EP4028196A1 - Procédé pour établir une liaison électriquement conductrice - Google Patents

Procédé pour établir une liaison électriquement conductrice

Info

Publication number
EP4028196A1
EP4028196A1 EP20793259.1A EP20793259A EP4028196A1 EP 4028196 A1 EP4028196 A1 EP 4028196A1 EP 20793259 A EP20793259 A EP 20793259A EP 4028196 A1 EP4028196 A1 EP 4028196A1
Authority
EP
European Patent Office
Prior art keywords
bonding tool
tip
laser
laser generator
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20793259.1A
Other languages
German (de)
English (en)
Inventor
Andreas Unger
Michael BRÖKELMANN
Matthias Hunstig
Hans-Jürgen HESSE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hesse GmbH
Original Assignee
Hesse GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse GmbH filed Critical Hesse GmbH
Publication of EP4028196A1 publication Critical patent/EP4028196A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

Definitions

  • the invention relates to a method for laser-assisted ultrasonic bonding.
  • German patent application 102018 121 696.3 of the applicant it is known to heat a tip of a bonding tool during ultrasonic bonding by means of a laser beam.
  • Various method concepts are disclosed in relation to the operation of a laser generator providing the laser beam. The method concepts disclosed are particularly advantageous in controlled operation.
  • the object of the present invention is to provide a further developed method for the laser-assisted production of a bond connection, in which a temperature of the tool tip can be specified, monitored and / or set as required.
  • the invention has the features of claim 1. Accordingly, the method for making an electrically conductive Connection between a contact surface of a functional component and a connecting component, the following method steps: the connecting component is placed against a tip of the bonding tool and is pressed against the contact surface of the functional component by the bonding tool with a normal force; the bonding tool and the connecting component placed thereon are excited to produce ultrasonic vibrations; a laser generator is activated and a laser beam is provided from the laser generator; the laser beam is directed onto the tip of the bonding tool and heats the tip of the bonding tool; an actual temperature of the tip of the bonding tool is measured without contact; the laser generator is operated intermittently and / or with an adjustable laser power so that a predetermined target temperature is set at the tip of the bonding tool.
  • the laser generator is operated in a controlled manner and that the measured actual temperature of the tool tip is adapted or set to the target temperature.
  • the particular advantage of the invention is that the actual temperature is determined and influenced directly at the tip of the bonding tool and that a temperature of the connecting component to be connected to the functional component can thus also be selected and set indirectly as required.
  • Variable or fluctuating process parameters that cannot be precisely determined either by measurement or model-based can be compensated for, which influence the actual temperature of the tool tip and thus have an effect on the bonding process.
  • the actual temperature can be determined by the Surface quality or the absorption capacity of the bonding tool when heated with the laser beam as well as the heat flow in the direction of a shaft of the bonding tool, the ultrasonic generator or transducer and / or other functional components of the automatic bonding machine can be influenced.
  • the actual temperature and the target temperature during bonding are usually above the ambient temperature or the starting temperature of the connection partner (functional component and connection component).
  • the method according to the invention therefore offers the possibility of influencing the bonding process by changing the normal force, adapting the ultrasonic vibrations and adapting or changing the temperature. While the normal force in particular can only be adjusted or changed slowly, the temperature can be changed dynamically by activating or deactivating the laser generator and / or adapting the laser power. The additional provision of the laser power extends the possibility of influencing the process, introducing additional energy into the connection point and / or adapting the process to different materials.
  • the method according to the invention can be used, for example, in the field of wire bonding and chip bonding.
  • the manufacturing method according to the invention is also very gentle. There is no direct heating of the connection partner, with the result that the risk of damage to the connection partner is counteracted. For example, this reduces the risk that the wire or his will melt during wire bonding Surface is damaged and the ultrasound excitation is made more difficult.
  • the indirect heating of the chip significantly reduces the risk of damage to the chip fixed as a connecting component on the tool or its functional elements and / or connection contacts.
  • the laser generator is activated and the laser beam provided before the bonding tool is subjected to the normal force and the connecting component is pressed against the contact surface of the functional component or before the bonding tool is excited to ultrasonic vibrations.
  • the connection process can advantageously be significantly accelerated and the time for producing a bond connection can be reduced, since the bonding tool is already warm when it is put on and less ultrasonic energy has to be supplied.
  • the reduced process times then mean that more connections can be established per unit of time.
  • the wear of the bonding tool can be reduced if the ultrasound is only activated when the connection partners are already heated and thus softer.
  • it can be achieved that the initial thermal conditions are always the same at the time the normal force is applied and / or when the ultrasound is activated, with the result that the reproducibility and controllability of the process are improved.
  • the bonding tool is mounted on a movable bondhead.
  • the tip of the bonding tool can then be heated when the bonding head is positioned over the contact surface of the functional component, with the result that the overall cycle time is reduced and the connections can be made particularly economically within a short time.
  • the laser power of the laser generator is selected so that the bonding tool tip is permanently heated, with the actual temperature at the tip of the bonding tool continuously above the after making a first electrically conductive connection and before making a second electrically conductive connection Ambient or starting temperature.
  • the process time can advantageously be further reduced and the throughput can be increased, with the result that a large number of electrically conductive connections in particular can be produced economically. Since the actual temperature is always above the ambient or starting temperature, the thermal energy introduced into the connection point with the aid of the laser beam can be lower when making the second and every further connection than when making the first connection.
  • the laser generator can continue to operate after the excitation of the bonding tool into ultrasonic vibrations has ended.
  • the connection quality can advantageously be improved as a result.
  • the laser beam is guided out of the laser generator via an optical waveguide and guided to the tip of the bonding tool.
  • the laser generator can advantageously be installed in a stationary manner, whereas the laser beam is guided via the optical waveguide to the bonding tool, which can therefore be freely positioned. This makes it possible to keep the moving masses low and to provide an automatic bonding machine that is characterized by high dynamics.
  • a free end of the optical waveguide facing the tip of the bonding tool is positioned or held at a distance from the bonding tool.
  • this advantageously ensures that ultrasonic vibrations of the bonding tool are not transmitted to the optical waveguide.
  • the spacing between the tool tip and the free end of the optical waveguide counteracts contamination of the optical waveguide and thus a reduction in the optical quality or the optical efficiency.
  • the laser beam is guided from the outside onto the bonding tool on the jacket side.
  • the assembly and maintenance of the automatic bonding machine can advantageously be carried out very easily.
  • work on the laser generator or on the optical fiber can be avoided, with the result that the tool change can be carried out quickly and with little effort and downtimes are reduced.
  • 17 shows a first exemplary embodiment for the time course of normal force, ultrasonic power and actual temperature for three successive bonding cycles and
  • the method can be used in ultrasonic thick wire bonding.
  • the bonding tool is held on a bond head that can be freely positioned and rotated in a bonding area of an automatic bonding machine.
  • the bonding tool is positioned over a contact surface of a functional component, for example an electrical conductor on a circuit board, a chip or a battery.
  • a usually V-shaped recess is provided at the end of the bonding tool at the tip, in which an aluminum or copper wire serving as a connecting component is inserted.
  • the connecting component is pressed against the contact surface of the functional component with a normal force in that the bonding tool is lowered.
  • the bonding tool is then excited to produce ultrasonic vibrations via an ultrasonic generator, for example a piezo actuator.
  • the tip of the bonding tool is heated by means of a laser beam provided by a laser generator.
  • the laser beam preferably strikes the bonding tool on the jacket side from the outside in the region of the tip.
  • the moving masses must be as small as possible, especially in the case of ultrasonic wire bonding. It can be provided that the laser generator is installed in a stationary manner and the laser beam is guided through an optical waveguide from the laser generator to the bonding tool.
  • a free end of the optical waveguide facing the tip of the bonding tool can be positioned at a distance from the bonding tool. This avoids the transmission of the ultrasonic vibrations to the optical waveguide. In addition, contamination of the optical waveguide by detached material particles is counteracted during laser-assisted ultrasonic bonding, with the result that good optical efficiency is achieved.
  • the optical waveguide or the free end thereof is always provided in a defined position in relation to the bonding tool.
  • the laser beam always strikes the bonding tool at a defined, identical point.
  • a recess or pocket can be formed on the jacket side of the bonding tool where the laser beam strikes the bonding tool.
  • a surface geometry can be selected such that the laser beam is reflected multiple times and strikes the bonding tool multiple times. The absorption of the laser beam is improved as a result, with the result that a larger proportion of the laser power is available as heating power for heating the tip of the bonding tool.
  • a first implementation example for the method according to the invention according to FIG. 1 provides that the process parameters normal force, ultrasonic power and actual temperature are brought to a constant process value at the same time.
  • the process value of the actual temperature is above an ambient or Outlet temperature To.
  • the process parameters are shown scaled or standardized.
  • the normal force according to FIG. 1 builds up when the bonding tool is lowered as soon as the connecting component is pressed against the contact surface of the functional component.
  • a linear increase in normal force is selected as an example in the illustration. In reality, the force can also increase non-linearly.
  • the bonding tool is excited to produce ultrasonic vibrations.
  • the ultrasonic source is activated accordingly and the ultrasonic output is kept constant over the process time.
  • the activation time for the laser generator is selected so that the process value of the actual temperature is reached as soon as the normal force reaches its maximum.
  • the actual temperature is then kept constant over time as long as the normal force is applied and the bonding tool is excited to produce ultrasonic vibrations.
  • the ultrasound is deactivated.
  • the bonding tool is lifted, the normal force drops and the actual temperature drops.
  • a linear curve or that of a decay curve is shown as an example for the drop in normal force and the actual temperature.
  • these courses are only chosen as examples. A different course based on the requirements or particularities of the connection process can be selected.
  • the operating method according to the first method variant can be implemented simply in terms of process technology and with regard to the control, since the laser generator is operated synchronously with the ultrasonic generator while the normal force is applied.
  • This variant is also advantageous if the tip of the bonding tool can only be reached or heated by means of the laser when the connecting component is pressed against the functional component and the normal force is applied.
  • the thermal load on the other functional components of the automatic bonding machine is comparatively low, since the tool tip is only heated during contact with the connection component.
  • the relationship between the setpoint temperature, the actual temperature recorded by measurement in the area of the tool tip and the heating power is discussed below with reference to FIG. 2.
  • the actual temperature follows the jump to the process value above the ambient or initial temperature To, which is predetermined by the set temperature profile. If the setpoint temperature is then kept constant over a certain period of time, the heating power or a laser power is reduced, in particular, since less and less heat flows from the heated bonding tool tip into the rest of the bonding tool.
  • the laser power is therefore greater than the heating power by the power loss, or the heating power is that part of the laser power made available by the laser with which the tool tip of the bonding tool is heated.
  • the target temperature is increased linearly to a higher temperature level
  • the heating output to be applied increases. As soon as the higher target temperature is reached, the heating output also remains approximately constant again or decreases slightly.
  • the actual temperature is recorded by measurement in each case. It serves as a controlled variable for the laser generator.
  • the laser power can also be reduced or the laser generator can be deactivated. In the event of uncontrolled cooling, however, the actual temperature will not drop suddenly, but will be reduced along a decay curve.
  • FIG 3 shows a second method concept with regard to the time course of the normal force, the ultrasonic power and the actual temperature.
  • the bonding tool is heated before the normal force is applied. After the application of the normal force, the temperature is maintained with the result that the connecting component and the functional component are heated via the tip of the bonding tool.
  • the representation assumes an ideal controller that ideally compensates for the heat dissipation. In practice there may be deviations that the actual temperature temporarily fluctuates more strongly.
  • the ultrasound is then activated when the components to be connected have reached an elevated temperature.
  • the temperature is then reduced again after the bonding tool has been raised.
  • the bonding tool is heated during the positioning of the bonding head. Overall, this can lead to a significant reduction in process times.
  • the wear of the bonding tool can be reduced if the ultrasound is only activated after the connection partners have been heated and can thus be more easily deformed and connected.
  • the bonding tool is excited to produce ultrasonic vibrations after the normal force has been impressed and the bonding tool has been heated for a predetermined period of time. In this respect, the wear on the bonding tool is also reduced here. The bonding tool is not heated up before the normal force is applied.
  • the temperature of the bonding tool is reduced before the ultrasonic power is deactivated and the bonding tool is lifted off.
  • This procedure can be indicated in particular in order to prevent impermissible heating of the contact surface and / or damage to the functional component.
  • a control measurement or monitoring can be implemented with regard to the temperature of the functional component and the laser generator can be deactivated as soon as a critical temperature is reached in the area of the contact surface or the functional component.
  • the actual temperature is kept at a constantly high process value throughout, that is to say over the production of several electrically conductive connections.
  • connection component placed on the tip of the bonding tool is heated from the time of contact with the bonding tool. After the application of the normal force, the intimate contact due to the normal force increases the heating of the connecting component and the functional component is also heated. In addition, the bonding tool is excited to produce ultrasonic vibrations.
  • the bonding process can advantageously be accelerated further by the proposed embodiment of the manufacturing method according to the invention, since a separately formed heating phase is omitted and constant thermal conditions prevail, which have a positive effect on the controllability of the bonding process.
  • FIG. 1 A modification of the connection method discussed above is shown in FIG. Here it is so that the temperature is always kept above the ambient or starting temperature. Nevertheless, the temperature is raised during the establishment of the connection.
  • the process can advantageously be accelerated due to the always comparatively high temperature level.
  • the heating energy or the laser energy correlated with it can be reduced if the actual temperature is allowed to drop between the establishment of two connections, that is, for example, when the bondhead is repositioned. This reduces the thermal load on the functional components of the automatic bonding machine and the connecting component in comparison to the sixth embodiment variant of the method according to the invention according to FIG. 7.
  • FIG. 11 shows a tenth variant of the method in which the temperature is lowered from a predetermined target temperature during the manufacturing process. The lowering of the temperature can be provided, for example, in order to avoid impermissible or damaging heating of the connecting component or the functional component.
  • An eleventh method variant according to FIG. 12 and a twelfth method variant according to FIG. 13 show a course for the actual temperature that decreases during the ongoing bonding process.
  • the actual temperature can, for example, be reduced linearly, stepped or otherwise continuously. In particular, this can also make it possible to avoid damage to the connecting component or the functional component.
  • the laser generator can, for example, be deactivated and / or pulsed and / or operated with a reduced laser power.
  • the ultrasonic power is reduced when the connection is established while the process is running.
  • a stepped reduction of the ultrasonic power is shown as an example.
  • the ultrasonic power is not reduced abruptly, but in a ramp-shaped or steady manner.
  • the ultrasonic power can initially be comparatively high and reduced when the contact surfaces have been cleaned and the first connection has been formed.
  • the reduction in the ultrasonic power serves to further develop the connection that has already been initially formed and prevents excessive ultrasonic vibrations from damaging the connection again.
  • FIG. 15 shows a modification of the method according to FIG. 14.
  • provision is made here to increase the ultrasonic power slowly and, for example, in a ramp-like manner after the application of the normal force.
  • the ultrasonic power can be reduced in a ramp-shaped or continuous manner.
  • the (resonance) frequency control of the ultrasonic generator advantageously works in a particularly stable manner when the ultrasonic power or the amplitude of the ultrasonic oscillation is slowly increased.
  • the electrical voltage is usually specified when the ultrasonic generator is in operation. If the oscillation amplitude is increased abruptly, the current and the ultrasonic power can overshoot. Then the oscillation amplitude and the ultrasound power are briefly greater than intended and damage can occur, particularly in the case of sensitive substrates or functional components.
  • the bonding process is implemented in such a way that the actual temperature is raised to a high first temperature level during bonding and that the actual temperature drops to the starting temperature To between two bonding cycles.
  • the bonding process is designed in such a way that the actual temperature does not drop to the starting temperature To between two bonds. For example, the cycle time is so short that the starting temperature To cannot be set during free cooling.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un procédé pour établir une liaison électriquement conductrice entre une surface de contact d'un élément fonctionnel et un élément de liaison, ce procédé comprenant les étapes suivantes : l'élément de liaison est plaqué par un outil de liaison avec une force normale contre la surface de contact de l'élément fonctionnel; l'outil de liaison et l'élément de liaison appliqué sur celui-ci sont excités pour produire des vibrations ultrasonores; un faisceau laser est fourni par un générateur laser; le faisceau laser est dirigé sur l'outil de liaison et de préférence sur une pointe de celui-ci et chauffe ladite pointe; une température réelle de la pointe de l'outil de liaison est mesurée sans contact; le générateur laser est actionné par intermittence et/ou avec une puissance laser réglable de telle sorte qu'une température de consigne prédéfinie règne au niveau de la pointe de l'outil de liaison.
EP20793259.1A 2019-09-11 2020-09-08 Procédé pour établir une liaison électriquement conductrice Pending EP4028196A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019124333.5A DE102019124333A1 (de) 2019-09-11 2019-09-11 Verfahren zur Herstellung einer elektrisch leitenden Verbindung
PCT/DE2020/100783 WO2021047733A1 (fr) 2019-09-11 2020-09-08 Procédé pour établir une liaison électriquement conductrice

Publications (1)

Publication Number Publication Date
EP4028196A1 true EP4028196A1 (fr) 2022-07-20

Family

ID=72943844

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20793259.1A Pending EP4028196A1 (fr) 2019-09-11 2020-09-08 Procédé pour établir une liaison électriquement conductrice

Country Status (4)

Country Link
US (1) US20220194014A1 (fr)
EP (1) EP4028196A1 (fr)
DE (1) DE102019124333A1 (fr)
WO (1) WO2021047733A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0367705A3 (fr) * 1988-10-31 1990-09-26 International Business Machines Corporation Jonction ultrasonique assistée par laser
JP2002118152A (ja) * 2000-10-06 2002-04-19 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
JP2004006465A (ja) * 2002-05-31 2004-01-08 Renesas Technology Corp 半導体装置の製造方法
DE102018121696A1 (de) 2018-09-05 2020-03-05 Hesse Gmbh Verfahren zum elektrischen Kontaktieren eines Batterieblocks

Also Published As

Publication number Publication date
DE102019124333A1 (de) 2021-03-11
WO2021047733A1 (fr) 2021-03-18
US20220194014A1 (en) 2022-06-23

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