EP4100448A1 - High tg acrylate copolymers with nitrogen-containing aromatic heterocyclic group - Google Patents
High tg acrylate copolymers with nitrogen-containing aromatic heterocyclic groupInfo
- Publication number
- EP4100448A1 EP4100448A1 EP21701690.6A EP21701690A EP4100448A1 EP 4100448 A1 EP4100448 A1 EP 4100448A1 EP 21701690 A EP21701690 A EP 21701690A EP 4100448 A1 EP4100448 A1 EP 4100448A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- methacrylate
- tert
- acrylate
- monomer
- butyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001577 copolymer Polymers 0.000 title claims abstract description 62
- 125000006615 aromatic heterocyclic group Chemical group 0.000 title claims abstract description 20
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 title claims description 5
- 239000000178 monomer Substances 0.000 claims abstract description 102
- 239000000853 adhesive Substances 0.000 claims abstract description 68
- 230000001070 adhesive effect Effects 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 12
- 238000010526 radical polymerization reaction Methods 0.000 claims abstract description 11
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims description 132
- 229920000647 polyepoxide Polymers 0.000 claims description 132
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 99
- 239000000203 mixture Substances 0.000 claims description 76
- 239000002390 adhesive tape Substances 0.000 claims description 50
- -1 isobornyl ethacrylate Chemical compound 0.000 claims description 42
- 229920000642 polymer Polymers 0.000 claims description 37
- 239000011159 matrix material Substances 0.000 claims description 32
- 239000004593 Epoxy Substances 0.000 claims description 27
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 22
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 22
- 239000004848 polyfunctional curative Substances 0.000 claims description 22
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 20
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 19
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 17
- 229920001519 homopolymer Polymers 0.000 claims description 17
- 150000003254 radicals Chemical class 0.000 claims description 17
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 13
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 13
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 12
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims description 11
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 11
- ISRJTGUYHVPAOR-UHFFFAOYSA-N dihydrodicyclopentadienyl acrylate Chemical compound C1CC2C3C(OC(=O)C=C)C=CC3C1C2 ISRJTGUYHVPAOR-UHFFFAOYSA-N 0.000 claims description 11
- XFHJDMUEHUHAJW-UHFFFAOYSA-N n-tert-butylprop-2-enamide Chemical compound CC(C)(C)NC(=O)C=C XFHJDMUEHUHAJW-UHFFFAOYSA-N 0.000 claims description 11
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 10
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims description 10
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 claims description 10
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 claims description 10
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 claims description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 10
- 150000003440 styrenes Chemical class 0.000 claims description 10
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 claims description 10
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 claims description 9
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 9
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims description 9
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 claims description 9
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 claims description 9
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 9
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 9
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 8
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 claims description 8
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 8
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 8
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 8
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 8
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 8
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 claims description 8
- SOGAXMICEFXMKE-UHFFFAOYSA-N alpha-Methyl-n-butyl acrylate Natural products CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 7
- RWCHFQMCWQLPAS-UHFFFAOYSA-N (1-tert-butylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C(C)(C)C)CCCCC1 RWCHFQMCWQLPAS-UHFFFAOYSA-N 0.000 claims description 6
- JAMNSIXSLVPNLC-UHFFFAOYSA-N (4-ethenylphenyl) acetate Chemical compound CC(=O)OC1=CC=C(C=C)C=C1 JAMNSIXSLVPNLC-UHFFFAOYSA-N 0.000 claims description 6
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 6
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 5
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 3
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- BGPDZUTXTIWAQM-UHFFFAOYSA-N 2-methylprop-2-enoic acid 2-phenoxyethyl prop-2-enoate Chemical compound O(C1=CC=CC=C1)CCOC(C=C)=O.CC(C(=O)O)=C BGPDZUTXTIWAQM-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 22
- 230000009477 glass transition Effects 0.000 abstract description 6
- 238000001723 curing Methods 0.000 description 38
- 229920005989 resin Polymers 0.000 description 34
- 239000011347 resin Substances 0.000 description 34
- 229920000459 Nitrile rubber Polymers 0.000 description 33
- 238000006243 chemical reaction Methods 0.000 description 31
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 27
- 239000000243 solution Substances 0.000 description 23
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 229920001971 elastomer Polymers 0.000 description 18
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 17
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 16
- 235000014113 dietary fatty acids Nutrition 0.000 description 16
- 239000000194 fatty acid Substances 0.000 description 16
- 229930195729 fatty acid Natural products 0.000 description 16
- 239000007788 liquid Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 229920001169 thermoplastic Polymers 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 150000004665 fatty acids Chemical class 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 239000007787 solid Substances 0.000 description 14
- 239000004823 Reactive adhesive Substances 0.000 description 13
- 238000013329 compounding Methods 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 13
- 125000003700 epoxy group Chemical group 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 239000004416 thermosoftening plastic Substances 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 11
- 239000000806 elastomer Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 238000012546 transfer Methods 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005886 esterification reaction Methods 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 8
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000008346 aqueous phase Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 230000032050 esterification Effects 0.000 description 7
- 239000012299 nitrogen atmosphere Substances 0.000 description 7
- 238000000746 purification Methods 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000004440 column chromatography Methods 0.000 description 6
- 150000002118 epoxides Chemical class 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 235000019198 oils Nutrition 0.000 description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- PMMYEEVYMWASQN-DMTCNVIQSA-N Hydroxyproline Chemical compound O[C@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-DMTCNVIQSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- 230000004913 activation Effects 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 5
- 235000019341 magnesium sulphate Nutrition 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- PNAHKLRTWHKPSP-UHFFFAOYSA-N C(C)OC(C(=C)C)=O.N1C=NC=C1 Chemical group C(C)OC(C(=C)C)=O.N1C=NC=C1 PNAHKLRTWHKPSP-UHFFFAOYSA-N 0.000 description 4
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 4
- 230000003213 activating effect Effects 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- 150000002825 nitriles Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 3
- 229920013646 Hycar Polymers 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 229950000688 phenothiazine Drugs 0.000 description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- WBTMPGTZFSWTAM-UHFFFAOYSA-N (1-butylcyclohexyl) 2-methylprop-2-enoate Chemical compound CCCCC1(OC(=O)C(C)=C)CCCCC1 WBTMPGTZFSWTAM-UHFFFAOYSA-N 0.000 description 2
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical group C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- MLSVJHOYXJGGTR-IFHOVBQLSA-N acetic acid;(2s)-n-[(2r)-1-[(2-amino-2-oxoethyl)amino]-5-(diaminomethylideneamino)-1-oxopentan-2-yl]-1-[(4r,7s,10s,13s,16s)-7-(2-amino-2-oxoethyl)-10-(3-amino-3-oxopropyl)-13-benzyl-16-[(4-hydroxyphenyl)methyl]-6,9,12,15,18-pentaoxo-1,2-dithia-5,8,11,14,1 Chemical compound CC(O)=O.C([C@H]1C(=O)N[C@H](C(N[C@@H](CC(N)=O)C(=O)N[C@@H](CSSCCC(=O)N[C@@H](CC=2C=CC(O)=CC=2)C(=O)N1)C(=O)N1[C@@H](CCC1)C(=O)N[C@H](CCCNC(N)=N)C(=O)NCC(N)=O)=O)CCC(=O)N)C1=CC=CC=C1 MLSVJHOYXJGGTR-IFHOVBQLSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 230000000181 anti-adherent effect Effects 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010382 chemical cross-linking Methods 0.000 description 2
- 238000007385 chemical modification Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 2
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 2
- KLSIXFGCJONDRV-UHFFFAOYSA-N ethyl prop-2-enoate 1H-imidazole Chemical group C(C=C)(=O)OCC.N1C=NC=C1 KLSIXFGCJONDRV-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 229960004488 linolenic acid Drugs 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 2
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000007430 reference method Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229920006135 semi-crystalline thermoplastic polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000003784 tall oil Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 2
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 2
- GWHCXVQVJPWHRF-KTKRTIGZSA-N (15Z)-tetracosenoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-KTKRTIGZSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- URXZXNYJPAJJOQ-FPLPWBNLSA-N (Z)-icos-13-enoic acid Chemical compound CCCCCC\C=C/CCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-FPLPWBNLSA-N 0.000 description 1
- JEUPWQVILXWUFD-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)ethanol Chemical compound OCCC1=NC=CN1 JEUPWQVILXWUFD-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- QZFAGHFGBLEISM-DBQHITQZSA-N 3-[(1r)-1-hydroxy-2-(methylamino)ethyl]phenol;4-[1-hydroxy-2-(propan-2-ylamino)butyl]benzene-1,2-diol;dihydrochloride Chemical compound Cl.Cl.CNC[C@H](O)C1=CC=CC(O)=C1.CC(C)NC(CC)C(O)C1=CC=C(O)C(O)=C1 QZFAGHFGBLEISM-DBQHITQZSA-N 0.000 description 1
- QNDRHEMEDHNOMU-UHFFFAOYSA-N 3-hydroxy-1-phenylpyrrolidine-2,5-dione Chemical compound O=C1C(O)CC(=O)N1C1=CC=CC=C1 QNDRHEMEDHNOMU-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XGAFCCUNHIMIRV-UHFFFAOYSA-N 4-chloropyridine;hydron;chloride Chemical compound Cl.ClC1=CC=NC=C1 XGAFCCUNHIMIRV-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- OPGOLNDOMSBSCW-CLNHMMGSSA-N Fursultiamine hydrochloride Chemical compound Cl.C1CCOC1CSSC(\CCO)=C(/C)N(C=O)CC1=CN=C(C)N=C1N OPGOLNDOMSBSCW-CLNHMMGSSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methyl-N-phenylamine Natural products CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 1
- XJXROGWVRIJYMO-SJDLZYGOSA-N Nervonic acid Natural products O=C(O)[C@@H](/C=C/CCCCCCCC)CCCCCCCCCCCC XJXROGWVRIJYMO-SJDLZYGOSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 235000021319 Palmitoleic acid Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Chemical class 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 235000021322 Vaccenic acid Nutrition 0.000 description 1
- UWHZIFQPPBDJPM-FPLPWBNLSA-M Vaccenic acid Natural products CCCCCC\C=C/CCCCCCCCCC([O-])=O UWHZIFQPPBDJPM-FPLPWBNLSA-M 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- VXTQKJXIZHSXBY-UHFFFAOYSA-N butan-2-yl 2-methylprop-2-enoate Chemical compound CCC(C)OC(=O)C(C)=C VXTQKJXIZHSXBY-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000007707 calorimetry Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- SECPZKHBENQXJG-UHFFFAOYSA-N cis-palmitoleic acid Natural products CCCCCCC=CCCCCCCCC(O)=O SECPZKHBENQXJG-UHFFFAOYSA-N 0.000 description 1
- GWHCXVQVJPWHRF-UHFFFAOYSA-N cis-tetracosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 235000020669 docosahexaenoic acid Nutrition 0.000 description 1
- 229940090949 docosahexaenoic acid Drugs 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- JAZBEHYOTPTENJ-UHFFFAOYSA-N eicosapentaenoic acid Natural products CCC=CCC=CCC=CCC=CCC=CCCCC(O)=O JAZBEHYOTPTENJ-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- HOQGQSLQYIEEJZ-UHFFFAOYSA-N ethyl n,n-dimethylcarbamate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CCOC(=O)N(C)C HOQGQSLQYIEEJZ-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- LQJBNNIYVWPHFW-QXMHVHEDSA-N gadoleic acid Chemical compound CCCCCCCCCC\C=C/CCCCCCCC(O)=O LQJBNNIYVWPHFW-QXMHVHEDSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 235000019988 mead Nutrition 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical class NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- JIWBIWFOSCKQMA-UHFFFAOYSA-N stearidonic acid Natural products CCC=CCC=CCC=CCC=CCCCCC(O)=O JIWBIWFOSCKQMA-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 125000003249 tertiary aromatic amine group Chemical group 0.000 description 1
- 150000003513 tertiary aromatic amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- UWHZIFQPPBDJPM-BQYQJAHWSA-N trans-vaccenic acid Chemical compound CCCCCC\C=C\CCCCCCCCCC(O)=O UWHZIFQPPBDJPM-BQYQJAHWSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- BJDLPDPRMYAOCM-UHFFFAOYSA-N triethoxy(propan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)C BJDLPDPRMYAOCM-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LGROXJWYRXANBB-UHFFFAOYSA-N trimethoxy(propan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)C LGROXJWYRXANBB-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/04—Polymerisation in solution
- C08F2/06—Organic solvent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a single or double bond to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
- C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
- C08F2800/10—Copolymer characterised by the proportions of the comonomers expressed as molar percentages
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the invention relates to a process for radical polymerization for the production of a copolymer with specific monomers A which have a Tg of at least 0 ° C. and specific monomers B which contain an aromatic heterocyclic group which contain at least one nitrogen atom in the ring.
- the invention further relates to the copolymers which are obtained by free radical polymerization, the use of these as accelerators in the curing reagent for adhesives and adhesive tapes which contain them.
- CN 106432584 A discloses acrylate copolymers with imidazole groups, which otherwise consist of low-Tg comonomers such as HEA (-20 ° C), EHA (-58 ° C) and LA (-17 ° C).
- low-Tg comonomers such as HEA (-20 ° C), EHA (-58 ° C) and LA (-17 ° C).
- the typical “rubber-toughening” materials to which this application relates are based on phase-separated low-Tg polymers that can absorb impacts on the hard epoxy network.
- CN 104387525 A1 discloses terpolymers made from three different monomers.
- the polymers contain monomers in proportions of more than 10 mol% which, as homopolymer, have a Tg lower than 0 ° C.
- the process requires that an epoxy polymer is first produced, to which an imidazole derivative is bound in a second step.
- Methyl methacrylate monomers and up to 10% vinyl pyrrolidone, amides, methylolamides, methyloletheramides can exist.
- Monomers with aromatic heterocyclic nitrogen-containing groups are not disclosed.
- US 2011159195 A1 describes acrylate pressure-sensitive adhesives, the polymers being low Tg polymers.
- the polymers by way of example all have a 2-ethylhexyl acrylate of at least 70%, which, as a homopolymer, has a Tg of approx. -56 ° C.
- the abovementioned polymers are not suitable as accelerators which are exposed to high temperatures in the production process. Particularly when manufacturing adhesive tapes from the melt, more energy is introduced into the system than with conventional reactive liquid adhesives. Most of the previously known accelerators do not survive an extrusion step at up to 100 ° C, which prevails in the production from the melt, or are not active enough in their property as accelerators in the final curing.
- the object of the present invention was therefore to provide a stable accelerator, in particular at 100 ° C., which, despite the high temperature stability, has a sufficient accelerating effect, in particular on an epoxy-dicyanamide reaction.
- the object could be achieved by the specific copolymers of the present invention and their production process.
- the invention relates to a copolymer obtainable by free radical polymerization according to the present invention.
- the invention in a third aspect, relates to an adhesive tape comprising at least one layer of a pressure-sensitive adhesive, the adhesive comprising a polymeric film-forming matrix and a curable composition, the curable composition comprising one or more epoxy resins and at least one curing reagent for epoxy resins, characterized in that that the curing reagent comprises at least one copolymer of the present invention and at least one curing agent.
- the present invention relates to the use of the copolymer of the present invention as an accelerator in the curing reagent for adhesives.
- At least one refers to 1 or more, for example 2, 3, 4, 5, 6, 7, 8, 9 or more. In connection with constituents of the compounds described herein, this indication does not refer to the absolute amount of molecules, but to the type of constituent. “At least one monomer A” therefore means, for example, that only one type of monomer A or several different types of monomers A can be included without specifying the amount of the individual compounds. Unless stated otherwise, all of the quantitative data given in connection with the compositions described herein relate to% by weight in each case based on the total weight of the composition. Furthermore, quantities of this type which relate to at least one constituent always relate to the total amount of this type of constituent contained in the composition, unless explicitly stated otherwise. This means that such quantitative data, for example in connection with “at least one monomer A”, relates to the total amount of monomers A contained in the reaction or in the polymer, unless explicitly stated otherwise.
- numeric ranges given in the format "in / from x to y" include the stated values. If several preferred numeric ranges are given in this format, it is understood that all ranges created by the combination of the various endpoints are also recorded.
- molecular weight relates to the weight average molecular weight in g / mol, unless the number average molecular weight is explicitly mentioned.
- Molecular weights are preferably determined by GPC using polystyrene standards.
- the at least one monomer A can preferably have a molecular weight of less than 1000 g / mol, more preferably less than 750 g / mol, most preferably less than 500 g / mol.
- the at least one monomer A is different from the at least one monomer B and, if present, from the at least one monomer C.
- the at least one monomer A does not comprise any nitrogen-containing aromatic heterocyclic group.
- the at least one monomer A is preferably selected from acenaphthylene, maleic anhydride, N-phenylmaleimide, N-vinylpyrrolidone, 2-vinylnaphthalene acrylamide, N-vinylcaprolactam, itaconic anhydride, tert-butyl methacrylate, dihydrodicyclopentadienyl acrylate, dihydrodicyclopentadienyl acrylate, acrylic acid, tert-acrylate, methyl acrylate, tert-acrylate, butyl acrylate, acrylic acid, tert-acrylate, acrylate, acrylate, acrylic ,.
- Styrene and styrene derivatives such as 4-acetoxystyrene, alpha-methylstyrene, 3-methylstyrene, 4-methylstyrene, N, N-dimethylacrylamide, N-tert-butyl acrylamide, N-isopropyl acrylamide, isobornyl acrylate, acrylonitrile, methacrylonitrile, hydroxyethyl methacrylate, cyclohexyl methacrylate, tert-tertiary
- Toloidylureido ethyl methacrylate or mixtures thereof.
- the at least one monomer A is selected from acenaphthylene, maleic anhydride, N-phenylmaleimide, N-vinylpyrrolidone, 2-vinylnaphthalene, acrylamide, N-vinylcaprolactam, itaconic anhydride, tert-butyl methacrylate,
- the at least one monomer A is selected from acenaphthylene, maleic anhydride, N-phenylmaleimide, N-vinylpyrrolidone, 2-vinylnaphthalene, acrylamide, N-vinylcaprolactam, itaconic anhydride, tert-butyl methacrylate,
- Methyl methacrylate, styrene and styrene derivatives such as 4-acetoxystyrene, 3-methylstyrene, 4-methylstyrene, N, N-dimethylacrylamide, N-tert-butylacrylamide, N-isopropylacrylamide,
- the at least one monomer A is selected from acenaphthylenes, maleic anhydride, N-phenylmaleimide, N-vinylpyrrolidone, 2-vinylnaphthalene, acrylamide, N-vinylcaprolactam, itaconic anhydride, tert-butyl methacrylate,
- Methyl methacrylate, styrene and styrene derivatives such as 4-acetoxystyrene, 3-methylstyrene, 4-methylstyrene, N, N-dimethylacrylamide, N-tert-butylacrylamide, N-isopropylacrylamide,
- a monomer A is N-phenylmaleimide and the further monomer A is selected from acenaphthylenes, maleic anhydride, N-vinylpyrrolidone, 2-vinylnaphthalene, acrylamide, N-vinylcaprolactam, itaconic anhydride, tert-butyl methacrylate, dihydrodicyclopentadienyl acrylate,
- the at least one monomer A is preferably contained in 30 to 70 mol%, more preferably 35 to 60 mol%, in particular 35 to 60 mol%, based on the total monomers of the copolymer.
- the at least one monomer B preferably has a molecular weight of less than 2000 g / mol, preferably less than 1500 g / mol, more preferably less than 1000 g / mol.
- the at least one monomer B contains, as an aromatic heterocyclic group which contains at least one nitrogen atom in the ring, imidazole, pyridine or derivatives thereof, more preferably imidazole or derivatives thereof.
- the respective derivatives of pyridine and imidazole are derived, with one or more Hydrogen atoms can be replaced by alkyl radicals or other organic groups such as, for example, ketone or aldehyde radicals, in particular methyl, ethyl, propyl, butyl, pentyl and hexyl.
- Substituted here means that one or more hydrogen atoms of the respective alkyl unit can be replaced by -F, -Cl, -Br, -CH 3 , -CH 2 CH 3 , -OH or -CF 3 .
- An unsubstituted alkyl unit is preferably present in each case.
- Substituted here means that one or more hydrogen atoms of the respective alkyl unit can be replaced by -F, -Cl, -Br, -CH 3 , -CH 2 CH 3 , -OH or -CF 3 .
- An unsubstituted alkyl unit is preferably present in each case.
- the backbone is understood to be the longest chain of the polymer which results from the polymerization of the unsaturated double bonds of monomers A and B and optionally C.
- Backbone spacer group with 4 atoms In the following a non-limiting example for the backbone and a spacer group with 4 atoms is shown: Backbone spacer group with 4 atoms
- the monomer B does not contain an —OH radical.
- the at least one monomer B is selected from imidazole ethyl methacrylate, imidazole ethyl acrylate, 2-methylimidazole ethyl methacrylate, 2-methylimidazole ethyl acrylate, methylaminopyridine ethyl methacrylate, methylaminopyridine ethyl acrylate, vinylimidazole, imidazole ethyl urethane methacrylate) or mixtures thereof, N-methyl-4-methyl-N-ethyl-methacrylate, N-methyl-N-methyl-urethane methacrylate, N-methyl-N-methyl-N-ethyl acrylate, N-methyl in particular imidazole ethyl methacrylate, imidazole ethyl acrylate, 2-methylimidazole ethyl methacrylate, 2-methylimidazole ethyl acrylate,
- Methyl aminopyridine ethyl methacrylate methyl aminopyridine ethyl acrylate, or mixtures thereof.
- the at least one monomer B is preferably contained in 20 to 70 mol%, more preferably 25 to 60 mol%, in particular 35 to 60 mol%, based on the total monomers of the copolymer.
- the monomers A to the monomers B are present in a molar ratio of 30 to 60 to 40 to 70, preferably 40 to 60 to 40 to 60.
- the reaction takes place in the presence of at least one free radical initiator.
- All radical initiators known to the person skilled in the art in the field of radical polymerization are suitable. These include UV radical initiators, which are activated by means of UV radiation, and thermal radical initiators, which are thermally activated.
- UV radical initiators which are activated by means of UV radiation
- thermal radical initiators which are thermally activated.
- Free radical initiators that are used for the polymerization of (meth) acrylates.
- the at least one free-radical initiator is azobisisobutyronitrile.
- the at least one free radical initiator is present in less than 10 mol%, preferably in at most 5 mol%, based on the sum of the monomers A to C, which is 100 mol%.
- the reaction is preferably carried out in at least one organic solvent, preferably selected from toluene, acetone, butanone, ethyl acetate, 2-propanol, dimethylformamide and mixtures thereof.
- organic solvent preferably selected from toluene, acetone, butanone, ethyl acetate, 2-propanol, dimethylformamide and mixtures thereof.
- reaction is preferably carried out under a protective gas atmosphere, in particular under a nitrogen or argon atmosphere.
- At least one regulator can also be used in the reaction; this is preferably mercaptoethanol.
- the at least one regulator is contained preferably in less than 10 mol%, preferably in at most 5 mol%, based on the sum of the monomers A to C, which are 100 mol%.
- the polymerization is preferably carried out with heating, more preferably at a temperature of at least 35 ° C, even more preferably at least 50 ° C, most preferably at least 65 ° C, the temperature preferably not being higher than 120 ° C.
- the reaction time is at least 1 hour, preferably at least 6 hours, more preferably at least 22 hours.
- the free radical polymerization of the present invention will contain a copolymer, which is also an object of the invention.
- the copolymer obtained preferably has a Tg of 40 to 200 ° C., measured by means of DSC.
- a Tg which is at least 20 ° C. above the processing temperature is preferred, in particular for shelf life.
- the Tg of the copolymer is correspondingly preferably greater than 100 ° C., but in order to achieve the highest possible reactivity, the Tg of the copolymer is ideally lower than the curing temperature. This means that at a curing temperature of 160 ° C, 140 ° C or, for example, 130 ° C, the Tg is correspondingly less than 160 ° C, less than 140 ° C or less than 130 ° C.
- the Tg is also preferably at least 20 ° C higher than the storage temperature, ie the Tg for room temperature storage (20 ° C) is at least 40 ° C. If higher temperatures are reached in the transport process, the Tg is correspondingly preferably 60 ° C, in particular 80 ° C.
- the copolymer preferably has a weight-average molecular weight Mw of at least 1000 g / mol, more preferably 2000 g / mol. A particularly good compromise between long shelf life and reactivity is achieved if the molecular weight is not greater than 500,000 g / mol, in particular 200,000 g / mol, and is preferably between 2000 and 100,000 g / mol.
- the inventive copolymer obtained is used as an accelerator in the curing reagent for adhesives, in particular epoxy-based adhesives.
- the invention further relates to an adhesive tape comprising at least one layer of a pressure-sensitive adhesive, the adhesive comprising a polymeric film-forming matrix and a curable composition, the curable composition comprising one or more epoxy resins and at least one curing reagent for epoxy resins, characterized in that the curing reagent comprises at least one copolymer according to the present invention and at least one hardener.
- At least one of the epoxy resins of the curable composition is an elastomer-modified, in particular nitrile rubber-modified epoxy resin, and / or a fatty acid-modified epoxy resin.
- thermoplastic polyurethanes or one or more non-thermoplastic elastomers are used wholly or partially as the polymeric film-forming matrix.
- the copolymers of the present invention are also referred to as accelerators.
- a hardening reagent contains at least one copolymer, that is to say accelerator, of the present invention and at least one hardener.
- the curing of the adhesive takes place in particular via the reaction of one or more reactive resins with one or more copolymers and hardeners according to the invention.
- the curable composition comprises at least one epoxy resin as reactive resin, but can also comprise several epoxy resins.
- the one epoxy resin or the several epoxy resins can be the only reactive resins in the curable composition, in particular the only components of the curable composition that can lead to curing of the composition with the curing reagent - if necessary after appropriate activation.
- further reactive resins that are not epoxy resins to be present in addition to the epoxy resin or in addition to the epoxy resins.
- the epoxy resin (s) used are, for example and advantageously, one or more elastomer-modified, in particular nitrile rubber-modified, epoxy resins and / or one or more silane-modified epoxy resins and / or one or more fatty acid-modified epoxy resins.
- Reactive resins are crosslinkable resins, namely oligomers or short-chain polymeric compounds comprising functional groups, in particular with a number-average molar mass M n of not more than 10,000 g / mol; and in particular those with several functional groups in the macromolecule. Since the resins are a distribution of macromolecules of different individual masses, the reactive resins can contain fractions whose number-average molar mass is significantly higher, for example up to about 100,000 g / mol; this applies in particular to polymer-modified reactive resins, such as elastomer-modified reactive resins.
- Reactive resins differ from tackifier resins frequently used for adhesives, in particular for pressure-sensitive adhesives.
- an “adhesive resin” is understood to mean an oligomeric or polymeric resin that only the adhesion (the tack, the inherent tack) of the PSA in comparison to none Increased pressure sensitive adhesive containing adhesive resin but otherwise identical.
- adhesive resins typically, apart from double bonds (in the case of the unsaturated resins), adhesive resins contain no reactive groups, since their properties should not change over the life of the pressure-sensitive adhesive.
- the functional groups of the reactive resins are such that, under suitable conditions - in particular after activation, for example by increased temperature (thermal energy) and / or by actinic radiation (such as light, UV radiation, electron beams, etc.) and / or by initiation and / or catalysis by further chemical compounds, such as water (moisture-curing systems) - with a curing reagent lead to curing of the composition comprising the reactive resins and the curing reagent, in particular in the sense of a crosslinking reaction.
- thermal energy thermal energy
- actinic radiation such as light, UV radiation, electron beams, etc.
- further chemical compounds such as water (moisture-curing systems) - with a curing reagent lead to curing of the composition comprising the reactive resins and the curing reagent, in particular in the sense of a crosslinking reaction.
- epoxy resins are reactive resins comprising epoxy groups, in particular those with more than one epoxy group per molecule, that is to say those reactive resins in which the functional groups or at least some of the functional groups are epoxy groups.
- the conversion of the epoxy resins during the hardening reaction of the hardenable composition takes place in particular via polyaddition reactions with suitable epoxy hardeners or via polymerization via the epoxy groups. Depending on the choice of epoxy hardener, both reaction mechanisms can take place in parallel.
- the hardener is the chemical compound (s) that act as a binder and that is (are) added to the crosslinkable resins in order to ensure the hardening (crosslinking) of the curable composition, in particular in the form of an applied film.
- hardener is accordingly the designation for that component which, after being mixed with the reactive resins and activated accordingly, brings about the chemical crosslinking.
- accelerators are those chemical compounds which, in the presence of another hardener, increase the reaction rate of the hardening reaction and / or the rate of activation of the hardening of the epoxy resins, in particular in the sense of a synergism.
- the hardener system of the present invention contains at least one copolymer according to the present invention as accelerator.
- the curable composition of the adhesive tape according to the invention is preferably an adhesive, in particular a reactive adhesive, particularly preferably an adhesive or reactive adhesive which is pressure-sensitive at room temperature (23 ° C.).
- Adhesives are (according to DIN EN 923: 2008-06) non-metallic substances that connect parts to be joined through surface adhesion and internal strength (cohesion). Adhesives can be self-adhesive and / or develop their final bond strength only through certain activation, for example through thermal energy and / or actinic radiation. Reactive adhesives (which can be self-adhesive or non-adhesive before activation) comprise chemically reactive systems which, when activated, lead to a curing reaction and can develop particularly high adhesive strengths (in particular greater than 1 MPa) to the substrates to which they are bonded.
- the hardening or solidification is achieved through a chemical reaction of the building blocks with one another.
- pressure-sensitive adhesives which are also regularly crosslinked to increase cohesion, but still have viscoelastic properties after crosslinking and, in particular, no longer experience solidification after bonding, with reaction adhesives, as a rule, curing leads to the actual bonding with the desired bond strengths; the adhesive itself is often thermoset or largely thermoset ("paint-like") after curing.
- pressure-sensitive also as a component of nouns such as in pressure-sensitive adhesive - or synonymously with the attribute "self-adhesive” - also as a component of nouns - in the context of this document
- those compositions are referred to that are already under relatively weak pressure - if if not stated otherwise, at room temperature, i.e. 23 ° C - allow a permanent connection with the primer and can be removed from the primer after use, essentially without leaving any residue.
- Pressure-sensitive adhesives are preferably used in the form of adhesive tapes.
- a pressure-sensitive adhesive tape has a bond strength in the uncured state of at least 1 N / cm.
- the bond strength here is determined on steel analogously to ISO 29862: 2007 (method 3) at 23 ° C. and 50% relative humidity at a peel speed of 300 mm / min and a peel angle of 180 °.
- Gluing a 2 cm wide The measuring strip is made using a rolling machine weighing 4 kg at a temperature of 23 ° C. The tape is peeled off immediately after application. The measured value (in N / cm) was the mean value from three individual measurements.
- Pressure-sensitive adhesives thus have a permanently tacky effect at room temperature, that is to say they have a sufficiently low viscosity and high tack so that they wet the surface of the respective adhesive base even with a slight pressure.
- the adhesiveness of the pressure-sensitive adhesives is based on their adhesive properties and the redetachability on their cohesive properties.
- Pressure-sensitive reactive adhesives have pressure-sensitive adhesive properties at room temperature (and are especially viscoelastic in this state), but exhibit the behavior of reactive adhesives during and after curing.
- the curable composition in particular the pressure-sensitive adhesive, is used in film or preferably in layer form as a component of an adhesive tape.
- the curable composition in particular the pressure-sensitive adhesive
- the curable composition is preferably applied as a layer to a permanent or a temporary carrier, in particular using the coating processes known to the person skilled in the art.
- the coating of the web-like material is preferably carried out solvent-free, for example by means of nozzle coating or with a multi-roller applicator. This can be done particularly effectively and advantageously with a 2- to 5-roller applicator, for example with a 4-roller applicator, so that the self-adhesive mass is shaped to the desired thickness when passing through one or more roller gaps before transfer to the web-like material.
- the rollers of the applicator can be individually tempered, for example set to temperatures of 20 ° C to 150 ° C.
- Permanent carriers are, in particular, permanent components of single- or double-sided adhesive tapes in which one or both of the outer surfaces of the adhesive tape is formed by an (pressure-sensitive) adhesive layer.
- the adhesive layers can be covered with anti-adhesive separating layers, such as siliconized papers, which are removed in each case for bonding.
- adheresive tape thus encompasses, on the one hand, a carrier material which is provided with an (pressure-sensitive) adhesive on one or both sides and can optionally have further layers in between.
- adhesive tape in the context of the present invention encompasses so-called “transfer adhesive tapes”, that is to say adhesive tapes without a permanent carrier, in particular single-layer adhesive tapes without a permanent carrier.
- Such adhesive transfer tapes according to the invention are applied to a temporary carrier prior to application.
- flexible sheet-like materials plastic films, papers or the like
- a separating layer for example siliconized
- anti-adhesive properties so-called separating materials, liners or release liners
- Temporary carriers are used in particular to make single-layer or otherwise non-self-supporting adhesive tapes - that is, in particular only composed of the (pressure-sensitive) adhesive layer - manageable and to protect.
- the temporary carrier can be easily removed and is removed during use (usually after the free adhesive tape surface has been applied to the first substrate and before the other, initially covered, adhesive tape surface is bonded to the second substrate), so that the adhesive layer is used as a double-sided adhesive tape can be.
- Adhesive transfer tapes according to the invention can, before application, also have two temporary carriers, between which the adhesive is present as a layer. For application, a liner is then regularly first removed, the adhesive applied and then the second liner removed. The adhesive can thus be used directly to connect two surfaces.
- carrierless adhesive transfer tapes are particularly preferred according to the invention. With such a tacky, backing-free adhesive transfer tape according to the invention, an adhesive bond that is very precise in terms of positioning and dosing is made possible.
- Adhesive tapes are also possible in which one does not work with two liners, but with a single liner equipped with double-sided separation.
- the upper side of the adhesive tape web is then covered with one side of a double-sided separating liner, its underside with the back of the double-sided separating liner, in particular an adjacent turn on a bale or roll.
- adhesive tapes differ - regardless of whether they have a carrier or are without a carrier, i.e. adhesive transfer tapes - from layers of adhesive that are present on a substrate as a liquid adhesive, for example, in that the adhesive tapes are self-supporting, i.e. can be handled as an independent product.
- the The layer of adhesive has sufficient cohesion on and / or the entirety of the layers forming the adhesive tape, in particular, sufficient stability.
- Adhesive tapes that are coated on one or both sides with adhesives are usually wound or cross-wound into a roll in the form of an Archimedean spiral at the end of the manufacturing process.
- the adhesive tapes if not already present on a liner, can advantageously be or covered on both sides with a liner that is rolled up together with the adhesive tape.
- liners are also used to cover pure adhesive compounds (adhesive transfer tape) and sections of adhesive tape (e.g. labels). These liners also ensure that the adhesive is not soiled before use.
- the adhesive tape according to the invention comprises a polymeric film-forming matrix in which the curable composition, which comprises at least one epoxy resin and at least one curing reagent for the epoxy resin, is contained.
- Such adhesive tapes thus comprise an adhesive film which is basically formed from a polymeric film-forming matrix (referred to as “film-forming matrix” for short in this document) with the curable composition embedded therein, which serves in particular as a reactive adhesive.
- the film-forming matrix forms a self-supporting three-dimensional film (the spatial expansion in the thickness direction of the film is usually much smaller than the spatial expansion in the longitudinal and transverse directions, i.e. than in the two spatial directions of the surface area of the film; of importance of the term “film”, see also below).
- the curable composition in particular the reactive adhesive, is preferably essentially spatially evenly distributed (homogeneously), in particular so that the reactive adhesive - which might not be self-supporting without the matrix - has essentially the same (macroscopic) spatial distribution in the adhesive film according to the invention like the film-forming matrix.
- this matrix is to form an inert basic structure for the reactive monomers and / or reactive resins so that these are embedded in a film or a foil. This means that otherwise liquid systems can also be offered in film form. That way easier handling is guaranteed.
- the polymers on which the film-forming matrix is based are able to form a self-supporting film through sufficient interactions between the macromolecules, for example - without wishing to restrict the concept of the invention unnecessarily - through the formation of a network based on physical and / or chemical crosslinking .
- Inert means in this context that the reactive monomers and / or reactive resins essentially do not react with the polymeric film-forming matrix under suitably selected conditions (for example at sufficiently low temperatures).
- Suitable film-forming matrices for use in the present invention are preferably a thermoplastic homopolymer or a thermoplastic copolymer (collectively referred to as “polymers” in this document), or a blend of thermoplastic homopolymers or thermoplastic copolymers or one or more thermoplastic Homopolymers with one or more thermoplastic copolymers. In a preferred procedure, completely or partially semicrystalline thermoplastic polymers are used.
- thermoplastic polymers for example polyesters, copolyesters, polyamides, copolyamides, polyacrylic acid esters, acrylic acid ester copolymers, polymethacrylic acid esters, methacrylic acid ester copolymers, thermoplastic polyurethanes and chemically or physically crosslinked substances of the aforementioned compounds can be chosen.
- the polymers mentioned can each be used as the only polymer used or as a component of a blend.
- thermoplastic elastomers and - as representatives of the thermoplastic polymers already mentioned - thermoplastic elastomers alone or in a mixture as a polymeric film-forming matrix are conceivable.
- Thermoplastic elastomers, in particular semicrystalline, are preferred.
- the named - in particular thermoplastic - elastomers can each be used as the only polymer used or as a component of a blend, for example with further elastomers and / or thermoplastic elastomers and / or other thermoplastic polymers, such as those mentioned in the preceding paragraph.
- Thermoplastic polymers with softening temperatures below 100 ° C. are particularly preferred.
- softening temperature stands for the temperature from which the thermoplastic granulate sticks to itself. If the component is If the polymeric film former matrix is a semicrystalline thermoplastic polymer, then it very preferably has a glass transition temperature of at most 25 ° C., preferably at most 0 ° C., in addition to its softening temperature (which is related to the melting of the crystallites).
- thermoplastic polyurethane In a preferred embodiment according to the invention, a thermoplastic polyurethane is used.
- the thermoplastic polyurethane preferably has a softening temperature of less than 100.degree. C., in particular less than 80.degree.
- Desmomelt 530® is used as a polymeric film-forming matrix, which is commercially available from Bayer Material Science AG, 51358 Leverkusen, Germany. Desmomelt 530® is a hydroxyl-terminated, largely linear, thermoplastic, strongly crystallizing polyurethane elastomer.
- the amount of the polymeric film-forming agent matrix within a reactive adhesive film is preferably in the range from about 15 to 60% by weight, preferably from about 30 to 50% by weight, based on the total amount of polymers of the polymeric film-forming matrix and reactive resins of the curable composition .
- Adhesives with particularly high bond strengths after curing are obtained when the proportion of the film-forming matrix is in the range from 15 to 25% by weight.
- Such adhesives, in particular with less than 20% film-forming matrix are very soft and less dimensionally stable in the uncured state.
- the dimensional stability is improved if more than 20% by weight, in particular more than 30%, are used. Between 40 and 50% by weight pressure-sensitive adhesives are obtained which exhibit the best properties with regard to dimensional stability, but the maximum achievable bond strength drops. Very balanced adhesives with regard to dimensional stability and bond strength are obtained in the range from 30 to 40% by weight of film-forming matrix.
- the above% by weight figures are in each case based on the sum of the polymers and epoxy resins forming the film-forming matrix.
- non-thermoplastic elastomers are used as matrix polymers.
- the non-thermoplastic elastomers can in particular be a nitrile rubber or a mixture of several nitrile rubbers or act as a mixture of one or more other non-thermoplastic elastomers with one or more nitrile rubbers.
- Non-thermoplastic in the context of the present specification is understood to mean those substances or compositions which, when heated to a temperature of 150 ° C, preferably when heated to a temperature of 200 ° C, very preferably when heated to a temperature of 250 ° C show no thermoplastic behavior, in particular in such a way that they are not considered thermoplastic in the thermoplasticity test (see experimental part).
- nitrile rubber stands for "acrylonitrile butadiene rubber", the abbreviation NBR, derived from nitrile butadiene rubber, and denotes synthetic rubbers that are produced by copolymerizing acrylonitrile and butadiene in mass ratios of approximately 10:90 to 52:48 (acrylonitrile : Butadiene) can be obtained.
- NBR acrylonitrile butadiene rubber
- Nitrile rubbers are produced almost exclusively in an aqueous emulsion.
- the resulting emulsions are used as such (NBR latex) on the one hand or worked up to solid rubber on the other.
- nitrile rubber The properties of nitrile rubber depend on the ratio of the starting monomers and on its molar mass. Vulcanizates made from nitrile rubber have a high resistance to fuels, oils, fats and hydrocarbons and are distinguished from those made from natural rubber by their more favorable aging behavior, lower abrasion and reduced gas permeability.
- Niril rubbers are available in a wide range. In addition to the acrylonitrile content, the different types are distinguished in particular on the basis of the viscosity of the rubber. This is usually indicated by the Mooney viscosity. This in turn is determined on the one hand by the number of chain branches in the polymer and on the other hand by the molar mass. In principle, a distinction is made between so-called cold and hot polymerization in polymerization. The cold polymerization is usually carried out at temperatures of 5 to 15 ° C. and, in contrast to the hot polymerization, which is usually carried out at 30 to 40 ° C., leads to a lower number of chain branches. Nitrile rubbers suitable according to the invention are available from a large number of manufacturers such as, for example, Nitriflex, Zeon, LG Chemicals and Lanxess.
- Carboxylated nitrile rubber types are produced by the terpolymerization of acrylonitrile and butadiene with small amounts of acrylic acid and / or methacrylic acid in emulsion. They are characterized by high strength.
- Vulcanization takes place with common sulfur crosslinkers, peroxides or by means of high-energy radiation.
- liquid nitrile rubbers In addition to carboxylated or hydrogenated nitrile rubbers, there are also liquid nitrile rubbers. These are limited in their molar mass during the polymerization by the addition of polymerization regulators and are therefore obtained as liquid rubbers.
- inert separating aids such as talc, silicates (talc, clay, mica), zinc stearate and PVC powder are often added to the rubbers.
- the non-thermoplastic elastomers used are partially or exclusively those nitrile rubbers which have an acrylonitrile content of at least 25%, preferably at least 30%, very preferably at least 35%.
- Hot-polymerized nitrile rubbers can be used excellently as matrix polymers. Such nitrile rubbers are highly branched and therefore have a particularly high tendency towards physical crosslinking and thus show particularly good shear strengths even in the uncured state.
- the hardening reagent comprises all of the present accelerators and at least one hardener, with at least one copolymer according to the invention being present as accelerator.
- Copolymers according to the invention usually do not have to be used in stoichiometric amounts, based on the functionality of the epoxy resin to be cured, in order to develop a good effect.
- Typical amounts used are 15 to 35 parts by weight per 100 parts by weight of the epoxy resin (s) to be cured. If several copolymers according to the invention are used, the sum of the amounts used is advantageously in the abovementioned range.
- the amount used of the copolymers according to the invention is preferably in the range from 0.1 to 10 parts by weight, in particular from 0.5 to 5 parts by weight, preferably from 1 to 3 parts by weight, based in each case on 100 parts by weight .
- -Parts of the epoxy resin (s) to be cured - especially if the copolymer - for example in combination with Dicyandiamide, - are used.
- amounts in the range of 4-8 parts by weight are advantageously used.
- compositions can also contain at least one further accelerator different from the copolymers of the present invention in the curing reagent. These are known to those skilled in the art of curable adhesives.
- the curing reagent comprises - in addition to the copolymer (s) according to the invention - one or more hardeners for the epoxy resins and optionally one or more further accelerators for the curing reaction of the epoxy resins, these hardeners or accelerators not being copolymers according to the invention.
- reaction products from diacids and multifunctional amines are, for example, reaction products from phthalic acid and diethylenetriamine.
- the curing reagent comprises dicyandiamide and one or more copolymer (s) according to the invention.
- the curing reagent consists exclusively of dicyandiamide and one or more copolymers according to the invention.
- the at least one copolymer according to the invention takes on the effect of an accelerator, i.e. increases the reaction rate of the curing reaction of the epoxy resin compared to the situation in which dicyandiamide would be the only component of the curing reagent.
- the invention thus furthermore relates to an adhesive tape comprising at least one layer of a pressure-sensitive adhesive, the adhesive comprising a polymeric film-forming matrix and a curable composition, the curable composition comprising at least one epoxy resin and at least one curing reagent for the epoxy resin, and the curing reagent i) comprises or consists of at least one copolymer according to the invention and ii) dicyandiamide.
- Stoichimetric hardeners such as dicyandiamide are preferably used based on the amount of epoxy in the adhesive.
- m H AEW * (mi / EEWges)
- the copolymer (s) according to the invention acting as accelerator is / are then advantageously from 0.1 to 10 parts by weight, in particular from 0.5 to 5 parts by weight, preferably from 1 to 3 parts by weight Parts used, each based on 100 parts by weight of the epoxy resin to be cured. In some cases - especially when the copolymers according to the invention are a somewhat weaker accelerator - amounts in the range from 4 to 8 parts by weight are used.
- a single epoxy resin or a mixture of epoxy resins can be used as the epoxy resin (s) of the curable composition.
- epoxy resins which are liquid at room temperature or epoxy resins which are solid at room temperature or mixtures thereof can be used.
- the one epoxy resin or at least one of the epoxy resins is preferably a solid; in particular one with a softening temperature of at least 45 ° C or one with a viscosity at 25 ° C of at least 20 Pa s, preferably 50 Pa s, in particular at least 150 Pa s (measured according to DIN 53019-1; 25 ° C, shear rate 1 xs _1 ).
- the epoxy resins comprise a mixture of epoxy resins that are liquid at 25.degree. C. and that are solid at 25.degree.
- the proportion of the liquid epoxy resins in the epoxy hearts (E) is in particular from 10 to 90% by weight, more preferably from 20 to 75% by weight.
- the respective difference to 100% by weight of the epoxy resins is then given by solid epoxy resins.
- Adhesive tapes with such proportions of liquid and solid epoxy components show particularly balanced adhesive properties in the uncured state. If an adhesive tape with particularly good flow properties is desired, the proportion of liquid epoxy components is preferably 50 to 80% by weight. For applications in which the adhesive tapes have to bear a higher load even in the uncured state, a proportion of 15 to 45% by weight is particularly preferred. Such a resin or a mixture of different resins can be used.
- the epoxy resins further preferably comprise at least two different epoxy resins (E-1) and (E-2), of which a.
- the first epoxy resin (E-1) has a dynamic viscosity of less than 500 Pa * s at 25 ° C., measured according to DIN 53019-1 at a measurement temperature of 25 ° C. and a shear rate of 1 ⁇ s 1 , and b.
- the second epoxy resin (E-2) has a softening temperature of at least 45 ° C or at 25 ° C a dynamic viscosity of at least 1000 Pa * s, measured according to DIN 53019-1 at a measuring temperature of 25 ° C and a shear rate of 1 xs 1 , where in particular the proportion of the first epoxy resin (E-1) 10 to 90% by weight, preferably 20 to 75% by weight and the proportion of the second epoxy resin (E-2) 10 to 90% by weight, is preferably 25 to 80 wt .-%, based on the total of epoxy resins.
- the epoxy resin component advantageously consists of these two epoxy resins (E-1) and (E-2), so that the proportion of the two epoxy resins (E-1) and (E-2) in the total epoxy resin is 100% by weight add.
- Particularly good pressure-sensitive adhesives are obtained when the proportion of epoxy resin (E2) is in the range from 40 to 80% by weight, in particular from 60 to 75% by weight.
- the proportion of epoxy resins (E-2) which have a softening temperature of at least 45 ° C. is at least 35% by weight, in particular in the range from 40 to 70% by weight.
- the cohesion of the uncrosslinked pressure-sensitive adhesives while still having sufficient pressure-sensitive adhesiveness is particularly good if the proportion of epoxy resins with a softening temperature of at least 45 ° C. is at least 15% by weight, in particular in the range from 20% by weight to 75% by weight is based on the total epoxy resin.
- the flow behavior is improved if it contains less than 55% by weight, in particular between 25% by weight and 45% by weight.
- Epoxy resins to be used advantageously as epoxy resin or as part of the totality of epoxy resins are, for example, elastomer-modified epoxy resins, silane-modified epoxy resins or fatty acid-modified epoxy resins.
- elastomer-modified epoxy resins for the purposes of the present invention are - in particular liquid, usually highly viscous - epoxy resins with an average functionality of at least two and an elastomer content of up to 50 wt .-%, preferably with such a functionality of 5 - 40 wt .-% , to understand.
- the epoxy groups can be terminal and / or arranged in the side chain of the molecule.
- the elastomeric structural component of these flexibilized epoxy resins consists of polyenes, diene copolymers and polyurethanes, preferably of polybutadiene, butadiene-styrene or butadiene-acrylonitrile copolymers.
- An epoxy resin modified by butadiene-acrylonitrile copolymers is, for example, an epoxy prepolymer which is obtained by modifying an epoxy resin with at least two epoxy groups in the molecules with a nitrile rubber.
- a reaction product of glycerol or propylene glycol and a halogen-containing epoxy compound, such as epichlorohydrin, or the reaction product of a polyhydric phenol, such as hydroquinone, bisphenol-A, and a halogen-containing epoxide is advantageously used as the epoxy base.
- a reaction product of a bisphenol A type epoxy resin having two terminal epoxy groups is desirable.
- nitrile rubbers a third monomer with an acid function - for example acrylic acid - can also be polymerized.
- CTBN carboxy-terminated nitrile rubbers
- these compounds contain acid groups not only at the ends, but also along the main chain.
- CTBN are offered, for example, under the trade name Hycar from B. F. Goodrich. These have molecular weights between 2000 and 5000 and acrylonitrile contents between 10% and 30%. Specific examples are Hycar CTBN 1300 x 8, 1300 x 13 or 1300 x 15.
- ETBN epoxy-terminated nitrile rubbers
- An example of an epoxy-terminated butadiene rubber is Hypro 2000X174 ETB.
- elastomer-modified epoxy-functional compounds are a reaction product of a diglycidyl ether of neopentyl alcohol and a butadiene / acrylonitrile elastomer with carboxyl ends (e.g. EPONTM Resin 58034 from Resolution Performance Products LLC), a reaction product of a diglycidyl ether of bisphenol A and a butadiene / acrylonitrile elastomer with carboxyl ends (e.g. EPON TM Resin 58006 from Resolution Performance Products LLC), a butadiene / acrylonitrile elastomer with carboxyl ends (e.g.
- CTBN-1300X8 and CTBN-1300X13 from Noveon , Inc., Cleveland, Ohio) and an amine-terminated butadiene / acrylonitrile elastomer e.g., ATBN-1300X16 and ATBN-1300X42 from Noveon, Inc.
- An example of the elastomer-modified epoxy resin adduct is the reaction product of an epoxy resin based on bisphenol F and a butadiene / acrylonitrile elastomer with carboxyl ends (e.g. EPON TM Resin 58003 from Resolution Performance Products LLC).
- the proportion of elastomer-modified epoxy resins based on the total amount of epoxy resins in the curable composition can be between 0 and 100%.
- proportions - such as, for example, 0 to 15% by weight - are chosen.
- adhesives with high elongation values are obtained if the proportion is greater than 40% by weight, in particular greater than 60% by weight.
- proportions between 20 to 60% by weight, in particular 30 to 50% by weight are preferred.
- Silane-modified epoxy resins can be used very advantageously as further suitable representatives for the epoxy resins.
- a single silane-modified epoxy resin or two, three or even more silane-modified epoxy resins can be present in the curable composition.
- the curable composition can be limited to the silane-modifiable epoxy resin (s) as curable reactive resins.
- other epoxy resins can also be present, which not silane-modified - for example elastomer-modified, in particular nitrile rubber-modified - epoxy resins and / or fatty acid-modified epoxy resins, as detailed in detail in this document - and / or reactive resins that are not epoxy resins.
- silane-modified epoxy resin is present, this can in particular be selected from the silane-modified epoxy resins described below as being preferred. If several silane-modified epoxy resins are present, at least one of the epoxy resins is advantageously one of the compounds described below as preferred silane-modified epoxy resins. Further preferred are all silane-modified epoxy resins such as are described below as being preferred.
- the chemical modification of epoxy resins can be used to control the properties of adhesives.
- Modified epoxy resins according to the invention are selected in particular from silane-modified epoxy resins.
- Silane group-modified epoxy resins are epoxy resins to which one or more silane groups are chemically bonded.
- the epoxy resin used is a silane-modified epoxy resin that is obtainable by dealcoholization condensation reaction between a bisphenol epoxy resin and a hydrolyzable alkoxysilane.
- Such epoxy resins are described, for example, in EP 1114834 A, the disclosure content of which is intended to be incorporated into the present document by reference.
- the bisphenol epoxy resin can advantageously be selected in such a way that it has an epoxy equivalent weight of more than 180 g / eq, and preferably of less than 5000 g / eq.
- the epoxy equivalent weight (abbreviation EEW) is a characteristic and important parameter for epoxy resins or epoxy crosslinkers. According to DIN EN ISO 3001: 1999-11, the epoxy equivalent weight indicates the solid content of the substance in question in grams per epoxy group. It is preferred to use epoxy resins with an EEW> 180 g / eq, since otherwise there may not be sufficient hydroxyl groups for the condensation reaction with the alkoxysilanes.
- the bisphenol-epoxy resin for reaction with the hydrolyzable alkoxysilane is preferably a compound corresponding to the following formula used. As a rule, this is a mixture of corresponding compounds of the above bisphenol-epoxy resin formula with a varying number of repetitions m of the unit in square brackets.
- the bisphenol-epoxy resin is selected in particular in such a way that the average is from m 0.07 to 16.4, i.e. the number-average molar masses are between approximately 350 g / mol and 4750 g / mol.
- the hydrolyzable alkoxysilane is either a compound corresponding to the general formula
- R x p Si (OR Y ) 4 -p where p is 0 or 1
- R x is a CC alkyl group, an aryl group or an unsaturated aliphatic hydrocarbon group which can have a functional group bonded directly to a carbon atom
- R Y is a hydrogen atom or represents a lower alkyl group
- the radicals R Y can be identical or different
- the hydrolyzable alkoxysilane is a partial condensate of the compound mentioned.
- the functional group directly bonded to a carbon atom may be, for example, vinyl group, mercapto group, epoxy group, glycidoxy group, and so on.
- the lower alkyl group may, for example, be a straight or branched alkyl group having 6 or fewer carbon atoms.
- hydrolyzable alkoxysilane examples include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, tetrabuthoxysilane and the like tetraalkoxysilanes; Methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, Methyltributhoxysilan, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, isopropyltrimethoxysilane, isopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane,
- tetramethoxysilane, tetraethoxysilane and like tetraalkoxysilanes or partial condensates thereof are preferred.
- Poly (tetramethoxysilane) which is a partial condensate of tetramethoxysilane represented by the formula
- the poly (tetramethoxysilane) represented by the above formula may contain a molecule in which n is 0 so long as the average of n is 1 or more.
- the number average molecular weight of the poly (tetramethoxysilane) is preferably from about 260 to about 1200.
- poly (tetramethoxysilane) is not toxic.
- the epoxy resin used is such a silane-modified epoxy resin which can be obtained by modifying bisphenol diglycidyl ether with alkoxysilanes which carry an epoxy group.
- silane-modified epoxides and their production method are described in US Pat. No. 8,835,574 A, the disclosure content of which is also incorporated into this document by reference.
- the epoxyalkoxysilane is first partially hydrolyzed and partially condensed in the presence of water.
- a bisphenol diglycidyl ether is added and bound to the siloxane partial condensate.
- alkoxysilanes which contain an isocyanate group are bound to the aliphatic hydroxyl groups with the formation of a urethane group.
- the proportion of silane-modified epoxy resins based on the total amount of epoxy resins in the curable composition can be between 0 and 100%. In order to reduce the drawing on of certain siliconized liners, lower proportions - such as 5 to 25% - are chosen. For a balanced performance even after moist and warm storage, proportions between 10 to 50% by weight, in particular 20 to 40% by weight, have proven to be outstanding.
- fatty acid-modified epoxides can also be used very advantageously as epoxy resins.
- Epoxy resin esters also referred to as epoxy esters, are preferably used as fatty acid-modified epoxy resins, that is to say the esterification products of epoxy resins with saturated or unsaturated fatty acids.
- a single fatty acid-modified epoxy resin or two, three or even more fatty acid-modified epoxy resins can be present in the curable composition.
- the curable composition can be limited to the fatty acid-modifiable epoxy resin or resins as curable reactive resins.
- other epoxy resins that are not fatty acid-modified - for example elastomer-modified, in particular nitrile rubber-modified - epoxy resins and / or silane-modified epoxy resins, as detailed in this document - and / or reactive resins that do not Are epoxy resins.
- a single fatty acid-modified epoxy resin is present, this can in particular be selected from the fatty acid-modified epoxy resins described below as preferred. If several fatty acid-modified epoxy resins are present, at least one of the epoxy resins is advantageously one of the compounds described below as preferred fatty acid-modified epoxy resins. All fatty acid-modified epoxy resins are more preferably those as described below as being preferred.
- Modified epoxy resins according to the invention are selected in particular from fatty acid-modified epoxy resins.
- Fatty acid group-modified epoxy resins are those epoxy resins to which one or more fatty acids are chemically bonded, in particular through esterification reactions.
- Epoxy resins of the bisphenol A / epichlorohydrin type in accordance with the general formula already introduced above can be used as the epoxy resin base for the fatty acid-modified epoxy resins, in particular epoxy esters serve.
- Both the terminal epoxy groups and the secondary hydroxyl groups of bisphenol-based epoxy resins can react with fatty acids. During the esterification, the two epoxy rings are usually opened first, then the hydroxyl groups react.
- Each epoxy group is equivalent to 2 hydroxyl groups, since a ß-hydroxy ester is formed after the reaction of an acid group with an epoxide. These ß-hydroxy groups can also react with fatty acids.
- the production is typically carried out at temperatures of 240-260 ° C. under a protective gas atmosphere, preferably under azeotropic conditions, in order to remove the water of reaction that is released.
- the reaction is optionally accelerated by adding catalysts such as calcium or zinc soaps, for example fatty acids such as stearic acid.
- catalysts such as calcium or zinc soaps, for example fatty acids such as stearic acid.
- 40 to 80% of the available functional groups of the epoxy resin are converted with fatty acids.
- an epoxy resin of type n (corresponds to the number of free OH groups along the chain) can theoretically bind a maximum of n + 4 fatty acid molecules per epoxy resin molecule (degree of esterification 100%). Accordingly, the “oil length” for epoxy resin esters is defined as follows: short oil: degree of esterification 30-50%; medium oil: degree of esterification 50-70%; long oil: degree of esterification 70-90%.
- fatty acids for the esterification for example coconut oil fatty acid, ricineal fatty acid (fatty acid of dehydrated castor oil), linseed oil fatty acid, soybean oil fatty acid or tall oil fatty acid are well suited according to the invention.
- fatty acids advantageous according to the invention are ⁇ -linolenic acid, stearidonic acid, eicosapentaenoic acid, docosahexaenoic acid, linoleic acid, g-linolenic acid, dihomogammlinolenic acid, arachidonic acid, docosa-7,10,13,16-tetrain-1 acid, palmitoleic acid, vaccenic acid, Oleic acid, elaidic acid, gadoleic acid, 13-eicosenoic acid, erucic acid, nervonic acid, stearic acid, Mead 's acid.
- Dimers and oligomers of unsaturated fatty acids can also be used, for example the dimers of tall oil fatty acids.
- the proportion of fatty acid-modified epoxy resins based on the total amount of epoxy resins in the curable composition can be between 0 and 100%.
- proportions - such as, for example, 5 to 25% by weight - are chosen.
- proportions between 10 to 50% by weight, in particular 20 to 40% by weight have proven to be outstanding.
- the adhesives used according to the invention can in principle be prepared by the processes known to the person skilled in the art.
- a very gentle process with which even difficult to process raw materials such as non-thermoplastic elastomers - for example nitrile rubbers - can be processed is extrusion, in particular using a planetary roller extruder.
- Such a preliminary reaction would already cure or at least partially cure the adhesive tape and would run counter to the goal of a storable, transportable adhesive tape which is only intended to be cured after application.
- Planetary roller extruders as a continuously operating unit have been known for a long time and were first used in the processing of thermoplastics such as PVC, where they were mainly used to feed the downstream units such as calenders or rolling mills. Due to their advantage of the large surface renewal for material and heat exchange, with which the energy introduced via friction can be dissipated quickly and effectively, as well as the short dwell time and the narrow dwell time spectrum, their field of application has recently expanded to include compounding processes, among other things require temperature-controlled driving style.
- Planetary roller extruders consist of several parts, namely a rotating central spindle, a housing surrounding the central spindle at a distance with internal teeth and planetary spindles, which in the cavity between the central spindle and the internally toothed housing rotate like planets around the central spindle.
- this also includes a multi-part housing with a bushing, which forms the internal toothing of the housing.
- the planetary spindles mesh with both the central spindle and the internally toothed housing.
- the planetary spindles slide with the end pointing in the conveying direction on a stop ring.
- the planetary roller extruders have an extremely good mixing effect compared to all other types of extruder, but a much lower conveying effect.
- Planetary roller extruders are available in different designs and sizes, depending on the manufacturer. Depending on the desired throughput, the diameter of the roller cylinders is typically between 70 mm and 400 mm.
- Planetary roller extruders usually have a filling part and a compounding part.
- the filling part usually corresponding to a filling zone, consists of a screw conveyor to which all solid components - present in particular the non-thermoplastic elastomers and possibly other components - are continuously metered.
- the screw conveyor then transfers the material to the compounding section.
- the area of the filling part with the screw is preferably cooled in order to avoid caking of materials on the screw.
- the central spindle can also preferably be cooled.
- the compounding part usually consists of a driven central spindle and several planetary spindles which rotate around the central spindle within a roller cylinder with internal helical teeth.
- the speed of the central spindle and thus the speed of rotation of the planetary spindles can be varied and is therefore an important parameter for controlling the compounding process.
- the compounding part can be made up of a single compounding cell or a sequence of several - in particular with stop rings and optionally additional injection or dispersing rings - separate compounding zones are formed.
- the number and arrangement of the planetary spindles can vary from compounding zone to compounding zone.
- the compounding part will preferably consist of at least two, but particularly preferably three or four coupled roller cylinders, each roller cylinder being able to have one or more separate temperature control circuits.
- the surrounding housing has a contemporary design with a double jacket.
- the inner jacket is formed by a bushing that is provided with internal teeth.
- the important cooling of the planetary roller extruder is provided between the inner and outer jacket.
- the planetary spindles do not require any guidance in the circumferential direction.
- the toothing ensures that the distance between the planetary spindles remains the same in the circumferential direction. It can be said that it is self-guided
- the materials are circulated between central and planetary spindles or between planetary spindles and the helical gearing of the roller part, so that the materials are dispersed to form a homogeneous compound under the influence of shear energy and external temperature control.
- the number of planetary spindles rotating in each roller cylinder can be varied and thus adapted to the requirements of the process.
- the number of spindles influences the free volume within the planetary roller extruder, the dwell time of the material in the process and also determines the area size for the heat and material exchange.
- the number of planetary spindles has an influence on the compounding result via the shear energy introduced. With a constant roller cylinder diameter, a greater number of spindles can achieve better homogenizing and dispersing performance or a greater product throughput.
- the maximum number of planetary spindles that can be installed between the central spindle and the roller cylinder depends on the diameter of the roller cylinder and the diameter of the planetary spindles used.
- the roller cylinders can be equipped with a larger number of planetary spindles.
- each roller cylinder can be equipped differently with regard to the number and type of planetary spindles and thus be adapted to the respective formulation and process requirements.
- the invention it has been possible to provide storage-stable, curable compositions based on epoxy which are outstandingly suitable for use as adhesives in adhesive tapes and with which it is possible to produce even very thick adhesive tapes.
- the products produced have very good adhesion, in particular to glass surfaces.
- the selected components have made it possible to reduce the solubility of the hardeners used in the other components or to avoid it altogether, resulting in products that are very stable in storage, which are easy to transport and store and also when used by the customer - even after a long storage period. ensure their full bonding performance.
- the curing of the adhesives or adhesive tapes according to the invention after application can advantageously take place at temperatures between 120 ° C. and 200 ° C. for 10 to 120 minutes.
- the exact conditions depend on the hardener used and the accelerator used, if any, and the amount of accelerator used. Typically, accelerators between 0.5 phr and 5 phr are used, phr referring to the amount of epoxy resins used.
- Exemplary curing conditions are 30 minutes at 180 ° C, 30 minutes at 160 ° C, 35 minutes at 145 ° C, 60 minutes at 130 ° C, 120 minutes at 120 ° C.
- very thick adhesive tapes can be produced.
- the administration of adhesives of high viscosity per se in the form of stable films - for example by embedding the reactive adhesive in a polymeric film-forming matrix - opens up, with the adhesives of the invention, access to very storage-stable adhesive films in a wide variety of dimensions.
- adhesive films in a very thin form - for example from a few ⁇ m thick - over conventional adhesive tape thicknesses, for example with adhesive layers from 25 ⁇ m to 100 ⁇ m thick - such as about 50 ⁇ m thick adhesive layers - up to adhesive tapes with very thick adhesive layers of over 100 ⁇ m, preferably over 200 ⁇ m, even 300 ⁇ m or more, 500 mm or more, 1 mm or more up to layers of adhesive in the range of a few millimeters and even Centimeters, both as single-layer adhesive films (transfer adhesive tapes) and as single- or double-sided adhesive multi-layer adhesive tapes, in particular also with a carrier material.
- adhesive layers from 25 ⁇ m to 100 ⁇ m thick - such as about 50 ⁇ m thick adhesive layers - up to adhesive tapes with very thick adhesive layers of over 100 ⁇ m, preferably over 200 ⁇ m, even 300 ⁇ m or more, 500 mm or more, 1 mm or more up to layers of adhesive in the range of a few millimeter
- Dynamic viscosity is a measure of the flowability of the fluid coating material.
- the dynamic viscosity is determined according to DIN 53019.
- a viscosity of less than 108 Pa s is referred to as a fluid.
- the viscosity is measured in a cylinder rotation viscometer with a standard geometry according to DIN 53019-1 at a measuring temperature of 23 ° C. and a shear rate of 1 s-1.
- THF tetrahydrofuran
- eluent 0.1% by volume of trifluoroacetic acid
- the measurement was carried out at 25 ° C.
- PSS-SDV, 5 m, 10 3 ⁇ , ID 8.0 mm x 50 mm was used as the guard column.
- the sample concentration was 4 g / l, the flow rate 1.0 ml per minute. It was measured against polystyrene standards.
- the softening temperature is carried out according to the relevant method known as "Ring and Ball” and standardized according to ASTM E28.
- An HRB 754 ring-ball machine from Herzog is used to determine the softening temperature.
- the samples to be measured - such as the resin or the elastomer - are first finely ground in a mortar.
- the resulting powder is filled into a brass cylinder with a bottom opening (inner diameter at the upper part of the cylinder 20 mm, diameter of the bottom opening of the cylinder 16 mm, height of the cylinder 6 mm) and placed on a heating table melted.
- the filling quantity is chosen so that the sample completely fills the cylinder without protrusion after melting.
- the resulting test specimen including the cylinder, is placed in the test holder of the HRB 754.
- Glycerine is used to fill the bath if the softening temperature is between 50 ° C and 150 ° C.
- a water bath can also be used at lower softening temperatures.
- the test balls have a diameter of 9.5 mm and weigh 3.5 g. According to the HRB 754 procedure, the ball is placed above the test specimen in the temperature bath and placed on the test specimen. There is a collecting plate 25 mm below the cylinder base, and a light barrier 2 mm above it. During the measurement process, the temperature is increased at 5 ° C / min.
- the ball In the temperature range of the softening temperature, the ball begins to move through the bottom opening of the cylinder until it finally comes to a stop on the collecting plate. In this position it is detected by the light barrier and the temperature of the bath is registered at this point in time. There is a double determination.
- the softening temperature is the mean value from the two individual measurements.
- the static glass transition temperature (Tg) is determined using dynamic differential calorimetry in accordance with DIN 53765: 1994-03. For this purpose, approximately 7 mg of the sample are weighed exactly into an aluminum pan and then introduced into the measuring device (device: DSC 204 F1, Netzsch). An empty crucible is used as a reference. Two heating curves are then recorded with a heating rate of 10 K / min. The information on the glass transition temperature Tg relates to the glass transition temperature Tg according to DIN 53765: 1994-03 of the second heating curve, unless otherwise stated in the individual case.
- the shelf life (Lf) of the (uncured) copolymers was determined by DSC.
- the heat of reaction of a fresh mixture of Epikote828LVEL with 7.03% dicyandiamide (Dyhard 100SF) and, unless otherwise noted, 5phr of the copolymer to be tested is determined (AH f nsc h ) and the residual heat of reaction after storage for 10d at 60 ° C ( DHKMQO) compared.
- Tpeak The temperature of the curing curve , determined by DSC, from the shelf life measurement, which is reached at the maximum of the exothermic reaction signal, is referred to as Tpeak.
- TUEMA 3- (3-toloidylureido) ethyl methacrylate (homopolymer-Tg ⁇ 137 ° C)
- MMA methyl methacrylate (homopolymer Tg ⁇ 105 ° C)
- VI m vinylimidazole (homopolymer Tg ⁇ 131 ° C)
- DMAP-M N-methyl-N- (4-pyridyl) amino) ethyl methacrylate
- Imidazole ethyl methacrylate Imidazole ethyl methacrylate (ImEMA)
- ImEMA Imidazole ethyl methacrylate
- ImEUr-M Imidazole ethyl urethane methacrylate
- Table 1 shows the Tpeak temperatures of the respective polymers and indicates whether the storage test was passed or not.
- the activating effect of the nitrogen-containing aromatic heterocyclic group is surprisingly particularly effective when it is not bound directly to the polymer backbone. This becomes clear when comparing B1 and B2. Both accelerators are storage-stable and show an accelerating effect. However, the peak temperature of B2 is 10 ° C lower. Without being tied to a theory, it is assumed that decoupling from the polymer backbone by at least 2, preferably 4 atoms results in the amino groups being more accessible to the reactive resin when the Tg is exceeded.
- B4-B7 are examples according to the invention with different amounts of monomers B in the polymer (20% -60%).
- the activating property of B7 with only 20% monomer B initially appears to be weaker.
- the same amount of accelerator (5phr) was used in the DSC experiment. Because of the lower amount in the copolymer, there are fewer accelerating groups in the curing test. This can be counteracted by simply increasing the amount of accelerator.
- the activating effect does not increase with an increasing amount of monomer B, as can be clearly seen in the range according to the invention between 45% and 60% (B4-B6), as well as in the counterexample V1, which consists of 100% ImEMA.
- the ImEMA proportions are too high, the solubility that is introduced via the high Tg monomers (monomers A) is greatly reduced, so that the accelerating monomers B are not sufficiently effective Form are available.
- Accelerator polymers according to the invention can also be obtained with commercially available high-Tg monomers such as MMA and n-phenylmalimide. This is shown with B8 and B9.
- Imidazoles have proven to be particularly reactive and at the same time easy to store (B2 unsubstituted imidazole, B10 methylimidazole). But other tertiary aromatic amino groups also have an accelerating effect and can still be used for very storable epoxy resin adhesives. This is shown by way of example in B11 with a tertiary aromatic amine comparable to DMAP.
- Dyhard UR500 Latent accelerator based on dimethyl urea for epoxy systems in which 98% of the particles are smaller than 10 pm.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020201334.9A DE102020201334A1 (en) | 2020-02-04 | 2020-02-04 | High Tg acrylate copolymers with nitrogen-containing aromatic heterocyclic group |
PCT/EP2021/050695 WO2021156033A1 (en) | 2020-02-04 | 2021-01-14 | High tg acrylate copolymers with nitrogen-containing aromatic heterocyclic group |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4100448A1 true EP4100448A1 (en) | 2022-12-14 |
Family
ID=74236155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21701690.6A Pending EP4100448A1 (en) | 2020-02-04 | 2021-01-14 | High tg acrylate copolymers with nitrogen-containing aromatic heterocyclic group |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230064702A1 (en) |
EP (1) | EP4100448A1 (en) |
CN (1) | CN115052912B (en) |
DE (1) | DE102020201334A1 (en) |
WO (1) | WO2021156033A1 (en) |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3028259A (en) * | 1960-03-31 | 1962-04-03 | Norton Co | Pressure sensitive adhesive tapes having a primer coating of a half ester of a copolymer of styrene and maleic acid and a terpolymer of butadiene, styrene, vinyl pyridine |
DE2543542C2 (en) | 1975-09-30 | 1986-10-02 | Röhm GmbH, 6100 Darmstadt | Process for making a plastisol |
US4349651A (en) * | 1980-08-01 | 1982-09-14 | Westinghouse Electric Corp. | Resinous copolymer insulating compositions |
US5232972A (en) * | 1989-08-31 | 1993-08-03 | Bridgestone Corporation | Adhesive composition |
JPH07286079A (en) * | 1994-04-20 | 1995-10-31 | Mitsubishi Chem Corp | Thermoplastic resin composition |
DE19519339A1 (en) * | 1995-05-26 | 1996-11-28 | Basf Ag | Water-soluble copolymers containing copolymerized crosslinkers, process for their preparation and their use |
JP3559114B2 (en) * | 1995-09-14 | 2004-08-25 | 株式会社ブリヂストン | Adhesive composition |
US6599602B2 (en) | 1999-06-02 | 2003-07-29 | 3M Innovative Properties Company | Polycarbonate articles and adhesive composition therefor |
EP1114834B1 (en) | 1999-06-17 | 2002-10-16 | Arakawa Chemical Industries, Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
US6660805B1 (en) * | 2002-05-16 | 2003-12-09 | Lord Corporation | Two-part adhesive: part A-monomer, toughener(s), optional adhesion promotor and reducing agent; part B-epoxy resin |
ES2405615T3 (en) * | 2005-07-22 | 2013-05-31 | Basf Se | Use of anionic and cationic ampholytic copolymers |
WO2009117345A2 (en) | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
DE102009026548A1 (en) * | 2009-05-28 | 2011-03-24 | Henkel Ag & Co. Kgaa | Adhesive film or adhesive tape based on epoxides |
JP5094832B2 (en) | 2009-12-25 | 2012-12-12 | 日東電工株式会社 | Adhesive composition and adhesive sheet |
SI2627677T1 (en) | 2010-10-13 | 2014-11-28 | Evonik Roehm Gmbh | Process for preparing a (meth)acrylate copolymer containing tertiary amino groups by free-radical polymerization in solution |
KR20150093331A (en) * | 2014-02-07 | 2015-08-18 | 동우 화인켐 주식회사 | A color photosensitive resin composition, color filter and display device comprising the same |
CN104387525B (en) | 2014-12-05 | 2016-09-07 | 宁波南海化学有限公司 | A kind of imidazole modified copolymer and its preparation method and application |
DE102015122438A1 (en) * | 2015-12-21 | 2017-06-22 | Lohmann Gmbh & Co. Kg | Heat-activated adhesive tape |
CN106432584B (en) | 2016-09-18 | 2019-03-01 | 江南大学 | A kind of synthesis of imidazoles latency Epoxy curing accelerators with toughening effect and its application on epoxy-modified |
-
2020
- 2020-02-04 DE DE102020201334.9A patent/DE102020201334A1/en not_active Withdrawn
-
2021
- 2021-01-14 CN CN202180012831.9A patent/CN115052912B/en active Active
- 2021-01-14 EP EP21701690.6A patent/EP4100448A1/en active Pending
- 2021-01-14 US US17/797,155 patent/US20230064702A1/en active Pending
- 2021-01-14 WO PCT/EP2021/050695 patent/WO2021156033A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20230064702A1 (en) | 2023-03-02 |
DE102020201334A1 (en) | 2021-08-05 |
CN115052912B (en) | 2024-07-09 |
CN115052912A (en) | 2022-09-13 |
WO2021156033A1 (en) | 2021-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3714016B1 (en) | Adhesive tapes based on epoxy resin reactive adhesives | |
EP3452540B1 (en) | Curable adhesive composition and corresponding reactiv adhesive tapes | |
EP2638118B1 (en) | Adhesive compound and method for encapsulating an electronic assembly | |
EP3091059B1 (en) | Adhesive tape with adhesive mass with continuous polymer phase | |
EP3374408A1 (en) | Cationically polymerisable polyacrylate containing alkoxysilane groups and use thereof | |
WO2010007150A2 (en) | Reaction products based on amphiphilic block copolymers and their use as impact modifier | |
EP2182025A1 (en) | Heat curable epoxide resin compositions suitable as bodyshop adhesive or structural foam | |
EP3448906A1 (en) | Repositionable, moisture-curing adhesive tape | |
DE102017216070A1 (en) | Sealing tape for bodies | |
EP4100448A1 (en) | High tg acrylate copolymers with nitrogen-containing aromatic heterocyclic group | |
EP3741803B1 (en) | Method for producing reactive adhesive tapes | |
DE102019212591A1 (en) | Process for sheathing elongated material, in particular lines | |
DE102019215894A1 (en) | Reactive adhesives containing glycidyl groups | |
WO2021032727A1 (en) | Method for covering elongated articles, in particular lines | |
WO2021032822A1 (en) | Method for covering elongated articles, in particular lines | |
EP2771422B1 (en) | Adhesive paste with increased temperature stability and use thereof for an adhesive tape | |
DE102019215890A1 (en) | Curable adhesive and reactive adhesive tapes based thereon | |
DE102020206619A1 (en) | PRE-CROSS-LINKED EPOXY ADHESIVE COMPOUNDS AND ADHESIVE TAPES, WHICH CONTAIN THESE | |
DE102020211738A1 (en) | Activator tape |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: UNKNOWN |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20220905 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20240425 |