EP4122179A4 - Modular 5g ue layer-2 data stack solutions for high throughput and low latency data transfer - Google Patents

Modular 5g ue layer-2 data stack solutions for high throughput and low latency data transfer Download PDF

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Publication number
EP4122179A4
EP4122179A4 EP21722356.9A EP21722356A EP4122179A4 EP 4122179 A4 EP4122179 A4 EP 4122179A4 EP 21722356 A EP21722356 A EP 21722356A EP 4122179 A4 EP4122179 A4 EP 4122179A4
Authority
EP
European Patent Office
Prior art keywords
modular
layer
high throughput
low latency
data transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21722356.9A
Other languages
German (de)
French (fr)
Other versions
EP4122179A1 (en
Inventor
Su-Lin Low
Tianan Tim Ma
Hong Kui Yang
Hausting Hong
Chun-I Lee
Jianzhou Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeku Technology Shanghai Corp Ltd
Original Assignee
Zeku Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeku Inc filed Critical Zeku Inc
Publication of EP4122179A1 publication Critical patent/EP4122179A1/en
Publication of EP4122179A4 publication Critical patent/EP4122179A4/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/30—Definitions, standards or architectural aspects of layered protocol stacks
    • H04L69/32—Architecture of open systems interconnection [OSI] 7-layer type protocol stacks, e.g. the interfaces between the data link level and the physical level
    • H04L69/322—Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions
    • H04L69/324—Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions in the data link layer [OSI layer 2], e.g. HDLC
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/18—Multiprotocol handlers, e.g. single devices capable of handling multiple protocols
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W80/00—Wireless network protocols or protocol adaptations to wireless operation
    • H04W80/02—Data link layer protocols

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Computer Security & Cryptography (AREA)
  • Mobile Radio Communication Systems (AREA)
EP21722356.9A 2020-06-09 2021-01-25 Modular 5g ue layer-2 data stack solutions for high throughput and low latency data transfer Pending EP4122179A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063036736P 2020-06-09 2020-06-09
PCT/US2021/014934 WO2021087526A1 (en) 2020-06-09 2021-01-25 Modular 5g ue layer-2 data stack solutions for high throughput and low latency data transfer

Publications (2)

Publication Number Publication Date
EP4122179A1 EP4122179A1 (en) 2023-01-25
EP4122179A4 true EP4122179A4 (en) 2023-08-23

Family

ID=75715447

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21722356.9A Pending EP4122179A4 (en) 2020-06-09 2021-01-25 Modular 5g ue layer-2 data stack solutions for high throughput and low latency data transfer

Country Status (4)

Country Link
US (1) US20230105582A1 (en)
EP (1) EP4122179A4 (en)
CN (1) CN115769668A (en)
WO (1) WO2021087526A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220106405A (en) * 2021-01-22 2022-07-29 삼성전자주식회사 Method and apparatus for enhancing security of mac layer in next generation communication system
WO2024076337A1 (en) * 2022-10-03 2024-04-11 Zeku, Inc. Apparatus and method for adaptive activation/deactivation of an uplink layer 2 datapath and hardware threads

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080279129A1 (en) * 2007-05-09 2008-11-13 Broadcom Corporation System and method for automatic wireless transport selection for increased performance and reduced power consumption
US10257329B2 (en) * 2017-09-08 2019-04-09 National Instruments Corporation Wireless communications apparatus and method for performing low latency high throughput layer 2 operations

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2406663B (en) * 2003-10-01 2006-03-22 Toshiba Res Europ Ltd Flexible protocol stack
EP3393200A1 (en) * 2016-02-04 2018-10-24 Huawei Technologies Co., Ltd. Data transmission system, method, and device
CN109691155B (en) * 2016-08-09 2023-05-30 三星电子株式会社 Method and apparatus for managing user plane operations in a wireless communication system
US10531382B2 (en) * 2017-06-20 2020-01-07 Intel Corporation Offloading MAC/link layer functions
US10681607B2 (en) * 2018-06-22 2020-06-09 Intel Corporation Receive-side scaling for wireless communication devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080279129A1 (en) * 2007-05-09 2008-11-13 Broadcom Corporation System and method for automatic wireless transport selection for increased performance and reduced power consumption
US10257329B2 (en) * 2017-09-08 2019-04-09 National Instruments Corporation Wireless communications apparatus and method for performing low latency high throughput layer 2 operations

Also Published As

Publication number Publication date
US20230105582A1 (en) 2023-04-06
WO2021087526A1 (en) 2021-05-06
CN115769668A (en) 2023-03-07
EP4122179A1 (en) 2023-01-25

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