EP4101036A4 - Diodenlaserverpackung mit langer lebensdauer - Google Patents
Diodenlaserverpackung mit langer lebensdauer Download PDFInfo
- Publication number
- EP4101036A4 EP4101036A4 EP21750248.3A EP21750248A EP4101036A4 EP 4101036 A4 EP4101036 A4 EP 4101036A4 EP 21750248 A EP21750248 A EP 21750248A EP 4101036 A4 EP4101036 A4 EP 4101036A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- long life
- diode laser
- laser packaging
- life diode
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
- H01S5/0021—Degradation or life time measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
- H01S5/02224—Gas-filled housings the gas comprising oxygen, e.g. for avoiding contamination of the light emitting facets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
- H01S5/405—Two-dimensional arrays
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062969541P | 2020-02-03 | 2020-02-03 | |
| PCT/US2021/016462 WO2021158696A1 (en) | 2020-02-03 | 2021-02-03 | Long lifetime laser diode packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP4101036A1 EP4101036A1 (de) | 2022-12-14 |
| EP4101036A4 true EP4101036A4 (de) | 2024-04-17 |
Family
ID=77200623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP21750248.3A Withdrawn EP4101036A4 (de) | 2020-02-03 | 2021-02-03 | Diodenlaserverpackung mit langer lebensdauer |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4101036A4 (de) |
| JP (1) | JP2023513104A (de) |
| CN (1) | CN115349206A (de) |
| WO (1) | WO2021158696A1 (de) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030214987A1 (en) * | 2002-04-03 | 2003-11-20 | Fuji Photo Film Co., Ltd. | Laser module and production process thereof |
| EP1760849A1 (de) * | 2004-06-02 | 2007-03-07 | Matsushita Electric Industrial Co., Ltd. | Halbleiter-laser-bauelement und herstellungsverfahren dafür |
| US20070147449A1 (en) * | 2005-12-27 | 2007-06-28 | Sanyo Electric Co., Ltd. | Semiconductor laser device and manufacturing method thereof |
| WO2018231884A1 (en) * | 2017-06-13 | 2018-12-20 | Nuburu, Inc. | Very dense wavelength beam combined laser system |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60108162T2 (de) * | 2000-10-26 | 2006-01-05 | Atlantium Lasers Ltd. | Desinfektion durch verpackung |
| US6788724B2 (en) * | 2001-07-06 | 2004-09-07 | Intel Corporation | Hermetically sealed external cavity laser system and method |
| JP2004022918A (ja) * | 2002-06-19 | 2004-01-22 | Fuji Photo Film Co Ltd | レーザモジュールの製造方法 |
| US6953291B2 (en) * | 2003-06-30 | 2005-10-11 | Finisar Corporation | Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection |
| JP2005109402A (ja) * | 2003-10-02 | 2005-04-21 | Fuji Photo Film Co Ltd | レーザモジュールおよびその製造方法 |
| JP2005109403A (ja) * | 2003-10-02 | 2005-04-21 | Fuji Photo Film Co Ltd | レーザモジュールの製造方法 |
| JP2006054366A (ja) * | 2004-08-13 | 2006-02-23 | Fuji Photo Film Co Ltd | レーザモジュール |
| US20120273470A1 (en) * | 2011-02-24 | 2012-11-01 | Zediker Mark S | Method of protecting high power laser drilling, workover and completion systems from carbon gettering deposits |
-
2021
- 2021-02-03 JP JP2022547037A patent/JP2023513104A/ja active Pending
- 2021-02-03 EP EP21750248.3A patent/EP4101036A4/de not_active Withdrawn
- 2021-02-03 WO PCT/US2021/016462 patent/WO2021158696A1/en not_active Ceased
- 2021-02-03 CN CN202180025824.2A patent/CN115349206A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030214987A1 (en) * | 2002-04-03 | 2003-11-20 | Fuji Photo Film Co., Ltd. | Laser module and production process thereof |
| EP1760849A1 (de) * | 2004-06-02 | 2007-03-07 | Matsushita Electric Industrial Co., Ltd. | Halbleiter-laser-bauelement und herstellungsverfahren dafür |
| US20070147449A1 (en) * | 2005-12-27 | 2007-06-28 | Sanyo Electric Co., Ltd. | Semiconductor laser device and manufacturing method thereof |
| WO2018231884A1 (en) * | 2017-06-13 | 2018-12-20 | Nuburu, Inc. | Very dense wavelength beam combined laser system |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2021158696A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4101036A1 (de) | 2022-12-14 |
| WO2021158696A1 (en) | 2021-08-12 |
| CN115349206A (zh) | 2022-11-15 |
| JP2023513104A (ja) | 2023-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| STAA | Information on the status of an ep patent application or granted ep patent |
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| 17P | Request for examination filed |
Effective date: 20220816 |
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| AK | Designated contracting states |
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| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230526 |
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| A4 | Supplementary search report drawn up and despatched |
Effective date: 20240320 |
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| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01S 5/40 20060101ALN20240314BHEP Ipc: H01S 5/323 20060101ALN20240314BHEP Ipc: H01S 5/02255 20210101ALN20240314BHEP Ipc: H01S 5/02224 20210101ALN20240314BHEP Ipc: H01S 5/0222 20210101ALN20240314BHEP Ipc: H01S 5/02212 20210101ALN20240314BHEP Ipc: H01S 5/02 20060101ALN20240314BHEP Ipc: H01S 5/022 20210101ALI20240314BHEP Ipc: H01S 5/00 20060101AFI20240314BHEP |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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| 18D | Application deemed to be withdrawn |
Effective date: 20240903 |