Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
  • H01M10/6567—Liquids
  • H01M10/6568—Liquids characterised by flow circuits, e.g. loops, located externally to the cells or cell casings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
  • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
  • F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
  • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/61—Types of temperature control
  • H01M10/613—Cooling or keeping cold
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
  • H01M10/625—Vehicles
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/655—Solid structures for heat exchange or heat conduction
  • H01M10/6554—Rods or plates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/655—Solid structures for heat exchange or heat conduction
  • H01M10/6556—Solid parts with flow channel passages or pipes for heat exchange
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
  • H01M10/6569—Fluids undergoing a liquid-gas phase change or transition, e.g. evaporation or condensation
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
  • H05K7/20318—Condensers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
  • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
  • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
  • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
  • F28D2021/0029—Heat sinks
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
  • F28F2250/08—Fluid driving means, e.g. pumps, fans
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F2275/00—Fastening; Joining
  • F28F2275/04—Fastening; Joining by brazing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M2220/00—Batteries for particular applications
  • H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/10—Energy storage using batteries

Definitions

• the present invention is in the field of thermal regulation devices for electronic components capable of giving off heat during operation.
• Electronic components be they electrical energy storage cells, integrated circuits, servers, data centers, etc. require thermal regulation in order to keep them within their operating temperature range.
• heat treatment devices make it possible to modify a temperature of an electric battery, of a power electronic device or of an on-board computer, and in particular to reduce the temperature of the electric battery, which tends to heat up during use and particularly during charging.
• such devices for heat treatment of electric batteries use heat exchangers.
• the various battery cells of a battery system can in particular be cooled by means of a cold plate inside which circulates a cooling fluid, the plate being in contact with the battery cells to be cooled. It has been found that such heat exchangers can lead to inhomogeneous cooling of the electric batteries of the same system of electronic components, thus causing a reduction in the performance of these electric batteries.
• These heat treatment devices also have a high thermal resistance due to the thicknesses of material present between the cooling fluid and the battery cells.
• Document FR3037727 is particularly known, in which a device for cooling the electric batteries of electric or hybrid cars is disclosed. More particularly, this document relates to a device for cooling the cells of the electric batteries of a battery pack of the Ion-Lithium type. It includes a hermetically sealed housing in which a two-phase fluid and an air layer circulates. The electrical storage cells are partially immersed in the two-phase fluid, so that the heat exchange between the cells and the two-phase fluid is ensured. Thus, the cooling of the electric batteries is carried out by immersion of the cells of the electric batteries in said fluid.
• the two-phase liquid reserve consists of a tank located outside the housing and connected to said housing in order to allow the circulation of the two-phase fluid.
• the invention aims to offer an alternative thermal regulation of electrical components, in particular batteries, by overcoming the aforementioned problems of the prior art, by proposing a thermal regulation device which lowers and homogenizes the temperature of the component. electronics, thus optimizing the life as well as the performance of such an electronic component, in particular in a system of electronic components for a motor vehicle.
• the present invention relates to a device for thermal regulation, in particular for cooling, for an electronic component, in particular a battery, the temperature of which must be regulated, said electronic component being in particular likely to generate heat during operation.
• the thermal regulation device comprises at least a first circuit configured to allow the circulation of a heat-transfer fluid, at least a second circuit configured to transport a dielectric fluid, this second circuit comprising at least one outlet for distributing the dielectric fluid towards the electronic component, the thermal regulation device being configured so that at least a portion of the first circuit and at least a portion of the second circuit are in thermal contact with each other.
• the two circuits that the thermal regulation device comprises are at least in an area of the device sufficiently close to each other that the first circuit and the heat transfer fluid which circulates within this first circuit can exchange calories with the second circuit and the dielectric fluid which circulates within this second circuit.
• the proximity of the circuits to each other is understood by the fact that locally, at least in one zone of the device, a portion of the first circuit is mechanical contact with a portion of the second circuit, or that these portions are at a minimal distance from each other.
• This minimum distance can in particular be of the order of ten millimeters, more particularly, in the temperature control device according to the invention, in which the dielectric fluid is intended to be sprayed onto an electronic component to regulate its temperature when this heats up during its operation, it is desirable to have a dielectric fluid as cold as possible during its projection and the thermal contact of the circuits makes it possible to cool the dielectric fluid by exchange of calories between this fluid and the fluid heat sink present in the first circuit. This performs a sub-cooling step, or additional cooling, to lower the temperature of the dielectric fluid before it leaves the second circuit to be projected onto the electronic component whose temperature must be regulated.
• the thermal regulation device advantageously comprises any one of at least the following technical characteristics, taken alone or in combination:
• the thermal regulation device comprises at least one plate integrating the at least one first circuit so as to form a condenser capable of liquefying the fluid distributed by the at least one outlet of the second circuit.
• an integrated circuit in a plate is meant the fact that this circuit is arranged in the thickness of the plate, both via a configuration with channels dug in the material and a configuration with shells reported against each other to form a wall of the condenser, at least one of the shells being stamped to form a channel of said circuit.
• the condenser plate is provided on one of these faces with a heat transfer fluid inlet and a heat transfer fluid outlet between which the first circuit extends, that is to say the heat transfer fluid circuit.
• the second circuit is integrated in at least one plate forming a condenser.
• the second circuit is integrated in a plate identical to that integrating the first circuit.
• the second circuit extends in the condenser plate so as to be surrounded by branches forming part of the first circuit.
• the second circuit is formed in a peripheral zone of the at least one plate forming a condenser, so as to release a central zone of this plate for the circuit of heat transfer fluid.
• the condenser can fulfill its primary function of liquefying the vaporized dielectric fluid following its projection onto the electronic components, the vaporized fluid possibly being present over the entire surface of the main wall of the condenser configured to overhang the electronic component, without this functional surface of condensation is disturbed by the passage of a dielectric fluid at a temperature different from that of the heat transfer fluid.
• the first circuit and the second circuit are arranged on either side of the condenser plate, which comprises on a first face a plurality of cavities and on an opposite face a plurality of cells, said cavities and cells being covered respectively by at least one cover and at least one cover so that the cavities, respectively the cells, form the first circuit, respectively the second circuit.
• the second circuit is integrated into a secanting plate to that integrating the first circuit.
• the same side of the condenser plate is equipped with the dielectric fluid inlet, the coolant inlet and the coolant outlet, to facilitate connection with means for supplying coolant and fluid dielectric of the main wall.
• At least the plate forming the condenser is formed of two separate shells and affixed one against the other, at least one shell comprising a boss which delimits a cavity forming part of the heat transfer fluid circuit or part of the dielectric fluid circuit.
• the condenser comprises at least one main wall provided with the dielectric fluid inlet as well as with a heat transfer fluid inlet and with a heat transfer fluid outlet between which the heat transfer fluid circuit extends, the condenser further comprising a plurality of secondary walls projecting from the main wall, including a first lateral secondary wall which equips a first longitudinal end of the main wall, a second lateral secondary wall which equips a second longitudinal end of the main wall and an intermediate secondary wall which is interposed between the side secondary walls, the intermediate secondary wall participating in delimiting with a part of the main wall and one of the side secondary walls two receiving chambers for an electronic component.
• the first circuit is formed at least in the main wall.
• the second circuit is formed in at least one secondary wall.
• the dielectric fluid circuit has several branches in parallel on each of the secondary walls.
• each distribution outlet of the dielectric fluid circuit includes a projection nozzle, each projection nozzle being oriented towards one of the electronic components.
• the second circuit is formed by a conduit produced distinctly from the at least one plate forming a condenser and attached to one face of this plate which is turned towards a chamber for receiving at least one electronic component.
• the fact of making the dielectric fluid circuit apart makes it possible to produce the condenser and the heat transfer fluid circuit in different materials and / or in different thicknesses. This can in particular make it possible to manage the pressure resistance of the dielectric fluid circuit differently and the risk of leakage at the level of the condenser.
• the electrical fluid circuit can consist of an aluminum tube attached to the condenser. - in the case where the second circuit is produced by means of a conduit separate from the plate forming the condenser, this second circuit is fixed on the condenser so as to form an integral assembly which can be mounted integrally in the electronic component system.
• the conduit forming the second circuit has an inlet end of dielectric fluid which is made integral with the plate forming the condenser, in particular by a brazing operation.
• the duct forming the second circuit is fixed to the condenser plate by means of fixing studs.
• the fixing studs have a main dimension, defining the distance between the first circuit and the second circuit, less than 10mm.
• the conduit forming the second circuit has a substantially planar shape, and is arranged in a plane parallel to the plate forming the condenser.
• the conduit forming the second circuit has bent portions extending in a plane substantially perpendicular to the plane of the plate forming the condenser.
• the main and secondary walls are formed from three U-shaped shells with a first shell which overlaps both a second shell and a third shell arranged side by side, the heat transfer fluid circuit and the dielectric fluid circuit being provided between deformations produced respectively on one or the other of the shells.
• the first circuit and the second circuit are respectively formed by a conduit disposed in the vicinity of the corresponding electronic component.
• each battery element comprises at least one electrical storage cell, the electrical storage cell or cells being directly opposite the walls of the condenser.
• the projection of the dielectric fluid is directed directly onto the storage cells, and the cooling by means of the dielectric fluid can be more effective, at least for the storage cells which receive the dielectric fluid directly,
• each battery element comprises a second housing housing at least one electrical storage cell, the second housing extending between the storage cell or cells and the walls of the condenser.
• the projection of the dielectric fluid is directed directly onto the second housing, and the cooling of the storage cells via the dielectric fluid can be more homogeneous for all of the storage cells.
• the invention also relates to a thermal regulation assembly comprising a thermal regulation device as previously mentioned and configured to regulate the temperature of a plurality of electronic components stacked in a stacking direction, at least one of the electronic components being associated with the at least one first circuit and the at least one second circuit, characterized in that said regulation device comprises a dielectric fluid recovery tank disposed in the extension of the electronic components in the stacking direction and configured to receive the dielectric fluid coming from each condenser, the thermal regulation device comprising means for recirculating the dielectric fluid which are provided with a pump and which connect the recovery tank to at least one inlet for dielectric fluid which each of the second circuits comprises.
• the electronic components can be arranged in a stepped superposition, forming a plurality of stages of electronic components, and each stage can comprise one or more electronic components capable of generating heat and therefore having to be cooled.
• the thermal regulation assembly can comprise a plurality of electronic components distributed in a plurality of columns of electronic components and a plurality of stages, each stage of electronic components being provided with at least a first circuit of heat transfer fluid. and at least a second dielectric fluid circuit.
• the assembly is configured so that a recovery tank is able to receive the dielectric fluid sprayed on each of the stages of a given set of electronic components, and that a pump is capable of supplying fluid dielectric from the recovery tank all the dielectric fluid circuits allowing the spraying of the given set of electronic components.
• FIG. l illustrates a perspective view of a section of an electronic component system equipped with a thermal regulation assembly of electronic components according to the present invention
• FIG.2 illustrates a front view of the section of the system shown in Figure 1
• FIG.3 illustrates a partial perspective view of the system illustrated in Figures 1 and 2, a first housing being in particular removed to make the thermal regulation assembly clearly visible and to schematically illustrate a recirculation line and a pump of this thermal regulation assembly,
• FIG.4 illustrates a perspective view of a first variant of electronic components capable of being cooled by the thermal regulation assembly shown in Figures 1 to 3,
• FIG.5 illustrates a perspective view of a second variant of electronic components capable of being cooled by the thermal regulation assembly shown in Figures 1 to 3,
• FIG.6 illustrates another embodiment of an electronic component box comprising two thermal regulation assemblies in accordance with the present invention
• FIG.7 illustrates a perspective view of a thermal regulation device according to a first embodiment, as it equips the system shown in Figures 1 to 3, intended to cool the electronic components illustrated in Figure 4 or 5,
• FIG.8 illustrates a perspective view of the thermal regulation device illustrated in FIG. 7,
• FIG. 9 illustrates a schematic view of the thermal regulation device illustrated in FIGS. 7 and 8, to make visible the circulation channels of dielectric fluid present in the thickness of a plate forming a condenser of this thermal regulation device,
• FIGS. 7 to 9 illustrate an exploded perspective view of the thermal regulation device illustrated in FIGS. 7 to 9,
• FIG.11 illustrates a thermal regulation device according to a second embodiment, shown in an exploded view, with a heat transfer fluid circuit and a dielectric fluid circuit formed in the thickness of the same plate forming the condenser,
• FIG.12 illustrates a sectional view of the thermal regulation device of FIG. 11, making in particular visible the dielectric fluid outlets arranged on either side of the plate forming the condenser
• FIG.13 illustrates a thermal regulation device according to a third embodiment, shown in section, with the heat transfer fluid and dielectric fluid circuits which are arranged on either side of the same plate participating in forming a condenser
• FIG. 14 illustrates a thermal regulation device according to a fourth embodiment, with a circuit of dielectric fluid produced distinctly by means of a duct attached against, or in the immediate vicinity of, the plate forming the condenser,
• FIG.15 illustrates an exploded view of the thermal regulation device of FIG. 14,
• FIG.16 illustrates a bottom view of the thermal regulation device of Figure 14.
• FIG.17 illustrates a variant of the thermal regulation device of FIG. 14,
• FIG.18 illustrates a thermal regulation device according to a fifth embodiment, different from the fourth embodiment by the shape of the conduit forming the dielectric fluid circuit,
• FIG.19 exploded view of a thermal regulation device according to a sixth embodiment, different from the fourth embodiment by the shape of the coolant conduit,
• FIG.20 illustrates different possible arrangements of a thermal regulation assembly according to the invention comprising a thermal regulation device and electronic components to be cooled.
• FIG. 1 a system of electronic components 100, suitable in particular for equipping a motor vehicle with electric or hybrid motorization, is illustrated. Such a system 100 is intended to supply electrical energy to an electric motor fitted to the motor vehicle for its movement.
• the electronic component system is equipped with a thermal regulation device 2 which comprises at least a first circuit 4 configured to allow the circulation of a heat-transfer fluid and at least a second circuit 5 configured to transport a fluid dielectric, this second circuit comprising at least one distribution outlet for the dielectric fluid in the direction of an electronic component whose temperature must be regulated in particular because of overheating during its operation.
• the dielectric fluid is caused to collect calories emanating from the electronic component, if necessary by vaporizing under the effect of the temperature to be regulated, and the heat transfer fluid present in the first circuit has mainly the role of recovering by convection of the calories of the dielectric fluid.
• the first circuit is in thermal interaction with the dielectric fluid distributed by the at least one outlet of the second circuit, to cool the latter, if necessary restore it to a liquid state, so that it is capable of be reinjected into the second circuit and projected back onto the electronic component.
• the thermal regulation device is configured so that the first and second circuits are in thermal contact, that is to say with mechanical proximity such that calories can be exchanged from one circuit to another and more particularly from a fluid present in a circuit to another fluid present in the other circuit.
• Such an arrangement allows if necessary a sub-cooling of the dielectric fluid before it is projected onto the electronic components, or in other words a preliminary cooling of the dielectric fluid while it circulates in the liquid phase in the second circuit, and therefore allows greater efficiency in the desired thermal regulation.
• the electronic component system 100 comprises a first housing 101 which houses a plurality of electronic components here taking the form of electronic components 103, it being understood that other configurations of the electronic component system could be implemented according to the invention since this system includes a thermal regulation device in accordance with the teachings of the invention.
• the first housing 101 comprises two half-shells 109a, 109b, including a first shell 109a and a second shell 109b, which are arranged in a bowl and which are joined to one another via their flanges 110.
• each flange 110 is provided with a lip 111, the lip 111 of the first shell 109a being fixed to the lip 111 of the second shell 109b by means of reversible joining means 112, of the screwing type or the like.
• the electronic components 103 are shaped as a parallelepiped and are arranged relative to one another by being arranged in a stepped superposition. More particularly, the electronic components 103 are stacked one on the other in several columns 105 while being distributed in several stages 106a, 106b.
• each stage 106a, 106b of electronic components 103 preferably comprises a plurality of electronic components 103 according to the number of columns 105, it being understood that the number of stages and columns of electronic components varies according to the authorized congestion of the first box and according to the quantity of electrical energy to be stored.
• the latter are arranged side by side and each stage 106a, 106b of electronic components 103 is carried by a plate 107a, 107b on which the electronic components 103 rest.
• the electronic components 103 are six in number and are distributed over two columns 105 and three stages 106a, 106b, each column 105 comprising three electronic components 103 and each stage 106a, 106b comprising two electronic components 103. Tel as has been clarified, the number of columns 105 and the number of stages 106a, 106b are likely to be different from the example illustrated, in particular being greater.
• the thermal regulation device 2 of the present invention is capable of simultaneously cooling each of the stages 106a, 106b of electronic components 103.
• the thermal regulation device 2 associates at least one condenser 3 housing a first circuit 4, and more particularly a heat transfer fluid circuit, with a second circuit, and more particularly a dielectric fluid circuit 5, which is arranged to spray a dielectric fluid 1 on a stage 106a, 106b corresponding to electronic components 103.
• the heat transfer fluid circuit 4 is in particular provided for passing from a vapor state to a liquid state the dielectric fluid 1 sprayed on the electronic components 103 and transformed into vapor form under the effect of the heat given off by the electronic components.
• the first heat transfer fluid circuit is thus in thermal interaction with the dielectric fluid once it is projected out of the second circuit and vaporized by the heat released by the electronic components, in the sense that the heat transfer fluid and the corresponding first circuit are configured. to exchange calories with the vaporized dielectric fluid, and in particular to yield frigories to this dielectric fluid so that it becomes liquid again.
• the heat transfer fluid may in particular consist of a coolant or a coolant, and for example consist of glycol water, R134a or 1234yf, or even C02, without this list being exhaustive.
• the dielectric fluid this is chosen as a function of its phase change point.
• the fluid chosen here must have an evaporation temperature at atmospheric pressure greater than 32, 33 or 34 degrees Celsius and a condensation temperature less than 31, 30 or 29 degrees Celsius.
• the dielectric fluid sprayed in liquid form on the electronic components of a given stage recovers calories released by these electronic components and is thus transformed into vapor.
• the vapor rises to come into contact with the condenser 3, inside which circulates a heat transfer fluid, and the condenser recovers the calories stored previously by the dielectric fluid until liquefying it, by a thermal interaction between the first circuit of heat transfer fluid and the dielectric fluid then in the gas phase.
• the dielectric fluid falls by gravity into the first housing.
• the thermal regulation device of the present invention comprises at least as many dielectric fluid circuits 5 as the first housing 101 stage housing 106a, 106b of electronic components 103, and it advantageously comprises as many condensers 3 as the first housing 101 stage housing 106a, 106b of electronic components 103.
• each dielectric fluid circuit 5 is advantageously associated to a corresponding condenser 3 for optimizing a condensation of the dielectric fluid 1, and subsequently a cooling of the electronic components 103, stage by stage, such an association being as compact as possible inside the first box 101 which delimits a desired confined space the as small as possible.
• the first housing 101 has a bottom which constitutes a collecting tank 108 for the dielectric fluid 1 which flows by gravity from a stage 106a, 106b of electronic components 103 to a stage lower 106a, 106b of electronic components 103.
• the recovery tank is used for the recovery of the dielectric fluid having been vaporized by each of the condensers.
• each of the plates supporting the stages of electronic components is configured to allow the passage of fluid by gravity in the direction of the recovery tank.
• a lower plate 107a on which rests a lower stage 106a of electronic components 103 there are, among the plates 107a, 107b on which a respective stage 106a, 106b rests of electronic components 103, a lower plate 107a on which rests a lower stage 106a of electronic components 103.
• the lower stage 106a is that of stages 106a, 106b which does not overhang any other stage and which is therefore the lowest of stages 106a, 106b of the layered superposition of the electronic components 103 described above, with reference to a vertical arrangement and to the direction of flow by gravity of the fluid dielectric in liquid form.
• the upper stages 106b of electronic components 103 carried by a corresponding upper plate 107b overhang at least one other stage 106a, 106b of electronic components 103.
• the lower plate 107a is perforated with a plurality of orifices 119 allowing the flow of the dielectric fluid through it in the direction of the recovery tank.
• the orifices 119 are dimensioned to allow a filtering operation of the dielectric fluid before it enters the recovery tank.
• the lower plate 107a is dimensioned to be in contact on its periphery with the walls delimiting the first housing.
• the upper plates 107b have a solid, non-perforated surface, and that they are dimensioned to form a passage at the periphery between the edges of the corresponding plate and the walls delimiting the first housing.
• each, or at least some, of the upper plates may be perforated, since the condenser that such a perforated plate overhangs is arranged so as to have a plane inclined with respect to the plane of the corresponding tray. Therefore, the water flowing through the upper plates through the perforations is not able to stagnate between the condenser and the corresponding upper plate and can flow on the sides to fall by gravity into the tank. recovery.
• the recovery tank 108 is provided with a discharge hose 113 for the dielectric fluid 1 recovered inside the recovery tank 108, the discharge hose 113 being in fluid communication with a recirculation line 114 of the dielectric fluid 1.
• the recirculation line 114 is equipped with a pump 115 for bringing the dielectric fluid 1 to each of the dielectric fluid inlets 23 equipping a condenser.
• the pump 115 which is common to each of the stages of electronic components of the thermal regulation device 2, is capable of supplying dielectric fluid 1 all of the dielectric fluid circuits 5 that the thermal regulation device 2 includes. , which is advantageous in terms of production cost.
• a distributor is capable of supplying dielectric fluid 1 all of the dielectric fluid circuits 5 that includes the thermal regulation device 2 and which equip a respective stage 106a, 106b with electronic components 103.
• the dielectric fluid inlets 23 are all arranged on the same side of each condenser 3, to facilitate the distribution of the dielectric fluid recovered in the common recovery tank in each of the dielectric fluid inlets.
• Each dielectric fluid circuit 5 is provided with at least one spray nozzle 37 which is capable of spraying the dielectric fluid 1 in the liquid state towards the electronic components 103 in order to cool them. It is thus understood that the dielectric fluid 1 runs through a circulation loop 116 comprising the collecting tank 108 for the dielectric fluid 1 in the liquid state, the recirculation pipe 114 for the dielectric fluid 1 equipped with the pump 115 which supplies, by the intermediate recirculation means 117, together each dielectric fluid circuit 5 equipping a stage 106a, 106b with electronic components 103, the projection nozzles 37 of the dielectric fluid circuits 5 spraying the electronic components 103 with dielectric fluid 1 which vaporizes at their contact, then which liquefies on contact with the condensers 3 to drain by gravity inside a common recovery tank 108.
• the electronic components can for example be battery cells
• Each battery cell 103 comprises a second housing 102 which houses a plurality of electrical storage cells 104.
• the second housing 102 comprises a cover 118, removed from one of the second housings 102 to make the electrical storage cells 104 visible.
• the dielectric fluid sprayed via the nozzles fitted to the dielectric fluid circuit comes into contact with the second housing and vaporizes under the effect of the heat given off by this second housing.
• the cooling of this second box generates a drop in temperature of the enclosure in which the electrical storage cells are housed and therefore a drop in temperature of the cells themselves.
• FIG. 5 there is shown a stage 106a, 106b of battery cell 103 according to a second alternative embodiment.
• Each battery cell 103 only comprises a plurality of electrical storage cells 104.
• the dielectric fluid sprayed via the nozzles equipping the dielectric fluid circuit comes into direct contact with the electrical storage cells and vaporizes under the effect of the heat released by each of these cells.
• each electric storage cell 104 is the functional unit of the battery cell 103 which at least partially supplies the electric motor with the electric energy it needs.
• the electrical storage cell 104 is for example an Ion-Lithium cell or the like.
• FIG. 6 illustrates an exemplary embodiment of a box of electronic components in which two cooling devices are provided.
• each thermal regulation device is associated with a portion of the electronic component system 100 comprising a housing 101, 201 which houses a plurality of electronic components 103 arranged in stages 106, and each thermal regulation device comprises a recovery tank arranged at the bottom of the corresponding housing to recover the dielectric fluid originally sprayed on a plurality of stages of electronic components.
• a first housing 101 and a second housing 201 are arranged side by side with a connecting portion 202 which has a clearance zone to conform to a particular arrangement of a motor vehicle, without this being limiting .
• the example of FIG. 6 is particularly interesting in that it makes it possible to understand that a box of electronic components can comprise several recovery tanks and several pumps, with each recovery tank and each associated pump arranged to recover the electrical fluid. sprayed on several electronic components stacked one on top of the other and above the relevant recovery tank.
• thermal regulation device is illustrated in a configuration associated with a single stage of electronic components, but that it could be implemented, with several other similar devices in a system of electronic components with several floors as described above.
• FIGS 7 to 10 illustrate a first embodiment, in accordance with what was visible in the previous figures, and more particularly make visible the characteristic of the invention that the heat transfer fluid and dielectric fluid circuits are in thermal contact with each other.
• the condenser 3 is represented in an orthonormal reference frame Oxyz which comprises a longitudinal axis Ox, a lateral axis Oy and a transverse axis Oz.
• the condenser 3 comprises a main wall 6 which extends inside a plane parallel to the Oxy plane.
• the main wall 6 is arranged substantially in a quadrilateral which has two longitudinal ends of the main wall 7a, 7b, opposite one another and formed at a first distance DI from one another, and two lateral ends from the main wall 8a, 8b, opposite one another and formed at a second distance D2 from one another.
• the condenser 3 also includes three secondary walls 9a, 9b, 9c which extend respectively in a plane parallel to the Oyz plane.
• the three secondary walls 9a, 9b, 9c there is a first lateral secondary wall 9a which equips a first longitudinal end of the main wall 7a, a second lateral secondary wall 9b which equips a second longitudinal end of the main wall 7b and a intermediate secondary wall 9c which is interposed between the lateral secondary walls 9a, 9b being arranged here at an equal distance from the first lateral secondary wall 9a and from the second lateral secondary wall 9b.
• the first lateral secondary wall 9a and the intermediate secondary wall 9c delimit with a portion of the main wall 6 a first chamber 10a which is intended to receive a first electronic component 103.
• the second lateral secondary wall 9b and the intermediate secondary wall 9c delimit with another portion of the main wall 6 a second chamber 10b which is intended to receive a second electronic component 103.
• the main wall 6 houses the heat transfer fluid circuit 4 which winds inside the main wall 6, above the first chamber 10a and above the second chamber 10b.
• the heat transfer fluid circuit 4 is formed in a thickness of the main wall 6.
• the main wall 6 is formed of two shells affixed one against the other, at least a shell comprising a boss which delimits a cavity forming the heat transfer fluid circuit 4.
• the heat transfer fluid circuit 4 is formed in relief of at least one of the shells.
• the main wall 6 has a first face l ia, upper in FIG. 7, which is provided with a heat transfer fluid inlet 12a and a heat transfer fluid outlet 12b.
• the inlet of heat transfer fluid 12a is provided to allow an intake of heat transfer fluid 13 inside the heat transfer fluid circuit 4 while the outlet of heat transfer fluid 12b is provided to allow the heat transfer fluid 13 to be removed from the circuit heat transfer fluid 4.
• the heat transfer fluid 13 is for example carbon dioxide or the like. It is understood that from a circulation of the heat transfer fluid 13 inside the first circuit 4, the heat transfer fluid 13 cools the main wall 6 to maintain it at a temperature below a condensation temperature of the dielectric fluid 1, this which guarantees that on contact, the dielectric fluid 1 passes to the liquid state.
• the heat transfer fluid circuit is thus in thermal interaction with the dielectric fluid distributed at the outlet of the second circuit.
• the inlet for heat transfer fluid 12a and the outlet for heat transfer fluid 12b are provided near a first lateral end of the main wall 8a and the heat transfer fluid circuit 4 extends from the arrival of heat transfer fluid 12a to the outlet of the heat transfer fluid 12b.
• the heat transfer fluid circuit 4 comprises for example several branches of circulation of the heat transfer fluid 15, 17, 19, 21 which are arranged in parallel with each other.
• the arrival of heat transfer fluid 12a is in fluid communication with a distributor 14 which supplies three first branches of circulation of heat transfer fluid 15 parallel to each other. These first three branches of circulation of heat transfer fluid 15 open out inside a first manifold 16 which is formed near a second lateral end of the main wall 8b.
• the heat transfer fluid 13 traverses substantially the second distance D2, visible in FIG. 7.
• the first manifold 16 is in fluid communication with three second branches of circulation of heat transfer fluid 17 which are arranged in parallel with each other.
• the three second branches of circulation of heat transfer fluid 17 extend from the first manifold 16 to a second manifold 18 which is formed near the first lateral end of the main wall 8a.
• the coolant 13 again travels substantially the second distance D2.
• the second manifold 18 is in fluid communication with three third circulation branches of heat transfer fluid 19 which are arranged in parallel with each other, one of the third branches of circulation of the heat transfer fluid 19 bordering the second longitudinal end of the main wall 7b.
• the three third branches of circulation of heat transfer fluid 19 extend from the second collector 18 to a third collector 20 which is formed near the second lateral end of the main wall 8b and which extends along the second lateral end of the main wall 8b to the first longitudinal end of the main wall 7a. Also, inside the third branches of circulation of coolant 19, the coolant 13 again travels substantially the second distance D2. Also, inside the third collector 20, the heat transfer fluid 13 substantially traverses the first distance Dl, visible in FIG. 7.
• the third collector 20 is in fluid communication with three fourth branches of circulation of heat transfer fluid 21 which are arranged in parallel to each other, one of the fourth branches of circulation of the heat transfer fluid 21 bordering the first longitudinal end of the main wall 7a.
• the three fourth branches of circulation of coolant 21 extend from the third collector 20 to a fourth manifold 22 which is provided with the outlet of the coolant 12b. It is understood that the number of branches of circulation of coolant 15, 17, 19, 21 arranged between two collectors 16, 18, 20 or between a collector 16, 18, 20 and the distributor 14 as well as the number of collectors 16, 18 , 20 are likely to be distinct from those previously stated.
• the fact that the heat transfer fluid 13 travels several times over the second distance D2 and the first distance Dl allows cooling of the entire surface of the main wall 6, and subsequently cooling of the dielectric fluid 1 which comes into contact with the main wall 6 after vaporization in contact with electronic components 103.
• main wall and the various branches of circulation of the heat transfer fluid which are formed therein are configured so that the heat transfer fluid circuit 4 is arranged in a central zone 61 of the main wall 6.
• the dielectric fluid circuit 5 is produced in the thickness of the condenser , that is to say by being integrated in at least one of the walls 6, 9a, 9b, 9c forming the condenser 3.
• the dielectric fluid circuit can in particular be described with reference to Figures 9 and 10, schematically illustrating and in an exploded representation this circuit.
• the circuit can be produced by stampings formed respectively in one and or the other of two shells which form each of the walls when assembled against each other.
• the walls 6, 9a, 9b, 9c can be formed from three shells 301, 302, 303, in particular metallic, shaped U-shaped including a first shell 301 housing a second shell 302 and a third shell 303, the heat transfer fluid circuit 4 and the dielectric fluid circuit 5 being formed between the shells 301, 302, 303, in particular from a stamping of these last.
• the shells 301, 302, 303 are for example brazed or welded together. It is understood that in this case, the second shell and third shell are dimensioned to each delimit a receiving chamber of an electronic component.
• the dielectric fluid circuit 5 is arranged here in the condenser so as to allow this central zone formed in the main wall to be clear. , either by extending over other walls of the condenser than the main wall, and / or by extending over a peripheral zone 60 of the main wall.
• the first face 11a of the main wall 6 is provided with a dielectric fluid inlet 23 which is formed near the first lateral end of the main wall 8a.
• the dielectric fluid inlet 23 allows an admission of the dielectric fluid 1 inside the dielectric fluid circuit 5.
• the dielectric fluid inlet 23 is in fluid communication with a first dielectric fluid channel 24 which runs along the first lateral end of the main wall 8a between the inlet of dielectric fluid 23 and a first point of circulation of the dielectric fluid 25 which is located directly above the intermediate secondary wall 9c. More particularly, the first dielectric fluid channel 24 can be formed by a deep-drawn formed in the first shell 301 carrying the arrival of dielectric fluid and by a flat surface of the second or third shell. As illustrated in FIG.
• this first dielectric fluid channel 24, forming a portion of the second circuit 5 is arranged at the edge of the second collector 18 of the first circuit 4, the stamped forming this first channel being in contact with the delimiting edge the second collector. At least in this portion of the second circuit 5, the circuits are in thermal contact, calories can be exchanged, by thermal conduction via the walls of the circuits, between the fluids circulating in each of these circuits.
• the first circulation point can be formed by two opposite stamps respectively formed in the walls of the second and third shells participating in forming the intermediate secondary wall.
• the first point of circulation of the dielectric fluid 25 is in fluid communication with a second channel of dielectric fluid 26 which extends inside the intermediate secondary wall 9c up to a second point of circulation of the dielectric fluid 27 located nearby. of the second lateral end of the main wall 8b.
• the second dielectric fluid channel 26 has two first branches of circulation of the dielectric fluid 28 parallel to each other.
• the second point of circulation of the dielectric fluid 27 is in fluid communication with a third channel of dielectric fluid 29 and a fourth channel of dielectric fluid which both extend along the second lateral end of the wall. main 8b.
• the third dielectric fluid channel 29 extends between the second point of circulation of the dielectric fluid 27 and a fourth point of circulation of the dielectric fluid 31 which is located directly above the first side secondary wall 9a.
• the fourth point of circulation of the dielectric fluid 31 is in fluid communication with a fifth channel of dielectric fluid 33 which extends inside the first lateral side wall 9a and which comprises two second branches of circulation of the dielectric fluid 34 parallel l to one another.
• the second branches of circulation of the dielectric fluid 34 extend from the second lateral end of the main wall 8b to the first lateral end of the main wall 8b.
• the fourth dielectric fluid channel 30 extends between the second circulation point of the dielectric fluid 27 and a fifth circulation point of the dielectric fluid 32 which is located directly above the second lateral secondary wall 9b.
• the third dielectric fluid channel 29 and the fourth dielectric fluid channel 30, respectively forming portions of the second circuit 5 are arranged at the edge of the third collector 20 of the first circuit 4, the stamp forming these third and fourth channels being in contact with the edge delimiting the third collector. At least in these portions of the second circuit 5, the circuits are in thermal contact, calories can be exchanged, by thermal conduction via the walls of the circuits, between the fluids circulating in each of these circuits.
• the dielectric fluid 1 substantially traverses the second distance D2, which allows a projection of the dielectric fluid over the whole of a first dimension, here the length, of the electronic components 103.
• the circulation channels comprise several branches of circulation of the dielectric fluid allows a spraying of the dielectric fluid on different heights of the electronic components, respectively to a second dimension of the electronic components parallel to the stacking direction of the stages, and therefore a homogenization of the cooling operation of the electronic component considered.
• the fifth point of circulation of the dielectric fluid 32 is in fluid communication with a sixth channel of dielectric fluid 35 which extends inside the second lateral side wall 9b and which comprises two third branches of circulation of the dielectric fluid 36 parallel l to one another.
• the third branches of circulation of the dielectric fluid 36 extend from the second lateral end of the main wall 8b to the first lateral end of the main wall 8b.
• the dielectric fluid 1 substantially traverses the second distance D2.
• Each branch of circulation of the dielectric fluid 28, 34, 36 is equipped with a plurality of spray nozzles 37 of the dielectric fluid 1 towards the chamber 10a, 10b which participate in bordering the secondary walls 9a, 9b, 9c.
• each branch of circulation of the dielectric fluid 28, 34, 36 is equipped with four projection nozzles 37. The number of projection nozzles 37 equipping a branch for circulation of the dielectric fluid 28, 34, 36 is likely to be different.
• the first branches of circulation of the dielectric fluid 28 are provided with a number of spray nozzles 37 which is equivalent to twice the number of spray nozzles 37 which the second branches of circulation of the dielectric fluid 34 and respectively third branches of circulation of the dielectric fluid 36, for spraying dielectric fluid 1 towards the first chamber 10a and towards the second chamber 10b, due to the fact that the intermediate secondary wall 9c, which is equipped with the first branches of circulation of the dielectric fluid 28 , borders the two chambers 10a, 10b.
• the projection nozzles 37 equipping the second branches of circulation of the dielectric fluid 34 are intended to spray the dielectric fluid 1 towards the first chamber 10a and that the projection nozzles 37 equipping the third branches of circulation of the dielectric fluid 36 are intended spraying the dielectric fluid 1 towards the second chamber 10b.
• the dielectric fluid circuit 5 is produced in G thickness of the main wall 6 of the condenser 3 and in G thickness of the secondary walls 9a, 9b, 9c of the condenser 3.
• the description and the corresponding figures, in particular FIG. 9, illustrate well the characteristic according to which the heat transfer fluid circuit 4 is formed only in the thickness of the main wall 6, and in a central zone 61, while the fluid circuit dielectric 5 is configured to clear this central zone and not to penalize the action of the condenser on the vaporized dielectric fluid extends.
• the dielectric fluid circuit can extend in the thickness of one and / or the other of the secondary walls 9a, 9, 9c, and it can extend at the edge of the main wall, in an area device 60.
• the circuits are advantageously arranged in the main wall so that the portions of the second circuit 5 extending in the peripheral zone 60 are very close to a branch of the first circuit 4, so to make it possible to exchange heat from one circuit to another. The proximity of these circuits makes it possible to speak of thermal contact between the first and second circuits.
• the condenser 3 does not have secondary walls, so that it mainly consists of a plate formed by the main wall 6. It is advisable note that this is not limiting and that combinations of dielectric fluid circuit as they will be described below and of condenser with secondary walls previously described are to be considered in the context of the invention.
• FIGS. 11 and 12 illustrate a thermal regulation device according to a second embodiment, which differs from the above in that the second circuit 5, or dielectric fluid circuit, is entirely included in the plate, here the main wall 6 , further integrating the first circuit 4, or heat transfer fluid circuit.
• the main wall 6 of the condenser 3 is here produced by the junction one on the other of two plates with here a stamped plate 62 in which the branches of the first circuit of heat transfer fluid and the second circuit of fluid dielectric are produced and a flat plate 64 attached against the stamped plate to close the branches and form the first and second circuits.
• this second circuit extends in the central zone 61 of the condenser plate, and therefore in the flow region of the heat transfer fluid.
• the second circuit 5 has a U-shape, entangled in the first circuit.
• the second circuit comprises a first segment 51 which has a first end leading to the dielectric fluid inlet 23 and a second segment 52 parallel to the first segment and which extends towards the first lateral end 8a of the plate on which is reported the arrival of dielectric fluid.
• the plate and the two circuits are arranged so that between the segments 51, 52 extend different branches of the heat transfer fluid circuit 4, that the second segment 52 is sufficiently distant from the first lateral end 8a of the plate to allow passage to a branch for connection of the heat transfer fluid circuit, and that the branches connected to the fluid inlet heat transfer medium 12a and at the heat transfer fluid outlet 12b are arranged on either side of the first segment 51 of the second circuit 5.
• the second dielectric fluid circuit 5 extends in the condenser plate 3 so as to be surrounded by branches forming part of the first heat transfer fluid circuit, and that a thermal contact is thus created between the two circuits 4, 5.
• this thermal contact is advantageous in that it allows a pass of sub-cooling of the dielectric fluid before it is projected onto the electronic components 103 which must be regulate the temperature.
• the dielectric fluid flowing in the second fluid exchanges calories with the heat transfer fluid of the first circuit 4 so that its temperature is lowered, and this before being projected onto the electronic components, which are all the better cooled.
• the heat transfer fluid circulates over a large majority of the surface of the plate forming condenser 3, so that the thermal interaction of the first circuit with the fluid projected by the second circuit and vaporized by the heat released by the electronic components remains effective.
• FIG. 13 illustrates a thermal regulation device according to a third embodiment, which differs from what was previously described for the second embodiment, in the arrangement of the two conduits, these conduits being there again integrated in the same plate forming condenser.
• the condenser plate 3 of the thermal regulation device 2 has a general shape similar to the main wall 6 previously described but this time consisting of an intermediate wall 200, a cover 212 which is attached to a first face of this intermediate wall and a plurality of cowls 222 which are attached to the second face, opposite the first face, of this intermediate wall. In this way, the cover and the covers are fixed on either side of the intermediate wall.
• the intermediate wall 200 is stamped so as to present on each of the faces an alternation of recesses and bumps and on the opposite face an alternation of cavities 211 and of cells 221 extending in parallel along the transverse dimension, a lateral end 8a to the other of the plate forming the condenser 3.
• the cavities and the cells open respectively on the first face 1a and on the second face 1b, and at least one plane passes through each of the cavities and each of the cells.
• the cover 212 is arranged to overlap the first face 1a so as to cover each of the cavities, the cover having an internal face facing the first face of the intermediate wall. More particularly, the cover has ribs 230 projecting from the internal face configured to cooperate with the edges delimiting the cavities 211 of the intermediate wall, so as to seal the circulation of the fluid present in the cavities.
• the covers 222 are positioned in the cells 221, having a clearance allowing the fluid circulation between the covers and the intermediate wall in the cells 221.
• the cells 221 communicate with each other and participate in forming one of the circuits of the thermal regulation device, here the second circuit of dielectric fluid 5.
• the covers 222 and / or the second face 1 lb of the intermediate wall at the level of the cells 221 have fluid outlets dielectric, here not visible on the cutting plane, to allow its projection towards electronic components.
• the cavities 211 communicate step by step and participate in forming one of the circuits of the thermal regulation device, here the first circuit of heat transfer fluid 4.
• An inlet and an outlet for heat transfer fluid are arranged on an edge of the intermediate wall to allow the circulation of heat transfer fluid in this first circuit
• the alternation of the cavities and the cells, and therefore portions of the first circuit of the second circuit, is such that a cavity and the directly adjacent cell share a common wall delimiting them, which ensures thermal contact in the sense of l invention between a portion of the first circuit and a portion of the second circuit.
• the second dielectric fluid circuit 5 is formed by a conduit 400, or tube, produced distinctly from the plate forming condenser. In other words, the second circuit is not integrated into the condenser plate.
• the condenser is produced by joining one on the other of two plates with here a stamped plate 402 in which the branches of the first heat transfer fluid circuit are made and a flat plate 404 attached against the stamped plate to close the branches and form the first circuit.
• the conduit 400 forming the second circuit that is to say the conduit, here tubular, in which the dielectric fluid is likely to circulate, is attached to the second face 1 lb of the condenser 3, here constituted by one face of the flat plate 404, which faces a chamber for receiving at least one electronic component.
• This duct is more particularly visible in FIG. 15 or FIG. 16.
• the conduit 400 here present in the form of a tube 40 of circular section, can be made of a material distinct from that used to make the plate forming the condenser 3, and it can in particular be made of aluminum.
• the conduit forming the second circuit has in this fourth embodiment a substantially planar shape and is arranged in a plane parallel to the plate forming condenser 3.
• the tube 40 forming a conduit 400 is visible in transparency under the main wall 6 of the plate forming the condenser 3.
• the dielectric fluid 1 is projected from the fluid outlets of the second circuit 5, opposite the condenser plate 3 integrating the first circuit 4.
• These outlets can be equipped with projection nozzles 37, which can be oriented to project the dielectric fluid on either side of the electronic components 103, the temperature of which must be regulated.
• the first circuit 4 is in thermal interaction with the dielectric fluid leaving the second circuit 5 and vaporized by the heat released by the electronic components, in that the first circuit exchanges calories with the vapor arriving in contact with the plate forming the condenser.
• the thermal regulation device 2 comprises an inlet end of dielectric fluid 23 integral with the conduit forming the second circuit, as well as an inlet and an outlet for heat transfer fluid connected to the heat transfer fluid circuit.
• the end of the dielectric fluid inlet 23 arranged at a free end of the conduit participating in forming the second circuit is made integral with the plates forming the condenser 3.
• the dielectric fluid inlet end 23 is fitted into an orifice 406 formed in the condenser, here in the flat plate forming the condenser and in particular at the level of a lateral projection 408 so that, as visible in FIG. 14, this protrusion and the end of the dielectric fluid inlet passing therethrough projects laterally from the stamped plate forming the condenser.
• a brazing operation can be performed to ensure the grip of the inlet end of the dielectric fluid on the condenser.
• the low weight of the pipe in this case tubular, does not impose any constraints on the fixing by brazing and that when the thermal regulation device is manipulated, the tubular pipe 400 forming the second circuit remains at constant distance of condenser, preferably against the corresponding face of the condenser.
• the second circuit 5 is thus sufficiently close to the first circuit, at a distance less than 10 mm in particular, so that it is considered, in accordance with what has been described above, that the two circuits 4, 5 are in thermal contact one the other.
• the thermal regulation device 2 is arranged in a thermal regulation assembly, facing electronic components 103 in particular, so that the first circuit, or circuit of heat transfer fluid 4, is in thermal interaction with the dielectric fluid sprayed out of the conduit 400, here in the form of a tube 40, in the direction of the electronic components and vaporized by the release of heat from these components when they are in operation.
• fixing pads 410 arranged between the conduit 400 delimiting the second dielectric fluid circuit 5 and the plate forming the condenser 3.
• the main dimension of these fixing pads then defines the spacing between the first circuit 4 and the second of circuit 5, the latter not being directly pressed against the plate forming condenser 3 and integrating the first circuit 4.
• the main dimension of the fixing studs 410 is less than 10mm, in order to ensure proximity of the circuits relative to one another.
• the thermal regulation device is configured so that there is thermal contact between the circuits.
• these are made of a material capable of conducting the calories from one circuit to another, and they are dimensioned so that a minimum distance is provided between the two circuits, which makes it possible to estimate that there is the equivalent of a thermal contact between the two, as mentioned previously.
• the tube 40 forming the conduit 400 for the dielectric fluid is arranged in a flat coil which comprises first tube portions 40a parallel to the longitudinal ends of the main wall 7a, 7b and second tube portions 40b skirting the lateral ends of the main wall 8a, 8b, at least a first portion of tube 40a being interposed between two second portions of tube 40b and at least a second portion of tube 40b being interposed between two first portions of tube 40a.
• the second portions of tube 40b are alternately formed near the first lateral end of the main wall 8a and the second lateral end of the main wall 8b.
• FIG. 17 illustrates a variant of the fourth embodiment of the thermal regulation device, which differs from what has just been described in that the second portions of tube 40b are formed near the first lateral end of the main wall 8a , the second dielectric fluid circuit having a comb shape with the first tube portions 40a which form teeth parallel to each other.
• This variant also differs in that the duct is formed by a flat tube, that is to say a tube with a rectangular section different from the circular section previously described, and in that this duct is disposed against the plate forming the condenser. in grooves provided for this purpose.
• the arrangement of the tube in the bottom of the groove ensures the grip of the tube and therefore improves the thermal contact of one circuit to another.
• FIG. 18 illustrates a fifth embodiment in which the conduit 400 of the second circuit is formed by a curved tube which has lateral portions 420 able to run along the lateral faces of the electronic components 103.
• the tube has lateral portions which extend substantially perpendicular to the plane in which the condenser plate extends.
• the thermal regulation device 2 is here equipped with two dielectric fluid circuits 5 which extend at a distance from the second face 1 lb of the main wall 6, opposite the first face l ia.
• Each dielectric fluid circuit 5 is for example produced from a tube 40 which partially extends inside two planes of tubes PI, P2.
• each dielectric fluid circuit 5 comprises at least a first portion of circuit 41 which extends inside a first plane PI and a second portion of circuit 42 extends inside a second plane P2, the first plane PI being interposed between the main wall 6 and the second plane P2, the distances provided between the main wall 6 and the first plane PI on the one hand and between the first plane PI and the second plane P2 on the other share being non-zero.
• the first circuit portion 41 and the second circuit portion 42 of the same dielectric fluid circuit 5 are connected to each other by means of at least a third circuit portion 43 which extends along an axis orthogonal to the first plane PI and to the second plane P2.
• Mechanical reinforcements 44 extend between the first portion of circuit 41 and the second portion of circuit 42 of the same dielectric fluid circuit 5 to reinforce the robustness of each dielectric fluid circuit 5. These arrangements are such that each tube 40 is arranged in a serpentine which extends in a volume bordered at least by the main plate 6 and the second plane P2.
• the tube 40 is provided with a plurality of projection nozzles 37 oriented towards the first chamber 10a or the second chamber 10b which are at least partially delimited by an intermediate arrangement 45 of an element of a first portion of circuit 41 and d an element of a second portion of circuit 42 superimposed on each other, the intermediate arrangement 45 being interposed between two respective lateral arrangements 46 of an element of a first portion of circuit 41 and of an element a second portion of circuit 42 superimposed on each other, these lateral arrangements forming said lateral portions 420 of the bent tube.
• FIG. 19 illustrates a sixth embodiment in which the first circuit, that is to say the heat transfer fluid circuit, differs from what has been previously described and no longer fits into the thickness of a plate full against or in which the second circuit is reported.
• the first circuit is produced by means of a tube exchanger, with a plurality of tubes arranged parallel to each other between two inlet and outlet manifolds of heat transfer fluid, the tubes of the exchanger being spaced one another.
• the conduit delimiting the second circuit is here identical to what has been described and illustrated for the fourth embodiment.
• the second circuit is made integral, by a welding, brazing or bonding operation for example of the exchanger forming the first circuit, so that these circuits are in thermal contact with respect to the other, the first circuit being in thermal interaction with the fluid leaving the second circuit.
• FIG. 20 illustrates different arrangements of a thermal regulation assembly, with a thermal regulation device associated with two electrical components, the temperature of which must be regulated by projection of dielectric fluid.
• Figures 20a to 20f illustrate a condenser similar to what has been described for the first embodiment
• Figures 20g and 20h illustrate a condenser similar to what has been described for the fourth embodiment for example, without the type of condenser being limiting in the choice of this or that arrangement.
• FIG. 20a highlights in particular a device in which the first heat transfer fluid circuit is advantageously arranged in the main wall 6, above the electronic components, and in which the second dielectric fluid circuit, and at least the projection nozzles 37, is arranged laterally to these components, here in the secondary walls 9a, 9b, 9c.
• the two circuits are arranged with respect to each other so that the first circuit is at least in thermal interaction with the fluid leaving the second circuit and evaporated by the release of heat from the electronic components.
• the second circuit is placed close enough to the first circuit to consider that the two circuits are in thermal contact and that sub-cooling of the dielectric fluid is thus possible with its output from the second circuit.
• the main wall forming the condenser is arranged above the electronic components.
• a collecting tank common to the two electronic components is provided under these components.
• FIG. 20b illustrates an inverted arrangement, in which the main wall forming a condenser is arranged below the electronic components.
• the second dielectric fluid circuit, and at least the spray nozzles 37 is disposed laterally to these components, here in the secondary walls 9a, 9b, 9c.
• the two circuits are arranged relative to each other so that the first circuit is at least in thermal interaction with the part of the fluid leaving the second circuit and flowing by gravity along the electronic components.
• the second circuit is placed close enough to the first circuit to consider that the two circuits are in thermal contact and that sub-cooling of the dielectric fluid is thus possible with its output from the second circuit. In this configuration, it may not be necessary to provide a tank, recovery can be done along the main wall 6.
• Fixing studs 420 are placed here between the main wall and the electronic components.
• FIGS. 20c and 20d illustrate arrangements respectively similar to those of FIGS. 20a and 20b, with an area for projecting additional dielectric fluid, namely an area included in the main wall 6 where the first circuit of heat transfer fluid extends.
• Figures 20e and 20f illustrate arrangements different from the above in that the heat transfer fluid circulates here only in the secondary walls, laterally to the electronic components, while the dielectric fluid and the corresponding spray nozzles are arranged above or at below the electronic component whose temperature is sought to be regulated.
• FIG. 20g and 20h illustrate arrangements which have been mentioned during the description of the third embodiment, with the projection nozzles 37 arranged on either side of the main wall 6 of the condenser.
• FIG. 20g illustrates an arrangement in which all the nozzles are oriented in the same direction, and at least all in the direction of the electrical component or components whose temperature must be regulated and covered by the condenser.
• FIG. 20h illustrates an arrangement in which the nozzles are, here equitably without this being limiting of the invention, arranged on either side of the condenser plate, a first part of the projection nozzles being opposite the first components electronics disposed under the condenser plate and a second part of the projection nozzles being opposite second electronic components disposed above the condenser plate.

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• 2019
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