EP4036261A4 - Pure copper plate - Google Patents

Pure copper plate Download PDF

Info

Publication number
EP4036261A4
EP4036261A4 EP20870402.3A EP20870402A EP4036261A4 EP 4036261 A4 EP4036261 A4 EP 4036261A4 EP 20870402 A EP20870402 A EP 20870402A EP 4036261 A4 EP4036261 A4 EP 4036261A4
Authority
EP
European Patent Office
Prior art keywords
copper plate
pure copper
pure
plate
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20870402.3A
Other languages
German (de)
French (fr)
Other versions
EP4036261A1 (en
Inventor
Hiroyuki Mori
Hirotaka Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of EP4036261A1 publication Critical patent/EP4036261A1/en
Publication of EP4036261A4 publication Critical patent/EP4036261A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/03—Making non-ferrous alloys by melting using master alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP20870402.3A 2019-09-27 2020-09-11 Pure copper plate Withdrawn EP4036261A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019176835 2019-09-27
PCT/JP2020/034462 WO2021060023A1 (en) 2019-09-27 2020-09-11 Pure copper plate

Publications (2)

Publication Number Publication Date
EP4036261A1 EP4036261A1 (en) 2022-08-03
EP4036261A4 true EP4036261A4 (en) 2023-09-20

Family

ID=75166681

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20870402.3A Withdrawn EP4036261A4 (en) 2019-09-27 2020-09-11 Pure copper plate

Country Status (7)

Country Link
US (1) US20220403484A1 (en)
EP (1) EP4036261A4 (en)
JP (1) JP6973680B2 (en)
KR (1) KR20220068985A (en)
CN (1) CN114269957B (en)
TW (1) TW202115264A (en)
WO (1) WO2021060023A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115279929A (en) * 2020-03-06 2022-11-01 三菱综合材料株式会社 Pure copper plate, copper-ceramic junction body, and insulated circuit board
WO2021177461A1 (en) * 2020-03-06 2021-09-10 三菱マテリアル株式会社 Pure copper plate, copper/ceramic joined body, and insulated circuit substrate
JP7215626B2 (en) * 2021-07-02 2023-01-31 三菱マテリアル株式会社 Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
WO2023277197A1 (en) * 2021-07-02 2023-01-05 三菱マテリアル株式会社 Copper strip for edgewise bending, and electronic/electrical device component and busbar
JP7243904B2 (en) * 2021-07-02 2023-03-22 三菱マテリアル株式会社 Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
WO2023277196A1 (en) * 2021-07-02 2023-01-05 三菱マテリアル株式会社 Copper strip for edgewise bending, and electronic/electrical device component and busbar
TW202308768A (en) * 2021-07-02 2023-03-01 日商三菱綜合材料股份有限公司 Copper strip for edgewise bending, and electronic/electrical device component and busbar
JP7243903B2 (en) * 2021-07-02 2023-03-22 三菱マテリアル株式会社 Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
KR20240028351A (en) * 2021-07-02 2024-03-05 미쓰비시 마테리알 가부시키가이샤 Tuning for edge-wise bending, and parts for electronic and electrical devices, bus bars
JP7215627B2 (en) * 2021-07-02 2023-01-31 三菱マテリアル株式会社 Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
KR20240134029A (en) * 2022-07-29 2024-09-05 미쓰비시 마테리알 가부시키가이샤 Pure copper, insulating substrate, electronic device
JP7473066B2 (en) 2022-07-29 2024-04-23 三菱マテリアル株式会社 Pure copper materials, insulating substrates, electronic devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5143208B2 (en) * 2010-10-25 2013-02-13 Ｊｘ日鉱日石金属株式会社 Rolled copper foil, and negative electrode current collector, negative electrode plate and secondary battery using the same
KR20140037962A (en) * 2011-08-23 2014-03-27 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Rolled copper foil
JP2015048521A (en) * 2013-09-03 2015-03-16 Jx日鉱日石金属株式会社 Copper alloy sheet excellent in conductivity and bending deflection coefficient

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062058A (en) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The Crystal grain growth suppressing oxygen free copper
JP5499933B2 (en) * 2010-01-12 2014-05-21 三菱マテリアル株式会社 Phosphorous copper anode for electrolytic copper plating, method for producing the same, and electrolytic copper plating method
JP4869415B2 (en) * 2010-02-09 2012-02-08 三菱伸銅株式会社 Pure copper plate manufacturing method and pure copper plate
WO2013021969A1 (en) * 2011-08-05 2013-02-14 古河電気工業株式会社 Rolled copper foil for secondary battery collector and production method therefor
JP5826160B2 (en) * 2012-04-10 2015-12-02 Jx日鉱日石金属株式会社 Rolled copper foil, copper-clad laminate, flexible printed wiring board and manufacturing method thereof
JP5752736B2 (en) * 2013-04-08 2015-07-22 三菱マテリアル株式会社 Sputtering target
JP6851963B2 (en) * 2015-04-01 2021-03-31 古河電気工業株式会社 Manufacturing method of flat rolled copper foil, flexible flat cable, rotary connector and flat rolled copper foil
JP2019176835A (en) 2018-03-30 2019-10-17 三井化学株式会社 Method for producing amide compound

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5143208B2 (en) * 2010-10-25 2013-02-13 Ｊｘ日鉱日石金属株式会社 Rolled copper foil, and negative electrode current collector, negative electrode plate and secondary battery using the same
KR20140037962A (en) * 2011-08-23 2014-03-27 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Rolled copper foil
JP2015048521A (en) * 2013-09-03 2015-03-16 Jx日鉱日石金属株式会社 Copper alloy sheet excellent in conductivity and bending deflection coefficient

Also Published As

Publication number Publication date
EP4036261A1 (en) 2022-08-03
JP6973680B2 (en) 2021-12-01
WO2021060023A1 (en) 2021-04-01
US20220403484A1 (en) 2022-12-22
CN114269957B (en) 2022-07-29
TW202115264A (en) 2021-04-16
JPWO2021060023A1 (en) 2021-11-04
KR20220068985A (en) 2022-05-26
CN114269957A (en) 2022-04-01

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