EP3881652A1

EP3881652A1 - Circuit carrier, (power) electronics assembly and electrical drive device

Info

Publication number: EP3881652A1
Application number: EP19813729.1A
Authority: EP
Inventors: Johannes Weiss; Fabian WEISS; Johannes Katzmann; Frank Meyer; Matthias HAMMERL
Original assignee: Vitesco Technologies GmbH
Current assignee: Vitesco Technologies GmbH
Priority date: 2018-11-15
Filing date: 2019-11-13
Publication date: 2021-09-22
Also published as: US20210273533A1; CN113039870A; WO2020099464A1; DE102018219574A1

Abstract

The present invention discloses a circuit carrier (20) for establishing a mechanical and electrical connection for at least one (power) electronic component (500), comprising: - a support plate (100) which has at least one through-hole (200); - at least one electrically and thermally conductive insertion element (300) which is arranged in the through-hole (200) and has a first contact surface (301) for establishing electrical and thermal connections to the component (500) and a second contact surface (302), facing away from the first contact surface (301), for establishing thermal connections to a cooling body (600); - wherein the insertion element (300) also forms a feedthrough (210) and has a lateral contact face (303) which abuts the feedthrough (210) and is designed to establish an electrical and thermal connection to an electrical connection element (710).

Description

description

Circuit carriers, (power) electronics and electrical

Drive device

Technical field:

The present invention relates to a circuit carrier and a

(Power) electronic arrangement and an electrical drive device, in particular for a hybrid electric / electric vehicle, with a circuit carrier mentioned.

PRIOR ART AND OBJECT OF THE INVENTION:

Power electronics assemblies or electrical drive devices, especially for hybrid electric / electric vehicles, have power electrical components, such as. B. power electrical components and / or electrical machines, between which high currents with a current of more than 10 amperes, even over 100 amperes flow during operation of the power electronics assemblies or the drive devices. Furthermore, the

Power-electrical components due to their function or in particular due to the high currents, high power losses and thus strong waste heat, which must be dissipated by the components shortly before they occur.

There is the general requirement to produce the power electronics assemblies or the electrical drive devices inexpensively.

It is therefore the object of the present application to provide a possibility with which a (power) electronic arrangement or an electrical drive device can be produced inexpensively.

Description of the invention: This object is solved by the subject matter of the independent claims. Advantageous refinements are the subject of the dependent claims.

According to a first aspect of the invention, a circuit carrier for

Establishing mechanical and electrical connection for at least one

(Power) electronic (or (power) electrical) component provided.

The circuit carrier has at least one carrier plate which has at least one through hole. The circuit carrier has at least one electrically and thermally conductive insert element which is arranged in the through hole of the carrier plate. The insert element has a first contact surface for producing (direct areally extensive) electrical and thermal connections to the component, and a second, from the first

Contact surface facing away from the contact surface for manufacture

(also directly extensive) thermal connections to a heat sink. The insert element also forms a feedthrough and also has a contact side surface, which lies on the feedthrough and is designed to produce an (also direct, extensive) electrical and thermal connection to an electrical connection element.

Here, a circuit carrier or a carrier plate are carriers for

(power) electronic components. They are used for mechanical fastening and electrical connection for the (performance) electronic components.

Due to the design described above, the insert element combines two

Functions, namely power transmission and heat transfer. Over the two contact surfaces and the contact side surface, the insert element forms extensive contact or transfer surfaces for efficient

Power transmission and at the same time efficient heat transport. The current-carrying circuit components, that is

(Power) electronic component and the electrical connection element, electrically with each other via the insert element (direct and low-resistance)

get connected. Furthermore, the circuit components that are themselves high Generate waste heat or stand under high thermal load, can be (directly) thermally connected to the heat sink, namely the heat sink, using the same insert element. The electricity transmission between the live

Circuit components and the heat transfer from them

Circuit components to the heat sink are thus made directly by one and the same insert element. The insert element differs from a plated-through hole, which is generally known in printed circuit board technology.

in that in the insert element all thermal and electrical contacts to the above-mentioned circuit components and the heat sink are made directly and via extensive contact surfaces and extensive contact side surface. In this case, the insert element can be fitted on the carrier plate by a generally known placement machine during a placement process in which other electrical components are also fitted on the carrier plate.

Here, the term "direct" means that the electrical or thermal connections (especially only) via low-resistance and heat-conducting direct

Connection, by means of, for example, soldering, welding or gluing, in particular without or with only negligibly low electrical or thermal resistance.

By using the insert element, which combines two functions, namely power transmission and heat transport, otherwise required components can be saved exclusively for power transmission or only for heat transport. This reduces costs.

This provides a possibility of producing a (power) electronic arrangement or an electrical drive device inexpensively.

E.g. the insert element has at least one contact section

Establishing the electrical and thermal connection to the

Connection element that extends over the first and / or the second Contact surface extends beyond. The contact side surface is at least partially formed on the contact section.

E.g. the bushing extends through the insert element.

Alternatively, the feedthrough is formed, for example, between the insert element and a side surface of the carrier plate and within the through hole.

E.g. the circuit carrier further has at least one conductor track which is formed between two sides of the carrier plate and / or on at least one side of the carrier plate and is electrically and thermally connected to the insert element.

According to a second aspect of the invention, a

(Power) electronics arrangement provided.

The electronic arrangement has at least one previously described

Circuit carrier and at least one (power) electronic component, which is arranged on the first contact surface of the insert element and is electrically and thermally connected to the first contact surface and thus to the insert element.

E.g. is the component as a power semiconductor component or a

Power semiconductor switch trained.

E.g. the electronic arrangement also has at least one heat sink which is arranged on the second contact surface of the insert element and is thermally connected to the second contact surface and thus to the insert element.

E.g. the electronic arrangement also has at least one electrical one

Connecting element, which extends at least partially through the bushing and with the contact side surface and thus with the

Insert element is electrically and thermally connected. E.g. the connecting element is soldered or welded onto the contact side surface.

Alternatively, the connecting element can be crimped, pressed or screwed onto the insert element. For this purpose, the contact section can be used as

Pipe cross section but also be U-shaped. Alternatively, a threaded hole can be provided in the insert element and then a hole can be provided in the connecting element. Alternatively, a "cable lug" at the end of the

Connection element may be attached.

E.g. the connecting element is designed as a connection of a motor phase of an electrical machine.

According to a third aspect of the invention, an electrical

Drive device, in particular for a hybrid electric / electric vehicle, provided.

The drive device has at least one previously described

Electronics arrangement and at least one electrical machine, wherein the electrical machine has at least one connecting element as a connection of a motor phase and

is electrically and thermally connected to the electronic arrangement via the connecting element.

E.g. the drive device also has an inverter which has the electronic arrangement described above as a component. As an alternative or in addition to the inverter, the drive device can have, for example, a DC / DC converter which performs the previously described

Has electronics assembly as a component.

Advantageous refinements of the circuit carrier described above, as far as otherwise, can also be transferred to the above-mentioned (power) electronic arrangement and the above-mentioned electrical drive device, as well To view configurations of the (power) electronics arrangement and the drive device.

Description of the drawing:

An exemplary embodiment of the invention is explained in more detail below with reference to the accompanying drawing. The single figure shows a schematic cross-sectional illustration of a section of an electric drive device 1 of a flybridge electric / electric vehicle according to the exemplary embodiment of the invention.

The electrical drive device 1 has an electrical machine 700 and an inverter with a power electronics arrangement 10.

The electric machine 700 is as one in this embodiment

Three-phase synchronous machine is formed and has three motor phases and correspondingly three phase current connections 710 for the motor phases, via which the machine 700 is electrically and thermally connected to the power electronics arrangement 10.

In this embodiment, the power electronics arrangement 10 is designed as a power output stage of the inverter and has one

Circuit carrier 20 with a carrier plate 100 and power semiconductor switch 500 as part of electronic components and a heat sink 600 for cooling the power electronics arrangement 10. The power semiconductor switches 500 are designed as surface-mountable components (in English “Surface-mount device (SMD)”) and are surface-mounted via contact surfaces on the circuit carrier 20 or the carrier plate 100.

The carrier plate 100 has conductor tracks 110 for producing electrical ones

Connection for the power semiconductor switch 500, which are formed on both sides of the carrier plate 100 or between the two sides of the carrier plate 100 and thus in the carrier plate 100. In addition, the carrier plate 100 has three through holes 200, in each of which an electrically and thermally conductive insert element 300 is arranged.

The insert elements 300 are formed from copper or a copper alloy and are accordingly highly electrically and thermally conductive. The insert elements 300 are soldered to the conductor tracks 110, welded or in a similar manner electrically and thermally connected. The insert elements 300 each have a first contact surface 301 for establishing electrical and thermal connection to at least one of the above

Power semiconductor switch 500 on. The power semiconductor switches 500 rest on their contact surfaces on the first contact surface 301 of the corresponding insert elements 300 and are electrically and thermally connected to them. For this purpose, the power semiconductor switches 500 are soldered, for example, to the first contact surface 301 of the corresponding insert elements 300. The insert elements 300 also each have a second contact surface 302, which is on one of the first

Contact surface 301 facing away from the respective insert elements 300 and are used to produce thermal connection to the above-mentioned heat sink 600. The heat sink 600 is above his

Contact surface on the second contact surface 302 of the respective

Insert elements 300 and is physically and thermally connected to the insert elements 300, for example by means of an electrically insulating and thermally conductive adhesive layer.

The insert elements 300 also each form a passage 210. The bushings 210 are either in the form of further smaller ones

Through holes are formed, which are within each

Insert elements 300 extend through the respective insert elements 300, as is the case with insert element 300 on the left in the figure. Alternatively, the bushings 210 are in the form of gaps (or spaces) between the respective insert elements 300 and

Side surfaces 101 of the carrier plate 100 within the respective

corresponding through holes 200 formed, as in the Insert element 300 on the right side in the figure is the case. The

Feedthroughs 210 each have a contact side surface 303, which lie on the feedthroughs 210. Some of the insert elements 300 each have a contact section 310, which extend beyond the first contact surface 301 of the respective corresponding insert elements 300 and for providing the electrical and thermal connections to the

Phase current connections 710 are made, as is the case with the insert element 300 on the right-hand side in the figure. The contact side surfaces 303 of some of the insert elements 300 are at least partially on the

Contact sections 310 of the respective corresponding insert elements 300 are formed.

The phase current connections 710 of the electrical machine 700 are at least partially passed through the bushings 210 and are on the

Contact side surfaces 303 of the respective corresponding insert elements 300 or their respective contact sections 310 are soldered or welded on.

As a result, the phase current connections 710 or the electrical machine 700 are electrically connected to the corresponding corresponding power semiconductor switches 500 via the respective insert elements 300 and are thermally connected to the heat sink KK.

The insert elements 300 combine two functions, namely the current transmission between the respective corresponding conductor tracks 110, the respective corresponding power semiconductor switches 500 and the respective corresponding phase current connections 710, and the heat transfer from the respective corresponding conductor tracks 110, the respective ones

corresponding power semiconductor switches 500 and the corresponding corresponding phase current connections 710 and thus from the electrical machine 700.

Claims

1. Circuit carrier (20) for the production of mechanical and electrical

Connection for at least one (power) electronic component (500), comprising;

a support plate (100) having at least one through hole (200);

at least one electrically and thermally conductive insert element (300), which is arranged in the through hole (200) and a first contact surface (301) for establishing electrical and thermal connections to the component (500) and a second, from the first contact surface (301) has facing contact surface (302) for producing thermal connections to a heat sink (600);

wherein the insert element (300) also forms a bushing (210) and has a contact side surface (303) which lies on the bushing (210) and is designed to establish an electrical and thermal connection to an electrical connecting element (710).

2. Circuit carrier (20) according to claim 1, wherein the insert element (300) has at least one contact section (310) for establishing the electrical and thermal connection to the connecting element (710), which extends over the first (301) and / or the second (302) extends beyond the contact surface, the contact side surface (303) being at least partially formed on the contact section (310).

3. Circuit carrier (20) according to claim 1 or 2, wherein the bushing (210) extends through the insert element (300), or between the insert element (300) and a side face (101) of the carrier plate (100) within the through hole ( 200) is formed.

4. Circuit carrier (20) according to one of the preceding claims, further comprising at least one conductor track (110) which is formed between two sides of the carrier plate (100) and / or on at least one side of the carrier plate (100) and with the insert element ( 300) is electrically and thermally connected.

5. (power) electronics arrangement (10), comprising:

at least one circuit carrier (20) according to one of the preceding claims;

at least one (power) electronic component (500); wherein the component (500) is arranged on the first contact surface (301) of the insert element (300) and with the first

Contact surface (301) is electrically and thermally connected.

6. The electronic arrangement (10) according to claim 5, wherein the component (500) is a power semiconductor component or a power semiconductor switch.

7. The electronic arrangement (10) according to claim 5 or 6, further comprising at least one heat sink (600) which is arranged on the second contact surface (302) of the insert element (300) and with the second

Contact surface (302) is thermally connected.

8. Electronics assembly (10) according to any one of claims 5 to 7, further

has at least one electrical connecting element (710) which extends at least partially through the leadthrough (210) and is electrically and thermally connected to the contact side surface (303).

9. The electronic arrangement (10) according to claim 8, wherein the connecting element (710) is soldered or welded onto the contact side surface (303), or is crimped, pressed or screwed onto the insert element (300).

10. Electronics arrangement (10) according to claim 8 or 9, wherein the

Connecting element (710) is a connection of a motor phase of an electrical machine (700).

11. Electric drive device (1), comprising:

at least one electronic arrangement (10) according to claim 10; at least one electrical machine (700) with at least one connecting element (710) as a connection of a motor phase of the electrical machine (700);

wherein the electrical machine (700) is electrically and thermally connected to the electronic arrangement (10) via the connecting element (710).

12. Drive device (1) according to claim 11, further comprising an inverter, wherein the electronic arrangement (10) forms part of the inverter.