EP3836314A1 - Connector for high-speed transmission - Google Patents
Connector for high-speed transmission Download PDFInfo
- Publication number
- EP3836314A1 EP3836314A1 EP20213129.8A EP20213129A EP3836314A1 EP 3836314 A1 EP3836314 A1 EP 3836314A1 EP 20213129 A EP20213129 A EP 20213129A EP 3836314 A1 EP3836314 A1 EP 3836314A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- connector
- contact
- terminal
- terminals
- speed transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 20
- 238000005192 partition Methods 0.000 claims abstract description 55
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 239000011347 resin Substances 0.000 description 33
- 229920005989 resin Polymers 0.000 description 33
- 239000000758 substrate Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6477—Impedance matching by variation of dielectric properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/06—Riveted connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Definitions
- the present invention relates to a connector for high-speed transmission mounted on a circuit board.
- Patent Document 1 Japanese Patent Application Publication No. 2018-156936
- the connector described in Patent Document 1 has a signal terminal receiving groove which is an opening portion penetrating the bottom wall of the housing from the upper portion to the lower portions of the bottom wall. Ground terminals and signal terminals are alternately inserted in the signal terminal receiving groove. The tale portion of the lower end of the signal terminal is soldered to the mounting surface of the circuit board with a solder ball, and the terminal of a counterpart connector is held by the elastic contact portion thereof.
- a first independent aspect for solving this task relates to a connector for high-speed transmission to be fitted with an external counterpart connector.
- the connector of the first independent aspect includes a housing and a plurality of terminals.
- the housing has at least one slot.
- the plurality of terminals include ground terminals and signal terminals, and are arranged in the slot along a first direction orthogonal to a fitting direction of the connector.
- Partition walls are provided between adjacent terminals in the slot. A height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.
- upper ends of the partition walls between the ground terminals and upper ends of the partition walls between the signal terminals may be located at substantially the same positions as upper surface of the housing, and upper ends of the partition walls between the ground terminals and the signal terminals may be below the upper surface of the housing.
- the terminal may have a linear portion extending along the fitting direction and a curved portion curved from a tip end of the linear portion on a side of a second direction orthogonal to the fitting direction and the first direction.
- the curved portion of the ground terminal and the curved portion of the signal terminal may not be separated by the partition wall.
- an air layer may be formed between the curved portions.
- the terminal may have a linear portion extending along the fitting direction and a curved portion curved from a tip end of the linear portion on a side of a second direction orthogonal to the fitting direction and the first direction.
- the linear portion of the ground terminal and the linear portion of the signal terminal may be separated by the partition wall.
- a plurality of ribs may be arranged at intervals in the first direction on inner wall surfaces facing each other in the slot, and the plurality of terminals may be accommodated in gaps between adjacent ribs in the slot one by one in an arrangement order in which two ground terminals and two signal terminals are set as a group and the two signal terminals are interposed between two ground terminals.
- the terminal may have a fork portion, a solder may be sandwiched and crimped in the fork portion.
- the solder of the terminal may be supported by the upper end of the rib.
- the terminal may have a contact portion to contact an external counterpart connector.
- a portion of the partition wall between the ground terminal and the signal terminal just beside the contact portion may be cut out.
- the slot may be provided with a support to support a shield plate as another terminal, and the partition wall may be bridged between the rib and the support.
- a long hole may be bored in the support, and the shield plate may be pressed into the long hole.
- the host connector CNH and the plug connector CNP are used by soldering to the pads of an electronic substrate 90 and an extension substrate 91, respectively.
- the plug connector CNP is mounted on the extension substrate 91 while the host connector CNH is mounted on the electronic substrate 90.
- the fitting direction of the host connector CNH and the plug connector CNP is appropriately referred to as the Z direction
- a direction orthogonal to the Z direction is appropriately referred to as the X direction
- the direction orthogonal to the Z direction and the X direction is appropriately referred to as the Y direction.
- the side where the host connector CNH is located as viewed from the plug connector CNP in the Z direction may be referred to as the upper side and the side where the plug connector CNP is located as viewed from the host connector CNH may be referred to as the lower side.
- the host connector CNH is provided with three slots 10H arranged in the X direction in the housing 1H.
- each of the three slots 10H of the housing 1H vertically penetrates three table portions 12H rising from the bottom portion 11H of the housing 1H.
- a plurality of reinforcing plates 13H are bridged between the adjacent table portions 12H.
- Three depressions 111H are formed on the outside of the table portion 12H on the +X side of the bottom portion 11H of the housing 1H.
- Two depressions 112H are formed on the outside of the table portion 12H on the -X side of the bottom portion 11H of the housing 1H.
- a groove 19H is provided around each of the three slots 10H on the upper surface of the housing 1H.
- the groove 19H is formed in a rectangular frame shape that is horizontally long in the Y direction. Both sides of the groove 19H in the Y direction are open to the outside as open portions 18H.
- the conductive resin 2HA shown in Fig. 8A is embedded in the groove 19H around the central slot 10H.
- the conductive resin 2HA has a rectangular frame shape whose dimensions make it possible to be contained in the groove 19H.
- a plurality of projections 23HA are formed on the inner wall surface of the side wall 21 HA facing the X direction in the conductive resin 2HA.
- An extension portion 24HA protruding outward in the Y direction is formed on the side wall 22HA facing the Y direction in the conductive resin 2HA. In a state where the conductive resin 2HA is contained in the groove 19H around the central slot 10H, the extension portion 24HA is fitted into the open portion 18H of the groove 19H. Further, the upper surface of the conductive resin 2HA is flush with the upper surface of the housing 1H.
- the conductive resin 2HB shown in Fig. 8B is embedded in the groove 19H around the slot 10H on both sides in the X direction.
- the conductive resin 2HB has a rectangular frame shape whose dimensions make it possible to be contained in the groove 19H.
- a plurality of projections 23HB are formed on the inner wall surface of the side wall 21HB facing the X direction in the conductive resin 2HB.
- An extension portion 24HB protruding outward in the Y direction is formed on the side wall 22HB facing the Y direction in the conductive resin 2HB.
- the extension portion 24HB is fitted into the open portion 18H of the groove 19H.
- the upper surface of the conductive resin 2HB is flush with the upper surface of the housing 1H.
- ribs 14H-k are provided on the inner wall surfaces of the housing 1H facing each other in the X direction and sandwiching the slot 10H in the table portion 12H.
- the ribs 14H-k protrude inwardly from the inner wall surface.
- a plate support 16H On the upper side (+Z side) of the slot 10H in the table portion 12H of the housing 1H there is located a plate support 16H extending in the Y direction.
- the partition wall 15H-k rises from the end surface on the inner side of the rib 14H-k toward the side of the plate support 16H.
- the contact 3H-j includes; a first linear portion 31H extending in the Z direction; a second linear portion 32H extending in parallel with the first linear portion 31H away from the first linear portion 31H on the -X side; a fork portion 30H bifurcated and extending from one end of the first linear portion 31H; a first curved portion 33H curved from an end portion opposite to the fork portion 30H side of the first linear portion 31H to the side of the second linear portion 32H in the X direction and connected to one end of the second linear portion 32H; a second curved portion 34H curved from the other end of the second linear portion 32H to the side opposite to the first linear portion 31H in the X direction; an inclined portion 35H extending slightly inclined from the end portion of the second curved portion 34H to a side away from the second linear portion 32H; and a contact portion 37H bending and extending in a hook-shape from the tip end of the inclined portion 35H.
- Convex portions 39aH, 39bH, and 39cH protruding outward in the Y direction are formed on the side surface of the first linear portion 31H.
- the contact portion 37H is further inclined and extends from the base end connected to the inclined portion 35H toward the side opposite to the second linear portion 32H, and then bends and extends in a dogleg shape.
- the tip end of the contact portion 37H faces the first curved portion 33H.
- the width of the contact portion 37H in the Y direction is narrowed from the vicinity of the base end of the contact portion 37H.
- the width of tip end of the contact portion 37H in the Y direction is approximately half the width of the base end of the contact portion 37H in the Y direction.
- the fork portion 30H of the contact 3H-j is a soldering terminal portion soldered to the pad of the electronic substrate 90 which is a mounting destination. Solder is sandwiched and crimped in the fork portion 30H of the contact 3H-j.
- the solder is fixed to the fork portion 30H by the following procedure. First, as shown in Fig. 10A , a cut piece 300 of a wire solder is prepared by cutting the wire solder into a piece longer than the width of the fork portion 30H in the X direction. Next, as shown in Fig. 10B , the cut piece 300 of the wire solder is pushed in between the tines of the fork portion 30H. After the cut piece 300 of the wire solder is pressed in between the tines of the fork portion 30H, both ends of the cut piece 300 of the wire solder are sandwiched by a tool and crimped to the fork portion 30H.
- the cutting of the solder and the pushing of the solder in between the tines of the fork portion 30H may be performed collectively for a plurality of contacts 3H-j. In that case, it is advisable to pass a long wire solder through the fork portion 30H of a plurality of contacts 3H-j obtained in a state of being continuously connected by press molding, and then to cut the wire solder into an appropriate length.
- the solder fixed by the above procedure spreads up to the surface on the outer side of the fork portion 30H, a part of the outer surface on the outer side of the sandwiching surface of the fork portion 30H is then covered by the solder, thus the solder is integrated with the fork portion 30H.
- a letter (G) is attached to the ground contact 3H-j and a letter (S) is attached to the signal contact 3H-j to distinguish between the two.
- the ground contact 3H-1(G) is contained in the gap between the inner wall of the table portion 12H on the +Y side and the partition wall 15H-1
- the ground contact 3H-2(G) is contained in the gap between the partition wall 15H-1 and the partition wall 15H-2.
- the signal contact 3H-3(S) is contained in the gap between the partition wall 15H-2 and the partition wall 15H-3
- the signal contact 3H-4(S) is contained in the gap between the partition wall 15H-3 and the partition wall 15H-4. The same applies to the -X side of the long hole 17H-1.
- solder fixed to the fork portion 30H of the contact 3H-j faces upward, and the contact portion 37H of the contact 3H-j faces downward.
- the solder of the contact 3H-j is supported by the upper end of the rib 14H-k and the solder is exposed above the upper surface of the housing 1H.
- a first height of the partition walls 15H-k between the ground contacts 3H-j(G) and the signal contacts 3H-j(S) in the Z direction is lower than a second height of the partition walls 15H-k between the ground contacts 3H-j(G) in the Z direction and is lower than a third height of the partition walls 15H-k between the signal contacts 3H-j(S), in the Z direction, in which the partition walls 15H-k of the second and third heights are the other partition walls 15H-k.
- the partition wall 15H-k between the ground contacts 3H-j (G) (in the cross section of Fig. 2 , the partition wall 15H-1 at the back in the Y direction) has a lower end at substantially the same position as the lower surface of the housing 1H, and an upper end at substantially the same position as the upper surface of the housing 1H.
- a lower end thereof locates at substantially the same position as the lower surface of the housing 1H, and an upper end thereof locates below the upper surface of the housing 1H and around the boundary between the first linear portion 31H and the second curved portion 34H of the contact 3H-j.
- the upper end of the partition wall 15H-k between the ground contact 3H-j (G) and the signal contact 3H-j(S) is formed in a slope shape that becomes lower as the distance from the central plate support 16H increases.
- substantially rectangular portion of the partition wall 15H-k between the ground contact 3H-j(G) and the signal contact 3H-j(S) just beside the contact portion 37H of the contact 3H-j is cut out so as to form a notch portion 110H.
- first linear portion 31H and the second linear portion 32H of the ground contact 3H-j(G) are separated from the first linear portion 31H and the second linear portion 32H of the signal contact 3H-j(S) by the partition wall 15H-k
- first curved portion 33H, the second curved portion 34H, and the contact portion 37H of the ground contact 3H-j are not separated from the first curved portion 33H, the second curved portion 34H, and the contact portion 37H of the signal contact 3H-j(G) by the partition wall 15H-k.
- An air layer are formed between the first curved portion 33H, the second curved portion 34H, the contact portion 37H of the ground contact 3H-j(G) and the first curved portion 33H, the second curved portion 34H, the contact portion 37H of the signal contact 3H-j(S).
- the shield plate 5H-m includes: a main body portion 51H; four fork portions 50aH, 50bH, 50cH, 50dH bifurcated and extending from four locations, separated in the Y direction, at the upper end of the main body portion 51H; contact portions 57aH, 57bH, 57cH protruding from locations sandwiching two grooves at the lower end of the main body portion 51H. Convex portions 59aH, 59bH protruding outward in the Y direction are formed on the side surface of the main body portion 51H.
- the fork portions 50aH, 50bH, 50cH, 50dH of the contact 3H-j are a soldering terminal portions soldered to the pads of the electronic substrate 90 which is a mounting destination. Solders are sandwiched and crimped in the fork portions 50aH, 50bH, 50cH, 50dH of the shield plate 5H-m. The procedure for fixing the solders to the fork portions 50aH, 50bH, 50cH, 50dH is the same with the procedure for fixing the solder to the fork portion 30H of the contact 3H-j.
- the shield plate 5H-m is pressed into the long hole 17H-m of the plate support 16H in the slot 10H from the upper side.
- the solders fixed to the fork portions 50aH, 50bH, 50cH, 50dH of the shield plate 5H-m are exposed on the upper side of the upper surface of the housing 1H.
- the ribs 14P-k are formed in a thin rectangular shape.
- the ribs 14P-k are aligned in the Y direction at the same interval.
- a groove 16P is provided at a position on the bottom wall 12P of the housing 1P on the side opposite to the header 10P.
- the upper end of the header 10P is located slightly lower than the upper edges of the side walls 11Pon both sides of the housing 1P in the X direction.
- the lower end of the header 10P protrudes below the lower surface of the groove 16P.
- the width of the lower portion of the long hole 17P-m in the X direction is narrower than the width of the upper portion in the X direction.
- the conductive resin 2PA shown in Fig. 16A is fitted into the lower end of the central header 10P in the groove 16P.
- the lower surface of the conductive resin 2PA is flush with the lower surface of the 1P.
- the conductive resin 2PB shown in Fig. 16B is fitted into the lower ends of the headers 10P on both sides of the groove 16P in the X direction.
- the conductive resin 2PB has two long plates 21PB facing each other with a slight gap therebetween and both ends of the two long plates 21PB in the Y direction are connected via the connection pieces 22PB.
- the lower surface of the conductive resin 2PB is flush with the lower surface of the 1P.
- the contact 3P-j includes: a contact portion 37P extending linearly in the Z direction; a bent portion 33P bending and extending from the base end of the contact portion 37P to one side of the X direction; and a fork portion 30P bifurcated and extending from the end portion opposite to the contact portion 37P at the bent portion 33P.
- Convex portions 39aP, 39bP protruding outward in the Y direction are formed on the side surface of the contact portion 37P.
- a hole 38 is bored in the center of the bent portion 33P in the Y direction.
- the fork portion 30P of the contact 3P-j is a soldering terminal portion soldered to the pad of the extension substrate 91 which is a mounting destination. Solder is sandwiched and crimped in the fork portion 30P of the contact 3P-j.
- the procedure for fixing the solder to the fork portion 30P is the same as the procedure for fixing the solder to the fork portion 30H of the contact 3H-j shown in Figs 11A-11C .
- the contacts 3P-j fixed with solders pass through the long hole 18P-j of the header 10P from the lower side and are contained one by one in the gaps between the adjacent ribs 14P-k in the header 10P.
- the bent portion 33P of the contact 3P-j is supported by the edge portion of the long hole 18P-j in the bottom wall 12P of the housing 1P, and the solder of the contact 3P-j is exposed on the lower side of the lower surface of the housing 1P.
- the shield contact 4P-m includes: a main body portion 41P; contact portions 47aP, 47bP, 47cP, 47dP bending and extending in a dogleg shape from four locations separated in the Y direction at the lower end of the main body portion 41P; and convex portions 42aP, 42bP protruding from two locations at the upper end of the main body portion 41P on the opposite side of, and between the contact portion 47aP and the contact portion 47bP, and the opposite side of, and between the contact portion 47cP and the contact portion 47dP.
- Convex portions 49aP, 49bP protruding outward in the Y direction are formed on the side surface of the main body portion 41P.
- the bending orientation of two contact portions 47aP and 47dP on the outer side and the bending orientation of two contact portions 47bP and 47cP on the inner side in the Y direction which is the arrangement direction of the contact portions, are reversed.
- the upper ends of the two contact portions 47aP and 47dP on the outer side and the upper ends of the two contact portions 47bP and 47cP on the inner side are inclined in directions away from each other and open in a Y shape when viewed from the Y direction.
- the lower ends of the convex portions 42aP, 42bP are rounded.
- the shield plate 5P-m includes: a main body portion 51P; convex portions 52aP, 52bP, 25cP, 52dP protruding from four locations separated in the Y direction at the lower end of the main body portion 51P; and fork portions 50aP, 50bP, 50cP, 50dP bifurcated and extending four locations separated in the Y direction at the lower end of the main body portion 51P.
- Convex portions 59aP, 59bP, 59cP protruding outward in the Y direction are formed on the side surfaces of the main body portion 51P and the convex portions 52aP and 52dP.
- recess portions 56aP and 56bP are formed.
- the recess portions 56aP are gouged downward between the convex portion 52aP and the convex portion 52bP, and
- the recess portions 56bP are gouged downward between the convex portion 52cP and the convex portion 52dP.
- the fork portions 50aP, 50bP, 50cP, 50dP of the shield plate 5P-m are soldering terminal portions soldered to the pads of the extension substrate 91 which is a mounting destination. Solders are sandwiched and crimped in the fork portions 50aP, 50bP, 50cP, 50dP of the shield plate 5P-m.
- the procedure for fixing the solders to the fork portions 50aP, 50bP, 50cP, 50dP is the same as the procedure for fixing the solder to the fork portion 30P of the contact 3P-j.
- the shield contact 4P-m is pressed into the long hole 17P-m of the header 10P from the upper side, and the shield plate 5P-m fixed with solders is pressed into the long hole 17P-m of the header 10P from the lower side through the long hole 27P-m of the conductive resin 2PA (or 2PB).
- the end portion of the shield contact 4P-m and the end portion of the shield plate 5P-m abut on each other in the long hole 17P-m. More specifically, as shown in Fig.
- a rectangular locking piece 177P-m is bridged between the inner wall surfaces of the long hole 17P-m of the header 10P facing each other in the X direction, and the shield contact 4P-m and the shield plate 5P-m are positioned by this locking piece 177P-m.
- the end portion of the shield contact 4P-m and the end portion of the shield plate 5P-m are appropriately referred to as "the first end portion” and "the second end portion", respectively.
- the locking piece 177P-m is fitted in a depression between the convex portion 52bP and the convex portion 52cP of the shield plate 5P-m. Further, the convex portion 42aP of the shield contact 4P-m is fitted in a depression between the convex portion 52aP and the convex portion 52bP of the shield plate 5P-m, and the convex portion 42bP of the shield contact 4P-m is fitted in a depression between the convex portion 52cP and the convex portion 52dP of the shield plate 5P-m. Further, notches are provided in the inner wall surfaces of the long hole 17P-m of the header 10P facing each other in the Y direction.
- the convex portions 49aP and 49bP of the shield contact 4P-m and the convex portions 59aP, 59bP, 59cP of the shield plate 5P-m are engaged with the notches to prevent the shield contact 4P-m and shield plate 5P-m from coming off.
- the long hole 17H-m of the slot 10H of the host connector CNH also has notches which play a similar role.
- the contact portions 47aP, 47bP, 47cP, 47dP of the shield contact 4P-m of the plug connector CNP are in contact with the contact portions 57aH, 57bH, 57cH of the shield plate 5H-m of the host connector CNH, and the contact portion 37P of the contact 3P-j of the plug connector CNP is in contact with the contact portion 37H of the contact 3H-j of the host connector CNH.
- the plug connector CNP of the present embodiment includes: a housing 1P having a long hole 17P-m extending in one direction; and a plurality of terminals arranged in the long hole 17P-m, each of which having contact portions 37P, 47aP, 47bP, 47cP, 47dP in contact with the mating connector and soldering terminal portions soldered to a mounting target substrate. Then, among these terminals, the terminals interposed between the shield plate 5H-m of the host connector CNH and the pad of the extension substrate 91 are divided into shield contacts 4P-m which are components having the contact portions 47aP, 47bP, 47cP, 47dP and shield plates 5P-m which are components having soldering terminal portions.
- the first end portion of the shield contact 4P-m on the side opposite to the side of the contact portions 47aP, 47bP, 47cP, 47dP and the second end portion of shield plate 5P-m on the side opposite to the side of the soldering terminal portions are pressed into the long hole 17P-m from directions opposite to each other, and the first and second end portions abut on each other in the long hole 17P-m.
- the opening portion of the long hole 17P-m of the housing 1P can be minimized, and the rigidity of the housing 1P can be ensured.
- the host connector CNH of the present embodiment includes: a housing 1H having a plurality of slots 10H; and a plurality of contacts 3H-j including contacts 3H-j (G) which are ground terminals and contacts 3H-j(S) which are signal terminals, in which the plurality of contacts 3H-j are arranged in the slots 10H along the Y direction as a first direction orthogonal to the fitting direction of the connector.
- Partition walls 15H-k are provided between the adjacent contacts 3H-j in the slots 10H, and the height of the partition walls 15H-k between the ground contacts 3H-j(G) and the signal contacts 3H-j(S) in the fitting direction is lower than the height of the other partition walls 15H-k in the fitting direction.
- an air layer which is a layer of a space with a smaller dielectric constant than that of a resin partition wall 15H-k is formed between the signal contact 3H-j(S) and the ground contact 3H-j(G). Therefore, it is possible to provide a connector for high-speed transmission capable of reducing the crosstalk between the adjacent channels.
- the host connector CNH of the present embodiment includes: a housing 1H; and a plurality of contacts 3H-j having a contact portion 37H in contact with the mating connector and a soldering terminal portion soldered to the mounting target substrate, in which the plurality of contacts 3H-j are arranged in the housing 1H with the contact portion 37H and the soldering terminal portion facing each other.
- the soldering terminal portion is a fork portion 30H, and a cut piece 300 of a wire solder is sandwiched and crimped in the fork portion 30H.
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Abstract
Description
- The present invention relates to a connector for high-speed transmission mounted on a circuit board.
- Many of the connectors for high-speed transmission mounted on circuit boards are formed by arranging a plurality of sets of terminal arrays including signal terminals and ground terminals in the housing. As an example of documents disclosing a technique related to this type of connector, Japanese Patent Application Publication No.
2018-156936 Patent Document 1") can be taken up. The connector described inPatent Document 1 has a signal terminal receiving groove which is an opening portion penetrating the bottom wall of the housing from the upper portion to the lower portions of the bottom wall. Ground terminals and signal terminals are alternately inserted in the signal terminal receiving groove. The tale portion of the lower end of the signal terminal is soldered to the mounting surface of the circuit board with a solder ball, and the terminal of a counterpart connector is held by the elastic contact portion thereof. - Incidentally, in order to increase the speed of signal transmission, it is necessary to reduce crosstalk between adjacent terminals. However, this type of conventional connector has a problem that the paired signal terminal and the ground terminal are completely separated by a resin wall, and it is difficult to reduce crosstalk.
- It is an object of the present invention to provide a connector for high-speed transmission capable of reducing crosstalk.
- A first independent aspect for solving this task relates to a connector for high-speed transmission to be fitted with an external counterpart connector. The connector of the first independent aspect includes a housing and a plurality of terminals. The housing has at least one slot. The plurality of terminals include ground terminals and signal terminals, and are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot. A height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.
- In this aspect, upper ends of the partition walls between the ground terminals and upper ends of the partition walls between the signal terminals may be located at substantially the same positions as upper surface of the housing, and upper ends of the partition walls between the ground terminals and the signal terminals may be below the upper surface of the housing.
- Further, the terminal may have a linear portion extending along the fitting direction and a curved portion curved from a tip end of the linear portion on a side of a second direction orthogonal to the fitting direction and the first direction. The curved portion of the ground terminal and the curved portion of the signal terminal may not be separated by the partition wall. Thus, an air layer may be formed between the curved portions.
- Further, the terminal may have a linear portion extending along the fitting direction and a curved portion curved from a tip end of the linear portion on a side of a second direction orthogonal to the fitting direction and the first direction. The linear portion of the ground terminal and the linear portion of the signal terminal may be separated by the partition wall.
- Further, a plurality of ribs may be arranged at intervals in the first direction on inner wall surfaces facing each other in the slot, and the plurality of terminals may be accommodated in gaps between adjacent ribs in the slot one by one in an arrangement order in which two ground terminals and two signal terminals are set as a group and the two signal terminals are interposed between two ground terminals..
- Further, the terminal may have a fork portion, a solder may be sandwiched and crimped in the fork portion. The solder of the terminal may be supported by the upper end of the rib.
- Further, the terminal may have a contact portion to contact an external counterpart connector. A portion of the partition wall between the ground terminal and the signal terminal just beside the contact portion may be cut out.
- Further, the slot may be provided with a support to support a shield plate as another terminal, and the partition wall may be bridged between the rib and the support.
- Further, a long hole may be bored in the support, and the shield plate may be pressed into the long hole.
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Fig. 1A andFig. 1B are perspective views of a host connector CNH according to an embodiment of the present invention as viewed from two directions; -
Fig. 1C andFig. 1D are perspective views of a plug connector CNP according to an embodiment of the present invention as viewed from two directions; -
Fig. 2 is a diagram showing a cut surface parallel to the XZ plane between thecontact 3H-3(S)and thecontact 3H-4(S) of an assembly constituted by fitting the host connector CNH into the plug connector CNP shown inFigs. 1A - 1D ; -
Fig. 3 is an exploded perspective view of the host connector CNH ofFig. 1B ; -
Fig. 4A is a perspective view including a cut surface of the host connector CNH ofFig. 1B , the cut surface passing through the center of thecontact 3H-15(S) in the Y direction; -
Fig. 4B is a partially enlarged view ofFig. 4A ; -
Fig. 5 is a perspective view of thehousing 1H ofFig. 3 ; -
Fig. 6B is a partially enlarged view of the front view ofFig. 6A ; -
Fig. 7A is a rear view of thehousing 1H ofFig. 3 ; -
Fig. 7B is a partially enlarged view of the rear view ofFig. 7A ; -
Fig. 8A is a perspective view of a conductive resin 2HA in the center ofFig. 3 ; -
Fig. 8B is a perspective view of the conductive resin 2HB on both sides of the conductive resin 2HA shown inFig. 8B ; -
Fig. 9 is a perspective view of thecontact 3H-j ofFig. 3 ; -
Fig. 10A to Fig. 10C are diagrams showing a working process of thecontact 3H-j ofFig. 3 ; -
Fig. 11 is a perspective view of theshield plate 5H-m ofFig. 3 ; -
Fig. 12 is an exploded perspective view of the plug connector CNP ofFig. 1D ; -
Fig. 13 is a perspective view of thehousing 1P ofFig. 12 ; -
Fig. 14A shows a front view of thehousing 1P ofFig. 13 and side views thereof as viewed from all sides; -
Fig. 14B is a partially enlarged view of the front view ofFig. 14A ; -
Fig. 15A is a rear view of thehousing 1P ofFig. 13 ; -
Fig. 15B is a partially enlarged view of the rear view ofFig. 13A ; -
Fig. 16A is a perspective view of the conductive resin 2PA ofFig. 1C ; -
Fig. 16B is a perspective view of the conductive resin 2PB on both sides of the conductive resin 2PB ofFig. 16A ; -
Fig. 17 is a perspective view of thecontact 3P-j ofFig. 12 ; -
Fig. 18 is a perspective view of theshield contact 4P-m ofFig. 12 ; -
Fig. 19 is a perspective view of theshield plate 5P-m ofFig. 12 . -
Fig. 20 is a perspective view including a cut surface passing through the center of thecontact 3P-15 in the Y direction inFig. 1D ; -
Fig. 21 is a cross-section view of the fitting portion of theshield plate 5P-4 and theshield contact 4P-4 inFig. 1D ; and -
Fig. 22 is a diagram showing shield contacts 4PA-m and 4PB-m of a plug connector CNP according to another embodiment of the present invention. - Hereinafter, a host connector CNH and a plug connector CNP, which are connectors for high-speed transmission according to an embodiment of the present invention, will be described with reference to the drawings. The host connector CNH and the plug connector CNP are used by soldering to the pads of an
electronic substrate 90 and anextension substrate 91, respectively. The plug connector CNP is mounted on theextension substrate 91 while the host connector CNH is mounted on theelectronic substrate 90. When the host connector CNH and the plug connector CNP are brought close to each other in the bold arrow direction shown inFig. 1 and fitted, the terminal of the host connector CNH and the terminal of the plug connector CNP are electrically connected to each other, and high-speed transmission of up to 3.2Tbps between theelectronic substrate 90 andextension substrate 91 becomes possible. - In the following description, the fitting direction of the host connector CNH and the plug connector CNP is appropriately referred to as the Z direction, a direction orthogonal to the Z direction is appropriately referred to as the X direction and the direction orthogonal to the Z direction and the X direction is appropriately referred to as the Y direction. Further, the side where the host connector CNH is located as viewed from the plug connector CNP in the Z direction may be referred to as the upper side and the side where the plug connector CNP is located as viewed from the host connector CNH may be referred to as the lower side.
- As shown in
Fig. 3 , the host connector CNH is provided with threeslots 10H arranged in the X direction in thehousing 1H. Conductive resins 2HA and 2HB, two rows of twenty-eightcontacts 3H-j (j=1 to 28), and rows of fourshield plates 5H-m (m=1 to 7) are mounted in each of the threeslots 10H. All thecontacts 3H-j (j=1 to 28) mounted in eachslot 10H have the same shape. Further, the shapes of theshield plates 5H-m (m=1 to 7) mounted in eachslot 10H are also all the same. - As shown in
Fig. 5 andFig. 6 , each of the threeslots 10H of thehousing 1H vertically penetrates threetable portions 12H rising from thebottom portion 11H of thehousing 1H. As shown inFig. 6A , a plurality of reinforcingplates 13H are bridged between theadjacent table portions 12H. Threedepressions 111H are formed on the outside of thetable portion 12H on the +X side of thebottom portion 11H of thehousing 1H. Twodepressions 112H are formed on the outside of thetable portion 12H on the -X side of thebottom portion 11H of thehousing 1H. - As shown in
Fig. 7A and Fig. 7B , agroove 19H is provided around each of the threeslots 10H on the upper surface of thehousing 1H. Thegroove 19H is formed in a rectangular frame shape that is horizontally long in the Y direction. Both sides of thegroove 19H in the Y direction are open to the outside asopen portions 18H. - The conductive resin 2HA shown in
Fig. 8A is embedded in thegroove 19H around thecentral slot 10H. The conductive resin 2HA has a rectangular frame shape whose dimensions make it possible to be contained in thegroove 19H. A plurality of projections 23HA are formed on the inner wall surface of theside wall 21 HA facing the X direction in the conductive resin 2HA. An extension portion 24HA protruding outward in the Y direction is formed on the side wall 22HA facing the Y direction in the conductive resin 2HA. In a state where the conductive resin 2HA is contained in thegroove 19H around thecentral slot 10H, the extension portion 24HA is fitted into theopen portion 18H of thegroove 19H. Further, the upper surface of the conductive resin 2HA is flush with the upper surface of thehousing 1H. - The conductive resin 2HB shown in
Fig. 8B is embedded in thegroove 19H around theslot 10H on both sides in the X direction. The conductive resin 2HB has a rectangular frame shape whose dimensions make it possible to be contained in thegroove 19H. A plurality of projections 23HB are formed on the inner wall surface of the side wall 21HB facing the X direction in the conductive resin 2HB. An extension portion 24HB protruding outward in the Y direction is formed on the side wall 22HB facing the Y direction in the conductive resin 2HB. In a state where the conductive resin 2HB is contained in thegroove 19H around thecentral slot 10H on both sides in the X direction, the extension portion 24HB is fitted into theopen portion 18H of thegroove 19H. Further, the upper surface of the conductive resin 2HB is flush with the upper surface of thehousing 1H. - As shown in
Fig. 4A ,Fig. 6B , andFig. 7B , twenty-sevenribs 14H-k (k=1 to 27) are provided on the inner wall surfaces of thehousing 1H facing each other in the X direction and sandwiching theslot 10H in thetable portion 12H. Theribs 14H-k protrude inwardly from the inner wall surface. Theribs 14H-k (k=1 to 27) are aligned in the Y direction at the same interval. The interval between theadjacent ribs 14H-k among theribs 14H-k (k=1 to 27) is approximately the same as the width of thecontact 3H-j in the Y direction. - On the upper side (+Z side) of the
slot 10H in thetable portion 12H of thehousing 1H there is located aplate support 16H extending in the Y direction. Apartition wall 15H-k (k=1 to 27) is provided between theplate support 16H and therib 14H-k (k=1 to 27) of theslot 10H. As shown inFig. 4A ,Fig. 6B , andFig. 7B , thepartition wall 15H-k rises from the end surface on the inner side of therib 14H-k toward the side of theplate support 16H. Theplate support 16H is supported by the end portion of thepartition wall 15H-k on the inner side opposite to therib 14H-k. Sevenlong holes 17H-m (m=1 to 7) vertically penetrating theplate support 16H are bored in theplate support 16H. - As shown in
Fig. 9 , thecontact 3H-j includes; a firstlinear portion 31H extending in the Z direction; a secondlinear portion 32H extending in parallel with the firstlinear portion 31H away from the firstlinear portion 31H on the -X side; afork portion 30H bifurcated and extending from one end of the firstlinear portion 31H; a firstcurved portion 33H curved from an end portion opposite to thefork portion 30H side of the firstlinear portion 31H to the side of the secondlinear portion 32H in the X direction and connected to one end of the secondlinear portion 32H; a secondcurved portion 34H curved from the other end of the secondlinear portion 32H to the side opposite to the firstlinear portion 31H in the X direction; aninclined portion 35H extending slightly inclined from the end portion of the secondcurved portion 34H to a side away from the secondlinear portion 32H; and acontact portion 37H bending and extending in a hook-shape from the tip end of theinclined portion 35H. - Convex portions 39aH, 39bH, and 39cH protruding outward in the Y direction are formed on the side surface of the first
linear portion 31H. Thecontact portion 37H is further inclined and extends from the base end connected to theinclined portion 35H toward the side opposite to the secondlinear portion 32H, and then bends and extends in a dogleg shape. The tip end of thecontact portion 37H faces the firstcurved portion 33H. The width of thecontact portion 37H in the Y direction is narrowed from the vicinity of the base end of thecontact portion 37H. The width of tip end of thecontact portion 37H in the Y direction is approximately half the width of the base end of thecontact portion 37H in the Y direction. - The
fork portion 30H of thecontact 3H-j is a soldering terminal portion soldered to the pad of theelectronic substrate 90 which is a mounting destination. Solder is sandwiched and crimped in thefork portion 30H of thecontact 3H-j. The solder is fixed to thefork portion 30H by the following procedure. First, as shown inFig. 10A , acut piece 300 of a wire solder is prepared by cutting the wire solder into a piece longer than the width of thefork portion 30H in the X direction. Next, as shown inFig. 10B , thecut piece 300 of the wire solder is pushed in between the tines of thefork portion 30H. After thecut piece 300 of the wire solder is pressed in between the tines of thefork portion 30H, both ends of thecut piece 300 of the wire solder are sandwiched by a tool and crimped to thefork portion 30H. - The cutting of the solder and the pushing of the solder in between the tines of the
fork portion 30H may be performed collectively for a plurality ofcontacts 3H-j. In that case, it is advisable to pass a long wire solder through thefork portion 30H of a plurality ofcontacts 3H-j obtained in a state of being continuously connected by press molding, and then to cut the wire solder into an appropriate length. - As shown in
Fig. 10C , the solder fixed by the above procedure spreads up to the surface on the outer side of thefork portion 30H, a part of the outer surface on the outer side of the sandwiching surface of thefork portion 30H is then covered by the solder, thus the solder is integrated with thefork portion 30H. - Here, the
contacts 3H-j (j=1 to 28) of eachslot 10H includecontacts 3H-j serving as ground terminals andcontacts 3H-j serving as signal terminals. Hereinafter, as appropriate, a letter (G) is attached to theground contact 3H-j and a letter (S) is attached to thesignal contact 3H-j to distinguish between the two. - As shown in
Fig. 4B , two rows ofcontacts 3H-j (j=1 to 28) on the +X side and the -X side in thelong holes 17H-m (m=1 to 7) in eachslot 10H are contained one by one in the gap between theadjacent partition walls 15H-k in theslot 10H in such a manner that two ground contacts and two signal contacts are aligned alternately. For example, on the +X side of thelong hole 17H-1 shown inFig. 6B andFig. 7B , theground contact 3H-1(G) is contained in the gap between the inner wall of thetable portion 12H on the +Y side and thepartition wall 15H-1, and theground contact 3H-2(G) is contained in the gap between thepartition wall 15H-1 and thepartition wall 15H-2. Thesignal contact 3H-3(S) is contained in the gap between thepartition wall 15H-2 and thepartition wall 15H-3, and thesignal contact 3H-4(S) is contained in the gap between thepartition wall 15H-3 and thepartition wall 15H-4. The same applies to the -X side of thelong hole 17H-1. - The solder fixed to the
fork portion 30H of thecontact 3H-j faces upward, and thecontact portion 37H of thecontact 3H-j faces downward. The solder of thecontact 3H-j is supported by the upper end of therib 14H-k and the solder is exposed above the upper surface of thehousing 1H. - Of the
partition walls 15H-k (k=1 to 28) in theslot 10H, a first height of thepartition walls 15H-k between theground contacts 3H-j(G) and thesignal contacts 3H-j(S) in the Z direction is lower than a second height of thepartition walls 15H-k between theground contacts 3H-j(G) in the Z direction and is lower than a third height of thepartition walls 15H-k between thesignal contacts 3H-j(S), in the Z direction, in which thepartition walls 15H-k of the second and third heights are theother partition walls 15H-k. - More specifically, as shown in
Fig. 2 , thepartition wall 15H-k between theground contacts 3H-j (G) (in the cross section ofFig. 2 , thepartition wall 15H-1 at the back in the Y direction) has a lower end at substantially the same position as the lower surface of thehousing 1H, and an upper end at substantially the same position as the upper surface of thehousing 1H. The same applies to thepartition wall 15H-k between thesignal contacts 3H-j(S). - In contrast, regarding the
partition wall 15H-k between theground contact 3H-j(G) and thesignal contact 3H-j(S) (in the cross section ofFig. 2 , thepartition wall 15H-2 in front of the Y direction), a lower end thereof locates at substantially the same position as the lower surface of thehousing 1H, and an upper end thereof locates below the upper surface of thehousing 1H and around the boundary between the firstlinear portion 31H and the secondcurved portion 34H of thecontact 3H-j. Further, the upper end of thepartition wall 15H-k between theground contact 3H-j (G) and thesignal contact 3H-j(S) is formed in a slope shape that becomes lower as the distance from thecentral plate support 16H increases. - Further, the substantially rectangular portion of the
partition wall 15H-k between theground contact 3H-j(G) and thesignal contact 3H-j(S) just beside thecontact portion 37H of thecontact 3H-j is cut out so as to form anotch portion 110H. - Therefore, although the first
linear portion 31H and the secondlinear portion 32H of theground contact 3H-j(G) are separated from the firstlinear portion 31H and the secondlinear portion 32H of thesignal contact 3H-j(S) by thepartition wall 15H-k, the firstcurved portion 33H, the secondcurved portion 34H, and thecontact portion 37H of theground contact 3H-j are not separated from the firstcurved portion 33H, the secondcurved portion 34H, and thecontact portion 37H of thesignal contact 3H-j(G) by thepartition wall 15H-k. An air layer are formed between the firstcurved portion 33H, the secondcurved portion 34H, thecontact portion 37H of theground contact 3H-j(G) and the firstcurved portion 33H, the secondcurved portion 34H, thecontact portion 37H of thesignal contact 3H-j(S). - As shown in
Fig. 11 , theshield plate 5H-m includes: amain body portion 51H; four fork portions 50aH, 50bH, 50cH, 50dH bifurcated and extending from four locations, separated in the Y direction, at the upper end of themain body portion 51H; contact portions 57aH, 57bH, 57cH protruding from locations sandwiching two grooves at the lower end of themain body portion 51H. Convex portions 59aH, 59bH protruding outward in the Y direction are formed on the side surface of themain body portion 51H. - The fork portions 50aH, 50bH, 50cH, 50dH of the
contact 3H-j are a soldering terminal portions soldered to the pads of theelectronic substrate 90 which is a mounting destination. Solders are sandwiched and crimped in the fork portions 50aH, 50bH, 50cH, 50dH of theshield plate 5H-m. The procedure for fixing the solders to the fork portions 50aH, 50bH, 50cH, 50dH is the same with the procedure for fixing the solder to thefork portion 30H of thecontact 3H-j. - The
shield plate 5H-m is pressed into thelong hole 17H-m of theplate support 16H in theslot 10H from the upper side. The solders fixed to the fork portions 50aH, 50bH, 50cH, 50dH of theshield plate 5H-m are exposed on the upper side of the upper surface of thehousing 1H. - As shown in
Fig. 12 , the plug connector CNP is provided with threeheaders 10P corresponding to theslots 10H of the host connector CNH in thehousing 1P, and conductive resin 2PA and 2PB, two rows of twenty-eightcontacts 3P-j (j=1 to 28), rows of sevenshield contacts 4P-m (m=1 to 7), and rows of sevenshield plates 5P-m (m=1 to 7) are mounted to each of the threeheaders 10P. All thecontacts 3P-j (j=1 to 28) mounted to eachheader 10P have the same shape. Further, all theshield contacts 4P-m (m=1 to 7) mounted to eachheader 10P have the same shape, and all theshield plates 5P-m (m=1 to 7) also have the same shape. - As shown in
Fig. 20 , the outer wall surfaces on both sides of theheader 10P in the X direction are provided with twenty-sevenribs 14P-k (k=1 to 27). Theribs 14P-k are formed in a thin rectangular shape. Theribs 14P-k are aligned in the Y direction at the same interval. The interval between theadjacent ribs 14P-k among theribs 14P-k (k=1 to 27) is approximately the same as the width of thecontact 3P-j in the Y direction. - A
groove 16P is provided at a position on thebottom wall 12P of thehousing 1P on the side opposite to theheader 10P. The upper end of theheader 10P is located slightly lower than the upper edges of the side walls 11Pon both sides of thehousing 1P in the X direction. The lower end of theheader 10P protrudes below the lower surface of thegroove 16P. - As shown in
Fig. 14A and Fig. 14B , sevenlong holes 17P-m (m=1 to 7) vertically penetrating theheader 10P are bored in theheader 10P. The width of the lower portion of thelong hole 17P-m in the X direction is narrower than the width of the upper portion in the X direction. Further, as shown inFig. 14A, Fig. 14B , andFig. 20 , twenty-eightlong holes 18P-j(j=1 to 28) are bored in thebottom wall 12P at positions directly below between theadjacent ribs 14P-k on both sides of the base end of theheader 10P in the X direction. Thelong holes 18P-j (j=1 to 28) penetrate between the upper surface of thebottom wall 12P and the bottom surface of thegroove 16P on the back side thereof. - The conductive resin 2PA shown in
Fig. 16A is fitted into the lower end of thecentral header 10P in thegroove 16P. The conductive resin 2PA has two long plates 21PA facing each other with a slight gap therebetween and both ends of the two long plates 21PA in the Y direction are connected to each other via the connection pieces 22PA. Sevenlong holes 27P-m (m=1 to 7) divided by the division pieces 23PA are formed in the gap between the two long plates 21PA. In a state where the conductive resin 2PA is fitted in the lower end of thecentral header 10P, the lower surface of the conductive resin 2PA is flush with the lower surface of the 1P. - The conductive resin 2PB shown in
Fig. 16B is fitted into the lower ends of theheaders 10P on both sides of thegroove 16P in the X direction. The conductive resin 2PB has two long plates 21PB facing each other with a slight gap therebetween and both ends of the two long plates 21PB in the Y direction are connected via the connection pieces 22PB. Sevenlong holes 27P-m (m=1 to 7) divided by the division pieces 23PB are formed in the gap between the two long plates 21PB. In a state where the conductive resin 2PB is fitted in the lower end of thecentral header 10P, the lower surface of the conductive resin 2PB is flush with the lower surface of the 1P. - As shown in
Fig. 17 , thecontact 3P-j includes: acontact portion 37P extending linearly in the Z direction; abent portion 33P bending and extending from the base end of thecontact portion 37P to one side of the X direction; and afork portion 30P bifurcated and extending from the end portion opposite to thecontact portion 37P at thebent portion 33P. Convex portions 39aP, 39bP protruding outward in the Y direction are formed on the side surface of thecontact portion 37P. Ahole 38 is bored in the center of thebent portion 33P in the Y direction. - The
fork portion 30P of thecontact 3P-j is a soldering terminal portion soldered to the pad of theextension substrate 91 which is a mounting destination. Solder is sandwiched and crimped in thefork portion 30P of thecontact 3P-j. The procedure for fixing the solder to thefork portion 30P is the same as the procedure for fixing the solder to thefork portion 30H of thecontact 3H-j shown inFigs 11A-11C . - As shown in
Fig. 2 andFig. 20 , thecontacts 3P-j fixed with solders pass through thelong hole 18P-j of theheader 10P from the lower side and are contained one by one in the gaps between theadjacent ribs 14P-k in theheader 10P. Thebent portion 33P of thecontact 3P-j is supported by the edge portion of thelong hole 18P-j in thebottom wall 12P of thehousing 1P, and the solder of thecontact 3P-j is exposed on the lower side of the lower surface of thehousing 1P. - As shown in
Fig. 18 , theshield contact 4P-m includes: amain body portion 41P; contact portions 47aP, 47bP, 47cP, 47dP bending and extending in a dogleg shape from four locations separated in the Y direction at the lower end of themain body portion 41P; and convex portions 42aP, 42bP protruding from two locations at the upper end of themain body portion 41P on the opposite side of, and between the contact portion 47aP and the contact portion 47bP, and the opposite side of, and between the contact portion 47cP and the contact portion 47dP. Convex portions 49aP, 49bP protruding outward in the Y direction are formed on the side surface of themain body portion 41P. - Of the contact portions 47aP, 47bP, 47cP, 47dP, the bending orientation of two contact portions 47aP and 47dP on the outer side and the bending orientation of two contact portions 47bP and 47cP on the inner side in the Y direction, which is the arrangement direction of the contact portions, are reversed. The upper ends of the two contact portions 47aP and 47dP on the outer side and the upper ends of the two contact portions 47bP and 47cP on the inner side are inclined in directions away from each other and open in a Y shape when viewed from the Y direction. The lower ends of the convex portions 42aP, 42bP are rounded.
- As shown in
Fig. 19 , theshield plate 5P-m includes: amain body portion 51P; convex portions 52aP, 52bP, 25cP, 52dP protruding from four locations separated in the Y direction at the lower end of themain body portion 51P; and fork portions 50aP, 50bP, 50cP, 50dP bifurcated and extending four locations separated in the Y direction at the lower end of themain body portion 51P. Convex portions 59aP, 59bP, 59cP protruding outward in the Y direction are formed on the side surfaces of themain body portion 51P and the convex portions 52aP and 52dP. At the upper end of themain body portion 51P recess portions 56aP and 56bP are formed. The recess portions 56aP are gouged downward between the convex portion 52aP and the convex portion 52bP, and The recess portions 56bP are gouged downward between the convex portion 52cP and the convex portion 52dP. - The fork portions 50aP, 50bP, 50cP, 50dP of the
shield plate 5P-m are soldering terminal portions soldered to the pads of theextension substrate 91 which is a mounting destination. Solders are sandwiched and crimped in the fork portions 50aP, 50bP, 50cP, 50dP of theshield plate 5P-m. The procedure for fixing the solders to the fork portions 50aP, 50bP, 50cP, 50dP is the same as the procedure for fixing the solder to thefork portion 30P of thecontact 3P-j. - As shown in
Fig. 2 andFig. 20 , theshield contact 4P-m is pressed into thelong hole 17P-m of theheader 10P from the upper side, and theshield plate 5P-m fixed with solders is pressed into thelong hole 17P-m of theheader 10P from the lower side through thelong hole 27P-m of the conductive resin 2PA (or 2PB). The end portion of theshield contact 4P-m and the end portion of theshield plate 5P-m abut on each other in thelong hole 17P-m. More specifically, as shown inFig. 21 , arectangular locking piece 177P-m is bridged between the inner wall surfaces of thelong hole 17P-m of theheader 10P facing each other in the X direction, and theshield contact 4P-m and theshield plate 5P-m are positioned by thislocking piece 177P-m. In this disclosure, the end portion of theshield contact 4P-m and the end portion of theshield plate 5P-m are appropriately referred to as "the first end portion" and "the second end portion", respectively. - The
locking piece 177P-m is fitted in a depression between the convex portion 52bP and the convex portion 52cP of theshield plate 5P-m. Further, the convex portion 42aP of theshield contact 4P-m is fitted in a depression between the convex portion 52aP and the convex portion 52bP of theshield plate 5P-m, and the convex portion 42bP of theshield contact 4P-m is fitted in a depression between the convex portion 52cP and the convex portion 52dP of theshield plate 5P-m. Further, notches are provided in the inner wall surfaces of thelong hole 17P-m of theheader 10P facing each other in the Y direction. The convex portions 49aP and 49bP of theshield contact 4P-m and the convex portions 59aP, 59bP, 59cP of theshield plate 5P-m are engaged with the notches to prevent theshield contact 4P-m andshield plate 5P-m from coming off. Thelong hole 17H-m of theslot 10H of the host connector CNH also has notches which play a similar role. - In a case where the plug connector CNP is fitted with the host connector CNH which is a mating connector, the contact portions 47aP, 47bP, 47cP, 47dP of the
shield contact 4P-m of the plug connector CNP are in contact with the contact portions 57aH, 57bH, 57cH of theshield plate 5H-m of the host connector CNH, and thecontact portion 37P of thecontact 3P-j of the plug connector CNP is in contact with thecontact portion 37H of thecontact 3H-j of the host connector CNH. - The above is the details of the configuration of the present embodiment, and according to the present embodiment, the following effects can be obtained.
- The plug connector CNP of the present embodiment includes: a
housing 1P having along hole 17P-m extending in one direction; and a plurality of terminals arranged in thelong hole 17P-m, each of which havingcontact portions 37P, 47aP, 47bP, 47cP, 47dP in contact with the mating connector and soldering terminal portions soldered to a mounting target substrate. Then, among these terminals, the terminals interposed between theshield plate 5H-m of the host connector CNH and the pad of theextension substrate 91 are divided intoshield contacts 4P-m which are components having the contact portions 47aP, 47bP, 47cP, 47dP andshield plates 5P-m which are components having soldering terminal portions. The first end portion of theshield contact 4P-m on the side opposite to the side of the contact portions 47aP, 47bP, 47cP, 47dP and the second end portion ofshield plate 5P-m on the side opposite to the side of the soldering terminal portions are pressed into thelong hole 17P-m from directions opposite to each other, and the first and second end portions abut on each other in thelong hole 17P-m. Thus, by dividing thecontact portions 37P, 47aP, 47bP, 47cP, 47dP of theshield contact 4P-m and the soldering terminal portions, the opening portion of thelong hole 17P-m of thehousing 1P can be minimized, and the rigidity of thehousing 1P can be ensured. Further, by pressing and fitting the respective components, the same performance as that of the single piece structure can be ensured. Therefore, it is possible to provide a connector for high-speed transmission capable of reducing the width of the
opening portion of thehousing 1P and ensuring the rigidity of the housing. - Further, the host connector CNH of the present embodiment includes: a
housing 1H having a plurality ofslots 10H; and a plurality ofcontacts 3H-j including contacts 3H-j (G) which are ground terminals andcontacts 3H-j(S) which are signal terminals, in which the plurality ofcontacts 3H-j are arranged in theslots 10H along the Y direction as a first direction orthogonal to the fitting direction of the connector.Partition walls 15H-k are provided between theadjacent contacts 3H-j in theslots 10H, and the height of thepartition walls 15H-k between theground contacts 3H-j(G) and thesignal contacts 3H-j(S) in the fitting direction is lower than the height of theother partition walls 15H-k in the fitting direction. Thus, an air layer, which is a layer of a space with a smaller dielectric constant than that of aresin partition wall 15H-k is formed between thesignal contact 3H-j(S) and theground contact 3H-j(G). Therefore, it is possible to provide a connector for high-speed transmission capable of reducing the crosstalk between the adjacent channels. - Further, the host connector CNH of the present embodiment includes: a
housing 1H; and a plurality ofcontacts 3H-j having acontact portion 37H in contact with the mating connector and a soldering terminal portion soldered to the mounting target substrate, in which the plurality ofcontacts 3H-j are arranged in thehousing 1H with thecontact portion 37H and the soldering terminal portion facing each other. The soldering terminal portion is afork portion 30H, and acut piece 300 of a wire solder is sandwiched and crimped in thefork portion 30H. Thus, the heating process of the terminal in the reflow layer, which is required in the conventional solder ball type soldering, can be reduced, and the influence of heat treatment can be reduced. Therefore, it is possible to provide a connector that can reduce the overheating process of the terminal in the reflow and reduce the adverse effect on the finished product due to the heat treatment. - The embodiments of the present invention have been described above, however, the following modifications may be added to these embodiments.
- (1)ln the above embodiments, there were three
slots 10H in thehousing 1H of the host connector CNH, and there were threeheaders 10P in thehousing 1P of the plug connector CNP. However, the number of theslots 10H and theheaders 10P may be one, two, or four or more. - (2)ln the above embodiment, the contact portions 47aP, 47bP, 47cP, 47dP of the
shield contact 4P-m of the plug connector CNP were described as being bent and extended in a dogleg shape from four locations at the lower end of themain body portion 41P separated in the Y direction. However, like the shield contact 4PA-m ofFig. 22A , the contact portions 47aP, 47bP, 47cP, 47dP may be replaced by contact portions 147aP, 147bP composed of a pair of plate bodies in which the cross sections viewed from the Y direction are formed in dogleg shapes in directions opposite to each other, and theshield plate 5P-m of the host connector CNH may be inserted between the contact portions 147aP and 147bP. Furthermore, like the shield contact 4PB-m ofFig. 22B , the terminal of the plug connector CNP to be pressed into thelong hole 17P-m of theheader 10P may not be divided into theshield contact 4P-m and theshield plate 5P-m, and may be configured by a single plate component having a contact portion and soldering terminal portion. - (3)ln the above embodiment, the number of the
contacts 3H-j, 3P-j forming a row may be less than two or may be more than two. Further, the number of the shield plates 4H-m, theshield contacts 4P-m, and theshield plates 5P-m may be less than seven or may be more than seven. Moreover, the number of theribs 14H-k,ribs 14H-k,partition walls 15H-k may be less than twenty-seven or may be larger than twenty-seven. -
- 1H housing
- 1P housing
- 2HA, 2HA conductive resin
- 2P conductive resin
- 3H contact
- 3P contact
- 4H shield plate
- 4P shield contact
- 4PA shield contact
- 4PB shield contact
- 5H shield plate
- 5P shield plate
- 10H slot
- 10P header
- 11H bottom portion
- 11P side wall
- 12H table portion
- 12P bottom wall
- 13H reinforcing plate
- 14H rib
- 14P rib
- 15H partition wall
- 16H plate support
- 16P groove
- 17H long hole
- 17P long hole
- 18H open portion
- 18P long hole
- 19H groove
- 21 HA, 21 HA, 22HA, 22HB side wall
- 21PA, 21PB long plate
- 22PA, 22PB connection piece
- 23HA, 23HB projection
- 23PA 23PB division piece
- 24HA, 24HB extension portion
- 27P long hole
- 30H fork portion
- 30P fork portion
- 31H the first linear portion
- 32H the second linear portion
- 33H the first curved portion
- 33P bent portion
- 34H the second curved portion
- 35H inclined portion
- 37H contact portion
- 37P contact portion
- 39aH convex portion
- 39aP convex portion
- 39bH convex portion
- 39bP convex portion
- 39cH convex portion
- 41P main body portion
- 42aP convex portion
- 42bP convex portion
- 47aP contact portion
- 47bP contact portion
- 47cP contact portion
- 47dP contact portion
- 49aP convex portion
- 49bP convex portion
- 50aH fork portion
- 50aP fork portion
- 50bH fork portion
- 50bP fork portion
- 50cH fork portion
- 50cP fork portion
- 50dH fork portion
- 50dP fork portion
- 51H main body portion
- 51P main body portion
- 52aP convex portion
- 52bP convex portion
- 52cP convex portion
- 52dP convex portion
- 56aP recess portion
- 57aH contact portion
- 57bH contact portion
- 57cH contact portion
- 59aH convex portion
- 59aP convex portion
- 59bH convex portion
- 59bP convex portion
- 59cP convex portion
- 90 electronic substrate
- 91 extension substrate
- 110H notch portion
- 111H, 112H depression
- 147aP contact portion
- 147bP contact portion
- 177P locking piece
- 300 cut piece
Claims (9)
- A connector (CHN) for high-speed transmission to be fitted with an external counterpart connector (CNP), the connector (CHN) for high-speed transmission comprising:a housing (1H) with at least one slot (10H);a plurality of terminals (3H-j) which comprise ground terminals (3H-j(S)) and signal terminals (3H-j (G)), and are arranged in the slot (10H) along a first direction orthogonal to a fitting direction of the connector; andpartition walls (15H-k) provided between adjacent terminals (3H-j) in the slot (10H),whereina height of the partition walls (15H-k) between the ground terminals (3H-j (G)) and the signal terminals (3H-j(S)) in the fitting direction is lower than a height of other partition walls (15H-k) in the fitting direction.
- The connector (CHN) for high-speed transmission according to claim 1, wherein
upper ends of the partition walls (15H-k) between the ground terminals (3H-j(G)) and upper ends of the partition walls between the signal terminals (3H-j(S)) are located at substantially the same positions as upper surface of the housing,
upper ends of the partition walls between the ground terminals (3H-j (G)) and the signal terminals (3H-j(S)) are below the upper surface of the housing. - The connector (CHN) for high-speed transmission according to claim 1, wherein
the terminal (3H-j) comprises:a linear portion (31H) extending along the fitting direction and a curved portion (33H) curved from a tip end of the linear portion (31H) toward a side of a second direction orthogonal to the fitting direction and the first direction,no partition wall separates the curved portion (33H) of the ground terminal (3H-j(G)) and the curved portion (33H) of the signal terminal(3H-j(S)), and an air layer is formed between the curved portions (33H). - The connector (CHN) or high-speed transmission according to claim 1 or 2, wherein
the terminal (3H-j) comprises:a linear portion (32H) extending along the fitting direction and a curved portion (33H) curved from a tip end of the linear portion (32H) toward a side of a second direction orthogonal to the fitting direction and the first direction,the linear portion (32H) of the ground terminal (3H-j (G)) and the linear portion (32H) of the signal terminal (3H-j(S)) are separated by the partition wall (15H-k). - The connector (CHN) for high-speed transmission according to claim 1, further comprises:a plurality of ribs (14H-k) arranged at intervals in the first direction on inner wall surfaces facing each other in the slot (10H),whereinthe plurality of terminals (3H-j) are accommodated in gaps between adjacent ribs (14H-k) in the slot (10H) one by one in an arrangement order in which two ground terminals (3H-j(G)) and two signal terminals (3H-j(S)) are set as a group and the two signal terminals (3H-j(S)) are interposed between two ground terminals (3H-j(G)).
- The connector (CHN) for high-speed transmission according to claim 5, wherein
the terminal (3H-j) comprises a fork portion (30H) and a solder is sandwiched and clamped in the fork portion (30H),
the solder of the terminal (3H-j) is supported by an upper end of the rib (14H-k). - The connector (CHN) for high-speed transmission according to claim 1, wherein
the terminal (3H-j) comprises a contact portion to contact an external counterpart connector (CNP),
a portion of the partition wall (15H-k) between the ground terminal (3H-j (G)) and the signal terminal (3H-j(S)) just beside the contact portion (37H) is cut out. - The connector (CHN) for high-speed transmission according to claim 5, wherein
the slot (10H) is provided with a support (16H) to support a shield plate (5H-m) as another terminal, and the partition wall (15H-k) is bridged between the rib (14H-k) and the support (16H). - The connector (CHN) for high-speed transmission according to claim 8, wherein
a long hole (17H-m) is bored in the support (16H), and the shield plate (5H-m) is pressed into the long hole (17H-m).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911264975.4A CN112952417B (en) | 2019-12-11 | 2019-12-11 | Connector for high-speed transmission |
Publications (2)
Publication Number | Publication Date |
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EP3836314A1 true EP3836314A1 (en) | 2021-06-16 |
EP3836314B1 EP3836314B1 (en) | 2022-09-07 |
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Family Applications (1)
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EP20213129.8A Active EP3836314B1 (en) | 2019-12-11 | 2020-12-10 | Connector for high-speed transmission |
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EP (1) | EP3836314B1 (en) |
CN (1) | CN112952417B (en) |
Citations (5)
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US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
WO2003094304A1 (en) * | 2002-05-06 | 2003-11-13 | Molex Incorporated | High-speed differential signal connector with interstitial ground aspect |
US20100068942A1 (en) * | 2008-09-16 | 2010-03-18 | Japan Aviation Electronics Industry, Limited | Connector unit |
JP2018156936A (en) | 2017-03-16 | 2018-10-04 | モレックス エルエルシー | Electric connector and electric connector assembly |
US20190207341A1 (en) * | 2017-12-28 | 2019-07-04 | Tyco Electronics (Shanghai) Co. Ltd. | Connector |
Family Cites Families (13)
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JP2910682B2 (en) * | 1996-07-30 | 1999-06-23 | 日本電気株式会社 | High-speed transmission connector |
JP2003297463A (en) * | 2002-04-02 | 2003-10-17 | Yamaichi Electronics Co Ltd | Connector |
US6979238B1 (en) * | 2004-06-28 | 2005-12-27 | Samtec, Inc. | Connector having improved contacts with fusible members |
CN104737384B (en) * | 2012-10-18 | 2017-06-16 | 山一电机株式会社 | Socket connector, plug connector and possesses the electric connector of both |
JP6127199B2 (en) * | 2013-03-13 | 2017-05-10 | モレックス エルエルシー | Integrated signal-to-element and connector using the same |
JP2017130421A (en) * | 2016-01-22 | 2017-07-27 | 山一電機株式会社 | Contact terminal, contact support, and connection device including the same |
JP6703900B2 (en) * | 2016-06-01 | 2020-06-03 | ヒロセ電機株式会社 | Connectors and connector systems |
JP2018010724A (en) * | 2016-07-11 | 2018-01-18 | ヒロセ電機株式会社 | Electric connector with shield plate |
JP6794954B2 (en) * | 2017-07-31 | 2020-12-02 | 住友電装株式会社 | connector |
JP6662369B2 (en) * | 2017-12-28 | 2020-03-11 | Smk株式会社 | connector |
US10601195B2 (en) * | 2018-07-30 | 2020-03-24 | Lotes Co., Ltd | Electrical connector and electrical connector assembly capable of ensuring terminal positioning effect |
CN109980449B (en) * | 2019-01-16 | 2019-11-01 | 四川大学 | High-speed high-density connector with dual shield function |
CN211017468U (en) * | 2019-12-11 | 2020-07-14 | 山一电机株式会社 | Connector for high-speed transmission |
-
2019
- 2019-12-11 CN CN201911264975.4A patent/CN112952417B/en active Active
-
2020
- 2020-12-10 EP EP20213129.8A patent/EP3836314B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
WO2003094304A1 (en) * | 2002-05-06 | 2003-11-13 | Molex Incorporated | High-speed differential signal connector with interstitial ground aspect |
US20100068942A1 (en) * | 2008-09-16 | 2010-03-18 | Japan Aviation Electronics Industry, Limited | Connector unit |
JP2018156936A (en) | 2017-03-16 | 2018-10-04 | モレックス エルエルシー | Electric connector and electric connector assembly |
US20190207341A1 (en) * | 2017-12-28 | 2019-07-04 | Tyco Electronics (Shanghai) Co. Ltd. | Connector |
Also Published As
Publication number | Publication date |
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CN112952417A (en) | 2021-06-11 |
EP3836314B1 (en) | 2022-09-07 |
CN112952417B (en) | 2023-01-31 |
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