EP3916906A1 - Mikrostreifenstrahlungseinheit und gruppenantenne - Google Patents

Mikrostreifenstrahlungseinheit und gruppenantenne Download PDF

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Publication number
EP3916906A1
EP3916906A1 EP19912014.8A EP19912014A EP3916906A1 EP 3916906 A1 EP3916906 A1 EP 3916906A1 EP 19912014 A EP19912014 A EP 19912014A EP 3916906 A1 EP3916906 A1 EP 3916906A1
Authority
EP
European Patent Office
Prior art keywords
radiation unit
microstrip
circuit
radiation
top portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19912014.8A
Other languages
English (en)
French (fr)
Other versions
EP3916906A4 (de
Inventor
Shengjun LUO
Bo PAN
Ji Cheng
Yaoting YANG
Yanming Sun
Weihua Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CICT Mobile Communication Technology Co Ltd
Original Assignee
CICT Mobile Communication Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CICT Mobile Communication Technology Co Ltd filed Critical CICT Mobile Communication Technology Co Ltd
Publication of EP3916906A1 publication Critical patent/EP3916906A1/de
Publication of EP3916906A4 publication Critical patent/EP3916906A4/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/062—Two dimensional planar arrays using dipole aerials

Definitions

  • Embodiments of the present disclosure relate to the technical field of communications, and in particular, to a microstrip radiation unit and an array antenna.
  • the 5th-Generation (5G) mobile communication technology applies large-scale antenna technology, and dozens or even hundreds of antenna arrays are deployed at a base station to increase network capacity.
  • the large-scale antenna technology in the 5G era turns the antenna into an integrated active antenna unit (AAU).
  • AAU integrates the antenna and the radio remote unit (RRU), resulting in the significant increase in the total weight of the AAU, which brings great troubles to the load-bearing and antenna installation of a tower, and thus the lightweight of the antenna becomes the most intuitive and most important goal to be achieved.
  • the traditional radiation unit is mainly made by the following three solutions.
  • a first solution is to adopt an aluminum alloy integral die-casting structure, in which due to the use of a metal base material with a higher density, a vibrator has a heavier weight, which does not meet a demand for lightweight of large-scale antennas. Moreover, the radiation portion and the feeding portion are separated, and the assembly is complicated, so it is not suitable for large-scale automated production.
  • a second solution is to adopt a PCB structure, in which the radiation portion and the feeding portion are etched on different flat substrate PCBs, and then the various parts are welded together to generate electrical contact. Although this implementation greatly reduces the weight of the radiation unit, due to the large number of parts, complex assembly and low reliability, it is very adverse to large-scale automated production.
  • a third solution is an improvement on the basis of the first solution, in which the radiation portion is made of engineering plastic by injection molding, and then the whole is electroplated. Although the weight of the radiation unit is reduced, the radiation portion and the feeding portion are still separate structures, which leads to complex assembly.
  • Embodiments of the present disclosure provide a microstrip radiation unit and an array antenna so as to solve the problems of heavy weight and complicated assembly of the traditional radiation unit.
  • an embodiment of the present disclosure provides a microstrip radiation unit, including a dielectric substrate, a radiation circuit, and a feed circuit;
  • the dielectric substrate is integrally formed by injection molding, and includes a top portion, a support portion and a welding portion, and the support portion is connected to the top portion and the welding portion respectively;
  • the radiation circuit is arranged on an upper surface of the top portion, and the feed circuit is arranged on a lower surface of the top portion and extends along the support portion to the welding portion.
  • an embodiment of the present disclosure provides an array antenna, including a plurality of microstrip radiation units as provided in the first aspect, and a feed network configured to install each of the plurality of microstrip radiation units.
  • the weight of the radiation unit is reduced by an integrally injection-molded dielectric substrate, and the radiation circuit and the feed circuit are both arranged on the dielectric substrate to realize the integration of the radiation unit, thus simple structure is provided, no assembly is required, reliability and consistency of the radiation units are improved, and it is more suitable for large-scale manufacture.
  • the single-layer radiation circuit is adopted to implement the microstrip radiation unit, which has good low profile characteristics, effectively reduces the height of the radiation unit, further reduces the weight of the radiation unit, and provides the lightweight of the radiation unit.
  • FIG. 1 is a schematic structural diagram of a microstrip radiation unit according to an embodiment of the present disclosure.
  • the microstrip radiation unit includes a dielectric substrate 11, a radiation circuit 12, and a feed circuit 13; wherein the dielectric substrate 11 is integrally formed by injection molding and includes a top portion 111, a support portion 112, and a welding portion 113.
  • the support portion 112 is connected to the top portion 111 and the welding portion 113, respectively; the radiation circuit 12 is arranged on an upper surface of the top portion 111, and the feed circuit 13 is arranged on a lower surface of the top portion 111 and extends along the support portion 112 to the welding portion 113.
  • the dielectric substrate 11 is an integrally injection-molded single part including the top portion 111, the support portion 112, and the welding portion 113 from top to bottom, wherein the support portion 112 is a connecting part between the top portion 111 and the welding portion 113.
  • the support portion 112 may be a single column structure as shown in FIG. 1 , it may also be composed of a plurality of support components.
  • a surface of the top portion 111 in contact with the support portion 112 is confirmed as a lower surface of the top portion 111, and accordingly a surface of the top portion 111 not in contact with the support portion 112 is confirmed as an upper surface of the top portion 111.
  • the radiation circuit 12 is arranged on the upper surface of the top portion 111.
  • the radiation circuit 12 may completely cover the upper surface of the top portion 111, or may be arranged on the upper surface of the top portion 111 in a shape consistent with the upper surface of the top portion 111, or may be arranged at a preset position of the upper surface on the top portion 111 based on a preset shape, which is not limited in the embodiment of the present disclosure.
  • the feed circuit 13 is arranged on the back of a surface for arranging the radiation circuit 12, that is, the lower surface of the top portion 111, and the support portion 112 in contact with the lower surface of the top portion 111 finally extends to the welding portion 113, so as to facilitate the electric connection between the feed circuit 13 and the feed network through the welding portion 113 in the state that the welding portion 113 is connected to the feed network when the microstrip radiation unit is installed.
  • the radiation circuit 12 is arranged on the upper surface of the top portion 111
  • the feed circuit 13 is arranged on the lower surface of the top portion 111
  • a specific arrangement position of the radiation circuit 12 on the upper surface of the top portion 111 corresponds to a specific arrangement position of the feed circuit 13 on the lower surface of the top portion 111 such that the radiation circuit 12 arranged on the upper surface of the top portion 111 and the feed circuit 13 arranged on the lower surface of the top portion 111 form a coupled feeding of the radiation unit.
  • the radiation circuit 12 and the feed circuit 13 may be arranged on the dielectric substrate 11 by 3D-MID (3D molded interconnect device) technology.
  • the weight of the radiation unit is reduced by an integrally injection-molded dielectric substrate 11, and the radiation circuit 12 and the feed circuit 13 are both arranged on the dielectric substrate 11 to realize the integration of the radiation unit, thus simple structure is provided, no assembly is required, reliability and consistency of the radiation units are improved, and it is more suitable for large-scale manufacturing.
  • the single-layer radiation circuit is adopted to implement the microstrip radiation unit, which has good low profile characteristics, effectively reduces the height of the radiation unit, further reduces the weight of the radiation unit, and provides the lightweight of the radiation unit.
  • FIG. 2 is a schematic structural diagram of a microstrip radiation unit according to another embodiment of the present disclosure.
  • an extension hole 114 is opened in the center of the top portion 111, and extends towards the direction of the welding portion in the support portion; and the radiation circuit is extended to and arranged on a wall of the extension hole 114.
  • an extension hole 114 is provided in the center of the top portion 111, and extends towards the direction of the welding portion.
  • the extension hole 114 may be a through hole, that is, both the support portion and the welding portion of the dielectric substrate are designed as hollow structures.
  • the extension hole 114 may also be a blind hole, that is, the extension hole 114 extends in but does not pass through the support portion, which is not specifically limited in the embodiment of the present disclosure.
  • the radiation circuit arranged on the upper surface of the top portion 111 is extended to and arranged on the wall of the extension hole 114.
  • the radiation circuit is divided into two parts, one part is a radiation circuit arranged on the upper surface of the top portion 111, that is, a top radiation circuit 121, and the other is a radiation circuit extending to the wall of the extension hole 114, that is, the extension radiation circuit 122.
  • the extension hole 114 is a hole provided in the center of the support portion
  • the support portion may be regarded as a hollow structure
  • the wall of the extension hole 114 is regarded as the inner wall of the support portion
  • the surface of the support portion on which the feed circuit is arranged is regarded as an outer wall of the support portion.
  • a non-conductive area is also arranged on the radiation circuit.
  • FIG. 3 is a top view of a microstrip radiation unit according to an embodiment of the present disclosure.
  • the top portion 111 of the dielectric substrate is circular, the top portion 111 is provided with a radiation circuit 12, and the center of the top portion 111 is provided with an extension hole 114.
  • Four groups of demetallized non-conductive areas 14, each of which is a staight-line shape, are evenly distributed on the upper surface with the center of the top portion 111 as a center of symmetry.
  • FIG. 4 is a top view of a microstrip radiation unit according to another embodiment of the present disclosure.
  • the top portion 111 of the dielectric substrate is octagonal, the top portion 111 is provided with a radiation circuit 12, and the center of the top portion 111 is provided with an extension hole 114.
  • Four groups of demetallized non-conductive areas 14, each of which is splayed, are evenly distributed on the upper surface with the center of the top portion 111 as a center of symmetry.
  • reinforcing ribs are also arranged on the top portion.
  • the structural strength of the integrated dielectric substrate and the flatness of the top planar structure may be improved.
  • Square-shaped reinforcing ribs with skirt may be disposed at the peripheral edges of the top portion, or cross-shaped reinforcing ribs may be disposed on the surface of the top portion based on the center of the top portion, which is not specifically limited in the embodiments of the present disclosure.
  • the radiation circuit and the feed circuit are symmetrically arranged about a central axis of the dielectric substrate. Therefore, when the microstrip radiation unit is subject to the complete machine assembly as a single component, the electrical connection assembly of the radiation unit and the feed network does not require additional identification, which is very suitable for automated production in large-scale array antenna applications.
  • FIG. 5 is a bottom view of the microstrip radiation unit according to an embodiment of the present disclosure.
  • the microstrip radiation unit includes four groups of feed circuits 13 uniformly distributed with a central axis of the dielectric substrate 11 as an axis of symmetry.
  • each group of feed circuits 13 has the same structure, and is distributed along the central axis by a 90° rotation in sequence.
  • the microstrip radiation unit containing four groups of feed circuits 13 is referred to as a dual-polarized radiation unit.
  • Each polarization of the dual-polarized radiation unit is fed differentially (with a 180° phase difference) by two groups of feed circuits 13 arranged oppositely and symmetrically so as to suppress high-order modes, further reduce the coupling between two ports, and improve the pattern consistency and isolation of +45° polarization and -45° polarization of a dual-polarized oscillator.
  • the welding portion 113 includes four plug pins 1131 evenly distributed with the central axis of the dielectric substrate 11 as an axis of symmetry, and each feed circuit 13 wraps a plug pin 1131.
  • each feed circuit 13 includes a top feed circuit 131, an intermediate connecting portion 132 and a bottom welding portion 133.
  • the top feed circuit 131 is a portion of said feed circuit 13 arranged on the top portion 111 of the dielectric substrate
  • the intermediate connecting portion 132 is a portion of said feed circuit 13 arranged on the support portion 112 of the dielectric substrate for connecting the top feed circuit 131 and the bottom welding portion 133
  • the bottom welding portion 133 is a portion of said feed circuit 13 arranged on the welding portion 113 of the dielectric substrate for wrapping one plug pin 1131 corresponding to the welding portion 113.
  • the bottom welding portion 133 for wrapping the plug pin 1131 is configured to electrically connect with a port of the feed network to provide signal excitation.
  • a slot 1132 is provided between any two adjacent plug pins 1131 of the welding portion 113.
  • the slot 1132 may be a slot of various shapes such as U-shaped slot and V-shaped slot.
  • the microstrip radiation unit is a three-dimensional molded interconnect device, and the entire microstrip radiation unit is a single component, which simplifies a supply chain, has a simple structure, improves the reliability and consistency of the radiation units, and is suitable for large-scale manufacture.
  • FIG. 6 is a schematic structural diagram of an array antenna according to an embodiment of the present disclosure.
  • the array antenna includes several microstrip radiation units 1, and a feed network 2 configured to install each microstrip radiation unit 1.
  • each microstrip radiation unit 1 is welded to the feed network 2 through the welding portion of the dielectric substrate to provide the electrical connection between the feed circuit and the feed network 2.
  • the welding portion may be a pin-type welding structure, or may be a patch-type welding structure, and the installation method between the microstrip radiation unit 1 and the feed network 2 is not specifically limited in the embodiments of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a feed network according to an embodiment of the present disclosure.
  • several feed ports 21 are provided on the feed network 2 for electrical connection with the welding portion of the microstrip radiation unit.
  • four feed ports 21 are provided for the microstrip radiation unit whose welding portion includes four plug pins. Each plug pin corresponds to one feed port 21.
  • the four plug pins In the case that four plug pins have rotational center symmetry, the four plug pins only need to be directly connected to the four feed ports 21 without additional identification during assembly, and thus blind mating assembly may be realized, which may significantly shorten the assembly time in antenna production and increase the assembly efficiency. Therefore, it is very suitable for implementing automated production in large-scale array antenna applications.
  • FIG. 8 is a schematic diagram of differential feeding of an integrated microstrip radiation unit according to an embodiment of the present disclosure, including an integrated microstrip radiation unit 1 and a differential feed network 2 thereof.
  • the four plug pins of the integrated radiation unit are blindly plugged into the four feed ports of the differential feed network 2 without additional identification.
  • two feed ports of the same polarization are arranged oppositely with a 180° phase difference.
  • the microstrip radiation unit 1 includes a dielectric substrate 11, a radiation circuit 12 and a feed circuit 13.
  • the dielectric substrate 11 is an integrated structure and is integrally formed by injection molding with high-temperature-resistant engineering plastics.
  • the dielectric substrate 11 includes a top portion 111, a support portion 112, a welding portion 113, and reinforcing ribs 15.
  • An extension hole 114 is provided at the center of the top portion 111 to form a smooth transition structure with the support portion 112, which is unobstructed from the top view.
  • the radiation circuit 12 includes a top radiation circuit 121 arranged on the upper surface of the top portion 111 of the dielectric substrate and an extension radiation circuit 122 arranged on the wall surface of the extension hole 114.
  • the top radiation circuit 121 is provided with a demetallized gap, that is, a non-conductive area 14.
  • the feed circuit 13 includes a top feed circuit 131 arranged on the bottom surface of the top portion 111 of the dielectric substrate, an intermediate connecting portion 132 arranged on the outer wall surface of the support portion 112 of the dielectric substrate, and a bottom welding portion 113 arranged on the welding portion of the dielectric substrate and wrapping one of the four plug pins of the welding portion 113 of the entire dielectric substrate.
  • the top portion 111 of the dielectric substrate has a square planar structure, and may also has a round or other polygonal structure. Through the arrangement of the extension hole 114 at the center of the top portion 111, materials used may be reduced and the weight of the integrated dielectric substrate 11 is also decreased.
  • the top radiation circuit 121 arranged on the top portion 111 of the dielectric substrate has a circuit shape consistent with the planar shape of the top portion 111 of the dielectric substrate 11.
  • four groups of non-conductive regions 14 having the same structures with the central axis of the dielectric substrate 11 as the axis of symmetry are provided, whose shapes are linear or inversed V-shaped or other deformed shapes, so as to improve the polarization isolation.
  • the cross-polarization ratio index of the microstrip radiation unit 1 may be greatly improved.
  • the reinforcing ribs 15 are respectively arranged on the peripheral edges of the top portion 111 of the dielectric substrate, forming a square skirt, and a cross shape on the center of the bottom surface of the top portion 111, so as to improve the structural strength of the integrated dielectric substrate 11 and the flatness of the planar structure of the top portion 111.
  • the support portion 112 forms a hollow closed structure to enhance the structural strength of the integrated dielectric substrate 11.
  • the support portion 112 may be in a barrel shape or other closed shapes.
  • the welding portion 113 includes four surrounding plug pins 1131 that rotate by 90°.
  • a U-shaped slot 1132 is provided in an area of two adjacent plug pins 1131 to further reduce the weight of the integrated dielectric substrate 11.
  • the microstrip radiation unit 1 includes four groups of feed circuits 13, each of which has the same structure and is distributed along the central axis in a 90° rotation in turn.
  • the top feed circuit 131 arranged on the bottom surface of the top portion 111, in the feed circuit 13 and the radiation circuit 12 form a radiation unit coupling feed
  • the intermediate connecting portion 132 is configured to connect with the top feed circuit 131 and the bottom welding portion 133, so as to provide the continuous electrical connection of the entire feed circuit 13.
  • the bottom welding portion 133 for wrapping the plug pin 1131 is configured to electrically connect with a feed port of the feed network 2 to provide signal excitation.
  • the bottom welding portion 133 may be configured as a pin-type plug-welding type structure, or may be configured as a disc-shaped patch type welding structure, which is not specifically limited in the embodiments of the present disclosure.
  • the four groups of feed circuits 13 based on the above structure jointly provide the feed excitation of the dual-polarized microstrip radiation unit 1, so as to suppress high-order modes, further reduce the coupling between two ports, and improve the pattern consistency and isolation of +45° polarization and -45° polarization of a dual-polarized oscillator.
  • the coupling feed mode may be adopted to effectively increase the matching bandwidth of the oscillator.
  • microstrip radiation unit 1 In the microstrip radiation unit 1 according to the embodiments of the present disclosure, a structure of single-layer radiation circuit 12 is adopted, and since the overall height of the microstrip radiation unit 1 is less than 0.15 ⁇ (where ⁇ represents the wavelength), it has good low profile characteristics. Secondly, the microstrip radiation unit 1 is specially provided with the extension radiation circuit 122, which greatly improves the cross-polarization index of the microstrip radiation unit 1.
  • the microstrip radiation unit 1 is a 3D-MID molded interconnect device, which is very light in weight and suitable for use in large-scale array antenna application, and the entire microstrip radiation unit 1 is a single part, which simplifies the supply chain, has a simple structure, improves the reliability and consistency of the radiation units, and is suitable for large-scale manufacture.
  • the radiation portion and the feeding portion of the microstrip radiation unit 1 are all centrosymmetric based on a single component of the radiation unit, and the four plug pins may be blindly inserted into the four feed ports of the feed network 2 without additional identification, which significantly shortens the assembly time in antenna production and improves assembly efficiency, being very suitable for realizing automated production in large-scale array antenna applications.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
EP19912014.8A 2019-01-22 2019-11-05 Mikrostreifenstrahlungseinheit und gruppenantenne Pending EP3916906A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910058017.5A CN109755721B (zh) 2019-01-22 2019-01-22 微带辐射单元和阵列天线
PCT/CN2019/115523 WO2020151297A1 (zh) 2019-01-22 2019-11-05 微带辐射单元和阵列天线

Publications (2)

Publication Number Publication Date
EP3916906A1 true EP3916906A1 (de) 2021-12-01
EP3916906A4 EP3916906A4 (de) 2022-03-16

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EP19912014.8A Pending EP3916906A4 (de) 2019-01-22 2019-11-05 Mikrostreifenstrahlungseinheit und gruppenantenne

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EP (1) EP3916906A4 (de)
CN (1) CN109755721B (de)
WO (1) WO2020151297A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109755721B (zh) * 2019-01-22 2021-03-05 中信科移动通信技术有限公司 微带辐射单元和阵列天线
CN110165374B (zh) * 2019-05-27 2021-03-05 中信科移动通信技术有限公司 一种用于5g天线的辐射单元
WO2021000137A1 (zh) * 2019-06-30 2021-01-07 瑞声声学科技(深圳)有限公司 天线振子
CN110416721A (zh) * 2019-08-27 2019-11-05 武汉虹信通信技术有限责任公司 辐射单元及阵列天线
CN112467343B (zh) * 2019-09-09 2023-07-04 普罗斯通信技术（苏州）有限公司 一种高增益小型化天线振子及天线
CN110571533A (zh) * 2019-09-29 2019-12-13 武汉虹信通信技术有限责任公司 Mimo天线的功分网络
CN113422201B (zh) * 2021-06-18 2023-07-07 京信通信技术(广州)有限公司 辐射单元及天线
CN113437506B (zh) * 2021-07-02 2022-12-09 中信科移动通信技术股份有限公司 一种贴片辐射单元与阵列天线
CN114243286B (zh) * 2021-12-03 2023-07-07 中国电子科技集团公司第二十九研究所 一种抗振动和冲击的微带馈电天线结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4069638B2 (ja) * 2002-02-08 2008-04-02 三菱電機株式会社 アンテナ素子
KR20090020878A (ko) * 2007-08-24 2009-02-27 (주)텔콤코리아 Ｕ자형 소자를 갖는 슬롯 평면 어레이 안테나
CN102185182B (zh) * 2011-04-09 2014-02-12 合肥安大电子检测技术有限公司 圆极化多模宽带天线及微带功分移相网络
CN102799220B (zh) * 2011-05-31 2015-04-22 深圳光启智慧科技有限公司 一种笔记本电脑
CN202651355U (zh) * 2012-07-06 2013-01-02 苏州博海创业微系统有限公司 三频传输装置
EP3166178B1 (de) * 2015-11-03 2019-09-11 Huawei Technologies Co., Ltd. Antennenelement, vorzugsweise für eine basisstationsantenne
CN107706512B (zh) * 2016-08-09 2019-09-27 广东通宇通讯股份有限公司 一种用于大规模mimo天线的馈电网络系统
CN207124278U (zh) * 2017-08-08 2018-03-20 京信通信系统（中国）有限公司 一种微带辐射单元及其天线
CN108134197A (zh) * 2017-12-26 2018-06-08 上海安费诺永亿通讯电子有限公司 一体化四点差分馈电低剖面双极化振子单元及基站天线
CN208078182U (zh) * 2018-05-03 2018-11-09 京信通信系统（中国）有限公司 基站天线及其双极化天线振子
CN108777352B (zh) * 2018-05-07 2024-04-16 广东通宇通讯股份有限公司 一种双极化微带贴片振子组件
CN109037906A (zh) * 2018-06-04 2018-12-18 深圳市飞荣达科技股份有限公司 一种基于塑胶电镀工艺的双极化天线
CN108899644B (zh) * 2018-06-20 2020-12-18 深圳市深大唯同科技有限公司 一种低剖面、小型化、高隔离度的双极化贴片天线单元
CN109149128B (zh) * 2018-09-05 2020-08-07 武汉虹信通信技术有限责任公司 一种5g大规模阵列天线
CN109244662B (zh) * 2018-09-06 2024-05-31 广东博纬通信科技有限公司 一种运用于5g系统的天线辐射单元
CN109755721B (zh) * 2019-01-22 2021-03-05 中信科移动通信技术有限公司 微带辐射单元和阵列天线

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CN109755721A (zh) 2019-05-14
WO2020151297A1 (zh) 2020-07-30
CN109755721B (zh) 2021-03-05
EP3916906A4 (de) 2022-03-16

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