pressure level by means of a further supply line 174, 174 ', which are each set up in the high-pressure sides 156, 156' of the respective first heat exchangers 158, 158 ' Power supply lines 110, 110 'open.
- the further refrigerant mixture which has already been partially cooled as a result, then arrives via a further line 176, 176 ‘in a further expansion device 178, 178‘.
- the delivery of the cold refrigerant mixture to the warm area 142 takes place via the respective low-pressure side 160, 160 'of the first heat exchanger 158, 158 ‘by means of a respective further discharge line 180, 180‘.
- the exemplary embodiment of the device 140 according to FIG. 5a compared to the exemplary embodiment according to FIG ", 110 '" to cool further.
- the refrigerant mixture which has already been partially cooled in each first heat exchanger 158, 158% 158 ", 158 '"
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102020205184.4A DE102020205184A1 (de) | 2020-04-23 | 2020-04-23 | Stromzuführung und Verfahren zur ihrer Herstellung |
| PCT/EP2021/060522 WO2021214213A1 (de) | 2020-04-23 | 2021-04-22 | Stromzuführung und verfahren zu ihrer herstellung |
Publications (1)
| Publication Number | Publication Date |
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| EP4139943A1 true EP4139943A1 (de) | 2023-03-01 |
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| EP21721065.7A Pending EP4139943A1 (de) | 2020-04-23 | 2021-04-22 | Stromzuführung und verfahren zu ihrer herstellung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12261423B2 (de) |
| EP (1) | EP4139943A1 (de) |
| JP (1) | JP7682208B2 (de) |
| KR (1) | KR102772808B1 (de) |
| DE (1) | DE102020205184A1 (de) |
| WO (1) | WO2021214213A1 (de) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2163270C2 (de) | 1971-12-20 | 1974-01-10 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Stromzuführung für elektrische Einrichtungen mit auf Tieftemperatur gekühlten Leitern |
| US4992623A (en) | 1989-04-26 | 1991-02-12 | At&T Bell Laboratories | Superconducting bus bar |
| JPH05175047A (ja) * | 1991-12-25 | 1993-07-13 | Ishikawajima Harima Heavy Ind Co Ltd | 超電導マグネット冷却装置 |
| DE4315580A1 (de) * | 1993-05-11 | 1994-11-17 | Fraunhofer Ges Forschung | Anordnung aus Laserdioden und einem Kühlsystem sowie Verfahren zu deren Herstellung |
| WO2000011922A1 (fr) | 1998-08-18 | 2000-03-02 | Hamamatsu Photonics K.K. | Dissipateur thermique, laser a semi-conducteurs et piles de dispositifs laser a semi-conducteurs utilisant ce dissipateur |
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2020
- 2020-04-23 DE DE102020205184.4A patent/DE102020205184A1/de active Pending
-
2021
- 2021-04-22 US US17/996,870 patent/US12261423B2/en active Active
- 2021-04-22 WO PCT/EP2021/060522 patent/WO2021214213A1/de not_active Ceased
- 2021-04-22 KR KR1020227036387A patent/KR102772808B1/ko active Active
- 2021-04-22 EP EP21721065.7A patent/EP4139943A1/de active Pending
- 2021-04-22 JP JP2022564471A patent/JP7682208B2/ja active Active
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| GOMSE D ET AL: "Numerical model of a micro-structured heat exchanger for cryogenic mixed refrigerant cycles", 10 October 2017 (2017-10-10), pages 1 - 19, XP093251476, Retrieved from the Internet <URL:https://publikationen.bibliothek.kit.edu/1000075576> * |
| GOMSE D. ET AL: "Micro-structured heat exchanger for cryogenic mixed refrigerant cycles", IOP CONFERENCE SERIES: MATERIALS SCIENCE AND ENGINEERING, 1 December 2017 (2017-12-01), GB, pages 1 - 8, XP093210885, ISSN: 1757-8981, Retrieved from the Internet <URL:http://stacks.iop.org/1757-899X/278/i=1/a=012061?key=crossref.b2954937f2485b81a881c8e054bb80ba> DOI: 10.1088/1757-899X/278/1/012061 * |
| See also references of WO2021214213A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023522464A (ja) | 2023-05-30 |
| KR102772808B1 (ko) | 2025-02-24 |
| US12261423B2 (en) | 2025-03-25 |
| US20230155363A1 (en) | 2023-05-18 |
| WO2021214213A1 (de) | 2021-10-28 |
| JP7682208B2 (ja) | 2025-05-23 |
| KR20220158010A (ko) | 2022-11-29 |
| DE102020205184A1 (de) | 2021-10-28 |
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