EP4022663A1 - Elektronenquelle zum erzeugen eines elektronenstrahls - Google Patents
Elektronenquelle zum erzeugen eines elektronenstrahlsInfo
- Publication number
- EP4022663A1 EP4022663A1 EP20751508.1A EP20751508A EP4022663A1 EP 4022663 A1 EP4022663 A1 EP 4022663A1 EP 20751508 A EP20751508 A EP 20751508A EP 4022663 A1 EP4022663 A1 EP 4022663A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- graphene
- cathode
- electron source
- anode
- electron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/304—Field-emissive cathodes
- H01J1/3042—Field-emissive cathodes microengineered, e.g. Spindt-type
- H01J1/3046—Edge emitters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/06—Cathodes
- H01J35/064—Details of the emitter, e.g. material or structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/316—Cold cathodes, e.g. field-emissive cathode having an electric field parallel to the surface, e.g. thin film cathodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements common to two or more basic types of discharge tubes or lamps
- H01J3/02—Electron guns
- H01J3/021—Electron guns using a field emission, photo emission, or secondary emission electron source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements common to two or more basic types of discharge tubes or lamps
- H01J3/02—Electron guns
- H01J3/027—Construction of the gun or parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/06—Cathodes
- H01J35/065—Field emission, photo emission or secondary emission cathodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/06—Cathodes
- H01J35/066—Details of electron optical components, e.g. cathode cups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/36—Solid anodes; Solid auxiliary anodes for maintaining a discharge
- H01J1/38—Solid anodes; Solid auxiliary anodes for maintaining a discharge characterised by the material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30446—Field emission cathodes characterised by the emitter material
- H01J2201/30453—Carbon types
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/319—Circuit elements associated with the emitters by direct integration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/06—Cathode assembly
- H01J2235/062—Cold cathodes
Definitions
- the invention relates to an electron source for generating an electron beam.
- the invention also relates to a method for generating an electron beam.
- Electron sources are used, among other things, in electron microscopy and for the generation of X-rays.
- a point source of high brilliance and low energy dispersion is required;
- a high stability and service life with vacuum conditions that are as uncritical as possible are desirable.
- Thermal emitters with low brilliance but simple construction are known from the prior art. Also known are monocrystalline tungsten or LaB6 field effect emitters which, although they have a high level of brilliance, have extreme vacuum requirements due to ion bombardment and can only be operated stably over short periods of time. Finally, so-called Schottky emitters are known which are operated at high temperatures and represent a sensible compromise between field effect emitters and the more stable thermal emitters. However, Schottky emitters are expensive, usually have to be selected by hand and require complex adjustment during installation; in addition, their shelf life is limited to one to a few years.
- the invention is based on the object of providing an improved electron source for generating an electron beam. Another object of the invention is to provide an improved method for generating an electron beam. In particular, the invention is intended to overcome disadvantages of the electron sources and methods for generating an electron beam known from the prior art.
- the object set is achieved by an electron source with the features of claim 1.
- the electron source according to the invention has a cathode with a substrate which comprises silicon carbide.
- the substrate of a component (for example the cathode) of the electron source is a material on which the component (and possibly other components) are directly (in the sense that the component is directly in mechanical connection with the substrate) or indirectly (in the sense that components are mechanically connected to the substrate by means of another component or another material).
- Silicon carbide in the context of the present invention can have defects and / or be doped with foreign atoms. It can be single or multicrystalline.
- This aspect of the invention can take advantage of the fact that silicon carbide has good high-voltage strength. It can also take advantage of the fact that processes for manufacturing silicon carbide on an industrial scale are available. Finally, with silicon carbide it can advantageously be achieved that with electrical potential differences of a few kilovolts, as required for an electron source, surface currents only play a subordinate role.
- the invention can advantageously be achieved that several components of the electron source can be arranged on a common substrate comprising silicon carbide, which can result in greater integration. This can simplify the manufacture of the electron source according to the invention. Miniaturization, that is to say a reduction in the installation space required for the electron source, can also advantageously be achieved. In particular, an on-chip electron source can be realized with the invention.
- one or more components of the electron source can be arranged with other electronic, mechanical or mechatronic components on a common substrate comprising silicon carbide, which can also result in a higher integration density.
- This can simplify the manufacture of devices that include an electron source. It is also advantageously possible to achieve miniaturization, that is to say a reduction in the installation space that is required for a device that includes an electron source.
- an on-chip device which has an electron source can be realized with the invention.
- an electron source for generating an electron beam which comprises an anode which has a graphene layer.
- a graphene layer in the context of the present invention is a graphene monolayer or a graphene multilayer with a maximum of 100 graphene monolayers lying on top of one another.
- a single layer of in one is used as a graphene monolayer carbon atoms arranged in a hexagonal lattice.
- a graphene monolayer according to the invention can - locally or completely - be chemically modified, have lattice distortions and / or defects and / or be doped with foreign atoms.
- a completely or partially oxidized graphene layer is also a graphene layer in the context of the present invention. However, the preferred graphene layer is not or only partially oxidized or chemically modified.
- a multilayer graphene layer according to the invention preferably has less than 50, particularly preferably less than 15, particularly preferably less than 4, preferably less than 3 monolayers.
- This aspect of the invention can take advantage of the fact that graphene is one of the materials with particularly high permissible current densities.
- the invention can also take advantage of the fact that graphene is extremely robust.
- the object is also achieved by a method for generating an electron beam having the features of claim 15.
- electrons are emitted from a cathode, the cathode having a substrate comprising silicon carbide.
- electrons are accelerated to an anode, which comprises a graphene layer.
- the invention is suitable for the monolithic production of a miniaturized source of a high-energy, focused electron beam, including its use as an on-chip X-ray source. All components of the electron source according to the invention can be manufactured from or on a single silicon carbide chip.
- the substrate particularly preferably consists predominantly, particularly preferably completely, of silicon carbide.
- the preferred silicon carbide of the invention is one of the polytypes 4H-SiC and 6H-SiC.
- the preferred cathode comprises a graphene layer, preferably the cathode consists of one or more graphene layers.
- the preferred graphene layer (s) of the cathode is / are in contact with the silicon carbide of the substrate.
- the graphene layer of the cathode is preferably grown epitaxially with the silicon carbide, for example by thermal decomposition.
- a suitable method for producing epitaxial graphene on silicon carbide is from KV Emtsev, A. Bostwick, K. Horn, J. Jobst, GL
- Kellogg L. Ley, J.L. McChesney, T. Ohta, S.A. Reshanov, J. Rohrl, E. Rotenberg, A.K. Schmid, D. Waldmann, H.B. Weber, T. Seyller, Towards wafer-size graphene layers by atmospheric pressure graphitization of Silicon Carbide, Nat Mater, 8 (2009) 203-207 and from Hertel, F. Kisslinger, J. Jobst, D. Waldmann, M. Krieger, HB Weber, Current annealing and electrical breakdown of epitaxial graphene, Applied Physics Leiters, 98 (2011) 212109 known. The methods described there can also be used in an analogous manner on 4H-SiC.
- Epitaxial graphene in particular on silicon carbide, can advantageously allow particularly high current densities and be extremely robust. This can be used in the invention to achieve high currents or to withstand an oppositely accelerated parasitic ion bombardment and thus enable stable operation of the electron source according to the invention.
- the preferred electron source has an anode.
- it preferably has an acceleration path between the cathode and the anode in order to extract electrons from the cathode due to an electrical potential difference, also referred to as extraction voltage, between the cathode and anode and to accelerate them from the cathode towards the anode.
- the potential difference is greater than 100 V (volts), preferably greater than 300 V, particularly preferably greater than 1 kV (kilovolts), particularly preferably greater than 9 kV, particularly preferably greater than 15 kV.
- the potential difference is preferably less than 40 kV, particularly preferably less than 30 kV, particularly preferably less than 25 kV, for example 20 kV.
- This embodiment of the invention is particularly suitable for an electron source for generating X-rays.
- the potential difference is greater than 90 kV, preferably greater than 200 kV, particularly preferably greater than 350 kV.
- the potential difference is preferably less than 1,500 kV, particularly preferably less than 800 kV, for example 400 kV.
- the preferred anode comprises a graphene layer, preferably the anode consists of one or more graphene layers.
- the preferred anode has a substrate comprising silicon carbide.
- the preferred graphene layer (s) of the anode is / are in contact with the silicon carbide of the substrate.
- the graphene layer of the anode is preferably grown epitaxially with the silicon carbide of the substrate, for example by thermal decomposition.
- the preferred anode is a perforated anode in the sense that it has a channel which plays the role of the hole of the perforated anode.
- Graphene layer (s) adjoins the channel, preferably on opposite sides of the channel.
- the channel can be open or closed at the end facing away from the cathode.
- the perforated anode comprises two graphene layers, which particularly preferably lie in a common plane. Edges of the graphene layers facing each other form the channel of the perforated anode, which is open on both sides.
- the preferred channel comprises a groove in the substrate running in the longitudinal direction of the channel.
- the graphene layer (s) of the anode is or are preferably arranged, directly or indirectly, on the areas of the substrate adjoining the channel.
- the preferred substrate comprises or consists of silicon carbide.
- the preferred substrate is structured, doped and / or metallized in order to divert undesired portions of the electron beam or to counteract or even completely prevent static charging.
- the cathode and the anode are preferably arranged on the same substrate, which comprises or consists of silicon carbide.
- the silicon carbide in particular also in connection with epitaxial graphene, has a high breakdown field strength and low leakage currents can advantageously be used here.
- the anode comprises a second substrate, which preferably also comprises or consists of silicon carbide and can be structured, doped and / or metallized.
- This substrate also preferably bears a graphene layer, wherein particularly preferably the surfaces of the graphene layer (s) of the first and of the second substrate lie opposite one another in order to form a channel for the electron beam between them.
- the second substrate particularly preferably extends over the cathode.
- the second substrate particularly preferably extends over the acceleration path between anode and cathode.
- the second substrate particularly preferably extends over the entire electron source.
- a further structure can be provided between the cathode and the anode, which structure is constructed in the manner of one of the embodiments of the anode described above. This can be kept at a negative potential compared to the cathode during operation and thus perform the function of a conventional Wehnelt cylinder.
- the graphene layer of the cathode is arranged in such a way that electrons are emitted at an edge of the graphene layer of the cathode in order to be accelerated towards the anode.
- the graphene layer preferably lies epitaxially on a pedestal on the substrate of the cathode.
- the edge is preferably facing the anode of the electron source.
- a preferred graphene layer of the cathode is designed as a strip.
- the width of the preferred strip is less than 300 nm (nanometers), particularly preferably less than 100 nm, particularly preferably less than 30 nm, particularly preferably less than 10 nm.
- Suitable strips and a suitable manufacturing process are, for example, from M. Sprinkle, M Ruan, Y. Hu, J. Hankinson, M. Rubio-Roy, B. Zhang, X. Wu, C. Berger, WA de Heer, Scalable templated growth of graphene nanoribbons on SiC, Nature nanotechnology, 5 (2010) 727-731. Special features of graphene growth on silicon carbide surfaces can be used.
- the cathode comprises not just one but two of the or more strips. The preferred strips are arranged in parallel.
- the graphene of the preferred graphene layer of the cathode is chemically functionalized at the edge of the graphene layer that emits the electrons of the electron beam, for For example, through carboxyl groups, fluorine or oxidation with oxygen.
- the cathode graphene layer is divided at its emitting edge in its longitudinal direction into several sections, one or more of which are not functionalized and another or different sections are functionalized or of which one or more sections are functionalized differently than another Section or other sections.
- a non-functionalized section can be bounded on both sides by functionalized, for example oxidized, sections.
- the preferred cathode has a graphene-graphene tunnel contact or a graphene-graphene nanobridge.
- a tunnel contact within the meaning of the present invention is formed from two opposing electrodes which are at their smallest distance in the area of the tunnel contact, this distance being less than 1 nm.
- a nanobridge within the meaning of the present invention is formed by two electrodes that are connected to one another by a bridge, the bridge at its narrowest point being less than 100 nm, particularly preferably less than 10 nm, particularly preferably less than 1 nm wide.
- the graphene-graphene tunnel contact or the graphene-graphene nano-bridge are constructed and arranged in such a way that electrons are emitted from the vicinity of the graphene-graphene tunnel contact or a graphene-graphene nano-bridge.
- the electrons are preferably emitted in the direct vicinity of the graphene-graphene tunnel contact or the graphene-graphene nanobridge.
- This embodiment of the invention is based, inter alia, on the knowledge that with a graphene-graphene tunnel contact and a graphene-graphene nanobridge, a spatially narrowly delimited electron plasma (also referred to as nanoplasm) can arise above the positive electrode. It is therefore particularly preferred that the cathode emits electrons from this plasma.
- the electrons emitted in the area of the graphene-graphene tunnel contact or the graphene-graphene nanobridge can, according to the invention, be accelerated towards the anode.
- the preferred graphene-graphene tunnel junction or the preferred graphene-graphene nanobridge face the anode for this purpose.
- the cathode comprises one or more carbon nanotubes.
- electrons are emitted from the carbon nanotube (s) in order to be accelerated towards the anode.
- the preferred nanotube (s) is or are arranged on the emitting edge of the graphene layer or the graphene layers of the cathode.
- the carbon nanotube (s) are synthesized at the edge of the graphene layer (s).
- a suitable method for this is, for example, from J.R. Sanchez-Valencia, T. Dienel, O.
- the carbon nanotube (s) can be used to achieve a geometric narrowing of the emission location of the electrons at the cathode.
- a carbon nanotube within the meaning of the present invention comprises both single-walled and multi-walled carbon nanotubes.
- a carbon nanotube can be open on both sides, open on one side or closed on both sides.
- a carbon nanotube according to the invention can - locally or completely - be chemically modified, have lattice distortions and / or defects and / or be doped with foreign atoms.
- a completely or partially oxidized carbon nanotube is also a carbon nanotube for the purposes of the present invention. However, the preferred carbon nanotube is not or only partially oxidized or chemically modified in some other way.
- the wall of a multi-walled carbon nanotube according to the invention preferably has fewer than 8, particularly preferably fewer than 4 layers of carbon atoms arranged in a hexagonal lattice.
- the end of the nanotube according to the invention pointing away from the cathode is semiconducting or metallic.
- a preferred electron source comprises electron optics, for example an electrostatic lens for focusing the electron beam.
- the electron optics preferably comprise a substrate which has a graphene layer, particularly preferably epitaxially grown, and / or a metallization.
- the substrate preferably comprises or consists of silicon carbide.
- the preferred electron optics are arranged on the same substrate as the cathode and / or the anode.
- the electron source according to the invention can have a dielectric resonance structure in order to accelerate the electrons of the electron beam.
- Suitable resonance structures are, for example, from R.J. England, R.J. Noble, K. Bane, D.H. Dowell, C.-K. Ng, J.E. Spencer, S. Tantawi, Z. Wu, R.L. Byer, E. Peralta, K. Soong, C.-M. Chang, B. Montazeri, S.J. Wolf, B. Cowan, J. Dawson, W. Gai, P. Hommelhoff, Y.-C. Huang, C. Jing, C. McGuinness, R.B. Palmer, B. Naranjo, J. Rosenzweig, G. Travish, A.
- the resonance structure preferably comprises a substrate which comprises or consists of silicon carbide.
- the substrate preferably comprises or consists of silicon carbide.
- the preferred resonance structure is arranged on the same substrate as the cathode and / or the anode and / or the electron optics.
- the electron source has a target which is arranged and designed in such a way that the electron beam strikes the target in order to generate X-rays.
- metallic layers for example copper, nickel or graphite, can be used as the target. It can advantageously be achieved that at the location where the electron beam impinges on the target, characteristic bremsstrahlung is generated in the form of x-ray radiation over a small area, which radiates outwards.
- the punctual heat load on the target can in one embodiment of the invention by a pulsed operation or by varying the location of the impingement of the electron beam over time.
- the electron beam can be deflected electrostatically with the aid of one or more deflection plates, for example in order to scan the target line by line.
- the target preferably has a substrate which particularly preferably comprises or consists of silicon carbide.
- the target is particularly preferably arranged on the same substrate as the cathode and / or the anode and / or the electron optics.
- the good heat conduction of silicon carbide can be used to advantage.
- the invention is particularly suitable for providing microfocus X-ray sources which require good focusing of the electron beam. It is also suitable for miniaturized and inexpensive X-ray sources for novel applications, in particular in the medical field, space travel and for materials research.
- a preferred electron source comprises power electronic components, for example for controlling the cathode, the anode, the electrostatic lens and / or the dielectric resonance structure.
- the power electronic components are preferably arranged on the same substrate as the cathode, the anode, the electron optics and / or the dielectric resonance structure.
- Suitable components are, for example, from S. Hertel, D. Waldmann, J. Jobst, A. Albert, M. Albrecht, S. Reshanov, A. Schoner, M. Krieger, H.B. Weber, Tailoring the graphene / silicon Carbide interface for monolithic wafer-scale electronics, Nature Communications, 3 (2012), from S. Hertel, M. Krieger, H.B.
- FIG. 1 shows the cathode of an electron source according to the invention
- FIG. 2 shows an electron source according to the invention with the cathode from FIG. 1, in which the cathode and anode are arranged on a common substrate;
- FIG. 3 shows the electron source from FIG. 2, developed in such a way that the graphene layers of the perforated anode from FIG. 2 are opposite two further graphene layers;
- FIG. 4 shows an electron source according to the invention with a target for generating X-rays.
- FIG. 1 an embodiment of a cathode 1 of the electron source 2 according to the invention is shown.
- the electron emission takes place from an edge 3 of a graphene layer of the cathode 1, which is placed on a high negative potential.
- the edge 3 of the cathode 1 faces the anode 4 of the electron source 2.
- the electron source 2 shown in the figures is based on the material system epitaxial graphene on silicon carbide.
- the starting material is a silicon carbide substrate 5. Due to the material properties, an HPSI (high purity semiinsulating) 4H-SiC, which is commercially available, is particularly suitable.
- HPSI high purity semiinsulating 4H-SiC, which is commercially available, is particularly suitable.
- the pedestal 9 for the emitting edge 3 is structured lithographically and etched by a dry etching process in a reactive ion etching system (RIE).
- RIE reactive ion etching system
- an epitaxial graphene layer 6 is then produced by thermal decomposition of the silicon carbide surface (silicon side), as from the above-cited publication by KV Emtsev et al., Towards wafer-size graphene layers by atmospheric pressure graphitization of silicon Carbide, Nat Mater, 8 (2009) 203-207.
- the sample is heated in an oven under an argon atmosphere close to atmospheric pressure for 30 minutes at around 1,700 ° C.
- the graphene surface 6 is defined on the pedestal and exposed by an oxygen plasma etching step. Through this excess graph areas are removed.
- the metal contact 7 to the graphene emitter is produced in a final lithography step by vapor deposition of 5 nm titanium (Ti) and 50 nm gold (Au) and a subsequent lift-off process.
- the cathode In an alternative embodiment of the cathode, not shown in the figures, it is spatially pointed by using epitaxially defined graphene strips.
- the graphene strips are a few nanometers wide.
- the current flows along the graphene strips and the electrons are emitted from the edge, which is only a few nanometers short.
- the emitting edge (s) 3 of the cathode 1 shown in the figures or of the last-described cathode made of graphene strips can be equipped with one or more carbon nanotubes.
- the cathode In a further alternative embodiment of the cathode, not shown in the figures, it is designed as a graphene-graphene tunnel contact or graphene-graphene nanobridge.
- the inventors have found that above the positive electrode of such a tunnel contact or such a nano-bridge a spatially narrowly delimited electron plasma forms, which can be used to extract electrons. Because of Its light emission, similar to black body radiation at 2,000 K, is expected to have a corresponding energy dispersion (approx. 200 meV).
- two graphene surfaces are produced on the pedestal using lithography and oxygen plasma etching in such a way that a thin graphene channel approximately 50 nm wide connects the two graphene surfaces at the pedestal edge.
- Each graphene surface is contacted with a Ti / Au contact as described above.
- the thin graphene channel is then opened by means of an electroburning process, so that a gap approximately 1 to 3 nm wide, also known as nanogap, is created.
- a voltage ramp of around 0 to 100 V is applied to the two Ti / Au contacts in air.
- the current through the graph channel increases and heats it up so that the graph channel “burns through” locally. This is shown by a drop in the current at which the voltage ramp is immediately interrupted.
- the size of the nanogap can be adjusted via the ohmic resistance.
- the electrons of the electron beam 8 emitted from the cathode 1 are accelerated in the direction of a perforated anode 4 by means of an extraction voltage.
- the simplest embodiment of such a perforated anode 4 is shown in FIG. To manufacture this anode, both the pedestal
- the graphene layer 12 is on the anode web
- the anode bar 10 left and contacted by means of Ti / Au contacts (not shown); no additional process step is required for this.
- the anode bar 10 can also be doped. This is done before the
- Graphene growth process lithographically defines an implantation mask for the anode web 10 and the latter is doped by ion implantation, for example with nitrogen ions, in such a way that good conductivity is achieved; a suitable nitrogen concentration is 10 19 cm x 3 .
- the sample is then covered with a carbon cap, the implantation damage is healed at 1,700 ° C. for a period of 30 minutes and the doping is activated.
- the carbon cap is then removed by oxidation in oxygen at 800 ° C for a period of 30 minutes and the sample is cleaned again. The further production takes place as described above.
- an enclosed structure can be produced by covering the structure described above.
- a second silicon carbide substrate 13 is structured in such a way that a mirror-image anode web 14 is created for the upper side, as shown in FIG.
- This structuring takes place with the same process steps as described above for the bottom side, including graph growth.
- the two semiconductor wafers are then pressed and clamped, glued or connected to one another by a wafer bonding process.
- the components of the electron source 2 are therefore located inside the chip and are therefore additionally protected against external influences.
- the electron beam 8 exits through the side opening of the perforated anode.
- FIG. 4 shows a further development of the electron source 2 shown in FIG. 2, which additionally has a target 15 in order to be able to be used for the generation of X-rays 16.
- an opening for the inclined target pedestal 17 is structured in a further lithography step. This process step should take place before the structuring of the cathode platform 9 and the anode web 10.
- the inclined target surface is achieved either by an isotropic RIE dry etching step, i.e. at higher process pressure, by gray-scale lithography or by selective electrochemical etching. In the latter process, aluminum is implanted at an incline before the graphene grows; the electrochemical process selectively removes the aluminum-doped areas.
- the target metallization is achieved through vapor deposition of metallic layers, for example copper or nickel, through a lithographically defined mask with a subsequent lift-off process.
- Metal and layer thickness depend on the respective application. Typical layer thicknesses are in the range between 10 nm and 1 ⁇ m. The further process steps are carried out as described above.
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- Electron Sources, Ion Sources (AREA)
Abstract
Description
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019123248.1A DE102019123248B4 (de) | 2019-08-29 | 2019-08-29 | Elektronenquelle zum Erzeugen eines Elektronenstrahls |
| PCT/EP2020/071704 WO2021037481A1 (de) | 2019-08-29 | 2020-07-31 | Elektronenquelle zum erzeugen eines elektronenstrahls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4022663A1 true EP4022663A1 (de) | 2022-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| EP20751508.1A Withdrawn EP4022663A1 (de) | 2019-08-29 | 2020-07-31 | Elektronenquelle zum erzeugen eines elektronenstrahls |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220406556A1 (de) |
| EP (1) | EP4022663A1 (de) |
| CN (1) | CN114521282A (de) |
| DE (1) | DE102019123248B4 (de) |
| WO (1) | WO2021037481A1 (de) |
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| CN119233508B (zh) * | 2024-09-24 | 2025-11-14 | 中山大学 | 一种微型无线热释电x射线源 |
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|---|---|---|---|---|
| JP3054205B2 (ja) * | 1991-02-20 | 2000-06-19 | 株式会社リコー | 電子放出素子集積基板 |
| JP3634781B2 (ja) * | 2000-09-22 | 2005-03-30 | キヤノン株式会社 | 電子放出装置、電子源、画像形成装置及びテレビジョン放送表示装置 |
| US6876724B2 (en) * | 2000-10-06 | 2005-04-05 | The University Of North Carolina - Chapel Hill | Large-area individually addressable multi-beam x-ray system and method of forming same |
| JP4095610B2 (ja) * | 2004-12-28 | 2008-06-04 | キヤノン株式会社 | 電子放出素子、電子源、画像表示装置、および映像受信表示装置 |
| US7508122B2 (en) * | 2005-01-05 | 2009-03-24 | General Electric Company | Planar gated field emission devices |
| CN102103953B (zh) * | 2009-12-22 | 2012-09-05 | 中国科学院物理研究所 | 一种在碳化硅基底上外延生长的冷阴极场发射材料及方法 |
| DE102011016900A1 (de) | 2011-04-13 | 2012-10-18 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Halbleiterbauelement |
| EP2535937B1 (de) | 2011-06-17 | 2015-03-11 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Elektronische Vorrichtung |
| US9331189B2 (en) * | 2012-05-09 | 2016-05-03 | University of Pittsburgh—of the Commonwealth System of Higher Education | Low voltage nanoscale vacuum electronic devices |
| CN103456581B (zh) * | 2013-09-10 | 2016-08-24 | 中国科学院深圳先进技术研究院 | 碳纳米管场发射阴极及其制备方法 |
| CN104409303A (zh) * | 2014-10-31 | 2015-03-11 | 深圳先进技术研究院 | 基于碳纳米管/石墨烯复合阴极结构的x射线源 |
| WO2017112937A1 (en) * | 2015-12-23 | 2017-06-29 | Massachusetts Institute Of Technology | Electron transparent membrane for cold cathode devices |
| US9805900B1 (en) * | 2016-05-04 | 2017-10-31 | Lockheed Martin Corporation | Two-dimensional graphene cold cathode, anode, and grid |
| CN106252179A (zh) | 2016-08-29 | 2016-12-21 | 北京大学 | 一种基于阻变材料的微型电子源及其阵列和实现方法 |
| US10784024B2 (en) | 2017-08-30 | 2020-09-22 | Ultra Conductive Copper Company, Inc. | Wire-drawing method and system |
| RU181863U1 (ru) | 2017-12-01 | 2018-07-26 | федеральное государственное автономное образовательное учреждение высшего образования "Южный федеральный университет" (Южный федеральный университет) | Автоэмиссионный пленочный диод |
| CN109273337B (zh) | 2018-11-12 | 2023-11-10 | 北京大学 | 一种片上微型x射线源及其制造方法 |
-
2019
- 2019-08-29 DE DE102019123248.1A patent/DE102019123248B4/de active Active
-
2020
- 2020-07-31 WO PCT/EP2020/071704 patent/WO2021037481A1/de not_active Ceased
- 2020-07-31 CN CN202080067855.XA patent/CN114521282A/zh active Pending
- 2020-07-31 EP EP20751508.1A patent/EP4022663A1/de not_active Withdrawn
- 2020-07-31 US US17/638,891 patent/US20220406556A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN114521282A (zh) | 2022-05-20 |
| DE102019123248B4 (de) | 2025-04-24 |
| US20220406556A1 (en) | 2022-12-22 |
| DE102019123248A1 (de) | 2021-03-04 |
| WO2021037481A1 (de) | 2021-03-04 |
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